WO2019071736A1 - Oled显示器及其制作方法 - Google Patents

Oled显示器及其制作方法 Download PDF

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Publication number
WO2019071736A1
WO2019071736A1 PCT/CN2017/112506 CN2017112506W WO2019071736A1 WO 2019071736 A1 WO2019071736 A1 WO 2019071736A1 CN 2017112506 W CN2017112506 W CN 2017112506W WO 2019071736 A1 WO2019071736 A1 WO 2019071736A1
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substrate
plastic frame
cathode
transparent conductive
layer
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PCT/CN2017/112506
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English (en)
French (fr)
Inventor
余威
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武汉华星光电半导体显示技术有限公司
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Priority to US15/735,932 priority Critical patent/US20190386241A1/en
Publication of WO2019071736A1 publication Critical patent/WO2019071736A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/824—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80522—Cathodes combined with auxiliary electrodes

Definitions

  • the invention relates to the field of display technology, in particular to an OLED display and a manufacturing method thereof.
  • OLED displays also known as organic electroluminescent displays, are an emerging flat panel display device that has a simple manufacturing process, low cost, low power consumption, high luminance, wide operating temperature range, and slim size. The response speed is fast, and it is easy to realize the advantages of color display and large screen display, and has broad application prospects.
  • the existing OLED includes a bottom emission type display and a top emission type display.
  • a top emission type OLED display the light emitting principle of the organic light emitting diode OLED display is to add an organic light emitting layer between the cathode and the metal anode or the conductive layer.
  • the organic light-emitting layer emits light when a voltage is applied across the cathode and the metal anode. Light emitted from the organic light-emitting layer exits the substrate from the side of the translucent metal cathode.
  • the metal cathode In order to ensure that the light is emitted from the side of the translucent metal cathode as much as possible, it is generally required to set the metal cathode to be thin, only a few nanometers thick, and therefore, the corresponding translucent metal cathode has a large electrical resistance, a translucent metal cathode and a metal anode.
  • the organic light-emitting layer When the organic light-emitting layer is driven together, it consumes a large amount of electric energy, and the heat is large, which easily affects the normal operation of the array substrate.
  • the technical problem to be solved by the present invention is to provide an OLED display and a manufacturing method thereof, which can not only reduce the electrode resistance, thereby improving the cathode resistivity, reducing panel heat generation, reducing power consumption, and improving the packaging effect.
  • a technical solution adopted by the present invention is to provide a method for fabricating an organic light emitting diode OLED display, and the manufacturing method includes:
  • the transparent conductive paste is heated to cure the transparent conductive paste, so that the transparent conductive adhesive layer is cured and cured with the cathode.
  • another technical solution adopted by the present invention is to provide a method for fabricating an OLED display, comprising the following steps:
  • an OLED display structure including:
  • Encapsulating a cover plate the package cover plate being adhered to the first substrate by a plastic frame coated at an edge thereof; wherein the inside of the area enclosed by the package cover plate and the plastic frame is coated a transparent conductive adhesive layer, the transparent conductive adhesive layer being cured and cured with the cathode.
  • the invention has the beneficial effects that the transparent conductive adhesive layer is coated on the inner side of the area enclosed by the package cover and the plastic frame, and is adhered to the first substrate through the plastic frame, and is different from the prior art.
  • Forming a closed space on a substrate not only reduces the electrode resistance, thereby improving the cathode resistivity, reducing the panel heat generation, reducing the power consumption, and also improving the packaging effect, preventing the water and oxygen from entering the OLED display through the plastic frame, so that the organic light is emitted.
  • the aging of the layer of organic materials affects the lifetime of the OLED display.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for fabricating an OLED display of the present invention
  • FIG. 2 is a cross-sectional view showing an embodiment of the OLED display after the first substrate, the anode, the organic light-emitting layer, and the cathode are formed by the fabrication method of FIG. 1;
  • FIG. 3 is a cross-sectional view showing an embodiment of the OLED display after forming a package cover, a plastic frame, and a conductive paste in the manufacturing method of FIG. 1;
  • FIG. 4 is a cross-sectional view showing an embodiment of an OLED display of the present invention.
  • Figure 5 is a cross-sectional view showing another embodiment of the OLED display of the present invention.
  • FIG. 1 is a schematic flowchart of a method for fabricating an OLED display according to an embodiment of the present invention.
  • the method for fabricating an OLED display of the present embodiment includes the following steps:
  • Step 100 sequentially forming an anode, an organic light-emitting layer, and a cathode on the first substrate.
  • a first substrate is first prepared, an anode is formed on the first substrate, a hole injection layer is formed on the anode, and a hole transport layer is formed on the hole injection layer on the hole transport layer.
  • An organic light-emitting layer is formed, an electron transport layer is formed on the organic light-emitting layer, an electron injection layer is formed on the electron transport layer, and a cathode is formed on the electron injection layer.
  • the anode, the hole injection layer, the hole transport layer, the organic light-emitting layer, the electron transport layer, the electron injection layer, and the cathode formed on the first substrate are sequentially stacked, wherein the organic light-emitting layer includes an organic thin film And organic luminescent materials, etc.
  • the first substrate is an array substrate
  • the array substrate includes a glass substrate, a gate disposed on the glass substrate, a gate insulating layer formed on the gate, an oxide film layer, and an oxide film a source and a drain on the layer, wherein the source and the drain are separated by a channel.
  • the first substrate may be at least one of glass and quartz.
  • the OLED display is a top emission type OLED display
  • the anode material is a metal material
  • the cathode material is a translucent metal material.
  • FIG. 2 is a schematic cross-sectional structural view of an OLED according to an embodiment of the manufacturing method of FIG. 1.
  • the schematic diagram of the structure of the present embodiment is a schematic structural view of forming an anode, an organic light-emitting layer, and a cathode on a first substrate.
  • an anode 201 is formed on the first substrate 200
  • a hole injection layer (not shown) is formed on the anode
  • a hole transport layer (not shown) is formed on the hole injection layer to transport the holes.
  • An organic light-emitting layer 202 is formed on the layer, an electron transport layer (not shown) is formed on the organic light-emitting layer 202, an electron injection layer (not shown) is formed on the electron transport layer, and a cathode 203 is formed on the electron injection layer.
  • Step 101 Apply a plastic frame to the edge of the package cover, and apply a transparent conductive adhesive layer inside the area surrounded by the plastic frame and the package cover.
  • the present embodiment in order to package the cover plate to be attached to the first substrate and form a closed space, applies a plastic frame on the edge of the package cover.
  • the sealant can be a dam glue.
  • a transparent conductive adhesive layer is coated on a side of a region surrounded by the plastic frame and the package cover.
  • the transparent conductive paste may be a transparent electronic glue, and the material includes a material such as sorbitol.
  • the transparent conductive adhesive may also be a colloidal conductive material applied to an electronic component, which is not specifically limited herein.
  • FIG. 3 is a schematic cross-sectional structural view of an OLED according to another embodiment of the manufacturing method of FIG. 1.
  • the schematic diagram of the structure of the present embodiment is a schematic structural view of a cover plate coated with a plastic frame and a conductive adhesive layer.
  • the plastic frame 301 is first coated on the edge of the package cover 300, and the transparent conductive paste 302 is coated on the inner side of the area surrounded by the plastic frame 301 and the package cover 300.
  • Step 102 attaching the package cover to the first substrate through a plastic frame to form a closed space, wherein the transparent conductive adhesive layer is cured and adhered to the cathode.
  • the package cover is attached to the first substrate through a plastic frame in a vacuum environment, and the package cover is attached to the cathode layer of the first substrate, wherein the transparent conductive adhesive layer is adhered to the cathode.
  • the transparent conductive adhesive fills the space between the package cover and the cathode layer of the first substrate, and the package cover forms a closed space with the first substrate.
  • the plastic frame and the transparent conductive adhesive need to be cured.
  • the plastic frame is cured by irradiating the plastic frame with ultraviolet light.
  • the transparent conductive paste is cured by heating the transparent conductive paste.
  • the plastic frame may be cured by heating the plastic frame; the transparent conductive adhesive may be cured by a room temperature curing method.
  • the plastic frame and the transparent conductive paste are finally in a cured state, they are not specifically limited herein.
  • the manufacturing method of the OLED display of the present invention is formed by coating a transparent conductive adhesive layer on the inner side of the area enclosed by the package cover and the plastic frame, and bonding the same to the first substrate through the plastic frame.
  • a closed space not only reduces the electrode resistance, but also increases the cathode resistivity, reduces panel heating, reduces power consumption, and improves package efficiency.
  • FIG. 4 is a schematic cross-sectional view showing an embodiment of an organic light emitting diode OLED display of the present invention.
  • the OLED display of the present embodiment includes a first substrate 400, an anode 401, an organic light-emitting layer 402, and a cathode 403 which are sequentially stacked on the first substrate, and a package cover 404 which is coated with glue at an edge thereof.
  • the frame 405 is adhered to the first substrate.
  • the inside of the area enclosed by the package cover 404 and the plastic frame is coated with a transparent conductive adhesive 406, and the transparent conductive adhesive 406 and the cathode 403 are bonded and cured.
  • the first substrate 400 and the package cover 404 may be at least one of glass and quartz.
  • the OLED display is a top emission type OLED display, the anode 401 is made of a metal material, and the cathode 403 is made of a translucent metal material.
  • FIG. 5 is a schematic cross-sectional view of another embodiment of an organic light emitting diode OLED display of the present invention.
  • the anode 501 and the organic light-emitting layer 504 of the organic light-emitting diode OLED display of the present invention further include a hole injection layer 502, a hole transport layer 503, an electron transport layer 506 between the organic light-emitting layer 504 and the cathode 508, and an electron injection layer 507. .
  • the transparent conductive paste 406 or 509 may be a transparent electronic glue, and the material includes a material such as sorbitol.
  • the transparent conductive adhesive layer can also be applied to the gel conductive material of the electronic component, which is not specifically limited herein.
  • the first substrate 400 and the package cover 404 are sealed by a plastic frame in a vacuum environment to form a closed space.
  • the plastic frame 405 and the transparent conductive paste 406 need to be cured.
  • the plastic frame 405 is cured by the method of irradiating the plastic frame 405 with ultraviolet light.
  • the transparent conductive paste 406 is further cured by heating the transparent conductive paste 406.
  • the plastic frame may be cured by heating the plastic frame 405; the transparent conductive adhesive 406 may be cured by a room temperature curing method. As long as the plastic frame 405 and the transparent conductive paste 406 are finally in a cured state.
  • the present invention is coated with a transparent conductive adhesive layer on the inner side of the area enclosed by the package cover and the plastic frame, and is adhered to the first substrate through the plastic frame to form a closed space with the first substrate.
  • the electrode resistance be reduced, thereby improving the cathode resistivity, reducing the panel heat generation, reducing the power consumption, and improving the packaging effect, preventing the water and oxygen from entering the OLED display through the plastic frame, causing the organic light-emitting layer to aging the organic material and affecting the OLED. Display life.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种有机发光二极管OLED显示器及其制作方法，其制作方法包括：在第一基板（400）上依次叠置形成阳极（401）、有机发光层（402）以及阴极（403）；在封装盖板（404）的边缘涂布胶框（405），并在胶框（405）以及封装盖板（404）所围成的区域内侧涂布透明导电胶层（406）；通过胶框（405）将封装盖板（404）贴合到第一基板（400）形成一封闭空间，其中，透明导电胶层（406）与阴极（403）粘接固化。通过上述方式，不仅能够降低电极电阻，从而提高阴极电阻率、减小面板发热、减小功耗，还可以提升封装效果。

Description

OLED显示器及其制作方法
【技术领域】
本发明涉及显示技术领域，特别是一种OLED显示器及其制作方法。
【背景技术】
有机发光二极管（Organic Light-Emitting diodes）OLED显示器，也称为有机电致发光显示器，是一种新兴的平板显示装置，由于其具有制备工艺简单、成本低、功耗低、发光亮度高、工作温度适应范围广、体积轻薄、响应速度快，而且易于实现彩色显示和大屏幕显示等优点，具有广阔的应用前景。
现有的OLED包括底发射型显示器和顶发射型显示器，以顶发射型OLED显示器为例，有机发光二极管OLED显示器的发光原理在于在阴极以及金属阳极或导电层之间增加一层有机发光层，在给阴极以及金属阳极两端增加电压时，有机发光层会发光。有机发光层发出的光自半透明金属阴极一侧射出基板。
为了保证光尽可能从半透明金属阴极一侧射出基板，一般需要将金属阴极设置的很薄，仅有数纳米厚，因此，对应的半透明金属阴极的电阻很大，半透明金属阴极和金属阳极共同驱动有机发光层发光时需要消耗较多的电能，并且发热较大，容易影响阵列基板的正常工作。
【发明内容】
本发明主要解决的技术问题是提供一种OLED显示器及其制作方法，不仅能够降低电极电阻，从而提高阴极电阻率、减小面板发热、减小功耗，还可以提升封装效果。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种有机发光二极管OLED显示器的制作方法，所述制作方法包括：
在第一基板上依次叠置形成阳极、有机发光层以及阴极；
在封装盖板的边缘涂布胶框，并在所述胶框以及所述封装盖板所围成的区域内侧涂布透明导电胶层；
通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间；
通过紫外光对所述胶框进行照射，以固化所述胶框；
加热所述透明导电胶，以固化所述透明导电胶，从而使所述透明导电胶层与所述阴极粘接固化。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种OLED显示器的制作方法，包括如下步骤：
在第一基板上依次叠置形成阳极、有机发光层以及阴极；
在封装盖板上的边缘涂布胶框，并在所述胶框以及所述封装盖板所围成的区域内侧涂布透明导电胶层；
通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间，其中，所述透明导电胶层与所述阴极层粘接固化。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种OLED显示器结构，包括：
第一基板，依次叠置在所述第一基板上的阳极、有机发光层以及阴极；
封装盖板，所述封装盖板通过涂布在其边缘位置的胶框与所述第一基板相贴合；其中，所述封装盖板与所述胶框所围成的区域内侧涂布有透明导电胶层，所述透明导电胶层与所述阴极粘接固化。
本发明的有益效果是：区别于现有技术，本发明在封装盖板与胶框所围成的区域内侧涂布有透明导电胶层，并通过胶框与第一基板相贴合，与第一基板形成一封闭空间，不仅能够降低电极电阻，从而提高阴极电阻率、减小面板发热、减小功耗，还可以提升封装效果，避免水氧透过胶框进入OLED显示器内部，使有机发光层有机材料老化，影响OLED显示器寿命。
【附图说明】
图1是本发明OLED显示器的制作方法一实施例的流程示意图；
图2是图1制作方法形成第一基板、阳极、有机发光层以及阴极后的OLED显示器一实施例的剖面示意图；
图3是图1制作方法形成封装盖板、胶框、导电胶后的OLED显示器一实施例的剖面示意图；
图4是本发明OLED显示器一实施例的剖面示意图；
图5是本发明OLED显示器另一实施例的剖面示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本发明保护的范围。
请参阅图1，图1是本发明OLED显示器的制作方法一实施例的流程示意图，本实施方式的OLED显示器的制作方法包括如下步骤：
步骤100：在第一基板上依次叠置形成阳极、有机发光层以及阴极。
在一个具体的实施场景中，首先制备第一基板，再在第一基板上形成阳极，在阳极上形成空穴注入层，在空穴注入层上形成空穴传输层，在空穴传输层上形成有机发光层，在有机发光层上形成电子传输层，在电子传输层上形成电子注入层，在电子注入层上形成阴极。具体地，在第一基板上形成的阳极、空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层以及阴极是依次叠置形成的，其中，有机发光层包括有机薄膜和有机发光材料等。
在本实施场景中，第一基板为阵列基板，阵列基板包括玻璃基板，设置在玻璃基板上的栅极，形成在栅极上的栅极绝缘层、氧化物薄膜层，以及设置在氧化物薄膜层上的源极和漏极，其中，源极和漏极以一沟道相隔开。其中，第一基板可以为玻璃、石英中的至少一种。
具体地，该OLED显示器为顶发射型OLED显示器，阳极材质为金属材料；阴极材质为半透明金属材料。
如图2所示，图2是图1制作方法的一具体实施方式的OLED的剖面结构示意图。本实施方式的结构示意图是在第一基板形成阳极、有机发光层以及阴极的结构示意图。具体地，在第一基板200上形成阳极201，在阳极上形成空穴注入层（图中未标示），在空穴注入层上形成空穴传输层（图中未标示），在空穴传输层上形成有机发光层202，在有机发光层202上形成电子传输层（图中未标示），在电子传输层上形成电子注入层（图中未标示），在电子注入层上形成阴极203。
当给阳极201和阴极203两端增加电压时，电子和空穴分别从阴极和阳极注入到电子传输层和空穴传输层，然后分别经过电子传输层和空穴传输层迁移到有机发光层202，并在有机发光层202中相遇形成激子，并激发有机发光材料发光。在本实施方式中，有机发光层202发出的光自半透明金属阴极203射出。
步骤101：在封装盖板的边缘涂布胶框，并在胶框以及封装盖板所围成的区域内侧涂布透明导电胶层。
在一个具体的实施场景中，为了封装盖板可以与第一基板贴合，并形成封闭空间，本实施方式在封装盖板的边缘上涂布胶框。在一个可选的实施方式中，该框胶可以为围坝胶。
为了进一步地避免水氧透过胶框进入OLED显示器内部而导致的有机发光层有机材料老化，进而提高OLED显示器的显示寿命。本实施方式在胶框与封装盖板所围成的区域内侧涂布透明导电胶层。
在一个可选的实施方式中，透明导电胶可以为透明电子胶水，材质包括山梨醇等材料。在其他实施方式中，透明导电胶还可以为应用于电子元器件的胶质导电材料，在此不作具体限定。
如图3所示，图3是图1制作方法的另一具体实施方式的OLED的剖面结构示意图。本实施方式的结构示意图是封装盖板涂布胶框、导电胶层的结构示意图。如图3所示，先在封装盖板300边缘涂布胶框301，再在胶框301与封装盖板300所围成的区域内侧涂布透明导电胶302。
步骤102：通过胶框将所述封装盖板贴合到第一基板形成一封闭空间，其中，透明导电胶层与阴极粘接固化。
在一个具体的实施场景中，在真空环境下，通过胶框将封装盖板与第一基板进行贴合，封装盖板贴合到第一基板的阴极层，其中，透明导电胶层与阴极粘接固化，贴合的过程中透明导电胶填充封装盖板与第一基板阴极层之间的空间，封装盖板与第一基板形成一封闭空间。
为了进一步地阻挡水氧，封装盖板与第一基板贴合后，还需要对胶框和透明导电胶进行固化。在本实施方式中，通过紫外光对胶框进行照射的方法对胶框进行固化。并通过加热透明导电胶的方法对透明导电胶进行固化。
在其它的实施场景中，可以通过加热胶框的方法对胶框进行固化；通过室温固化的方法对透明导电胶进行固化等。只要胶框和透明导电胶最终是固化状态即可，在此不作具体限定。
通过上述描述可知，本发明的OLED显示器的制作方法通过在封装盖板与胶框所围成的区域内侧涂布有透明导电胶层，并通过胶框与所述第一基板相贴合，形成一封闭空间，不仅能够降低电极电阻，从而提高阴极电阻率、减小面板发热、减小功耗，还可以提升封装效果。
参阅图4，图4是本发明有机发光二极管OLED显示器一实施方式的剖面示意图。本实施方式的OLED显示器包括第一基板400，依次叠置在第一基板上的阳极401、有机发光层402以及阴极403；封装盖板404，封装盖板404通过涂布在其边缘位置的胶框405与所述第一基板相贴合；其中，封装盖板404与胶框所围成的区域内侧涂布有透明导电胶406，透明导电胶406与阴极403粘接固化。
其中，该第一基板400和封装盖板404可以为玻璃、石英中的至少一种。该OLED显示器为顶发射型OLED显示器，阳极401的材质为金属材料；阴极403的材质为半透明金属材料。
在具体的实施方式中，如图5所示，图5是本发明有机发光二极管OLED显示器另一实施方式的剖面示意图。本发明有机发光二极管OLED显示器的阳极501与有机发光层504之间还包括空穴注入层502、空穴传输层503，有机发光层504与阴极508之间的电子传输层506以及电子注入层507。
进一步地，如图4所示，当给阳极401和阴极403两端增加电压时，电子和空穴分别从阴极403和阳极401注入到电子传输层和空穴传输层，然后分别经过电子传输层和空穴传输层迁移到有机发光层402，并在有机发光层402中相遇形成激子，并激发有机发光材料发光。在本实施方式中，有机发光层402发出的光自半透明金属阴极403射出。
在上述任一实施方式中，透明导电胶406或509可以为透明电子胶水，材质包括山梨醇等材料。在其他实施方式中，透明导电胶层还可以应用于电子元器件的胶质导电材料，在此不作具体限定。通过设置该透明导电胶层406或509，能够避免水氧透过胶框进入OLED显示器内部而导致有机发光层有机材料老化，进而提高OLED显示器的显示寿命。
在一个可选的实施方式中，该第一基板400与封装盖板404是在真空环境下通过胶框贴合而形成封闭空间的。
为了进一步阻挡水氧，封装盖板404与第一基板400贴合后，还需要对胶框405和透明导电胶406进行固化。在本实施方式中，通过紫外光对胶框405照射的方法对胶框405进行固化。并进一步地通过加热透明导电胶406的方法对透明导电胶406进行固化。
在其它的实施场景中，可以通过加热胶框405的方法对胶框进行固化；通过室温固化的方法对透明导电胶406进行固化等。只要胶框405和透明导电胶406最终是固化状态即可。
区别于现有技术，本发明在封装盖板与胶框所围成的区域内侧涂布有透明导电胶层，并通过胶框与第一基板相贴合，与第一基板形成一封闭空间，不仅能够降低电极电阻，从而提高阴极电阻率、减小面板发热、减小功耗，还可以提升封装效果，避免水氧透过胶框进入OLED显示器内部，使有机发光层有机材料老化，影响OLED显示器寿命。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (15)

  1. 一种有机发光二极管OLED显示器的制作方法，其中，所述制作方法包括：
    在第一基板上依次叠置形成阳极、有机发光层以及阴极；
    在封装盖板的边缘涂布胶框，并在所述胶框以及所述封装盖板所围成的区域内侧涂布透明导电胶层；
    通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间；
    通过紫外光对所述胶框进行照射，以固化所述胶框；
    加热所述透明导电胶，以固化所述透明导电胶，从而使所述透明导电胶层与所述阴极粘接固化。
  2. 根据权利要求1所述的制作方法，其中，所述通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间的步骤具体包括：
    在真空环境下通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间。
  3. 根据权利要求1所述的制作方法，其中，所述在第一基板上依次叠置形成阳极、有机发光层以及阴极的步骤之前还包括：
    在玻璃基板上形成栅极；
    在所述栅极上依次形成栅极绝缘层、氧化物薄膜层；
    在所述氧化物薄膜层上依次形成源极和漏极，其中，所述源极和所述漏极以一沟道相隔开。
  4. 根据权利要求1所述的制作方法，其中，所述透明导电胶的材质为山梨醇。
  5. 根据权利要求1所述的制作方法，其中，所述阴极材质为半透明金属材料。
  6. 一种有机发光二极管OLED显示器的制作方法，其中，所述制作方法包括：
    在第一基板上依次叠置形成阳极、有机发光层以及阴极；
    在封装盖板的边缘涂布胶框，并在所述胶框以及所述封装盖板所围成的区域内侧涂布透明导电胶层；
    通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间，且所述透明导电胶层与所述阴极粘接固化。
  7. 根据权利要求6所述的制作方法，其中，所述通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间的步骤具体包括：
    在真空环境下通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间。
  8. 根据权利要求6所述的制作方法，其中，所述通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间的步骤之后还包括：
    通过紫外光对所述胶框进行照射，以固化所述胶框。
  9. 根据权利要求6所述的制作方法，其中，所述通过所述胶框将所述封装盖板贴合到所述第一基板形成一封闭空间的步骤之后还包括：
    加热所述透明导电胶，以固化所述透明导电胶，从而使所述透明导电胶层与所述阴极粘接固化。
  10. 根据权利要求6所述的制作方法，其中，所述在第一基板上依次叠置形成阳极、有机发光层以及阴极的步骤之前还包括：
    在玻璃基板上形成栅极；
    在所述栅极上依次形成栅极绝缘层、氧化物薄膜层；
    在所述氧化物薄膜层上依次形成源极和漏极，其中，所述源极和所述漏极以一沟道相隔开。
  11. 一种有机发光二极管OLED显示器，其中，所述OLED显示器包括：
    第一基板，依次叠置在所述第一基板上的阳极、有机发光层以及阴极；
    封装盖板，所述封装盖板通过涂布在其边缘位置的胶框与所述第一基板相贴合；其中，所述封装盖板与所述胶框所围成的区域内侧涂布有透明导电胶层，所述透明导电胶层与所述阴极粘接固化。
  12. 根据权利要求11所述的OLED显示器，其中，所述透明导电胶的材质为山梨醇。
  13. 根据权利要求11所述的OLED显示器，其中，所述阴极材质为半透明金属材料。
  14. 根据权利要求11所述的OLED显示器，其中，所述胶框为通过紫外线照射所形成的固化胶框。
  15. 根据权利要求11所述的OLED显示器，其中，所述OLED显示器还包括设置在所述阳极与所述有机发光层之间的空穴注入层、空穴传输层，还包括设置在所述有机发光层与所述阴极之间的电子传输层以及电子注入层。
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