CN110572746B

CN110572746B - A conducting film and sound generating mechanism for sound generating mechanism

Info

Publication number: CN110572746B
Application number: CN201910765463.XA
Authority: CN
Inventors: 赵国栋; 何超锋
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2019-08-19
Filing date: 2019-08-19
Publication date: 2021-10-29
Anticipated expiration: 2039-08-19
Also published as: WO2021031495A1; CN110572746A

Abstract

The invention discloses a conductive film for a sound generating device and the sound generating device. The conductive layer is arranged on the first substrate layer, and the second substrate layer is attached to the two surfaces of the conductive layer; the first substrate layer is connected with one surface of the conducting layer through a first adhesive layer in a hot pressing mode, and then a conducting circuit is formed on the conducting layer through etching; the first adhesive layer has adhesive force at hot pressing temperature and does not have adhesive force at room temperature. The invention has the technical effects that: the conductive film has conductivity, not only can be used as a sound-producing vibrating diaphragm, but also can be used as a conductive supporting vibrating diaphragm.

Description

A conducting film and sound generating mechanism for sound generating mechanism

Technical Field

The invention relates to the technical field of electroacoustic conversion, in particular to a conductive film for a sound generating device and the sound generating device.

Background

The sound generating device generally includes a diaphragm and a voice coil coupled to one side of the diaphragm, and further includes an electrical connector electrically connecting an internal circuit and an external circuit of the sound generating device. The voice coil comprises two voice coil leads, the two voice coil leads are respectively electrically connected with two bonding pads of the electric connecting piece in a spot welding mode and the like, and the electric connecting piece is simultaneously electrically connected with an external circuit to control an electric signal in the voice coil through the electric signal of a terminal product.

Generally, the lead of the voice coil needs to be threaded out for a certain length to achieve electrical connection with the electrical connector. However, in the sound generating device with such a structure, when the voice coil vibrates, the lead of the voice coil is easily broken, and thus, the product is poor.

In the prior art, some sound generating devices further include a centering pad, which is usually combined on one side of the diaphragm, and the centering pad can be used as an electrical connection part between the voice coil and the outside. Specifically, the connection line of the voice coil is connected to the spider, and the spider is connected to an external circuit, thereby achieving electrical connection. In fact, although the hidden danger of voice coil loudspeaker voice coil lead wire broken string has effectively been solved in the application of centering branch piece, the existence of centering branch piece can occupy sound generating mechanism's inner space to lose the acoustic performance of product to a certain extent, and then reduced user's audio frequency and experienced.

In recent years, many researchers have developed diaphragms having a conductive function, which makes conductive films widely used in sound emitting devices. For the conductive film, the main current application methods include electrophoresis of conductors, electroplating of conductors, injection molding of conductors, addition of conductive coatings, addition of conductive ink layers, laser etching and the like in the diaphragm. However, the above methods all have the defects of large technical implementation difficulty, low mass productivity, high cost, and low reliability and acoustic performance to different degrees.

Disclosure of Invention

An object of the present invention is to provide a conductive film for a sound generating device and a new technical solution of the sound generating device.

According to a first aspect of the present invention, there is provided a conductive film for a sound generating device, including a conductive layer, and a first substrate layer and a second substrate layer attached to both surfaces of the conductive layer;

the first substrate layer is connected with one surface of the conducting layer through a first adhesive layer in a hot pressing mode, and then a conducting circuit is formed on the conducting layer through etching;

the first adhesive layer has adhesive force at hot pressing temperature and does not have adhesive force at room temperature.

Optionally, the first substrate layer is connected with the first adhesive layer, and then connected with the conductive layer in a hot pressing manner.

Optionally, after the conductive line is formed on the conductive layer by etching, the second substrate layer is connected to the other surface of the conductive layer and the first adhesive layer by a second adhesive layer.

Optionally, the second substrate layer is connected with the other surface of the conductive layer and the first adhesive layer through a second adhesive layer in a hot pressing way,

the second adhesive layer has adhesive force at hot pressing temperature and does not have adhesive force at room temperature.

Optionally, the second substrate layer is a thermoplastic elastomer, and after the conductive layer is etched to form a conductive circuit, the second substrate layer is connected with the other surface of the conductive layer and the first adhesive layer in a hot pressing manner.

Optionally, the first adhesive layer is made of any one of a hot melt adhesive, an acrylic adhesive and a silica gel.

Optionally, the first substrate layer and the second substrate layer are made of any one of plastic, thermoplastic elastomer and rubber.

Optionally, the first substrate layer and the second substrate layer are made of any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU.

Optionally, the conductive layer is a metal foil.

Optionally, the conductive layer is a copper foil.

Optionally, the thickness of the conductive layer is 12 to 36 μm, the thickness of the first glue layer is 5 to 50 μm, and the thicknesses of the first substrate layer and the second substrate layer are 3 to 50 μm.

Optionally, an inner pad and an outer pad are respectively disposed on the conductive layer, and the inner pad is configured to: for connection with a voice coil, the outer pad configured to: for connection to an external circuit;

the inner bonding pad and the outer bonding pad are exposed out of the base material layer.

Optionally, the conductive film for a sound generating device includes an inner portion located inside, a deformation portion disposed outside the inner portion, and an outer portion disposed outside the deformation portion;

the conducting layer comprises a first conducting layer distributed on the inner side portion, a second conducting layer distributed on the outer side portion and a third conducting layer distributed on the deformation portion, the third conducting layer is connected with the first conducting layer and the second conducting layer, and the first conducting layer, the second conducting layer and the third conducting layer are connected to form at least one conducting circuit.

Optionally, the first conductive layer and the second conductive layer each include two independent portions, and the two portions form two independent conductive traces.

According to a second aspect of the present invention, there is provided a sound generating apparatus comprising a vibration system and a magnetic circuit system cooperating with the vibration system;

vibration system includes the sound production vibrating diaphragm and combines the voice coil loudspeaker voice coil of sound production vibrating diaphragm one side, the sound production vibrating diaphragm adopts as above the conducting film.

vibration system includes the sound production vibrating diaphragm, combines the voice coil loudspeaker voice coil of sound production vibrating diaphragm one side and be used for elastic support the support vibrating diaphragm of voice coil loudspeaker voice coil, support vibrating diaphragm adopts as above the conducting film.

Optionally, the voice coil includes two long sides and two short sides, and two support diaphragms are arranged on the two short sides of the voice coil; at least one of the support diaphragms employs the conductive film.

The conducting film for the sound generating device provided by the embodiment of the invention is a multilayer composite structure comprising a conducting layer, an adhesive layer and a base material layer. The conductive film has good conductive performance, and the phenomenon of broken lead of the voice coil can be effectively avoided by using the conductive film. The conductive film can be used as a sound vibrating diaphragm and a supporting vibrating diaphragm. The conducting film provided by the invention has stable vibration during working, and can improve the loudness of sound and reduce nonlinear distortion.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic partial structure diagram of a conductive film provided in an embodiment of the present invention.

Fig. 2 is a perspective view of a conductive film provided by an embodiment of the present invention.

Fig. 3 is a schematic partial structure diagram of a sound generating device according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a supporting diaphragm according to an embodiment of the present invention.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

As shown in fig. 1, the conductive film according to the embodiment of the present invention includes a conductive layer 1, and a first substrate layer 31 and a second substrate layer 32 attached to both surfaces of the conductive layer 1. Since the first base material layer 31 and the second base material layer 32 are respectively provided on both surfaces of the conductive layer 1, that is, the conductive layer 1 is wrapped by the first base material layer 31 and the second base material layer 32, the phenomenon that the conductive layer 1 is in contact with other components to cause a short circuit is prevented. The first base material layer 31 and the second base material layer 32 can provide a good protective effect for the conductive layer 1.

The first substrate layer 31 is connected with one surface of the conductive layer 1 through the first adhesive layer 21 in a hot pressing manner, and then a conductive circuit is formed on the conductive layer 1 through etching. In the present invention, the first adhesive layer 21 has adhesive strength at a hot pressing temperature, but does not have adhesive strength at room temperature. Thus, the first substrate layer 31 can be firmly bonded to the conductive layer 1 through the first adhesive layer 21 by the hot pressing.

In an example of the present invention, the first substrate layer 31 is first bonded to the first adhesive layer 21, and then bonded to the conductive layer 1 by hot pressing. It should be noted that, since the first adhesive layer 21 can form a viscous state at a high temperature, and at this time, the first adhesive layer 21 has a good adhesive force, in this example, the first substrate layer 31 is bonded to the first adhesive layer 21 by hot pressing, and then the first adhesive layer 21 is bonded to the conductive layer 1 by hot pressing. The first substrate layer 31 and the conductive layer 1 can form a stable connection relationship through two times of hot pressing.

Of course, the present invention is not limited to the above-mentioned method of bonding the first substrate layer 31 and the first adhesive layer 21 by hot pressing, and then bonding the conductive layer 1 and the first adhesive layer 21 by hot pressing. Other bonding methods are also possible, for example, by directly subjecting the first base material layer 31, the first adhesive layer 21, and the conductive layer 1 to thermocompression. The direct hot pressing mode is simpler, and the process steps are simplified. In a specific application, a person skilled in the art can flexibly select a specific combination manner according to needs, and the method is not limited in this respect.

The first adhesive layer 21 of the present invention may be made of any one of a hot melt adhesive, an acrylic adhesive, and a silicone adhesive. The material adopted by the first adhesive layer 21 can form a viscous state at a higher temperature, and has good adhesive force. When the adhesive is used for bonding the first base material layer 31 and the conductive layer 1, the first base material layer 31 and the conductive layer 1 can be firmly bonded to each other, and separation between the first base material layer 31 and the conductive layer 1 is not easily generated.

The material of the first base material layer 31 of the present invention is a polymer material. In particular, it may be a plastic, a thermoplastic elastomer or a rubber. These materials have insulating properties. In an example of the present invention, the material of the first substrate layer 31 is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU. The first substrate layer 31 can further protect the internal conductive layer 1, so that the conductive film is safer and more reliable to use.

After the conductive circuit is formed on the conductive layer 1 by etching, the second substrate layer 32 is connected to the other surface of the conductive layer 1 and the first adhesive layer by the second adhesive layer 22. That is, in the present invention, the first base material layer 31 is attached to one surface of the conductive layer 1, the conductive line is etched and formed on the conductive layer 1, and the second base material layer 32 is attached to the other surface of the conductive layer 1, thereby forming the conductive film.

In one example of the present invention, the second substrate layer 32 is thermally press-bonded to the other surface of the conductive layer 1 and the first adhesive layer 21 through the second adhesive layer 22.

The material of the second base material layer 32 of the present invention is a thermoplastic elastomer. After the conductive circuit is formed on the conductive layer 1 by etching, the second substrate layer 32 is connected with the other surface of the conductive layer 1 and the first adhesive layer 21 by hot pressing. In this way, the second base material layer 22 can be stably connected to the conductive layer 1.

The second adhesive layer 22 of the present invention has adhesive strength at hot pressing temperature, but does not have adhesive strength at room temperature. The material used for the second adhesive layer 22 of the present invention can form a viscous state at a higher temperature, and has a good adhesive force. When the adhesive is used for connecting the second base material layer 32 and the conductive layer 1, the two layers can be firmly connected, and the second base material layer 32 and the conductive layer 1 are not easily separated. The material of the second adhesive layer 22 may be the same as or different from the material of the first adhesive layer 21. For example, the second adhesive layer 22 may be any one of a hot melt adhesive, an acrylic adhesive, and a silicone adhesive. For another example, the second adhesive layer 22 may be a pressure sensitive adhesive. The skilled person can select the desired one according to the actual need.

The material of the second base material layer 32 of the present invention is a polymer material. In particular, it may be a plastic, a thermoplastic elastomer or a rubber. These materials are insulating. In an example of the present invention, the material of the second substrate layer 32 is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU. The second substrate layer 32 can further protect the internal conductive layer 1, so that the conductive film is safer and more reliable to use. The material of the second base material layer 32 may be the same as or different from the material of the first base material layer 31. The skilled person can flexibly select the required conditions according to the actual needs.

The conductive layer 1 of the present invention is a metal foil. For example, the conductive layer 1 is a copper foil. The copper foil is a thin sheet structure, has low surface oxygen characteristics, and can be easily attached to the surfaces of various base materials made of different materials. In addition, the copper material has better conductivity, so that the formed conductive film has good conductivity. A predetermined circuit pattern may be formed on the conductive layer 1 by etching, etc. well known to those skilled in the art.

In one example of the present invention, the conductive layer 1 is a rolled copper foil, for example, an RA copper foil or an HA copper foil. The rolled copper foil has excellent tensile strength and high elongation, and has good ductility when hot-pressed in combination with the first substrate layer 2.

As shown in fig. 2, the conductive layer 1 of the present invention is further provided with inner pads 4 and outer pads 5, respectively. Wherein the inner pad 4 is configured to: for electrical connection with the voice coil. The outer pad 5 is configured to: for connection to external circuitry. And, the inner pad 4 and the outer pad 5 are exposed from the substrate layer, so as to realize electrical connection.

In addition, in the conductive film of the present invention, the conductive layer 1 is bonded to the first substrate layer 31 through the first adhesive layer 21, and a hot pressing process is used. When the hot pressing treatment is performed, the hot pressing temperature is high, generally about 110 ℃, at this time, the first adhesive layer 21 can form a viscous state based on the adopted material, and at this time, the adhesive force is strong, and the first adhesive layer can be firmly connected with the conductive layer 1. After the conductive layer 1 is etched, the conductive layer 1 and the first substrate layer 31 may be subjected to a rolling process. And the rolling process is usually performed at room temperature. At room temperature, the first glue layer 21 has no adhesive force, so that impurities such as dust cannot be adhered to the first base material layer 31, and the influence on the subsequent forming process is avoided. However, in the prior art, the adhesive used in the diaphragm of the sound generating device still has a certain adhesive force at room temperature, so that the rolling step after etching the conductive layer cannot be performed, and the adhesive cannot be used for forming the conductive film of the present invention.

With regard to the thicknesses of the conductive layer 1, the first adhesive layer 21, the first substrate layer 31, the second adhesive layer 22 and the second substrate layer 32, those skilled in the art can flexibly adjust the thicknesses as required, so that the formed conductive film has a suitable thickness to adapt to a corresponding assembly space.

In one example of the present invention, the thickness of the conductive layer 1 is 12 to 36 μm, the thickness of the first and second

adhesive layers

21 and 22 is 5 to 50 μm, and the thickness of the first and second substrate layers 31 and 32 is 3 to 50 μm. In this embodiment, the formed conductive film can have good conductivity, and the base layer and the adhesive layer can provide good protection for the conductive layer 1 located in the middle. Through the reasonable adjustment to conducting layer, glue film and substrate layer thickness, can also guarantee that the whole rigidity and the pliability that have of conducting film can make the conducting film more steady when the vibration. The acoustic performance can be improved, and the phenomenon of polarization during vibration can be prevented.

The conductive film provided by the embodiment of the invention comprises an inner side part positioned on the inner side, a deformation part arranged on the outer side of the inner side part in a surrounding manner, and an outer side part arranged on the outer side of the deformation part.

When the conductive film of the present invention is applied to a sound generating device such as a speaker, a person skilled in the art can attach the outer side portion of the conductive film to the housing of the sound generating device to fix the conductive film.

As shown in fig. 2, the conductive layer 1 includes a plurality of portions, respectively: a first conductive layer 101 distributed over the inner part, a second conductive layer 102 distributed over the outer part, and a third conductive layer 103 distributed over the deformation. The third conductive layer 103 connects the first conductive layer 101 and the second conductive layer 102. The first conductive layer 101, the second conductive layer 102 and the third conductive layer 103 are connected to form at least one conductive line.

Wherein the first conductive layer 101 includes two portions independent of each other. Similarly, the second conductive layer 102 includes two portions independent of each other. The two parts of the first conductive layer 101, the second conductive layer 102 and the third conductive layer 103 form two independent conductive traces. An inner pad 4 electrically connected to the first conductive layer 101 is provided on the first conductive layer 101, and an outer pad 5 electrically connected to the second conductive layer 102 is provided on the second conductive layer 102.

The inner pad 4 on the conductive film is electrically connected to the voice coil, and the outer pad 5 on the conductive film is electrically connected to an external circuit. The outer bonding pad 5 can be directly electrically connected with an external circuit, or can be electrically connected with the external circuit through an elastic sheet arranged on a shell 6 of the sound generating device. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.

The conductive film provided by the embodiment of the invention is a multilayer composite structure comprising a conductive layer 1, and the conductive layer 1 is also respectively provided with an inner pad 4 and an outer pad 5. Wherein the inner pad 4 can be used to electrically connect with the voice coil, and the outer pad 5 can be used to electrically connect with the external circuit, i.e. the structure can directly connect with the internal and external signals of the terminal product through the corresponding pad. The lead wire that can make the voice coil loudspeaker voice coil need not be in the same direction as very long thread, can realize the electricity of voice coil loudspeaker voice coil and conductive film and be connected, can effectively avoid the phenomenon that the voice coil loudspeaker voice coil lead wire takes place the broken string at work, has improved the stability of product. When the conductive film provided by the embodiment of the invention is applied to the sound generating device, the structural design of the sound generating device can be simplified, the space utilization rate in the sound generating device is improved, and the frequency response and the reliability of the sound generating device are improved.

The embodiment of the invention provides a sound production device. The sound generating device comprises a vibration system and a magnetic circuit system (not shown in the figures and known in the art) cooperating with the vibration system. The sound generating device also comprises a shell with a containing cavity, and the vibration system and the magnetic circuit system are both contained in the containing cavity. Wherein, vibration system includes sound production vibrating diaphragm and the voice coil loudspeaker voice coil that combines in sound production vibrating diaphragm one side. The sound production vibrating diaphragm adopts the conductive film. In the working process of the sound production device, the voice coil which is communicated with the electric signal interacts with the magnetic circuit system to produce vertical vibration, so that the sound production vibrating diaphragm can be driven to produce sound.

As shown in fig. 2, when the conductive film of the present invention is used as a sounding diaphragm, the first conductive layer 101 has a ring structure (for example, the conductive film is rectangular as a whole, and the first conductive layer 101 has a rectangular ring structure), the first conductive layer 101 is located on an inner edge of the conductive film near the deformation portion, and the first conductive layer 101 can be used to form an electrical connection with a voice coil. Specifically, the voice coil generally has two voice coil leads, and for the first conductive layer 101, two independent conductive lines are formed to be electrically connected to the two leads of the voice coil. In the present embodiment, a first separating portion 11 is formed on each of two opposite short axes of the rectangular ring-shaped first conductive layer 101, and the conductive layer is not disposed at the position of the first separating portion 11, so that the first conductive layer 101 is divided into two independent portions. Further, an inner pad 4 electrically connected to the first conductive layer 101 is provided on the inner side of the first conductive layer 101. The number of the inner bonding pads 4 is at least two, and the inner bonding pads can be used for being electrically connected with two leads of the voice coil.

Wherein, all be provided with interior pad 4 corresponding every conducting wire, the lead wire of voice coil loudspeaker voice coil can be connected with two interior pad 4 that correspond the conducting wire are arbitrary to be connected electrically. Of course, the number of the inner pads 4 may also be more, for example, four, six, etc., and those skilled in the art may flexibly adjust the number according to actual needs, which is not limited herein.

In addition, a avoidance hole for avoiding is formed in the first base material layer 2 close to one side of the voice coil and corresponds to the inner bonding pad 4. This dodge the hole and be used for making things convenient for the lead wire of voice coil loudspeaker voice coil and interior pad 4 to pass through the mode electrically conductive bonding of electric welding.

As shown in fig. 2, when the conductive film of the present invention is used as a sound-generating diaphragm, the second conductive layer 102 has a ring structure (for example, the conductive film is rectangular as a whole, and the second conductive layer 102 also has a rectangular ring structure). The second conductive layer 102 is located at an edge position of the conductive film, i.e., an edge position of the outer side portion, for connection with an external circuit. Similarly, in order to form two independent conductive traces, in the present embodiment, the second conductive layer 102 is configured by two independent portions, in which one second separating portion 12 is formed on each of two opposite short axes of the rectangular annular second conductive layer 102, and no conductive layer is provided at the position of the second separating portion 12.

And, at least two corner portions of the second conductive layer 102 are respectively provided with an outer pad 5. The outer welding disc 5 is used for being electrically connected with an electric connecting piece on a shell of the sound production device in an electric welding mode and the like. Wherein, the first substrate layer 2 corresponding to the upper part and the lower part of the outer bonding pad 5 is provided with an avoidance area for avoiding the outer bonding pad 5, so that the outer bonding pad 5 can be properly exposed from the substrate layer 2, thereby being convenient for realizing the electric connection with an external circuit. For an end product such as a sound generating device, the electrical signal inside the end product can be controlled by electrically connecting the outer pads 5.

Further, a metal protective layer may be provided on the surfaces of the inner pad 4 and the outer pad 5. The metal protection layer may be formed by, for example, electroplating, or may be bonded thereto, which is not limited thereto.

As shown in fig. 2, when the conductive film of the present invention is used as a sound diaphragm, the third conductive layer 103 has a strip structure. The third conductive layer 103 connects the first conductive layer 101 and the second conductive layer 102 (for example, the conductive film is rectangular as a whole, and the first conductive layer 101 and the second conductive layer 102 are both rectangular ring-shaped structures). In this embodiment, the third conductive layers 103 are respectively disposed on two opposite long-axis sides of the rectangular conductive film. The structure and the arrangement position of the third conductive layer 103 can increase the strength of the rectangular conductive film in the long axis direction, which is helpful for improving the acoustic performance of the conductive film. The third conductive layer 103 may include at least three strip structures arranged in parallel, which can enhance the stability of electrical connection.

In addition, when the conductive film of the present invention is used as a sound-emitting diaphragm, the conductive film may further include a rigid reinforcing portion, and the reinforcing portion is bonded to an inner side of the conductive film. When a rigid reinforcing portion is provided on the conductive film of the present invention, the reinforcing portion and the conductive film may be bonded together by a means (e.g., adhesion) known to those skilled in the art. The high-frequency characteristics of the conductive film can be effectively improved by adding the rigid reinforcing part to the conductive film. However, it should be noted that, for the conductive film of the present invention, a person skilled in the art may select whether to provide the reinforcement portion or not according to actual needs, and this is not a limitation.

When the inner side of the conductive film is provided with the rigid reinforcing part, the reinforcing part can play a good supporting role in the electric welding process so as to prevent the whole conductive film from collapsing and other adverse phenomena in the electric welding process. Therefore, the reinforcement portion can be covered at the position of the inner pad 4. The reinforcement unit is selected from any one of materials such as epoxy resin, PET, PEN, metal plate, PEI, PAR, PPS, and PES.

The conductive film can be used as a sound vibrating diaphragm and a supporting vibrating diaphragm. The embodiment of the invention also provides a sound production device which comprises a vibration system and a magnetic circuit system matched with the vibration system. The vibration system comprises a sounding vibrating diaphragm, a voice coil and a supporting vibrating diaphragm, wherein the voice coil is combined on one side of the sounding vibrating diaphragm, and the supporting vibrating diaphragm is used for elastically supporting the voice coil. Wherein, the support diaphragm adopts the conductive film of the invention. Typically, the voice coil includes two oppositely disposed long sides and two oppositely disposed short sides, and a support diaphragm is disposed on each short side of the voice coil. For example, at least one of the support diaphragms is the conductive film of the present invention. When the conductive film is used for supporting the vibrating diaphragm, the conductive film has the advantage of stable vibration, can be used for preventing an internal vibration system from polarizing, and can improve the loudness of a sound generating device and reduce nonlinear distortion.

As shown in fig. 3 and 4, when the conductive film of the present invention is used as a support diaphragm, it is provided at each short side position of the voice coil, which may be in a fan shape. At this moment, the support diaphragm can cover the whole short edge of the voice coil, the support force is more balanced, and the elastic restoring force is better.

Of course, when the conductive film is used to support the diaphragm, the conductive film is not limited to the fan shape, and may also be in an arc shape or other shapes, which is not limited to this.

As shown in fig. 4, an outer portion 7, an inner portion 9 and a deformation portion 8 are distributed on one of the supporting diaphragms of the present invention. Wherein the outer part 7 is configured to: for connection with the housing 6, the inner side 9 is configured to: for connection to a voice coil. The conductive layers comprise a first conductive layer distributed over the inner part 9, a second conductive layer distributed over the outer part 7, and a third conductive layer distributed over the deformation 8. The third conductive layer is connected to the first conductive layer and the second conductive layer, the first conductive layer, the second conductive layer and the third conductive layer are connected to form two independent conductive traces (not shown), two inner pads 4 electrically connected to the two conductive traces are disposed on the first conductive layer, and two outer pads 5 electrically connected to the two conductive traces are disposed on the second conductive layer. Wherein, interior pad 4 can be used for realizing being connected with the voice coil loudspeaker voice coil electricity, outer pad 5 can be used for being connected with external circuit electricity, can make the lead wire of voice coil loudspeaker voice coil need not be in the same direction as very long thread, can realize the electric connection of voice coil loudspeaker voice coil and conducting film, can effectively avoid the phenomenon that the voice coil loudspeaker voice coil lead wire took place the broken string at work, has improved the stability of product.

The thickness of the substrate layer corresponding to the outer part 7 and the inner part 9 is large, and the substrate layer can play a role of structural support. And deformation portion 8 is used for forming the edge structure, provides the effect of elastic support power, and the thickness of its substrate layer that corresponds is relatively thin, and its sensitivity is higher.

Further, a through hole 71 for soldering is provided in the outer pad 5. During soldering, the solder paste on the lower surface of the outer pad 5 reaches the upper surface of the outer pad 5 through the through hole 71. The through-holes 71 increase the contact area of the solder paste with the outer pads 5. The solder paste solidifies to connect the outer pads 5 to the conductive terminals on the housing.

On the other hand, the embodiment of the invention also provides electronic equipment which comprises the sound generating device.

The electronic device can be, but is not limited to, a mobile phone, a tablet computer, an intelligent wearable device, an intelligent watch, an interphone, a television, an intelligent sound box and the like. The electronic device may include a housing and the sound generating device of the embodiment of the present disclosure, which is housed and fixed in the housing.

Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A conducting film for a sound generating device is characterized by comprising a conducting layer, a first base material layer and a second base material layer, wherein the first base material layer and the second base material layer are attached to two surfaces of the conducting layer;

the first substrate layer is connected with one surface of the conducting layer through a first adhesive layer in a hot pressing mode, and then a conducting circuit is formed on the conducting layer through etching; the conductive layer is a rolled copper foil;

the first adhesive layer has adhesive force at the hot pressing temperature and does not have adhesive force at the room temperature;

after a conductive circuit is formed on the conductive layer through etching, the second substrate layer is connected with the other surface of the conductive layer and the first adhesive layer through a second adhesive layer;

the thickness of the conducting layer is 12-36 μm, the thickness of the first glue layer is 5-50 μm, and the thickness of the first base material layer and the thickness of the second base material layer are 3-50 μm.

2. The conductive film for a sound generating device according to claim 1, wherein the first substrate layer is bonded to the first adhesive layer and then bonded to the conductive layer by means of hot pressing.

3. The conductive film for a sound-emitting device according to claim 1, wherein the second substrate layer is thermocompression bonded to the other surface of the conductive layer and the first adhesive layer via a second adhesive layer,

4. The conductive film for a sound generating device according to claim 1, wherein the second substrate layer is a thermoplastic elastomer, and after the conductive layer is etched to form the conductive circuit, the second substrate layer is connected with the other surface of the conductive layer and the first adhesive layer by means of hot pressing.

5. The conductive film for the sound production device according to claim 1, wherein the first adhesive layer is made of any one of a hot melt adhesive, an acrylic adhesive and a silica gel.

6. The conductive film for a sound generating device according to claim 1, wherein the first substrate layer and the second substrate layer are made of any one of plastic, thermoplastic elastomer, and rubber.

7. The conductive film for a sound generating device according to claim 1, wherein the material of the first substrate layer and the second substrate layer is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU.

8. The conductive film for a sound emitting device according to claim 1, wherein an inner pad and an outer pad are provided on the conductive layer, respectively, the inner pad being configured to: for connection with a voice coil, the outer pad configured to: for connection to an external circuit;

9. The conductive film for a sound emitting device according to any one of claims 1 to 8, comprising an inner portion located inside, a deformation portion provided outside the inner portion, and an outer portion provided outside the deformation portion;

10. The conductive film for a sound generating device according to claim 9, wherein the first conductive layer and the second conductive layer each comprise two independent portions, the two portions forming two independent conductive traces.

11. A sound production device is characterized by comprising a vibration system and a magnetic circuit system matched with the vibration system;

the vibration system comprises a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm, wherein the sounding diaphragm adopts the conductive film as claimed in any one of claims 1 to 10.

12. A sound production device is characterized by comprising a vibration system and a magnetic circuit system matched with the vibration system;

the vibration system comprises a sounding diaphragm, a voice coil combined on one side of the sounding diaphragm, and a supporting diaphragm used for elastically supporting the voice coil, wherein the supporting diaphragm adopts the conductive film as claimed in any one of claims 1 to 10.

13. The sound-generating apparatus of claim 12,

the voice coil comprises two long sides and two short sides, and two support diaphragms are arranged on the two short sides of the voice coil;

at least one of the support diaphragms employs the conductive film.