WO2019080241A1 - 显示面板母板及显示面板母板的切割方法 - Google Patents

显示面板母板及显示面板母板的切割方法

Info

Publication number
WO2019080241A1
WO2019080241A1 PCT/CN2017/112886 CN2017112886W WO2019080241A1 WO 2019080241 A1 WO2019080241 A1 WO 2019080241A1 CN 2017112886 W CN2017112886 W CN 2017112886W WO 2019080241 A1 WO2019080241 A1 WO 2019080241A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
display panel
layer
cutting
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/112886
Other languages
English (en)
French (fr)
Inventor
朱小光
蔡哲汶
蔡孟起
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US15/740,007 priority Critical patent/US20190129268A1/en
Publication of WO2019080241A1 publication Critical patent/WO2019080241A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for cutting a display panel motherboard and a display panel motherboard.
  • a glass material is generally used as the substrate.
  • the rigid substrate is fragile and does not have flexibility. Therefore, a display device made of a rigid substrate is less resistant to stress.
  • flexible substrates have flexible properties, and thus display devices using flexible substrates are becoming mainstream.
  • the flexible substrate requires the use of a rigid substrate as a support carrier for the flexible substrate during screen preparation. Specifically, first remove it with a laser (laser lift) Off) peeling the flexible substrate from the rigid substrate, and then laser cutting the flexible substrate according to the size of the desired screen (laser Cutting) Finally, the flexible substrate is separated from the rigid substrate to obtain a flexible screen.
  • the obtained flexible substrate is relatively soft, which is not conducive to the transfer of the substrate in the production line. And in the subsequent laser cutting process, the flexible substrate which is too soft is easy to warp and wrinkle.
  • Embodiments of the present invention provide a display panel motherboard including: a rigid substrate, a flexible substrate, and a fixed layer, the flexible substrate including a cutting area and a non-cutting area;
  • the flexible substrate of the non-cut region is bonded to the rigid substrate;
  • the fixing layer is disposed between the flexible substrate of the cutting region and the rigid substrate, and the flexible substrate, the rigid substrate peeling off the non-cut region, and the flexible substrate cutting along the cutting region In the flexible substrate, the fixing layer is used to fix the flexible substrate on the rigid substrate.
  • the bonding strength of the fixing layer and the flexible substrate ranges from 1 to 20 gram force per foot;
  • constituent material of the fixed layer is a non-transparent material.
  • the cutting region includes a plurality of cutting sub-regions, the fixing layer including a plurality of fixing portions in one-to-one correspondence with the flexible substrate of the plurality of cutting sub-regions;
  • the plurality of fixing portions are arranged adjacent to each other or at intervals.
  • the shape of the bottom surface of the fixing portion is an elongated shape, a circular shape, a square shape, or a rounded square shape.
  • the pinned layer includes a fixed sublayer and a light shielding sublayer
  • the light shielding layer is disposed on the rigid substrate
  • the fixing sublayer is disposed between the flexible substrate and the light shielding sublayer.
  • the constituent material of the light shielding sublayer is a non-transparent material.
  • the constituent material of the fixed sub-layer is a transparent material
  • the bonding strength of the fixing sub-layer and the flexible substrate ranges from 1 to 20 gram force per foot.
  • the bond strength between the flexible substrate of the non-cut region and the rigid substrate is greater than 50 grams force per foot.
  • the display panel motherboard further includes a driving circuit layer and a display medium layer;
  • the driving circuit layer is disposed on the flexible substrate
  • the display medium layer is disposed on the driving circuit layer.
  • Embodiments of the present invention provide a display panel motherboard, including: a rigid substrate, a flexible substrate, and a fixed layer, the flexible substrate including a cutting area and a non-cutting area;
  • the flexible substrate of the non-cut region is bonded to the rigid substrate;
  • the fixing layer is disposed between the flexible substrate of the cutting region and the rigid substrate, and the flexible substrate, the rigid substrate peeling off the non-cut region, and the flexible substrate cutting along the cutting region In the flexible substrate, the fixing layer is used to fix the flexible substrate on the rigid substrate.
  • the bond strength of the pinned layer to the flexible substrate ranges from 1 to 20 grams force per foot.
  • the constituent material of the pinned layer is a non-transparent material.
  • the cutting region includes a plurality of cutting sub-regions, the fixing layer including a plurality of fixing portions in one-to-one correspondence with the flexible substrate of the plurality of cutting sub-regions;
  • the plurality of fixing portions are arranged adjacent to each other or at intervals.
  • the shape of the bottom surface of the fixing portion is an elongated shape, a circular shape, a square shape, or a rounded square shape.
  • the solid layer comprises a fixed sub-layer and a light-shielding layer
  • the light shielding layer is disposed on the rigid substrate
  • the fixing sublayer is disposed between the flexible substrate and the light shielding sublayer.
  • the constituent material of the light shielding sublayer is a non-transparent material.
  • the constituent material of the fixed sub-layer is a transparent material
  • the bonding strength of the fixing sub-layer and the flexible substrate ranges from 1 to 20 gram force per foot.
  • the bond strength between the flexible substrate of the non-cut region and the rigid substrate is greater than 50 grams force per foot.
  • the display panel motherboard further includes a driving circuit layer and a display medium layer;
  • the driving circuit layer is disposed on the flexible substrate
  • the display medium layer is disposed on the driving circuit layer.
  • the embodiment of the present invention further provides a method for cutting a display panel motherboard, which is used for cutting the display panel motherboard, and includes:
  • the flexible substrate is cut along the flexible substrate of the cutting area until it contacts the fixed layer.
  • the method further includes:
  • the flexible substrate is cut along the flexible substrate of the dicing region and extends to the rigid substrate.
  • the embodiment of the invention provides a method for cutting a display panel mother board and a display panel mother board, wherein the display panel mother board is provided with a fixing layer between the flexible substrate and the rigid substrate in the cutting area of the display panel mother board, and is peeled off and not cut.
  • the flexible substrate and the rigid substrate of the region when the flexible substrate is cut along the flexible substrate of the cutting region, the flexible substrate is fixed on the rigid substrate, thereby improving the cutting efficiency.
  • FIG. 1 is a schematic diagram of a first structure of a display panel motherboard according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a second structure of a display panel motherboard according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a third structure of a display panel motherboard according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a fourth structure of a display panel motherboard according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a fifth structure of a display panel motherboard according to an embodiment of the present invention.
  • FIG. 6 is a schematic flow chart of a method for cutting a display panel motherboard according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a scene of a method for cutting a display panel motherboard according to an embodiment of the present invention.
  • FIG. 8 is another schematic diagram of a cutting method of a display panel motherboard according to an embodiment of the present invention.
  • references to "an embodiment” herein mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the invention.
  • the appearances of the phrases in various places in the specification are not necessarily referring to the same embodiments, and are not exclusive or alternative embodiments that are mutually exclusive. Those skilled in the art will understand and implicitly understand that the embodiments described herein can be combined with other embodiments.
  • FIG. 1 is a schematic structural diagram of a display panel motherboard according to an embodiment of the present invention.
  • the display panel mother board 1000 includes a rigid substrate 100, a flexible substrate 200, and a fixed layer 300.
  • the flexible substrate 200 is composed of one or a combination of materials such as polyimide, polyetherimide, polyphenylene sulfide, and polyarylate, and may be transparent or non-transparent.
  • the flexible substrate 200 may be divided into a cutting area 210 and a non-cutting area 220 according to the size of the display panel to be fabricated, and the flexible substrate 200 located in the cutting area 210 is used for performing a cutting operation.
  • the rigid substrate 100 may be a glass substrate for carrying and supporting the flexible substrate 200.
  • the flexible substrate 200 located in the non-cut region 220 is bonded to the rigid substrate 100.
  • the bonding strength between the flexible substrate 200 located in the non-cutting region 220 and the rigid substrate 100 is greater than 50 gram force per foot.
  • the fixing layer 300 is disposed between the cutting region 210 and the rigid substrate 100, and when the flexible substrate 200 of the non-cutting region 220 is peeled off, the rigid substrate 100 is cut, and the flexible substrate 200 is cut along the flexible substrate 200 of the cutting region 210, the flexibility is The substrate 200 is fixed on the rigid substrate 100.
  • the constituent material of the fixed layer 300 is a non-transparent material, such as a metal, a metal alloy, or the like, to block the transmission of the laser when the laser is removed, that is, when the laser is removed, the rigid substrate 100 is not flexible.
  • the substrate 200 is peeled off. Since the flexible substrate 200 is still adhered to the rigid substrate 100 through the fixing layer 300, the alignment misalignment of the flexible substrate 200 due to the floating is avoided. Further, when the flexible substrate 200 is cut into a plurality of flexible daughter boards, the adsorption stage only needs to adsorb the rigid substrate 100, and the flexible substrate 200 can be cut by the laser, and the splitting process is not required, thereby greatly improving the cutting efficiency. , reducing costs.
  • the cutting region 210 includes a plurality of cutting sub-regions 211
  • the fixing layer 300 includes a plurality of one-to-one correspondences with the flexible substrate 200 of the plurality of cutting sub-regions 211.
  • the fixing portion 310 As shown in FIG. 3, the plurality of fixing portions 310 are arranged adjacent to each other or at intervals.
  • the shape of the bottom surface of the fixing portion 310 is an elongated shape, a circular shape, a square shape, a rounded square shape, and the like, and the height ranges from nanometer to micrometer, and can be adjusted according to actual conditions.
  • the pinned layer 300 includes a fixed sub-layer 310 and a light blocking sub-layer 320.
  • the light shielding sub-layer 320 is disposed on the rigid substrate 100, and has a thickness ranging from nanometer to micrometer.
  • the constituent material is a non-transparent material such as a metal, a metal alloy or the like to block the transmission of the laser light when the laser is removed.
  • the fixing sub-layer 310 is disposed between the flexible substrate 200 and the light shielding sub-layer 320, and has a thickness ranging from nanometer to micrometer.
  • the constituent material may be a transparent material, such as an inorganic material, a fluorine organic substance, or the like, and the flexible substrate 200.
  • the bond strength between 1 and 20 grams force per foot.
  • the display panel motherboard 1000 further includes a drive circuit layer 400 and a display medium layer 500.
  • a driving circuit layer 400 is disposed on the flexible substrate for controlling display of a screen.
  • the display medium layer 500 is disposed on the driving circuit layer 400, specifically, a display medium such as an electronic paper or an electrophoresis type.
  • FIG. 6 is a schematic flow chart of a method for cutting a display panel motherboard according to an embodiment of the present invention.
  • the cutting method is used for cutting the display panel motherboard 1000 described above, and the specific steps are as follows:
  • the flexible substrate 200 and the rigid substrate 100 of the non-cut region 220 are stripped by a laser removal method. Since the fixed layer 300 has a light-shielding property, the laser light can be blocked from being peeled off from the flexible substrate 200 of the cut region 210, and thus the flexible substrate 200 and the rigid substrate 100 of the cut region 210 are fixed together by the fixed layer 300.
  • the flexible substrate 200 can be cut along the flexible substrate 200 of the dicing region 210 until it contacts the fixed layer 300.
  • the flexible substrate 200 may be cut along the flexible substrate 200 of the cutting region 210 as shown in FIG. 8 .
  • the flexible substrate 200 is cut to extend to the rigid substrate 100.
  • the embodiment of the invention provides a method for cutting a display panel mother board and a display panel mother board, wherein the display panel mother board is provided with a fixing layer between the flexible substrate and the rigid substrate in the cutting area of the display panel mother board, and is peeled off and not cut.
  • the flexible substrate and the rigid substrate of the region when the flexible substrate is cut along the flexible substrate of the cutting region, the flexible substrate is fixed on the rigid substrate, thereby improving the cutting efficiency.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板母板（1000）及显示面板母板（1000）的切割方法，显示面板母板（1000）包括硬性基板（100）、柔性基板（200）和固定层（300），其中非切割区域（220）的柔性基板（200）与硬性基板（100）贴合；固定层（300）设置在切割区域（210）的柔性基板（200）和硬性基板（100）之间，在剥离非切割区域（220）的柔性基板（200）、硬性基板（100），沿切割区域（210）的柔性基板（200）切割柔性基板（200）时，固定层（300）用于将柔性基板（200）固定在硬性基板（100）上。

Description

显示面板母板及显示面板母板的切割方法 技术领域
本发明涉及显示技术领域，特别是涉及一种显示面板母板及显示面板母板的切割方法。
 背景技术
传统的显示装置，通常选用玻璃材质作为基板。由于硬性基板易碎且不具有可挠性。因此，使用硬性基板制成的显示装置对应力的耐受性较差。相较之下，柔性基板具有可挠曲特性，因此使用柔性基板制成显示装置逐渐成为主流。
受限于当前屏幕制备工艺，柔性基板需使用硬性基板作为柔性基板在屏幕制备过程中的支撑载体。具体的，先利用激光取下（laser lift off）将柔性基板从硬性基板上剥离，再根据所需屏幕的尺寸，对柔性基板进行激光切割（laser cutting），最后将柔性基板与硬性基板分离，得到柔性屏幕。然而在激光取下的过程中，得到的柔性基板较为柔软，不利于基板在产线中的传送。且后续激光切割过程中，过于柔软的柔性基板容易翘曲和褶皱。
 技术问题
本发明的目的在于提供一种显示面板母板，可以提高显示面板母板的切割效率。
 技术解决方案
本发明实施例提供了一种显示面板母板，其包括：硬性基板、柔性基板和固定层，所述柔性基板包括切割区域和非切割区域；
所述非切割区域的所述柔性基板与所述硬性基板贴合；
所述固定层设置在所述切割区域的所述柔性基板和所述硬性基板之间，在剥离所述非切割区域的所述柔性基板、所述硬性基板，沿所述切割区域的柔性基板切割所述柔性基板时，所述固定层用于将所述柔性基板固定在所述硬性基板上。
其中所述固定层与所述柔性基板的粘接强度范围为1-20克力/英尺；
其中所述固定层的组成材料为非透明材料。
在一些实施例中，所述切割区域包括多个切割子区域，所述固定层包括与所述多个切割子区域的所述柔性基板一一对应的多个固定部；
所述多个固定部邻接排列或间隔排列。
在一些实施例中，所述固定部底面形状为长条形、圆形、方形或圆角方形。
在一些实施例中，所述固定层包括固定子层和遮光子层；
所述遮光子层，设置在所述硬性基板上；
所述固定子层设置在所述柔性基板、所述遮光子层之间。
在一些实施例中，所述遮光子层的组成材料为非透明材料。
在一些实施例中，所述固定子层的组成材料为透明材料，所述固定子层与所述柔性基板的粘接强度范围为1-20克力/英尺。
在一些实施例中，所述非切割区域的柔性基板和所述硬性基板之间的粘接强度大于50克力/英尺。
在一些实施例中，所述显示面板母板还包括驱动电路层和显示介质层；
所述驱动电路层，设置在所述柔性基板上；
所述显示介质层，设置在所述驱动电路层上。
本发明实施例提供了一种显示面板母板，包括：硬性基板、柔性基板和固定层，所述柔性基板包括切割区域和非切割区域；
所述非切割区域的所述柔性基板与所述硬性基板贴合；
所述固定层设置在所述切割区域的所述柔性基板和所述硬性基板之间，在剥离所述非切割区域的所述柔性基板、所述硬性基板，沿所述切割区域的柔性基板切割所述柔性基板时，所述固定层用于将所述柔性基板固定在所述硬性基板上。
在一些实施例中，所述固定层与所述柔性基板的粘接强度范围为1-20克力/英尺。
在一些实施例中，所述固定层的组成材料为非透明材料。
在一些实施例中，所述切割区域包括多个切割子区域，所述固定层包括与所述多个切割子区域的所述柔性基板一一对应的多个固定部；
所述多个固定部邻接排列或间隔排列。
在一些实施例中，所述固定部底面形状为长条形、圆形、方形或圆角方形。
在一些实施例中，所述固定层包括固定子层和遮光子层；
所述遮光子层，设置在所述硬性基板上；
所述固定子层设置在所述柔性基板、所述遮光子层之间。
在一些实施例中，所述遮光子层的组成材料为非透明材料。
在一些实施例中，所述固定子层的组成材料为透明材料，所述固定子层与所述柔性基板的粘接强度范围为1-20克力/英尺。
在一些实施例中，所述非切割区域的柔性基板和所述硬性基板之间的粘接强度大于50克力/英尺。
在一些实施例中，所述显示面板母板还包括驱动电路层和显示介质层；
所述驱动电路层，设置在所述柔性基板上；
所述显示介质层，设置在所述驱动电路层上。
本发明实施例还提供了一种显示面板母板的切割方法，用于对上述的显示面板母板进行切割，包括：
将非切割区域的柔性基板和硬性基板剥离；
沿切割区域的柔性基板，对所述柔性基板进行切割，到接触到所述固定层为止。
在一些实施例中，所述将非切割区域的柔性基板和硬性基板剥离步骤之后，还包括：
沿切割区域的柔性基板，对所述柔性基板进行切割，延伸至硬性基板为止。
 有益效果
本发明实施例提供了一种显示面板母板及显示面板母板的切割方法，其中显示面板母板通过在显示面板母板的切割区域柔性基板和硬性基板之间设置固定层，在剥离非切割区域的柔性基板、硬性基板，沿切割区域柔性基板切割柔性基板时，将柔性基板固定在硬性基板上，提高了切割效率。
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
 附图说明
图1为本发明实施例提供的显示面板母板的第一种结构示意图。
图2为本发明实施例提供的显示面板母板的第二种结构示意图。
图3为本发明实施例提供的显示面板母板的第三种结构示意图。
图4为本发明实施例提供的显示面板母板的第四种结构示意图。
图5为本发明实施例提供的显示面板母板的第五种结构示意图。
图6为本发明实施例提供的显示面板母板的切割方法的流程示意图。
图7为本发明实施例提供的显示面板母板的切割方法的场景示意图。
图8为本发明实施例提供的显示面板母板的切割方法的另一场景示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
在图中，结构相似的单元是以相同标号表示。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参照图1，图1为本发明实施例提供的显示面板母板的结构示意图。显示面板母板1000包括硬性基板100、柔性基板200和固定层300。
柔性基板200由聚酰亚胺、聚醚酰亚胺、聚苯硫醚、聚芳酯等材料的一种或几种组合而成，其可以为透明状，也可以为非透明状。根据需要制作的显示面板的尺寸，可以将柔性基板200划分为切割区域210和非切割区域220，位于切割区域210的柔性基板200用于进行切割操作。
硬性基板100可以为玻璃基板，用于承载并支撑柔性基板200。在本实施例中，位于非切割区域220的柔性基板200与硬性基板100贴合。位于非切割区域220的柔性基板200和所述硬性基板100之间的粘接强度大于50克力/英尺。
固定层300设置在所述切割区域210和所述硬性基板100之间，在剥离非切割区域220的柔性基板200、硬性基板100，沿切割区域210的柔性基板200切割柔性基板200时，将柔性基板200固定在硬性基板100上。
在一些实施例中，固定层300的组成材料为非透明材料，比如金属、金属合金等，以阻挡激光取下时激光的透过，即在激光取下时，不会与硬性基板100、柔性基板200剥离。由于柔性基板200仍通过固定层300粘附在硬性基板100，因此避免了柔性基板200因悬空造成的切割对位不准。进一步的，在将柔性基板200切割成多个柔性子板时，吸附载台（stage）只需吸附硬性基板100，通过激光切断柔性基板200即可，不用进行裂片工艺，极大提升了切割效率，降低了成本。
在一些实施例中，所述固定层300与所述柔性基板200的粘接强度较小，范围为1-20克力/英尺。将柔性基板200切割成多个柔性子板之后，固定层300依旧可以将单个柔性子板粘附在硬性基板上，从而可以避免切割后单个柔性子板的错位。同时，在分离单个柔性子板和硬性基板100时，还可以通过机械取下的方法分离固定层300和柔性基板200。
在一些实施例中，如图2所示，所述切割区域210包括多个切割子区域211，所述固定层300包括与所述多个切割子区域211的柔性基板200一一对应的多个固定部310。如图3所示，这些多个固定部310邻接排列或间隔排列。固定部310底面的形状为长条形、圆形、方形、圆角方形等形状，高度范围为纳米级-微米级，可以根据实际情况进行调节。
在一些实施例中，如图4所示，所述固定层300包括固定子层310和遮光子层320。遮光子层320设置在所述硬性基板100上，厚度范围为纳米级到微米级，组成材料为非透明材料，比如金属、金属合金等，以阻挡激光取下时激光的透过。
固定子层310设置在所述柔性基板200、所述遮光子层320之间，厚度范围为纳米级到微米级，组成材料可以为透明材料，比如无机物、氟代有机物等，与柔性基板200之间的粘接强度为1-20克力/英尺。
在一些实施例中，如图5所示，显示面板母板1000还包括驱动电路层400和显示介质层500。驱动电路层400设置在所述柔性基板上，用于控制画面的显示。显示介质层500设置在所述驱动电路层400上，具体为电子纸、电泳类等显示介质。
请参照图6，图6为本发明实施例提供的显示面板母板的切割方法的流程示意图。该切割方法用于对上述的显示面板母板1000进行切割，具体步骤如下：
S601，将非切割区域的柔性基板和硬性基板剥离。
如图7和图8所示，先采用激光取下的方法剥离（Stripping）非切割区域220的柔性基板200和硬性基板100。由于固定层300具有遮光性能，能够遮挡激光，不会与切割区域210的柔性基板200剥离，因此切割区域210的柔性基板200和硬性基板100通过固定层300固定在一起。
S602，沿切割区域的柔性基板，对柔性基板进行切割，到接触到固定层为止。
由于固定层300可以使柔性基板200固定在硬性基板100上，因此避免了柔性基板200因悬空造成的切割对位不准。故如图7所示，可沿着切割区域210的柔性基板200对柔性基板200进行切割（Cutting），直到接触到固定层300为止。
在一些实施例中，所述将非切割区域220的柔性基板200和硬性基板100剥离步骤之后，还可以如图8所示，沿切割区域210的柔性基板200对柔性基板200进行切割（Cutting），延伸至硬性基板100为止，来切割柔性基板200。
进一步的，可以通过机械取下的方法将固定层300和柔性基板200剥离。将硬性基板100和固定层300移除（Removing）后，得到如图7和图8所示柔性基板200。再将柔性基板200贴合背板，得到最终的柔性显示装置。
本发明实施例提供了一种显示面板母板及显示面板母板的切割方法，其中显示面板母板通过在显示面板母板的切割区域柔性基板和硬性基板之间设置固定层，在剥离非切割区域的柔性基板、硬性基板，沿切割区域柔性基板切割柔性基板时，将柔性基板固定在硬性基板上，提高了切割效率。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板母板，其包括：硬性基板、柔性基板和固定层，所述柔性基板包括切割区域和非切割区域；
    所述非切割区域的所述柔性基板与所述硬性基板贴合；
    所述固定层设置在所述切割区域的所述柔性基板和所述硬性基板之间，在剥离所述非切割区域的所述柔性基板、所述硬性基板，沿所述切割区域的柔性基板切割所述柔性基板时，所述固定层用于将所述柔性基板固定在所述硬性基板上。
    其中所述固定层与所述柔性基板的粘接强度范围为1-20克力/英尺；
    其中所述固定层的组成材料为非透明材料。
  2. 根据权利要求1所述的显示面板母板，其中所述切割区域包括多个切割子区域，所述固定层包括与所述多个切割子区域的所述柔性基板一一对应的多个固定部；
    所述多个固定部邻接排列或间隔排列。
  3. 根据权利要求2所述的显示面板母板，其中所述固定部底面形状为长条形、圆形、方形或圆角方形。
  4. 根据权利要求1所述的显示面板母板，其中所述固定层包括固定子层和遮光子层；
    所述遮光子层，设置在所述硬性基板上；
    所述固定子层设置在所述柔性基板、所述遮光子层之间。
  5. 根据权利要求4所述的显示面板母板，其中所述遮光子层的组成材料为非透明材料。
  6. 根据权利要求4所述的显示面板母板，其中所述固定子层的组成材料为透明材料，所述固定子层与所述柔性基板的粘接强度范围为1-20克力/英尺。
  7. 根据权利要求1所述的显示面板母板，其中所述非切割区域的柔性基板和所述硬性基板之间的粘接强度大于50克力/英尺。
  8. 根据权利要求1所述的显示面板母板，其中所述显示面板母板还包括驱动电路层和显示介质层；
    所述驱动电路层，设置在所述柔性基板上；
    所述显示介质层，设置在所述驱动电路层上。
  9. 一种显示面板母板，其包括：硬性基板、柔性基板和固定层，所述柔性基板包括切割区域和非切割区域；
    所述非切割区域的所述柔性基板与所述硬性基板贴合；
    所述固定层设置在所述切割区域的所述柔性基板和所述硬性基板之间，在剥离所述非切割区域的所述柔性基板、所述硬性基板，沿所述切割区域的柔性基板切割所述柔性基板时，所述固定层用于将所述柔性基板固定在所述硬性基板上。
  10. 根据权利要求9所述的显示面板母板，其中所述固定层与所述柔性基板的粘接强度范围为1-20克力/英尺。
  11. 根据权利要求9所述的显示面板母板，其中所述固定层的组成材料为非透明材料。
  12. 根据权利要求9所述的显示面板母板，其中所述切割区域包括多个切割子区域，所述固定层包括与所述多个切割子区域的所述柔性基板一一对应的多个固定部；
    所述多个固定部邻接排列或间隔排列。
  13. 根据权利要求12所述的显示面板母板，其中所述固定部底面形状为长条形、圆形、方形或圆角方形。
  14. 根据权利要求9所述的显示面板母板，其中所述固定层包括固定子层和遮光子层；
    所述遮光子层，设置在所述硬性基板上；
    所述固定子层设置在所述柔性基板、所述遮光子层之间。
  15. 根据权利要求14所述的显示面板母板，其中所述遮光子层的组成材料为非透明材料。
  16. 根据权利要求14所述的显示面板母板，其中所述固定子层的组成材料为透明材料，所述固定子层与所述柔性基板的粘接强度范围为1-20克力/英尺。
  17. 根据权利要求9所述的显示面板母板，其中所述非切割区域的柔性基板和所述硬性基板之间的粘接强度大于50克力/英尺。
  18. 根据权利要求9所述的显示面板母板，其中所述显示面板母板还包括驱动电路层和显示介质层；
    所述驱动电路层，设置在所述柔性基板上；
    所述显示介质层，设置在所述驱动电路层上。
  19. 一种显示面板母板的切割方法，用于对权利要求1所述的显示面板母板进行切割，其包括：
    将非切割区域的柔性基板和硬性基板剥离；
    沿切割区域的柔性基板，对所述柔性基板进行切割，到接触到所述固定层为止。
  20. 根据权利要求19所述的显示面板母板的切割方法，其中所述将非切割区域的柔性基板和硬性基板剥离步骤之后，还包括：
    沿切割区域的柔性基板，对所述柔性基板进行切割，延伸至硬性基板为止。
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CN105679808A (zh) * 2016-04-18 2016-06-15 京东方科技集团股份有限公司 一种柔性显示基板及其半切割损伤检测方法和制作方法
CN106024704A (zh) * 2016-05-27 2016-10-12 京东方科技集团股份有限公司 一种柔性显示面板及其制作方法和柔性显示装置
CN106935596A (zh) * 2017-02-22 2017-07-07 武汉华星光电技术有限公司 一种柔性基板的制备方法
CN106842669A (zh) * 2017-04-06 2017-06-13 信利半导体有限公司 一种柔性彩膜基板及其制造方法
CN107146856A (zh) * 2017-05-11 2017-09-08 京东方科技集团股份有限公司 柔性显示母板及其制备方法、切割方法
CN107195658A (zh) * 2017-05-25 2017-09-22 上海天马微电子有限公司 柔性基板及其制作方法

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