CN112788836B

CN112788836B - Circuit integrated device with multilayer bridging structure

Info

Publication number: CN112788836B
Application number: CN201911139992.5A
Authority: CN
Inventors: 贺轩持; 刘美卲
Original assignee: Lextar Electronics Corp
Current assignee: Lextar Electronics Corp
Priority date: 2019-11-08
Filing date: 2019-11-20
Publication date: 2022-11-15
Anticipated expiration: 2039-11-20
Also published as: TW202119887A; CN112788836A; TWI736014B

Abstract

A circuit integrated device with a multilayer bridging structure comprises an electrical carrier and a bridging element. The electric carrier plate mainly comprises a single-layer circuit pattern, and comprises a surface which is provided with a plurality of first welding spots which are electrically insulated with each other. The bridging element comprises at least two layers of circuit patterns and a plurality of second welding points which are separated from each other, and the second welding points are respectively welded to the corresponding first welding points so as to bridge the first welding points. The circuit design of the circuit integrated device with the same complexity can be realized at lower cost by utilizing the multi-layer circuit pattern of the small-sized bridging element to realize more complicated circuit design.

Description

Circuit integrated device with multilayer bridging structure

Technical Field

The invention relates to a circuit integrated device.

Background

A Printed Circuit Board (Printed Circuit Board) is a support for electronic components, and includes a patterned metal conductor as a wiring for connecting the electronic components. Generally, the more layers of patterned metal conductors are included, the higher the manufacturing cost of printed circuit boards, especially large area multilayer (patterned metal conductor) printed circuit boards. How to avoid using the multi-layer printed circuit board is one of the major considerations in the design of electronic products.

Disclosure of Invention

The present invention provides an innovative integrated circuit device with a multi-layer bridge structure to solve the problems of the prior art.

In an embodiment of the present invention, a circuit integrated device with a multilayer bridge structure includes an electrical carrier and a bridge element. The electric carrier plate mainly comprises a single-layer circuit pattern, and comprises a surface which is provided with a plurality of first welding spots which are electrically insulated with each other. The bridging element comprises at least two layers of circuit patterns and a plurality of second welding points which are separated from each other, and the second welding points are respectively welded to the corresponding first welding points so as to bridge the first welding points.

In an embodiment of the invention, an area of a surface of the electrical carrier is larger than an area of the bridging element.

In an embodiment of the present invention, the first solder joints are arranged in two rows.

In one embodiment of the present invention, the two rows are parallel to each other.

In an embodiment of the invention, the second solder joints are respectively located at two opposite sides of the bridging element.

In an embodiment of the invention, the bridging element further includes two opposite upper surfaces and lower surfaces.

In an embodiment of the invention, the at least two layers of circuit patterns are respectively disposed on the upper surface and the lower surface of the bridging element.

In an embodiment of the invention, the bridge component further includes a plurality of end holes separated from each other and distributed on the upper surface and the lower surface, and the second solder points are respectively located in the end holes.

In an embodiment of the invention, the second pads are electrically connected to at least two layers of circuit patterns respectively.

In an embodiment of the invention, the surfaces of the bridging elements are adhered to the electrical carrier.

In summary, the circuit integrated device with a multi-layer bridge structure of the present invention can achieve a more complex circuit design required by the circuit integrated device by reducing the number of circuit patterns of a single layer on a large-area electrical carrier and utilizing the multi-layer circuit patterns of the small-sized bridge elements, thereby achieving a circuit design with the same complexity at a lower cost.

The above description will be described in detail by embodiments, and further explanation will be provided for the technical solution of the present invention.

Drawings

In order to make the aforementioned and other objects, features, and advantages of the invention, as well as others which will become apparent, reference is made to the following description taken in conjunction with the accompanying drawings in which:

FIG. 1 is a perspective view of a circuit integrated device according to an embodiment of the invention;

fig. 2 and 3 are partially enlarged views of the circuit integrated device of fig. 1;

FIG. 4 is a top view of a bridge device according to an embodiment of the invention;

FIGS. 5 and 6 are perspective views of the bridge element of FIG. 4 from two different perspectives;

FIG. 7 is a top view of a bridge device according to another embodiment of the present invention;

fig. 8 and 9 are perspective views showing two different viewing angles of the bridge element of fig. 7.

[ notation ] to show

In order to make the aforementioned and other objects, features, advantages and embodiments of the present invention more comprehensible, the following description is given:

100

102.. An electrical carrier plate

102 a-102 h

A bridging member

Welding spot for 150 a-150 h

160

A bridging element

202

202a

202b

203 a-203 d

204 a-204 d

205 a-205 d

206 a-206 d

207a to 207d

208a to 208d

A bridging element

A substrate

Surface 302a

Surface 302b

303-306

303a, 303b

304a, 304b

305a, 305b

306a, 306b

Detailed Description

In order to make the description of the present invention more complete and complete, reference is made to the accompanying drawings, in which like numerals designate the same or similar elements, and the various embodiments described below. In other instances, well-known elements and steps have not been described in detail in order to avoid unnecessarily obscuring the present invention.

Referring to fig. 1 to 3, fig. 1 is a perspective view of a circuit integrated device 100 according to an embodiment of the invention; fig. 2 and 3 are enlarged views of the circuit integrated device of fig. 1, wherein the bridging element 150 of fig. 3 is separated from the electrical carrier 102. The circuit integrated device 100 includes an electrical carrier 102 and a plurality of bridge devices (150, 160). The electrical carrier 102 has only a single-layer circuit pattern, i.e., the electrical carrier 102 includes an insulating substrate and a single-layer circuit conductor pattern. In order to realize a more complex circuit design and take the cost of the circuit board into consideration, the present invention sets a plurality of electrically insulated solder joints (for example, the solder joints 102 a-102 h in fig. 3) on the surface of the electrical carrier 102, and bridges the corresponding solder joints among the solder joints with a bridging element. For example, in fig. 3, a plurality of separated pads (150 a-150 h) of the bridging element 150 are respectively soldered to corresponding pads (102 a-102 h) on the electrical carrier 102 to bridge the corresponding pads (102 a-102 h), so that the circuit design of the circuit integrated device 100 can be achieved at a lower cost. In the embodiment, the pads (102 a-102 d) and the pads (102 e-102 h) on the electrical carrier 102 are arranged in two rows, and the two rows are parallel to each other, but not limited thereto. In the embodiment, the pads (150 a-150 d) and the pads (150 e-150 h) of the bridge component 150 are respectively located at two opposite sides of the bridge component, but not limited thereto.

In the embodiment of the invention, the large-area electrical carrier 102 has only a single-layer circuit pattern, and the manufacturing cost is greatly reduced compared with the electrical carrier with a plurality of layers of circuit patterns. More complex circuit designs are implemented with multiple bridge elements in at least two-layer circuit patterns. The bridging element with smaller area can be realized with lower cost even if at least two layers of circuit patterns are designed. The following illustrates a specific structure of the bridge member.

Referring to fig. 4 to fig. 6, fig. 4 is a top view of a bridge component 200 according to an embodiment of the invention; fig. 5 and 6 are perspective views showing two different viewing angles of the bridge element 200 of fig. 4. The bridge element 200 includes an insulating substrate 202 and circuit patterns on two opposing surfaces (202 a, 202 b). In fig. 4, the circuit pattern of the upper surface (solid line pattern) and the circuit pattern of the lower surface (dotted line pattern) are staggered with each other, so that a more complicated circuit can be implemented on a substrate having a smaller area.

In fig. 5, the circuit pattern on the surface 202a includes a plurality of circuits (204 a to 204 d) insulated from each other, and both ends of each circuit are pads. For example, two terminals of the circuit 204a are pads (206 a, 208 a), two terminals of the circuit 204b are pads (206 b, 208 b), two terminals of the circuit 204c are pads (206 c, 208 c), and two terminals of the circuit 204d are pads (206 d, 208 d), so that the circuit pattern can be electrically connected to the corresponding pads.

In fig. 6, the circuit pattern on the surface 202b includes a plurality of circuits (203 a to 203 d) insulated from each other, and both ends of each circuit are pads. For example, two ends of the circuit 203a are pads (205 a, 207 a), two ends of the circuit 203b are pads (205 b, 207 b), two ends of the circuit 203c are pads (205 c, 207 c), and two ends of the circuit 203d are pads (205 d, 207 d), so that the circuit pattern can be electrically connected to the corresponding pads.

In the embodiment of the bridge member 200, the solder joints are located in the end holes separated from each other, and the metal layer of the solder joint extends into and around the end holes, so that the surface 202a or the surface 202b of the bridge member 200 can be used as a soldering surface. In the present embodiment, the bridging element 200 is a surface-mount solder part for surface-mounting to an electrical carrier.

Referring to fig. 7 to 9, fig. 7 is a top view of a bridge component 300 according to an embodiment of the invention; fig. 8 and 9 are perspective views showing two different viewing angles of the bridging element 300 of fig. 7. The bridge component 300 includes an insulating substrate 302 and circuit patterns on two opposite surfaces (302 a, 302 b). In fig. 7, the circuit pattern of the upper surface (solid line pattern) and the circuit pattern of the lower surface (dotted line pattern) overlap each other, and thus a more complex circuit can be realized on a substrate of a smaller area.

In fig. 8, the circuit pattern on the surface 302a includes a plurality of circuits (304, 306) insulated from each other, the circuit 306 is a straight circuit, and the circuit 304 is an arc circuit, and both ends of each circuit are pads. For example, two terminals of the circuit 304 are pads (304 a, 304 b) and two terminals of the circuit 306 are pads (306 a, 306 b), so that the circuit pattern can be electrically connected to the corresponding pads. In the embodiment, the corresponding welding points (304 a, 304b, 306a, 306 b) are arranged in a row, but not limited thereto. In the embodiment, the pads (304 a, 304b, 306a, 306 b) of the circuits (304, 306) and the pads (303 a, 303b, 305a, 305 b) of the other surface circuits (303, 305) are also arranged in a row, but not limited thereto.

In fig. 9, the circuit pattern on the surface 302b includes a plurality of circuits (303, 305) insulated from each other, the circuit 305 is a straight circuit, the circuit 303 is an arc circuit, and both ends of each circuit are pads. For example, two ends of the circuit 303 are pads (303 a, 303 b), and two ends of the circuit 305 are pads (305 a, 305 b), so that the circuit pattern can be electrically connected to the corresponding pads. The pads (303 a, 303b, 305a, 305 b) on the surface 302b are all electrically connected to the pads (303 a, 303b, 305a, 305 b) on the surface 302a, for example, the pads (303 a, 303b, 305a, 305 b) can be two ends of a column of metal penetrating through the substrate 302.

In the embodiment of bridging element 300, only the surface 302a can have all of the pads of the two-surface circuit (304, 306, 303, 305) as bonding surfaces. In the present embodiment, the bridging element 300 is also a surface-mount solder part, so as to be surface-mounted on the electrical carrier.

In the bridge component of the above embodiments, although only two layers of circuit patterns are illustrated, additional layers of circuit patterns can be designed according to the requirement, so that the bridge component can have three or more layers of circuit patterns.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A circuit integrated device having a multi-layer bridge structure, comprising:

the electric carrier plate consists of a single-layer circuit pattern, and comprises a surface, wherein the surface is provided with a plurality of first welding spots which are electrically insulated with each other; and

the bridge element comprises at least two layers of circuit patterns and a plurality of second welding points which are separated from each other, the second welding points are respectively welded to the corresponding first welding points so as to bridge the first welding points, the at least two layers of circuit patterns are respectively arranged on the upper surface and the lower surface of the bridge element, each layer of the at least two layers of circuit patterns comprises a plurality of circuits which are insulated from each other, at least one of the plurality of circuits comprises a middle section straight circuit and two tail section straight circuits, the middle section straight circuit is connected between the two tail section straight circuits, each section of the two tail section straight circuits is not parallel to the middle section straight circuit, and the second welding points are respectively positioned in end holes which are separated from each other at the edge of the bridge element or at two ends of columnar metal which penetrates through the bridge element.

2. The integrated circuit device according to claim 1, wherein the surface of the electrical carrier has an area larger than an area of the bridging element.

3. The integrated circuit device of claim 1, wherein the first pads are arranged in two rows.

4. The device of claim 3, wherein the two rows are parallel to each other.

5. The integrated circuit device according to claim 1, wherein the second pads are respectively located at two opposite sides of the bridge element.

6. The integrated circuit device of claim 1, wherein the bridge element further comprises a plurality of terminal holes separated from each other and disposed on the upper surface and the lower surface, the second pads being disposed in the terminal holes, respectively.

7. The integrated circuit device according to claim 6, wherein the second pads are electrically connected to the at least two layers of circuit patterns respectively.

8. The integrated circuit device according to any of claims 1 to 7, wherein the bridging element is surface-mounted to the electrical carrier.