JP2715767B2 - Flex-rigid board - Google Patents
Flex-rigid boardInfo
- Publication number
- JP2715767B2 JP2715767B2 JP3352972A JP35297291A JP2715767B2 JP 2715767 B2 JP2715767 B2 JP 2715767B2 JP 3352972 A JP3352972 A JP 3352972A JP 35297291 A JP35297291 A JP 35297291A JP 2715767 B2 JP2715767 B2 JP 2715767B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- flex
- connector
- layers
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表裏に一対のパターン
配線が形成された多層配線基板とコネクタ間を電気的に
接続するフレックスリジット基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flex-rigid board for electrically connecting a multi-layered wiring board having a pair of pattern wirings formed on the front and back to a connector.
【０００２】[0002]
【従来の技術】一般に、この種のフレックスリジット基
板２１は、図２に示すように、パターン層２２と、この
パターン層２２の表裏に接着層２３ａ、２３ｂを介して
接着された一対の絶縁層２４ａ、２４ｂとからなり、パ
ターン層２２の一端には、複数の接点パターン２２ａ
が、紙面奥方に向かって一列に配列されている。2. Description of the Related Art Generally, as shown in FIG. 2, a flex-rigid substrate 21 of this kind has a pattern layer 22 and a pair of insulating layers bonded to the front and back of the pattern layer 22 via bonding layers 23a and 23b. 24a, 24b, and one end of the pattern layer 22 is provided with a plurality of contact patterns 22a.
Are arranged in a line toward the back of the paper.
【０００３】フレックスリジット基板２１の接点パター
ン２２ａと電気的に接続されるコネクタ２５は、フレッ
クスリジット基板２１の先端が嵌合する嵌合溝２６が凹
設され、この嵌合溝２６内に一端が臨み、コネクタ２５
のブロック内を貫通し、ほぼ中間部で下方に折曲してブ
ロックから他端が突出した電極２７が設けられている。The connector 25 electrically connected to the contact pattern 22a of the flex-rigid board 21 has a fitting groove 26 into which the tip of the flex-rigid board 21 is fitted. Coming, connector 25
An electrode 27 is provided which penetrates through the inside of the block, is bent downward at a substantially middle portion, and has the other end protruding from the block.
【０００４】したがって、多層配線基板１の表裏に形成
された両パターン２、３のそれぞれとコネクタ２５とを
接続する場合には、図２に示すように、２つの配線パタ
ーン２、３に対応して、２つのフレックスリジット基板
２１と２つのコネクタ２５とを用意して、それぞれの基
板２１のパターン層２２の一端を両パターン２、３のそ
れぞれに接続し、他端の接点パターン２２ａをコネクタ
２５の嵌合溝２６に嵌合させて、電極に電気的に接続し
ている。Accordingly, when connecting each of the two patterns 2 and 3 formed on the front and back surfaces of the multilayer wiring board 1 to the connector 25, as shown in FIG. Then, two flex-rigid boards 21 and two connectors 25 are prepared, one end of the pattern layer 22 of each board 21 is connected to each of the two patterns 2 and 3, and the contact pattern 22a at the other end is connected to the connector 25. And is electrically connected to the electrodes.
【０００５】[0005]
【発明が解決しようとする課題】上述した従来のフレッ
クスリジット基板を用いて、多層配線基板とコネクタを
接続する場合には、多層配線基板の両パターンに対応し
て、フレックスリジット基板を独立して２つ用意し、こ
れにともなって、コネクタも２つ必要となり、このた
め、コネクタを実装するための実装面積あるいは実装高
さが２倍となり、装置の小型化に支障をきたすといった
問題があった。In the case where a connector and a multilayer wiring board are connected by using the above-mentioned conventional flex-rigid board, the flex-rigid board is independently provided corresponding to both patterns of the multilayer wiring board. Two of them are prepared, and accordingly, two connectors are required. Therefore, the mounting area or mounting height for mounting the connector is doubled, and there is a problem that the miniaturization of the device is hindered. .
【０００６】したがって、本発明は、上記したような従
来の問題に鑑みてなされたものであり、その目的とする
ところは、多層配線基板の両パターンを接続する２つの
パターン層を１つのフレックスリジット基板内に納め、
これにより、コネクタを１つにして、もって、装置の小
型化を図ったフレックスリジット基板を提供することに
ある。SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to combine two pattern layers for connecting both patterns of a multilayer wiring board into one flex-rigid. Put it in the board,
Accordingly, it is an object of the present invention to provide a flex-rigid board in which the number of connectors is reduced to one and the size of the apparatus is reduced.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に、本発明に係るフレックスリジット基板は、多層配線
基板の表裏に形成された一対のパターンのそれぞれに接
続された第１および第２のパターン層と、これら第１お
よび第２のパターン層のそれぞれの表裏に接着層を介し
て接着された絶縁層とからなり、これら第１および第２
のパターン層の対向する絶縁層を別の絶縁層を介して、
接着層で接着すると共に、前記第１および第２のパター
ン層のそれぞれの先端にコネクタの端子配列に対応した
接点パターンを設けたものである。In order to achieve this object, a flex-rigid board according to the present invention comprises a first and a second pattern connected to a pair of patterns formed on the front and back of a multilayer wiring board. A pattern layer, and an insulating layer adhered to the front and back of each of the first and second pattern layers via an adhesive layer.
The opposing insulating layer of the pattern layer of
The first and second pattern layers are provided with a contact pattern corresponding to the terminal arrangement of the connector at the tip of each of the first and second pattern layers.
【０００８】[0008]
【作用】本発明においては、コネクタ端子が１つとな
る。According to the present invention, only one connector terminal is provided.
【０００９】[0009]
【実施例】以下、本発明の一実施例を図に基づいて説明
する。図１は、本発明に係るフレックスリジット基板を
多層配線基板とコネクタに接続する全体構成の側断面図
である。同図において、本発明のフレックスリジット基
板５は、第１のパターン層６および第２のパターン層１
０とからなり、これら両パターン層６、１０は、その表
裏のそれぞれに接着層７ａ、７ｂおよび１１ａ、１１ｂ
を介して、絶縁層８、９および１２、１３が接着され、
さらに、別の絶縁層としての接着層１４を介して絶縁層
９と１３が接着されることによって、第１のパターン層
６と第２のパターン層１０とが一体化構造とされてい
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view of the overall configuration for connecting a flex-rigid board according to the present invention to a multilayer wiring board and a connector. In the figure, a flex-rigid substrate 5 of the present invention comprises a first pattern layer 6 and a second pattern layer 1.
0, and these two pattern layers 6, 10 are respectively provided with adhesive layers 7a, 7b and 11a, 11b
The insulating layers 8, 9 and 12, 13 are adhered through
Furthermore, the first pattern layer 6 and the second pattern layer 10 have an integrated structure by bonding the insulating layers 9 and 13 via an adhesive layer 14 as another insulating layer .
【００１０】このフレックスリジット基板５の多層配線
基板１側は、二股状に分岐し、第１、第２のパターン層
６、１０の互いに対向する面が露呈しており、この露呈
した対向面は、多層配線基板１を挟持するようにして、
両パターン２、３に電気的に接続されている。一方、フ
レックスリジット基板５の他端側の第１および第２のパ
ターン層６、１０は同一方向、すなわち下方方向に露呈
している。The multilayer wiring board 1 side of the flex-rigid board 5 branches into a forked shape, and surfaces of the first and second pattern layers 6 and 10 facing each other are exposed. , So as to sandwich the multilayer wiring board 1,
Both patterns 2 and 3 are electrically connected. On the other hand, the first and second pattern layers 6, 10 on the other end side of the flex-rigid substrate 5 are exposed in the same direction, that is, downward.
【００１１】コネクタ１５には、嵌合溝１６が設けられ
ており、この嵌合溝１６には、離間して配設された２層
状の電極１７ａ、１７ｂが臨み、これら２つの電極１７
ａ、１７ｂは、コネクタ１５のブロック内を貫通して、
下方に突出している。したがって、フレックスリジット
基板５の他端側を、コネクタ１５の嵌合溝１６内に嵌合
させると、第１および第２のパターン層６、１０の露呈
部分が電極１７ａ、１７ｂに電気的に接続される。な
お、本実施例では、第１および第２のパターン層６、１
０の露呈部分を同一方向としたが、これに限定されず、
反対方向あるいは、互いに向き合う方向に設けてもよい
ことは勿論である。The connector 15 is provided with a fitting groove 16, and two-layered electrodes 17 a and 17 b which are separately provided face the fitting groove 16.
a, 17b penetrate inside the block of the connector 15,
It protrudes downward. Therefore, when the other end of the flex-rigid substrate 5 is fitted into the fitting groove 16 of the connector 15, the exposed portions of the first and second pattern layers 6, 10 are electrically connected to the electrodes 17a, 17b. Is done. In the present embodiment, the first and second pattern layers 6, 1
Although the exposed portion of 0 was set to the same direction, it is not limited to this.
Needless to say, they may be provided in opposite directions or in directions facing each other.
【００１２】[0012]
【発明の効果】以上説明したように、本発明によれば、
第１および第２のパターン層の対向する絶縁層を別の絶
縁層を介して、接着層で接着すると共に、第１および第
２のパターン層のそれぞれの先端にコネクタの端子配列
に対応した接点パターンを設けたので、この接点パター
ンに接続される２つのコネクタを１つとすることがで
き、このためコネクタの実装面積および実装高さを小さ
くし、実装される装置の小型化を図ることができる効果
がある。As described above, according to the present invention,
The opposite insulating layers of the first and second pattern layers are bonded to each other with an adhesive layer via another insulating layer, and contacts corresponding to the terminal arrangement of the connector are provided at the respective ends of the first and second pattern layers. Since the pattern is provided, it is possible to use only one connector connected to the contact pattern, so that the mounting area and mounting height of the connector can be reduced, and the size of the mounted device can be reduced. effective.
【図１】本発明に係るフレックスリジット基板を多層基
板とコネクタに接続する全体側断面図である。FIG. 1 is an overall side sectional view of connecting a flex-rigid substrate according to the present invention to a multilayer substrate and a connector.
【図２】従来のフレックスリジット基板を多層基板とコ
ネクタに接続する全体側断面図である。FIG. 2 is an overall side sectional view of connecting a conventional flex-rigid board to a multilayer board and a connector.
１ 多層配線基板 ２ パターン配線 ３ パターン配線 ５ フレックスリジット基板 ６ 第１のパターン ６ａ 接点パターン １０ 第２のパターン １０ａ 接点パターン １４ 接着層 １５ コネクタ DESCRIPTION OF SYMBOLS 1 Multilayer wiring board 2 Pattern wiring 3 Pattern wiring 5 Flex-rigid board 6 First pattern 6a Contact pattern 10 Second pattern 10a Contact pattern 14 Adhesive layer 15 Connector
Claims (1)
パターンのそれぞれに接続された第１および第２のパタ
ーン層と、これら第１および第２のパターン層のそれぞ
れの表裏に接着層を介して接着された絶縁層とからな
り、これら第１および第２のパターン層の対向する絶縁
層を別の絶縁層を介して、接着層で接着すると共に、前
記第１および第２のパターン層のそれぞれの先端にコネ
クタの端子配列に対応した接点パターンを設けたことを
特徴とするフレックスリジット基板。1. A first and a second pattern layer connected to a pair of patterns formed on the front and back of a multilayer wiring board, and an adhesive layer on each of the first and second pattern layers. An insulating layer adhered to the first and second pattern layers via a separate insulating layer and an adhesive layer between the first and second pattern layers. A contact pattern corresponding to the terminal arrangement of the connector is provided at each end of the flex-rigid substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3352972A JP2715767B2 (en) | 1991-12-17 | 1991-12-17 | Flex-rigid board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3352972A JP2715767B2 (en) | 1991-12-17 | 1991-12-17 | Flex-rigid board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05167202A JPH05167202A (en) | 1993-07-02 |
| JP2715767B2 true JP2715767B2 (en) | 1998-02-18 |
Family
ID=18427709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3352972A Expired - Fee Related JP2715767B2 (en) | 1991-12-17 | 1991-12-17 | Flex-rigid board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2715767B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19958776A1 (en) * | 1999-12-07 | 2001-06-13 | Bosch Gmbh Robert | Inseparable electrical and mechanical connection, contact part for an inseparable electrical and mechanical connection and method for producing an inseparable electrical and mechanical connection |
| JP4574311B2 (en) * | 2004-09-30 | 2010-11-04 | 大日本印刷株式会社 | Manufacturing method of rigid-flexible substrate |
| JP4849908B2 (en) * | 2006-02-27 | 2012-01-11 | 株式会社フジクラ | Rigid board connection structure |
-
1991
- 1991-12-17 JP JP3352972A patent/JP2715767B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05167202A (en) | 1993-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |