WO2010058960A2 - Module électroluminescent et dispositif d'affichage le comportant - Google Patents

Module électroluminescent et dispositif d'affichage le comportant Download PDF

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Publication number
WO2010058960A2
WO2010058960A2 PCT/KR2009/006799 KR2009006799W WO2010058960A2 WO 2010058960 A2 WO2010058960 A2 WO 2010058960A2 KR 2009006799 W KR2009006799 W KR 2009006799W WO 2010058960 A2 WO2010058960 A2 WO 2010058960A2
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting devices
phosphor
board
phosphor film
Prior art date
Application number
PCT/KR2009/006799
Other languages
English (en)
Other versions
WO2010058960A3 (fr
Inventor
Kyung Ho Shin
Original Assignee
Lg Innotek Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Innotek Co., Ltd filed Critical Lg Innotek Co., Ltd
Priority to CN2009801081997A priority Critical patent/CN101960626A/zh
Priority to EP09827725.4A priority patent/EP2250681B1/fr
Priority to JP2011536262A priority patent/JP2012509574A/ja
Publication of WO2010058960A2 publication Critical patent/WO2010058960A2/fr
Publication of WO2010058960A3 publication Critical patent/WO2010058960A3/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133617—Illumination with ultraviolet light; Luminescent elements or materials associated to the cell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H01L2933/0041—
    • H01L33/504—
    • H01L33/507—
    • H01L33/508—
    • H01L33/54—

Definitions

  • Embodiments relate to a light emitting module and a display device having the same.
  • LCD liquid crystal display
  • a backlight unit used as a light source for emitting light toward a rear surface of an LCD panel is provided generally.
  • the backlight unit emits white light so that the liquid crystal panel can reproduce the real colors of the image.
  • Embodiments provide a light emitting module including a phosphor film attached to a light emitting device array, and a display device having the same.
  • Embodiments provide a light emitting module in which a phosphor film is attached to a plurality of light emitting devices that emit light of the same color or different colors to realize a target light emitting device, and a display device having the same.
  • An embodiment provides a light emitting module comprising: a board; a plurality of light emitting devices on the board; and a phosphor film contacting on the board and the light emitting devices.
  • Embodiments provide a light emitting module, display device including the light emitting module, and method of forming the same, which address the limitations and disadvantages associated with the related art.
  • An embodiment provides a display device comprising: a light emitting device comprising a board, a plurality of light emitting devices on the board, light transmitting resins, and a phosphor film contacting on the board and the light transmitting resins; an optical member spaced from the light emitting devices; and a display panel on the optical member.
  • the invention provides a light emitting module comprising: a board; a plurality of light emitting devices on the board; and a phosphor film covering the light emitting devices and covering and extending along areas between the light emitting devices.
  • the invention provides a display device comprising: a light emitting module comprising a board, a plurality of light emitting devices on the board, and a phosphor film covering the light emitting devices and covering and extending along areas between the light emitting devices; an optical member spaced apart from the light emitting module; and a display panel on the optical member.
  • the target color having the uniform color degree can be emitted.
  • the white light emitting module can be easily manufactured.
  • the reliability of the light emitting module using the light emitting devices can be improved.
  • the target light using the plurality of light emitting devices and the phosphor film can be realized.
  • Fig. 1 is a side cross-sectional view illustrating a light emitting module according to a first embodiment of the invention.
  • Figs. 2 to 6 are views illustrating a process of manufacturing the light emitting module according to the first embodiment.
  • Fig. 7 is a side cross-sectional view illustrating a light emitting module according to a second embodiment of the invention.
  • Fig. 8 is a side cross-sectional view illustrating a light emitting module according to a third embodiment of the invention.
  • Fig. 9 is a side cross-sectional view illustrating a display device according to an embodiment of the invention.
  • Fig. 1 is a side cross-sectional view illustrating a light emitting module according to a first embodiment.
  • a light emitting module 100 includes a board 110, a light emitting device 120, a light transmitting resin or layer 130, and a phosphor film or layer 140.
  • the light emitting module 100 may be defined as a single light emitting apparatus. All the components of the light emitting module 100 are operatively coupled and configured.
  • the board 110 may selectively include a single layer printed circuit board (PCB), a multi-layer PCB, a ceramic PCB, and a metal PCB.
  • a line pattern or a coated electrode pattern which has a predetermined pattern shape to supply a power source, may be disposed on the board 110.
  • the line pattern will be described as one example of the pattern for supplying the power source.
  • the invention covers other patterns.
  • a plurality of light emitting devices 120 are mounted or provided on the board 110.
  • the light emitting devices 120 may be mounted on the board 110 in a chip of board (COB) type or a package of board (POB) type.
  • COB chip of board
  • POB package of board
  • COB chip of board
  • POB package of board
  • a structure in which the light emitting device 120 is mounted on the board 110 in the COB type will be described as an example.
  • the invention covers other types.
  • a top or upper surface of the board 110 may have a flat plane shape, or a plurality of cavities may be formed in the top surface of the board 110. At least one light emitting device 120 and the light transmitting resin 130 may be disposed inside the cavities of the board 110. In examples, a single light emitting device 120 or multiple light emitting devices 120 may be disposed in each of the cavities of the board 110. The cavities can be in any shape or size. In another variation, projections may be provided on the board 110 and the light emitting devices 120 may be disposed on these projections.
  • the plurality of light emitting devices 120 may be arranged on the board 110 in a transverse direction and/or in a longitudinal direction to form an array structure. Alternatively, the plurality of light emitting devices 120 may be arranged in a matrix or zigzag shape, or in other suitable shapes or patterns.
  • the plurality of light emitting devices 120 may be arranged spaced from each other by a predetermined distance, but is not limited thereto.
  • a reflective material may be coated on a region of the board 110 excluding a region, in which the light emitting device 120 is disposed, to reflect incident light.
  • Each light emitting device 120 may be electrically connected to the line pattern (not shown) formed on the board 110 using a wire 122.
  • each light emitting device 120 may be electrically connected using a single wire or multiple wires.
  • the light emitting devices 120 may be mounted by selectively using a wire bonding method, a flip chip method, or a die bonding method. Such a connection method of the light emitting device 120 may be changed according to a chip kind and a mounting method, but the invention is not limited thereto.
  • the plurality of light emitting devices 120 may be connected to each other in series or parallel. Such a connection method may be changed according to a circuit pattern and a driving method.
  • Each light emitting device 120 may include one of a blue LED chip, a green LED chip, a red LED chip, and an ultraviolet (UV) LED chip.
  • a blue LED chip a green LED chip
  • a red LED chip a red LED chip
  • UV LED chip an ultraviolet (UV) LED chip.
  • the light emitting device having the blue LED chip that emits blue light will be described below as one non-limiting example.
  • the light transmitting resin 130 is disposed on the light emitting devices 120.
  • the light transmitting resin 130 may include a transparent resin formed of silicon or epoxy.
  • the light transmitting resin 130 may have a hemisphere shape or a convex lens shape, e.g., for covering the light emitting device(s) 120.
  • the shape of the light transmitting resin 130 may be variously modified according to light efficiency and light distribution.
  • the light transmitting resin 130 may seal at least one light emitting device 120.
  • the light transmitting resin 130 may seal one light emitting device 120 or two or more light emitting devices 120 at a time.
  • the sealed shape may be a hemisphere shape or a convex lens (including a total reflection lens, etc.) shape.
  • the light transmitting resin 130 may also be a planarized/flat layer covering the light emitting devices 120, or can be in the hemisphere or convex lens shape directly over each light emitting device 120 with the resin 130 covering and connecting areas between the hemisphere/convex lens shaped resin 130.
  • the phosphor film 140 is disposed on the light transmitting resins 130.
  • the phosphor film 140 may be curved along a surface of the light transmitting resin 130 and may be tightly attached or adhered to the surface of the light transmitting resin 130.
  • the phosphor film 140 is attached along or in contact with top surfaces of the board 110 between the curved shaped portions of the light transmitting resin 130 over the light emitting devices 120.
  • the phosphor film 140 can preferably cover the entire exposed surfaces of the light transmitting resin 130 and/or the entire exposed surfaces of the board 110.
  • the phosphor film 140 may include a transparent film formed of a mixture of a polymer such as silicon or epoxy and a phosphor.
  • the phosphor may include at least one phosphor of a yellow phosphor, a red phosphor, a blue phosphor, and a green phosphor.
  • the phosphor film 140 containing the yellow phosphor will be described as an example.
  • the light emitting module 100 a light emitting device array on the board 110 is sealed by the light transmitting resin 130. Then, the phosphor film 140 is stacked on the entire surface of the board 110 to adhere thereto.
  • the light transmitting resin 130 may have a predetermined lens shape.
  • the light emitting module 100 emits light of a first color from one of the light emitting devices 120.
  • the light of the first color emitted from the light emitting device 120 is emitted through the light transmitting resin 130.
  • the light of the first color enters the phosphor film 140.
  • a portion of the light of the first color is absorbed into the phosphor in the phosphor film 140, and then, is emitted as light of a second color.
  • the light of the first color and the light of the second color are mixed to produce light of a third color that is target light, thereby emitting the light of the third color.
  • the light of the first color is blue light generated by the blue LED chip in one particular light emitting device 10
  • the light of the second color is yellow light generated by the yellow phosphor in the phosphor film 140
  • the light of the third color emerging from the phosphor film 140 above the particular light emitting device 10 may be white light.
  • the phosphor film 140 may be changed within the above-described technical scope.
  • the light emitting device 120 since the light emitting device 120 is spaced a predetermined distance from the phosphor film 140, it may prevent the phosphor of the phosphor film 140 from being degraded or discolored. Also, since the phosphor film 140 is closely attached to the light transmitting resin 130 with preferably a uniform distribution and the same thickness, target light having a uniform color degree may be emitted.
  • the light emitted from the light emitting device 120 is diffused by the light transmitting resin 130 to pass through the entire region of the phosphor film 140 covering the light transmitting resin 130, uniformly distributed light is emitted from the phosphor film 140.
  • Figs. 2 to 6 are views illustrating a process of manufacturing the light emitting module according to the first embodiment.
  • a plurality of light emitting devices 120 are mounted on a board 110.
  • the board 110 may selectively include a single layer PCB, a multilayer PCB, a ceramic PCB, and/or a metal PCB.
  • a line pattern) or a coated electrode pattern, each having a predetermined pattern shape to supply a power source, may be disposed on the board 110.
  • the line pattern will be described as the pattern for supplying the power source as an example.
  • the plurality of light emitting devices 120 are mounted on the board 110.
  • the light emitting devices 120 may be mounted on the board 110 in a COB type or a POB type.
  • COB type a structure in which the light emitting device 120 is mounted on the board 110 in the COB type will be described as an example.
  • the plurality of light emitting devices 120 may be arranged on the board 110 in a transverse direction and/or in a longitudinal direction to form an array structure. Alternatively, the plurality of light emitting devices 120 may be arranged in a matrix or zigzag shape.
  • a top surface of the board 110 may have a flat plane shape, or a plurality of grooves may be formed in or on the top surface of the board 110. At least one light emitting device 120 may be disposed inside the grooves or a cavity of the board 110.
  • Each light emitting device 120 is attached to the line pattern of the board 110 and is electrically connected to the line pattern formed on the board 110 using a wire 122.
  • the light emitting device 120 may be mounted by selectively using at least one method of a wire bonding method, a flip bonding method, and a die bonding method.
  • Each light emitting device 120 may include one of colored LED chips such as a blue LED chip, a green LED chip, and a red LED chip, or a UV LED chip.
  • the LED chip may be modified according to target light to be output.
  • a light transmitting resin 130 is formed on the light emitting device 120.
  • the light transmitting resin 130 may include a transparent resin formed of silicon or epoxy.
  • the light transmitting resin 130 may have a hemisphere shape or a convex lens shape (including a total-reflection lens, etc.).
  • the shape of the light transmitting resin 130 may be variously modified according to desired light distribution and light quantity.
  • the light transmitting resin 130 may seal one light emitting device 120 or two or more light emitting devices 120 of the same group.
  • an adhesive 151 is sprayed onto the board 110 using a spraying equipment (e.g., sprayer) 150 or can be applied onto the board 110 in some other manner.
  • the adhesive 151 is preferably formed of a polymer such as silicon or epoxy.
  • the adhesive 151 may be uniformly coated on the surfaces of the board 110 and the light transmitting resin 130 using the spraying equipment 150.
  • the adhesive 151 is coated on the entire surface of the board 110 having the light transmitting resin 130.
  • the adhesive 151 is coated on the surfaces of the light transmitting resin 130 and the board 110.
  • a phosphor film 140 is disposed on the board 110.
  • the phosphor film 140 is heated by irradiating preferably uniform heat using a heating equipment to form the flexible phosphor film 140.
  • the heating process may be variously performed according to a mother material of the phosphor film 140.
  • the heating process may be performed at a temperature of about 50°C to about 200°C.
  • At least one phosphor e.g., a yellow phosphor, a red phosphor, a blue phosphor, and/or a green phosphor may be selectively added to the phosphor film 140.
  • the phosphor film 140 containing the yellow phosphor will be described as an example.
  • the flexible phosphor film 140 is closely attached to the board 110. At this time, the phosphor film 140 is closely attached to the board 110 using an air blow equipment. The phosphor film 140 may be closely attached to the surfaces of the board 110 and the light transmitting resin 130 using a separate compressing unit.
  • the phosphor film 140 is curved along the surface of the light transmitting resin 130 on the board 110 and adheres thereto.
  • the phosphor film 140 is closely attached preferably with a uniform thickness, but may have a varying thickness.
  • the phosphor film 140 is closely attached to the surfaces of the board 110 and the light transmitting resin 130.
  • a top surface of the board 110 including the phosphor film 140 is heated using the heating equipment to harden the top surface of the board 110.
  • the phosphor film 140 is hardened while the closely attached phosphor film 140 is heated to more completely be attached to the surfaces of the board 110 and the light transmitting resin 130.
  • a hardened condition may be changed according to the mother material of the phosphor film 140.
  • the phosphor film 140 is closely attached to the light transmitting resin 130 with the uniform thickness, a target light having a uniform color degree is secured by the light emitting module 100 according to the invention.
  • the light emitting device 120 arranged in an array form on the board 100 is protected by the light transmitting resin 130. Then, the phosphor film 400 is closely attached to the surface of the board 110 to simply manufacture the light emitting module 100. Therefore, discoloration of the phosphor is prevented or minimized to improve reliability.
  • Fig. 7 is a side cross-sectional view illustrating a light emitting module according to a second embodiment.
  • parts having the same structure as the first embodiment will be generally identified using the same reference numbers and described with reference to the first embodiment, and some of their duplicated description will be omitted for the sake of brevity.
  • a light emitting module 100A includes a board 110, a plurality of light emitting devices 121, a plurality of light transmitting resins 130, and a phosphor film 140A divided into a plurality of phosphor parts 141, 142, and 143. All the components of the light emitting module 100A are operatively coupled and configured.
  • Each of the light emitting devices 121 may include a UV LED chip disposed in a chip or package type.
  • the light emitting device 121 can be identical to the light emitting devices 120.
  • At least two or more different phosphors are separately provided into regions and disposed to form the phosphor film 140A.
  • a case in which three kinds of phosphors are disposed as part of the phosphor film 140A will be described as an example.
  • the invention covers a phosphor film 140A having any number of different phosphor parts, which may be arranged repeatedly in a certain sequence or which may be arranged in a certain pattern.
  • the third phosphor part 143 may be disposed between the first phosphor part 141 and the second phosphor part 142 with a distance corresponding to that of at least two light emitting devices 121 therebetween.
  • An array direction of the first to third phosphor parts 141, 142, and 143 may be disposed in a transverse direction and/or in a longitudinal direction, but is not limited to the array direction.
  • the plurality of light emitting devices 121 may be spaced a predetermined distance apart from each other, and a distance between a start portion of the first phosphor part 141 and a start portion of the third phosphor part 143 may correspond to the distance between the corresponding light emitting devices 121.
  • the first to third phosphor parts 141, 142, and 143 are closely attached and adhered to each of the portions of the light transmitting resin 130 covering the light emitting devices 121.
  • the first phosphor part 141, the second phosphor part 142, and the third phosphor part 143 of the phosphor film 140A may be classified into a blue phosphor region, a green phosphor region, and a red phosphor region, respectively, but is not limited to this order of the phosphors.
  • Phosphor particles that are equal to or different from each other may be added to the first to third phosphor parts 141, 142, and 143 of the phosphor film 140.
  • An addition rate may be varied within the technical scope of the embodiment(s) according to light distribution and light density.
  • each of the first to third phosphor parts 141, 142, and 143 may extend for a distance corresponding to a region covering each light emitting device 121, and the number and cycle of phosphor parts may be changed.
  • the UV light when UV light is emitted through the light emitting device 121, the UV light is mixed with the light emitted from each of the phosphor parts 141, 142, and 143 of the phosphor film 140A to produce white light.
  • the phosphor film 104A may include four phosphor regions, e.g., regions of a red phosphor part, a green phosphor part, a blue phosphor part, and a yellow phosphor part.
  • the red phosphor part, the green phosphor part, and the blue phosphor part may be disposed in a region of a UV LED chip, and the yellow phosphor part may be disposed in a region of a blue LED chip.
  • the blue LED chip and the yellow phosphor part may be disposed at predetermined positions, respectively. The positions may be variously changed within the technical scope of the embodiments.
  • Fig. 8 is a side cross-sectional view illustrating a light emitting module according to a third embodiment of the invention.
  • the light emitting module 100B is preferably identical to the light emitting module 100, but differs from the light emitting module 100 in that the light emitting resin 130 covers the light emitting devices 120 and also extends along the areas between the light emitting devices 120.
  • the phosphor film 140 is formed directly on the light emitting resin 130, and covers the light emitting devices 120 and extends along the areas between the light emitting devices 120.
  • Fig. 9 is a side cross-sectional view illustrating a display device according to an embodiment.
  • a display device 200 includes a bottom cover 210, a light emitting module 100, an optical sheet 220, and a display panel 230. All the components of the display device 200 are operatively coupled and configured.
  • the bottom cover 210 may have a container shape, and an inside surface 250 of the bottom cover 210 may be inclined or vertically disposed.
  • a reflective material e.g., silver (Ag)
  • a reflective sheet may be adhered to the inside surface 250.
  • the bottom cover 210 may be formed of a metallic material.
  • the bottom cover 210 may be formed of one of aluminum (Al), magnesium (Mg), zinc (Zn), titanium (Ti), tantalum (Ta), hafnium (Hf), and niobium (Nb).
  • An upper cavity or space 201 having a predetermined depth may be defined in the bottom cover 210, but is not limited thereto.
  • At least one light emitting module 100 may be coupled to the upper cavity 201 of the bottom cover 210.
  • the light emitting module 100 may be arranged in one or more lines and/or one or more rows, but is not limited thereto.
  • the light emitting module 100 includes a board 110, a light emitting device 120, a light transmitting resin 130, and a phosphor film 140, as discussed above with reference to the first embodiment.
  • target light mixing the first light with the second light may be irradiated from the phosphor film 140.
  • At least one optical sheet 220 is disposed on the light emitting module 100.
  • the optical sheet 220 may be spaced a predetermined distance from the light emitting module 100.
  • the optical sheet 220 may be supported by a guide pin.
  • the optical sheet 220 may include a diffusion sheet and/or a prism sheet.
  • the diffusion sheet diffuses the light emitted from the light emitting device 120, and the diffused light is guided to a light emitting region by the prism sheet.
  • the prism sheet may include a horizontal and/or vertical prism sheet and one or more luminance enhancement films.
  • a display panel (e.g., LCD panel) 230 is disposed on the optical sheet 220 to display images using the light emitted from the optical sheet 230.
  • the display panel 230 further includes known components of a display panel such as thin film transistor arrays, color filters, etc.
  • the display device 200 can include other known components.
  • the display device 200 can include the light emitting module 100A or 100B instead of the light emitting module 100.
  • the LED e.g., LED chips of the light emitting devices 120
  • the LED can be spaced a predetermined distance from the phosphor to prevent the phosphor from being discolored.
  • the target color having the uniform color degree can be emitted.
  • the white light emitting module can be easily manufactured.
  • the reliability of the light emitting module using the light emitting devices can be improved.
  • the target light using the plurality of light emitting devices and the phosphor film can be realized.
  • the light emitting module can be used as a light source of a lighting module, a display device, or an indication device using the plurality of light emitting devices and the phosphor film.
  • the light emitting module can be applied to a backlight unit including the plurality of light emitting devices and the phosphor film, where the backlight unit can be used in a display device or in other suitable device.
  • the light emitting module can be used as a light source of a lighting module, a display device, or an indication device using the plurality of light emitting devices and the phosphor film.
  • the light emitting module can be applied to a backlight unit including the plurality of light emitting devices and the phosphor film, where the backlight unit can be used in a display device or in other suitable device.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

La présente invention concerne un module électroluminescent et un dispositif d'affichage le comportant. Selon un mode de réalisation, ledit module comprend un panneau, une pluralité de dispositifs électroluminescents sur le panneau et un film de luminophore couvrant lesdits dispositifs, et couvrant des zones entre lesdits dispositifs et s'étendant le long de celles-ci.
PCT/KR2009/006799 2008-11-18 2009-11-18 Module électroluminescent et dispositif d'affichage le comportant WO2010058960A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2009801081997A CN101960626A (zh) 2008-11-18 2009-11-18 发光模块以及具有发光模块的显示装置
EP09827725.4A EP2250681B1 (fr) 2008-11-18 2009-11-18 Module électroluminescent et dispositif d'affichage l'incorporant
JP2011536262A JP2012509574A (ja) 2008-11-18 2009-11-18 発光モジュール及びこれを備えたディスプレイ装置

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Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5176750B2 (ja) * 2008-07-24 2013-04-03 ソニー株式会社 発光素子組立体、面状光源装置、及び、液晶表示装置組立体
KR101134815B1 (ko) * 2010-01-15 2012-04-13 엘지이노텍 주식회사 영상표시장치 및 그 제조방법
US20110309393A1 (en) 2010-06-21 2011-12-22 Micron Technology, Inc. Packaged leds with phosphor films, and associated systems and methods
KR101668262B1 (ko) * 2010-06-22 2016-10-21 엘지디스플레이 주식회사 발광다이오드 및 이의 제조방법
KR101154368B1 (ko) * 2010-09-27 2012-06-15 엘지이노텍 주식회사 광변환부재 제조방법 및 그 제조방법으로 제조된 광변환부재를 포함하는 백라이트 유닛
TWI441361B (zh) * 2010-12-31 2014-06-11 Interlight Optotech Corp 發光二極體封裝結構及其製造方法
JP2012199497A (ja) * 2011-03-23 2012-10-18 Panasonic Corp 発光装置
US20120327649A1 (en) * 2011-06-24 2012-12-27 Xicato, Inc. Led based illumination module with a lens element
US8585243B2 (en) 2011-06-28 2013-11-19 Osram Sylvania Inc. LED lighting apparatus, systems and methods of manufacture
US8480267B2 (en) * 2011-06-28 2013-07-09 Osram Sylvania Inc. LED lighting apparatus, systems and methods of manufacture
DE102011078572B4 (de) 2011-07-04 2016-06-02 Osram Gmbh Beleuchtungsvorrichtung
KR101877410B1 (ko) * 2011-08-01 2018-07-11 엘지이노텍 주식회사 발광소자 패키지
DE102011112710A1 (de) * 2011-09-07 2013-03-07 Osram Ag Beleuchtungsvorrichtung
US8579451B2 (en) * 2011-09-15 2013-11-12 Osram Sylvania Inc. LED lamp
KR101943446B1 (ko) * 2011-12-20 2019-01-30 엘지이노텍 주식회사 디스플레이 장치 및 조명 시스템
CN103177893A (zh) * 2011-12-21 2013-06-26 致伸科技股份有限公司 具有发光按键的键盘装置
CN103486451B (zh) * 2012-06-11 2017-09-15 欧司朗股份有限公司 发光装置及包括该发光装置的照明装置
US20140118990A1 (en) * 2012-10-30 2014-05-01 No Chul KI Led module
CN103872221A (zh) * 2012-12-18 2014-06-18 玉晶光电股份有限公司 发光装置
WO2015092579A1 (fr) 2013-12-18 2015-06-25 Koninklijke Philips N.V. Couche de masque de brasage réfléchissant pour boîtier del-phosphore
JP6233750B2 (ja) * 2014-03-14 2017-11-22 パナソニックＩｐマネジメント株式会社 発光装置およびその製造方法、照明用光源、並びに照明装置
KR102164079B1 (ko) * 2014-05-30 2020-10-12 엘지이노텍 주식회사 산질화물계 형광체를 포함하는 발광 소자 패키지
CN104298001B (zh) * 2014-10-10 2017-05-10 深圳市华星光电技术有限公司 直下式背光模组及其制造方法
KR102221602B1 (ko) * 2014-11-07 2021-03-02 엘지이노텍 주식회사 발광 모듈, 이 모듈을 포함하는 백 라이트 유닛 및 이 유닛을 포함하는 표시 장치
EP3499302B1 (fr) 2014-12-03 2020-03-18 Samsung Electronics Co., Ltd. Dispositif électroluminescent et afficheur au moyen dudit dispositif
CN105810800A (zh) * 2014-12-29 2016-07-27 宁波海奈特照明科技有限公司 一种led集成发光器件及其制作方法
CN105822935B (zh) * 2015-01-05 2019-03-15 合肥京东方显示光源有限公司 灯条和显示装置
CN105304802A (zh) * 2015-10-12 2016-02-03 深圳万城节能股份有限公司 发光装置的制造方法
CN105702833B (zh) 2016-03-30 2019-03-05 开发晶照明（厦门）有限公司 Led封装结构和led发光装置
TWI598859B (zh) 2016-10-26 2017-09-11 友達光電股份有限公司 電子裝置與其製造方法
DE102016224090B4 (de) * 2016-12-05 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, Modul mit mindestens zwei optoelektronischen Bauelementen und Verfahren zum Herstellen eines optoelektronischen Bauelements
US10195985B2 (en) * 2017-03-08 2019-02-05 Ford Global Technologies, Llc Vehicle light system
KR102160225B1 (ko) 2017-06-12 2020-09-28 유니카르타, 인크. 개별 부품들의 기판 상으로의 병렬적 조립
CN115963661A (zh) * 2017-10-24 2023-04-14 华为技术有限公司 背光模组、显示屏及终端
CN110140081B (zh) * 2017-12-08 2024-01-16 首尔半导体株式会社 背光单元
US10948163B2 (en) 2017-12-08 2021-03-16 Seoul Semiconductor Co., Ltd. Backlight unit
JP2019129176A (ja) * 2018-01-22 2019-08-01 パナソニックＩｐマネジメント株式会社 発光装置の製造方法、及び、発光装置
CN108488693A (zh) * 2018-03-28 2018-09-04 武汉华星光电技术有限公司 Mini LED背光模组及荧光膜层的制作方法
JP7161100B2 (ja) * 2018-09-25 2022-10-26 日亜化学工業株式会社 発光装置及びその製造方法
CN111983848B (zh) * 2019-05-24 2023-03-31 佛山市国星光电股份有限公司 一种背光模组
JP7447421B2 (ja) * 2019-10-04 2024-03-12 岩崎電気株式会社 照明器具
KR20210048975A (ko) * 2019-10-24 2021-05-04 현대모비스 주식회사 자동차용 램프 및 그 램프를 포함하는 자동차
EP4150681A4 (fr) 2020-05-15 2024-07-31 Lumileds Llc Source de lumière multicolore et procédés de fabrication
KR102457808B1 (ko) * 2020-08-26 2022-10-24 주식회사 예지아테크코리아 광학 렌즈, 발광 모듈 및 이를 구비한 라이트 유닛
KR102389527B1 (ko) * 2021-06-21 2022-04-25 (주)탑룩스 백색 항균 엘이디 칩 패키지

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050224830A1 (en) 2004-04-09 2005-10-13 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
US20060197098A1 (en) 2005-03-07 2006-09-07 Citizen Electronics Co. Ltd. Light emitting device and illumination apparatus using said light emitting device
WO2007088501A1 (fr) 2006-01-31 2007-08-09 Koninklijke Philips Electronics N.V. Source de lumiere blanche
US20080076198A1 (en) 2006-09-21 2008-03-27 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing light emitting diode package and white light source module
US20080158480A1 (en) 2006-07-06 2008-07-03 Intematix Corporation Photo-luminescence color liquid crystal display

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
JP3782411B2 (ja) * 2002-09-02 2006-06-07 松下電器産業株式会社 発光装置
JP4496774B2 (ja) * 2003-12-22 2010-07-07 日亜化学工業株式会社 半導体装置の製造方法
US7452737B2 (en) * 2004-11-15 2008-11-18 Philips Lumileds Lighting Company, Llc Molded lens over LED die
US20060171152A1 (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
KR20070000001A (ko) 2005-05-04 2007-01-02 정화정 실사출력 프린터
KR101103462B1 (ko) 2005-05-24 2012-01-09 엘지이노텍 주식회사 형광물질이 도포된 발광소자 패키지 제조방법
KR100689260B1 (ko) 2005-05-24 2007-03-02 삼원산업주식회사 항산화성 스틸벤계 형광증백제 및 이의 합성방법
KR100649704B1 (ko) * 2005-09-05 2006-11-27 삼성전기주식회사 발광 다이오드 패키지 및 그 제조방법
JP2007080880A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
US7344952B2 (en) * 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
KR100771811B1 (ko) * 2005-12-27 2007-10-30 삼성전기주식회사 백색 발광 장치
JP2007273562A (ja) 2006-03-30 2007-10-18 Toshiba Corp 半導体発光装置
JP2007311663A (ja) 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
KR101203451B1 (ko) 2006-06-01 2012-11-21 엘지디스플레이 주식회사 액정표시장치모듈
US7737636B2 (en) * 2006-11-09 2010-06-15 Intematix Corporation LED assembly with an LED and adjacent lens and method of making same
TWI287671B (en) * 2006-11-09 2007-10-01 Au Optronics Corp Diffusion plate of backlight structure and display device using the same
KR100946015B1 (ko) * 2007-01-02 2010-03-09 삼성전기주식회사 백색 발광장치 및 이를 이용한 ｌｃｄ 백라이트용 광원모듈
KR20080092756A (ko) * 2007-04-13 2008-10-16 삼성전자주식회사 백라이트 어셈블리 및 이를 갖는 표시장치
KR100872696B1 (ko) * 2007-04-16 2008-12-10 엘지이노텍 주식회사 광원 장치 및 이를 이용한 디스플레이 장치
JP2008187212A (ja) 2008-05-07 2008-08-14 Sharp Corp 面実装型発光素子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050224830A1 (en) 2004-04-09 2005-10-13 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
US20060197098A1 (en) 2005-03-07 2006-09-07 Citizen Electronics Co. Ltd. Light emitting device and illumination apparatus using said light emitting device
WO2007088501A1 (fr) 2006-01-31 2007-08-09 Koninklijke Philips Electronics N.V. Source de lumiere blanche
US20080158480A1 (en) 2006-07-06 2008-07-03 Intematix Corporation Photo-luminescence color liquid crystal display
US20080076198A1 (en) 2006-09-21 2008-03-27 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing light emitting diode package and white light source module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2250681A4

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KR20100055846A (ko) 2010-05-27
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US8670087B2 (en) 2014-03-11
US8446544B2 (en) 2013-05-21
EP2250681B1 (fr) 2017-01-04
WO2010058960A3 (fr) 2010-08-26
KR101039957B1 (ko) 2011-06-09
EP2250681A4 (fr) 2011-03-30
EP2250681A2 (fr) 2010-11-17
JP2012509574A (ja) 2012-04-19
TW201023337A (en) 2010-06-16
TWI474468B (zh) 2015-02-21
US20130265742A1 (en) 2013-10-10

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