WO2021093115A1

WO2021093115A1 - Conductive vibrating diaphragm for sound production device and sound production device

Info

Publication number: WO2021093115A1
Application number: PCT/CN2019/129534
Authority: WO
Inventors: 宋启龙; 解志浩; 王昭明
Original assignee: 歌尔股份有限公司
Priority date: 2019-11-11
Filing date: 2019-12-28
Publication date: 2021-05-20
Also published as: CN210641063U

Abstract

Disclosed are a conductive vibrating diaphragm for a sound production device and a sound production device, the conductive vibrating diaphragm comprising conductive layers, and base material layers located on two sides of the conductive layers. The base material layers and the multiple conductive layers are compounded to form a sandwich structure, the conductive layers of the structure are all located in the middle of the base material layers, and the problems of deformation and distortion caused by physical property difference of traditional high polymer materials and copper foils are solved by means of damping and buffering the multiple conductive layers and the base material layers on the two sides of the conductive layers; and in order to solve the problems of stretching and tearing of the conductive layers caused by bending structures of folding ring parts, conductive layer structures of the folding ring parts are configured to be symmetrical belt-shaped structures, and the stress of the conductive layers in the vibration stretching process is greatly reduced.

Description

Conductive vibrating membrane for sounding device and sounding device

Technical field

The present invention relates to the technical field of electro-acoustic conversion, in particular, the present invention relates to a conductive diaphragm for a sound emitting device and a sound emitting device.

Background technique

The sounding device generally includes a diaphragm and a voice coil combined on one side of the diaphragm, and also includes an electrical connection that electrically connects the internal circuit and the external circuit of the sounding device. Among them, the voice coil includes two voice coil leads. The two voice coil leads are electrically connected to the two pads of the electrical connector by spot welding. The electrical connector is electrically connected to the external circuit at the same time to pass the electrical signal of the terminal product. Control the electrical signal in the voice coil.

Generally speaking, the lead wire of the voice coil needs to run a certain length of thread, and then it is suspended in the air to realize the electrical connection with the electrical connector. Although the floating lead structure can achieve higher sensitivity, due to the limitation of the lead floating, the amplitude cannot be too large, and the risk of disconnection is high, the low frequency effect is not significant enough, and it cannot provide a better user hearing experience.

In recent years, many researchers have begun to develop diaphragms with conductive functions, which makes conductive diaphragms more widely used in sound generating devices. For conductive diaphragms, the main methods currently used are electrophoresis conductors, electroplated conductors, injection molded conductors in the diaphragm, adding conductive coatings, adding conductive ink layers, and laser etching. However, these methods mentioned above all have the disadvantages of difficulty in technical implementation, low mass production, high cost, low reliability and low acoustic performance.

Summary of the invention

An object of the present invention is to provide a conductive diaphragm for a sound emitting device and a new technical solution for the sound emitting device.

According to the first aspect of the present invention, there is provided a conductive diaphragm for a sound emitting device, which includes a conductive layer and a substrate layer located on the upper and lower sides of the conductive layer;

The conductive diaphragm includes a connecting portion, a folded ring portion, and a central portion. The connecting portion is arranged on the periphery of the conductive diaphragm, and the folded ring portion is arranged inside the connecting portion and has a bent shape. The central part is arranged inside the folding ring part and at the center of the conductive diaphragm;

The conductive layer includes a first conductive area provided on the connecting portion and/or a central portion, a second conductive area provided on the folding ring portion, the second conductive area and the first conductive area Electrical connection

The Young's modulus of the second conductive region is smaller than the Young's modulus of the first conductive region, and the second conductive region has a symmetrical band-shaped structure.

Optionally, the symmetry axis of the symmetry belt-shaped structure includes a first symmetry axis, the first symmetry axis being perpendicular to the extension direction of the folding ring portion and passing through the center of the folding ring portion.

Optionally, the symmetry axis of the symmetrical belt-shaped structure further includes a second symmetry axis, the second symmetry axis being parallel to the extension direction of the folding ring portion and passing through the center of the folding ring portion.

Optionally, at least one second conductive area is provided on the one folding ring portion.

Optionally, the symmetrical belt-shaped structure is at least one of an X-shape, an H-shape and an I-shape.

Optionally, the material of the substrate layer is at least one of thermoplastic, thermoplastic elastomer and rubber.

Optionally, the thermoplastic includes at least one of polyether ether ketone, polyethylene naphthalate, polyethylene terephthalate, and polyphenylene sulfide.

Optionally, the thermoplastic elastomer includes at least one of polyarylate, thermoplastic polyurethane, and thermoplastic polyester elastomer.

Optionally, the rubber includes methyl silicone rubber, dimethyl silicone rubber, methyl vinyl silicone rubber, nitrile silicone rubber, fluoro rubber, styrene butadiene rubber, triethylene propylene rubber, ethylene acrylate rubber, and acrylate rubber At least one of the materials.

Optionally, the material of the first conductive area is metal foil, and the material of the second conductive area is a conductive adhesive layer.

Optionally, the first conductive area is copper foil.

Optionally, the copper foil includes at least one of rolled copper foil, electroplated copper foil, and sprayed copper foil, and the thickness of the copper foil ranges from 2 to 150 μm.

Optionally, the substrate layer includes a first substrate layer and a second substrate layer directly attached to the conductive layer, and the first conductive area is connected to the first substrate layer;

After forming a conductive circuit on the first conductive region by etching, the second conductive region is connected to the first substrate layer and the first conductive region;

The second substrate layer is connected to the first substrate layer, the first conductive region and the second conductive region.

Optionally, a first solder joint and a second solder joint are provided on the first conductive area;

The first substrate layer and/or the second substrate layer are provided with openings corresponding to the first solder joints and the second solder joints.

Optionally, the thickness of the substrate layer ranges from 5 to 100 μm.

Optionally, the forming method of the first conductive region is one of hot pressing or bonding.

Optionally, the adhesive used in the bonding method is at least one of epoxy type, acrylic type, polyurethane type and silicone type adhesive.

Optionally, the second conductive region extends to the first conductive region.

Optionally, the forming method of the second conductive area is one of coating or printing.

According to a second aspect of the present invention, there is provided a sound generating device, including a vibration system and a magnetic circuit system matched with the vibration system;

The vibration system includes a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm, and the sounding diaphragm adopts the above-mentioned conductive diaphragm.

The beneficial effect of the present invention is that the present invention discloses a conductive diaphragm for a sound emitting device and a sound emitting device. The conductive diaphragm includes a conductive layer and a substrate layer located on both sides of the conductive layer. The substrate layer is combined with a variety of conductive layers to form a sandwich structure. The conductive layers of this structure are all in the middle of the substrate layer. The damping buffer of the multiple conductive layers and the substrate layers on both sides is used to make up for the traditional polymer materials, The problem of deformation and distortion of copper foil caused by the difference in physical properties; and in order to solve the problem of stretching and tearing of the conductive layer by the bending structure of the ring portion, the conductive layer structure of the ring portion is set to a symmetrical ribbon structure, which greatly reduces The stress of the conductive layer during vibration stretching.

Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.

Description of the drawings

The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present invention, and together with the description thereof, serve to explain the principle of the present invention.

Fig. 1 is a schematic diagram of the structure of a conductive diaphragm for a sound generating device of the present invention;

2 is a schematic diagram of another conductive diaphragm structure used in a sound generating device of the present invention;

Fig. 3 is a perspective view of a conductive diaphragm used in a sound device of the present invention.

Among them: 1-connecting part; 2-folding ring part; 3-central part; 4-first base material layer; 5-second base material layer; 6-first solder joint; 7-second solder joint; 8- Reinforcement; 11-first conductive area; 12-second conductive area.

Detailed ways

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

1 and 3, the present invention discloses a conductive diaphragm for a sound generating device, including a conductive layer and a substrate layer located on the upper and lower sides of the conductive layer;

The conductive diaphragm includes a connecting portion 1, a folded ring portion 2 and a central portion 3. The connecting portion 1 is arranged on the periphery of the conductive diaphragm, and the folded ring portion 2 is arranged inside the connecting portion 1 and presents In a bent shape, the central portion 3 is arranged inside the folded ring portion 2 and located at the center of the conductive diaphragm;

The conductive layer includes a first conductive region 11 disposed on the connecting portion 1 and/or the central portion 3, a second conductive region 12 disposed on the folding ring portion 2, and the second conductive region 12 is connected to The first conductive area 11 is electrically connected;

The conductive layer in the embodiment of the present invention is made of different materials. The Young's modulus of the second conductive region 12 is smaller than the Young's modulus of the first conductive region 11, and the second conductive region 12 is symmetrical. Ribbon structure.

The substrate layer is combined with a variety of conductive layers to form a sandwich structure. The conductive layers of this structure are all in the middle of the substrate layer. The damping buffer of the multiple conductive layers and the substrate layers on both sides is used to make up for the traditional polymer materials, The copper foil is deformed and twisted due to the difference in physical properties; and the first conductive area 11 located in the middle position increases the rigidity and strength of the conductive diaphragm; in addition, in order to solve the stretching problem of the conductive diaphragm folding ring 2 The position of the ring portion 2 uses the second conductive area 12 with a smaller Young's modulus to replace the first conductive area 11 with a larger Young's modulus, and in order to solve the problem of the bending structure of the folded ring portion 2 on the second conductive area 12 For the problem of tensile tearing, the structure of the second conductive area 12 is set to a symmetrical belt structure, which greatly reduces the stress of the second conductive area 12 during the vibration and stretching process while ensuring the strength and stability of the structure.

Optionally, the symmetrical belt-shaped structure is at least one of an X-shape, an H-shape and an I-shape. Referring to FIG. 3, when the symmetrical belt-shaped structure is a symmetrical X-shaped structure, the X-shaped structure is composed of four arc-shaped sections and one rectangular section; the width a ₂ of the middle rectangular section of the X-shaped structure is the arc-shaped section width 1-2 times of a ₁ _{; the length a 4} of the middle rectangular section of the X-shaped structure is 0.5-2 times of the half length a ₃ _{of the ring portion 2; the width a 1} of the arc-shaped section of the X-shaped structure is 0.1-0.5 times the width of the folded ring portion 2.

Optionally, the folded ring portion 2 is circular or rectangular, and when the folded ring portion 2 is rectangular, patterns radiating outward from the central portion 3 are provided on the four corners of the folded ring portion 2 . The patterns are protrusions or grooves arranged on the conductive diaphragm. The pattern is linear or arc-shaped. The pattern can offset the stress generated by the conductive diaphragm during vibration, improve the compliance of the conductive diaphragm, increase the life of the conductive diaphragm, and further prevent the conductive diaphragm from polarization; b ₁ , b ₂ , B ₃ and b ₄ are the specific parameters of the above-mentioned X-shaped structure, corresponding to a ₁ , a ₂ , a ₃ and a _{4 respectively} , but when the X-shaped structure is on different sides of the rectangle, a ₁ , A ₂ , a ₃ , a ₄ and b ₁ , b ₂ , b ₃ , and b ₄ respectively correspond to the parameter characteristics of the X-shaped structure on different sides.

The advantage of this setting is that less conductive materials can be used to achieve the required strength and stability of the conductive diaphragm, the width and connection area of the conductive layer can be ensured, the conductive diaphragm is flatter, the flatness after molding is high, and the folding The ring part 2 is not easy to be broken by tension, and the reliability of resistance to tension is obviously improved.

Optionally, the material of the substrate layer is at least one of thermoplastic, thermoplastic elastomer and rubber. Use thermoplastics, thermoplastic elastomers or rubber to compound with a variety of conductive layers to form a symmetrical structure. The conductive layers of this structure are all in the middle of the substrate layer, and a variety of conductive layers with different Young's modulus and substrates on both sides are used The damping cushion of the layer compensates for the deformation and distortion caused by the difference in physical properties of traditional polymer materials and copper foil.

Optionally, the thermoplastic includes at least one of polyether ether ketone, polyethylene naphthalate, polyethylene terephthalate, and polyphenylene sulfide; the thermoplastic elastomer includes At least one of polyarylate, thermoplastic polyurethane, and thermoplastic polyester elastomer; the rubber includes methyl silicone rubber, dimethyl silicone rubber, methyl vinyl silicone rubber, nitrile silicone rubber, fluorine rubber, styrene butadiene rubber , At least one of triethylene propylene rubber, ethylene acrylate rubber and acrylate rubber materials.

Thermoplastics, thermoplastic elastomers and rubbers all have high adhesion at high temperatures. Therefore, under the hot-press molding method, no adhesive is needed when the thermoplastic, thermoplastic elastomer, and rubber are used to combine, and the substrate layer can be well connected with the first conductive region 11. It has the characteristics of simple combination, good firmness and not easy to separate.

Optionally, a first solder joint 6 and a second solder joint 7 are provided on the first conductive area 11; the conductive diaphragm of the present invention can be applied to the vibration system of a sounding device, and the first solder joint 6 is It is configured to be used for connection with an external circuit; the second solder joint 7 is configured to be used for connection with a voice coil of a sound emitting device. The substrate layer is provided with openings corresponding to the first solder joint 6 and the second solder joint 7, and both the first solder joint 6 and the second solder joint 7 are exposed from the substrate layer, To facilitate electrical connection. The number of the first welding spot 6 and the second welding spot 7 may both be two, or it may be determined according to the specific structure and function of the sound generating device.

On the one hand, the conductive diaphragm and the voice coil are connected together, and the voice coil leads can extend a short length to connect with the first conductive area 11 of the central portion 3, and then the first conductive area 11 of the connecting portion 1 is electrically connected to the outside. The circuit is connected, and the voice coil lead does not need to be provided with a suspended structure, so the risk of disconnection can be avoided. The vibration system of the sound device can have large amplitude and high sensitivity, which improves the low-frequency performance.

On the other hand, the conductive diaphragm of the present invention overcomes the problems of difficulty and low reliability of the conductive diaphragm in the prior art, and can realize high-efficiency mass production.

Optionally, the material of the first conductive region 11 is a metal foil with a relatively high Young's modulus, which can improve the structural strength of the connecting portion 1 and the central portion 3, so that the two parts are not easily deformed, and the central portion The first conductive area 11 of 3 is used as a carrier for welding with the voice coil leads, and the first conductive area 11 is used as a carrier for welding with an external circuit. The use of metal foil can withstand high temperatures during welding and will not scald the base layer of the conductive diaphragm. The material of the second conductive area 12 is a conductive adhesive layer with a small Young's modulus, so that the second conductive area 12 can adapt to repeated bending and deformation without breaking, avoiding the folding ring during the reciprocating vibration of the conductive diaphragm The frequent deformation of the portion 2 causes the conductive layer to break.

The foregoing provides an embodiment for electrically connecting the conductive diaphragm and the voice coil, but those skilled in the art should understand that the conductive diaphragm in the present invention can also be used in other scenarios, as long as the conductive diaphragm itself is based on the structure and function of the conductive diaphragm. Above, further having the above-defined conductive layer structure should be within the protection scope of this patent. For example, in another embodiment, when a metal layer is attached to the conductive diaphragm as a movable plate of a capacitor, The conductive layer of the conductive diaphragm can be used to realize electrical connection with the movable electrode plate.

Optionally, the first conductive regions 11 are all copper foils, and the thickness of the copper foil ranges from 2 to 150 μm. Copper foil is a thin sheet-like structure with low surface oxidation characteristics and can be easily attached to the surface of a variety of substrates of different materials. In addition, the copper material has better conductivity, which can make the formed conductive diaphragm have good conductivity. The first conductive region 11 can be formed into a predetermined circuit pattern by etching, etching, etc., which are well known to those skilled in the art.

Optionally, the copper foil includes at least one of rolled copper foil, electroplated copper foil, and sprayed copper foil. Rolled copper foil, electroplated copper foil and sprayed copper foil all have excellent tensile strength and high elongation, and have good ductility when combined with the base layer of the conductive diaphragm. In addition, it should be noted that the connecting portion 1 and the first conductive area 11 on the central portion 3 are not limited to be made of the same material, and can be made of metal foils of different materials according to specific needs.

Optionally, the substrate layer includes a first substrate layer 4 and a second substrate layer 5 directly attached to the conductive layer, and the first conductive region 11 is connected to the first substrate layer 4 After forming a conductive circuit by etching on the first conductive region 11, the second conductive region 12 is connected to the first substrate layer 4 and the first conductive region 11; the second base The material layer 5 is connected to the first substrate layer 4 and the first conductive region 11 and the second conductive region 12 together.

Optionally, the thickness of the substrate layer ranges from 5 to 100 μm. The thickness of the first substrate layer 4 and the second substrate layer 5 can be flexibly adjusted by those skilled in the art as required. In an example of the invention, the thickness of the first base material layer 4 and the second base material layer 5 can be respectively controlled at 5-100 μm, preferably 3-50 μm, and the first base material layer 4 and the second base material layer 4 The substrate layer 5 can play a good protective effect on the conductive layer located in the middle. By reasonably adjusting the thickness of the substrate layer and the conductive layer on both sides, it can also ensure that the conductive diaphragm as a whole has appropriate rigidity and flexibility, and can make the conductive diaphragm more stable when vibrating.

Optionally, the forming method of the first conductive region 11 is one of hot pressing or bonding. It should be noted that when the first base material layer 4 is a thermoplastic elastomer layer, and the metal foil of the first conductive area 11 and the first base material layer 4 are connected together by hot pressing, the hot pressing The temperature is relatively high, usually around 110°C. At this time, the first substrate layer 4 is based on the material used is a thermoplastic elastomer, which can form a viscous fluid state. At this time, the adhesion is strong and can be firmly bonded to the two conductive layers Connected together. After the conductive lines are etched on the two conductive layers, the two conductive layers and the first substrate layer 4 need to be subjected to a rolling process. The rolling treatment is usually carried out at room temperature. At room temperature, the thermoplastic elastomer has no adhesive force and will not cause impurities such as dust to adhere to the first substrate layer 4 and the two conductive layers, thereby avoiding the influence on the subsequent molding process.

Optionally, the adhesive used in the bonding method is at least one of epoxy type, acrylic type, polyurethane type and silicone type adhesive. After the adhesive is cured, the molecular skeleton structure of the conductive adhesive layer is formed, which provides mechanical properties and bonding performance guarantee.

Optionally, the second conductive region 12 extends to the first conductive region 11, and the second conductive region 12 may partially or completely cover the first conductive region 11 to ensure the reliability of the connection between the two to achieve good Conductive connection function, during the vibration process of the conductive diaphragm, there will be no separation between the two connections.

Optionally, the forming method of the second conductive region 12 is one of coating or printing. In addition to the conductive adhesive layer, the second conductive area 12 can also be a conductive ink layer. The second conductive area 12 formed by the conductive adhesive layer or the conductive ink layer has a small Young's modulus and has good flexibility and fatigue resistance. The stronger the destruction ability is, the second conductive zone 12 will not have a risk of fracture when the vibration system vibrates in a large amplitude state.

Optionally, the conductive adhesive layer is mainly composed of conductive particles, adhesives, solvents, additives, etc., and the high-temperature conductive adhesive layer may also be doped with glass powder.

Among them, the adhesive generally chooses epoxy, acrylic, polyurethane, and silicone adhesives. After curing, the adhesive forms the molecular skeleton structure of the conductive adhesive layer, which provides mechanical and adhesive performance guarantees, and Make conductive particles form channels.

The solvent is butyl anhydride acetate, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, and isophorone. Due to the high amount of conductive particles added, the viscosity of the adhesive of the conductive adhesive layer is greatly increased, which often affects the process performance of the adhesive. In order to reduce the viscosity and achieve good manufacturability and rheology, it is also necessary to add a solvent or reactive diluent to the conductive adhesive.

The conductive particles may specifically be at least one of gold, silver, copper, aluminum, zinc, nickel powder or alloy powder. In this specific embodiment, the conductive adhesive layer is a conductive silver adhesive, and the conductive particles in the conductive adhesive layer are silver particles. The resistance of silver is low, the conductivity is good, and it is not easy to oxidize.

In a specific embodiment, the particle size of the silver particles is less than or equal to 1 μm. When the filling ratio of the silver particles is constant and the conductive adhesive layer has the same thickness, there are more silver particles, and the gap between the silver particles is smaller, and the conductivity is obtained. Promote. Furthermore, the particle size of the silver particles is less than or equal to 100 nm, the nano-scale silver particles can further improve the conductivity of the second conductive region 12, and the printing methods of the conductive silver glue are diverse and flexible. The nanoimprinting process can be used to improve the printing accuracy, and its tolerance It can be upgraded from the micron level of screen printing to the nano level.

Specifically, the thickness of the conductive adhesive layer ranges from 6 μm to 15 μm, and the composite in the substrate layer has high reliability and low resistance. When the thickness of the conductive adhesive layer exceeds 15 μm, it is easy to crack and fall off after curing. When the thickness is less than 6 μm, the resistance of the conductive adhesive layer will be relatively high, which will affect the conductivity.

Specifically, the conductive adhesive layer has a cured resistance of 10-30mΩ/mm ² /mil. If the square resistance is too small, it is difficult to make it. If the square resistance is too large, the thickness or width needs to be increased to compensate. The square resistance has been determined and the thickness has been determined. Next, the impedance of the finished product can be reduced by increasing the width, but the width will not be increased indefinitely in actual use, so the square resistance of the conductive adhesive layer is less than 30mΩ/mm ² /mil, which can ensure that the second conductive area 12 has a small impedance .

The hardness of the conductive adhesive layer after curing is less than or equal to 3H, the conductive diaphragm formed by the conductive adhesive layer and the substrate layer has good compliance, good resilience and toughness, and the sound device has good transient response and low THD distortion.

Optionally, referring to FIG. 2, the conductive diaphragm of the present invention may further include a reinforcing portion 8, and the reinforcing portion 8 is combined with the central portion 3 of the conductive diaphragm. When the rigid reinforcing part 8 is provided on the conductive diaphragm of the present invention, the reinforcing part 8 and the conductive diaphragm can be joined together in a manner known to those skilled in the art, such as bonding. The high-frequency characteristics of the conductive diaphragm can be effectively improved by adding the rigid reinforcing part 8 on the conductive diaphragm. However, it should be noted that for the conductive diaphragm of the present invention, those skilled in the art can choose to provide or not provide the reinforcing part 8 on it according to actual needs, and there is no limitation on this.

The invention also discloses a sounding device, which includes a vibration system and a magnetic circuit system matched with the vibration system. The sounding device also includes a housing with a containing cavity, and both the vibration system and the magnetic circuit system are contained in the containing cavity .

The vibration system includes a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm, and the sounding diaphragm adopts the above-mentioned conductive diaphragm. During the working process of the sounding device, the voice coil with the electric signal interacts with the magnetic circuit system to generate up and down vibrations, which can drive the sounding diaphragm to produce sound. The sound device can be a circular structure or a rectangular structure.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims

A conductive diaphragm for a sounding device, comprising a conductive layer and a base material layer located on the upper and lower sides of the conductive layer, characterized in that:

The conductive diaphragm includes a connecting portion (1), a folded ring portion (2), and a central portion (3). The connecting portion (1) is arranged on the periphery of the conductive diaphragm, and the folded ring portion (2) It is arranged inside the connecting portion (1) and presents a bent shape, and the central portion (3) is arranged inside the folding ring portion (2) and located at the center of the conductive diaphragm;

The conductive layer includes a first conductive area (11) provided on the connecting portion (1) and/or the central portion (3), and a second conductive area provided on the folding ring portion (2) (12) The second conductive area (12) is electrically connected to the first conductive area (11);

The Young's modulus of the second conductive region (12) is smaller than the Young's modulus of the first conductive region (11), and the second conductive region (12) has a symmetrical band-shaped structure.
The conductive diaphragm for a sounding device according to claim 1, wherein the axis of symmetry of the symmetrical ribbon structure includes a first axis of symmetry, and the first axis of symmetry and the folding ring portion ( The extension direction of 2) is vertical and passes through the center of the folded ring portion (2).
The conductive diaphragm for a sounding device according to claim 1, wherein the symmetry axis of the symmetrical ribbon structure further comprises a second symmetry axis, and the second symmetry axis is connected to the folding ring part. The extension direction of (2) is parallel and passes through the center of the folded ring portion (2).
The conductive diaphragm for a sounding device according to claim 1, wherein at least one second conductive area (12) is provided on the one folded ring portion (2).
The conductive diaphragm for a sounding device according to claim 1, wherein the symmetrical belt-shaped structure is at least one of X-shaped, H-shaped and I-shaped.
The conductive diaphragm for a sounding device according to claim 1, wherein the material of the substrate layer is at least one of thermoplastic, thermoplastic elastomer and rubber.
The conductive diaphragm for a sounding device according to claim 1, wherein the material of the first conductive region (11) is metal foil, and the material of the second conductive region (12) For the conductive adhesive layer.
The conductive diaphragm for a sounding device according to claim 7, wherein the first conductive area (11) is a copper foil.
The conductive diaphragm for a sounding device according to claim 8, wherein the copper foil comprises at least one of rolled copper foil, electroplated copper foil, and sprayed copper foil, and the copper foil is The thickness range is 2-150μm.
The conductive diaphragm for a sounding device according to claim 1, wherein the substrate layer comprises a first substrate layer (4) and a second substrate directly attached to the conductive layer Layer (5), the first conductive region (11) is connected to the first substrate layer (4);

After forming a conductive circuit on the first conductive region (11) by etching, the second conductive region (12) is connected to the first substrate layer (4) and the first conductive region (11);

The second substrate layer (5) is connected with the first substrate layer (4), the first conductive region (11) and the second conductive region (12).
The conductive diaphragm for a sounding device according to claim 10, wherein a first solder joint (6) and a second solder joint (7) are provided on the first conductive area (11);

The first substrate layer (4) and/or the second substrate layer (5) are provided with openings corresponding to the first solder joint (6) and the second solder joint (7).
A sound generating device, characterized by comprising a vibration system and a magnetic circuit system matched with the vibration system;

The vibration system includes a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm, and the sounding diaphragm adopts the conductive diaphragm of any one of claims 1-11.