WO2021031495A1

WO2021031495A1 - Conductive membrane for use in sound-producing apparatus and sound-producing apparatus

Info

Publication number: WO2021031495A1
Application number: PCT/CN2019/128550
Authority: WO
Inventors: 赵国栋; 何超锋
Original assignee: 歌尔股份有限公司
Priority date: 2019-08-19
Filing date: 2019-12-26
Publication date: 2021-02-25
Also published as: CN110572746A; CN110572746B

Abstract

Disclosed in the present invention are a conductive membrane for use in a sound-producing apparatus and a sound-producing apparatus, comprising a conductive layer and a first base material layer and a second base material layer attached to the two surfaces of the conductive layer; the first base material layer is first connected by means of hot pressing a first adhesive layer to one surface of the conductive layer, and then conductive lines are formed on the conductive layer by means of etching; the first adhesive layer has adhesive force at the hot pressing temperature, but does not have adhesive force at room temperature. One technical effect of the present invention is: the conductive membrane is conductive and can be used as a sound-producing diaphragm and also as a conductive support diaphragm.

Description

Conductive film for sounding device and sounding device

Technical field

The present invention relates to the field of electro-acoustic conversion technology, and more specifically, the present invention relates to a conductive film for a sound emitting device and a sound emitting device.

Background technique

The sounding device generally includes a diaphragm and a voice coil combined on one side of the diaphragm, and also includes an electrical connection that electrically connects the internal circuit of the sounding device with the external circuit. Among them, the voice coil includes two voice coil leads. The two voice coil leads are electrically connected to the two pads of the electrical connector by spot welding. The electrical connector is also electrically connected to an external circuit to pass the electrical signal of the terminal product. Control the electrical signal in the voice coil.

Generally speaking, the lead wire of the voice coil needs to run a certain length of thread to realize the electrical connection with the electrical connector. However, when the voice coil is vibrating, the voice coil lead of the voice device with this structure is prone to disconnection, which will cause product failure.

In the prior art, some sounding devices also include a centering support piece, which is usually combined on one side of the diaphragm, and the centering support piece can be used as an electrical connection between the voice coil and the outside. Specifically, the connection wire of the voice coil is connected to the centering support piece, and the centering support piece is connected to the external circuit, thereby achieving electrical connection. In fact, although the application of the centering support piece effectively solves the hidden danger of voice coil wire breakage, the existence of the centering support piece will occupy the internal space of the sound device, thereby losing the acoustic performance of the product to a certain extent, thereby reducing The user’s audio experience.

In recent years, many researchers have begun to develop a diaphragm with a conductive function, which makes the conductive film widely used in sound generating devices. For conductive films, the current main methods are electrophoresis conductors, electroplated conductors, injection molded conductors in the diaphragm, adding conductive coatings, adding conductive ink layers, and laser etching. However, the above-mentioned methods all have the disadvantages of difficulty in technical realization, low mass production, high cost, low reliability and low acoustic performance.

Summary of the invention

An object of the present invention is to provide a conductive film for a sounding device and a new technical solution for the sounding device.

According to a first aspect of the present invention, there is provided a conductive film for a sound emitting device, comprising a conductive layer and a first substrate layer and a second substrate layer attached to both surfaces of the conductive layer;

Wherein, the first substrate layer is first connected to one surface of the conductive layer through a first adhesive layer by hot pressing, and then a conductive circuit is formed on the conductive layer by etching;

The first adhesive layer has adhesive force at the hot pressing temperature, but does not have adhesive force at room temperature.

Optionally, the first substrate layer is connected to the first adhesive layer first, and then connected to the conductive layer by hot pressing.

Optionally, after forming conductive lines on the conductive layer by etching, the second substrate layer is connected to the other surface of the conductive layer and the first adhesive layer through a second adhesive layer .

Optionally, the second substrate layer is connected to the other surface of the conductive layer and the first adhesive layer through a second adhesive layer by hot pressing,

The second adhesive layer has adhesive force at the hot pressing temperature, but does not have adhesive force at room temperature.

Optionally, the second substrate layer is a thermoplastic elastomer. After the conductive lines are formed by etching on the conductive layer, the second substrate layer is connected to the other surface of the conductive layer and the first The glue layers are connected together by hot pressing.

Optionally, the material of the first adhesive layer is any one of hot melt adhesive, acrylic adhesive, and silica gel.

Optionally, the material of the first substrate layer and the second substrate layer is any one of plastic, thermoplastic elastomer, and rubber.

Optionally, the material of the first substrate layer and the second substrate layer is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU.

Optionally, the conductive layer is a metal foil.

Optionally, the conductive layer is copper foil.

Optionally, the thickness of the conductive layer is 12-36 μm, the thickness of the first adhesive layer is 5-50 μm, and the thickness of the first substrate layer and the second substrate layer is 3-50 μm.

Optionally, an inner pad and an outer pad are respectively provided on the conductive layer, the inner pad is configured to connect with the voice coil, and the outer pad is configured to connect to an external circuit. connection;

Both the inner pad and the outer pad are exposed from the substrate layer.

Optionally, the conductive film for a sound generating device is characterized in that it includes an inner part located inside, a deformed part arranged outside the inner part, and an outer part arranged outside the deformed part;

The conductive layer includes a first conductive layer distributed on the inner portion, a second conductive layer distributed on the outer portion, and a third conductive layer distributed on the deformed portion, and the third conductive layer The layer connects the first conductive layer and the second conductive layer, and the first conductive layer, the second conductive layer and the third conductive layer are connected to form at least one conductive line.

Optionally, the first conductive layer and the second conductive layer each include two parts independent of each other, and the two parts of the first conductive layer, the second conductive layer and the third conductive layer form two Independent conductive circuit.

According to a second aspect of the present invention, a sound generating device is provided, which includes a vibration system and a magnetic circuit system matched with the vibration system;

The vibration system includes a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm, and the sounding diaphragm adopts the conductive film described above.

The vibration system includes a sounding diaphragm, a voice coil coupled to one side of the sounding diaphragm, and a supporting diaphragm for elastically supporting the voice coil, and the supporting diaphragm adopts the conductive film described above.

Optionally, the voice coil includes two long sides and two short sides, and two supporting diaphragms are provided on the two short sides of the voice coil; at least one of the supporting diaphragms adopts the conductive film .

The conductive film for a sound emitting device provided by the embodiment of the present invention is a multi-layer composite structure including a conductive layer, an adhesive layer and a substrate layer. The conductive film has good conductivity, and the use of the conductive film can effectively avoid the phenomenon of voice coil lead wire disconnection. The conductive film of the present invention can be used not only as a sound-producing diaphragm, but also as a supporting diaphragm. The conductive film of the present invention vibrates relatively smoothly during operation, can increase the loudness of the sound and reduce the nonlinear distortion.

Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.

Description of the drawings

The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention, and together with the description thereof are used to explain the principle of the present invention.

FIG. 1 is a schematic diagram of a partial structure of a conductive film provided by an embodiment of the present invention.

Fig. 2 is a perspective view of a conductive film provided by an embodiment of the present invention.

Fig. 3 is a partial structural diagram of a sound generating device provided by an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a supporting diaphragm provided by an embodiment of the present invention.

detailed description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement, numerical expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

In all the examples shown and discussed herein, any specific value should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiment may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

The conductive film provided by the embodiment of the present invention, as shown in FIG. 1, includes a conductive layer 1 and a first substrate layer 31 and a second substrate layer 32 attached to both surfaces of the conductive layer 1. Since the first substrate layer 31 and the second substrate layer 32 are respectively provided on the two surfaces of the conductive layer 1, that is, the conductive layer 1 is wrapped by the first substrate layer 31 and the second substrate layer 32. In order to prevent the conductive layer 1 from contacting other components and causing a short circuit. The first base material layer 31 and the second base material layer 32 can play a good protective effect on the conductive layer 1.

Wherein, the first substrate layer 31 is first connected to one surface of the conductive layer 1 through the first adhesive layer 21 by hot pressing, and then a conductive circuit is formed on the conductive layer 1 by etching. In the present invention, the first adhesive layer 21 has adhesive force at the hot pressing temperature, but does not have adhesive force at room temperature. In this way, under the action of hot pressing, the first substrate layer 31 can be firmly combined with the conductive layer 1 through the first adhesive layer 21.

In an example of the present invention, the first substrate layer 31 is connected to the first adhesive layer 21 first, and then connected to the conductive layer 1 by hot pressing. It should be noted that since the first adhesive layer 21 can form a viscous fluid state at high temperature, it has good adhesion at this time. Therefore, in this example, the first substrate layer 31 must first be connected to the first adhesive layer 21. The first adhesive layer 21 and the conductive layer 1 are combined together by hot pressing, and then the first adhesive layer 21 and the conductive layer 1 are combined by hot pressing. Through two hot pressing treatments, a stable connection relationship can be formed between the first substrate layer 31 and the conductive layer 1.

Of course, the present invention is not limited to the above-mentioned first base material layer 31 and the first adhesive layer 21 are combined by hot pressing, and then the conductive layer 1 and the first adhesive layer 21 are combined by hot pressing. Other bonding methods may also be used, for example, the first substrate layer 31, the first adhesive layer 21 and the conductive layer 1 are directly subjected to the hot pressing process. Using this direct hot pressing method is simpler and simplifies the process steps. In a specific application, those skilled in the art can flexibly select a specific combination manner according to needs, and there is no restriction on this.

The material of the first adhesive layer 21 of the present invention may be any one of hot melt adhesive, acrylic adhesive, and silica gel, for example. The material used in the first adhesive layer 21 of the present invention can form a viscous fluid state at a higher temperature, and has good adhesion. When used to connect the first base material layer 31 and the conductive layer 1, the two can be firmly connected, and the first base material layer 31 and the conductive layer 1 are not easily separated.

The material of the first substrate layer 31 of the present invention is a polymer material. Specifically, it can be plastic, thermoplastic elastomer or rubber. All of the above-mentioned materials have insulating properties. In an example of the present invention, the material of the first substrate layer 31 is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU. The first substrate layer 31 can further protect the inner conductive layer 1 so that the conductive film is safer and more reliable to use.

After forming conductive lines on the conductive layer 1 by etching, the second substrate layer 32 is connected to the other surface of the conductive layer 1 and the first adhesive layer through the second adhesive layer 22 . That is to say, in the present invention, the first substrate layer 31 is attached to one surface of the conductive layer 1, and then the conductive circuit is formed by etching on the conductive layer 1, and then the second substrate layer 32 is attached to On the other surface of the conductive layer 1, thereby forming a conductive film.

In an example of the present invention, the second substrate layer 32 is connected to the other surface of the conductive layer 1 and the first adhesive layer 21 through the second adhesive layer 22 by thermocompression.

The material of the second base material layer 32 of the present invention is a thermoplastic elastomer. After the conductive circuit is formed by etching on the conductive layer 1, the second substrate layer 32 is connected to the other surface of the conductive layer 1 and the first adhesive layer 21 by hot pressing . In this way, the second base material layer 22 and the conductive layer 1 can be stably connected.

The second adhesive layer 22 of the present invention has adhesive force at the hot pressing temperature, but does not have adhesive force at room temperature. The material used for the second adhesive layer 22 of the present invention can form a viscous fluid state at a higher temperature, and has good adhesion. When used to connect the second base layer 32 and the conductive layer 1, the two can be firmly connected, and the second base layer 32 and the conductive layer 1 are not easily separated. The material of the second adhesive layer 22 may be the same as or different from the material of the first adhesive layer 21. For example, the second adhesive layer 22 may be any one of hot melt adhesive, acrylic adhesive, and silica gel. For another example, the second adhesive layer 22 may be pressure sensitive adhesive. Those skilled in the art can make selections according to actual needs.

The material of the second base material layer 32 of the present invention is a polymer material. Specifically, it can be plastic, thermoplastic elastomer or rubber. These materials are all insulating. In an example of the present invention, the material of the second substrate layer 32 is any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU. The second substrate layer 32 can further protect the inner conductive layer 1 so that the conductive film is safer and more reliable to use. It should be noted that the material of the second base material layer 32 may be the same as or different from the material of the first base material layer 31. Those skilled in the art can flexibly choose according to actual needs.

The conductive layer 1 of the present invention is a metal foil. For example, the conductive layer 1 is copper foil. Copper foil is a thin sheet structure, which has low surface oxygen characteristics and can be easily attached to the surface of a variety of different materials. In addition, the conductivity of the copper material is better, which can make the formed conductive film have good conductivity. A predetermined circuit pattern can be formed on the conductive layer 1 by etching and etching methods well known to those skilled in the art.

In an example of the present invention, the conductive layer 1 adopts rolled copper foil, for example, RA copper foil or HA copper foil. The rolled copper foil has excellent tensile strength and high elongation, and has good ductility when combined with the first substrate layer 2 by hot pressing.

As shown in FIG. 2, the conductive layer 1 of the present invention is further provided with an inner pad 4 and an outer pad 5 respectively. Wherein, the inner pad 4 is configured to be electrically connected to the voice coil. The outer pad 5 is configured to connect with an external circuit. In addition, both the inner pad 4 and the outer pad 5 are exposed from the base material layer to facilitate electrical connection.

In addition, it should be noted that, in the conductive film of the present invention, the conductive layer 1 is combined with the first substrate layer 31 through the first adhesive layer 21, wherein a hot pressing process is adopted. When the hot pressing process is performed, the hot pressing temperature is relatively high, usually around 110°C. At this time, the first adhesive layer 21 is based on the material used, which can form a viscous fluid state, and the adhesive force is strong at this time. The conductive layers 1 are firmly connected together. After the conductive lines are etched on the conductive layer 1, the conductive layer 1 and the first substrate layer 31 can also be subjected to a rolling process. The rolling treatment is usually carried out at room temperature. At room temperature, the first adhesive layer 21 has no adhesive force, and impurities such as dust will not adhere to the first substrate layer 31, thereby avoiding the influence on the subsequent molding process. In the prior art, the adhesive used in the diaphragm of the sound generating device still has a certain adhesive force at room temperature and cannot be used for the rolling step after the conductive layer is etched and cannot be used to form the conductive film of the present invention.

For the conductive film provided by the embodiment of the present invention, the thickness of the conductive layer 1, the first adhesive layer 21, the first substrate layer 31, the second adhesive layer 22, and the second substrate layer 32 can be determined by those skilled in the art according to It needs to be adjusted flexibly so that the formed conductive film has a suitable thickness to fit the corresponding assembly space.

In an example of the present invention, the thickness of the conductive layer 1 is 12-36 μm, the thickness of the first adhesive layer 21 and the second adhesive layer 22 is 5-50 μm, and the first substrate layer 31 and the The thickness of the second substrate layer 32 is 3-50 μm. In this embodiment, the formed conductive film can be made to have good conductivity, and the substrate layer and the glue layer can play a good role in protecting the conductive layer 1 located in the middle. By reasonably adjusting the thickness of the conductive layer, the adhesive layer and the substrate layer, it can also ensure that the conductive film as a whole has appropriate rigidity and flexibility, and can make the conductive film more stable during vibration. It can not only improve the acoustic performance, but also prevent the phenomenon of polarization when vibrating.

The conductive film provided by the embodiment of the present invention includes an inner portion located on the inner side, a deformed portion provided around the inner portion, and an outer portion provided on the outer side of the deformed portion.

When the conductive film of the present invention is applied to a sound generating device such as a speaker, those skilled in the art can connect the outer part of the conductive film to the housing of the sound generating device to realize the fixation of the conductive film.

As shown in FIG. 2, the conductive layer 1 includes multiple parts, namely: a first conductive layer 101 distributed on the inner side, a second conductive layer 102 distributed on the outer side, and The third conductive layer 103 on the deformed portion. In addition, the third conductive layer 103 connects the first conductive layer 101 and the second conductive layer 102. The first conductive layer 101, the second conductive layer 102 and the third conductive layer 103 are connected to form at least one conductive circuit.

Wherein, the first conductive layer 101 includes two parts independent of each other. Similarly, the second conductive layer 102 also includes two parts independent of each other. Two parts of the first conductive layer 101, the second conductive layer 102, and the third conductive layer 103 form two independent conductive lines. In addition, an inner pad 4 electrically connected to the first conductive layer 101 is provided on the first conductive layer 101, and an outer pad 5 electrically connected to the second conductive layer 102 is provided on the second conductive layer 102.

The inner pad 4 on the conductive film is electrically connected to the voice coil, and the outer pad 5 on the conductive film is electrically connected to the external circuit. Wherein, the outer pad 5 may be directly electrically connected to an external circuit, or may be electrically connected to an external circuit through an elastic piece provided on the housing 6 of the sound device. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.

The conductive film provided by the embodiment of the present invention is a multilayer composite structure including a conductive layer 1, and the conductive layer 1 is further provided with an inner pad 4 and an outer pad 5 respectively. Among them, the inner pad 4 can be used for electrical connection with the voice coil, and the outer pad 5 can be used for electrical connection with an external circuit, that is, this structure can directly realize the connection with the internal and external signals of the terminal product through the corresponding pad. The lead of the voice coil can be electrically connected to the conductive film without having to run a long thread, which can effectively avoid the phenomenon of disconnection of the voice coil lead during work, and improve the stability of the product. When the conductive film provided by the embodiment of the present invention is applied to a sound emitting device, the structural design of the sound emitting device can be simplified, the space utilization rate inside the sound emitting device can be improved, and the frequency response and reliability of the sound emitting device can be improved.

The embodiment of the present invention provides a sound emitting device. The sound generating device includes a vibration system and a magnetic circuit system matched with the vibration system (not shown in the figure, which is common knowledge in the art). The sound generating device also includes a housing with a containing cavity, and both the vibration system and the magnetic circuit system are contained in the containing cavity. Among them, the vibration system includes a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm. The sound-producing diaphragm adopts the above-mentioned conductive film. During the working process of the sounding device, the voice coil with the electric signal interacts with the magnetic circuit system to generate up and down vibration, which can drive the sounding diaphragm to produce sound.

As shown in FIG. 2, when the conductive film of the present invention is used as a sound-emitting diaphragm, the first conductive layer 101 has a ring structure (for example, the conductive film is rectangular as a whole, and the first conductive layer 101 has a rectangular ring shape. Structure), the first conductive layer 101 is located on the inner edge of the conductive film near the deformed portion, and the first conductive layer 101 can be used to form an electrical connection with the voice coil. Specifically, the voice coil usually has two voice coil leads. For the first conductive layer 101, in order to form two independent conductive lines electrically connected to the two leads of the voice coil. In this embodiment, it is designed to provide a first partition 11 on each of the two opposite short axes of the rectangular ring-shaped first conductive layer 101, and no conductive layer is provided at the position where the first partition 11 is located, so that the first The conductive layer 101 is divided into two independent parts. In addition, an inner pad 4 electrically connected to the first conductive layer 101 is provided inside the first conductive layer 101. Wherein, the number of the inner bonding pads 4 is set to at least two, which can be used for electrical connection with the two leads of the voice coil.

Wherein, an inner pad 4 is provided corresponding to each conductive circuit, and the lead of the voice coil can be electrically connected to any one of the two inner pads 4 of the corresponding conductive circuit. Of course, the number of inner pads 4 can also be set to more, for example, four, six, etc. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.

In addition, an escape hole for avoiding is provided on the first substrate layer 2 on the side close to the voice coil corresponding to the inner pad 4. The escape hole is used to facilitate the conductive connection between the lead wire of the voice coil and the inner pad 4 by electric welding.

As shown in FIG. 2, when the conductive film of the present invention is used as a sound-emitting diaphragm, the second conductive layer 102 has a ring structure (for example, the conductive film is rectangular as a whole, and the second conductive layer 102 is also a rectangular ring at this time.状结构). The second conductive layer 102 is located at the edge of the conductive film, that is, at the edge of the outer part, and is used to connect to an external circuit. Similarly, in order to form two independent conductive lines, in this embodiment, a second partition 12 is provided on each of the two opposite short axes of the rectangular ring-shaped second conductive layer 102, where the second partition 12 is located. No conductive layer is provided at the position of, so that the second conductive layer 102 can be composed of two independent parts.

Moreover, at least two corners of the second conductive layer 102 are respectively provided with outer pads 5. The outer pad 5 is used to electrically connect with the electrical connector on the housing of the sounding device through electric welding or the like. Wherein, the first substrate layer 2 corresponding to the upper and lower parts of the outer pad 5 is provided with an escape area for avoiding the outer pad 5, so that the outer pad 5 can be removed from the substrate layer 2. Appropriate exposure to facilitate electrical connection with external circuits. For terminal products such as sound generating devices, the electrical signals inside the terminal product can be controlled by electrically connecting the outer pad 5.

In addition, a metal protection layer may be provided on the surfaces of the inner pad 4 and the outer pad 5. The metal protective layer can be formed by electroplating, for example, of course, a metal protective layer can also be attached to it, which is not limited.

As shown in FIG. 2, when the conductive film of the present invention is used as a sound generating diaphragm, the third conductive layer 103 has a strip structure. The third conductive layer 103 connects the first conductive layer 101 and the second conductive layer 102 (for example, the conductive film has a rectangular shape as a whole, and both the first conductive layer 101 and the second conductive layer 102 have a rectangular ring structure). In this embodiment, the third conductive layer 103 is respectively disposed on two opposite long axis sides of the rectangular conductive film. The structure and location of the third conductive layer 103 can increase the strength of the rectangular conductive film in the long axis direction, which helps to improve the acoustic performance of the conductive film. Wherein, the third conductive layer 103 may include at least three strip structures arranged in parallel, which can enhance the stability of electrical connection.

In addition, when the conductive film of the present invention is used as a sound-emitting diaphragm, it may also include a rigid reinforcement part, and the reinforcement part is bonded to the inner side of the conductive film. When a rigid reinforcing part is provided on the conductive film of the present invention, the reinforcing part and the conductive film can be joined together in a manner known to those skilled in the art (for example, bonding). The high frequency characteristics of the conductive film can be effectively improved by adding a rigid reinforcement part on the conductive film. However, it should be noted that for the conductive film of the present invention, those skilled in the art can choose to provide or not provide a reinforcing part on it according to actual needs, and there is no limitation on this.

When a rigid reinforcement is provided on the inner side of the conductive film, the reinforcement can play a good supporting role during the electric welding process, so as to prevent the conductive film from collapsing during the electric welding process. Therefore, the reinforcement portion can be covered where the inner pad 4 is located. Wherein, the reinforcing part is selected from any one of materials such as epoxy resin, PET, PEN, metal sheet, PEI, PAR, PPS, PES and the like.

The conductive film of the present invention can be used not only as a sound-producing diaphragm, but also as a supporting diaphragm. The embodiment of the present invention also provides a sound generating device, which includes a vibration system and a magnetic circuit system matched with the vibration system. The vibration system includes a sounding diaphragm, a voice coil coupled to one side of the sounding diaphragm, and a supporting diaphragm for elastically supporting the voice coil. Wherein, the supporting diaphragm adopts the conductive film of the present invention. Generally, the voice coil includes two opposed long sides and two opposed short sides, and a supporting diaphragm is provided on each short side of the voice coil. For example, at least one of the supporting diaphragms is the conductive film of the present invention. When the conductive film of the present invention is used as a supporting diaphragm, it has the advantage of stable vibration, can be used to prevent the internal vibration system from being polarized, can increase the loudness of the sound device and reduce nonlinear distortion.

As shown in Figs. 3 and 4, when the conductive film of the present invention is used as a supporting diaphragm, it is arranged at each short side of the voice coil, and it can be fan-shaped. At this time, the supporting diaphragm can cover the entire short side of the voice coil, the supporting force is more balanced, and the elastic recovery force is better.

Of course, when the conductive film is used to support the diaphragm, it is not limited to the above-mentioned sector shape, and it may also be an arc shape or other shapes, which is not limited.

As shown in FIG. 4, one of the supporting diaphragms of the present invention is distributed with an outer part 7, an inner part 9 and a deformable part 8. Wherein, the outer portion 7 is configured to be connected to the housing 6, and the inner portion 9 is configured to be connected to a voice coil. The conductive layer includes a first conductive layer distributed on the inner portion 9, a second conductive layer distributed on the outer portion 7, and a third conductive layer distributed on the deformed portion 8. In addition, the third conductive layer is connected to the first conductive layer and the second conductive layer, and the first conductive layer, the second conductive layer and the third conductive layer are connected to form two independent conductive lines (not shown) , And the first conductive layer is provided with two inner pads 4 that are electrically connected to the two conductive lines, and the second conductive layer is provided with two outer pads that are electrically connected to the two conductive lines. 5. Wherein, the inner pad 4 can be used for electrical connection with the voice coil, and the outer pad 5 can be used for electrical connection with an external circuit, so that the lead of the voice coil does not need to run out a long thread to realize the sound The electrical connection between the coil and the conductive film can effectively prevent the voice coil lead from breaking during work, and improve the stability of the product.

The thickness of the base material layer corresponding to the outer part 7 and the inner part 9 is relatively thick, which can play a role of structural support. The deformed portion 8 is used to form a folded ring structure to provide elastic support. The thickness of the corresponding substrate layer is relatively thin, and its sensitivity is high.

In addition, the outer pad 5 is also provided with a through hole 71 for soldering. During soldering, the solder paste located on the lower surface of the outer pad 5 reaches the upper surface of the outer pad 5 through the through hole 71. The through hole 71 increases the contact area between the solder paste and the outer pad 5. After the solder paste is solidified, the outer pad 5 is connected to the conductive terminal on the housing.

On the other hand, an embodiment of the present invention also provides an electronic device, which includes the above-mentioned sound generating device.

Wherein, the electronic device may be, but is not limited to, a mobile phone, a tablet computer, a smart wearable device, a smart watch, a walkie-talkie, a TV, a smart speaker, etc. The electronic device may include a housing and the sounding device of the embodiment of the present disclosure, and the sounding device is housed and fixed in the housing.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims

A conductive film for a sounding device, which is characterized by comprising a conductive layer and a first substrate layer and a second substrate layer attached to both surfaces of the conductive layer;

Wherein, the first substrate layer is first connected to one surface of the conductive layer through a first adhesive layer by hot pressing, and then a conductive circuit is formed on the conductive layer by etching;

The first adhesive layer has adhesive force at the hot pressing temperature, but not at room temperature.
The conductive film for a sounding device according to claim 1, wherein the first substrate layer is first connected to the first adhesive layer, and then connected to the conductive layer by hot pressing Together.
The conductive film for a sounding device according to claim 1, wherein after the conductive circuit is formed on the conductive layer by etching, the second substrate layer is connected to the conductive layer through a second adhesive layer. The other surface of the layer is connected to the first adhesive layer.
The conductive film for a sounding device according to claim 3, wherein the second substrate layer is connected to the other surface of the conductive layer and the first adhesive layer by a second adhesive layer. ,

The second adhesive layer has adhesive force at the hot pressing temperature, but does not have adhesive force at room temperature.
The conductive film for a sound generating device according to claim 1, wherein the second substrate layer is a thermoplastic elastomer, and after forming conductive lines on the conductive layer, the second substrate layer Then, the other surface of the conductive layer and the first adhesive layer are connected together by hot pressing.
The conductive film for a sounding device according to claim 1, wherein the material of the first adhesive layer is any one of hot melt adhesive, acrylic adhesive, and silica gel.
The conductive film for a sound emitting device according to claim 1, wherein the material of the first substrate layer and the second substrate layer is any one of plastic, thermoplastic elastomer, and rubber.
The conductive film for a sound emitting device according to claim 1, wherein the materials of the first substrate layer and the second substrate layer are PEEK, PAR, PEI, PI, PPS, PEN, PET Any one of TPEE, TPU.
The conductive film for a sound emitting device according to claim 1, wherein the conductive layer is a metal foil.
The conductive film for a sound emitting device according to claim 9, wherein the conductive layer is copper foil.
The conductive film for a sounding device according to claim 1, wherein the thickness of the conductive layer is 12-36 μm, the thickness of the first adhesive layer is 5-50 μm, and the first substrate layer And the thickness of the second substrate layer is 3-50 μm.
The conductive film for a sounding device according to claim 1, wherein an inner pad and an outer pad are respectively provided on the conductive layer, and the inner pad is configured to connect to a voice coil , The external pad is configured to be used for connection with an external circuit;

Both the inner pad and the outer pad are exposed from the substrate layer.
The conductive film for a sound generating device according to any one of claims 1-12, characterized by comprising an inner side located on the inner side, a deformed portion provided on the outer side of the inner side, and a deformed portion provided on the outer side of the deformed portion The outer part of

The conductive layer includes a first conductive layer distributed on the inner portion, a second conductive layer distributed on the outer portion, and a third conductive layer distributed on the deformed portion, and the third conductive layer The layer connects the first conductive layer and the second conductive layer, and the first conductive layer, the second conductive layer and the third conductive layer are connected to form at least one conductive line.
The conductive film for a sound generating device according to claim 13, wherein the first conductive layer and the second conductive layer each comprise two parts independent of each other, and the first conductive layer, the The second conductive layer and the third conductive layer form two independent conductive lines.
A sound generating device, characterized by comprising a vibration system and a magnetic circuit system matched with the vibration system;

The vibration system includes a sounding diaphragm and a voice coil combined with one side of the sounding diaphragm, and the sounding diaphragm adopts the conductive film according to any one of claims 1-14.
A sound generating device, characterized by comprising a vibration system and a magnetic circuit system matched with the vibration system;

The vibration system includes a sounding diaphragm, a voice coil combined on one side of the sounding diaphragm, and a supporting diaphragm for elastically supporting the voice coil, and the supporting diaphragm adopts any one of claims 1-14 The conductive film.
The sounding device according to claim 16, wherein:

The voice coil includes two long sides and two short sides, and two supporting diaphragms are provided on the two short sides of the voice coil;

At least one of the supporting diaphragm adopts the conductive film.