WO2019080381A1 - 软性面板切割设备及软性面板切割方法 - Google Patents

软性面板切割设备及软性面板切割方法

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Publication number
WO2019080381A1
WO2019080381A1 PCT/CN2018/072890 CN2018072890W WO2019080381A1 WO 2019080381 A1 WO2019080381 A1 WO 2019080381A1 CN 2018072890 W CN2018072890 W CN 2018072890W WO 2019080381 A1 WO2019080381 A1 WO 2019080381A1
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WO
WIPO (PCT)
Prior art keywords
laser beam
cutting
flexible panel
laser
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/072890
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English (en)
French (fr)
Inventor
王剑波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2019080381A1 publication Critical patent/WO2019080381A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible panel cutting device and a flexible panel cutting method.
  • laser cutting is an important process technology, and it is necessary to cut the excess film layer at the edge of the product to achieve the required appearance size.
  • the process of laser cutting a soft panel there are many kinds of cutting layers of the soft panel, and different materials of different layers have different transmittance and absorption rate for the laser, so a single type of laser wavelength cannot match all
  • the high absorption rate of the film material, the laser cutting efficiency is affected, and it is necessary to repeatedly cut many times, and repeated cutting will affect the cutting quality of the laser.
  • the object of the present invention is to provide a soft panel cutting device and two soft panel cutting methods to improve laser cutting efficiency without repeated cutting to ensure cutting quality.
  • the invention provides a soft panel cutting method, comprising:
  • the first laser beam and the second laser beam cut the flexible panel along the cutting path.
  • the flexible panel comprises a glass substrate and a first layer and a second layer disposed on the glass substrate, the glass substrate, the first layer and the second layer are opposite to the first laser beam
  • the absorption rate is different from the absorption rate of the second laser beam.
  • the invention provides another soft panel cutting method, comprising:
  • the superimposed first laser beam and the second laser beam cut the flexible panel along the cutting path.
  • the flexible panel comprises a glass substrate and a first layer and a second layer disposed on the glass substrate, the glass substrate, the first layer and the second layer are opposite to the first laser beam
  • the absorption rate is different from the absorption rate of the second laser beam.
  • the first light beam and the second light beam are respectively an ultraviolet light laser beam and a carbon dioxide laser beam.
  • the invention provides a cutting device for cutting a soft panel, comprising: a working platform, a laser source and a bracket, the soft panel being placed on the working platform facing the laser source, the softness a peripheral path of the substrate is provided with a cutting path, the laser source is fixed on the bracket to a cutting path toward a periphery of the flexible substrate, the laser source generates a first laser beam and a second laser beam, the first laser The beam is different from the wavelength of the second laser beam, the first laser beam is focused to a first cutting point on the cutting path, and the second laser beam is focused to a second cutting point on the cutting path, The first cutting point and the second cutting point have a pitch, the first laser beam and the second laser beam cutting the flexible panel along the cutting path; or the first laser beam and The second laser beam is superimposed and focused to a cutting point on the cutting path, and the superposed first laser beam and the second laser beam cut the flexible panel along the cutting path.
  • the working platform is fixed, the laser beam moves; or the working platform moves, the laser beam is fixed.
  • the working platform is connected with a driving portion
  • the driving portion includes a guiding block, a guiding rail, a supporting body and a driving member connected to the supporting body, and the supporting body and the driving member are located on the guiding block,
  • the support body supports the flexible panel, and the guide block slides within the guide rail.
  • the guide block is provided with pulleys on opposite sides, and the pulley slides along the guide rail.
  • the cutting device further comprises control means for controlling activation and deactivation of the drive member and for controlling activation and deactivation of the laser source.
  • the first laser beam generated by the laser source is focused to a first cutting point on the cutting path
  • the second laser beam generated by the laser source is focused to a second cutting point on the cutting path
  • the first laser beam generated by the laser source is superimposed with the second laser beam and focused to a cutting point on the cutting path, and the first laser beam and the second laser beam cut the flexible panel along the cutting path,
  • the high absorption rate of all the cut film layers of the soft panel to different lasers is realized, the laser cutting processing efficiency is improved, and the cutting quality is ensured without repeated cutting.
  • FIG. 1 is a schematic structural view of a cutting device according to an embodiment of the present invention, which includes a soft panel.
  • FIG. 2 is a schematic top plan view of the flexible panel of FIG. 1.
  • FIG. 3 is a schematic cross-sectional structural view of the working platform of FIG. 1.
  • FIG. 4 is a schematic view showing the internal planar structure of the flexible panel of FIG. 1.
  • FIG. 5 is a schematic structural view of a cutting device according to another embodiment of the present invention, which includes a soft panel.
  • FIG. 6 is a schematic top plan view of the flexible panel of FIG. 5.
  • FIG. 7 is a schematic flow chart of a method for cutting a flexible panel according to an embodiment of the present invention.
  • FIG. 8 is a schematic flow chart of a method for cutting a flexible panel according to another embodiment of the present invention.
  • the present invention provides a cutting apparatus for cutting a flexible panel 10, including: a movable working platform 20, a laser source 30, and a bracket 40, wherein the flexible panel 10 is disposed To the laser source 30 on the working platform 20, a peripheral edge of the flexible substrate 10 is provided with a cutting path 50, and the laser source 30 is fixed on the bracket 40 toward the periphery of the flexible substrate 10.
  • the laser source 30 generates a first laser beam 301 and a second laser beam 302, the first laser beam 301 focusing to a first cutting point on the cutting path 50, the second laser beam 302 Focusing on a second cutting point on the cutting path 50, the first cutting point and the second cutting point having a pitch along which the first laser beam 301 and the second laser beam 302 are cut
  • the path 50 cuts the flexible panel 10.
  • the first laser beam 301 and the second laser beam 302 are respectively an ultraviolet laser beam and a carbon dioxide laser beam, that is, the first laser beam 301 and the second laser beam 302 have different wavelengths.
  • One end of the bracket 40 supporting the laser source 30 is provided with a fixing seat, and the laser source 30 is disposed on the fixing base.
  • the ultraviolet laser beam and the carbon dioxide laser beam of the present invention match the high absorption rate of all the cutting layers of the flexible panel 10 to different lasers, thereby improving the efficiency of laser cutting processing, and eliminating the need for repeated cutting to ensure the cutting quality.
  • the cutting path 50 of the flexible panel 10 includes a cutting path in a first direction and a cutting path in a second direction.
  • the first direction is a direction parallel to a long side of the flexible panel 10
  • the second direction is a direction perpendicular to the first direction.
  • the angle between the directions is close to 90°, but not 90°, but the angle between the first direction and the second direction should be acceptable to those skilled in the art, and the angle should not be Implementations that affect the objects of the embodiments of the present invention.
  • the working platform 20 is connected with a driving portion 60 .
  • the driving portion 60 includes a guiding block 601 , a guiding rail 602 , a pulley 603 , a supporting body 604 , and the supporting body.
  • a driving member of the body 604, the supporting body 604 and the driving member are located on the guiding block 601, the supporting body 604 supports the flexible panel 10, and the pulley 603 and the guiding block 601 and the
  • the guide rail 602 is slidably connected.
  • the pulleys 603 are respectively disposed on the left and right sides of the guide block 601, and the guide rails 602 are disposed in parallel at the end of the guide block 601 to which the pulley 603 is connected, and the extending direction is parallel to the traveling direction.
  • the pulley 603 is slidably mounted on the guide rail 602 along the guide rail 602.
  • the guide block 601 slides directly in the guide rail 602, and the present invention is not limited thereto as long as the object of the present invention can be achieved.
  • the driving member drives the support body 604 to move, thereby driving the flexible panel 10 to move.
  • the drive member is a cylinder or a motor.
  • the flexible panel 10 cut by the first laser beam 301 and the second laser beam 302 includes a glass substrate 101 and a first layer 102 and a second layer disposed on the glass substrate 101. 103.
  • An array substrate 104 is disposed on the first layer 102.
  • the array substrate 104 is provided with a device light emitting diode 105.
  • the organic light emitting diode 105 is encapsulated with an encapsulation layer 106.
  • the opposite sides of the encapsulation layer 106 extend downward.
  • the second layer 103 is laminated on the encapsulation layer 106.
  • the first layer 102 is a polyimide substrate
  • the second layer 103 is a protective film.
  • the absorptivity of the glass substrate 101, the first layer 102, and the second layer 103 to the first laser beam 301 is different from the absorption rate of the second laser beam 302.
  • the absorption rate of the ultraviolet light laser beam by the first layer 102 is greater than the absorption rate of the carbon dioxide laser beam.
  • the first layer 102 can absorb 80% of the ultraviolet laser beam, and the first layer 102 can absorb 20% of the carbon dioxide laser beam, so during the cutting process of the flexible panel 10, the ultraviolet The cutting of the first layer 102 can be accomplished by a laser beam of light.
  • the glass substrate 101 and the second layer 103 have an absorption rate of the carbon dioxide laser beam greater than that of the ultraviolet laser beam.
  • the absorption rate of the carbon dioxide laser beam by the glass substrate 101 is 98%, the absorption rate of the ultraviolet light laser beam by the glass substrate 101 is 15%; and the second layer 103 is opposite to the carbon dioxide laser beam.
  • the absorption rate is 95%, and the absorption rate of the second layer 103 to the ultraviolet laser beam is 5%. Therefore, the carbon dioxide laser beam can complete the cutting of the glass substrate 101 and the second layer 103.
  • the array substrate 104 and the periphery of the organic light emitting diode 105 are encapsulated by the encapsulation layer 106, and the array substrate 104 and the organic light emitting diode 105 are compared with the glass substrate 101, the first The thickness of the layer 102 and the second layer 103 are thinner, so that any of the ultraviolet laser beam and the carbon dioxide laser beam can be the said substrate substrate 104 and the periphery of the organic light emitting diode 105
  • the encapsulation layer 106 is cut.
  • the ultraviolet laser beam of the present invention matches the high absorption rate of the ultraviolet light laser beam by the first layer 102, the carbon dioxide laser beam matching the glass substrate 101 and the second layer 103 to the carbon dioxide a high absorption rate of the laser beam, and the array substrate 104 and the organic light emitting diode 105 are thinner than the glass substrate 101, the first layer 102, and the second layer 103, so the ultraviolet light
  • the high absorption rate of the laser for all the cutting layers can be matched, the laser cutting efficiency is improved, and the cutting quality is ensured without repeated cutting.
  • the cutting apparatus further includes a control device that controls activation and deactivation of the drive member and controls activation and deactivation of the laser source 30. Specifically, when the flexible panel 10 is cut, the control device controls activation of the driving member, and the control device controls the laser source 30 to emit an ultraviolet laser beam and a carbon dioxide laser beam; when the flexible panel At the end of the 10 cutting, the control device controls the drive member to close and control the laser source 30 to be turned off.
  • the laser source 30 is connected with a driving member, the working platform 20 is kept fixed, and the driving member drives the laser source 30 to move along the cutting route 50, and further The first laser beam 301 and the second laser beam 302 cut the flexible panel 10 along the cutting line 50; or the support body 604 is connected to a first driving portion, and the laser source 30 is connected a second driving portion, the first driving portion drives movement of the support body 604 along the cutting path 50, thereby driving the flexible panel 10 to move, and the second driving portion drives the laser source 30 along the edge
  • the cutting path 50 moves, the soft panel 10 is opposite to the direction in which the laser source 30 moves, and the first laser beam 301 and the second laser beam 302 are cut when the flexible panel 10 is cut. There can be a faster speed, which further improves the cutting efficiency of cutting the flexible panel 10.
  • the present invention provides a cutting apparatus for cutting a flexible panel 10, including: a movable working platform 20, a laser source 30, and The support panel 40 is disposed on the working platform 20 toward the laser source 30.
  • the periphery of the flexible substrate 10 is provided with a cutting path 50, and the laser source 30 is fixed to the bracket 40.
  • the laser source 30 On the cutting path 50 facing the periphery of the flexible substrate 10, the laser source 30 generates a first laser beam 301 and a second laser beam 302, and the first laser beam 301 and the second laser beam 302 are superimposed and focused. To the cutting point on the cutting path 50, the superimposed first laser beam 301 and the second laser beam 302 cut the flexible panel 10 along the cutting path 50.
  • the first laser beam 301 and the second laser beam 302 are respectively an ultraviolet laser beam and a carbon dioxide laser beam, that is, the first laser beam 301 and the second laser beam have different wavelengths.
  • One end of the bracket 40 supporting the laser source 30 is provided with a fixing seat, and the laser source 30 is disposed on the fixing base.
  • the ultraviolet laser beam and the carbon dioxide laser beam of the present invention match the high absorption rate of all the dicing film layers of the flexible panel 10 to different laser beams, and the first laser beam and the second laser beam are superimposed Strengthening the effect, the processing efficiency of laser cutting is further improved, and the cutting quality is ensured without repeated cutting.
  • the laser source 30 is coupled to a drive member, the work platform 20 remains fixed, and the drive member drives the laser source 30 to move along the cutting path 50.
  • the first laser beam 301 and the second laser beam 302 are further cut along the cutting line 50 to cut the flexible panel 10; or the support body 604 is connected to the first driving portion,
  • the laser source 30 is connected to a second driving unit that drives the movement of the support body 604 along the cutting path 50 to drive the flexible panel 10 to move.
  • the second driving unit drives the second driving unit.
  • the laser source 30 moves along the cutting path 50, and the flexible panel 10 is opposite to the direction in which the laser source 30 moves, and thus the superposed first laser beam 301 and the second laser beam 302 are When the flexible panel 10 is cut, there is a faster speed, which further improves the cutting efficiency of cutting the flexible panel 10.
  • the present invention provides a method for cutting a flexible panel, comprising:
  • step 1 a flexible panel 10 is provided with a cutting path.
  • Step 2 focusing the first laser beam 301 to a first cutting point on the cutting path 50, a second laser beam 302 to a second cutting point on the cutting path 50, the first cutting point and the first
  • the two cutting points have a pitch, and the first laser beam 301 is different from the wavelength of the second laser beam 302.
  • the first laser beam 301 and the second laser beam 302 are respectively an ultraviolet laser beam and a carbon dioxide laser beam.
  • the laser source 30 is controlled to generate a first laser beam 301 and a second laser beam 301 according to a time difference, the first laser beam 301 is focused on the first cutting point, and the second laser beam 302 is focused on the The second cutting point is described.
  • Step 3 the first laser beam 301 and the second laser beam 302 cut the flexible panel 10 along the cutting path 50.
  • the control device controls the driving member to be activated, the driving member drives the support body 604 to move, thereby driving the flexible panel 10 to move, and the first laser beam 301 and the second laser beam 302 generated by the laser source 30 are The flexible panel 10 is cut along the cutting path 50.
  • the present invention provides another method for cutting a flexible panel, including:
  • step 1 a flexible panel 10 is provided with a cutting path.
  • Step 2 focusing the superposed first laser beam 301 and the second laser beam 302 to a cutting point on the cutting path 50, the first laser beam 301 and the second laser beam 302 having different wavelengths.
  • the first laser beam 301 and the second laser beam 302 are an ultraviolet laser beam and a carbon dioxide laser beam, respectively.
  • the laser source 30 is controlled to generate a first laser beam 301 and a second laser beam 301, and the first laser beam 301 and the second laser beam 302 are superimposed to focus on a cutting point on the cutting path.
  • Step 3 the superposed first laser beam 301 and the second laser beam 302 cut the flexible panel 10 along the cutting path 50.
  • the control device controls the driving member to be activated, the driving member drives the support body 604 to move, thereby driving the flexible panel 10 to move, and the first laser beam 301 and the second laser beam 302 generated by the laser source 30 are The soft panel 10 is cut along the cutting path 50 after stacking.
  • the control device controls the laser source 30 to turn on, the laser source 30 emitting a first laser beam 301 and a second laser beam 302.
  • the first laser beam 301 and the second laser beam 302 are an ultraviolet laser beam and a carbon dioxide laser beam, respectively.
  • the first laser beam 301 is focused on a first cutting point on the cutting path 50
  • the second laser beam 302 is focused on a second cutting point on the cutting path 50, the first cutting point and the
  • the second cutting point has a pitch; or the first laser beam 301 and the second laser beam 302 are superimposed to focus on a cutting point on the cutting path 50.
  • the control device controls the driving member to be opened, and the driving member drives the support body 604 to move, thereby driving the flexible panel 10 to move, the first laser beam 301 and the second laser beam along the cutting
  • the path 50 cuts the flexible panel 10.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种软性面板切割方法，包括一软性面板（10），设有切割路径（50），聚焦第一激光束（301）至切割路径（50）上的第一切割点，聚焦第二激光束（302）至切割路径（50）上的第二切割点，第一切割点和第二切割点具有间距，第一激光束（301）与第二激光束（302）的波长不同，第一激光束（301）以及第二激光束（302）沿着切割路径（50）切割软性面板（10），该方法实现了软性面板（10）所有被切割膜层对不同激光的高吸收率，提高了激光切割加工效率，无需反复切割，保证了切割品质。

Description

软性面板切割设备及软性面板切割方法
本发明要求2017年10月24日递交的发明名称为“软性面板切割设备及软性面板切割方法”的申请号201711000500.5的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及显示技术领域，特别涉及软性面板切割设备及软性面板切割方法。
背景技术
在软性面板工艺生产中，激光切割是重要制程工艺，需要对产品边缘多余的膜层进行切割，以达到需要的外观尺寸。而在激光切割软性面板的过程中，软性面板的切割膜层有多种，而不同膜层的不同材质对激光有不同的穿透率和吸收率，因此单一类型的激光波长不能匹配所有膜层材料的高吸收率，激光切割效率受到影响，需要反复切割多次，而反复切割会影响激光的切割品质。
发明内容
本发明的目的在于提供一种软性面板切割设备及两种软性面板切割方法，以提高激光切割效率，无需反复切割，保证切割品质。
本发明提供了一种软性面板切割方法，包括：
提供一软性面板，设有切割路径；
聚焦第一激光束至所述切割路径上的第一切割点，第二激光束至所述切割路径上的第二切割点，所述第一切割点和所述第二切割点具有间距，所述第一激光束与所述第二激光束的波长不同；
所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板。
其中，所述软性面板包括玻璃基板和设于所述玻璃基板的第一层和第二层，所述玻璃基板、所述第一层以及所述第二层对所述第一激光束的吸收率与 对所述第二激光束的吸收率不同。
本发明提供了另一种软性面板切割方法，包括：
提供一软性面板，设有切割路径；
聚焦叠加后的第一激光束与第二激光束至所述切割路径上的切割点，所述第一激光束与所述第二激光束的波长不同；
叠加后的所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板。
其中，所述软性面板包括玻璃基板和设于所述玻璃基板的第一层和第二层，所述玻璃基板、所述第一层以及所述第二层对所述第一激光束的吸收率与对所述第二激光束的吸收率不同。
其中，所述第一光束和所述第二光束分别为紫外光激光束和二氧化碳激光束。
本发明提供了一种切割设备，用于对软性面板的切割，包括：工作平台、激光源以及支架，所述软性面板置于所述工作平台上朝向所述激光源，所述软性基板的周缘设有切割路径，所述激光源被固定于所述支架上朝向所述软性基板周缘的切割路径，所述激光源产生第一激光束和第二激光束，所述第一激光束与所述第二激光束的波长不同，所述第一激光束聚焦至所述切割路径上的第一切割点，所述第二激光束聚焦至所述切割路径上的第二切割点，所述第一切割点和所述第二切割点具有间距，所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板；或者所述第一激光束和所述第二激光束叠加后聚焦至所述切割路径上的切割点，叠加后的所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板。
其中，所述工作平台固定，所述激光束移动；或者所述工作平台移动，所述激光束固定。
其中，所述工作平台连接有驱动部，所述驱动部包括导块、导轨、支撑体以及连接于所述支撑体的驱动件，所述支撑体与所述驱动件位于所述导块上，所述支撑体支撑所述软性面板，所述导块在所述导轨内滑动。
其中，所述导块相对两侧设有滑轮，所述滑轮沿着所述导轨滑动。
其中，所述切割设备还包括控制装置，所述控制装置控制所述驱动件的启 动与关闭，以及控制所述激光源的启动与关闭。
综上所述，本发明通过激光源产生的第一激光束聚焦至切割路径上的第一切割点，激光源产生的第二激光束聚焦至所述切割路径上的第二切割点，或者通过激光源产生的第一激光束与第二激光束叠加后聚焦至切割路径上的切割点，所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板，实现了所述软性面板所有被切割膜层对不同激光的高吸收率，提高了激光切割加工效率，无需反复切割，保证了切割品质。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的一种切割设备结构示意图，其中包括了软性面板。
图2是图1中软性面板的俯视结构示意图。
图3是图1中工作平台的剖面结构示意图。
图4是图1中软性面板的内部平面结构示意图。
图5是本发明另一实施例提供的一种切割设备结构示意图，其中包括了软性面板。
图6是图5中软性面板的俯视结构示意图。
图7是本发明实施例提供的软性面板切割方法流程示意图。
图8是本发明另一实施例提供的软性面板切割方法流程示意图。
具体实施方式
请参阅图1、图2，本发明提供了一种切割设备，用于对软性面板10的切割，包括：可移动的工作平台20、激光源30以及支架40，所述软性面板10置于所述工作平台20上朝向所述激光源30，所述软性基板10的周缘设有切割路径50，所述激光源30被固定于所述支架40上朝向所述软性基板10周缘 的切割路径50，所述激光源30产生第一激光束301和第二激光束302，所述第一激光束301聚焦至所述切割路径50上的第一切割点，所述第二激光束302聚焦至所述切割路径50上的第二切割点，所述第一切割点和所述第二切割点具有间距，所述第一激光束301和所述第二激光束302沿着所述切割路径50切割所述软性面板10。所述第一激光束301和所述第二激光束302分别为紫外光激光束与二氧化碳激光束，即所述第一激光束301与所述第二激光束302的波长不同。所述支架40支撑所述激光源30的一端设有固定座，所述激光源30设于所述固定座上。本发明的所述紫外光激光束和所述二氧化碳激光束匹配软性面板10所有切割膜层对不同激光的高吸收率，提高了激光切割加工效率，无需反复切割，保证了切割品质。
在本实施例中，所述软性面板10的切割路线50包括第一方向的切割路径与第二方向的切割路径。所述第一方向为与所述软性面板10的长边平行的方向，所述第二方向为与所述第一方向垂直的方向。需要说明的是，在工艺设计以及生产中，由于受误差或者工艺水平的限制，本发明实施例中的所述的垂直可能不是严格的互相垂直，而是所述第一方向以及所述第二方向之间的夹角接近90°，但不是90°，但是第一方向以及所述第二方向之间的夹角对于本领域的技术人员来说应该是能够接受的，且该夹角不应该影响本发明实施例发明目的的实现。
请参阅图1、图3，在本实施例中，所述工作平台20连接有驱动部60，所述驱动部60包括导块601、导轨602、滑轮603、支撑体604以及连接于所述支撑体604的驱动件，所述支撑体604与所述驱动件位于所述导块601上，所述支撑体604支撑所述软性面板10，所述滑轮603分别与所述导块601以及所述导轨602滑动连接。具体为，所述滑轮603分别装设于所述导块601左右两侧，所述导轨602平行设置于所述导块601连接有所述滑轮603的端部，延伸方向与行进方向平行，所述滑轮603沿所述导轨602滑动地安装于所述导轨602上。在其他实现方式中，所述导块601直接在所述导轨602内滑动，只要能实现本发明的发明目的，本发明在此不做限定。所述驱动件驱动所述支撑体604移动，进而带动所述软性面板10移动。所述驱动件为气缸或者马达。
请参阅图4，所述第一激光束301以及所述第二激光束302切割的所述软 性面板10包括玻璃基板101和设于所述玻璃基板101上的第一层102和第二层103。所述第一层102上设有阵列基板104，所述阵列基板104上设有机发光二极管105，所述有机发光二极管105上封装有封装层106，所述封装层106的相对两侧向下延伸至所述第一层102的表面，所述第二层103层叠于所述封装层106上。在本实施例中，所述第一层102为聚酰亚胺基板，所述第二层103为保护膜。
所述玻璃基板101、所述第一层102以及所述第二层103对所述第一激光束301的吸收率与对所述第二激光束302的吸收率不同。
具体为，所述第一层102对所述紫外光激光束的吸收率大于对所述二氧化碳激光束的吸收率。所述第一层102可以吸收80％的所述紫外光激光束，所述第一层102可以吸收20％的所述二氧化碳激光束，故在所述软性面板10切割过程中，所述紫外光激光束可以完成对所述第一层102的切割。所述玻璃基板101以及所述第二层103对所述二氧化碳激光束的吸收率大于对所述紫外光激光束的吸收率。所述玻璃基板101对所述二氧化碳激光束的吸收率为98％，所述玻璃基板101对所述紫外光激光束的吸收率为15％；所述第二层103对所述二氧化碳激光束的吸收率位95％，所述第二层103对所述紫外光激光束的吸收率为5％。故所述二氧化碳激光束可以完成对所述玻璃基板101以及所述第二层103的切割。
进一步地，所述阵列基板104以及所述有机发光二极管105的周缘被所述封装层106所封装，而所述阵列基板104以及所述有机发光二极管105较所述玻璃基板101、所述第一层102以及所述第二层103的厚度更薄，故所述紫外光激光束与二氧化碳激光束中的任一束均可以将所述阵列基板104以及所述有机发光二极管105的周缘的所述封装层106切割。
本发明的所述紫外光激光束匹配所述第一层102对所述紫外光激光束的高吸收率，所述二氧化碳激光束匹配所述玻璃基板101以及所述第二层103对所述二氧化碳激光束的高吸收率，而所述阵列基板104以及所述有机发光二极管105较所述玻璃基板101、所述第一层102以及所述第二层103的厚度更薄，故所述紫外光激光束以及所述二氧化碳激光束分别切割所述软性面板10时可以匹配所有切割膜层对激光的高吸收率，提高了激光切割效率，无需反复 切割，保证了切割品质。
所述切割设备还包括控制装置，所述控制装置控制所述驱动件的启动与关闭，以及控制所述激光源的30启动与关闭。具体为，当所述软性面板10切割时，所述控制装置控制所述驱动件启动，所述控制装置控制所述激光源30发出紫外光激光束以及二氧化碳激光束；当所述软性面板10切割结束时，所述控制装置控制所述驱动件关闭以及控制所述激光源30关闭。
在本发明实施例的其他实现方式中，所述激光源30连接有驱动件，所述工作平台20保持固定，所述驱动件驱动所述激光源30沿着所述切割路线50移动，进而所述第一激光束301和所述第二激光束302沿着所述切割线路50切割所述软性面板10；或者，所述支撑体604连接有第一驱动部，所述激光源30连接有第二驱动部，所述第一驱动部驱动所述支撑体604沿着所述切割路线50的移动，进而带动所述软性面板10移动，所述第二驱动部驱动所述激光源30沿着所述切割路线50移动，所述软性面板10与所述激光源30移动的方向相反，进而所述第一激光束301和所述第二激光束302在切割所述软性面板10时，可以有更快的速度，进一步提高了切割所述软性面板10的切割效率。
请参阅图5、图6，在本发明的另一实施例中，本发明提供了一种切割设备，用于对软性面板10的切割，包括：可移动的工作平台20、激光源30以及支架40，所述软性面板10置于所述工作平台20上朝向所述激光源30，所述软性基板10的周缘设有切割路径50，所述激光源30被固定于所述支架40上朝向所述软性基板10周缘的切割路径50，所述激光源30产生第一激光束301和第二激光束302，所述第一激光束301和所述第二激光束302叠加后聚焦至所述切割路径50上的切割点，叠加后的所述第一激光束301以及所述第二激光束302沿着所述切割路径50切割所述软性面板10。所述第一激光束301和所述第二激光束302分别为紫外光激光束与二氧化碳激光束，即所述第一激光束301与所述第二激光束的波长不同。所述支架40支撑所述激光源30的一端设有固定座，所述激光源30设于所述固定座上。本发明的所述紫外光激光束和所述二氧化碳激光束匹配所述软性面板10所有切割膜层对不同激光的高吸收率，所述第一激光束以及所述第二激光束叠加后具有加强效应，更加提高了激光切割的加工效率，无需反复切割，保证了切割品质。
在本发明另一实施例的其他实现方式中，所述激光源30连接有驱动件，所述工作平台20保持固定，所述驱动件驱动所述激光源30沿着所述切割路线50移动，进而叠加后的所述第一激光束301和所述第二激光束302沿着所述切割线路50切割所述软性面板10；或者，所述支撑体604连接有第一驱动部，所述激光源30连接有第二驱动部，所述第一驱动部驱动所述支撑体604沿着所述切割路线50的移动，进而带动所述软性面板10移动，所述第二驱动部驱动所述激光源30沿着所述切割路线50移动，所述软性面板10与所述激光源30移动的方向相反，进而叠加后的所述第一激光束301和所述第二激光束302在切割所述软性面板10时，可以有更快的速度，进一步提高了切割所述软性面板10的切割效率。
请参阅图7，本发明提供了一种软性面板的切割方法，包括：
步骤1，提供一软性面板10，设有切割路径。
步骤2，聚焦第一激光束301至所述切割路径50上的第一切割点，第二激光束302至所述切割路径50上的第二切割点，所述第一切割点和所述第二切割点具有间距，所述第一激光束301与所述第二激光束302的波长不同。所述第一激光束301与所述第二激光束302分别为紫外光激光束与二氧化碳激光束。具体为，根据时差控制所述激光源30产生第一激光束301以及第二激光束301，所述第一激光束301聚焦于所述第一切割点，所述第二激光束302聚焦于所述第二切割点。
步骤3，所述第一激光束301以及所述第二激光束302沿着所述切割路径50切割所述软性面板10。具体为，控制装置控制驱动件启动，驱动件驱动支撑体604移动，进而带动所述软性面板10移动，所述激光源30产生的所述第一激光束301和所述第二激光束302沿着所述切割路径50切割所述软性面板10。
请参阅图8，本发明提供了另一种软性面板的切割方法，包括：
步骤1，提供一软性面板10，设有切割路径。
步骤2，聚焦叠加后的第一激光束301与第二激光束302至所述切割路径50上的切割点，所述第一激光束301与所述第二激光束302的波长不同。所述第一激光束301和所述第二激光束302分别为紫外光激光束和二氧化碳激光 束。具体为，控制所述激光源30产生第一激光束301以及第二激光束301，所述第一激光束301和所述第二激光束302叠加后聚焦于所述切割路径上的切割点。
步骤3，叠加后的所述第一激光束301以及所述第二激光束302沿着所述切割路径50切割所述软性面板10。具体为，控制装置控制驱动件启动，驱动件驱动支撑体604移动，进而带动所述软性面板10移动，所述激光源30产生的所述第一激光束301和所述第二激光束302叠加后沿着所述切割路径50切割所述软性面板10。
使用时，控制装置控制激光源30开启，所述激光源30发出第一激光束301和第二激光束302。所述第一激光束301和所述第二激光束302分别为紫外光激光束和二氧化碳激光束。所述第一激光束301聚焦于所述切割路径50上的第一切割点，所述第二激光束302聚焦于所述切割路径50上的第二切割点，所述第一切割点和所述第二切割点具有间距；或者所述第一激光束301和所述第二激光束302叠加后聚焦于所述切割路径50上的切割点。所述控制装置控制所述驱动件开启，驱动件驱动所述支撑体604移动，进而带动所述软性面板10移动，所述第一激光束301与所述第二激光束沿着所述切割路径50切割所述软性面板10。
以上所揭露的仅为本发明较佳实施例而已，当然不能以此来限定本发明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。

Claims (10)

  1. 一种软性面板切割方法，其中，包括：
    提供一软性面板，设有切割路径；
    聚焦第一激光束至所述切割路径上的第一切割点，第二激光束至所述切割路径上的第二切割点，所述第一切割点和所述第二切割点具有间距，所述第一激光束与所述第二激光束的波长不同；
    所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板。
  2. 根据权利要求1所述的软性面板切割方法，其中，所述软性面板包括玻璃基板和设于所述玻璃基板的第一层和第二层，所述玻璃基板、所述第一层以及所述第二层对所述第一激光束的吸收率与对所述第二激光束的吸收率不同。
  3. 一种软性面板切割方法，其中，包括：
    提供一软性面板，设有切割路径；
    聚焦叠加后的第一激光束与第二激光束至所述切割路径上的切割点，所述第一激光束与所述第二激光束的波长不同；
    叠加后的所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板。
  4. 根据权利要求3所述的软性面板切割方法，其中，所述软性面板包括玻璃基板和设于所述玻璃基板的第一层和第二层，所述玻璃基板、所述第一层以及所述第二层对所述第一激光束的吸收率与对所述第二激光束的吸收率不同。
  5. 根据权利要求1所述的软性基板切割方法，其特征在于，所述第一光束和所述第二光束分别为紫外光激光束和二氧化碳激光束。
  6. 一种切割设备，用于对软性面板的切割，其中，包括：工作平台、激光源以及支架，所述软性面板置于所述工作平台上朝向所述激光源，所述软性基板的周缘设有切割路径，所述激光源被固定于所述支架上朝向所述软性基板周缘的切割路径，所述激光源产生第一激光束和第二激光束，所述第一激光束与所述第二激光束的波长不同，所述第一激光束聚焦至所述切割路径上的第一切割点，所述第二激光束聚焦至所述切割路径上的第二切割点，所述第一切割点 和所述第二切割点具有间距，所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板；或者所述第一激光束和所述第二激光束叠加后聚焦至所述切割路径上的切割点，叠加后的所述第一激光束以及所述第二激光束沿着所述切割路径切割所述软性面板。
  7. 根据权利要求6所述的切割设备，其中，所述工作平台固定，所述激光束移动；或者所述工作平台移动，所述激光束固定。
  8. 根据权利要求6所述的切割设备，其中，所述工作平台连接有驱动件，所述驱动部包括导块、导轨、支撑体以及连接于所述支撑体的驱动件，所述支撑体与所述驱动件位于所述导块上，所述支撑体支撑所述软性面板，所述导块在所述导轨内滑动。
  9. 根据权利要求8所述的切割设备，其中，所述导块相对两侧设有滑轮，所述滑轮沿着所述导轨滑动。
  10. 根据权利要求8所述的切割设备，其中，所述切割设备还包括控制装置，所述控制装置控制所述驱动件的启动与关闭，以及控制所述激光源的启动与关闭。
PCT/CN2018/072890 2017-10-24 2018-01-16 软性面板切割设备及软性面板切割方法 Ceased WO2019080381A1 (zh)

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