WO2019061602A1 - 一种彩膜基板及其制造方法、显示设备 - Google Patents

一种彩膜基板及其制造方法、显示设备 Download PDF

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Publication number
WO2019061602A1
WO2019061602A1 PCT/CN2017/107173 CN2017107173W WO2019061602A1 WO 2019061602 A1 WO2019061602 A1 WO 2019061602A1 CN 2017107173 W CN2017107173 W CN 2017107173W WO 2019061602 A1 WO2019061602 A1 WO 2019061602A1
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WO
WIPO (PCT)
Prior art keywords
shielding layer
light shielding
display area
layer
conductivity
Prior art date
Application number
PCT/CN2017/107173
Other languages
English (en)
French (fr)
Inventor
洪光辉
龚强
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/576,193 priority Critical patent/US20190384128A1/en
Publication of WO2019061602A1 publication Critical patent/WO2019061602A1/zh

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136209Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133512Light shielding layers, e.g. black matrix
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133514Colour filters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133388Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/22Antistatic materials or arrangements

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a color film substrate, a method for manufacturing the same, and a display device.
  • the technical problem to be solved by the present invention is to provide a color film substrate, a manufacturing method thereof, and a display device, which can improve the antistatic capability of the display panel, thereby solving the problem that the display panel is easily affected by static electricity and cannot work normally.
  • a technical solution adopted by the present invention is to provide a color filter substrate, comprising: a substrate substrate defining a display area and a non-display area, wherein the non-display area is located at the periphery of the display area; the first light shielding layer Provided in the non-display area and having a first conductivity; the second light shielding layer is disposed on a side of the non-display area away from the display area, and the second light shielding layer is disposed on the periphery of the first light shielding layer and the first light shielding layer Surrounding, the second light shielding layer has a second conductivity, wherein the second conductivity is less than the first conductivity.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a color film substrate, comprising: providing a substrate substrate, wherein the substrate substrate defines a display area and a non-display area, and is not displayed.
  • the area is located at the periphery of the display area; the first light-shielding layer having the first conductivity is fabricated on the non-display area on one side of the substrate; the second light-shielding layer having the second conductivity is formed on the same layer of the first light-shielding layer, and the second light-shielding
  • the layer is disposed on a periphery of the first light shielding layer and surrounds the first light shielding layer, wherein the second conductivity is less than the first conductivity.
  • a display device which includes a color filter substrate, wherein the color film substrate comprises: a substrate substrate, which defines a display area and a non-display area, The display area is located at the periphery of the display area; the first light shielding layer is disposed in the non-display area and has a first electrical conductivity; the second light shielding layer is disposed on a side of the non-display area away from the display area, and the second light shielding layer is disposed at the first A periphery of a light shielding layer surrounds the first light shielding layer, and the second light shielding layer has a second conductivity, wherein the second conductivity is less than the first conductivity.
  • the invention has the beneficial effects that the color film substrate, the manufacturing method thereof and the display device are different from the prior art.
  • the color film substrate comprises: a substrate substrate defining a display area and a non-display area, wherein the non-display area is located at a periphery of the display area; the first light shielding layer is disposed in the non-display area and has a first conductivity; the second light shielding layer And disposed on a side of the non-display area away from the display area, the second light shielding layer is disposed at a periphery of the first light shielding layer and surrounds the first light shielding layer, and the second light shielding layer has a second conductivity, wherein the second conductivity The rate is less than the first conductivity.
  • the present invention adds a second light-shielding layer having a smaller conductivity to the outside of the first light-shielding layer in the non-display area of the color filter substrate, so that static electricity is more difficult to pass through the non-display area, thereby protecting the line of the display area from static electricity. And it was damaged.
  • FIG. 1 is a schematic structural view of an embodiment of a color filter substrate according to the present invention.
  • Figure 2 is a schematic structural view showing a cross section of the color film substrate of Figure 1 in the II-II' direction;
  • FIG. 3 is a partial enlarged view of the embodiment of the color filter substrate shown in FIG. 1 at a position III;
  • FIG. 4 is a partial enlarged view of another embodiment of the color filter substrate shown in FIG. 1 at a position III;
  • Figure 5 is a schematic structural view showing a cross section of another embodiment of the color filter substrate shown in Figure 1 in the direction of II-II';
  • FIG. 6 is a schematic flow chart of a method for manufacturing a color filter substrate according to the present invention.
  • FIG. 7 is a schematic structural view of an embodiment of a display device according to the present invention.
  • Figure 8 is a structural schematic view showing a cross section of the display device embodiment shown in Figure 7 in the direction of VI-VI'.
  • FIG. 1 is a schematic structural view of a color filter substrate of the present invention
  • FIG. 2 is a schematic structural view of a cross section of the color film substrate shown in FIG. 1 in the II-II' direction.
  • the color film substrate 10 includes a base layer 13 provided with a display area 11 and a non-display area 12, the non-display area 12 is disposed at the periphery of the display area 11, and the non-display area 12 is provided with a first light shielding layer 121 and a second light shielding layer.
  • Layer 122 is provided with a first light shielding layer 121 and a second light shielding layer.
  • the first light shielding layer 121 surrounds the display area 11
  • the second light shielding layer 122 is disposed on the periphery of the first light shielding layer 121 and surrounds the first light shielding layer 121 .
  • the first light shielding layer 121 has a first conductivity
  • the second light shielding layer 122 has a second conductivity
  • the second conductivity is less than the first conductivity.
  • the color filter substrate 10 in this embodiment is a CF of a liquid crystal display panel. Filter, color filter) substrate.
  • the first light-shielding layer 121 and the second light-shielding layer 122 can be prepared by a photomask development process, and the specific manufacturing method is as follows: First, a substrate is provided, which is etched on one side of the substrate by a mask development process. The first light shielding layer is required, and then the second light shielding layer is etched through the second mask development process, and the first light shielding layer 121 and the second light shielding layer 122 may be disposed in the same layer to reduce the thickness of the color filter substrate.
  • the specific manufacturing steps are as follows, and will not be described here.
  • the first light shielding layer 121 can adopt the BM of the color film substrate 10 (Black
  • the material used in the Matrix (black matrix) layer (not shown) is prepared, for example, a metal oxide film, a resin material, etc., and the BM layer functions to separate the display regions into individual pixels one by one.
  • the BM layer is formed on the color filter substrate 10 by a mask development process.
  • the first light shielding layer 121 may use the same material of the BM layer and be formed simultaneously with the BM layer. When the BM layer is manufactured, the BM layer and the first light shielding layer 121 can be simultaneously obtained by adjusting the photomask, which can make the manufacturing process simple and easy to produce.
  • the material of the first light shielding layer 121 may be different from the material of the BM layer. That is, the material of the first light shielding layer 121 is selected as needed.
  • the second light shielding layer 122 may be prepared using a color photoresist, and the color photoresist material may be at least one of red (R), green (G), and blue (B) photoresist.
  • the display layer 11 and the non-display area 12 are disposed on one side of the base layer 13 , and the non-display area 12 is disposed on the periphery of the display area 11 , and the first light shielding layer 121 and the second light shielding layer 122 are disposed on the non-display area 12 . .
  • the first light shielding layer 121 surrounds the display area 11
  • the second light shielding layer 122 is disposed on the periphery of the first light shielding layer 121 and surrounds the first light shielding layer 121 .
  • the second light shielding layer 122 is a monochromatic photoresist layer, and may be formed by any one of red (R), green (G), and blue (B) photoresists.
  • the conductivity of the first light shielding layer 121 It is larger than the second light shielding layer 122. Therefore, when the second light shielding layer 122 is manufactured, a photoresist material having a conductivity lower than that of the first light shielding layer 121 is selected, and the external static electricity can be shielded to prevent the external static electricity from damaging the color filter substrate 10.
  • the second light shielding layer 122 may also be formed of photoresist layers of different colors.
  • the second light shielding layer 122 may be alternately arranged in different layers by different color resists, or the second light shielding layer 122 may be formed by alternately stacking different photoresist layers.
  • the second light-shielding layer 122 may be alternately arranged in different layers in the same layer, the second light-shielding layer 122 may be alternately arranged with strip-shaped photoresist layers of different colors, or may be strips of different colors.
  • the photoresist layers are staggered.
  • FIG. 3 is a partial enlarged view of an embodiment of the color filter substrate shown in FIG.
  • the second light shielding layer 122 is formed by alternately arranging a strip-shaped red photoresist layer 1221, a strip-shaped green photoresist layer 1222, and a strip-shaped blue photoresist layer 1223.
  • the second light-shielding layer can be reduced by alternately arranging the photoresist layers.
  • the conductivity of 122 makes the antistatic performance better.
  • the arrangement order of the photoresists is that, in a direction gradually away from the first light shielding layer 121, the strip photoresist layer is, in order, a red photoresist layer 1221, a green photoresist layer 1222, and a blue photoresist layer 1223.
  • the arrangement of the RGB can be abbreviated as RGB.
  • the strip photoresist layer can also be a red photoresist layer 1221, a blue photoresist layer 1223, and a green photoresist layer 1222.
  • the arrangement of the strip photoresist layers may also be an arrangement of GRB, GBR, BGR, and BRG.
  • the second light shielding layer 122 may be alternately arranged by two strip-shaped photoresist layers, and the arrangement thereof may be an arrangement of RG, RB, GR, GB, BR, and BG.
  • the second light shielding layer 122 may be formed by alternately arranging the strip-shaped red photoresist layer 1221, the green photoresist layer 1222, and the blue photoresist layer 1223.
  • FIG. 5 is a cross-sectional structure of another embodiment of the color filter substrate shown in FIG. 1 in the II-II′ direction. schematic diagram.
  • the second light shielding layer 122 may be formed by alternately superposing two different color photoresist layers.
  • the second light shielding layer 122 includes a red photoresist layer 1221 and a green photoresist layer 1222.
  • the green photoresist layer 1222 is disposed on the surface of the base layer 13.
  • the red photoresist layer 1221 is disposed on a side of the green photoresist layer 1222 opposite to the base layer 13.
  • the red photoresist layer 1221 and the green photoresist layer 1222 are stacked to have a thickness and a first light shielding layer 121. equal.
  • the color photoresist layer is selected from the red photoresist layer 1221 and the green photoresist layer 1222.
  • the color photoresist layer may be any other two different red, green, and blue photoresists.
  • the arrangement of the red photoresist layer 1221 and the green photoresist layer 1222 in the direction away from the surface of the base layer 13 may be an arrangement of RG, RB, GR, GB, BR or BG.
  • the second light shielding layer 122 may further include three different color photoresist layers, wherein the color photoresist layer comprises a red photoresist layer 1221, a green photoresist layer 1222, and a blue photoresist layer 1223 (not shown in the drawing).
  • the blue photoresist layer 1223 is superposed on the surface of the red photoresist layer 1221 facing away from the green photoresist layer 1222, the red photoresist layer 1221, the green photoresist layer 1222, and the third photoresist layer.
  • the thickness of the superposition is equal to the thickness of the first light shielding layer 121.
  • the arrangement of the red photoresist layer 1221, the green photoresist layer 1222 and the third photoresist layer may be an arrangement of RGB, RBG, GRB, GBR, BGR or BRG.
  • the second light shielding layer 122 is disposed on the periphery of the first light shielding layer 121 and surrounds the first light shielding layer 121.
  • a second BM layer may be added to the periphery of the second light shielding layer 122 to protect the second light shielding layer 122.
  • FIG. 6 is a schematic flow chart of a method for manufacturing a color filter substrate.
  • the manufacturing method includes providing a substrate, manufacturing a first light shielding layer on one side of the substrate, and fabricating a second light shielding layer on the same layer of the first light shielding layer.
  • the specific manufacturing method includes the following steps:
  • S601 Providing a base substrate, wherein the base substrate defines a display area and a non-display area, and the non-display area is located at a periphery of the display area.
  • the substrate may be a glass substrate, and the manufacturing of the glass substrate comprises:
  • the first light shielding layer having the first conductivity is disposed in the non-display area.
  • a first light shielding layer is fabricated on one side of the substrate by a reticle development process. The specific steps are as follows:
  • the reticle structure is adjusted such that the first light shielding layer is disposed at an edge position of the BM layer and formed together with the BM layer;
  • the substrate of the BM layer is then cleaned to obtain a substrate having a first light shielding layer.
  • the first light shielding layer may also be formed separately from the BM layer, and a material having a smaller conductivity than the BM layer may be selected when the first light shielding layer is formed, thereby improving the antistatic capability of the first light shielding layer, thereby improving The antistatic ability of the entire color film substrate.
  • a second light shielding layer having a second conductivity is disposed on the same layer of the first light shielding layer, the second light shielding layer is disposed on a periphery of the first light shielding layer and surrounding the first light shielding layer, wherein the second conductivity is smaller than the first Conductivity.
  • the substrate having the first light shielding layer is subjected to a secondary mask development process, and a second light shielding layer is formed on the periphery of the first light shielding layer.
  • the second light shielding layer is made of a material having a smaller conductivity than the first light shielding layer.
  • the material of the second light shielding layer may be selected from a photoresist material such as an RGB photoresist material.
  • the photoresist material of the second light shielding layer is a monochromatic photoresist
  • the monochromatic photoresist may be coated to the periphery of the first light shielding layer to form a second light shielding layer;
  • the second light-shielding layer required can be manufactured by using a plurality of mask development processes.
  • FIG. 7 is a schematic structural view of an embodiment of a display device according to the present invention
  • FIG. 8 is a schematic structural view of a cross-sectional view of the display device shown in FIG. 7 in the direction of VI-VI'.
  • the display device 70 includes a color filter substrate 71, an array substrate 72, a bezel 73, and a liquid crystal layer 74.
  • the liquid crystal layer 74 is disposed in the sealed space formed by the plastic frame 73, the color filter substrate 71, and the array substrate 72.
  • the color filter substrate 71 includes a display area 711 and a non-display area 712.
  • the non-display area 712 includes a first light shielding layer 7121 and a second light shielding layer 7122.
  • the second light shielding layer 7122 is a color photoresist layer, the conductivity of the second light shielding layer 7122 is smaller than the conductivity of the first light shielding layer 7121, and the structure of the second light shielding layer 7122 and the arrangement of the photoresist layer are as described above. This will not be repeated.
  • the second light shielding layer 7122 is disposed in a non-display area of the CF substrate.
  • a second light-shielding layer made of a color photoresist material to the non-display area of the CF substrate, external static electricity can be prevented from entering the display device through the color filter substrate, thereby improving the antistatic capability of the display device.
  • the same second light shielding layer may be added to the non-display area of the array substrate to increase the antistatic capability of the entire display device.
  • the present invention can improve the antistatic capability of the color filter substrate and the display device, thereby improving the performance of the display device.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optical Filters (AREA)

Abstract

一种彩膜基板(10,71)及制造方法、显示设备(70),涉及显示技术领域。彩膜基板(10,71)包括衬底基板(13),定义有显示区(11,711)及非显示区(12,712),非显示区(12,712)位于显示区(11,711)外围;第一遮光层(121,7121),设置于非显示区(12,712),且具有第一电导率;第二遮光层(122,7122),设置于非显示区(12,712)的远离显示区(11,711)的一侧,第二遮光层(122,7122)设置在第一遮光层(121,7121)的外围并将第一遮光层(121,7121)包围,第二遮光层(122,7122)具有第二电导率,其中,第二电导率小于第一电导率。解决现有的彩膜基板容易受静电影响,造成彩膜基板损坏的问题,从而提高彩膜基板的抗静电能力。

Description

一种彩膜基板及其制造方法、显示设备
【技术领域】
本发明涉及显示技术领域,特别是涉及一种彩膜基板及其制造方法、显示设备。
【背景技术】
现有的显示面板以及具有显示面板的显示装置在生产、制造以及运输的过程中常常会受到静电的影响,从而造成显示面板不能正常工作的问题,甚至当静电值达到一定程度时会损坏显示面板,导致显示面板无法发光。
【发明内容】
本发明主要解决的技术问题是提供一种彩膜基板及其制造方法、显示设备,能够提高显示面板的抗静电能力,从而解决显示面板容易受静电影响,从而无法正常工作的问题。
为解决上述技术问题,本发明采用的一个技术方案是:提供一种彩膜基板,包括:衬底基板,其定义有显示区及非显示区,非显示区位于显示区外围;第一遮光层,设置于非显示区,且具有第一电导率;第二遮光层,设置于非显示区的远离显示区的一侧,第二遮光层设置在第一遮光层的外围并将第一遮光层包围,述第二遮光层具有第二导电率,其中,第二电导率小于第一电导率。
为解决上述技术问题,本发明采用的另一种一个技术方案是:提供一种彩膜基板的制造方法,包括:提供一衬底基板,衬底基板定义有显示区及非显示区,非显示区位于显示区外围;在衬底基板一侧的非显示区制造具有第一导电率的第一遮光层;在第一遮光层同一层制造具有第二导电率的第二遮光层,第二遮光层设置在第一遮光层的外围并将第一遮光层包围,其中,第二电导率小于第一电导率。
为解决上述技术问题,本发明采用的又一个技术方案是:提供一种显示设备,显示设备包括彩膜基板,其中彩膜基板包括:衬底基板,其定义有显示区及非显示区,非显示区位于显示区外围;第一遮光层,设置于非显示区,且具有第一电导率;第二遮光层,设置于非显示区的远离显示区的一侧,第二遮光层设置在第一遮光层的外围并将第一遮光层包围,述第二遮光层具有第二导电率,其中,第二电导率小于第一电导率。
本发明的有益效果是:区别于现有技术的情况,本发明提出一种彩膜基板及其制造方法、显示设备。其中彩膜基板包括:衬底基板,其定义有显示区及非显示区,非显示区位于显示区外围;第一遮光层,设置于非显示区,且具有第一电导率;第二遮光层,设置于非显示区的远离显示区的一侧,第二遮光层设置在第一遮光层的外围并将第一遮光层包围,述第二遮光层具有第二导电率,其中,第二电导率小于第一电导率。因此,本发明通过在彩膜基板非显示区的第一遮光层的外侧添加导电率更小的第二遮光层,使静电更难通过非显示区,从而可以保护显示区的线路不受静电影响而受到损坏。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图:
图1是本发明一种彩膜基板一实施例的结构示意图;
图2是图1所示的彩膜基板一实施例在II-II’方向上的剖面的结构示意图;
图3是图1所示的彩膜基板一实施例在III位置的局部放大图;
图4是图1所示的彩膜基板另一实施例在III位置的局部放大图;
图5是图1所示的彩膜基板另一实施例在II-II’方向上的剖面的结构示意图;
图6是本发明一种彩膜基板制造方法的流程示意图;
图7是本发明一种显示设备一实施例的结构示意图;
图8是图7所示的显示设备实施例在VI-VI’方向上的剖面的结构示意图。
【具体实施方式】
为使本发明解决的技术问题、采用的技术方案和达到的技术效果更加清楚,下面将结合附图对本发明实施例的技术方案作进一步的详细描述。
参阅图1以及图2,图1是本发明一种彩膜基板的结构示意图,图2是图1所示的彩膜基板一实施例在II-II’方向上的剖面的结构示意图。其中彩膜基板10包括基层13,基层13设置有显示区11以及非显示区12,非显示区12设置在显示区11的外围,非显示区12上设置有第一遮光层121以及第二遮光层122。第一遮光层121包围显示区11,第二遮光层122设置在第一遮光层121的外围并包围第一遮光层121。其中,第一遮光层121具有第一导电率,第二遮光层122具有第二导电率,第二导电率小于第一导电率。
因此,本发明通过在彩膜基板10非显示区12的第一遮光层121的外侧添加导电率更小的第二遮光层122,使静电更难通过非显示区,从而可以保护彩膜基板10不受静电影响而受到损坏。
在本实施例中的彩膜基板10为液晶显示面板的CF(color filter,彩色滤光片)基板。其中,第一遮光层121以及第二遮光层122可以通过光罩显影工艺制备获得,其具体制造方法为:首先,提供一衬底基板,通过光罩显影工艺在衬底基板的一侧蚀刻出所需要的第一遮光层,然后再经过第二次光罩显影工艺蚀刻出第二遮光层,可以将第一遮光层121以及第二遮光层122设置在同一层来减少彩膜基板的厚度。具体制造步骤如后文所示,在此不做赘述。
其中,第一遮光层121可以采用彩膜基板10的BM(Black Matrix,黑色矩阵)层(图中未示出)所使用的材料进行制备,例如金属氧化膜、树脂材料等,BM层的作用包括将显示区分隔为一个一个的单独的像素。BM层通过光罩显影工艺在彩膜基板10上成形。其中第一遮光层121可以使用BM层相同的材料并与BM层同时成型。在制造BM层时,通过调整光罩就可以同时得到BM层以及第一遮光层121,这样可以使制作工艺简单,便于的生产。
在其他实施例中,还可以设置第一遮光层121的材料与BM层的材料不同。即根据需要对第一遮光层121的材料进行选取。
第二遮光层122可以采用彩色光阻进行制备,彩色光阻材料可以是红色(R)、绿色(G)以及蓝色(B)光阻中的至少一种。本实施例中,基层13一侧设置有显示区11以及非显示区12,非显示区12设置在显示区11的外围,非显示区12上设置有第一遮光层121以及第二遮光层122。第一遮光层121包围显示区11,第二遮光层122设置在第一遮光层121的外围并包围第一遮光层121。其中,第二遮光层122是单色光阻层,可以由红色(R)、绿色(G)以及蓝色(B)光阻中的任意一种光阻形成,第一遮光层121的导电率大于第二遮光层122。因此,在制造第二遮光层122时选用导电率小于第一遮光层121的光阻材料,可以屏蔽外界静电,防止外界静电损坏彩膜基板10。
在其他实施例中,第二遮光层122还可以由不同色的光阻层形成。其中,第二遮光层122可以由不同的色阻在同一层中交替排列而成,或者第二遮光层122也可以由不同的光阻层交替叠加形成。
对于第二遮光层122可以由不同的色阻在同一层中交替排列而成的情况,第二遮光层122可以采用不同色的带状光阻层交替排列而成,或者利用不同色的带状光阻层交错排列而成。
请参阅图3,图3是图1所示的彩膜基板一实施例在III处的局部放大图。其中,第二遮光层122由带状红色光阻层1221、带状绿色光阻层1222以及带状蓝色光阻层1223交替排列而成,通过将光阻层交替排列可以减小第二遮光层122的导电率,使抗静电性能更好。在本实施例中,光阻的排列顺序是,在逐渐远离第一遮光层121的方向上,带状光阻层依次是红色光阻层1221、绿色光阻层1222以及蓝色光阻层1223,其排列方式可以简称为RGB的排列方式;在其他实施例中,带状光阻层依次还可以是红色光阻层1221、蓝色光阻层1223以及绿色光阻层1222,简称RBG的排列方式。以此类推,带状光阻层的排列方式还可以是GRB、GBR、BGR以及BRG的排列方式。更进一步的,第二遮光层122还可以由两种带状光阻层交替排列而成,其排列方式可以是RG、RB、GR、GB、BR以及BG的排列方式。
更进一步的,参阅图4,第二遮光层122还可以由带状的红色光阻层1221、绿色光阻层1222以及蓝色光阻层1223交替排列拼接而成。
对于第二遮光层122由不同的光阻层交替叠加形成的情况,请参阅图5,其中图5是图1所示的彩膜基板另一实施例在II-II’方向上的剖面的结构示意图。本实施例中,第二遮光层122可由两种不同的彩色光阻层交替叠加形成。其中,第二遮光层122包括红色光阻层1221以及绿色光阻层1222。绿色光阻层1222设置在基层13的表面,红色光阻层1221设置在绿色光阻层1222背对基层13的一面,红色光阻层1221与绿色光阻层1222叠加厚度与第一遮光层121相等。本实施例中彩色光阻层选用的是红色光阻层1221以及绿色光阻层1222,在其他的实施例在彩色光阻层还可以是红色、绿色以及蓝色光阻中的其他任意不同的两种。在远离基层13的表面的方向上,红色光阻层1221与绿色光阻层1222的排列方式可以是RG、RB、GR、GB、BR或者BG的排列方式。更进一步的,第二遮光层122还可以包括三种不同的彩色光阻层,其中彩色光阻层由红色光阻层1221、绿色光阻层1222以及蓝色光阻层1223(图中未示出)交替叠加形成第二遮光层122,蓝色光阻层1223叠加设置在红色光阻层1221背对绿色光阻层1222的表面,红色光阻层1221、绿色光阻层1222以及第三光阻层叠加的厚度等于第一遮光层121的厚度。其中红色光阻层1221、绿色光阻层1222以及第三光阻层的排列方式可以是RGB、RBG、GRB、GBR、BGR或者BRG的排列方式。
在本实施例中,第二遮光层122设置在第一遮光层121的外围并将第一遮光层121包围。在其他的实施例中,还可以在第二遮光层122的外围添加一层BM层将第二遮光层122包围,用于保护第二遮光层122。
参阅图6,图6是一种彩膜基板制造方法的流程示意图。制造方法包括提供一基板、在基板一侧制造第一遮光层以及在第一遮光层同一层制造第二遮光层。具体制造方法包括如下步骤:
S601:提供一衬底基板,衬底基板定义有显示区及非显示区,非显示区位于显示区外围。
提供一衬底基板,衬底基板可以是玻璃基板,玻璃基板的制造包括:
a.将玻璃基板清洗除尘。
b.对清洗后的玻璃基板进行腐蚀,以得到比制造玻璃基板所需要的厚度大预设厚度的玻璃基板。
c.以及对腐蚀后的玻璃基板进行磨平处理使玻璃基板达到制造衬底基板所需的平滑度以及厚度。
S602:在非显示区设置具有第一导电率的第一遮光层。
通过光罩显影流程在基板的一侧制造第一遮光层。其具体步骤如下:
a.对基板进行清洗除尘;
b.在经过清洗后的基板一侧涂布一层用于制造BM层的色阻材料;
c.对涂布了色阻材料的基板进行离心处理,使色阻材料在基板上的厚度均匀;
d.对经过离心处理的基板进行光罩处理,然后在对基板上的色阻材料进行蚀刻得到基板的BM层;
其中,在光罩处理时,调整光罩结构,使第一遮光层设置在BM层的边缘位置与BM层一起成型;
e.然后清洗制备好BM层的基板,得到具有第一遮光层的基板。
可选地,第一遮光层也可以与BM层分开成型,在成型第一遮光层时可以选用具有比BM层更小的导电率的材料,可以提高第一遮光层的抗静电能力,进而提高整个彩膜基板的抗静电能力。
S603:在第一遮光层同一层设置具有第二导电率的第二遮光层,第二遮光层设置在第一遮光层的外围并将第一遮光层包围,其中,第二电导率小于第一电导率。
对具有第一遮光层的基板进行二次光罩显影流程处理,在第一遮光层的外围制造第二遮光层。
其中,第二遮光层选用导电率比第一遮光层小的材料。第二遮光层的材料可以选取光阻材料,例如RGB光阻材料。
可选地,当第二遮光层的光阻材料为单色光阻时,可采用涂布的方式将单色光阻涂布到第一遮光层的外围形成第二遮光层;当第二遮光层是由不同带状光阻层交替排列而成,或是不同色的带状光阻层交错排列而成时,可以通过采用多次光罩显影流程制造所需要的第二遮光层。
请参阅图7以及图8,图7是本发明一种显示设备一实施例的结构示意图,图8是图7所示的显示设备在VI-VI’方向上的剖面的结构示意图。显示设备70包括彩膜基板71、阵列基板72、胶框73以及液晶层74。其中液晶层74设置在胶框73、彩膜基板71以及阵列基板72形成的密封空间内。彩膜基板71包括显示区711以及非显示区712。非显示区712包括第一遮光层7121以及第二遮光层7122。其中第二遮光层7122为彩色光阻层,第二遮光层7122的导电率小于第一遮光层7121的导电率,第二遮光层7122的结构以及光阻层的排列方式具体请参阅前文,在此不做赘述。
第二遮光层7122设置在CF基板的非显示区。通过在CF基板的非显示区增加由彩色光阻材料制造的第二遮光层,可以防止外界静电通过彩膜基板进入显示设备,提高了显示设备的抗静电能力。进一步地,也可以在阵列基板的非显示区添加相同的第二遮光层,来增加整个显示设备的抗静电能力。
因此,本实施例通过在显示设备的边缘添加导电率小的第二遮光层,可以防止外界静电进入显示设备,提高了显示设备的抗静电能力,从而提高显示设备性能。
综上所述,本发明可以提高彩膜基板以及显示设备的的抗静电能力,从而提高了显示设备性能。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。

Claims (14)

  1. 一种彩膜基板,其中,包括:
    衬底基板,其定义有显示区及非显示区,所述非显示区位于所述显示区外围;
    第一遮光层,设置于所述非显示区,且具有第一电导率;
    第二遮光层,设置于所述非显示区的远离所述显示区的一侧,所述第二遮光层设置在所述第一遮光层的外围并将所述第一遮光层包围,具有第二导电率,其中所述第二电导率小于所述第一电导率。
  2. 根据权利要求1所述的彩膜基板,其中,
    所述第一遮光层是黑矩阵遮光层,所述第二遮光层是彩色光阻层。
  3. 根据权利要求2所述的彩膜基板,其中,
    所述第二遮光层是单色光阻层。
  4. 根据权利要求2所述的彩膜基板,其中,
    所述第二遮光层由不同色光阻层拼接而成。
  5. 根据权利要求4所述的彩膜基板,其中,
    所述不同色光阻层由不同色的带状光阻层交替排列而成,或者所述不同色光阻层由不同色的带状光阻层交错排列而成。
  6. 一种彩膜基板的制造方法,其中,包括:
    提供一衬底基板,所述衬底基板定义有显示区及非显示区,所述非显示区位于所述显示区外围;
    在所述非显示区设置具有第一导电率的第一遮光层;
    在所述第一遮光层同一层设置具有第二导电率的第二遮光层,所述第二遮光层设置在所述第一遮光层的外围并将所述第一遮光层包围,其中,所述第二电导率小于所述第一电导率。
  7. 根据权利要求6所述的制造方法,其中,
    所述第一遮光层是黑矩阵遮光层,所述第二遮光层是彩色光阻层。
  8. 根据权利要求7所述的制造方法,其中,
    所述第二遮光层是单色光阻层或者由不同色光阻层拼接而成。
  9. 根据权利要求8所述的制造方法,其中,
    所述不同色光阻层由不同色的带状光阻层交替排列而成,或者所述不同色光阻层由不同色的带状光阻层交错排列而成。
  10. 一种显示设备,所述显示设备包括彩膜基板,其中,所述彩膜基板包括:
    衬底基板,其定义有显示区及非显示区,所述非显示区位于所述显示区外围;
    第一遮光层,设置于所述非显示区,且具有第一电导率;
    第二遮光层,设置于所述非显示区的远离所述显示区的一侧,所述第二遮光层设置在所述第一遮光层的外围并将所述第一遮光层包围,具有第二导电率,其中所述第二电导率小于所述第一电导率。
  11. 根据权利要求10所述的显示设备,其中,
    所述第一遮光层是黑矩阵遮光层,所述第二遮光层是彩色光阻层。
  12. 根据权利要求11所述的显示设备,其中,
    所述第二遮光层是单色光阻层。
  13. 根据权利要求11所述的显示设备,其中,
    所述第二遮光层由不同色光阻层拼接而成。
  14. 根据权利要求13所述的显示设备,其中,
    所述不同色光阻层由不同色的带状光阻层交替排列而成,或者所述不同色光阻层由不同色的带状光阻层交错排列而成。
PCT/CN2017/107173 2017-09-26 2017-10-21 一种彩膜基板及其制造方法、显示设备 WO2019061602A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN108665799A (zh) * 2018-05-11 2018-10-16 维沃移动通信有限公司 一种电子设备及电子设备的显示模组
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080070317A (ko) * 2007-01-26 2008-07-30 삼성전자주식회사 액정 표시 장치
CN103926739A (zh) * 2013-12-31 2014-07-16 上海天马微电子有限公司 显示面板及显示装置
CN104375320A (zh) * 2014-12-04 2015-02-25 合肥鑫晟光电科技有限公司 一种显示基板及其制备方法、显示面板及显示装置
CN104656293A (zh) * 2015-03-18 2015-05-27 合肥京东方光电科技有限公司 液晶显示面板及其制作方法、显示装置
CN105807482A (zh) * 2016-05-26 2016-07-27 京东方科技集团股份有限公司 一种彩膜基板及显示装置
CN106647014A (zh) * 2017-03-23 2017-05-10 京东方科技集团股份有限公司 彩膜基板及其制备方法、显示面板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8077275B2 (en) * 2008-05-09 2011-12-13 Samsung Electronics Co., Ltd. Display substrate and a method of manufacturing the same
US9618690B2 (en) * 2015-07-10 2017-04-11 Shenzhen China Star Optoelectronics Technology Co., Ltd Liquid crystal display device
JP2017090771A (ja) * 2015-11-13 2017-05-25 株式会社ジャパンディスプレイ 液晶表示装置
CN107463024B (zh) * 2017-09-25 2020-12-22 京东方科技集团股份有限公司 显示基板及其制造方法、显示面板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080070317A (ko) * 2007-01-26 2008-07-30 삼성전자주식회사 액정 표시 장치
CN103926739A (zh) * 2013-12-31 2014-07-16 上海天马微电子有限公司 显示面板及显示装置
CN104375320A (zh) * 2014-12-04 2015-02-25 合肥鑫晟光电科技有限公司 一种显示基板及其制备方法、显示面板及显示装置
CN104656293A (zh) * 2015-03-18 2015-05-27 合肥京东方光电科技有限公司 液晶显示面板及其制作方法、显示装置
CN105807482A (zh) * 2016-05-26 2016-07-27 京东方科技集团股份有限公司 一种彩膜基板及显示装置
CN106647014A (zh) * 2017-03-23 2017-05-10 京东方科技集团股份有限公司 彩膜基板及其制备方法、显示面板

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