WO2019074278A1 - Ensemble module de del pour affichage - Google Patents

Ensemble module de del pour affichage Download PDF

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Publication number
WO2019074278A1
WO2019074278A1 PCT/KR2018/011922 KR2018011922W WO2019074278A1 WO 2019074278 A1 WO2019074278 A1 WO 2019074278A1 KR 2018011922 W KR2018011922 W KR 2018011922W WO 2019074278 A1 WO2019074278 A1 WO 2019074278A1
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WO
WIPO (PCT)
Prior art keywords
led module
unit substrate
light absorbing
absorbing layer
led
Prior art date
Application number
PCT/KR2018/011922
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English (en)
Korean (ko)
Inventor
민천기
김근오
노희경
조경민
Original Assignee
주식회사 루멘스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180119031A external-priority patent/KR102657094B1/ko
Application filed by 주식회사 루멘스 filed Critical 주식회사 루멘스
Priority to CN201880002168.2A priority Critical patent/CN109844948A/zh
Publication of WO2019074278A1 publication Critical patent/WO2019074278A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the present invention relates to an LED module assembly, and more particularly, to an LED module assembly in which an LED module is formed by connecting side surfaces thereof to each other to prevent color interference of light or diffused light at a joint portion of LED modules, To an LED module assembly.
  • a conventional LED module assembly includes a plurality of LED modules 2 to which side surfaces are connected.
  • Each of the plurality of LED modules 2 includes a unit substrate 22, a plurality of LED chips 24a, 24b, and 24c mounted on the unit substrate 22 to form a plurality of pixels, And a black molding part 26 formed on the unit substrate 22 so as to cover both the upper surface and the side surfaces of the plurality of LED chips 24a, 24b and 24c by a molding process.
  • the black molding part 26 is formed by a transfer molding process using a resin material mixed with black carbon.
  • the black molding portion 26 is provided for the purpose of reducing color interference due to the side light from the side of the R, G, and B LED chips for the pure black color of the display.
  • Each of the plurality of LED modules 2 is formed by separating and cutting one large LED module material into a plurality of LED modules 2.
  • Each of the plurality of LED modules 2 formed by cutting the LED modules 2 is divided into a side surface of the unit substrate 22, 26 are formed as a cut surface.
  • the LED display when applied to a module assembly device, a display device, obtain at the same time, the LED module 2, the joint boundaries between tteurige is severely appear significantly degrade the display quality as in Fig.
  • the above-described phenomenon is one of the causes of diffused reflection of light generated from the plurality of LED modules on the cut surface of the black molding part 26 formed by, for example, swaging.
  • the joint boundary is formed like a line.
  • an LED module assembly for a display including a first LED module and a second LED module, wherein the first LED module and the second LED module are mounted on a first unit substrate And a second unit substrate; A plurality of LED chips mounted on the substrate to form a plurality of pixels; And a light absorbing layer comprising a first light absorbing layer formed on the first unit substrate and a second light absorbing layer formed on the second unit substrate, wherein the light absorbing layer comprises a plurality of valley Wherein the first light absorbing layer and the second light absorbing layer are formed on the first unit substrate and the outer unit chip on the second unit substrate from the vicinity of the upper edge of the interface between the first unit substrate and the second unit substrate, And a first inclined portion and a second inclined portion inclined to the upper side of each side, at least one of the plurality of valleys being formed by the first inclined portion and the second inclined portion.
  • the light absorbing layer comprises inter-chip valleys formed between two adjacent LED chips of each of the plurality of pixels.
  • the width of the valley is preferably larger than the width of the interchip valley.
  • the light absorbing layer is formed by applying a liquid or gel-like material containing a black color material onto the substrate.
  • the valley extends obliquely from the upper side edge of the side of the LED chip toward the lower valley closest to the substrate surface.
  • the valley bottom is centrally located between two neighboring LED chips.
  • the first unit substrate and the second unit substrate include a light absorbing portion formed on a side to be connected to each other.
  • the light absorbing portion is formed by applying a material having a light absorbing color to the side surface of the first unit substrate and the side surface of the second unit substrate.
  • At least one of the plurality of valleys is formed in contact with the light absorption pattern film formed in advance in the first unit substrate or the second unit substrate.
  • the inter-chip valley is formed in contact with the light absorption pattern film formed in advance in the first unit substrate or the second unit substrate.
  • the plurality of LED chips are flip-chip bonded on the first unit substrate or the second unit substrate.
  • the side surfaces of the first unit substrate and the second unit substrate may be vertical cut surfaces.
  • the surface of each of the plurality of LED chips is exposed to the outside with the same height as the top of the valley.
  • the interval of the valley formed at the boundary between the first LED module and the second LED module by the first slope part and the second slope part is different from the distance between the first LED module and the second LED module, It is preferable that the interval of the other valleys formed between two pixels adjacent to each other only on either one of the two valleys.
  • the first LED module and the second LED module further include a first light transmitting layer formed on the first light absorbing layer and a second light transmitting layer formed on the second light absorbing layer .
  • each of the first light-transmitting layer and the second light-transmitting layer includes a first surface that is in contact with the plurality of valleys and a second surface that is formed flat on the opposite side of the first surface.
  • an LED module assembly comprising a first LED module and a second LED module, wherein the first LED module and the second LED module include a first unit substrate and a second unit substrate,
  • a plasma display panel comprising: a substrate including a unit substrate; A plurality of LED chips mounted on the substrate; And a light absorbing layer including a first light absorbing layer formed on the first unit substrate and a second light absorbing layer formed on the second unit substrate, wherein the light absorbing layer comprises a plurality of inter-chip valleys wherein the first light absorbing layer and the second light absorbing layer are formed on the first unit substrate and the outer light emitting layer on the second unit substrate from the upper edge of the interface between the first unit substrate and the second unit substrate,
  • each of the first inclined portion and the second inclined portion includes a first inclined portion and a second inclined portion that are inclined to the upper side of each side of the chip, and at least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion.
  • the LED modules are formed by joining the side surfaces of the LED modules, thereby preventing color interference of light or diffused light at the joints of the LED modules, thereby realizing seamless display characteristics.
  • the present invention is characterized in that the light absorbing layer provided in the form of an underfill includes a plurality of inter-pixel valleys and inter-chip valleys, and also the inter-pixel valleys are provided at the joint portions of the two LED modules, Thereby improving the seamless characteristics at the cut surface of the existing LED module.
  • the present invention is characterized in that the valley is previously formed at the part where the cut surface is formed by sawing, scribing or breaking Therefore, even when the cut surface is formed, irregular reflection is less, which can contribute to improvement of light efficiency.
  • the present invention since the light absorbing material including black color does not exist on the LED chip, the present invention has the light quantity improving effect.
  • the LED module assembly according to the present invention is advantageous in that the height deviation can be easily managed as compared with an LED module assembly including a black molding part formed by a squeezing process.
  • FIG. 3 is a cross-sectional view illustrating an LED module assembly according to an exemplary embodiment of the present invention
  • FIG. 4 is a plan view for explaining an LED module assembly according to an embodiment of the present invention.
  • Fig. 6 is an enlarged view of circle “ B " in Fig. 3,
  • FIG. 7 is a view for explaining another embodiment of the present invention.
  • FIG. 8 is a view for explaining an LED module assembly according to another embodiment of the present invention.
  • FIGS. 9 to 12 are views for explaining a method of manufacturing the LED module shown in FIG.
  • 3 to 6 are views for explaining an LED module assembly according to an embodiment of the present invention.
  • the LED module assembly for a display includes a plurality of LED modules 100 having side surfaces connected to each other.
  • the plurality of LED modules 100 includes a first LED module 100, a second LED module 100, ..., and an n-th LED module.
  • two LED modules adjacent to each other among a plurality of LED modules are referred to as a first LED module 100 and a second LED module 100, and the same number is used for the member numbers.
  • the LED module assembly includes a first unit substrate 110, which is a part of the first LED module 100, and a second unit substrate 110, which is a part of the second LED module 100.
  • the first LED module 100 and the second LED module 100 are connected to each other such that the first unit substrate 110 and the second unit substrate 110 are connected to each other.
  • the first LED module 100 and the second LED module 100 are mounted on the first unit substrate 110 and the second unit substrate 110 to form a plurality of pixels 120 And includes a plurality of LED chips 121, 122, and 123.
  • the first LED module 100 and the second LED module 100 may include a first light absorbing layer 130 formed on the first unit substrate 110 and a second light absorbing layer 130 formed on the second unit substrate 110. [ And a second light absorbing layer 130.
  • the unit substrate 110 may be a PCB (Printed Circuit Board), a flexible substrate (e.g., FPCB), or a transparent organic substrate.
  • the light absorbing layer including the first light absorbing layer 130 and the second light absorbing layer 130 may have a black color absorbing light, for example, and may be a pure black color 122, and 123 as well as improving the display image quality by eliminating color interference caused by the side light of the LED chips 121, 122, and 123.
  • a black color absorbing light for example, and may be a pure black color 122, and 123 as well as improving the display image quality by eliminating color interference caused by the side light of the LED chips 121, 122, and 123.
  • black molding unit of the related art So that the light amount is not substantially reduced, and in particular, a seamless characteristic in which a seam is not seen at the time of driving the display is developed.
  • the first LED module 100 and the second LED module 100 may be formed of a large substrate (not shown) having a number of times larger than the unit substrate and a plurality of LED chips mounted on the substrate And may be formed separately from the LED module material (not shown).
  • the side surfaces of the first unit substrate 110 and the second unit substrate 110 are vertically cut surfaces formed by the cutting.
  • a light absorbing portion 112 is formed on a side surface of the first unit substrate 110 and the second unit substrate 110, which form a boundary surface.
  • the light absorbing part 112 may be formed by applying a material having a light absorbing color, such as black ink, to the side surface of the first unit substrate 110 and the side surface of the second unit substrate 110.
  • a plurality of pixels 120 are arranged in a matrix array on the first unit substrate 110 and the second unit substrate 110, respectively.
  • Each of the pixels 120 includes a red LED chip 121, a green LED chip 122, and a blue LED chip 123.
  • the LED chips 121, 122 and 123 that is, the red LED chip 121, the green LED chip 122 and the blue LED chip 123 in the pixel 120 are arranged at regular intervals.
  • the LED chips 121, 122 and 123 are mounted on the unit substrate 110 by flip-chip bonding. Thus, the LED chips 121, 122 and 123 do not have bonding wires.
  • the LED chips 121, 122 and 123 may have a bonding wire on the LED chips 121, 122 and 123 by mounting a vertical chip on the corresponding unit substrate 110, have.
  • each of the LED module 100 the pixels 120 are arrayed with a constant transverse spacing a and a constant longitudinal spacing b.
  • the lateral spacing between the laterally adjacent pixels 120, 120 is constant at a
  • the longitudinal spacing between pixels 120 and 120 is constant b.
  • the horizontal interval between two neighboring pixels between two adjacent LED modules 100 and 100 is also a, and the interval between pixels in the corresponding LED module a, and the longitudinal spacing between two neighboring pixels between two adjacent LED modules 100 and 100 in the longitudinal direction is also b, which is equal to the inter-pixel spacing b in the corresponding LED module.
  • the inter-pixel valley width located between two adjacent lateral LED chips 121 and 121, 122 and 122, 123 and 123 between two laterally neighboring pixels is such that the two neighboring pixels in the transverse direction are in the same LED module
  • the width of the inter-pixel valley formed between the two adjacent LED chips 121 and 123 between two vertically adjacent pixels is equal to or less than the width of the vertical direction
  • the two neighboring pixels are the same regardless of whether they are in the same LED module or in other LED modules neighboring each other in the end direction.
  • a light absorbing layer 130 is formed on a substrate including the first unit substrate 110 and the second unit substrate 110, and the light absorbing layer 130 is formed on the substrate including the first unit substrate 110 and the second unit substrate 110, A first light absorbing layer 130 formed on one unit substrate 110 and a second light absorbing layer 130 formed on the second unit substrate 110.
  • the light absorbing layer 130 includes a plurality of valleys 132 formed between a plurality of pixels 120, more specifically, an inter-pixel valley 132.
  • Each of the plurality of valleys 132 is formed between two neighboring LED chips 123 and 121 between two neighboring pixels.
  • the light absorption layer includes inter-chip valleys 133 formed between two adjacent LED chips 121 and 122 or 122 and 123 in the plurality of pixels 120, respectively.
  • the distance between two neighboring LED chips 123 and 121 between two neighboring pixels 120 and 120 is greater than the distance between two neighboring LED chips 121 and 122 or 122 and 123 in each pixel 120
  • the width of the valley 132 formed between the neighboring two pixels 120 and 120 is smaller than the inter-chip valley 133 formed between two neighboring LED chips 121 and 122 or 122 and 123 in each pixel 120. [ Is set to be larger than the width.
  • the inter-pixel valley 132 is formed of a pixel lower valley 132a nearest to the surface of the first unit substrate 110 or the second unit substrate 110 from the upper side edge of the side of the pixel outer- And forming a slight curvature.
  • the inter-pixel valley bottom 132a may be located at the center between two neighboring LED chips 123, 121 between two neighboring pixels 120, 120.
  • it is most preferred that the inter-pixel valley bottom 132a is substantially in contact with the surface of the first unit substrate 110 or the second unit substrate 110.
  • the inter-chip valley 133 also has an inter-chip valley bottom 133a nearest to the surface of the first unit substrate 110 or the second unit substrate 110 from the upper side edge of the side of the LED chips 121, And forming a slight curvature.
  • the inter-chip valley bottom 133a may be located at the center between two neighboring LED chips 121 and 122 or 122 and 123 in the neighboring pixel 120. In this case, it is most preferable that the inter-chip valley bottom 133a is substantially in contact with the surface of the first unit substrate 110 or the second unit substrate 110.
  • the depth of the inter-pixel valley 132 is deeper than the depth of the inter-chip valley 133.
  • the first light absorbing layer 130 and the second light absorbing layer 130 are separated from the upper edge of the interface between the first unit substrate 110 and the second unit substrate 110, And includes a first inclined portion 134a and a second inclined portion 134b which are inclined to the upper side of each of the one unit substrate 110 and the pixel inside and outside LED chip 121 or 123 on the second unit substrate 110
  • the first inclined portion 134a and the second inclined portion 134b are formed to be symmetrical with respect to each other with respect to an interface and form one inter-pixel valley 134 when they meet with each other.
  • the inter-pixel valley 134 formed by the meeting of the first inclined portion 134a and the second inclined portion 134b is formed between the inter-pixel valley 134 formed in the first light absorbing layer 130 or the second light absorbing layer 130 itself, And have the same shape and the same size as those of FIG.
  • the light absorption layer 130 may be formed by applying a liquid or gel resin material containing a black color material onto the first unit substrate 110 and the second unit substrate 110 by a spray method .
  • the valley 134 formed by the first inclined portion 134a and the second inclined portion 134b is also inclined from the upper side edge of the side of the LED chip toward the lower end of the valley closest to the substrate surface.
  • the black color material may be black carbon, for example.
  • a liquid or gel resin material containing a black color material is applied to the first unit substrate 110 and the second unit substrate 110 on which the plurality of LED chips 121,
  • the liquid or gel-like resin material fills between the neighboring pixels or between the LED chips in the pixel to form the light absorbing layer 130 described above.
  • liquid or gel-like resin flows all the way from the upper surface to the side surface of the LED chips 121, 122 and 123, And 123 are exposed to the outside. Accordingly, the upper surfaces of the LED chips 121, 122, and 123 are exposed to the outside with the same height as the upper ends of the valleys 132 and 133.
  • the light absorbing layer does not exist on the upper surfaces of the LED chips 121, 122 and 123, it is possible to prevent the efficiency deterioration that can be caused by the light absorbed in the light absorbing layer from passing through the upper surfaces of the LED chips 121, do.
  • FIG. 7 is a view for explaining an LED module assembly according to another embodiment of the present invention.
  • the substrate more specifically, the first or second unit substrate 110 includes the light absorption pattern film 115 on the upper surface, .
  • the light absorption pattern film 115 is formed in advance so as to cover the exposed surface of the substrate 110 except an electrode pattern and the like connected to the electrode pads of the LED chips 121, (Photo Solder Resit) or a black tape.
  • the light absorbing layer 130 is disposed between two neighboring LED chips 123 and 121 between two neighboring pixels on the first unit substrate 110 or the second unit substrate 110 as in the previous embodiment Inter-pixel valleys 132 and inter-chip valleys 133 located between the two LED chips 121 and 122 or 122 and 123 in a specific pixel on the first unit substrate 110 or the second unit substrate 110, , Another inter-pixel valley 134 (Fig. 3 (a)) positioned between two adjacent LED chips 123, 121 between two adjacent pixels between the first unit substrate 110 and the second unit substrate 110
  • the inter-pixel valleys and inter-chip valleys are formed in contact with the light absorption pattern film 115 at the bottom of the valley. This configuration prevents the possibility of the substrate surface being exposed due to the opening of the bottom of the valley, and enables uniform black color implementation throughout the LED module assembly.
  • FIG. 8 is a view for explaining an LED module assembly for a display according to another embodiment of the present invention.
  • the LED module assembly for a display includes a plurality of LED modules 100 that are connected to each other at their side surfaces.
  • the plurality of LED modules 100 includes a first LED module 100, a second LED module 100, ..., and an n-th LED module.
  • the LED module assembly includes a substrate including a plurality of first unit substrates 110 and a second unit substrate 110 which are connected to each other at side surfaces thereof and a plurality of first unit substrates 110 arranged on the first unit substrates 110, A plurality of pixels 120 including a red LED chip 121, a green LED chip 122 and a blue LED chip 123 mounted on the first unit substrate 110 or the second unit substrate 110, A first light absorbing layer 130 formed on the first light absorbing layer 130 and a second light absorbing layer 130 formed on the second unit substrate 110 and a first light transmitting layer 130 formed on the first light absorbing layer 130. [ 140 and a second light transmitting layer 140 formed on the second light absorbing layer 130.
  • the light absorbing layer is formed by a first molding material containing a resin material mixed with a reflective material
  • the light transmitting layer is formed by a second molding material containing a light transmitting resin material and having good light transmittance.
  • the light absorption layer 130 includes inter-pixel valleys formed concavely between neighboring LED chips or inter-pixel valleys formed concavely between neighboring pixels.
  • the polarizing films are attached to the upper surfaces of the light absorbing layer 130 and the LED chips 121, 122 and 123 due to these valleys, uneven surfaces are generated, and further, the polarizing films are not attached as a whole , A gap may be generated between the light absorbing layers and the polarizing films.
  • the light transmitting layer 140 includes a lower surface entirely in contact with the upper surface of the light absorbing layer 130 formed with inter-chip valleys or inter-pixel valleys, and an upper surface that is entirely flat, Thereby filling the upper surface of the light absorbing layer 130 and providing a flat surface in the upper part. Then, a polarizing film or the like may be attached to the flat surface.
  • FIG. 9 A method of forming the optical transmitting layer 130 covering the surfaces of the LED chips 121, 122, and 123 and the surface of the light absorbing layer 130 will be described with reference to FIGS. 9 to 12.
  • FIG. 9 A method of forming the optical transmitting layer 130 covering the surfaces of the LED chips 121, 122, and 123 and the surface of the light absorbing layer 130 will be described with reference to FIGS. 9 to 12.
  • the LED module 100 includes a unit substrate 110 and red, green and blue LED chips 121, 122 and 123 formed on the unit substrate 110 and forming a plurality of pixels, And a light absorbing layer 130 formed to define inter-chip valleys and inter-pixel valleys between neighboring pixels.
  • the light absorbing layer 130 is formed by curing of a primary molding liquid composed of a resin material mixed with a reflective material.
  • a secondary molding liquid 140 ' is applied to the upper surface of the optional film 200.
  • the secondary molding liquid 140 ' may be a fluid resin having a light transmittance (for example, a silicone resin).
  • the dam 300 closes the second molding liquid 140 'as shown in FIG. Thereby, the secondary molding liquid 140 'is filled in the space defined inside the dam 300.
  • the dam 300 may be formed first and then the secondary molding liquid 140 'may be applied to the space inside the dam 300.
  • the above-described LED module 100 in which the light absorption layer 130 having inter-chip valleys and inter-pixel valleys are formed is turned upside down and the upper surface of the red, green and blue LED chips 121, 122, The upper surface of the second mold 130 is immersed in the second molding liquid 140 '.
  • the second molding liquid 140 ' is cured to form a rough surface which is in contact with the surface of the light absorbing layer 130 including inter-chip valleys and inter-pixel valleys
  • a light transmitting layer 140 including a flat surface in contact with the surface of the film 200 is formed. Then, the film 200 is removed.
  • a light absorbing layer a first light absorbing layer; a second light absorbing layer

Abstract

L'invention concerne un ensemble module de DEL pour un dispositif d'affichage, comprenant un premier module de DEL et un second module de DEL. En connexion avec l'ensemble module de DEL, le premier module de DEL et le second module de DEL comprennent un substrat comprenant un premier substrat d'unité et un second substrat d'unité, des surfaces latérales de ceux-ci étant jointes et liées les unes aux autres ; une pluralité de puces de DEL montées sur le substrat de façon à former une pluralité de pixels ; et une couche d'absorption de lumière comprenant une première couche d'absorption de lumière formée sur le premier substrat d'unité et une seconde couche d'absorption de lumière formée sur le second substrat d'unité. La couche d'absorption de lumière comprend une pluralité de creux formés entre la pluralité de pixels. La première couche d'absorption de lumière et la seconde couche d'absorption de lumière comprennent une première partie inclinée et une seconde partie inclinée, qui s'étendent de manière à s'incliner à partir du coin d'extrémité supérieure de la surface de délimitation entre le premier substrat unitaire et le second substrat unitaire à des parties supérieures de surfaces latérales de puces de DEL périphériques extérieures sur le premier substrat unitaire et le second substrat unitaire, respectivement. Au moins l'un de la pluralité de creux est formé en joignant la première partie inclinée et la seconde partie inclinée.
PCT/KR2018/011922 2017-10-12 2018-10-11 Ensemble module de del pour affichage WO2019074278A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880002168.2A CN109844948A (zh) 2017-10-12 2018-10-11 显示器用发光二极管模块组件

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20170132603 2017-10-12
KR10-2017-0132603 2017-10-12
KR10-2018-0119031 2018-10-05
KR1020180119031A KR102657094B1 (ko) 2017-10-12 2018-10-05 디스플레이용 엘이디 모듈 조립체

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WO2019074278A1 true WO2019074278A1 (fr) 2019-04-18

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114241943A (zh) * 2021-12-14 2022-03-25 惠州华星光电显示有限公司 显示屏、显示装置及显示屏的制作方法
US11908881B2 (en) * 2020-01-21 2024-02-20 Seoul Viosys Co., Ltd. LED display apparatus having micro LED module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59206869A (ja) * 1983-05-11 1984-11-22 三菱電機株式会社 液晶表示装置
JPH08122769A (ja) * 1994-09-02 1996-05-17 Sharp Corp 液晶表示装置
JP2009258455A (ja) * 2008-04-18 2009-11-05 Nichia Corp ディスプレイユニット及びその製造方法
JP2011075825A (ja) * 2009-09-30 2011-04-14 Mitsubishi Electric Corp 画像表示装置
JP2016224319A (ja) * 2015-06-02 2016-12-28 三菱電機株式会社 表示装置、表示ユニットおよび表示装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59206869A (ja) * 1983-05-11 1984-11-22 三菱電機株式会社 液晶表示装置
JPH08122769A (ja) * 1994-09-02 1996-05-17 Sharp Corp 液晶表示装置
JP2009258455A (ja) * 2008-04-18 2009-11-05 Nichia Corp ディスプレイユニット及びその製造方法
JP2011075825A (ja) * 2009-09-30 2011-04-14 Mitsubishi Electric Corp 画像表示装置
JP2016224319A (ja) * 2015-06-02 2016-12-28 三菱電機株式会社 表示装置、表示ユニットおよび表示装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11908881B2 (en) * 2020-01-21 2024-02-20 Seoul Viosys Co., Ltd. LED display apparatus having micro LED module
CN114241943A (zh) * 2021-12-14 2022-03-25 惠州华星光电显示有限公司 显示屏、显示装置及显示屏的制作方法
CN114241943B (zh) * 2021-12-14 2024-03-15 惠州华星光电显示有限公司 显示屏、显示装置及显示屏的制作方法

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