WO2019085730A1 - 背光模组及显示装置 - Google Patents

背光模组及显示装置 Download PDF

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Publication number
WO2019085730A1
WO2019085730A1 PCT/CN2018/110193 CN2018110193W WO2019085730A1 WO 2019085730 A1 WO2019085730 A1 WO 2019085730A1 CN 2018110193 W CN2018110193 W CN 2018110193W WO 2019085730 A1 WO2019085730 A1 WO 2019085730A1
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WO
WIPO (PCT)
Prior art keywords
backlight module
display panel
heat
guide plate
light
Prior art date
Application number
PCT/CN2018/110193
Other languages
English (en)
French (fr)
Inventor
朱成兵
朱孝菲
张大宇
张卓
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/336,800 priority Critical patent/US11086070B2/en
Publication of WO2019085730A1 publication Critical patent/WO2019085730A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G06F1/1607—Arrangements to support accessories mechanically attached to the display housing
    • G06F1/1609—Arrangements to support accessories mechanically attached to the display housing to support filters or lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055—Reflecting element, sheet or layer

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a backlight module and a display device.
  • the backlight module and the display panel are important components of the liquid crystal display.
  • the backlight module includes a light source and a light guide plate for providing a sufficient and uniform planar backlight for the liquid crystal display, and the display panel is used for displaying images.
  • the backlight module is divided into a side-incidence backlight module and a bottom-incidence backlight module.
  • the side-incident type backlight module uses one side of the light guide plate as a light incident surface, and the light strip located at the light incident surface serves as a light source, and the light emitting surface of the light source faces the light incident surface of the light guide plate, and the light emitted by the light source passes through the light guide plate.
  • the bottom incident type backlight module has a bottom surface of the light guide plate as a light incident surface, the light source is located at a bottom surface of the light guide plate, and light enters the light guide plate from the bottom surface of the light guide plate, and is guided from the light guide plate to the light exit surface (upper surface) of the light guide plate. The light is emitted and irradiated onto the liquid crystal panel for display.
  • the power consumption of the display panel is also increasing, which in turn leads to an increase in the amount of heat generated in certain areas of the display panel (for example, an area in which an integrated circuit is provided).
  • a region where the amount of heat generated by the display panel is large is referred to as a heat concentrated region.
  • the area of the display panel provided with the integrated circuit belongs to the heat concentrated area.
  • the temperature in the heat concentrated area of the display panel generally reaches above 42 ° C, which causes the display panel to fail to meet the needs of the touch. Therefore, there is an urgent need to solve the heat dissipation problem in the heat concentrated area of the display panel.
  • the display panel is generally assembled on the backlight module. To solve the heat dissipation problem of the heat concentrated area of the display panel, it is necessary to start from the thermal coupling manner of the display panel and the backlight module, so as to be generated from the heat concentrated area of the display panel. Heat can be quickly dissipated from the backlight module.
  • current backlight module designs are not able to meet this need.
  • a backlight module suitable for thermal coupling with a display panel including:
  • a light guide plate having a light incident surface and a light exit surface
  • a light source configured to allow light emitted therefrom to enter the light guide plate from the light incident surface and exit the light guide plate from the light exit surface to illuminate the display panel;
  • a heat sink configured to partially house the light guide plate and the light source
  • a heat conducting device disposed between the heat sink and the display panel to conduct heat generated from the display panel to the heat sink.
  • the heat dissipating member includes a bottom surface for supporting the light guide plate, a side surface substantially parallel to the light incident surface, and a top surface disposed on the light emitting surface, the bottom surface, the side surface and the top surface of the heat dissipating member together
  • a U-shaped bent structure is defined, the U-shaped bent structure partially covering the bottom surface of the light guide plate, the light incident surface, and the light exit surface adjacent to the light incident surface side.
  • the backlight module further includes a frame for supporting the display panel, and is sleeved on a peripheral portion of the light guide plate that is not covered by the U-shaped bent structure.
  • a top surface height of the frame in a thickness direction of the light guide plate is greater than a top surface height of the U-shaped bent structure.
  • the thickness of the heat conducting device is approximately the difference between the height of the top surface of the frame and the height of the top surface of the U-shaped bent structure.
  • the heat transfer device includes a filling member and a heat conductive member on a top surface of the U-shaped bent structure, the heat conductive member including: a surface of the filling member facing away from the U-shaped bent structure a first segment on the top surface of the U-shaped bent structure and disposed side by side with the filling member; and a third portion between the first portion and the second portion a section, wherein the first section is adapted to be in thermal contact with the display panel, the second section being adapted to be in thermal contact with the U-bend structure.
  • the thermally conductive member includes a plurality of thermally conductive strips on a position of the plurality of thermally conductive strips corresponding to a position where a heat concentrated region of the display panel is located.
  • the heat conductive member is a heat conductive pad
  • the heat sink includes a metal
  • the filling member is an adhesive tape
  • a side of the thermal pad for thermal contact with the display panel is coated with a thermal adhesive layer, one of the thermal pad for thermal contact with the U-bend structure The side is coated with a layer of thermal adhesive.
  • the adhesive tape is a double-sided adhesive tape coated on both sides with a glue layer, comprising two adhesive layers and a PET layer sandwiched between the two adhesive layers, the two adhesive layers respectively Bonding with the thermal pad and the U-bend structure.
  • the adhesive tape is a single-sided adhesive tape coated on one side with a rubber layer, comprising a PET layer and a glue layer bonded to the U-shaped bent structure, the PET layer and the adhesive layer The thermal conductive adhesive layer of the thermal pad is bonded.
  • the thermally conductive adhesive layer of the thermal pad is a colloid doped with highly thermally conductive ceramic particles.
  • the colloid comprises at least one of the following materials: glass fiber and acrylic pressure sensitive adhesive; and an acrylic polymer and a silicone adhesive.
  • the thermal pad comprises at least one of the following materials: a thermally conductive rubber; a thermally conductive silicone; and a thermally conductive ceramic.
  • the present disclosure also provides a display device including the backlight module and a display panel thermally coupled to the backlight module.
  • FIG. 1 is a partial structural view of a backlight module and a display panel thereon according to an embodiment of the present disclosure
  • Figure 2 is a schematic partial cross-sectional view of B-B of Figure 1, with the display panel and heat conducting means omitted for clarity and the introduction of a frame not shown in Figure 1;
  • FIG. 3 is a partial structural schematic view of a heat conducting device in a backlight module according to an embodiment of the present disclosure
  • FIG. 4 is a partial structural view of a backlight module and a display panel thereon, according to an embodiment of the present disclosure
  • Fig. 5 schematically shows a cross-sectional view of A-A in Fig. 4.
  • a backlight module includes a light guide plate 6, a light source 7, a heat sink 8 and a heat conducting device 3.
  • the light source 7 is disposed adjacent to the light incident surface 61 of the light guide plate 6.
  • the light incident surface 61 is an upright side surface of the light guide plate 6.
  • the light emitting surface of the light source 7 faces the light incident surface 61 of the light guide plate 6, and the light emitted by the light source 7 is guided. After the light guide 6 is guided, it is emitted from the light-emitting surface 62 (upper surface in FIG. 1) of the light guide plate 6, and is irradiated onto the display panel 5 for display.
  • the heat conducting device 3 (including the filling member 1 and the heat conducting member 2) as a whole is a good conductor of heat, and rapidly transfers the heat generated by the display panel 5 to the heat sink 8, and then dissipates into the surrounding environment to quickly cool the display panel 5. .
  • the light guide plate 6 has a substantially parallelepiped shape and has an upright light incident surface 61 and a light exit surface 62 and a bottom surface 63 opposed to each other. It should be noted that, for the sake of brevity, the side-incident backlight module is taken as an example in FIG. 1 , but it should be understood that the backlight module of the present disclosure may also be a bottom-incident backlight module, and only FIG. 1 is needed.
  • the light source 7 located at the light incident surface 61 of the light guide plate 6 may be moved to the bottom surface 63 of the light guide plate 6.
  • the light source 7 can be a cold cathode fluorescent lamp (CCFL) or an LED strip.
  • the light source 7 is configured such that light emitted therefrom enters the light guide plate from the light incident surface 61 of the light guide plate 6, and after being homogenized and mixed inside the light guide plate 6, exits the light guide plate 6 from the light exit surface 62 of the light guide plate 6 to The display panel 5 is illuminated to perform display.
  • CCFL cold cathode fluorescent lamp
  • the heat sink 8 is made of a hot, good conductor material, such as a metal (eg, iron) having a certain strength and stiffness.
  • the heat sink 8 dissipates heat generated by the display panel 5 to the surrounding environment in addition to heat conduction by the heat conducting device 3, and is also used to support the light guide plate 6 and the light source 7, and the bottom surface 81 thereof will be used from the light guide plate.
  • the light escaping from the bottom surface 63 of the 6 is re-reflected back into the light guide plate 6 to improve the utilization of light.
  • the shape of the heat sink 8 on the light incident surface 61 side of the light guide plate 6 is substantially a U-shaped bent shape (hereinafter referred to as a U-shaped bent structure) that opens toward the light incident surface 61, and functions as a light source as much as possible. The emitted light is reflected back into the light guide plate to improve the utilization efficiency of the light.
  • the heat sink 8 is configured to partially house the light guide plate 6 and the light source 7. As shown in FIG. 1 , the heat sink 8 includes a bottom surface 81 for supporting the light guide plate 6 , an upright side surface 82 substantially parallel to the light incident surface 61 of the light guide plate 6 , and a light emitting surface 62 disposed on the light guide surface 6 of the light guide plate 6 . Top surface 83.
  • the top surface 83 of the heat sink 8 extends along the light incident surface 61 perpendicular to the light guide surface 6 on the light exit surface 62 of the light guide plate 6 by a distance smaller than the bottom surface 81 of the heat sink 8 along the light incident surface perpendicular to the light guide plate 6.
  • the direction of 61 extends over the bottom surface 63 of the light guide plate 6. In other words, the coverage area of the top surface 83 of the heat sink 8 covering the light exit surface 62 of the light guide plate 6 is smaller than the coverage area of the bottom surface 81 of the heat sink 8 covering the bottom surface 63 of the light guide
  • the bottom surface 81, the side surface 82 and the top surface 83 of the heat dissipating member 8 together define a U-shaped bending structure 85 covering the bottom surface 63 of the light guide plate 6, the light incident surface 61 and the adjacent light incident surface. A portion of the exit surface 62 of 61.
  • the heat transfer device 3 comprises a filling member 1 and a heat conducting member 2 on the top surface 83 of the U-bend structure.
  • the heat conducting device 3 is disposed between the heat sink 8 and the display panel 5 to conduct heat generated from the display panel 5 to the heat sink 8 .
  • the introduction of the filling member 1 is to reduce the production cost of the heat-conducting device 3, since the price of the filling member 1 is much lower than that of the heat-conducting member 2 (especially the thermal conductive rubber 21), which is usually made of a hot poor conductor material, such as a tape. .
  • the tape is a poor conductor of heat
  • the intervention of the tape is not conducive to heat dissipation and heat conduction between the display panel and the U-shaped bent structure, but it can significantly reduce the cost, and at the same time due to the heat conductive member 2 (especially, it also includes a thermal adhesive 21) is made of a good good conductor material, so the heat conducting device 3 including the filling member 1 and the heat conducting member 2 according to the present disclosure can satisfy not only heat dissipation and heat conduction between the display panel 5 and the U-shaped bending structure 85. Requirements, also have cost advantages, and have good market competitiveness.
  • the heat conducting member 2 of the heat conducting device 3 comprises: a first section 21 on a surface of the filling member 1 facing away from the U-shaped bending structure 85; on the top surface 83 of the U-shaped bending structure 85 and a second section 22 disposed side by side with the filling member 1; and a third section 23 interposed between the first section 21 and the second section 22, wherein the first section 21 is adapted to The display panel 5 is in thermal contact and the second section 22 is adapted to be in thermal contact with the top surface 83 of the U-bend structure 85.
  • the backlight module further includes a frame 9 for supporting the display panel 5, and is sleeved on the light guide plate 6 without being wrapped by the U-shaped bending structure 85.
  • the height of the top surface of the frame 9 is greater than the height of the top surface 83 of the U-shaped bent structure 85 in the thickness direction of the light guide plate 6.
  • the difference in height between the top surface of the frame 9 and the top surface 83 of the U-shaped bent structure 85 is referred to as a step.
  • a heat conducting device 3 is provided (only shown in FIG. 2 for the sake of simplicity).
  • the filling member 1 is not shown as the heat conducting member 2).
  • the thickness of the heat conducting device 3 is approximately the difference between the height of the top surface of the frame 9 and the height of the top surface 83 of the U-shaped bending structure 85.
  • the step difference between the top surface of the frame 9 and the top surface 83 of the U-shaped bent structure 85 is well filled, so that the display panel 5 can be smoothly and smoothly joined together with the heat conducting means 3 by the frame 9. Supporting, the display panel 5 is effectively protected, delaying the life of the display panel 5.
  • the heat conducting member 2 of the heat conducting device 3 comprises a plurality of heat conducting strips (in the partial heat conducting device 3 shown in FIG. 3, having three heat conducting strips)
  • the position of the plurality of heat conducting strips on the filling member 1 corresponds to a position where a heat concentrated area of the display panel 5 (for example, an area where an integrated circuit is located).
  • the thermally conductive member 2 is, for example, a thermally conductive pad made of a hot, good conductor material.
  • the thermal pad is made of at least one of the following materials: a thermally conductive rubber; a thermally conductive silicone; and a thermally conductive ceramic.
  • thermal pad 21 of the thermal pad is a colloid doped with highly thermally conductive ceramic particles.
  • the colloid comprises at least one of the following materials: glass fibers and acrylic pressure sensitive adhesives; and acrylic polymers and silicone adhesives.
  • the filling member 1 is an adhesive tape
  • the adhesive tape is a double-sided adhesive tape coated on both sides with a glue layer.
  • the two adhesive layers 12, 13 are bonded to the thermal pad and the U-shaped bent structure 85, respectively .
  • the filling member 1 is an adhesive tape
  • the adhesive tape is a single-sided adhesive tape coated with a rubber layer on one side, which comprises a PET layer 11 and a lower rubber layer 12 .
  • the adhesive layer 12 is bonded to the U-shaped bent structure 85, and the PET layer 11 is bonded to the thermal conductive adhesive layer 21 of the thermal pad.
  • the heat conducting means 3 is provided. Since the heat conducting device 3 comprises a thermal pad made of a hot good conductor material, in particular the thermal pad comprises a thermally conductive adhesive layer 21 made of a hot, good conductor material, the heat generated in the display panel 5 is quickly passed. The heat conducting device 3 is conducted to the heat sink 8 and is dissipated from the heat sink into the surrounding environment.
  • the temperature of the heat concentrated region of the display panel 5 can be lowered from 42 ° C or more to 40 ° C or less, so that a human hand can be placed on the display panel 5 for touch, such a display panel 5 can Meet the requirements of acting as a touch screen.
  • the heat conductive member 2 may be provided only in the heat concentration region of the display panel 5, and the heat conductive member 2 may not be provided in the non-heat concentrated region of the display panel 5, and instead, an inexpensive filling member may be used in the non-heat concentrated region of the display panel 5. 1 (such as double-sided tape) instead. Further reducing the production cost of the entire backlight module.
  • the backlight module can be prevented from being detached from the display panel 5 during transportation or use, that is, the fixing of the display panel 5 is achieved, and the stability of the entire display device is improved.
  • the specific heat conducting device 3 including the filling member 1 and the heat conducting member 2, while the display panel 5 and the heat sink 8 are well thermally coupled the experiment proves to be beneficial to prevent light leakage and display brightness of the display device. Uniform (mura) or the phenomenon of spotting.
  • the present disclosure also provides a display device including the above-described backlight module and a display panel 5 thermally coupled to the backlight module.
  • a heat transfer device 3 is provided at a portion corresponding to a heat concentration region of the display panel 5, and the heat transfer device 3 has a heat conductive pad therein to quickly transfer heat of the display panel to the heat sink.
  • the problem that the display panel cannot meet the use requirements of the touch due to poor heat dissipation and high temperature of the display panel itself is solved.
  • the embodiment of the present disclosure further provides a display device, including a display panel, and further comprising any one of the above embodiments.
  • the term “substantially” as used herein such as in “substantially all” or in “consisting essentially of.”
  • the term “substantially” may also include embodiments having “entirely”, “completely”, “all”, and the like.
  • the adjective is also substantially removable.
  • the term “substantially” may also relate to 90% or higher, such as 95% or higher, particularly 99% or higher, even more particularly 99.5% or higher, including 100%.
  • the term “comprising” also includes the embodiment in which the term “comprising” means “consisting of.”
  • the term “and/or” particularly relates to one or more of the items mentioned before and after "and/or”.
  • the phrase “item 1 and/or item 2" and similar phrases may relate to one or more of items 1 and 2.
  • the term “comprising” may mean “consisting of” in one embodiment, but may also mean “including at least the defined species and optionally one or more other species” in another embodiment.
  • the invention is further applicable to apparatus comprising one or more of the characterizing features described in the specification and/or shown in the drawings.
  • the invention further relates to a method or process comprising one or more of the characterizing features described in the specification and/or shown in the drawings.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Planar Illumination Modules (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

一种适于与显示面板（5）进行热耦接的背光模组，包括：导光板（6），其具有入光面（61）和出光面（62）；光源（7），其配置成使得从其发出的光从入光面（61）进入导光板（6）内并从出光面（62）离开导光板（6）以照射到显示面板（5）上；散热件（8），其配置成部分地容纳导光板（6）和光源（7）；以及导热装置（3），其设置于散热件（8）与显示面板（5）之间以将从显示面板（5）产生的热传导到散热件（8）。背光模组能够将从显示面板（5）的热集中区域产生的热量快速地耗散出去。

Description

背光模组及显示装置
相关申请
本申请要求保护在2017年10月31日提交的申请号为201711048279.0的中国专利申请的优先权，该申请的全部内容以引用的方式结合到本文中。
技术领域
本公开涉及显示技术领域，特别涉及一种背光模组及显示装置。
背景技术
背光模组和显示面板是液晶显示器的重要组成部分，其中背光模组包括光源和导光板，用于为液晶显示器提供充足及均匀的平面状背光，显示面板用于显示图像。通常，背光模组分为侧面入射式背光模组(side-incidence backlight module)和底面入射式背光模组(bottom-incidence backlight module)。侧面入射式背光模组以导光板的一个侧面作为入光面，以位于入光面处的灯条作为光源，光源的发光面正对着导光板的入光面，光源发出的光经由导光板的引导后从导光板的出光面(上表面)出射，照射到液晶面板上以进行显示。底面入射式背光模组以导光板的底面作为入光面，光源位于导光板底面处，光从导光板的底面进入导光板内，经过导光板的引导后从导光板的出光面(上表面)出射，照射到液晶面板上以进行显示。
随着显示分辨率的逐渐增大，显示面板的功耗也越来越大，进而导致显示面板的某些区域(例如设有集成电路的区域)的发热量也越来越大。以下，为了叙述方便，将显示面板的发热量较大的区域称为热集中区域。例如显示面板的设有集成电路的区域隶属于热集中区域。
工作时，显示面板的热集中区域的温度一般都会达到42℃以上，造成显示面板无法满足触摸的使用需求。因此，亟需解决显示面板的热集中区域的散热问题。众所周知，显示面板一般组装在背光模组上，要解决显示面板的热集中区域的散热问题，就得从显示面板与背光模组的热耦接方式入手，使得从显示面板的热集中区域产生的热量能够快速地从背光模组耗散出去。然而，目前的背光模组设计无法满足这 一需求。
因此，亟需提供一种改进的背光模组设计，其能够将从显示面板的热集中区域产生的热量快速地从背光模组耗散出去。
公开内容
有鉴于此，本公开提供一种适于与显示面板进行热耦接的背光模组，包括：
导光板，其具有入光面和出光面；
光源，其配置成使得从其发出的光从该入光面进入导光板内并从该出光面离开导光板以照射到该显示面板上；
散热件，其配置成部分地容纳该导光板和该光源；以及
导热装置，其设置于该散热件与该显示面板之间以将从该显示面板产生的热传导到该散热件。
根据本公开的一个方面，该散热件包括用于支撑该导光板的底面、与该入光面基本平行的侧面和设置于出光面上的顶面，该散热件的底面、侧面和顶面一起限定了一U形弯折结构，该U形弯折结构部分地包覆导光板的底面、入光面以及邻近入光面侧的出光面。
根据本公开的一个方面，该背光模组还包括用于支撑该显示面板的框架，其套设在所述导光板的未被该U形弯折结构包覆的周边部分上。
根据本公开的一个方面，在所述导光板厚度方向上所述框架的顶面高度大于该U形弯折结构的顶面高度。
根据本公开的一个方面，所述导热装置的厚度大约为所述框架的顶面高度与该U形弯折结构的顶面高度的差值。
根据本公开的一个方面，所述导热装置包括位于该U形弯折结构的顶面上的填充构件和导热构件，该导热构件包括：位于所述填充构件背离所述U形弯折结构的表面上的第一部段；位于该U形弯折结构的顶面上并于该填充构件并排设置的第二部段；以及介于该第一部段与该第二部段之间的第三部段，其中该第一部段适于与所述显示面板热接触，该第二部段适于与所述U形弯折结构热接触。
根据本公开的一个方面，所述导热构件包括多个导热条，该多个导热条在该填充构件上的位置对应于所述显示面板的热集中区域所在 的位置。
根据本公开的一个方面，所述导热构件为导热垫，所述散热件包括金属，所述填充构件为胶带。
根据本公开的一个方面，所述导热垫的用于与所述显示面板热接触的一侧涂覆有导热胶层，所述导热垫的用于与所述U形弯折结构热接触的一侧涂覆有导热胶层。
根据本公开的一个方面，所述胶带为双面都涂覆有胶层的双面胶带，其包括两个胶层和夹于该两个胶层之间的PET层，该两个胶层分别与所述导热垫和所述U形弯折结构黏合。
根据本公开的一个方面，所述胶带为单面涂覆有胶层的单面胶带，其包括PET层和一个胶层，该胶层与所述U形弯折结构黏合，该PET层与所述导热垫的导热胶层黏合。
根据本公开的一个方面，所述导热垫的导热胶层为掺杂有高导热陶瓷粒子的胶体。
根据本公开的又一个方面，所述胶体包含以下材料中的至少一种：玻璃纤维和丙烯酸压敏胶；以及压克力聚合物和有机硅胶粘剂。
根据本公开的再一个方面，所述导热垫包含以下材料中的至少一种：导热橡胶；导热硅胶；以及导热陶瓷。
本公开还提供一种显示装置，其包括上述的背光模组和与所述背光模组热耦接的显示面板。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的实施例。需要强调的是，附图并不一定按照比例绘制，相反一些元件大小或尺寸比例关系可能被夸大以突出显示本发明的创新之处。
图1为根据本公开一个实施例的背光模组以及位于其上显示面板的局部结构示意图；
图2示意性地示出了图1中B-B的局部截面图，其中为清楚起见省略了显示面板和导热装置，并引入了图1中未示出的框架；
图3为根据本公开一个实施例的背光模组中的导热装置的局部结构示意图；
图4为根据本公开一个实施例的背光模组以及位于其上显示面板的局部结构示意图；以及
图5示意性地示出了图4中A-A的截面图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。一些实施例可以通过使用表达“一个实施例”或“一些实施例”连同它们的派生词而被描述。这些术语是指结合实施例描述的特定特征、结构或特性被包括在至少一个实施例中。在申请书的各个地方出现的词组“在一个实施例中”不一定必须全都指同一个实施例。
除非另有限定，用在本说明书中的所有技术和科学术语具有与本公开所属的领域中熟练的技术人员所通常理解的意义相同的意义。词语“第一”、“第二”、“第三”等等仅仅被用作为标签以对各元件进行区分，并不打算对它们的对象施加数值和次序要求。应理解，如此使用的术语在适当情形下是可互换的，并且本文所描述的本发明的实施例能够按与本文所描述或示出不同的顺序进行操作。
请一并参阅图1和图2，根据本公开一个实施例的背光模组包括导光板6、光源7、散热件8以及导热装置3。光源7邻近导光板6的入光面61设置，入光面61为导光板6的一个直立侧面，光源7的发光面正对着导光板6的入光面61，光源7发出的光经由导光板6的引导后从导光板6的出光面62(图1中的上表面)出射，照射到显示面板5上以进行显示。导热装置3(包括填充构件1和导热构件2)整体作为热的良导体，迅速地将显示面板5所产生的热传导到散热件8上，进而耗散到周围环境中以便为显示面板5快速降温。
导光板6大致呈平行六面体形状，其具有直立的入光面61和彼此相对的出光面62和底面63。需要说明的是，为了简明起见，图1中以 侧面入射式背光模组为范例来进行说明，但是应当理解，本公开的背光模组也可以是底面入射式背光模组，只需将图1中位于导光板6的入光面61处的光源7移到导光板6的底面63处即可。
光源7可以是冷阴极荧光灯(CCFL)，也可以是LED条带。光源7配置成使得从其发出的光从该导光板6的入光面61进入导光板内，经过在导光板6内部进行均匀化混合之后从该导光板6的出光面62离开导光板6以照射到显示面板5上以进行显示。
散热件8由热的良导体材料制成，例如为具有一定强度和刚度的金属(例如为铁)。散热件8除了通过导热装置3的热传导而迅速将显示面板5所产生的热耗散到周围环境中之外，其还用于支撑导光板6和光源7，并利用其底面81将从导光板6的底面63逸出的光重新反射回到导光板6中以提高光的利用率。换言之，散热件8在导光板6的入光面61一侧的形状大致呈开口朝向入光面61的U形弯折形状(以下称为U形弯折结构)，其作用是尽可能将光源发出的光反射回导光板中，以提高光的利用效率。
散热件8配置成部分地容纳该导光板6和该光源7。如图1所示，散热件8包括用于支撑该导光板6的底面81、与该导光板6的入光面61基本平行的直立侧面82和设置于该导光板6的出光面62上的顶面83。散热件8的顶面83沿着垂直于导光板6的入光面61的方向在导光板6出光面62上延伸的距离小于散热件8的底面81沿着垂直于导光板6的入光面61的方向在导光板6的底面63上延伸的距离。换言之，散热件8的顶面83覆盖在导光板6的出光面62上的覆盖面积小于散热件8的底面81覆盖在导光板6的底面63上的覆盖面积。
该散热件8的底面81、侧面82和顶面83一起限定了一U形弯折结构85，该U形弯折结构85包覆导光板6的底面63、入光面61以及邻近入光面61的部分出光面62。
导热装置3包括位于该U形弯折结构的顶面83上的填充构件1和导热构件2。导热装置3设置于该散热件8与该显示面板5之间以将从该显示面板5产生的热传导到该散热件8。填充构件1的引入是为了降低导热装置3的生产成本，因为填充构件1的价格相较于导热构件2(尤其是导热胶21)低很多，其通常由热的不良导体材料制成，例如胶带。虽然胶带是热的不良导体，胶带的介入并不利于显示面板与U 形弯折结构之间的散热和导热，但是其能显著降低成本，同时由于导热构件2(尤其是其还包括有导热胶21)是由热的良导体材料制成，所以根据本公开的包含有填充构件1和导热构件2的导热装置3不但能够满足显示面板5与U形弯折结构85之间的散热和导热的要求，还具有成本优势，具有很好市场竞争力。
该导热装置3的导热构件2包括：位于所述填充构件1的背离所述U形弯折结构85的表面上的第一部段21；位于该U形弯折结构85的顶面83上并于该填充构件1并排设置的第二部段22；以及介于该第一部段21与该第二部段22之间的第三部段23，其中该第一部段21适于与所述显示面板5热接触，该第二部段22适于与所述U形弯折结构85的顶面83热接触。
根据本公开的一个实施例，请参阅图2，该背光模组还包括用于支撑该显示面板5的框架9，其套设在所述导光板6的未被该U形弯折结构85包覆的周边部分上。通常，在所述导光板6的厚度方向上，所述框架9的顶面高度大于该U形弯折结构85的顶面83的高度。以下为了叙述方便，将框架9的顶面与U形弯折结构85的顶面83之间的高度差称为段差。由于段差的存在，使得该显示面板5不能很平稳地支撑在框架9上，容易造成显示面板5的破坏，甚至有碎裂的风险。在根据本公开一个实施例的背光模组中，在该U形弯折结构85的顶面83上对应于该段差的区域中，设置有导热装置3(图2中为了简明起见仅示出了填充构件1而未示出导热构件2)。可选地，所述导热装置3的厚度大约为所述框架9的顶面高度与该U形弯折结构85的顶面83高度的差值。通过设置导热装置3，很好地填平了框架9的顶面与U形弯折结构85的顶面83之间的段差，从而能够通过框架9连同导热装置3一起很平稳地对显示面板5进行支撑，有效地保护了显示面板5，延迟了显示面板5的寿命。
根据本公开的一个实施例，请参阅图3-图5，该导热装置3的导热构件2包括多个导热条(在图3中所示出的局部导热装置3中，具有三个导热条)，该多个导热条在该填充构件1上的位置对应于所述显示面板5的热集中区域(例如集成电路所在的区域)所在的位置。导热构件2例如为由热的良导体材料制成的导热垫。所述导热垫由以下材料中的至少一种材料制成：导热橡胶；导热硅胶；以及导热陶瓷。
进一步地，所述导热垫的用于与所述显示面板5热接触的一侧涂覆有导热胶层21，并且所述导热垫的用于与所述U形弯折结构85的顶面83热接触的一侧也涂覆有导热胶层21(参见图5)。所述导热垫的导热胶层21为掺杂有高导热陶瓷粒子的胶体。例如，所述胶体包含以下材料中的至少一种：玻璃纤维和丙烯酸压敏胶；以及压克力聚合物和有机硅胶粘剂。
请一并参阅图1、图2、图4和图5，根据本公开的一些实施例，所述填充构件1为胶带，所述胶带为双面都涂覆有胶层的双面胶带，其包括两个胶层12、13和夹于该两个胶层12、13之间的PET层11，该两个胶层12、13分别与所述导热垫和所述U形弯折结构85黏合。
请参阅图3，根据本公开的一个实施例，所述填充构件1为胶带，所述胶带为单面涂覆有胶层的单面胶带，其包括PET层11和一个下胶层12，该胶层12与所述U形弯折结构85黏合，该PET层11与所述导热垫的导热胶层21黏合。
组装时，先将光源7和导光板6组装到散热件8中，使得光源7和导光板6部分地被散热件8所收容。然后再将框架9套设在所述导光板6的未被该U形弯折结构85包覆的周边部分上。最后，在散热件8的U形弯折结构85的顶面83上对应于上述段差的区域中，设置导热装置3。由于导热装置3包含有由热的良导体材料制成的导热垫，尤其导热垫包含由热的良导体材料制成的导热胶层21，因此，显示面板5中所产生的热被快速地通过导热装置3传导到散热件8，并从散热件耗散到周围环境中。
实验证明，通过设置导热装置3，能够使得显示面板5的热集中区域的温度从42℃以上降至40℃以下，使得人的手能够放在显示面板5上进行触摸，这样的显示面板5能够满足充当触控屏的要求。
作为选择，可仅仅在显示面板5的热集中区域设置导热构件2，而在显示面板5的非热集中区域不设置导热构件2，取而代之，在显示面板5的非热集中区域用廉价的填充构件1(例如双面胶)来代替。进一步降低整个背光模组的生产成本。
另一方面，通过双面胶的使用，可以防止背光模组在运输或使用时与显示面板5发生脱离，即实现了对显示面板5的固定，提高整个显示装置的稳定性。
再一方面，上述包含填充构件1和导热构件2的特定导热装置3，在将显示面板5与散热件8很好地热耦接的同时，实验证明还有利于防止显示装置产生漏光和显示亮度不均匀(mura)或产生斑痕的现象。
本公开还提供一种显示装置，其包括上述的背光模组和与所述背光模组热耦接的显示面板5。
在根据本公开的一个方面所提供的显示装置中，与显示面板5的热集中区域相对应的部位设有导热装置3，导热装置3中具有导热垫，将显示面板的热量迅速传递到散热件8中，解决了由于显示面板本身散热较差、温度较高导致显示面板无法满足触摸的使用要求的问题。
本公开实施例还提供了一种显示装置，包括显示面板，还包括上述实施例中的任意一种背光模组。
本领域技术人员将理解本文中(诸如在“基本上所有”中或在“基本上由……组成”中)的术语“基本上”。术语“基本上”还可包括具有“整个地”、“完全地”、“所有”等的实施例。因此，在实施例中，形容词基本上也是可移除的。在适用的情况下，术语“基本上”还可涉及90％或更高、诸如95％或更高、特别地99％或更高、甚至更特别地99.5％或更高、包括100％。术语“包括”还包括其中术语“包括”意味着“由……组成”的实施例。术语“和/或”特别地涉及“和/或”之前和之后所提及项目中的一个或多个。比如，短语“项目1和/或项目2”和类似短语可涉及项目1和项目2中的一个或多个。术语“包括”可在一个实施例中是指“由……组成”，但可在另一个实施例中也指“包含至少所限定种类并且可选地包含一个或多个其他种类”。
除其他事项之外，本文的系统、设备和装置在操作过程中进行描述。如本领域技术人员将清楚的，本发明不限于操作方法和操作中的装置。
应注意，以上提及的实施例说明而不是限制本发明，并且本领域技术人员将能够在不背离所附权利要求的范围的情况下设计许多替代实施例。在权利要求中，放置在括号之间的任何参考标记不应被解释为限制权利要求。动词“以包括”及其词形变化的使用并不排除存在与权利要求中所陈述的那些不同的元件或步骤。在元件之前的冠词“一”或“一个”并不排除存在多个这种元件。本发明可借助于包括若干不同元件的硬件、以及借助于适当编程的计算机来实现。在枚举若干器件的装置权利要求中，这些装置中的若干个可由同一个硬件项体现。 在相互不同的从属权利要求中叙述某些措施的纯粹事实并不指示不能有利地使用这些措施的组合。
本发明进一步适用于包括本说明书中所描述和/或附图中所示出的表征特征中的一个或多个的装置。本发明进一步涉及包括本说明书中所描述和/或附图中所示出的表征特征中的一个或多个的方法或过程。
本专利中所论述的各种方面可组合起来，以便提供另外的优点。另外，本领域技术人员将理解实施例可组合起来，并且多于两个实施例也可组合起来。此外，一些特征可形成一个或多个分案申请的基础。
本文中应用了具体个例对本公开的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本公开的方法及其核心思想；同时，对于本领域的一般技术人员，依据本公开的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本公开的限制。

Claims (15)

  1. 一种适于与显示面板进行热耦接的背光模组，包括：
    导光板，其具有入光面和出光面；
    光源，其配置成使得从其发出的光从该入光面进入导光板内并从该出光面离开导光板以照射到该显示面板上；
    散热件，其配置成部分地容纳该导光板和该光源；以及
    导热装置，其设置于该散热件与该显示面板之间以将从该显示面板产生的热传导到该散热件。
  2. 根据权利要求1所述的背光模组，其中该散热件包括用于支撑该导光板的底面、与该入光面基本平行的侧面和设置于出光面上的顶面，该散热件的底面、侧面和顶面一起限定了一U形弯折结构，该U形弯折结构部分地包覆导光板的底面、入光面以及邻近入光面侧的出光面。
  3. 根据权利要求2所述的背光模组，还包括用于支撑该显示面板的框架，其套设在所述导光板的未被该U形弯折结构包覆的周边部分上。
  4. 根据权利要求3所述的背光模组，其中在所述导光板厚度方向上所述框架的顶面高度大于该U形弯折结构的顶面高度。
  5. 根据权利要求4所述的背光模组，其中所述导热装置的厚度大约为所述框架的顶面高度与该U形弯折结构的顶面高度的差值。
  6. 根据权利要求5所述的背光模组，其中所述导热装置包括位于该U形弯折结构的顶面上的填充构件和导热构件，该导热构件包括：位于所述填充构件背离所述U形弯折结构的表面上的第一部段；位于该U形弯折结构的顶面上并于该填充构件并排设置的第二部段；以及介于该第一部段与该第二部段之间的第三部段，其中该第一部段适于与所述显示面板热接触，该第二部段适于与所述U形弯折结构热接触。
  7. 根据权利要求6所述的背光模组，其中所述导热构件包括多个导热条，该多个导热条在该填充构件上的位置对应于所述显示面板的热集中区域所在的位置。
  8. 根据权利要求6所述的背光模组，其中所述导热构件为导热垫，所述散热件包括金属，所述填充构件为胶带。
  9. 根据权利要求8所述的背光模组，其中所述导热垫的用于与所述显示面板热接触的一侧涂覆有导热胶层，所述导热垫的用于与所述U形弯折结构热接触的一侧涂覆有导热胶层。
  10. 根据权利要求8所述的背光模组，其中所述胶带为双面都涂覆有胶层的双面胶带，其包括两个胶层和夹于该两个胶层之间的PET层，该两个胶层分别与所述导热垫和所述U形弯折结构黏合。
  11. 根据权利要求9所述的背光模组，其中所述胶带为单面涂覆有胶层的单面胶带，其包括PET层和一个胶层，该胶层与所述U形弯折结构黏合，该PET层与所述导热垫的导热胶层黏合。
  12. 根据权利要求9所述的背光模组，其中所述导热垫的导热胶层为掺杂有高导热陶瓷粒子的胶体。
  13. 根据权利要求10所述的背光模组，其中所述胶体包含以下材料中的至少一种：玻璃纤维和丙烯酸压敏胶；以及压克力聚合物和有机硅胶粘剂。
  14. 根据权利要求8所述的背光模组，其中所述导热垫包含以下材料中的至少一种：导热橡胶；导热硅胶；以及导热陶瓷。
  15. 一种显示装置，包括：
    如权利要求1-14中任一项所述的背光模组；和
    与所述背光模组热耦接的显示面板。
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