WO2019240534A1 - Procédé de fabrication d'unité de rétroéclairage utilisant une mini-del - Google Patents

Procédé de fabrication d'unité de rétroéclairage utilisant une mini-del Download PDF

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Publication number
WO2019240534A1
WO2019240534A1 PCT/KR2019/007204 KR2019007204W WO2019240534A1 WO 2019240534 A1 WO2019240534 A1 WO 2019240534A1 KR 2019007204 W KR2019007204 W KR 2019007204W WO 2019240534 A1 WO2019240534 A1 WO 2019240534A1
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WO
WIPO (PCT)
Prior art keywords
backlight unit
substrate
led
printing
led chip
Prior art date
Application number
PCT/KR2019/007204
Other languages
English (en)
Korean (ko)
Inventor
김선균
정재일
김기민
최영우
정용희
방해창
이종웅
Original Assignee
(주)코아시아
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)코아시아 filed Critical (주)코아시아
Publication of WO2019240534A1 publication Critical patent/WO2019240534A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors

Definitions

  • the present invention relates to a method for manufacturing a backlight unit, and more particularly, to a method for manufacturing a backlight unit using a mini LED.
  • the liquid crystal display device is a display device using a passive optical element that does not emit light by itself, the liquid crystal display device is configured to display an image by using a backlight unit provided on the rear surface of the liquid crystal panel.
  • the backlight unit may be classified into a side light type and a direct light type according to the arrangement of light sources.
  • a plurality of fluorescent lamps or light emitting diodes are arranged on the rear surface of the liquid crystal panel to directly irradiate light directly over the entire surface of the liquid crystal panel.
  • LEDs light emitting diodes
  • a liquid crystal display device having a direct backlight unit using such an LED may be configured by directly attaching a reflective sheet to a panel or a substrate on which an LED is installed.
  • the reflective sheet is simply reflected by using a reflective sheet attachment device. There is a problem that is difficult to attach the sheet.
  • an embodiment of the present invention is to provide a backlight unit manufacturing method using a mini LED to manufacture a backlight using a printing technique.
  • an embodiment of the present invention is to provide a backlight unit manufacturing method using a mini LED that can produce a backlight unit in a thinner package than a conventional manufacturing method.
  • an embodiment of the present invention to provide a backlight unit manufacturing method using a mini LED having a high contrast by using a mini LED.
  • an embodiment of the present invention is to provide a method for manufacturing a backlight unit using a mini LED having a high reliability as well as reducing the manufacturing cost.
  • a backlight unit manufacturing method using a mini LED may include printing a plurality of solders on a substrate; Bonding a plurality of LED chips on the printed solder; Printing a reflector on the substrate to which the LED chip is bonded; And protecting the LED chip by printing an encapsulant including a phosphor around the LED chip.
  • the solder may be printed on the substrate using a 2D stencil printing technique.
  • the plurality of LED chips may be capable of dimming control for each region formed according to an individual value or a set value.
  • the length of all sides of the LED chip may be formed to 500um or less.
  • the LED chip may be formed to 300um x 200um x 100um or less.
  • the reflective material may be printed on the substrate by using a 3D stencil printing technique.
  • the reflector may be printed on at least 80% of the area of the substrate.
  • the reflector may be formed of reflective silicon.
  • the reflector may be spaced apart from the LED chip by a predetermined distance or more.
  • the encapsulant may be printed on the substrate using a 2D stencil printing technique.
  • Backlight unit manufacturing method using a mini LED according to an embodiment of the present invention has an effect that can reduce the thickness of the backlight unit by manufacturing a package of a thin thickness.
  • the backlight unit manufacturing method using a mini LED has the effect of manufacturing a backlight unit that can express a high contrast by using a plurality of mini LED.
  • the backlight unit manufacturing method using a mini LED is to provide a backlight unit manufacturing method using a mini LED having a high reliability as well as a reduction in manufacturing cost.
  • FIG. 1 is a flowchart illustrating a method of manufacturing a backlight unit using a mini LED according to an embodiment of the present invention.
  • step S110 is a flow chart illustrating in more detail the step of printing solder on the substrate of step S110 according to an embodiment of the present invention.
  • Figure 3 is a flow chart illustrating in more detail the step of printing the reflective material on the substrate to which the LED chip of step S130 in accordance with an embodiment of the present invention.
  • Figure 4 is a flow chart illustrating in more detail the step of printing the encapsulant around the LED chip of step S140 according to an embodiment of the present invention.
  • FIG. 5 is a view showing an example of a backlight unit using a mini LED manufactured according to an embodiment of the present invention.
  • the backlight unit manufacturing apparatus performs a method for manufacturing a backlight unit using a mini LED for the convenience of description of the present invention. It may include.
  • FIG. 1 is a flow chart illustrating a method of manufacturing a backlight unit using a mini LED according to an embodiment of the present invention
  • Figure 2 is a flow chart showing in more detail the step of printing a solder on the substrate of step S110 according to an embodiment of the present invention
  • 3 is a flowchart illustrating a method of printing a reflector on a substrate to which an LED chip of step S130 is adhered according to an embodiment of the present invention
  • FIG. 4 is an encapsulation around the LED chip of step S140 according to an embodiment of the present invention.
  • 5 is a flowchart showing the steps of printing the ash in more detail
  • Figure 5 is a view showing an example of a backlight unit using a mini LED manufactured according to an embodiment of the present invention.
  • FIGS. 1 to 5 a method of manufacturing a backlight unit using a mini LED according to an embodiment of the present invention will be described in more detail with reference to FIGS. 1 to 5.
  • a step of printing a solder on a substrate (step S110), and bonding an LED chip to the printed solder Step S120, printing the reflective material on the substrate to which the LED chip is attached (S130) and printing the encapsulant around the LED chip (S140).
  • solder is printed on a substrate using a backlight unit manufacturing apparatus (step S110).
  • the backlight unit manufacturing apparatus uses a stencil printing technique to print solder on one side of a substrate having a circuit.
  • Stencil printing is a method of cutting out letters or drawings by hand or photochemically on thin plates such as paper or zinc, brass, stainless steel foil, etc., and printing ink or dyes using a roller or squeegee, etc. May be performed in the order shown in FIG. 2.
  • the step of contacting a stencil plate with one surface of the substrate includes a solder on top of the stencil plate. And printing the solder on the substrate using the step S220 and the squeeze step S230.
  • the backlight unit manufacturing apparatus first contacts the stencil plate with one surface of the substrate (step S210).
  • the backlight unit manufacturing apparatus may allow one surface of the stencil plate to be in contact with the surface in order to print solder on one surface of the substrate to be provided with the LED chip.
  • the stencil plate may be formed with a perforation at the position where the solder is to be printed on the substrate, and the perforation of the stencil plate may be preferably formed in a plurality of pairs for coupling the LED chip.
  • the stencil plate may preferably be a 2D stencil plate, where the 2D stencil plate is a stencil plate that is formed in such a way that the solder can be printed on the substrate at a negligible height because the height of the perforation is very low.
  • the backlight unit manufacturing apparatus includes solder on the stencil plate (step S220).
  • the backlight unit manufacturing apparatus includes solder on top of the stencil plate in order to insert solder into the perforation of the stencil plate to print on the substrate, and then the backlight unit manufacturing apparatus prints the solder on the substrate using squeeze (step S230).
  • Squeeze is used to print solder onto the substrate.
  • the squeeze works by thinly spreading the solder to print the solder provided on top of the stencil plate onto the substrate through the perforation of the stencil plate.
  • the squeeze pushes the solder to one side, the solder is inserted into the perforation included in the path through which the solder passes and printed on the substrate, so that the backlight unit manufacturing apparatus can print the solder using 2D stencil printing on the substrate using a stencil plate.
  • the backlight unit manufacturing apparatus adheres the LED chip to the printed solder (step S120).
  • the backlight unit manufacturing apparatus adheres the LED chip using the solder printed on the substrate on which the solder is printed in step S110.
  • the backlight unit manufacturing apparatus may use reel taped LED chips.
  • the reel taping of the LED chip may be performed before performing step S110 according to a user's setting or need, or may be performed after performing step S110 and before performing step S120.
  • the backlight unit manufacturing apparatus adheres the reel taped LED chip to the substrate.
  • two electrodes of the LED chip may be formed to be bonded to a pair of solders, respectively, and when the solder is cured after the electrodes of the LED chip are bonded to the solder, the LED chip may be electrically and physically coupled to the substrate.
  • the backlight unit manufacturing apparatus may perform reel taping of the LED chip at the same interval as a solder printed interval to facilitate adhesion of the LED chip.
  • the LED chip is bonded to the substrate to electrically couple with the substrate to emit light.
  • the length of each side of the LED chip may be formed to 500 ⁇ m or less, and particularly preferably, a mini LED having a horizontal X length X height of 300 ⁇ m X 200 ⁇ m X 100 ⁇ m may be used as the LED chip. .
  • the spacing between adjacent LED chips may be bonded to have a distance of 6 mm or more relative to the center of the LED chip.
  • the backlight unit manufacturing apparatus prints the reflective material on the substrate to which the LED chip is bonded (step S130).
  • the backlight unit manufacturing apparatus may operate in the order shown in FIG. 3 to print the reflector on the substrate to which the LED chip is attached.
  • the printing of the reflector according to an embodiment of the present invention includes contacting the stencil plate with one surface of the substrate (S310), and providing the reflector on the stencil plate ( S320) and printing the reflective material on the substrate (S330).
  • the apparatus for manufacturing a backlight unit includes contacting a stencil plate with one surface of a substrate (S310) to print a reflector on a substrate to which an LED chip is attached (S130), and providing a reflector on an upper portion of the stencil plate (S320); And printing the reflective material on the substrate (S330).
  • the backlight unit manufacturing apparatus first contacts the stencil plate with one surface of the substrate (step S310).
  • the substrate is a substrate to which the LED chip is bonded in step S120, in particular, the stencil plate may be provided to contact the surface on which the LED chip is bonded.
  • the stencil plate in step S130 is formed of a 3D stencil plate, unlike the 2D stencil plate of FIG. 2.
  • the 3D stencil plate may be formed by joining two stencil plates. That is, the stencil plate of step S310 may be formed three-dimensionally unlike the stencil plate of step S210 and may uniformly print a desired material on a large area.
  • the backlight unit manufacturing apparatus includes a reflector on the stencil plate (step S320).
  • the backlight unit manufacturing apparatus includes a reflective material on top of the stencil plate for inserting the reflective material into the perforation of the 3D stencil plate and printing on the substrate, wherein the reflective material is reflective silicon, which is preferably silicon having high reflectivity. May be).
  • the backlight unit manufacturing apparatus then prints the reflector on the substrate similarly to step S230 (step S330).
  • the backlight unit manufacturing apparatus prints a reflector on a substrate using, for example, a squeeze.
  • the perforation of the 3D stencil plate is preferably spaced apart from a pre-bonded LED chip by a predetermined distance may be formed so that the reflector is printed on the substrate.
  • the reflective material printed on the substrate through the squeeze is printed at a predetermined distance apart from the LED chip, thereby creating an empty space having a constant diameter between the LED chip and the reflective material.
  • the empty space may be formed larger than the length of the LED chip to protect the LED chip and to insert an encapsulant that can change the light generated by the LED chip to different wavelengths. It may be formed to have a radius of 0.5mm or more from the center of the chip.
  • the 3D stencil plate may be formed so that the reflector is printed higher than the height of the LED chip. That is, the thickness of the reflective material printed through the step S330 is preferably formed larger than the distance from the substrate to the upper surface of the LED chip.
  • the backlight unit manufacturing apparatus prints the encapsulant around the LED chip (step S140).
  • the backlight unit manufacturing apparatus prints the encapsulant in the empty space formed in step S330.
  • the stencil plate is brought into contact with one surface of the substrate using the backlight unit manufacturing apparatus (step S410).
  • the substrate is a substrate on which the reflector is printed in step S130, and in particular, the stencil plate may be provided to contact the surface on which the reflector is printed.
  • the stencil plate may be formed of a 2D stencil plate rather than a 3D stencil plate.
  • the 2D stencil plate may be preferably formed in a form in which a perforation is formed on the empty space to print the encapsulant through the perforation.
  • the backlight unit manufacturing apparatus is provided with an encapsulant on the stencil plate (step S420).
  • the backlight unit manufacturing apparatus includes an encapsulant on top of the stencil plate for inserting a reflector into the perforation of the 2D stencil plate to print the encapsulant on the substrate.
  • the encapsulant may include a phosphor, for example, may be formed by mixing the phosphor in silicon.
  • the backlight unit manufacturing apparatus prints the encapsulant on the substrate similarly to step S330 (step S430).
  • an encapsulant is printed on a substrate using, for example, a squeeze.
  • the perforation of the 2D stencil plate is formed to contact the empty space between the LED chip and the reflector formed in step S330, the encapsulant printed on the substrate through the 2D stencil plate is inserted and printed in the empty space between the LED chip and the reflector.
  • the 2D stencil plate can exhibit the same effect as using the 3D stencil plate.
  • the backlight unit manufactured by the backlight unit manufacturing method using a mini LED the plurality of LED chip is mounted in the encapsulant and electrically connected to the circuit formed on the substrate, the external control unit It is possible to easily perform a dimming control command through.
  • the dimming control can be performed by the LED individually, and a plurality of dimming regions are formed according to the setting, and dimming control is possible for each region.
  • an embodiment of the present invention is a method for manufacturing a backlight unit using a mini LED
  • all sides are 500 ⁇ m or less, preferably a mini LED formed of 300 ⁇ m X 200 ⁇ m X 100 ⁇ m is mounted on a substrate, and the periphery of the mini LED is In the substrate outside the area where the encapsulant for protecting the mini LED is printed, all of the substrates are provided with a reflector, thereby manufacturing a flexible backlight unit.
  • the reflector may be printed on at least 80% or more of the substrate area, thereby having a high contrast ratio.
  • FIG. 5 a backlight unit using a mini LED manufactured through the order of FIGS. 1 to 4 is illustrated in FIG. 5.
  • the reflector 510 is formed in most regions, and the mini LED light emitting unit 520 including an encapsulant is provided. ) May be provided in an area where the reflector 510 is not formed.
  • the mini LED light emitting part may be formed as the circular light emitting part 521 or may be formed as the square light emitting part 523. This is because the shape of the empty space is formed according to the shape of the 3D stencil plate in step S320 of FIG. 3, and a circular, square or other shape light emitting part may be formed on the substrate according to a user's setting or request.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Planar Illumination Modules (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'unité de rétroéclairage à l'aide d'une mini-DEL. Un procédé de fabrication d'unité de rétroéclairage utilisant une mini-DEL, selon un mode de réalisation de la présente invention, comprend les étapes consistant : à imprimer une pluralité de soudures sur un substrat; à lier une pluralité de puces de DEL à des parties supérieures des soudures imprimées; à imprimer un matériau réfléchissant sur le substrat auquel les puces de DEL sont liées; et à protéger les puces de DEL par impression, à proximité des puces de DEL, d'un matériau d'encapsulation comprenant une substance fluorescente.
PCT/KR2019/007204 2018-06-15 2019-06-14 Procédé de fabrication d'unité de rétroéclairage utilisant une mini-del WO2019240534A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0068712 2018-06-15
KR1020180068712A KR102059126B1 (ko) 2018-06-15 2018-06-15 미니 led를 이용한 백라이트 유닛 제조 방법

Publications (1)

Publication Number Publication Date
WO2019240534A1 true WO2019240534A1 (fr) 2019-12-19

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WO (1) WO2019240534A1 (fr)

Cited By (1)

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WO2023103059A1 (fr) * 2021-12-10 2023-06-15 Tcl华星光电技术有限公司 Source de rétroéclairage et appareil d'affichage

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EP4163714A4 (fr) 2020-10-23 2023-11-22 Samsung Electronics Co., Ltd. Dispositif d'affichage
CN112782889B (zh) * 2021-02-10 2022-03-08 Tcl华星光电技术有限公司 背光模组及其制作方法、液晶显示装置
KR20220126393A (ko) 2021-03-09 2022-09-16 주식회사 아모그린텍 디스플레이 광원용 단열시트, 이를 포함하는 단열 광원모듈, 단열 백라이트 유닛 및 디스플레이 장치
KR102634412B1 (ko) 2021-06-09 2024-02-06 주식회사 아모그린텍 디스플레이 광원용 단열시트, 이를 포함하는 단열 광원모듈, 단열 백라이트 유닛 및 디스플레이 장치

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JPH08334765A (ja) * 1995-06-09 1996-12-17 Matsushita Electric Ind Co Ltd 面光源装置およびそれを用いた液晶表示装置
KR20090119420A (ko) * 2008-05-16 2009-11-19 주식회사 이츠웰 고휘도 칩형 발광다이오드 패키지를 이용한 백라이트유니트
KR101211729B1 (ko) * 2010-07-02 2012-12-12 엘지이노텍 주식회사 백라이트유닛 및 이를 이용한 액정표시장치
KR101391371B1 (ko) * 2013-08-05 2014-05-02 주식회사 이티엘 인쇄회로 부착방식의 blu 제조방법 및 이를 이용한 blu
KR20180062224A (ko) * 2016-11-30 2018-06-08 엘지디스플레이 주식회사 백 라이트 유닛 및 이를 포함하는 액정 표시장치

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WO2023103059A1 (fr) * 2021-12-10 2023-06-15 Tcl华星光电技术有限公司 Source de rétroéclairage et appareil d'affichage

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