WO2019072090A1

WO2019072090A1 - Contact ic module pcb carrier, ic module made thereof and manufacturing process

Info

Publication number: WO2019072090A1
Application number: PCT/CN2018/107848
Authority: WO
Inventors: 吴小星
Original assignee: 爱创达应用卡工程有限公司
Priority date: 2017-10-11
Filing date: 2018-09-27
Publication date: 2019-04-18
Also published as: CN109661103A

Abstract

Disclosed herein is a contact integrated circuit module printed circuit carrier (25), comprising a substrate (12) that has an upper major surface (14a) and a lower major surface (14b) opposite to the upper major surface (14a), wherein the upper major surface and the lower major surface are covered with a copper layer. An electrical conduction section (18) penetrating the substrate electrically connects the upper major surface and the lower major surface. Circuit segments (26, 28, 30, 32, 34, 40, 42, 44, 46, 48) are electrically conductive on the lower major surface. First ends of the circuit segments are connected to an electrical conduction segment; second ends of the circuit segments terminate at termination points (A2, B2, C2, D2, E3) of each circuit segment, and the termination points are all located on a same side of the center point of the substrate, or the termination points are closer to the center of the substrate than the electrically conductive segments to which the termination points are connected.

Description

Contact IC module PCB carrier board, IC module made thereof and manufacturing process thereof

Technical field

The invention relates to the field of a printed circuit board (PCB) printed circuit board (PCB) carrier board, and particularly relates to a contact IC module PCB carrier board, an IC module made thereof and a manufacturing method thereof. Process.

Background technique

The contact IC module was born in the early 1990s and is a new technology developed in the world in recent years. The contact IC module is the abbreviation of the integrated circuit module and is a breakthrough in the field of electronic devices.

With the development of communication technology, contact IC modules are mainly used to produce financial IC cards for SIM, GSM, CDMA mobile phone communication, and also in various fields of production and life such as access control, transportation, social security, identity verification and electronic wallet. . The contact IC module itself is a passive body. When the module is read or written by the reader, the signal sent by the reader is composed of two parts: a part is a power signal, and the signal is directly supplied to the chip power supply. The other part is to combine the data signal, the command chip to complete the data, modification and storage, and return to the reader.

The contact IC module PCB board process in the prior art is complicated, and after the field product is produced, since the conventional carrier board is a single-sided copper clad board, the back pad is fixed in position and dispersed in position, and the interval is long, in subsequent production. In the process of the process, the distance is long, the use of the gold wire is more, the efficiency is lower, and the cost is higher. In view of the above, the present invention provides the following technical solutions.

Summary of the invention

The object of the present invention is to overcome the deficiencies of the prior art, and provide a contact type IC module PCB carrier board, an IC module manufactured thereby, and a manufacturing process.

According to a first aspect of the present invention, an integrated circuit module printed circuit carrier is provided, comprising a substrate having opposing first and second major surfaces, the first major surface and the second major surface Each of the first main surface and the second main surface is electrically connected to each other by a layer of copper and a first electrical conductive segment and a second electrical conductive segment extending through the substrate, wherein the first a first circuit segment electrically conductive and a second circuit segment electrically conductive, a first end of the first circuit segment being connected to the first electrical conduction segment a second end of the first circuit segment terminates at a first termination point, a first end of the second circuit segment is coupled to the second electrical conduction segment, and a second end of the second circuit segment terminates a second termination point, and wherein the first termination point and the second termination point are both located on a same side of a center point of the substrate, or the first termination point is more than the first electrical conduction section Near the center point of the substrate.

According to a second aspect of the present invention, there is provided an integrated circuit module comprising a carrier, the carrier comprising a substrate having opposing first and second major surfaces, the first major surface and the The second main surface is covered with a layer of copper, and the first electrical conductive portion and the second electrical conductive portion penetrating the substrate are electrically connected to the first main surface and the second main surface. The first main surface has an electrically conductive first circuit line segment and an electrically conductive second circuit line segment, and the first end of the first circuit segment is connected to the first electrical conduction segment And the second end of the first circuit segment terminates at a first termination point, the first end of the second circuit segment is connected to the second electrical conduction segment, and the second circuit segment is The two ends terminate at a second termination point, and wherein the first termination point and the second termination point are both located on a same side of a center point of the substrate, or the first termination point is greater than the first electrical point The conductive segment is closer to a center point of the substrate, and has at least a first solder joint and a second solder An integrated circuit chip of a contact, wherein the first solder joint of the integrated circuit wafer is electrically connected to the first termination point of the first circuit segment of the carrier, and the integrated circuit wafer The second solder joint is electrically connected to the second termination point of the second circuit segment of the carrier.

According to a third aspect of the present invention, a method of fabricating an integrated circuit module printed circuit carrier is provided, comprising the steps of (a) providing a substrate having opposing first major surfaces and second major surfaces, said first The main surface is covered with a first layer of copper, and the second main surface is covered with a second layer of copper, (b) forming a first hole and a second hole penetrating the substrate, and (c) filling the first portion with copper a hole to form a first electrical conductive segment to electrically connect the first major surface and the second major surface, (d) filling the second hole with copper to form a second electrical conduction a segment electrically connecting the first major surface and the second major surface, and (e) forming a first circuit segment electrically conductive on the first major surface and a second circuit segment electrically conducting The first end of the first circuit segment is connected to the first electrical conduction segment, and the second end of the first circuit segment terminates at a first termination point, and the second circuit segment The first end of the second circuit segment is connected to the second electrical conduction segment, and the second end of the second circuit segment is terminated at the second termination point. And wherein the first termination point and the second termination point are both located on a same side of a center point of the substrate, or the first termination point is closer to the substrate than the first electrical conduction section Center point.

According to a fourth aspect of the present invention, there is provided a method of fabricating an integrated circuit module, comprising the steps of: (f) fabricating an integrated circuit module printed circuit carrier, comprising the steps of (a) providing a substrate having opposing first mains a surface and a second major surface, the first major surface is covered with a first layer of copper, and the second major surface is covered with a second layer of copper, (b) forming a first hole and a second hole through the substrate (c) filling the first hole with copper to form a first electrical conductive segment to electrically connect the first major surface and the second major surface, (d) filling the copper with the a second hole to form a second electrical conductive segment to electrically connect the first major surface and the second major surface, and (e) to form a first electrical circuit electrically conductive on the first major surface a second circuit segment of the line segment and the electrical conduction, wherein the first end of the first circuit segment is connected to the first electrical conduction segment, and the second end of the first circuit segment is terminated a termination point, and the first end of the second circuit segment is connected to the second electrical conduction segment, and the second circuit a second end of the segment terminating at a second termination point, and wherein the first termination point and the second termination point are both located on a same side of a center point of the substrate, or the first termination point is greater than the first An electrical conductive segment is closer to a center point of the substrate, (g) an integrated circuit wafer having at least a first solder joint and a second solder joint is fixed to the first major surface, and (h) The first solder joint of the integrated circuit chip is electrically connected to the first termination point of the first circuit segment of the carrier, and the second solder joint of the integrated circuit wafer is The second termination point of the second circuit segment of the carrier is electrically connected.

After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: the manufacturing process of the contact type IC module PCB carrier board of the invention is relatively simple, and the invention replaces the traditional single-sided copper-clad board with the double-sided copper-clad board. Therefore, the circuit can also be designed on the back side, and the via hole and the pad are connected through the circuit, so that the pad can be concentratedly distributed to the position close to the solder joint of the wafer, thereby reducing the thread of the wire bonding process and greatly reducing the gold wire. The dosage greatly improves the efficiency, reduces the cost, and helps to improve the market competitiveness of the present invention.

DRAWINGS

Embodiments of the present invention will be described by way of example only with reference to the accompanying drawings in which:

1 through 10 illustrate a method of fabricating a printed circuit board of a contact integrated circuit module in accordance with an embodiment of the present invention;

Figure 11 shows a partial cutaway view of a contact integrated circuit module in accordance with one embodiment of the present invention;

12 through 16 illustrate a method of fabricating a contact integrated circuit module in accordance with one embodiment of the present invention.

Detailed ways

In accordance with an embodiment of the present invention, as also shown in FIG. 1, first, a large FR4, two opposing major surfaces, which are covered with a layer of copper, are cut to a suitable working size for use as the substrate 12. The opposite upper major surface 14a and lower surface 14b of the substrate 12 are also covered with a layer of copper. The substrate 12 is also referred to herein as a "Flexible Circuit Board" (FCB). As shown in FIG. 2, at least two holes 16 penetrating the substrate 12 are formed on the substrate 12 (eg, by drilling).

Thereafter, the holes 16 of the substrate 12 are filled with copper by electroplating. The operating temperature for this step is between 0 ° C and 45 ° C and the plating time is approximately 2 hours. The electroplating tank includes the following raw materials: 70 g per liter of copper sulfate, grams per litre, 50 PPM parts, and 5 ml per liter (millilitres per litre) ), electroplating tin, stannous sulfate 30 grams per liter (grams per litre), sulfuric acid 200 grams per liter (grams per litre), and tin light agent 20 milliliters per liter (millilitres per litre).

After electroplating, the holes 16 are filled with copper to form electrical conductive segments 18 that electrically connect the upper major surface 14a and the lower major surface 14b of the substrate 12. However, as shown in FIG. 4, the copper of some of the electrically conductive segments 18 protrudes above the copper of the

major surfaces

14a, 14b of the substrate 12. In this regard, as shown in FIG. 5, the copper of the copper layer protruding from the two

main surfaces

14a, 14b of the substrate 12 is smoothed by the ceramic grinder 20 to flatten the two

main surfaces

14a, 14b of the substrate 12, as shown in FIG. 6 is shown.

Thereafter, the photosensitive material is applied to the lower surface 14b of the substrate 12 to form a pre-designed wiring pattern using the working principle of the photographic film. Thereafter, a copper layer is formed on the formed wiring pattern by electroplating chemistry, and excess copper is removed by the copper etching solution to obtain a final desired line. Among them, the electroplating etching has an operating temperature of 0 ° C to 45 ° C and a time of approximately 2 hours. The electroplating tank includes the following raw materials: tin-light agent 20 ml per liter (millilitres per litre), sulfuric acid 180 g per liter (grams per litre), copper light agent 5 ml per liter (millitres per litre), copper sulfate 70 g per liter (grams per litre), chlorides 50 PPM (parts per million), electroplated tin 30 g per liter (grams per litre), and stannous sulfate 30 g per gram (grams per litre); copper solution from copper chloride and ammonia Made by mixing.

After the final required line is formed, the copper layers of the upper and lower

main surfaces

14a, 14b of the substrate 12 are surface-treated, and then the upper and lower sides of the substrate 12 are passed by the method of Electroless Nickel Immersion Gold (ENIG). A layer of nickel 22 and a layer of gold 24 are deposited on each of the copper layers of

surfaces

14a, 14b. The raw materials of the Shenjin tank include: 4.6 grams per litre of nickel ions, 100 ml per liter of gold opener (millitres per litre), 0.8 g per liter of gold salt, and 3 g of palladium ions. Per gram per litre. The working temperature of the immersion gold is 0 ° C to 95 ° C, and the time is approximately 2 hours. As shown in FIG. 7, a nickel layer 22 is deposited over the copper layers of the upper and lower

major surfaces

14a, 14b of the substrate 12, while a gold layer 24 is deposited over the nickel layer 22.

Figure 8 shows an integrated circuit module printed circuit carrier 25 made in accordance with the present invention having an upper major surface 27a having five exposed contact points A1, B1, C1 extending through the electrical conductive segments 18 of the carrier 25. , D1 and E1. FIG. 9 shows the lower main surface 27b of the carrier 25 shown in FIG. In the figure, A1, B1, C1, D1 and E1 are exposed contact points on the lower main surface 27b of the five electrical penetration sections 18 of the through-board 25, respectively corresponding to the carrier 25 shown in FIG. Contact points A1, B1, C1, D1 and E1 of the upper main surface 27a.

As shown in FIG. 9, the contact point A1 is physically and electrically connected (for example, by soldering) to one of the circuit segments 26 of the line formed on the lower main surface 27b of the carrier 25, and the other end of the circuit segment 26 is terminated. At A2; the contact point B1 is physically and electrically connected (eg, by soldering) to one of the circuit segments 28 of the line formed on the lower major surface 27b of the carrier 25, and the other end of the circuit segment 28 terminates at B2; The point C1 is physically and electrically connected (for example, by soldering) to one of the circuit segments 30 of the line formed on the lower main surface 27b of the carrier 25, and the other end of the circuit segment 30 terminates at C2; the contact point D1 is formed One of the circuit segments 32 of the line of the lower major surface 27b of the carrier 25 is physically and electrically connected (e.g., by soldering), the other end of the circuit segment 32 terminates at D2; and the contact point E1 is formed on the carrier One of the circuit segments 34 of the line of the lower major surface 27b of 25 is physically and electrically connected (e.g., by soldering) and the other end of the circuit segment 34 terminates at E2. The contact points A2, B2, C2, D2, and E2 are all located on the same side of the center point of the carrier 25. Taking FIG. 9 as an example, the contact points A2, B2, C2, D2, and E2 are both located on the left side of the center point of the carrier 25.

Also shown in FIG. 9, an integrated circuit (IC) chip 36 is mounted over the lower major surface 27b of the carrier 12 to form an integrated circuit module (IC module) 37, particularly a contact IC module, particularly suitable for For the production of SIM cards. The integrated circuit chip 36 has five solder joints, which are electrically connected to the contact points A2, B2, C2, D2 and E2 by gold wires 38, respectively. Since the contact points A2, B2, C2, D2 and E2 are all located on the same side of the integrated circuit chip 36 (also on the same side of the center point of the lower main surface 27b of the carrier 27), especially on the left side, especially in the integrated circuit One side of the solder joint of the wafer 36, thereby reducing the overall length of the desired gold wire 38, thereby reducing cost.

Figure 10 shows another possible arrangement of the lower major surface 27b of the carrier 25 shown in Figure 8. The contact point A1 is physically and electrically connected (for example, by soldering) to one of the circuit segments 40 of the line formed on the lower main surface 27b of the carrier 25, and the other end of the circuit segment 40 terminates at A2; the contact point B1 and One of the circuit segments 42 formed on the line of the lower main surface 27b of the carrier 25 is physically and electrically connected (for example, by soldering), the other end of the circuit segment 42 is terminated at B2; the contact point C1 is formed on the carrier One of the circuit segments 44 of the line of the lower major surface 27b of 25 is physically and electrically connected (e.g., by soldering), the other end of the circuit segment 44 terminates at C2; the contact point D1 is formed with the lower host formed on the carrier 25. One of the circuit segments 46 of the line of surface 27b is physically and electrically connected (e.g., by soldering), the other end of circuit segment 46 terminates at D2; and contact point E1 is formed with the lower major surface 27b of carrier 25 One of the circuit segments 48 of the line is physically and electrically connected (e.g., by soldering) and the other end of the circuit segment 48 terminates at E2. As can be seen from FIG. 10, A2 is closer to the center point of the lower main surface 14b of the substrate 12 than A1 (also the center point of the lower main surface 27b of the carrier 27); B2 is closer to the center point of the lower main surface 14b of the substrate 12 than B1. C2 is closer to the center point of the lower main surface 14b of the substrate 12 than C1; D2 is closer to the center point of the lower main surface 14b of the substrate 12 than D1; and E2 is closer to the center point of the lower main surface 14b of the substrate 12 than E1. According to this arrangement, the total length of the gold wires 50 for electrically connecting the five pads and the contact points A2, B2, C2, D2, and E2 on the integrated circuit chip 26 can also be reduced, thereby reducing the cost.

Figure 11 shows a partial cutaway view of the IC module 37 showing two exposed contact points A1 of the electrical conduction section 18, one above the upper surface 27a of the carrier 25 and the other on the carrier 25 Above the lower surface 27b. Figure 11 also shows a contact point A2 above the lower surface 27b of the carrier 25 which is electrically connected to the contact point A1 above the lower surface 27b of the carrier 25 by circuit segments 26/40. The contact point A2 of the IC chip 36 with the lower surface 27b of the carrier 25 is electrically connected by a gold wire 38/50. Through the gold wire 38/50, the contact point A2 on the lower surface 27b of the carrier 25, the circuit segment 26/40, the contact point A1 above the lower surface 27b of the carrier 25, and the electrical conduction segment 18 The associated pads on the IC wafer 36 are electrically connected to the contact point A1 above the upper surface 27a of the carrier 25.

As shown in Figs. 12 to 16, first, an adhesive 60 is provided at a central portion of the lower surface 27b of the carrier 25, and then the IC wafer 36 is placed to be fixed to the lower surface 27b of the carrier 25, and then The gold wires 38/50 are joined between the solder joints of the contact point A2 and the IC wafer 36 (e.g., by soldering) to provide an electrically conductive adhesive 62 to make the connections more secure. After all the gold wires 38/50 have been connected, a protective agent 64 is provided to form a protective layer 66 to protect the entire IC wafer 36.

In summary, the manufacturing process of the contact IC module PCB carrier board and the contact IC module of the present invention is relatively simple, and the present invention uses a double-sided copper clad board to replace the traditional single-sided copper clad board, so the back side (the lower main table) It is also possible to design a circuit through which the electrical conduction section 18 and the pads (i.e., the contact points A2, B2, C2, D2, and E2 above the lower surface 27b of the carrier 25) are connected such that the pads It can be concentratedly distributed to the position close to the solder joint of the integrated circuit chip 36, thereby reducing the threading process, greatly reducing the amount of the gold wire, greatly improving the efficiency, reducing the cost, and improving the market competitiveness of the present invention.

The above is only the specific embodiments of the present invention, and is not intended to limit the scope of the present invention. The equivalent changes or modifications made by the structures, features and principles described in the scope of the patent application are It should be included in the scope of the invention. In addition, it is to be understood that the above is only an example that can be performed by the present invention, and various modifications and/or substitutions can be made without departing from the spirit of the invention. It should also be understood that, for the sake of brevity, various features of the invention described in the context of a single embodiment can also be provided separately or in any suitable sub-combination.

Claims

An integrated circuit module printed circuit carrier board comprising:

a substrate having opposing first and second major surfaces, the first major surface and the second major surface each being covered with a layer of copper, and

The first main surface and the second main surface are electrically connected to each other through the first electrical conductive segment and the second electrical conductive segment of the substrate,

The first main surface has an electrically conductive first circuit line segment and an electrically conductive second circuit line segment, and the first end of the first circuit segment is connected to the first electrical conduction segment And the second end of the first circuit segment terminates at a first termination point, the first end of the second circuit segment is connected to the second electrical conduction segment, and the second circuit segment is The two ends terminate at the second termination point, and

Wherein the first termination point and the second termination point are both located on a same side of a center point of the substrate, or the first termination point is closer to a center of the substrate than the first electrical conduction section point.
The carrier of claim 1, wherein the carrier has a third electrical conductive segment, a fourth electrical conductive segment, and a fifth electrical conductive segment extending through the substrate.
The carrier of claim 2 wherein said first major surface has an electrically conductive third circuit line segment, an electrically conductive fourth circuit segment, and an electrically conductive fifth circuit segment.
The carrier board according to claim 3, wherein a first end of the third circuit segment is connected to the third electrical conduction segment, and a second end of the third circuit segment terminates at a third termination point, The first end of the fourth circuit segment is connected to the fourth electrical conduction segment, and the second end of the fourth circuit segment terminates at a fourth termination point, and the first of the fifth circuit segments The end is connected to the fifth electrical conduction segment, and the second end of the fifth circuit segment terminates at a fifth termination point.
The carrier of claim 4, wherein the third termination point, the fourth termination point, and the fifth termination point are both located on a same side of a center point of the substrate.
The carrier of claim 5, wherein the third termination point, the fourth termination point, and the fifth termination point are both located at the first termination point and the second termination point The same side of the center point of the substrate.
The carrier of claim 4 wherein said third termination point is closer to a center point of said substrate than said third electrically conductive via.
An integrated circuit module comprising:

The carrier of claim 1 and

An integrated circuit chip having at least a first solder joint and a second solder joint,

Wherein the first solder joint of the integrated circuit die is electrically connected to the first termination point of the first circuit segment of the carrier chip, and the second solder joint of the integrated circuit die The second termination point of the second circuit segment of the carrier is electrically connected.
The integrated circuit module of claim 8 wherein said first termination point of said first circuit segment of said carrier and said second termination of said second circuit segment are both located in said integrated circuit The same side of the wafer.
The integrated circuit module of claim 9 wherein said first termination point of said first circuit segment of said carrier and said second termination of said second circuit segment are both located in said integrated circuit The first solder joint of the wafer and one side of the second solder joint.
The integrated circuit module of claim 8 wherein said first termination point of said first circuit segment of said carrier is closer to said integrated circuit die than said first electrically conductive segment.
The integrated circuit module of claim 1 wherein said integrated circuit module is a contact integrated circuit module.
The integrated circuit module of claim 12 wherein said contact integrated circuit module is adapted to produce a SIM card.
A method of fabricating an integrated circuit module printed circuit carrier, comprising the steps of:

(a) providing a substrate having opposing first major surfaces and a second major surface, the first major surface being covered with a first layer of copper, and the second major surface being covered with a second layer of copper,

(b) forming a first hole and a second hole penetrating the substrate,

(c) filling the first hole with copper to form a first electrical conductive segment to electrically connect the first major surface and the second major surface,

(d) filling the second hole with copper to form a second electrical conductive segment to electrically connect the first major surface and the second major surface, and

(e) forming a first circuit segment electrically conductive and a second circuit segment electrically conducting on the first major surface,

Wherein the first end of the first circuit segment is connected to the first electrical conduction segment, and the second end of the first circuit segment terminates at a first termination point, and the second circuit segment a first end is coupled to the second electrical conduction segment, and a second end of the second circuit segment terminates at a second termination point, and

Wherein the first termination point and the second termination point are both located on a same side of a center point of the substrate, or the first termination point is closer to a center of the substrate than the first electrical conduction section point.
The method of claim 14 including after said step (d), smoothing copper protruding from said first layer of copper and/or copper protruding from said second layer of copper.
A method according to claim 14 or claim 15, wherein after said step (d), a layer of nickel and a layer of gold are deposited on the copper of said substrate.
The method of claim 16 wherein said layer of nickel and said layer of gold are deposited on the copper of said substrate by means of immersion gold.
A method of fabricating an integrated circuit module, comprising the steps of:

(f) fabricating an integrated circuit module printed circuit carrier according to the method of claim 13

(g) fixing an integrated circuit die having at least a first solder joint and a second solder joint to the first major surface, and

(h) electrically connecting the first solder joint of the integrated circuit die to the first termination point of the first circuit segment of the carrier, and the first of the integrated circuit wafer The second solder joint is electrically connected to the second termination point of the second circuit segment of the carrier.
The method of claim 18 wherein said first termination point of said first circuit segment of said carrier and said second termination of said second circuit segment are both located on said integrated circuit die The same side.
The method of claim 19 wherein said first termination point of said first circuit segment of said carrier and said second termination of said second circuit segment are both located on said integrated circuit die One side of the first weld point and the second weld point.
The method of claim 18 wherein said first termination point of said first circuit segment of said carrier is closer to said integrated circuit wafer than said first electrically conductive segment.
The method of claim 18 wherein said integrated circuit module is a contact integrated circuit module.
The method of claim 22 wherein said contact integrated circuit module is adapted to produce a SIM card.