WO2019097584A1 - Machine de travail et procédé de montage - Google Patents

Machine de travail et procédé de montage Download PDF

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Publication number
WO2019097584A1
WO2019097584A1 PCT/JP2017/040972 JP2017040972W WO2019097584A1 WO 2019097584 A1 WO2019097584 A1 WO 2019097584A1 JP 2017040972 W JP2017040972 W JP 2017040972W WO 2019097584 A1 WO2019097584 A1 WO 2019097584A1
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WO
WIPO (PCT)
Prior art keywords
pressing
unit
component
lead
controller
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Application number
PCT/JP2017/040972
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English (en)
Japanese (ja)
Inventor
崇二 向原
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2019554078A priority Critical patent/JP6858273B2/ja
Priority to PCT/JP2017/040972 priority patent/WO2019097584A1/fr
Publication of WO2019097584A1 publication Critical patent/WO2019097584A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a working machine and a mounting method for mounting a lead component having a lead wire to a circuit substrate.
  • Patent Document 1 there is a work machine which mounts a lead wire of a lead component in a through hole of a printed circuit board (for example, Patent Document 1).
  • the working machine described in Patent Document 1 includes a pusher that presses a lead component from above to insert a lead wire into a through hole.
  • the work machine also moves in the horizontal direction while lowering the pusher.
  • the pusher moves so as to draw a substantially arc-like locus, and pushes the lead component down in a predetermined direction.
  • the lead component is mounted while being pushed down to the printed circuit board side.
  • the present invention is made in view of the above-mentioned subject, and an object of the present invention is to provide a work machine which can be installed appropriately on a circuit base by pushing down a lead part and an installation method.
  • the present application is directed to a substrate holding device for holding a circuit substrate having a through hole, and a circuit for holding a lead part having a lead wire and held by the substrate holding device.
  • a work head for inserting the lead wire into the through hole of the substrate; a work head moving device for moving the work head; and a control device, the work head holding the lead component, and A pressing unit for pressing a main body of the lead component in a state in which the lead wire is inserted into the through hole; and a pressing unit moving device for moving the pressing unit, the control unit including the pressing unit Control at least one of the detected value acquiring unit for acquiring the detected value corresponding to the pressing load pressing the main body unit, the working head moving device and the pressing unit moving device to move the pressing unit; Based on the detected value obtained by the detection value obtaining section, having a hydraulic control unit for controlling the operation of pushing the main body portion by the pressing portion, discloses a working machine.
  • the operation of pressing the main unit includes, for example, the speed and acceleration when the pressing unit presses the main unit, the movement start position when moving the pressing unit toward the main unit, and the stop position at which the movement of the pressing unit is stopped. It is a concept including a moving distance for moving the pressing unit, a rotation angle of the pressing unit with respect to the main body, and the like.
  • the present application also relates to a substrate holding device for holding a circuit substrate having a through hole formed therein, and a lead component having a lead wire, and the through hole of the circuit substrate held by the substrate holding device.
  • a work head including: a work head for inserting the lead wire; and a work head moving device for moving the work head, wherein the work head is a mounting method for mounting the lead component on the circuit substrate.
  • a detection value acquiring step in which the mounting method acquires a detection value according to a pressing load pressing the main body by the pressing unit, and the number of the working head moving device and the pressing unit moving device
  • the detection value acquisition unit acquires the detection value corresponding to the pressing load that presses the main body of the lead component.
  • the actuation control unit controls actuation of the main body unit by the pressing unit based on the detection value acquired by the detection value acquisition unit.
  • FIG. 5 shows a chuck attached to a work head. It is a figure which shows the press part attached to a working head. It is a perspective view showing a cut and clinch device. It is a perspective view showing a cut and clinch unit. It is sectional drawing which shows a slide body. It is an enlarged view which shows the upper end part of a slide body. It is a block diagram which shows the control apparatus of a component mounting machine. It is a flowchart of mounting
  • the component mounting machine 10 is a device for performing the mounting operation of the component on the circuit substrate 12.
  • the component mounting apparatus 10 includes an apparatus main body 20, a base material conveyance and holding device 22, a component mounting device 24, a mark camera 26, a part camera 28, a component supply device 30, a bulk component supply device 32, and a cut and clinch device 33 (see FIG. 5) And a controller 34 (see FIG. 9).
  • a circuit board, a base material of a three-dimensional structure, etc. are mentioned as circuit base material 12
  • a printed wiring board, a printed circuit board, etc. are mentioned as a circuit board.
  • the apparatus main body 20 includes a frame portion 40 and a beam portion 42 mounted on the frame portion 40.
  • the base material transport and holding device 22 is disposed at the center of the frame portion 40 in the front-rear direction, and includes a transport device 50 and a clamp device 52.
  • the transport device 50 is, for example, a device that transports the circuit substrate 12 by rotating a conveyor belt.
  • the clamp device 52 is a device that holds the circuit substrate 12 and holds the circuit substrate 12 fixedly at the working position.
  • the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position.
  • the transport direction of the circuit substrate 12 is referred to as the X direction (lateral direction), the horizontal direction perpendicular to that direction is referred to as the Y direction (front and back direction), and the vertical direction is the Z direction (vertical direction It is called). That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.
  • the component mounting device 24 is disposed in the beam unit 42, and includes two working heads 60 and 62, a working head moving device 64, an opening / closing device 86 (see FIG. 9), and a driving device 90 (see FIG. 9). And.
  • Each working head 60, 62 has a chuck 65 (see FIGS. 2 and 3), and holds the parts by the chuck 65.
  • Each work head 60, 62 has a pressing portion 66 (see FIGS. 2 and 4). The pressing portion 66 is used to push down the component mounted on the circuit substrate 12 by the chuck 65.
  • the working head moving device 64 has an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72.
  • the two working heads 60 and 62 are integrally moved to an arbitrary position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70.
  • Each of the working heads 60 and 62 is detachably mounted on the sliders 74 and 76, as shown in FIG.
  • the Z-direction moving device 72 moves the sliders 74 and 76 separately in the vertical direction. In other words, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.
  • the chuck 65 as shown in FIG. 3, has a chuck body 101, a pair of chuck claws 103, and a clasp 105.
  • the pair of chuck claws 103 is disposed to extend downward from the lower surface of the chuck body 101.
  • the opening / closing device 86 and the drive device 90 are, for example, incorporated in each of the working heads 60 and 62.
  • the opening / closing device 86 and the drive device 90 include, for example, an electromagnetic motor as a drive source.
  • the pair of chuck claws 103 approach or separate from each other in response to the operation of the opening / closing device 86 (see FIG. 9).
  • the chuck 65 causes the pair of chuck claws 103 to approach each other, thereby holding the component, for example, the component body 111 of the lead component 110 as shown in FIG.
  • the metal fitting 105 is provided on the lower surface of the chuck body 101 and at the center between the pair of chuck claws 103.
  • the material of the metal pad 105 is, for example, aluminum.
  • the metal pad 105 contacts the upper surface of the component body 111 of the lead component 110 held by the pair of chuck claws 103.
  • the clasp 105 is biased downward by a spring 106 incorporated in the chuck body 101.
  • the contact metal 105 contacts the upper surface of the component body 111 and biases the component body 111 downward according to the elastic force of the spring 106. Therefore, for example, when the height of the component main body 111 sandwiched by the chuck claws 103 is high, the latch 105 presses the component main body 111 downward. As a result, it is possible to correct the height in the Z direction of the component body 111 held by the chuck claws 103, that is, the height of the lead component 110 to a predetermined position.
  • the chuck 65 separates the lead component 110 from between the pair of chuck claws 103 by separating the pair of chuck claws 103.
  • the chuck 65 is detachably mounted to the lower end of each of the working heads 60 and 62.
  • the device for holding the lead component 110 is not limited to the chuck 65.
  • each of the work heads 60 and 62 may be provided with a suction nozzle for sucking and holding a component as a device for holding the lead component 110.
  • the working heads 60 and 62 may be provided, for example, with claws or the like that sandwich the lead wire 113 instead of the component body 111 (see FIG. 21). Further, as shown in FIG.
  • the lead component 110 may be a radial component in which the lead wire 113 protrudes in one direction from below the lead component 110, or may be an axial component in which the lead wire protrudes in two directions. It may be a component provided with a lead wire of Therefore, as the lead component in the present application, various components capable of bending the component main body portion 111 to the lead wire 113 can be adopted.
  • the pressing portion 66 has a configuration similar to that of the chuck 65, as shown in FIG.
  • the pressing portion 66 is configured by removing the chuck claws 103 of the chuck 65.
  • the contact metal 105 is in a state of protruding downward from the lower surface of the chuck body 101.
  • the component mounting machine 10 of the present embodiment presses the metal plate 105 of the pressing portion 66 against the component body 111 of the lead component 110 mounted on the circuit substrate 12. As a result, the component body 111 is pushed and bent toward the circuit base 12 side.
  • the work heads 60 and 62 drive the drive device 90 to move the chuck 65 and the pressing portion 66 in the Z direction (vertical direction). As a result, the chuck claws 103 and the clasps 105 move in the Z direction according to the drive of the drive device 90.
  • the work heads 60 and 62 drive the drive device 90 to rotate the chuck 65 and the pressing portion 66.
  • the chuck claws 103 and the clasps 105 rotate around the rotation axis L1 (see FIG. 3) along the Z direction according to the drive of the drive device 90.
  • the rotation axis L1 for rotating the chuck 65 and the pressing portion 66 is not limited to the rotation axis along the Z direction, but may be a rotation axis along a direction forming a predetermined angle with the Z direction.
  • each of the working heads 60 and 62 is attached with a side camera 67 that images a component held by the chuck 65.
  • the side camera 67 can image the entire lead component 110 in a state in which the component main body 111 is held by the chuck 65 from the side.
  • the mark camera 26 is attached to the slider 74 in a state of facing downward, and is moved together with the working head 60 in the X direction, the Y direction and the Z direction. Thereby, the mark camera 26 can pick up an arbitrary position on the frame portion 40, and can pick up the state of the component mounted on the circuit base 12, the mark provided on the surface of the circuit base 12, and the like.
  • the parts camera 28 is set between the base material conveyance and holding device 22 on the frame portion 40 and the component supply device 30 so as to face upward, that is, the imaging direction is set upward. It is arranged in the Thus, the part camera 28 can pick up an image of a part (such as the lead part 110) held by the chucks 65 of the working heads 60 and 62.
  • the component supply device 30 is disposed at one end (front side) of the frame portion 40 in the front-rear direction.
  • the component supply device 30 has a tray-type component supply device 97 and a feeder-type component supply device (not shown).
  • the tray-type component supply device 97 is a device for supplying components (such as lead components 110) in a state of being placed on the tray.
  • the feeder type component supply device is a device that supplies components by a tape feeder (not shown) and a stick feeder (not shown).
  • the bulk parts supply device 32 is disposed at the other end (rear side) of the frame portion 40 in the Y direction (front-rear direction).
  • the loose parts supply device 32 is a device for aligning a plurality of parts (such as lead parts 110) in a state of being scattered and supplying the parts in an aligned state. That is, it is an apparatus which aligns a plurality of parts of an arbitrary posture to a predetermined posture and supplies the components of the predetermined posture.
  • the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, components of a solar cell, components of a power module, and the like.
  • the electronic circuit components include lead components 110 having lead wires (radial components, axial components and the like), and components having no lead wires.
  • the cut and clinch device 33 is disposed below the transfer device 50, and includes a cut and clinch unit 130 and a unit moving device 131, as shown in FIG.
  • the cut-and-clinch device 33 is a device that cuts and bends the lead wire 113 of the lead component 110 (see FIG. 3) inserted in the through hole formed in the circuit base 12.
  • the cut and clinch unit 130 includes a unit body 133, a pair of slide bodies 134, and a pitch change mechanism 135.
  • a slide rail 136 is disposed so as to extend in the X direction.
  • the slide rail 136 slidably supports the pair of slide bodies 134.
  • the cut and clinch device 33 has a plurality of electromagnetic motors 140 (see FIG. 9) corresponding to the respective devices and mechanisms.
  • the pitch changing mechanism 135 changes the distance between the pair of slide bodies 134 by the operation of the electromagnetic motor 140.
  • each of the pair of slide bodies 134 has a fixed portion 138, a movable portion 139 and a slide device 141.
  • Each of the pair of slide bodies 134 is slidably held by the slide rail 136 at the fixing portion 138.
  • Two slide rails 142 are fixed to the back side of the fixing portion 138 so as to extend in the X direction.
  • the movable portion 139 is slidably held by the two slide rails 142. Thereby, the movable portion 139 slides in the X direction with respect to the fixed portion 138.
  • the slide device 141 operates the electromagnetic motor 140 to slide the movable portion 139 relative to the fixed portion 138.
  • the upper end portion of the fixing portion 138 is tapered, and the first insertion hole 143 is formed so as to vertically penetrate the upper end portion.
  • the first insertion hole 143 communicates with an opening formed on the upper end surface of the fixing portion 138 at the upper end.
  • a fixed blade 203 for cutting the lead wire 113 (see FIG. 3) is formed.
  • the first insertion hole 143 is open at the lower end of the side surface of the fixing portion 138.
  • a waste box 145 is disposed below the side opening.
  • the upper end portion of the movable portion 139 is also tapered.
  • An L-shaped bent portion 147 is formed at the upper end of the movable portion 139.
  • the bending portion 147 extends above the upper end surface of the fixing portion 138, and the bending portion 147 and the upper end surface of the fixing portion 138 are opposed in the Z direction via a slight clearance.
  • the first insertion hole 143 (see FIG. 7) opened at the upper end surface of the fixing portion 138 is covered by the bent portion 147 disposed at the upper side.
  • a second insertion hole 149 is formed in the bending portion 147 so as to face the first insertion hole 143 in the vertical direction.
  • a movable blade 205 (see FIG. 11) is provided at the opening edge of the lower end of the second insertion hole 149. Further, on the upper end surface of the bending portion 147, a guide groove 151 is formed so as to extend in the X direction, that is, in the sliding direction of the movable portion 139. The guide groove 151 is formed to straddle the opening of the second insertion hole 149 in the X direction. The guide groove 151 and the second insertion hole 149 are connected. The guide groove 151 is open at both side surfaces of the bending portion 147.
  • the unit moving device 131 has an X direction moving device 153, a Y direction moving device 155, a Z direction moving device 157, and a rotation device 159.
  • the X-direction moving device 153 has a slide rail 160 and an X-slider 162.
  • the slide rail 160 is disposed to extend in the X direction.
  • the X slider 162 is slidably held by the slide rail 160. Then, the X slider 162 moves in the X direction by the drive of the electromagnetic motor 140 (see FIG. 9).
  • the Y-direction moving device 155 has a slide rail 166 and a Y-slider 168.
  • the slide rail 166 is disposed on the X slider 162 so as to extend in the Y direction.
  • the Y slider 168 is slidably held by the slide rail 166. Then, the Y slider 168 moves in the Y direction by driving of the electromagnetic motor 140 (see FIG. 9).
  • the Z-direction moving device 157 has a slide rail 172 and a Z-slider 174.
  • the slide rail 172 is disposed on the Y slider 168 so as to extend in the Z direction.
  • the Z slider 174 is slidably held by the slide rail 172. Then, the Z-slider 174 moves in the Z direction by driving the electromagnetic motor 140 (see FIG. 9).
  • the rotation device 159 has a generally disk-shaped rotary table 178.
  • the rotary table 178 is supported by the Z-slider 174 so as to be rotatable about its axis, and is rotated by the drive of the electromagnetic motor 140 (see FIG. 9).
  • the above-described cut and clinch unit 130 is disposed on the rotary table 178.
  • the cut and clinch unit 130 can be moved to an arbitrary position by the X-direction moving device 153, the Y-direction moving device 155, and the Z-direction moving device 157, and rotated by an autorotation device 159 at an arbitrary angle. Do. This enables the cut and clinch unit 130 to be positioned at an arbitrary position below the circuit substrate 12 held by the clamp device 52 (see FIG. 1).
  • control device 34 includes a controller 190, a plurality of drive circuits 192, image processing devices 195 and 196, and a storage device 197.
  • the plurality of drive circuits 192 are connected to the above-described transfer device 50, clamp device 52, work head moving device 64, opening / closing device 86, drive device 90, tray type component supply device 97, bulk component supply device 32, electromagnetic motor 140, etc. It is done.
  • the controller 190 includes a CPU, a ROM, a RAM, and the like, is mainly composed of a computer, and is connected to a plurality of drive circuits 192.
  • the controller 190 controls the base material conveyance and holding device 22, the component mounting device 24, and the like to centrally control the operation of the component mounting machine 10.
  • the controller 190 according to the present embodiment reads the control data D1 stored in the storage device 197 and executes the mounting operation of the component on the circuit substrate 12.
  • the storage device 197 includes, for example, a hard disk and a memory.
  • control data D1 for example, data such as a control program for controlling the operation of the component mounting machine 10, the type of the circuit substrate 12 to be produced, the type of the component to be mounted, and the mounting position of the component are set. Further, in the control data D1 of the present embodiment, setting values for pushing down the lead component 110 described later are stored.
  • the setting value mentioned here is, for example, a value indicating a position at which the pressing unit 66 is disposed, a speed at which the pressing unit 66 is moved, an angle at which the pressing unit 66 is rotated, a distance at which the pressing unit 66 is moved, and the like.
  • the controller 190 is also connected to the image processing apparatus 195.
  • the image processing device 195 processes imaging data captured by the side camera 67 of the component mounting device 24.
  • the controller 190 detects the bending of the lead wire 113 of the lead component 110 held by the chuck 65, the error in the position between the component body 111 and the lead wire 113, and the like by the processing of the image processing device 195, for example.
  • the controller 190 is also connected to the image processing apparatus 196.
  • the image processing device 196 processes imaging data captured by the mark camera 26 and the part camera 28.
  • the controller 190 acquires various types of information detected by the processing of the image processing apparatus 196.
  • the controller 190 processes the imaging data of the mark camera 26 with the image processing device 196, for example, to detect the state of the component mounted on the circuit substrate 12 and the identification information provided on the circuit substrate 12. Further, the controller 190 detects the holding position of the lead component 110 held by the chuck 65 by processing the imaging data of the part camera 28 with the image processing device 196, for example.
  • the controller 190 may detect a bend or the like of the lead wire 113 based on the imaging data imaged by the part camera 28.
  • the component mounting machine 10 mounts components on the circuit substrate 12 held by the substrate conveyance and holding device 22 according to the configuration described above. Further, the component mounting machine 10 performs an operation of pushing down the component main body 111 of the lead component 110 to the circuit base 12 side in the mounting operation.
  • FIG. 10 shows a flowchart of the mounting operation of the lead component 110 by the component mounting machine 10.
  • the controller 190 of the control device 34 performs the process shown in FIG. 10, for example, by executing the control program included in the control data D1.
  • the control program is generated by the user, for example, in a management computer (not shown) that manages the production line of the component placement machine 10.
  • the control program is transmitted from the management computer to the component mounting machine 10 and stored in the storage device 197 of the controller 190.
  • the controller 190 performs the mounting operation based on the control program stored in the storage device 197.
  • control by the controller 190 may be described simply by the device name.
  • the description “the base material transport and holding device 22 transports the circuit base material 12” refers to “the controller 190 executes the control program and controls the base material transport and support device 22 to transport the circuit base material 12. It may mean "to do.”
  • step 1 the base material transport and holding device 22 carries the circuit base material 12 into the component mounting machine 10 from, for example, an apparatus upstream of the production line. Transport to the work position.
  • the clamp device 52 holds the circuit substrate 12 fixedly in the working position.
  • the mark camera 26 moves above the circuit substrate 12 to image the circuit substrate 12.
  • the controller 190 detects the identification information provided on the circuit substrate 12 based on the imaging data of the mark camera 26. Further, the controller 190 detects the holding position of the circuit substrate 12 and the like based on the imaging data of the mark camera 26.
  • the component supply device 30 or the bulk component supply device 32 supplies the lead components 110 at a predetermined supply position. Either of the working heads 60 and 62 moves above the supply position of the lead component 110, and holds and holds the component body 111 of the lead component 110 by the pair of chuck claws 103 (see FIG. 3) of the chuck 65. .
  • the working heads 60 and 62 image the lead part 110 held by the chuck 65 by the side camera 67.
  • the work heads 60 and 62 for example, perform imaging with the side camera 67 while moving from the component supply position to the work position.
  • the controller 190 calculates information on the holding position and the like of the lead part 110 based on the imaging data of the side camera 67.
  • the controller 190 moves the working heads 60 and 62 holding the lead parts 110 above the circuit base 12 and inserts the lead wires 113 into the through holes of the circuit base 12 (S5).
  • the controller 190 controls the work heads 60 and 62 during movement to correct an error or the like in the holding position of the lead part 110.
  • the work heads 60 and 62 drive the drive device 90 to rotate the chuck 65 and the like, and correct an error or the like of the holding position of the lead part 110 held by the chuck 65.
  • the drive device 90 is driven to lower the chuck 65.
  • the pair of lead wires 113 of the lead component 110 held by the chuck 65 is inserted into the two through holes formed in the circuit base 12.
  • the cut and clinch unit 130 is moved below the circuit substrate 12.
  • the cut and clinch unit 130 cuts and bends the lead wire 113 (S7).
  • FIG. 11 shows the state before the lead wire 113 is cut.
  • the cut and clinch device 33 controls the unit moving device 131 to adjust the position of the cut and clinch unit 130, the distance between the pair of slide bodies 134, and the like.
  • the first insertion holes 143, the second insertion holes 149, and the through holes 208 of the circuit base 12 overlap in the Z direction.
  • the upper end portion of the slide body 134 is disposed at a position slightly spaced downward from the lower surface 12A of the circuit substrate 12.
  • the controller 190 lowers the lead component 110 held by the chuck 65 and inserts the lead wire 113 into the through hole 208 from the upper surface 12 B side of the circuit substrate 12.
  • Each of the pair of lead wires 113 is inserted into each of the pair of through holes 208.
  • the lead wire 113 is inserted from above the second insertion hole 149 and is inserted into the first insertion hole 143 via the second insertion hole 149.
  • the pair of movable parts 139 move relative to the fixed part 138 and slide in a direction approaching them.
  • the lead wire 113 is cut by the fixed blade 203 of the first insertion hole 143 and the movable blade 205 of the second insertion hole 149.
  • the tip portion separated by the cutting of the lead wire 113 falls within the first insertion hole 143 and is discarded to the discard box 145 (see FIG. 7).
  • the pair of movable parts 139 is slid further in the approaching direction. Therefore, the new tip of the lead wire 113 by cutting is bent along the tapered surface of the inner periphery of the second insertion hole 149 as the movable portion 139 slides. Furthermore, the distal end portion of the lead wire 113 bends along the guide groove 151 as the movable portion 139 slides. As a result, the lead wire 113 is bent substantially at a right angle, and the coming-off from the through hole 208 is suppressed.
  • the lead component 110 is in a state in which the lead wire 113 is crimped, and is in a state of being attached to the circuit base 12.
  • FIG. 12 shows, as an example, the case where the pair of movable parts 139 are brought close to each other, that is, the case where the lead wire 113 is bent inward.
  • the outer bending of the lead wire 113 can be performed in the same manner as the inner bending by sliding the pair of movable parts 139 in the direction away from each other.
  • the component mounting apparatus 10 of the present embodiment executes a process of pressing the component body 111 by the pressing unit 66 with respect to the lead component 110 in the state shown in FIG. 12.
  • the controller 190 determines the type of the lead part 110 mounted in S7 (S9).
  • the controller 190 detects, for example, the information of the component to be mounted from the control data D1, and determines the type of the lead component 110.
  • the controller 190 sets the movement start position and the like of the pressing unit 66 according to the determined type of the lead part 110 (S10). For example, in S10, the controller 190 sets a movement start position P1 (see FIG. 13) at which the movement to push the component main body 111 is started and stop positions P2 and P3 (see FIGS. 15 and 16). Further, in S10, the controller 190 sets a rotation angle ⁇ (see FIG. 13) for rotating the latch 105 before starting the pressing movement. Further, at S10, the controller 190 sets moving speeds V1 and V2 (see FIGS. 14 and 15) for moving the pressing portion 66 toward the component body 111. Further, the controller 190 sets acceleration and deceleration when moving the pressing portion 66.
  • the controller 190 sets movement distances DT1 and DT2 (see FIGS. 15 and 16) for moving the pressing unit 66. Further, the controller 190 sets a target load when pressing the component body 111 by the pressing unit 66. For example, in the control data D1, a value or the like of the movement start position P1 corresponding to the type of the lead part 110 is set. The controller 190 searches the control data D1 for the movement start position P1 and the like according to the type of the lead part 110 determined in S9, and sets values such as the movement start position P1 and the like. Then, as described later, the controller 190 moves the pressing unit 66 based on the movement start position P1 and the like set in S10 (S13 to S17). As a result, the movement start position P1 or the like of the pressing portion 66 is automatically set in accordance with the type of the lead part 110. Therefore, the pressing portion 66 can be arranged, moved, and stopped according to the type of the lead component 110.
  • the process sequence shown in FIG. 10 is an example, The order and the content can be changed suitably.
  • the controller 190 may execute the determination process in S9 and the setting process in S10 between S1 and S3.
  • the controller 190 may set the movement start position P1 and the like for all the components to be mounted based on the information of the control data D1 before starting the mounting of the components.
  • the controller 190 may receive a change of the movement start position P1 or the like.
  • the controller 190 may change the control data D1 in accordance with the input information of the display device 13 shown in FIG. 1 and change the coordinate value of the movement start position P1.
  • the display device 13 may include a touch panel for inputting change information.
  • the user may, for example, operate the management computer of the production line to change the control data D1 of the component mounting machine 10 and change the movement start position P1 and the like. Thereby, the user can reduce, for example, the moving speed V1 and the acceleration by changing the control data D1.
  • the damage or the like of the component main body 111 can be eliminated by reducing the moving speed V1 and the acceleration.
  • the user can accelerate the operation of the metal plate 105 by increasing the moving speed V1 and the acceleration, and can complete the processing of S15 and S17 described later in a shorter time. That is, the mounting time can be shortened.
  • FIG. 13 shows a state before pressing the component main body 111, and is a schematic view of the component main body 111 and the contact metal 105 viewed from the side.
  • the lead component 110 shown in FIG. 13 is in a state in which the lead wire 113 is bent, and is mounted on the circuit base 12.
  • the controller 190 moves the clasp 105 to the movement start position P1 set in S10 of FIG. 10 (S13).
  • the controller 190 drives the work head moving device 64 to move the latch 105 to the movement start position P1.
  • one working head is provided with both the chuck 65 and the pressing portion 66.
  • the controller 190 moves the working head 60 in the X direction or Y direction, thereby pressing the working head 60
  • the portion 66 can be disposed at the movement start position P1.
  • the working head 60 may move the chuck 65 that has been mounted up and move the pressing portion 66 down while moving in the X direction or the like.
  • the working heads 60 and 62 may be configured to include one of the pressing portion 66 or the chuck 65.
  • the controller 190 may drive the drive device 90 to change the position of the pressing portion 66, and may arrange the pressing portion 66 at the movement start position P1.
  • the latch 105 is disposed at the movement start position P1 and is adjacent to the lead part 110 (S13).
  • the hitch 105 moves from the movement start position P1 toward the component body 111 and pushes the component body 111.
  • the movement start position P1 is a position where the pressing portion 66 is disposed before the pressing operation is started.
  • the controller 190 sets the movement start position P1 or the like in S10 in accordance with the type of the lead part 110. For example, when the width W1 (see FIG. 13) of the component body 111 is large, the controller 190 may set the position of the movement start position P1 to a position farther from the center of the component body 111.
  • the controller 190 sets the position of the movement start position P1 further away from the top surface 12B of the circuit substrate 12 good.
  • the metal fitting 105 can be placed on the center of the component body 111 in the Z direction, and the component body 111 can be pushed well.
  • the controller 190 may change the rotation angle ⁇ in accordance with the type of the component body 111.
  • the controller 190 may set the rotation angle ⁇ such that the plane of the component body 111 and the plane of the metal plate 105 are parallel to each other. Thereby, the flat surface of the metal plate 105 can be placed on the flat surface of the component main body 111, and the component main body 111 can be favorably pressed.
  • the controller 190 may not set the movement start position P1 or the like based on a value preset in the control data D1 in S10. For example, the controller 190 detects data corresponding to the type of the lead part 110 determined in S9 from the control data D1.
  • the controller 190 may set the movement start position P1 or the like based on the shape or the like of the component body 111 detected from the control data D1. That is, the controller 190 may set the movement start position P1 or the like by determining the shape or the like of the lead part 110.
  • each of the pair of slide bodies 134 arranges the fixed portion 138 and the movable portion 139 slightly below the lower surface 12A.
  • the upper surface 138A (see FIG. 8) of the fixed portion 138 and the bent portion 147 of the movable portion 139 are in contact with the lower surface 12A of the circuit substrate 12 or slightly separated from the lower surface 12A.
  • the controller 190 determines, for example, a position avoiding the through hole 208, the wiring pattern on the lower surface 12A side, and the electronic component mounted on the lower surface 12A based on the information of the control data D1, and the fixed portion 138 and the movable portion Arrange the 139. Note that FIG.
  • the pair of slide bodies 134 may be disposed so as to sandwich the through hole 208.
  • the fixed portion 138 and the movable portion 139 of each slide body 134 may be disposed so as to sandwich the lead wire 113 and the through hole 208 from both sides in the left-right direction of FIG.
  • an elastic member (rubber or the like) for protecting the circuit base 12 may be provided on the upper surface 138A of the fixing portion 138 or the bending portion 147.
  • the circuit substrate 12 is the lower surface 12A (second surface An example of the cutting and clinching device 33 (an example of a substrate supporting device) supported from the side. According to this, by supporting the flat circuit base material 12 from the lower surface 12A side, it is possible to suppress the circuit base material 12 from being bent downward as the component body 111 is pressed. By suppressing the curvature of the circuit substrate 12, the controller 190 can appropriately acquire detection values and the like according to pressing loads N1 and N2 described later. That is, the control of the pressing portion 66 according to the pressing loads N1 and N2 can be executed with high accuracy.
  • the base material support device of the present embodiment is a cut and clinch device 33 that cuts and bends the lead wire 113 inserted into the through hole 208 prior to pressing the component main body portion 111 by the pressing portion 66.
  • the cut-and-clinch device 33 is used as both a device for performing cutting and bending of the lead wire 113 and a substrate supporting device for supporting the circuit substrate 12 at the time of pressing.
  • an apparatus for performing cutting and bending of the lead wire 113 in combination as a substrate supporting apparatus for supporting the circuit substrate 12 the miniaturization of the component mounting machine 10 and the reduction of the manufacturing cost can be achieved. It becomes possible.
  • the controller 190 moves the patch 105 arranged at the movement start position P1 shown in FIG. 13 in the direction horizontal to the upper surface 12B (S15).
  • the controller 190 moves the clasp 105 toward the component body 111 from the movement start position P1.
  • the controller 190 controls the work head moving device 64 to move the metal plate 105 at the moving speed V1 set in S10 and the acceleration and deceleration.
  • the controller 190 may control the drive device 90 to move the metal plate 105.
  • the controller 190 may control both the working head mover 64 and the drive 90 to move the latch 105.
  • the clasp 105 moves at a moving speed V ⁇ b> 1 and contacts the component body 111.
  • the metal pad 105 pushes the component main body 111 with the pressing load N1.
  • the controller 190 can detect a pressing load N1 for pressing the component main body 111 by the latch 105 or a detection value corresponding to the pressing load N1.
  • the controller 190 executes control according to the pressing load N1 based on the current value of the drive current generated in the drive circuit 192 (see FIG. 9) that drives the work head moving device 64.
  • the controller 190 feedback-controls the operation of the working head moving device 64 so that, for example, the magnitude of the current value of the drive current generated in the drive circuit 192 matches the current value corresponding to the target load set in S10. . Thereby, the pressing load N1 can be matched with the target load.
  • the controller 190 may convert the current value of the drive current generated in the drive circuit 192 into the value of the pressing load N1 and compare it with the target load. That is, the controller 190 may execute control of the working head moving device 64 after converting the current value (an example of the detection value) into a load.
  • the controller 190 of the present embodiment acquires the target load according to the type of the lead part 110 in S9.
  • the controller 190 controls the working head moving device 64 such that the pressing load N1 matches the target load. According to this, by performing feedback control so that the target load and the pressing load N1 match, the lead component 110 is pushed down to the circuit substrate 12 without damaging the circuit substrate 12 or the lead component 110. It can be worn properly.
  • the component mounting machine 10 of the present embodiment supports the circuit substrate 12 from below by the fixed portion 138 and the movable portion 139 of the cut and clinch device 33.
  • the downward bending of the circuit base 12 can be suppressed, and the lead wire 113 can be bent according to the pressure of the component body 111. That is, the force corresponding to the pressing load N1 can be efficiently transmitted to the lead wire 113, and the lead wire 113 can be favorably bent.
  • the controller 190 can appropriately acquire the current value of the drive current according to the pressing load N1. That is, the control of the pressing portion 66 according to the pressing load N1 can be performed with high accuracy.
  • the controller 190 sets the movement distance DT1 and the stop position P2 in S10 in accordance with the type of the lead part 110. For example, when the width W1 (see FIG. 13) of the component body 111 is large, the controller 190 increases the movement distance DT1. Alternatively, the controller 190 sets the position of the stop position P2 to a position further away from the movement start position P1. Thereby, the metal plate 105 disposed at the stop position P2 can be disposed above the central portion of the upper surface of the component main body 111 rotated by 90 degrees. As a result, in step S17 described later, the component main body portion 111 can be pushed in the vertical direction favorably by the latch 105.
  • the metal plate 105 disposed at the stop position P2 shown in FIG. 15 is moved in the vertical direction perpendicular to the upper surface 12B, that is, in the Z direction (S17).
  • the controller 190 moves the clasp 105 downward along the Z direction from the stop position P2.
  • the controller 190 controls the work head moving device 64, and moves the clamp 105 at the moving speed V2, the acceleration, and the deceleration set in S10, as shown in FIG.
  • the controller 190 may control the drive device 90 to move the metal plate 105 downward.
  • the controller 190 may control both the working head mover 64 and the drive 90 to move the latch 105 downward.
  • the latch 105 moves at, for example, the moving speed V 2 and contacts the component body 111.
  • the metal pad 105 pushes the component body 111 with the pressing load N2.
  • the controller 190 controls the pressing load N2 also in the vertical direction of S17 as in the horizontal direction of S15.
  • the controller 190 causes the magnitude of the current value of the drive current generated in the drive circuit 192 (see FIG. 9) for driving the work head moving device 64 to coincide with the current value corresponding to the target load set in S10.
  • the feedback control of the operation of the working head moving device 64 is performed.
  • the pressing load N2 can be matched with the target load.
  • the controller 190 may control only one of the pressing load N1 of S15 and the pressing load N2 of S17. Alternatively, the controller 190 may not control both the pressing load N1 of S15 and the pressing load N2 of S17.
  • the controller 190 moves the pressure plate 105 to the stop position P3 while matching the pressure load N2 with the target load.
  • the controller 190 moves the clamp 105 downward by the movement distance DT2 set in S10.
  • the latch 105 is disposed at the stop position P3.
  • the lead component 110 has the tip of the lead wire 113 bent at S7. Therefore, the lead component 110 is deformed so as to bend the lead wire 113 in the pressing direction (vertical direction) by pressing the component body 111 downward.
  • the component main body 111 moves in the direction approaching the upper surface 12B as the lead wire 113 bends.
  • the lead wire 113 is bent in a substantially L-shape. For example, the component body 111 comes in contact with the upper surface 12B.
  • the controller 190 of the present embodiment moves the pressing portion 66 in the horizontal direction parallel to the upper surface 12B (an example of the first surface) of the circuit substrate 12 (see FIG. 15). Pushes the component main body 111 in the horizontal direction. Further, the controller 190 controls the working head moving device 64 after pushing the component body 111 in the horizontal direction, and moves the pressing part 66 in the Z direction (an example of the vertical direction) perpendicular to the upper surface 12B. The part main body 111 is pushed toward the circuit base 12 by 66 (see FIG. 16). According to this, the pressing portion 66 presses the component body 111 divided into two steps in the horizontal direction and the Z direction.
  • the controller 190 can appropriately acquire the detection value and the like according to the pressing loads N1 and N2. That is, the control of the pressing portion 66 according to the pressing loads N1 and N2 can be executed with high accuracy.
  • the controller 190 may move the pressing portion 66 in the horizontal direction and also in the Z direction, and press the component main body 111 by the pressing portion 66.
  • the controller 190 of this embodiment can perform control using both the pressing load N2 and the movement distance DT2.
  • the height of the stop position P3 is the distance from the lower surface to the upper surface of the component body 111, ie, the width W1 of the component body 111 (see FIG. 13) Match with
  • the movement distance DT2 can be set based on the positions of the stop positions P2 and P3. Then, the controller 190 may notify an error, for example, when the pressing load N2 does not reach the target load at the time of lowering the clamp 105 by the moving distance DT2. in this case.
  • the controller 190 may notify an error when the pressing load N2 at the time of lowering the dent 105 by the moving distance DT2 becomes larger than the target load. In this case, it is possible that the pressing load N2 may have risen because the latch 105 is lowered too much.
  • the controller 190 sets the movement distance DT2 and the stop position P3 in S10 in accordance with the type of the lead part 110. For example, when the width W1 (see FIG. 13) of the component body 111 is large, the controller 190 reduces the movement distance DT2. Alternatively, the controller 190 sets the position of the stop position P3 closer to the stop position P2. Thereby, by separating the metal plate 105 disposed at the stop position P3 from the upper surface 12B, it is possible to suppress excessive pressing of the component main body 111.
  • the component mounting machine 10 of the present embodiment bends the lead wire 113 to bring the component body 111 into contact with the upper surface 12B, and executes the mounting of the lead component 110 on the circuit substrate 12.
  • the case where one lead component 110 was attached was described in the above-mentioned example, the case where several lead components 110 are attached can be performed similarly.
  • the controller 190 can execute mounting of the second and subsequent lead components 110 by executing the process from S3 again.
  • the component mounting machine 10 is an example of a working machine.
  • the clamp device 52 is an example of a substrate holding device.
  • the chuck 65 is an example of a holder.
  • the driving device 90 is an example of a pressing unit moving device.
  • the component main body 111 is an example of the main body.
  • the controller 190 is an example of a control device.
  • the upper surface 12B is an example of a first surface.
  • the lower surface 12A is an example of a second surface.
  • the controller 190 acquires detection values corresponding to the pressing loads N1 and N2 that press the component body 111 by the pressing unit 66.
  • the controller 190 controls the work head moving device 64 and the like to move the pressing unit 66, and controls the pressing operation of the component body 111 by the pressing unit 66 based on the acquired detection value.
  • the “pressing operation” mentioned here is, for example, pressing loads N1 and N2 to be applied from the pressing portion 66 to the component main body 111, moving speed, acceleration, deceleration, position, rotation angle and the like of the pressing portion 66. For example, when the load for pressing the lead component 110 to the circuit base 12 increases, the circuit base 12 and the lead component 110 may be damaged.
  • the lead component 110 is miniaturized and thinned, it is required to press the lead component 110 with an appropriate load.
  • the pressing loads N1 and N2 applied to the component body 111 from the pressing unit 66 by controlling the operation of the pressing unit 66 according to the pressing loads N1 and N2. Control.
  • the lead component 110 can be properly mounted on the circuit base 12 by pushing down the lead component 110 without damaging the circuit base 12 and the lead component 110.
  • a space for mounting another lead component 110 or the like can be more reliably secured above the circuit base 12.
  • FIG. 17 shows a plan view of the component 230 of the second embodiment.
  • FIG. 18 shows a side view of part 230.
  • the component 230 of the second embodiment has a component main body portion 231 and a fixed portion 233.
  • the component 230 is, for example, a component such as a sensor, a push button switch, or a lamp.
  • the component body 231 has a disk shape.
  • a terminal 235 is provided on the lower surface of the component body 231.
  • the terminals 235 are connected to the terminals 241 of the circuit base 12 shown in FIG.
  • three fixed parts 233 are provided.
  • the three fixed parts 233 are provided on the side surface of the component body 231, and are provided at equal intervals in the circumferential direction of the component body 231.
  • FIG. 19 is a schematic view of the circuit substrate 12 of the second embodiment. Note that FIG. 19 illustrates the component 230 larger than the circuit substrate 12 in order to make it easy to understand how the component 230 is attached. Accordingly, the sizes of the circuit base 12 and the component body 231 shown in FIG. 19 are an example.
  • three fixing parts 243 and terminals 241 are provided on the top surface 12B of the circuit base 12.
  • the three fixing parts 243 are provided corresponding to the position of the fixed part 233.
  • the fixing portion 243 is formed in a size that can accommodate the fixed portion 233.
  • the fixing portion 243 is formed with an insertion hole into which the fixed portion 233 is inserted.
  • the terminal 241 is provided at the center of the area surrounded by the three fixed parts 243.
  • FIG. 20 shows a state in which the component 230 is held by the chuck claws 103 of the chuck 65.
  • the pair of chuck claws 103 sandwiches a portion which is a side surface of the component main body portion 231 and in which the fixed portion 233 is not provided.
  • the pressing metal 105 comes in contact with the upper surface of the component body 231 by the biasing force of the spring 106.
  • the controller 190 moves the chuck 65 to clamp the component 230 supplied from the component supply device 30 or the like with the chuck claw 103.
  • the controller 190 moves the chuck 65 above the circuit substrate 12.
  • the chuck 65 aligns the position of the terminal 235 of the component body 231 with the terminal 241 of the circuit substrate 12 as shown in FIG. 19, and arranges the component 230 on the upper surface 12B.
  • the chuck 65 arranges the fixing portion 243 and the fixing portion 233 at positions shifted in the circumferential direction of the component main body portion 231.
  • the component 230 is disposed at the movement start position P1.
  • the chuck 65 rotates the component main body 231 by the rotation angle ⁇ about the rotation axis L1 (see FIG. 20) in the direction perpendicular to the upper surface 12B.
  • Each of the fixed portions 233 is inserted into the fixing portion 243 through the insertion hole of each of the fixing portions 243.
  • the component 230 is mounted on the circuit substrate 12 by engaging the fixed portion 233 with the fixing portion 243.
  • the movement start position P1 at the time of mounting, the rotation angle ⁇ , and the rotation speed become important as in the first embodiment. Therefore, for example, according to the type of the component 230, the controller 190 rotates the component 230 at the movement start position P1 and the movement start position P1 shown in FIG. And the like.
  • the fixing portion 243 and the fixed portion 233 can be shifted and arranged, and the contact between the fixed portion 243 and the fixed portion 233 can be avoided.
  • the terminals 235 and 241 can be more reliably connected.
  • the rotation angle ⁇ the fixed portion 233 of the component 230 can be favorably inserted into the fixing portion 243 of the circuit base 12.
  • the controller 190 may receive the change of the movement start position P1 or the rotation angle ⁇ via the display device 13 (see FIG. 1).
  • the user can properly mount the component 230 on the circuit substrate 12 by adjusting the movement start position P1 and the like.
  • the controller 190 includes a detected value acquisition unit 261, an operation control unit 263, a target load acquisition unit 265, a determination unit 267, and a setting unit 269.
  • the detected value acquisition unit 261 and the like are processing modules that are realized, for example, by the CPU of the controller 190 executing the control program of the control data D1.
  • the detection value acquisition unit 261 and the like may be configured by hardware such as a processing circuit instead of software such as a processing module.
  • the detection value acquisition unit 261 and the like may be configured by combining software and hardware.
  • the detection value acquisition unit 261 acquires detection values corresponding to the pressing loads N1 and N2 that press the component body 111.
  • the operation control unit 263 controls the operation head moving device 64 and the like to move the pressing unit 66, and controls the pressing operation of the component body 111 by the pressing unit 66 based on the detection value acquired by the detection value acquisition unit 261. .
  • the target load acquisition unit 265 acquires a target load according to the type of the lead part 110.
  • the determination unit 267 determines the type of the lead component 110.
  • the setting unit 269 sets the movement start position P1 of the pressing unit 66, the movement speeds V1 and V2, and the movement distances DT1 and DT2 according to the type of the lead part 110 determined by the determination unit 267.
  • the process performed by the detection value acquisition unit 261 is an example of the detection value acquisition process.
  • the process performed by the operation control unit 263 is an example of the operation control process.
  • the structure of the pressing portion 66 in the first embodiment is an example, and another structure capable of pressing the lead component 110 may be used.
  • the pressing portion 66 may have a structure in which an elastic member such as rubber or urethane is attached to the outside of a metal member. As a result, the collision load between the pressing portion 66 and the component body 111 can be reduced.
  • the working heads 60 and 62 may be provided with claws 250 for holding the lead wire 113 as an apparatus for holding the lead part 110.
  • the component holder 253 opens and closes the pair of slide portions 255 and opens and closes the four claws 250 in response to the drive of the drive device 90 (see FIG. 9).
  • the component holder 253 holds the lead component 110 by holding the lead wire 113 by the claw portion 250.
  • the component holder 253 is provided with a pusher 259 movable in the Z direction with respect to the main body portion 257.
  • the pusher 259 moves up and down in the Z direction, for example, by the operation of an air cylinder (not shown).
  • the pusher 259 contacts the component body 111 of the lead component 110 holding and holding the lead wire 113 with the claw 250 from above.
  • the lead component 110 may be attached to the circuit base 12 using such a component holder 253.
  • the lead body 113 may be pressed by using the pusher 259 to bend the lead wire 113.
  • the component mounting machine 10 may also include a load sensor that directly detects the values of the pressing loads N1 and N2. Then, the controller 190 may control the working head moving device 64 and the driving device 90 according to the values of the pressing loads N1 and N2 detected by the load sensor. The controller 190 may control at least one of the working head moving device 64 and the driving device 90 when pressing the component main body 111 by the pressing unit 66.
  • the controller 190 executes the processing (S15, S17) for pushing the component body 111 after the processing (S7) for cutting and bending the lead wire 113 by the cut and clinch device 33.
  • the controller 190 may execute the process (S15, S17) of pushing the component main body 111 without performing the process of S7.
  • the component placement machine 10 may not have the cut and clinch device 33.
  • the controller 190 controls the pressing loads N1 and N2 to coincide with the target loads, but the invention is not limited thereto.
  • the controller 190 may execute control while allowing fluctuations in the pressure loads N1 and N2 within an allowable range obtained by multiplying the target load by a predetermined coefficient. That is, the pressing loads N1 and N2 do not have to match the target loads.
  • the controller 190 performed control, detecting pressing load N1, N2 at the time of moving the pressing part 66, and pressing load N1, N2 after moving the pressing part 66, it does not restrict to this.
  • the controller 190 may be configured to determine only the pressing loads N1 and N2 after moving the pressing portion 66.
  • the component mounting machine 10 may not be provided with a substrate supporting device for supporting the circuit substrate 12 from the lower surface 12A at the time of pressing.
  • the substrate support device may be a device different from the cut and clinch device 33.
  • the component placement machine 10 may also be equipped with a device for pressing the circuit substrate 12 from the top surface 12B when pressed.
  • the work machine of the present application may not include the component supply device 30 for supplying components, the bulk component supply device 32, and the like. That is, the working machine may be configured to include only the clamp device 52 (an example of the substrate holding device), the working heads 60 and 62, the working head moving device 64 (an example of the head moving device), and the control device 34.
  • SYMBOLS 10 Component mounting machine (work machine), 12 circuit base materials, 12 B upper surface (1st surface), 12 A lower surface (2nd surface), 34 control apparatus, 52 clamp apparatus (substrate holding apparatus), 60, 62 working head, 64 working head moving device, 65 chuck (holding unit), 66 pressing unit, 90 driving device (pressing unit moving device), 110 lead component, 111 component main unit (main unit), 113 lead wire, 190 controller (control device) , 208 through holes, N1, N2 pressing load.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne une machine de travail et un procédé de montage, moyennant quoi un composant conducteur peut être pressé vers le bas et correctement monté sur une carte de circuit imprimé. Une tête de travail comprend : une section de maintien qui maintient le composant conducteur ; une section de pression qui presse une section de corps principal du composant conducteur qui est dans un état dans lequel un fil conducteur est inséré dans un trou traversant ; et un dispositif de déplacement de section de pression qui déplace la section de pression. Un dispositif de commande comprend : une unité d'acquisition de valeur de détection qui obtient une valeur de détection correspondant à une charge de pression à laquelle la section de corps principal est pressée par la section de pression ; et une unité de commande de fonctionnement qui commande au moins le dispositif de déplacement de tête de travail ou le dispositif de déplacement de section de pression et qui déplace la section de pression, et, sur la base de la valeur de détection obtenue par l'unité d'acquisition de valeur de détection, commande l'opération de pression de la section de corps principal par la section de pression.
PCT/JP2017/040972 2017-11-14 2017-11-14 Machine de travail et procédé de montage WO2019097584A1 (fr)

Priority Applications (2)

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JP2019554078A JP6858273B2 (ja) 2017-11-14 2017-11-14 作業機、装着方法
PCT/JP2017/040972 WO2019097584A1 (fr) 2017-11-14 2017-11-14 Machine de travail et procédé de montage

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Application Number Priority Date Filing Date Title
PCT/JP2017/040972 WO2019097584A1 (fr) 2017-11-14 2017-11-14 Machine de travail et procédé de montage

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269585A (ja) * 1985-09-21 1987-03-30 日本電気ホームエレクトロニクス株式会社 自動插入機における部品の実装方法
JPS62293797A (ja) * 1986-06-13 1987-12-21 シチズン時計株式会社 電子部品の高密度実装方法及びその装置
JPH05318245A (ja) * 1992-05-25 1993-12-03 Canon Inc 実装装置
JPH08195592A (ja) * 1995-01-17 1996-07-30 Ando Electric Co Ltd コネクタ圧入装置の圧入制御方法
JP2004200606A (ja) * 2002-12-20 2004-07-15 Matsushita Electric Ind Co Ltd 部品挿入ヘッド装置、部品挿入装置、及び部品挿入方法
JP2013093536A (ja) * 2011-10-07 2013-05-16 Juki Corp 電子部品実装装置及び電子部品実装方法
JP2013258194A (ja) * 2012-06-11 2013-12-26 Yamaha Motor Co Ltd クリンチ装置、部品取付装置
JP2014123624A (ja) * 2012-12-20 2014-07-03 Juki Corp 電子部品実装装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269585A (ja) * 1985-09-21 1987-03-30 日本電気ホームエレクトロニクス株式会社 自動插入機における部品の実装方法
JPS62293797A (ja) * 1986-06-13 1987-12-21 シチズン時計株式会社 電子部品の高密度実装方法及びその装置
JPH05318245A (ja) * 1992-05-25 1993-12-03 Canon Inc 実装装置
JPH08195592A (ja) * 1995-01-17 1996-07-30 Ando Electric Co Ltd コネクタ圧入装置の圧入制御方法
JP2004200606A (ja) * 2002-12-20 2004-07-15 Matsushita Electric Ind Co Ltd 部品挿入ヘッド装置、部品挿入装置、及び部品挿入方法
JP2013093536A (ja) * 2011-10-07 2013-05-16 Juki Corp 電子部品実装装置及び電子部品実装方法
JP2013258194A (ja) * 2012-06-11 2013-12-26 Yamaha Motor Co Ltd クリンチ装置、部品取付装置
JP2014123624A (ja) * 2012-12-20 2014-07-03 Juki Corp 電子部品実装装置

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