CN110708644A - A conducting film and sound generating mechanism for sound generating mechanism - Google Patents

A conducting film and sound generating mechanism for sound generating mechanism Download PDF

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Publication number
CN110708644A
CN110708644A CN201910931368.2A CN201910931368A CN110708644A CN 110708644 A CN110708644 A CN 110708644A CN 201910931368 A CN201910931368 A CN 201910931368A CN 110708644 A CN110708644 A CN 110708644A
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China
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layer
conductive
conducting
conducting layer
conductive layer
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Chinese (zh)
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郭晓冬
张成飞
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Goertek Techology Co Ltd
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Goertek Techology Co Ltd
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Priority to CN201910931368.2A priority Critical patent/CN110708644A/en
Publication of CN110708644A publication Critical patent/CN110708644A/en
Priority to PCT/CN2020/118532 priority patent/WO2021058011A1/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00Loudspeakers
    • H04R2400/11Aspects regarding the frame of loudspeaker transducers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

The invention discloses a conducting film for a sound generating device and the sound generating device, wherein the conducting film comprises a conducting layer and substrate layers positioned on two sides of the conducting layer, and the conducting film comprises an inner side part, a deformation part and an outer side part; the conducting layer comprises a first conducting layer arranged on the inner side part, a second conducting layer arranged on the deformation part and a third conducting layer arranged on the outer side part, and two ends of the second conducting layer are respectively and electrically connected with the first conducting layer and the third conducting layer; the first conducting layer and the third conducting layer are both metal foils, the second conducting layer is a conducting adhesive layer formed in a coating or printing mode, and the Young modulus of the second conducting layer is smaller than that of the metal foils. One technical effect of the invention is that: the conductive film has conductivity, not only can be used as a sound-producing vibrating diaphragm, but also can be used as a supporting vibrating diaphragm.

Description

A conducting film and sound generating mechanism for sound generating mechanism
Technical Field
The invention relates to the technical field of electroacoustic conversion, in particular to a conductive film for a sound generating device and the sound generating device.
Background
The sound generating device generally includes a diaphragm and a voice coil coupled to one side of the diaphragm, and further includes an electrical connector electrically connecting an internal circuit and an external circuit of the sound generating device. The voice coil comprises two voice coil leads, the two voice coil leads are respectively electrically connected with two bonding pads of the electric connecting piece in a spot welding mode and the like, and the electric connecting piece is simultaneously electrically connected with an external circuit to control an electric signal in the voice coil through the electric signal of a terminal product.
Generally, the lead of the voice coil needs to be threaded out to a certain length, and the lead is suspended to be electrically connected with the electrical connector. Although the suspension lead structure can realize higher sensitivity, the amplitude cannot be too large due to the suspension limitation of the lead, the wire breakage risk is higher, the low-frequency effect is not obvious enough, and better user auditory experience cannot be provided.
In recent years, many researchers have developed diaphragms having a conductive function, which makes conductive films widely used in sound emitting devices. For the conductive film, the main current application methods include electrophoresis of conductors, electroplating of conductors, injection molding of conductors, addition of conductive coatings, addition of conductive ink layers, laser etching and the like in the diaphragm. However, the above methods all have the defects of large technical implementation difficulty, low mass productivity, high cost, and low reliability and acoustic performance to different degrees.
Disclosure of Invention
An object of the present invention is to provide a conductive film for a sound generating device and a new technical solution of the sound generating device.
According to a first aspect of the present invention, there is provided a conductive film for a sound generating device, including a conductive layer and a substrate layer located on both sides of the conductive layer, the conductive film including an inner portion located inside, a bent deformation portion located outside the inner portion, and an outer portion located outside the deformation portion;
the conducting layer comprises a first conducting layer arranged on the inner side part, a second conducting layer arranged on the deformation part and a third conducting layer arranged on the outer side part, two ends of the second conducting layer are respectively and electrically connected with the first conducting layer and the third conducting layer, and the first conducting layer, the second conducting layer and the third conducting layer are connected to form at least one conducting circuit;
the first conducting layer and the third conducting layer are both metal foils, the second conducting layer is a conducting adhesive layer formed in a coating or printing mode, and the Young modulus of the second conducting layer is smaller than that of the metal foils.
Preferably, both ends of the second conductive layer extend to the first conductive layer and the third conductive layer, respectively.
Preferably, the conductive adhesive layer includes conductive particles, a binder and a solvent, and the conductive particles are at least one of gold, silver, copper, aluminum, zinc, nickel powder or alloy powder.
Preferably, the adhesive is one of epoxy type, acrylic type, polyurethane type and silica gel type adhesives.
Preferably, the solvent is one of butyl acetic anhydride acetate, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate and isophorone.
Preferably, the thickness of the conductive adhesive layer is 6-15 μm, and the sheet resistance of the conductive adhesive layer is 10-30m omega/mm2/mil。
Preferably, the hardness of the conductive adhesive layer is less than or equal to 3H.
Preferably, the first conductive layer and the third conductive layer are both copper foils.
Preferably, the substrate layer comprises a first substrate layer and a second substrate layer which are directly attached to the conductive layer, and the first conductive layer and the third conductive layer are connected with the first substrate layer in a hot pressing or bonding mode;
after the first conducting layer and the third conducting layer are etched to form conducting circuits, the second conducting layer is connected with the first base material layer, the first conducting layer and the third conducting layer in a coating or printing mode;
the second base material layer, the first conducting layer, the second conducting layer and the third conducting layer are connected together in a hot pressing or bonding mode.
Preferably, the substrate layer comprises a first substrate layer and a second substrate layer directly attached to the conductive layer, and the first substrate layer is a thermoplastic elastomer layer;
the first conducting layer and the third conducting layer are connected with the first base material layer in a hot pressing mode;
after the first conductive layer and the third conductive layer are etched to form conductive circuits, the second conductive layer is connected with the first substrate layer, the first conductive layer and the third conductive layer in a coating or printing mode.
Preferably, the second substrate layer is a thermoplastic elastomer layer, and the second substrate layer, the first conductive layer, the second conductive layer, and the third conductive layer are connected together by hot pressing.
Preferably, the thermoplastic elastomer is a TPU material or a TPEE material.
Preferably, the base material layer further comprises a third base material layer, and the third base material layer is attached to the surface, far away from the conductive layer, of the first base material layer and/or the second base material layer.
Preferably, the third base material layer is made of plastic, thermoplastic elastomer or rubber.
Preferably, the third base material layer is made of any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE and TPU.
Preferably, a glue layer is arranged between the third base material layer and the first base material layer and/or the third base material layer.
Preferably, an inner pad is disposed on the first conductive layer, an outer pad is disposed on the third conductive layer, and the inner pad is configured to: for connection with a voice coil, the outer pad configured to: for connection to an external circuit;
the inner bonding pad and the outer bonding pad are exposed out of the base material layer.
Preferably, the first conductive layer, the second conductive layer and the third conductive layer each include at least two portions independent of each other, and the first conductive layer, the second conductive layer and the third conductive layer form at least two independent conductive traces.
According to a second aspect of the present invention, there is provided a sound generating apparatus comprising a vibration system and a magnetic circuit system cooperating with the vibration system;
vibration system includes the sound production vibrating diaphragm and combines the voice coil loudspeaker voice coil of sound production vibrating diaphragm one side, the sound production vibrating diaphragm adopts as above the conducting film.
According to a third aspect of the present invention, there is provided a sound generating apparatus comprising a vibration system and a magnetic circuit system cooperating with the vibration system;
vibration system includes the sound production vibrating diaphragm, combines the voice coil loudspeaker voice coil of sound production vibrating diaphragm one side and be used for elastic support the support vibrating diaphragm of voice coil loudspeaker voice coil, support vibrating diaphragm adopts as above the conducting film.
According to the conductive film provided by the embodiment of the invention, the conductive layers are compounded in the substrate layer, the first conductive layer and the third conductive layer which are positioned on the inner side part and the outer side part adopt metal foils, the second conductive layer which is positioned on the deformation part adopts a material with a Young modulus smaller than that of the metal foils, the conductive film is connected with the voice coil, the lead of the voice coil can extend out for a short length to be connected with the first conductive layer, then the connection with an external circuit is realized through the electrically connected third conductive layer, and the lead of the voice coil does not need to be provided with a suspension structure, so that the wire breakage risk can be avoided, the vibration system of the sound generating device can have large amplitude and high sensitivity, and.
In addition, the conductive film provided by the invention overcomes the problems of high implementation difficulty and low reliability of the conductive film in the prior art, and can realize mass production. Specifically, the first conducting layer and the third conducting layer are made of metal foils with high Young modulus, the structural strength of the inner side portion and the structural strength of the outer side portion can be improved, the inner side portion and the outer side portion are not prone to deformation, the first conducting layer serves as a carrier welded with a voice coil lead, the third conducting layer serves as a carrier welded with an external circuit, and the metal foils can resist high temperature during welding and cannot scald a base material layer of the conducting film; the second conducting layer is made of materials with small Young modulus, such as conducting resin, so that the second conducting layer can adapt to repeated bending deformation and cannot be broken, and the conducting layer is prevented from being broken due to frequent deformation of a deformation part in the reciprocating vibration process of the conducting film.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a sound generating device according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a conductive film according to an embodiment of the invention.
Fig. 3 is a schematic plan view showing the first conductive layer and the third conductive layer in the conductive film according to an embodiment of the present invention.
FIG. 4 is a schematic diagram of a second conductive layer in the conductive film according to an embodiment of the invention.
FIG. 5 is a schematic diagram of an expanded plane of a conductive layer in a conductive film according to an embodiment of the invention.
Fig. 6 is a sectional view of a portion a of fig. 5.
Fig. 7 is a sectional view of a portion B in fig. 5.
Fig. 8 is a schematic structural diagram of a sound generating device in another embodiment of the present invention.
Fig. 9 is an exploded view of the sound generator of the embodiment of fig. 8.
Fig. 10 is a schematic structural diagram of the conductive film in the embodiment of fig. 8.
In the figure: 10. a housing; 20. a vibration system; 201. a sounding vibrating diaphragm; 202. a voice coil; 203. supporting the diaphragm; 30. a magnetic circuit system; 1. an inner side portion; 11. a first conductive layer; 111. a first partition; 2. a deformation section; 21. a second conductive layer; 211. an electrical connection arm; 3. an outer side portion; 31. a third conductive layer; 311. a second partition part; 4. a first base material layer; 5. a second substrate layer; 6. a third substrate layer; 7. an inner pad; 8. an outer pad; 9. a reinforcement section.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1 to 7, the sound generating apparatus applied to an electronic device capable of generating sound, such as an earphone and a mobile phone, generally includes a housing 10, a vibration system 20 installed on the housing 10, and a magnetic circuit system 30, wherein the vibration system 20 includes a sound-generating vibration diaphragm 201 and a voice coil 202 combined with the sound-generating vibration diaphragm 201, the magnetic circuit system 30 includes a magnetic yoke, and a central magnetic circuit portion and a side magnetic circuit portion which are arranged on a bottom wall of the magnetic yoke, a magnetic gap is formed between the central magnetic circuit portion and the side magnetic circuit portion, the voice coil 202 extends into the magnetic gap, and after a current is introduced into the voice coil 202, the voice coil 202 is forced to vibrate under the action of the magnetic field of the magnetic circuit system 30, so as to drive the sound-generating vibration diaphragm 201.
In some cases, in order to avoid polarization generated by the vibration system 20, an elastic supporting structure, such as a supporting diaphragm 203, may be further disposed in the vibration system 20, the supporting diaphragm 203 may be coupled between any one end or outer side of the voice coil 202 and the housing 10, and the vibration system 20 may have a larger amplitude under the action of the supporting diaphragm 203, so as to improve the low-frequency performance of the product.
The embodiment of the invention provides a conductive film for the sound-generating device, and the conductive film can be used for a sound-generating diaphragm 201 and can also be used for a supporting diaphragm 203.
As shown in fig. 2 to 7, the conductive film includes a conductive layer and substrate layers located at two sides of the conductive layer, and the substrate layers at two sides wrap the conductive layer to prevent the conductive layer from contacting with other components to cause a short circuit.
Further, the conductive film comprises an inner side portion 1 located at the inner side, a bending deformation portion 2 located at the outer side of the inner side portion 1, and an outer side portion 3 located at the outer side of the deformation portion 2. The voice coil 202 is connected to the inner portion 1, and the outer portion 3 is generally connected to a fixed member such as the case 10.
The conducting layer comprises a first conducting layer 11 arranged on the inner side portion 1, a second conducting layer 21 arranged on the deformation portion 2 and a third conducting layer 31 arranged on the outer side portion 3, two ends of the second conducting layer 21 are respectively electrically connected with the first conducting layer 11 and the third conducting layer 31, and the first conducting layer 11, the second conducting layer 21 and the third conducting layer 31 are connected to form at least one conducting circuit.
In particular, the conductive layers in the embodiment of the present invention are made of different materials, the first conductive layer 11 and the third conductive layer 31 are made of metal foils, and the young's modulus of the second conductive layer 21 is smaller than that of the metal foils.
Wherein an inner pad 7 is disposed on the first conductive layer 11, an outer pad 8 is disposed on the third conductive layer 31, and the inner pad 7 is configured to: for connection with the voice coil 202, the outer pad 8 is configured to: for connection to an external circuit; the inner bonding pad 7 and the outer bonding pad 8 are exposed out of the substrate layer, so that electrical connection is achieved.
Above-mentioned setting, on the one hand, the conducting film links together with voice coil 202, and voice coil 202 lead wire can stretch out shorter length and be connected with first conducting layer 11, then realizes being connected with external circuit through the third conducting layer 31 of electricity connection, and voice coil 202 lead wire need not set up unsettled structure, consequently can avoid the broken string risk, and sound generating mechanism's vibration system 20 can possess big amplitude and high sensitivity, has promoted the low frequency performance.
In addition, the conductive film provided by the invention overcomes the problems of high implementation difficulty and low reliability of the conductive film in the prior art, and can realize mass production. Specifically, the first conductive layer 11 and the third conductive layer 31 are made of metal foils with high young's modulus, so that the structural strength of the inner side portion 1 and the outer side portion 3 can be improved, the two portions are not prone to deformation, the first conductive layer 11 serves as a carrier for welding with a lead of the voice coil 202, the third conductive layer 31 serves as a carrier for welding with an external circuit, and the metal foils can resist high temperature during welding and cannot scald a base material layer of the conductive film; the second conductive layer 21 is made of a material with a small young's modulus, such as conductive adhesive, so that the second conductive layer 21 can adapt to repeated bending deformation without fracture, and fracture of the conductive layer caused by frequent deformation of the deformation part 2 in the reciprocating vibration process of the conductive film is avoided.
Although an embodiment in which the conductive film is electrically connected to the voice coil 202 is provided, it should be understood by those skilled in the art that the conductive film in the present invention can be used in other scenarios, and it is within the scope of the present disclosure as long as the conductive film further has the above-defined conductive layer structure based on the structural function of the conductive film itself.
The first conductive layer 11 and the third conductive layer 31 of the present invention each use a metal foil. The thickness of the metal foil can be controlled to be 5-36 μm. For example, the first conductive layer 11 and the third conductive layer 31 are both copper foils. The copper foil is a thin sheet structure, has low surface oxidation characteristics, and can be easily attached to the surfaces of various base materials made of different materials. In addition, the copper material has better conductivity, so that the formed conductive film has good conductivity. The first conductive layer 11 and the third conductive layer 31 may be patterned into a predetermined circuit pattern by etching, etc., which are well known to those skilled in the art.
In one example of the present invention, a rolled copper foil, for example, an RA copper foil or an HA copper foil is used as the first conductive layer 11 and the third conductive layer 31. The rolled copper foil has excellent tensile strength and high elongation, and has good ductility when combined with a base layer of a conductive film. The first conductive layer 11 and the third conductive layer 31 are not limited to be made of the same material, and may be made of metal foils made of different materials according to specific needs.
Furthermore, two ends of the second conductive layer 21 extend to the first conductive layer 11 and the third conductive layer 31 respectively, and two ends of the second conductive layer 21 can partially or completely cover the first conductive layer 11 and the third conductive layer 31, so that the connection reliability between two conductive layers is ensured, a good conductive connection effect is realized, and the separation of the connection part between two conductive layers cannot occur in the vibration process of the conductive layers.
Specifically, the second conductive layer 21 is a conductive layer formed by coating or printing. The second conductive layer 21 is formed by a conductive adhesive layer or a conductive ink layer, and the young's modulus of the second conductive layer 21 formed by the conductive adhesive layer or the conductive ink layer is small, so that the second conductive layer 21 has good flexibility and fatigue resistance, and the stronger the resistance to damage is, and the second conductive layer 21 does not generate a fracture risk when the vibration system 20 vibrates in a large-amplitude state.
As a specific example, the second conductive layer 21 is a coated or printed conductive adhesive layer, the conductive adhesive mainly comprises conductive particles, a binder, a solvent, an auxiliary agent, and the like, and the high-temperature conductive adhesive may be doped with glass powder. The adhesive is epoxy type, acrylic type, polyurethane type or silica gel type adhesive, and forms a molecular skeleton structure of a conductive adhesive layer after being cured, so that the mechanical property and the bonding property are guaranteed, and conductive particles form channels. The solvent is one of butyl acetic anhydride, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate and isophorone. Because the addition amount of the conductive particles is very high, the viscosity of the adhesive of the conductive adhesive is greatly increased, and the technological performance of the adhesive is often influenced. In order to reduce the viscosity and achieve good manufacturability and rheology, it is also necessary to add a solvent or reactive diluent to the conductive paste.
The conductive particles may be at least one of gold, silver, copper, aluminum, zinc, nickel powder or alloy powder. In this embodiment, the conductive adhesive layer is conductive silver adhesive, and the conductive particles in the conductive adhesive layer are silver particles, so that the silver is relatively cheap, low in resistance, good in conductivity and not easy to oxidize.
In a specific embodiment, the particle size of the silver particles is less than or equal to 1 μm, and under the condition that the filling proportion of the silver particles is certain and the thickness of the conductive adhesive layer is the same, the number of the silver particles is more, the gaps among the silver particles are smaller, and the conductivity is improved. Furthermore, the particle size of the silver particles is less than or equal to 100nm, the conductivity of the second conductive layer 21 can be further improved by the nano-silver particles, the printing mode of the conductive silver paste is various and flexible, the printing precision can be improved by using a nano-imprinting process, and the tolerance of the conductive silver paste can be improved to a nano level from a micron level of screen printing.
Specifically, the thickness of the conductive adhesive layer is 6-15 μm, and the conductive adhesive layer is compounded in the base material layer and has high reliability and small resistance. The thickness of the conductive adhesive layer exceeds 15 microns, the conductive adhesive layer is easy to crack and fall off after being cured, and the thickness of the conductive adhesive layer is less than 6 microns, so that the resistance of the conductive adhesive layer is high, and the conductivity is affected.
Specifically, the sheet resistance of the cured conductive adhesive layer is 10-30m omega/mm2The square resistance is too small to realize manufacture, the square resistance is too large to be compensated by increasing the thickness or the width, the impedance of a finished product can be reduced by increasing the width under the condition that the square resistance is determined and the thickness is determined, but the width cannot be infinitely increased in practical use, so that the smaller the square resistance is, the better the square resistance is, and the square resistance of the conductive adhesive layer is less than 30m omega/mm2A/mil, which can ensure a small resistance of the second conductive layer 21.
The hardness of the cured conductive adhesive layer is less than or equal to 3H, the conductive film formed by compounding the conductive adhesive layer and the base material layer is good in smoothness and resilience and toughness, and the sound generating device has good transient response and low THD distortion. The hardness of the conductive adhesive layer after curing is greater than 3H, and the conductive adhesive layer affects the compliance of the vibration system 20, so that the THD distortion of the product is increased.
In a specific embodiment, the first conductive layer 11, the second conductive layer 21, and the third conductive layer 31 each include at least two portions independent from each other, and the first conductive layer 11, the second conductive layer 21, and the third conductive layer 31 form at least two independent conductive traces.
In this embodiment, the first conductive layer 11 includes two independent portions, and the third conductive layer 31 also includes two independent portions. The second conductive layer 21 includes two portions between two sets of the first conductive layer 11 and the third conductive layer 31, and each portion of the second conductive layer 21 may include two or more electrical connection arms 211. An inner pad 7 electrically connected to the first conductive layer 11 is provided on the first conductive layer 11, and an outer pad 8 electrically connected to the third conductive layer 31 is provided on the third conductive layer 31.
The inner pad 7 on the conductive film is electrically connected to the voice coil 202, and the outer pad 8 on the conductive film is electrically connected to an external circuit. The outer bonding pad 8 may be directly electrically connected to an external circuit, or may be electrically connected to the external circuit through a spring plate disposed on a housing 10 of the sound generating device. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.
Further, the substrate layer comprises a first substrate layer 4 and a second substrate layer 5 directly attached to the conductive layer, and the first conductive layer 11 and the third conductive layer 31 are connected with the first substrate layer 4 in a hot pressing or bonding mode; after conductive lines are formed on the first conductive layer 11 and the third conductive layer 31 by etching, the second conductive layer 21 is connected with the first substrate layer 4, the first conductive layer 11 and the third conductive layer 31 by coating or printing; the second substrate layer 5, the first substrate layer 4, the first conductive layer 11, the second conductive layer 21, and the third conductive layer 31 are connected together by hot pressing or bonding.
The adhesive layer used in the above bonding method may be any one of a hot melt adhesive, an acrylic adhesive, and a silica gel.
The materials of the first substrate layer 4 and the second substrate layer 5 may be the same or different, and may be selected from plastics, thermoplastic elastomers, and silicone rubber in common materials of diaphragms, plastics such as PEEK, PAR, PEI, PI, PPS, PEN, PET, and the like, and thermoplastic elastomers such as TPEE, TPU, and the like.
The thicknesses of the first substrate layer 4 and the second substrate layer 5 can be flexibly adjusted by those skilled in the art according to the needs. In an example of the present invention, the thicknesses of the first substrate layer 4 and the second substrate layer 5 can be controlled to be 3 to 50 μm, respectively, and the first substrate layer 4 and the second substrate layer 5 can provide good protection for the conductive layer located in the middle. Through the reasonable adjustment to both sides substrate layer and conducting layer thickness, can also guarantee that the whole rigidity and the pliability that have of conducting film can make the conducting film more steady when the vibration.
As a specific embodiment, the substrate layer includes a first substrate layer 4 and a second substrate layer 5 directly attached to the conductive layer, and the first substrate layer 4 is a thermoplastic elastomer layer; the first conductive layer 11 and the third conductive layer 31 are connected with the first substrate layer 4 by means of hot pressing; after conductive lines are formed on the first conductive layer 11 and the third conductive layer 31 by etching, the second conductive layer 21 is connected to the first substrate layer 4, the first conductive layer 11, and the third conductive layer 31 by coating or printing.
Preferably, the material of the first substrate layer 4 is a thermoplastic polyurethane elastomer TPU material or a thermoplastic polyester elastomer TPEE material. The thermoplastic polyurethane elastomer TPU or the thermoplastic polyester elastomer TPEE belongs to thermoplastic elastomers TPE, and has high cohesive force at high temperature. Therefore, when the first substrate layer 4 is made of the thermoplastic polyurethane elastomer TPU or the thermoplastic polyester elastomer TPEE, the first substrate layer 4 can be well connected to the first conductive layer 11 and the third conductive layer 31 without using an adhesive in a hot pressing manner. Has the characteristics of simple combination mode, good firmness and difficult separation.
It should be noted that, when the metal foils of the first conductive layer 11 and the third conductive layer 31 and the first substrate layer 4 are connected together by hot pressing, the hot pressing temperature is high, usually about 110 ℃, at this time, the first substrate layer 4 is a thermoplastic elastomer TPE based on the adopted material, which can form a viscous state, and at this time, the adhesive force is strong, and the first substrate layer can be firmly connected with the two conductive layers. After the conductive lines are etched on the two conductive layers, a rolling process is performed on the two conductive layers and the first substrate layer 4. And the rolling process is usually performed at room temperature. At room temperature, the thermoplastic elastomer TPE has no cohesive force, so that impurities such as dust cannot be bonded on the first base material layer 4 and the two conducting layers, and the influence on the subsequent forming process is avoided.
Still further, the second substrate layer 5 is also a thermoplastic elastomer layer, and the second substrate layer 5, the first substrate layer 4, the first conductive layer 11, the second conductive layer 21, and the third conductive layer 31 are connected together by hot pressing.
The second substrate layer 5 also uses a thermoplastic elastomer, and is hot-pressed and compounded. The adhesive is not needed between the second substrate layer 5 and the first substrate layer 4, the first substrate layer 4 and the second substrate layer 5 do not have adhesive force at room temperature, before the second substrate layer 5 and the first substrate layer 4 are hot-pressed, under the condition that the counterpoint between the second substrate layer 5 and the first substrate layer 4 is inaccurate, the position can be corrected again, the adhesion can not be generated, the counterpoint accuracy of the two is ensured, the inner welding disc 7 and the outer welding disc 8 on the first conducting layer 11 and the second conducting layer 21 can be accurately exposed from the reserved hollow-out position of the substrate layers, and the reliability of electric connection is ensured.
In the conductive film provided in the embodiment of the present invention, the materials of the first substrate layer 4 and the second substrate layer 5 may be the same or different, and those skilled in the art can flexibly adjust the materials according to actual needs. For example, the first substrate layer 4 is made of thermoplastic polyurethane elastomer TPU, and the second substrate layer 5 is made of thermoplastic polyester elastomer TPEE. For another example, the first substrate layer 4 and the second substrate layer 5 are both formed of thermoplastic polyurethane elastomer TPU, and these two substrate layers are bonded to both surfaces of the conductive layer. For another example, a thermoplastic polyester elastomer TPEE is used for both substrate layers, and the two substrate layers are bonded to both surfaces of the conductive layer.
In addition, the base material layer may further include a third base material layer 6, and the third base material layer 6 is attached to a surface of the first base material layer 4 and/or the second base material layer 5 which is far from the conductive layer. The third substrate layer 6 may be only compounded on the first substrate layer 4, or the third substrate layer 6 may be only compounded on the second substrate layer 5, or the third substrate layer 6 may be compounded on both the first substrate layer 4 and the second substrate layer 5, and those skilled in the art may flexibly select the third substrate layer according to actual needs without limitation.
The third base material layer 6 is made of plastic, thermoplastic elastomer or rubber. Specifically, the third base material layer 6 is made of any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU.
Under the condition that first substrate layer 4 and second substrate layer 5 are thermoplastic elastomer, third substrate layer 6 can combine with first substrate layer 4 or second substrate layer 5 through hot pressing, because first substrate layer 4 and second substrate layer 5 adopt thermoplastic elastomer, have better adhesion strength under the high temperature, its can with the firm combination in surface of third substrate layer 6 is in the same place, and need not additionally to adopt special binder, and the combination mode is comparatively simple, and the combination fastness is comparatively good. As a preferred embodiment, the third substrate layer 6 may be bonded to the first substrate layer 4 by hot pressing, and then a conductive layer may be formed on the first substrate layer 4. The third substrate layer 6 may be thermally pressed to the second substrate layer 5, and then thermally pressed to the first substrate layer 4 and the conductive layer. However, the present invention is not limited to the above-described formation step.
As a different embodiment, a glue layer is disposed between the third substrate layer 6 and the first substrate layer 4 and/or the third substrate layer 6. Specifically, the third substrate layer 6 may be connected to the first substrate layer 4 through an adhesive layer, and then a conductive layer is formed on the first substrate layer 4. The third substrate layer 6 can be connected with the second substrate layer 5 through an adhesive layer, and then connected with the first substrate layer 4 and the conductive layer in a hot-pressing manner. However, the present invention is not limited to the above-described formation step.
Referring to fig. 1 to 7, an embodiment of the present invention provides a sound generating device. As previously described, the sound generating device includes a vibration system 20 and a magnetic circuit system 30 cooperating with the vibration system 20. The sound generating device further comprises a housing 10 having a receiving cavity in which the vibration system 20 and the magnetic circuit system 30 are received. Wherein the vibration system 20 includes a sounding diaphragm 201 and a voice coil 202 coupled to one side of the sounding diaphragm 201. The sounding diaphragm 201 employs the conductive film in the above embodiment. In the working process of the sound generating device, the voice coil 202 which is communicated with the electric signal interacts with the magnetic circuit system 30 to generate vertical vibration, so that the sound generating diaphragm 201 can be driven to generate sound.
The sound generating device may be a circular structure or a rectangular structure, the illustration of the embodiment provides a sound generating device with a circular structure, and the corresponding sound generating diaphragm 201 is circular.
As a specific example, the first conductive layer 11 and the second conductive layer 21 are made of copper foil, the first conductive layer 11 is in a ring structure, the first conductive layer 11 is located on the edge of the inner portion 1 of the conductive film near the deformation portion 2, and the first conductive layer 11 can be used to form an electrical connection with the voice coil 202. Specifically, the voice coil 202 generally has two leads of the voice coil 202, and for the first conductive layer 11, two independent conductive traces are formed to be electrically connected to the two leads of the voice coil 202. In this embodiment, two opposite positions of the annular first conductive layer 11 are respectively provided with a first separating portion 111, and the position of the first separating portion 111 is not provided with a conductive layer, so that the first conductive layer 11 is divided into two independent parts. Further, an inner pad 7 electrically connected to the first conductive layer 11 is provided on the inner side of the first conductive layer 11. Wherein, the number of the inner bonding pads 7 is at least two, and the inner bonding pads can be used for electrically connecting with two leads of the voice coil 202.
An inner pad 7 is provided corresponding to each conductive line, and a lead of the voice coil 202 may be electrically connected to any one of the two inner pads 7 of the corresponding conductive line. Of course, the number of the inner pads 7 may also be more, for example, four, six, etc., and those skilled in the art may flexibly adjust the number according to actual needs, which is not limited herein.
Further, the third conductive layer 31 has a ring structure. The third conductive layer 31 is located at the edge of the conductive film, i.e. at the outer part 3, for connection to an external circuit. Similarly, in the present embodiment, in order to form two independent conductive traces, the second separating portion 311 is opened at two opposite positions of the annular second conductive layer 21, and the conductive layer is not provided at the position of the second separating portion 311, so that the third conductive layer 31 can be formed by two independent portions.
Outer pads 8 are provided on the third conductive layers 31, respectively. The outer bonding pad 8 is used for electrically connecting with an electrical connector on a shell 10 of the sound generating device through welding and the like. Wherein, all be provided with on first substrate layer 4 and the second substrate layer 5 corresponding to the upper portion and the lower part of outer bonding pad 8 and be used for dodging the regional of dodging of outer bonding pad 8, can make outer bonding pad 8 suitably expose from the substrate layer like this to realize the electric connection with external circuit.
Further, a metal protective layer may be provided on the surfaces of the inner pad 7 and the outer pad 8. The metal protection layer may be formed by, for example, electroplating, or may be bonded thereto, which is not limited thereto.
The second conductive layer 21 in this embodiment is a bent strip-shaped structure formed by a conductive offset printing, the second conductive layer 21 in this embodiment includes two portions, each portion includes two strip-shaped electrical connection arms 211, and the four electrical connection arms 211 are arranged in a central symmetry manner, so that the symmetry of vibration of the sounding vibrating diaphragm 201 can be ensured, and polarization is not easily generated.
In addition, when the conductive film of the present invention is used as the sounding diaphragm 201, the conductive film may further include a rigid reinforcing portion 9, and the reinforcing portion 9 is bonded to the inner portion 1 of the conductive film. When the rigid reinforcement portion 9 is provided on the conductive film of the present invention, the reinforcement portion 9 and the conductive film may be bonded together by a method (e.g., adhesion) known to those skilled in the art. The high-frequency characteristics of the conductive film can be effectively improved by adding the rigid reinforcement portion 9 to the conductive film. However, the conductive film of the present invention is not limited to this, and those skilled in the art may select whether to provide the reinforcement portion 9 thereon or not according to actual needs.
As shown in fig. 8 to 10, the embodiment of the present invention further provides a sound generating apparatus, which includes a vibration system 20 and a magnetic circuit system 30 cooperating with the vibration system 20. The vibration system 20 includes a sounding diaphragm 201, a voice coil 202 coupled to one side of the sounding diaphragm 201, and a support diaphragm 203 for elastically supporting the voice coil 202. The supporting diaphragm 203 is made of the conductive film in the above embodiment of the present invention.
The sound generating device may have a circular structure or a rectangular structure, and the sound generating device of the present embodiment is illustrated in the drawings and provided with a rectangular structure, and the corresponding sound generating diaphragm 201 and the voice coil 202 are both rectangular.
As a specific example, the voice coil 202 includes two long sides disposed opposite to each other and two short sides disposed opposite to each other, and a support diaphragm 203 is disposed on each short side of the voice coil 202. For example, at least one of the support diaphragms 203 is a conductive film of the present invention. When the conductive film of the present invention is used as the support diaphragm 203, the conductive film has the advantage of stable vibration, and can be used to prevent the polarization of the internal vibration system 20, improve the loudness of the sound generating device, and reduce the nonlinear distortion.
When the conductive film of the present invention is used as the supporting diaphragm 203, the supporting diaphragm 203 has an outer portion 3, an inner portion 1, and a deformation portion 2. Wherein the outer part 3 is configured to: for connection with the housing 10, the inner side 1 is configured to: for connection to the voice coil 202. The conductive layers comprise a first conductive layer 11 distributed over the inner part 1, a second conductive layer 21 distributed over the deformation 2, and a third conductive layer 31 distributed over the outer part 3. The second conductive layer 21 is connected to the first conductive layer 11 and the third conductive layer 31, the first conductive layer 11, the second conductive layer 21 and the third conductive layer 31 are connected to form two independent conductive traces, the first conductive layer 11 is provided with two inner pads 7 electrically connected to the two conductive traces, and the third conductive layer 31 is provided with two outer pads 8 electrically connected to the two conductive traces. The inner bonding pad 7 can be used for being electrically connected with the voice coil 202, the outer bonding pad 8 can be used for being electrically connected with an external circuit, the lead of the voice coil 202 does not need to be arranged in a long thread, the electric connection between the voice coil 202 and the conductive film can be achieved, the phenomenon that the lead of the voice coil 202 is broken in work can be effectively avoided, and the stability of a product is improved.
On the other hand, the embodiment of the invention also provides electronic equipment which comprises the sound generating device. The electronic device can be, but is not limited to, a mobile phone, a tablet computer, an intelligent wearable device, an intelligent watch, an interphone, a television, an intelligent sound box and the like. The electronic device may include a housing and the sound generating device of the embodiment of the present disclosure, which is housed and fixed in the housing.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (20)

1. A conducting film for a sound generating device comprises a conducting layer and substrate layers positioned on two sides of the conducting layer, and is characterized in that,
the conductive film comprises an inner side part positioned on the inner side, a bending deformation part arranged on the outer side of the inner side part, and an outer side part arranged on the outer side of the deformation part;
the conducting layer comprises a first conducting layer arranged on the inner side part, a second conducting layer arranged on the deformation part and a third conducting layer arranged on the outer side part, two ends of the second conducting layer are respectively and electrically connected with the first conducting layer and the third conducting layer, and the first conducting layer, the second conducting layer and the third conducting layer are connected to form at least one conducting circuit;
the first conducting layer and the third conducting layer are both metal foils, the second conducting layer is a conducting adhesive layer formed in a coating or printing mode, and the Young modulus of the second conducting layer is smaller than that of the metal foils.
2. The conductive film for a sound emitting device according to claim 1, wherein both ends of the second conductive layer extend onto the first conductive layer and the third conductive layer, respectively.
3. The conductive film for a sound generating device according to claim 1, wherein the conductive adhesive layer comprises conductive particles, a binder and a solvent, and the conductive particles are at least one of gold, silver, copper, aluminum, zinc, nickel powder or alloy powder.
4. The conductive film for a sound emitting device according to claim 3, wherein the adhesive is one of an epoxy type, an acrylic type, a polyurethane type, and a silicone type adhesive.
5. The conductive film for a sound generating device according to claim 3, wherein the solvent is one of butyl acetic anhydride acetate, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate and isophorone.
6. The conductive film for a sound generating device according to claim 3, wherein the thickness of the conductive adhesive layer is 6 μm to 15 μm, and the sheet resistance of the conductive adhesive layer is 10 to 30m Ω/mm2/mil。
7. The conductive film for a sound emitting device according to claim 1, wherein a hardness of the conductive adhesive layer is 3H or less.
8. The conductive film for a sound emitting device according to claim 1, wherein the first conductive layer and the third conductive layer are both copper foils.
9. The conductive film for a sound generating device according to claim 1, wherein the substrate layer includes a first substrate layer and a second substrate layer directly bonded to the conductive layer, and the first conductive layer and the third conductive layer are connected to the first substrate layer by means of hot pressing or bonding;
after the first conducting layer and the third conducting layer are etched to form conducting circuits, the second conducting layer is connected with the first base material layer, the first conducting layer and the third conducting layer in a coating or printing mode;
the second base material layer, the first conducting layer, the second conducting layer and the third conducting layer are connected together in a hot pressing or bonding mode.
10. The conductive film for a sound generating device according to claim 1, wherein the substrate layer includes a first substrate layer and a second substrate layer directly bonded to the conductive layer, and the first substrate layer is a thermoplastic elastomer layer;
the first conducting layer and the third conducting layer are connected with the first base material layer in a hot pressing mode;
after the first conductive layer and the third conductive layer are etched to form conductive circuits, the second conductive layer is connected with the first substrate layer, the first conductive layer and the third conductive layer in a coating or printing mode.
11. The conductive film for a sound generating device according to claim 10, wherein the second substrate layer is a thermoplastic elastomer layer, and the second substrate layer and the first, second, and third conductive layers are connected together by means of hot pressing.
12. The conductive film for a sound emitting device according to claim 11, wherein the thermoplastic elastomer is a TPU material or a TPEE material.
13. The conductive film for a sound generating device according to any one of claims 9 to 12, wherein the base material layer further includes a third base material layer, and the third base material layer is attached to a surface of the first base material layer and/or the second base material layer which is remote from the conductive layer.
14. The conductive film for a sound generating device according to claim 13, wherein the third substrate layer is made of plastic, thermoplastic elastomer or rubber.
15. The conductive film for a sound generating device according to claim 14, wherein the third substrate layer is made of any one of PEEK, PAR, PEI, PI, PPS, PEN, PET, TPEE, and TPU.
16. The conductive film for a sound generating device according to claim 13, wherein a glue layer is provided between the third substrate layer and the first substrate layer and/or the third substrate layer.
17. The conductive film for a sound generating device according to claim 1, wherein an inner pad is provided on the first conductive layer, and an outer pad is provided on the third conductive layer, the inner pad being configured to: for connection with a voice coil, the outer pad configured to: for connection to an external circuit;
the inner bonding pad and the outer bonding pad are exposed out of the base material layer.
18. The conductive film for a sound generating device according to claim 1, wherein each of said first conductive layer, said second conductive layer and said third conductive layer comprises at least two portions independent of each other, said first conductive layer, said second conductive layer and said third conductive layer forming at least two independent conductive traces.
19. A sound production device is characterized by comprising a vibration system and a magnetic circuit system matched with the vibration system;
the vibration system comprises a sounding diaphragm and a voice coil combined on one side of the sounding diaphragm, wherein the sounding diaphragm adopts the conductive film as claimed in any one of claims 1 to 18.
20. A sound production device is characterized by comprising a vibration system and a magnetic circuit system matched with the vibration system;
the vibration system comprises a sounding diaphragm, a voice coil combined on one side of the sounding diaphragm, and a supporting diaphragm used for elastically supporting the voice coil, wherein the supporting diaphragm adopts the conductive film as claimed in any one of claims 1 to 18.
CN201910931368.2A 2019-09-29 2019-09-29 A conducting film and sound generating mechanism for sound generating mechanism Pending CN110708644A (en)

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