CN207505226U - Integrated circuit modules printed circuit carrier plate and integrated circuit modules - Google Patents

Integrated circuit modules printed circuit carrier plate and integrated circuit modules Download PDF

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Publication number
CN207505226U
CN207505226U CN201721306648.7U CN201721306648U CN207505226U CN 207505226 U CN207505226 U CN 207505226U CN 201721306648 U CN201721306648 U CN 201721306648U CN 207505226 U CN207505226 U CN 207505226U
Authority
CN
China
Prior art keywords
line segment
terminating point
circuit line
support plate
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721306648.7U
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Chinese (zh)
Inventor
吴小星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ai Chuang Application Card Engineering Co Ltd
Original Assignee
Ai Chuang Application Card Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ai Chuang Application Card Engineering Co Ltd filed Critical Ai Chuang Application Card Engineering Co Ltd
Priority to CN201721306648.7U priority Critical patent/CN207505226U/en
Application granted granted Critical
Publication of CN207505226U publication Critical patent/CN207505226U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The utility model is related to integrated circuit modules printed circuit carrier plate and integrated circuit modules.The integrated circuit modules printed circuit carrier plate (25),Including having the substrate (12) of opposite top major surface (14a) and bottom major surface (14b),The top major surface and bottom major surface respectively cover one layer of copper,And the section that electrically conducts (18) through the substrate,It is electrically connected the top major surface and bottom major surface,There is the circuit line segment (26 to electrically conduct on the bottom major surface,28,30,32,34,40,42,44,46,48),The first end of the circuit line segment is connect with the section that electrically conducts,And the second end of the circuit line segment terminates at respective terminating point (A2,B2,C2,D2,E3),And those terminating points are respectively positioned on the same side of the central point of substrate,Or the section that electrically conducts that those terminating points are connected than it is closer to the central point of substrate.

Description

Integrated circuit modules printed circuit carrier plate and integrated circuit modules
Technical field
The utility model is related to contact integrated circuit (Integrated Circuit, abbreviation IC) module PCB wiring boards (Printed Circuit Board, abbreviation PCB) support plate technical field is refered in particular to contact IC module PCB support plates, is made with it IC modules and manufacture craft.
Background technology
Contact IC modules are born in the early 1990s, are the new technologies to grow up recent years in the world, connect Touch IC modules are the abbreviations of integrated circuit modules, are a quantum jumps of field of electronic devices.
Along with the development of the communication technology, contact IC modules mainly for the production of financial IC card, for SIM, GSM, CDMA mobile communications are also employed in each neck of the production and living such as entrance guard management, traffic, social security, proof of identification and stored value card Domain.Contact IC modules are passive body in itself, when being written and read operation to module by reader, signal that reader is sent out by Two parts superposition composition：A part is power supply signal, which directly feeds chip power work.Another part is then to combine number It is believed that number, commander's chip completes data, modification and storage etc., and return to reader.
Contact IC modules PCB loading plate manufacturing process of the prior art is complex, and after live product is made, due to passing System support plate is single-side coated copper plate, and the position of backside pads is fixed and position disperses, and is spaced farther out, in follow-up producing process routing Distance is longer, and more using gold thread, less efficient, cost is higher, and in view of this, the utility model provides following technical scheme.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of integrated circuit modules printed circuit and carry Plate and integrated circuit modules.
It is according to the present utility model in a first aspect, provide a kind of integrated circuit modules printed circuit carrier plate, including substrate, It respectively covers one layer with opposite the first main surface and the second main surface, first main surface and second main surface Copper and electrically conducting through the first of the substrate and second electrically conducts section at section, makes first main surface and described Two main surfaces are electrically connected, wherein the first circuit line segment to electrically conduct in first main surface and electrically conduct second Circuit line segment, the first end of the first circuit line segment is connect with described first section that electrically conducts, and the first circuit line segment Second end terminate at the first terminating point, the first end of the second circuit line segment is connect with described second section that electrically conducts, and The second end of the second circuit line segment terminates at the second terminating point and wherein described first terminating point and second termination Point be respectively positioned on the central point of the substrate the same side or first terminating point section that electrically conducts than described first it is closer The central point of the substrate.
Second aspect according to the present utility model provides a kind of integrated circuit modules, and including support plate, the support plate includes Substrate, with opposite the first main surface and the second main surface, first main surface and second main surface respectively cover One layer of copper and electrically conducting through the first of the substrate and second electrically conducts section at section, makes first main surface and institute The electric connection of the second main surface is stated, wherein the first circuit line segment for electrically conducting in first main surface and electrically conducting it Second circuit line segment, the first end of the first circuit line segment is connect with described first section that electrically conducts, and first circuit The second end of line segment terminates at the first terminating point, and the first end of the second circuit line segment electrically conducts Duan Lian with described second It connects, and the second end of the second circuit line segment terminates at the second terminating point and wherein described first terminating point and described Section that two terminating points are respectively positioned on the same side of the central point of the substrate or first terminating point electrically conducts than described first Closer to the central point of the substrate and at least IC wafer of the first pad and the second pad, wherein First terminating point of first pad of the IC wafer and the first circuit line segment of the support plate It is electrically connected, and the institute of second pad of the IC wafer and the second circuit line segment of the support plate State the electric connection of the second terminating point.
After adopting the above technical scheme, the utility model has the advantages that compared with prior art：This practicality The manufacture craft of novel touch IC module PCB support plates is by a relatively simple, and the utility model is replaced using double face copper Traditional single-side coated copper plate, therefore circuit can also be overleaf designed, via hole is made to be connected with pad by circuit, such pad Can the dosage of gold thread so as to reduce the thread of routing procedure, be greatly reduced with integrated distribution to the position near from wafer solder joint, It greatly improves the efficiency, reduces cost, conducive to the market competitiveness of the utility model is improved.
Description of the drawings
Refer to the attached drawing is only described the embodiment of the utility model in an illustrative manner, wherein：
Fig. 1 to Figure 10 shows a kind of making contact integrated circuit modules print of one embodiment according to the present utility model The method of brush circuit board；
Figure 11 shows a kind of part section of contact integrated circuit modules of one embodiment according to the present utility model Figure；And
Figure 12 to Figure 16 shows a kind of making contact integrated circuit modules of one embodiment according to the present utility model Method.
Specific embodiment
One embodiment according to the present utility model, goes out as also shown in Figure 1, first from large stretch of FR4, two opposite main tables The plate 10 that face covers last layer copper is cut into suitable working size, using as substrate 12.The opposite upper main table of substrate 12 Face 14a and lower surface 14b is also to cover last layer copper.Substrate 12 is also known as " flexible circuit plate " (Flexible herein Circuit Board, abbreviation FCB).As illustrated in FIG. 2, at least two are formed in substrate 12 (such as method with drilling) to run through The hole 16 of substrate 12.
Thereafter the hole 16 of substrate 12 is filled up with copper with electric plating method.The operating temperature of this step between 0 DEG C to 45 DEG C, Electroplating time substantially 2 hours.It is electroplated in cylinder and includes following raw material：70 gram per liter of copper sulphate (grams per litre), sulphur Sour 180 gram per liters (grams per litre), chlorion 50PPM (parts per million), 5 milliliters every liter of bronzing agent (millilitres per litre), electrotinning, 30 gram per liter of stannous sulfate (grams per litre), 200 grams of sulfuric acid are every Rise (grams per litre) and 20 milliliters every liter of tin photo etching (millilitres per litre).
After plating, copper is filled up in hole 16, the section 18 that electrically conducts is formed, makes the top major surface 14a of substrate 12 and lower main table Face 14b is electrically connected.However, go out as shown in Figure 4, the copper of some sections 18 that electrically conduct protrudes from the main surface of substrate 12 On the copper of 14a, 14b.With regard to this, as illustrated in FIG. 5, two main surfaces for protruding from substrate 12 are polished with ceramic grinder 20 The copper of the layers of copper of 14a, 14b, two main surfaces 14a, 14b for making substrate 12 are smooth, as illustrated in FIG. 6.
Thereafter, photosensitive material is used to the operation principle of photographic negative, is formed on the lower surface 14b of substrate 12 and set in advance The line pattern of meter.Later, layers of copper is made on established line pattern by electroplating chemical principle, then will by copper etching liquor Extra copper removes, the circuit finally needed.Wherein, 0 DEG C to 45 DEG C of the operating temperature of etching, time substantially 2 is electroplated Hour.It is electroplated in cylinder and includes following raw material：20 milliliters every liter of tin photo etching (millilitres per litre), 180 grams of sulfuric acid Every liter (grams per litre), 5 milliliters every liter of bronzing agent (millitres per litre), 70 gram per liter of copper sulphate (grams per litre), chlorion 50PPM (parts per million), 30 gram per liter of electrotinning (grams per ) and 30 gram per liter of stannous sulfate (grams per litre) litre；Copper etching liquor is mixed by copper chloride and ammonium hydroxide.
After the circuit finally needed is formed, the layers of copper of upper and lower main surface 14a, 14b of substrate 12 is carried out at surface Reason, then by the method for turmeric (Electroless Nickel Immersion Gold, abbreviation ENIG) substrate 12 it is upper, Last layer nickel 22 and one layer of gold 24 are respectively deposited in the layers of copper of bottom major surface 14a, 14b.The raw material of turmeric cylinder include：Nickel ion 4.6 gram per liters (grams per litre), golden 100 milliliters every liter of open cylinder agent (millitres per litre), 0.8 gram of gold salt Every liter (grams per litre) and 3 gram per liter of palladium ion (grams per litre).The operating temperature of turmeric is 0 DEG C To 95 DEG C, substantially 2 hours time.As illustrated in FIG. 7, nickel layer 22 is deposited on upper and lower main surface 14a, 14b of substrate 12 On layers of copper, and layer gold 24 is deposited on nickel layer 22.
Fig. 8 shows an integrated circuit modules printed circuit carrier plate 25 as made of the utility model, top major surface 27a There are five exposed contact point A1, B1, C1, D1 and E1 of the section 18 that electrically conducts through support plate 25 for tool.Fig. 9 is shown shown in Fig. 8 The bottom major surface 27b of the support plate 25 gone out.A1, B1, C1, D1 and E1 are this five through the section 18 that electrically conducts of support plate 25 in figure Exposed contact point on bottom major surface 27b corresponds to the contact point of the top major surface 27a of support plate 25 illustrated in fig. 8 respectively A1, B1, C1, D1 and E1.
As illustrated in FIG. 9, a wherein circuit line for the circuit of bottom major surface 27bs of the contact point A1 with being formed in support plate 25 Physically and electrically (such as through welding) connection, the other end of circuit line segment 26 terminate at A2 to section 26；Contact point B1 and shape Into the bottom major surface 27b in support plate 25 circuit a wherein circuit line segment 28 physically and electrically (such as through welding) Connection, the other end of circuit line segment 28 terminate at B2；Contact point C1 and be formed in support plate 25 bottom major surface 27b circuit its In a circuit line segment 30 physically and electrically (such as through welding) connection, the other end of circuit line segment 30 terminate at C2； A wherein circuit line segment 32 for the circuit of bottom major surface 27bs of the contact point D1 with being formed in support plate 25 is physically and electrically (such as through welding) connection, the other end of circuit line segment 32 terminate at D2；And contact point E1 is with being formed under support plate 25 A wherein circuit line segment 34 for the circuit of main surface 27b physically and electrically (such as through welding) connection, circuit line segment 34 other end terminates at E2.Contact point A2, B2, C2, D2 and E2 are respectively positioned on the same side of the central point of support plate 25.Using Fig. 9 as Example, contact point A2, B2, C2, D2 and E2 are respectively positioned on the left side of the central point of support plate 25.
Fig. 9 also shows that integrated circuit (IC) chip 36 is fixed on the bottom major surface 27b of support plate 12, to form one Integrated circuit modules (IC modules) 37, particularly one contact IC modules are particularly suitable for producing SIM card.Integrated circuit is brilliant There are five solder joints on piece 36, are electrically connected respectively with gold thread 38 and contact point A2, B2, C2, D2 and E2.Due to contact point A2, B2, C2, D2 and E2 are respectively positioned on the same side of IC wafer 36, (and the central point of the bottom major surface 27b of support plate 27 is same Side) left side is particularly, especially positioned at the side of the solder joint of IC wafer 36, so gold thread 38 needed for can reducing is total Length, so as to reduce the cost.
Figure 10 shows another feasible arrangement of the bottom major surface 27b of support plate 25 illustrated in fig. 8.Contact point A1 is with forming In the wherein circuit line segment 40 of circuit of the bottom major surface 27b of support plate 25, physically and electrically (such as through welding) even It connects, the other end of circuit line segment 40 terminates at A2；The circuit of bottom major surface 27bs of the contact point B1 with being formed in support plate 25 is wherein Physically and electrically (such as through welding) connection, the other end of circuit line segment 42 terminate at B2 to one circuit line segment 42；It connects Contact C1 and be formed in support plate 25 bottom major surface 27b circuit a wherein circuit line segment 44 physically and electrically (example Such as through welding) it connects, the other end of circuit line segment 44 terminates at C2；Contact point D1 and the bottom major surface for being formed in support plate 25 A wherein circuit line segment 46 for the circuit of 27b physically and electrically (such as through welding) connection, circuit line segment 46 it is another One end terminates at D2；An and wherein circuit line segment for the circuit of bottom major surface 27bs of the contact point E1 with being formed in support plate 25 48 physically and electrically (such as through welding) connection, the other end of circuit line segment 48 terminate at E2.As seen from Figure 10, A2 ratios A1 is closer to the central point (and central point of the bottom major surface 27b of support plate 27) of the bottom major surface 14b of substrate 12；B2 is than B1 more Close to the central point of the bottom major surface 14b of substrate 12；C2 is than C1 closer to the central point of the bottom major surface 14b of substrate 12；D2 ratios D1 is closer to the central point of the bottom major surface 14b of substrate 12；And E2 than E1 closer to the center of the bottom major surface 14b of substrate 12 Point.According to this arrangement, can also reduce five solder joints being for electrically connecting on IC wafer 26 and contact point A2, B2, The total length of the gold thread 50 of C2, D2 and E2, so as to reduce the cost.
Figure 11 shows the partial cross-sectional view of IC modules 37, and there is shown with two exposed contact points of the section 18 that electrically conducts A1, one of them is on the upper surface 27a of support plate 25, another is on the lower surface 27b of support plate 25.Figure 11 is also shown Contact point A2 on the lower surface 27b of support plate 25 passes through circuit with the contact point A1 on the lower surface 27b of support plate 25 Line segment 26/40 is electrically connected.Contact point A2 on the IC chips 36 and lower surface 27b of support plate 25 is electrical by gold thread 38/50 Connection.Through gold thread 38/50, support plate 25 lower surface 27b on contact point A2, circuit line segment 26/40, under support plate 25 Contact point A1 and the section 18 that electrically conducts on the 27b of surface, related solder joint on IC chips 36 in the upper surface of support plate 25 Contact point A1 on 27a is electrically connected.
As Figure 12 is to illustrated in fig. 16, adhesive 60 is provided in the central part of the lower surface 27b of support plate 25 first, Then IC chips 36 are put, fix its lower surface 27b with support plate 25, then the solder joint of contact point A2 and IC chip 36 it Between (such as the method with welding) connection gold thread 38/50, the adhesive 62 to electrically conduct is provided, makes such connection more secured. After completing to connect all gold threads 38/50, then protective agent 64 is provided, protective layer 66 is formed, to protect entire IC chips 36.
In conclusion the contact IC module PCB support plates of the utility model and the manufacture craft of contact IC modules are opposite It is relatively simple, and the utility model replaces traditional single-side coated copper plate using double face copper, therefore overleaf (under main table) Circuit can be designed, makes to electrically conduct section 18 by circuit and pad (is the contact point on the lower surface 27b of support plate 25 A2, B2, C2, D2 and E2) be connected, such pad can with integrated distribution to the position near from 36 solder joint of IC wafer, from And the thread of routing procedure is reduced, the dosage of gold thread is greatly reduced, is greatly improved the efficiency, reduces cost, conducive to raising The market competitiveness of the utility model.
Certainly, the foregoing is merely specific embodiment of the utility model, and not with limitation the utility model Range, the equivalent change or modification that all construction, feature and principles according to described in the utility model patent application range are done, It should be included in the scope of the utility model.In addition, it is to be understood that the above is only that the utility model can perform shows Example, and in the case of the thought without departing substantially from the utility model, can carry out various modifications and/or replace.It should also be understood that It is, for sake of simplicity, the various characteristics of the utility model described in the content of single embodiment can also be individually or to appoint Suitable sub-portfolio of anticipating provides.

Claims (13)

1. a kind of integrated circuit modules printed circuit carrier plate, including：
Substrate, with opposite the first main surface and the second main surface, first main surface and second main surface are each Cover one layer of copper and
It electrically conducts and section and second electrically conducts section through the first of the substrate, make first main surface and second master Surface electrical behavior connects,
There are the first circuit line segment to electrically conduct and the second circuit line segment to electrically conduct in wherein described first main surface, it is described The first end of first circuit line segment is connect with described first section that electrically conducts, and the second end of the first circuit line segment terminates at First terminating point, the first end of the second circuit line segment is connect with described second section that electrically conducts, and the second circuit line Section second end terminate at the second terminating point and
Wherein described first terminating point and second terminating point are respectively positioned on the same side or described of the central point of the substrate First terminating point electrically conducts section than described first closer to the central point of the substrate.
2. support plate according to claim 1, wherein there is the support plate third through the substrate to electrically conduct section, the Four, which electrically conduct, section and the 5th electrically conducts section.
3. support plate according to claim 2, wherein there is tertiary circuit line segment, the electricity to electrically conduct in first main surface 4th circuit line segment of property conducting and the 5th circuit line segment to electrically conduct.
4. support plate according to claim 3, wherein the first end of the tertiary circuit line segment electrically conducts with the third Section connection, the second end of the tertiary circuit line segment terminate at third terminating point, the first end of the 4th circuit line segment and institute It states the 4th to electrically conduct section connection, and the second end of the 4th circuit line segment terminates at the 4th terminating point, and the described 5th The first end of circuit line segment is connect with the described 5th section that electrically conducts, and the second end of the 5th circuit line segment terminates at the 5th Terminating point.
5. support plate according to claim 4, wherein the third terminating point, the 4th terminating point and the described 5th Terminating point is respectively positioned on the same side of the central point of the substrate.
6. support plate according to claim 5, wherein the third terminating point, the 4th terminating point and the described 5th Terminating point is located at the same side of the central point of the substrate with first terminating point and second terminating point.
7. support plate according to claim 4, wherein the third terminating point electrically conducts section closer to institute than the third State the central point of substrate.
8. a kind of integrated circuit modules, including：
Support plate according to claim 1 and
With at least IC wafer of the first pad and the second pad,
Described the of first pad of wherein described IC wafer and the first circuit line segment of the support plate One terminating point is electrically connected, and the second circuit of second pad of the IC wafer and the support plate Second terminating point of line segment is electrically connected.
9. integrated circuit modules according to claim 8, wherein described the of the first circuit line segment of the support plate Second terminating point of one terminating point and the second circuit line segment is respectively positioned on the same side of the IC wafer.
10. integrated circuit modules according to claim 9, wherein described the of the first circuit line segment of the support plate Second terminating point of one terminating point and the second circuit line segment is respectively positioned on described the first of the IC wafer The side of pad and second pad.
11. integrated circuit modules according to claim 8, wherein described the of the first circuit line segment of the support plate One terminating point electrically conducts section than described first closer to the IC wafer.
12. integrated circuit modules according to claim 8, wherein the integrated circuit modules are contact integrated circuits Module.
13. integrated circuit modules according to claim 12, wherein the contact integrated circuit modules are suitable for giving birth to Produce SIM card.
CN201721306648.7U 2017-10-11 2017-10-11 Integrated circuit modules printed circuit carrier plate and integrated circuit modules Expired - Fee Related CN207505226U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721306648.7U CN207505226U (en) 2017-10-11 2017-10-11 Integrated circuit modules printed circuit carrier plate and integrated circuit modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721306648.7U CN207505226U (en) 2017-10-11 2017-10-11 Integrated circuit modules printed circuit carrier plate and integrated circuit modules

Publications (1)

Publication Number Publication Date
CN207505226U true CN207505226U (en) 2018-06-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721306648.7U Expired - Fee Related CN207505226U (en) 2017-10-11 2017-10-11 Integrated circuit modules printed circuit carrier plate and integrated circuit modules

Country Status (1)

Country Link
CN (1) CN207505226U (en)

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20180615

Termination date: 20191011