WO2019059047A1 - Dispositif électroluminescent, dispositif d'éclairage et procédé de fabrication de dispositif électroluminescent - Google Patents

Dispositif électroluminescent, dispositif d'éclairage et procédé de fabrication de dispositif électroluminescent Download PDF

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Publication number
WO2019059047A1
WO2019059047A1 PCT/JP2018/033638 JP2018033638W WO2019059047A1 WO 2019059047 A1 WO2019059047 A1 WO 2019059047A1 JP 2018033638 W JP2018033638 W JP 2018033638W WO 2019059047 A1 WO2019059047 A1 WO 2019059047A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
sealing material
mounting substrate
housing recess
Prior art date
Application number
PCT/JP2018/033638
Other languages
English (en)
Japanese (ja)
Inventor
匠史郎 杉尾
祐司 小田
健太郎 大橋
Original Assignee
岩崎電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 岩崎電気株式会社 filed Critical 岩崎電気株式会社
Priority to JP2019543572A priority Critical patent/JPWO2019059047A1/ja
Publication of WO2019059047A1 publication Critical patent/WO2019059047A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a light emitting device, a lighting device, and a method of manufacturing the light emitting device.
  • a light emitting device in which a substrate on which a light emitting element is mounted is housed in a package having an open top surface (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3). Further, in Patent Document 3, the inside of the package is sealed with a sealing material, and a notch is provided on the inner wall of the package along the top opening, and a light transmitting plate such as a glass plate is fitted and fixed in the notch. A technique for sealing the inside of the package along the side of the light transmission plate is shown.
  • An object of the present invention is to provide a light emitting device, a lighting device, and a method of manufacturing the light emitting device capable of suppressing damage to a sealing material.
  • the present invention includes a mounting substrate on which a light emitting element is mounted, and a case provided with a housing recess for housing the mounting substrate, and the light emitting device in which the mounting substrate is disposed on the bottom surface of the housing recess. And a translucent protective member provided on the surface of the sealing material, the protective member being filled with the concave portion and sealing the mounting substrate; A gap is provided between the housing recess and the housing recess, and the gap is filled with a flexible adhesive, and the protective member is coupled to the housing recess by the adhesive.
  • the present invention is characterized in that, in the light emitting device, the gap is provided between the accommodation recess and the entire circumference of the protective member.
  • the present invention is characterized in that, in the light emitting device, the protective member is bonded to the surface of the sealing material without a gap.
  • the present invention is characterized in that, in the light emitting device, a positioning member which determines the position of the protective member is provided in the housing recess.
  • the present invention is characterized in that, in the above-mentioned light emitting device, a phosphor layer which emits light by receiving light from the light emitting element is provided between the light emitting element and the protective member.
  • the present invention is characterized in that, in the light emitting device, a wiring hole through which an electric wiring electrically connected to the mounting substrate passes through the bottom surface of the housing recess, and the mounting substrate closes the wiring hole. I assume.
  • the light emitting device according to the present invention is provided with a plug fitting which is hooked on the mounting surface of the mounting board and electrically connected to the mounting surface by soldering. It is characterized by
  • the present invention is characterized in that, in the above-mentioned light emitting device, the light emitting element is a surface mounted type or chip on board type LED.
  • the present invention provides a lighting device comprising the light emitting device described in any of the above to a light source.
  • the present invention comprises a mounting substrate on which a light emitting element is mounted, and a case provided with a housing recess for housing the mounting substrate, and a method of manufacturing a light emitting device in which the mounting substrate is disposed on the bottom of the housing recess. Placing the mounting substrate in the receiving recess of the case, filling the receiving recess with a light-transmissive sealing material, and curing the sealing material; An adhesive having flexibility in the gap between the protection member and the accommodation recess, and a step of providing the protection member on the surface of the sealing material in a state where the clearance is opened between the protection member and the accommodation recess And bonding the protective member to the receiving recess with the adhesive.
  • the sealing material and the protective member expand and contract due to heat, the adhesive of the gap between the protective member and the housing recess Relieved by As a result, the protective member is peeled off from the sealing material to suppress the occurrence of damage such as cracks generated in the sealing material.
  • the protective member occupies most of the accommodation recess, the air tightness can be greatly improved, and the deterioration of the light emitting element due to the open air can be prevented.
  • FIG. 1 is a perspective view showing the configuration of a light emitting device according to an embodiment of the present invention.
  • 2A to 2C are a plan view
  • FIG. 2B is a front view
  • FIG. 2C is a rear view
  • FIG. 2D is a side view.
  • FIG. 3 is a view schematically showing the III-III cross section of FIG. 2 (A).
  • FIG. 4 is an exploded perspective view of the light emitting device.
  • FIG. 5 is a plan view showing the configuration of the circuit board.
  • FIG. 6 is a perspective view showing the configuration of the insertion fitting.
  • FIG. 7 is a view showing the manufacturing process of the light emitting device.
  • FIG. 8 is a perspective view showing the construction of the explosion-proof lighting device.
  • FIG. 1 is a perspective view showing the configuration of a light emitting device 1 according to the present embodiment.
  • 2A to 2C are a plan view
  • FIG. 2B is a front view
  • FIG. 2C is a rear view
  • FIG. 2D is a side view. It is.
  • the light emitting device 1 is a device used as a light source of various lighting devices, and includes a case 2 and a protective cover 4 as shown in FIGS. 1 and 2.
  • the light emitting device 1 according to the present embodiment is configured as an apparatus having an explosion-proof structure, and can be used in various plants and warehouses where a combustible gas can be generated.
  • the case 2 is a container body in which a substantially rectangular housing recess 20 (FIG. 3) for emitting light is formed on the case upper surface 2A of a thin rectangular parallelepiped member, and has excellent strength, corrosion resistance, and thermal conductivity. It is formed by casting using a material (for example, an aluminum alloy) as a material.
  • the case 2 is subjected to surface treatment such as alumite treatment in order to enhance corrosion resistance.
  • the open end of the accommodation recess 20 constitutes the emission opening 6 of the light emitting device 1, and the irradiation light is emitted from the emission opening 6.
  • a plurality of (four in the illustrated example) fixing pieces 8 protruding laterally are integrally provided. Screw holes 10 are formed in the front and back surfaces of the case 2 in each of the fixing pieces 8. A fixing screw is passed through each of the screw holes 10 to fix the light emitting device 1 to a lighting device or the like.
  • each of the wiring holes 13 is airtightly sealed without a gap by being filled with the filler 16.
  • a material having insulation properties is preferably used, and in the present embodiment, an epoxy resin is used.
  • the protective cover 4 is a member which is translucent and is formed of a hard material (for example, a glass material or the like) suitable for protection against physical contact, and has a rectangular plate shape and is accommodated
  • the recess 20 is disposed substantially flush with the case upper surface 2A.
  • the protective cover 4 is formed in a substantially similar shape whose size is slightly smaller than the planar view shape of the open end of the housing recess 20, and the gap ⁇ with the housing recess 20 over the entire circumference of the protective cover 4. It is placed open.
  • a flexible adhesive 12 is filled in a gap ⁇ between the edge 4A of the protective cover 4 and the accommodation recess 20, and the adhesive 12 is hermetically sealed by the adhesive 12, and the adhesive 12 and the later-described
  • the protective cover 4 is irremovably coupled to the case 2 by the sealing material 50.
  • FIG. 3 is a view schematically showing a configuration of the III-III cross section of FIG. 2 (A).
  • FIG. 4 is an exploded perspective view of the light emitting device 1.
  • a housing recess 20 is provided on the case upper surface 2 ⁇ / b> A of the case 2.
  • the housing recess 20 has a columnar concave shape from the case upper surface 2A toward the case back surface 2B, and the inner side surface 20A of the housing recess 20 is provided substantially perpendicularly to the case upper surface 2A and the case back surface 2B.
  • the emission opening 6 which is the opening end of the housing recess 20 and the bottom surface 24 have substantially the same size and shape.
  • An LED mounting substrate 22 which is a light source of the light emitting device 1 is fixed to the bottom surface 24.
  • the LED mounting substrate 22 includes a substrate 22A having a rectangular shape in plan view and made of a ceramic excellent in electrical insulation and thermal conductivity, and a circuit substrate 22B provided on the surface of the substrate 22A.
  • a large number of LEDs 28 and electronic circuit parts such as fuses and varistors are mounted on the The back surface of the LED mounting substrate 22 is thermally coupled to the bottom surface 24 of the housing recess 20, and the heat of the LED 28 is transmitted from the LED mounting substrate 22 to the case 2 and dissipated.
  • the inside of the housing recess 20 is sealed by a sealing material 50 filled without a gap to a predetermined depth D, and the mounting material of the LED mounting substrate 22 (the sealing material 50) LED 28 etc) is protected.
  • a sealing material 50 a light transmitting property to efficiently transmit the light of the LED 28 is used, and a material which is cured by heating is used, and in the present embodiment, a silicone resin is used.
  • the surface 50A of the sealing material 50 is substantially flat, and the protective cover 4 is adhered to the surface 50A.
  • the depth D of the sealing material 50 is adjusted so that the surface 4S1 of the protective cover 4 is substantially flush with the exit opening 6 of the case upper surface 2A.
  • a phosphor layer 52 is provided in the housing recess 20.
  • the phosphor layer 52 is a layered member made of a phosphor that emits fluorescence upon receiving the light of the LED 28.
  • the phosphor layer 52 is formed on the back surface 4S2 of the protective cover 4 in a thin film form over the range located immediately above the LED 28.
  • the protective cover 4 is disposed with a gap ⁇ between the housing recess and the housing recess 20 of the case 2 along the entire circumference.
  • the inner side surface 20A of the housing recess 20 is provided with a plurality of protrusions 54 projecting inward, and these protrusions 54 engage with the edge 4A of the protective cover 4.
  • the protective cover 4 is positioned. By this positioning, a gap ⁇ is generated around the entire circumference of the protective cover 4 and the protective cover 4 is disposed such that the phosphor layer 52 is positioned directly above the LED 28 of the LED mounting substrate 22.
  • the adhesive 12 is filled in the gap ⁇ of the entire periphery of the protective cover 4, and the protective cover 4 is non-dropably coupled to the housing recess 20 of the case 2 by the adhesive 12 and the sealing material 50.
  • Ru a material having flexibility in the cured state is used as the adhesive 12, and in the present embodiment, a silicone sealant is used. And the damage to the sealing material 50 is suppressed by the adhesive 12 having flexibility, which will be described later.
  • FIG. 5 is a plan view showing the configuration of the circuit board 22B.
  • a wiring pattern 26 constituting a predetermined electric circuit is formed, and to this wiring pattern 26, electronic circuit parts such as a large number of LEDs 28 are connected.
  • the LED 28 is a bare chip type light emitting element and emits light of a predetermined color (in the present embodiment, blue).
  • the LEDs 28 are arranged on the circuit board 22B in the form of a lattice at predetermined intervals. In this arrangement, seven LEDs 28 arranged in series constitute one series circuit 30A, and eleven series circuits 30A arranged in parallel constitute one parallel circuit 30B.
  • the wiring pattern 26 is provided with a pair of wiring connection lands 32 across the parallel circuit 30B.
  • the wiring connection land 32 is a conductive portion to which the electrical wiring 14 is connected.
  • the wiring connection land 32 is formed of a through hole 34A formed through the LED mounting substrate 22 and a conductive portion 34B such as copper foil provided around the through hole 34A.
  • the through holes 34 ⁇ / b> A of the wiring connection land 32 are provided at positions corresponding to the wiring holes 13 of the case 2.
  • the electrical wiring 14 inserted from the case back surface 2B into the wiring hole 13 has its tip 14A passing through the through hole 34A of the wiring connection land 32 and reaches the surface of the circuit board 22B, and the conductive portion 34B of the wiring connection land 32. Are connected electrically by soldering.
  • FIG. 6 is a perspective view showing the configuration of the insertion fitting 36.
  • the electrical wiring 14 and the wiring connection land 32 are electrically connected using the insertion fitting 36. More specifically, the front end portion 14A of the electrical wiring 14 has the insulating film covering the surface removed, and the lead wire 40 serving as the core is exposed over a length of about 5 mm.
  • the fitting 36 is attached to the wire member 40.
  • the insertion fitting 36 is a conductive fitting that is inserted into the through hole 34A from the back surface side of the LED mounting substrate 22, reaches the surface of the circuit substrate 22B, and is caught on the wiring connection land 32.
  • the insertion fitting 36 has a wire rod holding portion 42 and a land engaging portion 44.
  • the wire holding portion 42 is a member that extends along the wire member 40 and sandwiches and holds the wire member 40 between the plurality of claws 42A, and is inserted into the through hole 34A from the back surface side of the LED mounting substrate 22.
  • the land engaging portion 44 has a barb 44A provided at the tip of the wire rod holding portion 42, and the barb 44A engages with the mounting surface of the circuit board 22B to engage with the conductive portion 34B of the wiring connection land 32.
  • the barb 44A has a shape bent in a J-shape and is pulled out from the through hole 34A to the surface side of the circuit board 22B and engaged with the surface so as not to be pulled out, and soldered to the conductive portion 34B of the wiring connection land 32 Electrically connected.
  • the insertion fitting 36 By mounting the insertion fitting 36 on the end portion 14A of the electrical wiring 14, when the light emitting device 1 is manufactured, the insertion fitting 36 is inserted from the back surface side of the LED mounting substrate 22 and the wiring connection land of the mounting surface of the circuit substrate 22B 32 can be easily engaged.
  • the tip portion 14 A that is, the wire member 40 of the electrical wiring 14 and the wire rod holding portion 42 are insulated by the filler 16.
  • the LED mounting substrate 22 is also insulated by being sealed by the sealing material 50, and a so-called charging unit is not provided via a space.
  • FIG. 7 is a view showing the manufacturing process of the light emitting device 1.
  • the light emitting device 1 having the above configuration is manufactured in the procedure shown in the figure.
  • the LED 28 is mounted on the mounting surface of the circuit board 22B provided on the surface of the substrate 22A, and the LED mounting board 22 is manufactured (step S1).
  • a die bond or a wire bond can be suitably used for mounting the LED 28.
  • the LED mounting substrate 22 is fixed to the bottom surface 24 of the housing recess 20 of the case 2 using the heat conductive adhesive 60 (step S2).
  • the heat conductive adhesive 60 is an adhesive which is excellent in thermal conductivity and fixed by heating, and for example, a high thermal conductive silicone adhesive is suitably used.
  • the LED mounting substrate 22 is fixed to the bottom surface 24, whereby the wiring holes 13 in the case back surface 2B are closed by the LED mounting substrate 22.
  • the insertion fitting 36 is attached to the end portion 14A of the electrical wiring 14, and the insertion fitting 36 is passed from the case back surface 2B to the wiring hole 13 and inserted from the back surface side of the LED mounting substrate 22. Then, the plug fitting 36 is engaged with the circuit board 22B, and the plug fitting 36 is soldered to the circuit board 22B (step S3). Thereafter, the wiring holes 13 are filled with the filler 16, and the filler 16 is hardened to hermetically seal (Step S4). For the filler 16, an epoxy resin which is cured by heating is used.
  • the sealing member 50 is filled in the housing recess 20 of the case 2, the sealing material 50 is cured, and the LED mounting substrate 22 is sealed (step S5).
  • the sealing material 50 a silicone resin which is cured by heating is used.
  • the surface of the sealing material 50 after curing is provided such that a gap ⁇ is provided between the entire periphery of the protective cover 4 in which the phosphor layer 52 is provided on the back surface 4S2 of the protective cover 4 and the accommodation recess 20.
  • the protective cover 4 is provided on the surface 50A of the sealing material 50 by adhering the back surface 4S2 of the protective cover 4 to the surface 50A in close contact with no gap while arranging the cover 50A (step S6). Specifically, after thinly applying the uncured sealing material 50 on the entire surface 50A of the sealing material 50, the protective cover 4 is overlaid on the sealing material 50, and then the protective cover 4 is heated. Is adhered to the sealing material 50.
  • the sealing material 50 When the protective cover 4 is stacked on the sealing material 50, the sealing material 50 is stacked so that no air bubbles are generated at the interface between the two, and the excess sealing material 50 is formed in the gap ⁇ between the entire periphery of the protective cover 4 and the accommodation recess 20. By escaping, the loss of light due to air bubbles is suppressed.
  • step S7 the adhesive 12 is filled in the gap ⁇ around the entire periphery of the protective cover 4 and the adhesive 12 is cured, so that the protective cover 4 is irremovably coupled to the housing recess 20 (step S7).
  • step S5 is performed before the wiring holes 13 are closed with the filler 16 in step S4. Then, the sealing material 50 may be filled in the housing recess 20.
  • the LED mounting substrate 22 is sealed in the sealing material 50, and the heat generation of the LED mounting substrate 22 is directly transmitted to the sealing material 50.
  • the sealing material 50 is thermally expanded due to the heat at the time of manufacturing the light emitting device 1 (in particular, FIG. 7, step S6) and the heat generation of the LED 28 at the time of lighting.
  • most of the housing recess 20 is filled with the sealing material 50 with almost no gap, and there is no space inside the housing recess 20 for receiving deformation due to expansion and contraction of the sealing material 50. For this reason, when the sealing material 50 is expanded, a swelling deformation occurs on the surface 50A of the sealing material 50.
  • the force at the time of expansion and contraction of the sealing material 50 is the sealing material 50 itself.
  • the sealing material 50 may be damaged.
  • the protective cover 4 when the protective cover 4 is fixed to the surface 50A of the sealing material 50, the protective cover 4 can not move, so the surface 50A of the sealing material 50 is deformed when the sealing material 50 contracts. It may also peel off, which may cause cracks in the sealing material 50.
  • Such damage to the sealing material 50 causes non-lighting due to disconnection of the wiring of the LED 28 and loss of light, leading to a decrease in efficiency.
  • a large number of LEDs 28 are provided on the circuit board 22B, and furthermore, since these are arranged at relatively narrow intervals, heat generation per unit area also increases.
  • the horizontal width La of the circuit board 22B shown in FIG. 5 is about 65 mm
  • the vertical width Lb is about 25 mm.
  • the planar size of the LED 28 is about 1.0 mm ⁇ 1.5 mm
  • the series circuit 30A the LEDs 28 are disposed at an arrangement interval A1 of about 3 mm
  • the series circuit 30A is disposed in parallel at an arrangement interval A2 of about 4 mm It is done.
  • the protective cover 4 is coupled to the housing recess 20 of the case 2 using the adhesive 12 which is a material having flexibility in the cured state in addition to the adhesive property. It is done. As a result, the protective cover 4 moves in conjunction with the expansion and contraction of the sealing material 50 due to heat, and the flexibility of the adhesive 12 allows the protective cover 4 to maintain the connection with the housing recess 20. As a result, the force applied to the sealing material 50 itself along with the expansion and contraction of the sealing material 50 is alleviated, and the protective cover 4 does not peel off from the sealing material 50. Occurrence of damage such as cracks in the
  • the gap ⁇ between the edge 4A of the protective cover 4 and the housing recess 20 is provided over the entire periphery of the protective cover 4, whereby the freedom of the protective cover 4 in the movement direction is increased.
  • the protective cover 4 moves in the direction in which the force is relaxed, and damage to the sealing material 50. Can be prevented more reliably.
  • FIG. 8 is a perspective view showing a configuration of the explosion-proof lighting device 70 according to the present embodiment.
  • the explosion-proof lighting device 70 is a lighting device configured as an explosion-proof structure, and as shown in FIG. 8, includes the light emitting device 1 described above and a base body 72.
  • the base body 72 is a container body for connecting the light emitting device 1 and a power line for supplying commercial power, and is molded by casting.
  • the base body 72 includes a substantially rectangular main body 74 and a pair of cable glands 76 provided on the side surface of the main body 74, and the light emitting device 1 brings the case back 2B into close contact with the upper surface of the main body 74. In the state, it is screwed and fixed.
  • a hole is formed in the upper surface of the main body 74, and the electrical wiring 14 connected to the light emitting device 1 is drawn into the inside of the main body 74 through the hole.
  • the cable gland 76 is a member for drawing the power line into the inside of the main body 74.
  • the power line drawn into the main body 74 from the cable ground 76 is connected to the electrical wiring 14 of the light emitting device 1 inside the main body 74, and power is supplied to the light emitting device 1.
  • the explosion proof lighting device can be configured simply by fixing it to the surface of the base body 72 like this explosion proof lighting device 70.
  • the entire circumference of the edge portion 4A of the protective cover 4 is flexible so as to cover the adhesive 12 filled in the gap ⁇ of the light emitting device 1 from above.
  • the adhesive 12 is not deteriorated by gas corrosion or the like depending on the use atmosphere, and the airtightness of the gap ⁇ can be maintained.
  • the protective cover 4 is disposed with a gap ⁇ between it and the housing recess 20, and the gap ⁇ is filled with the adhesive 12 having flexibility, and the adhesive 12 A protective cover 4 is coupled to the receiving recess 20.
  • the protective cover 4 maintains the connection with the housing recess 20 according to the forces of expansion and contraction. As it moves as it is and the force applied to the sealing material 50 itself is also relaxed, the occurrence of damage such as a crack in the sealing material 50 can be suppressed.
  • the sealing material 50 can move in the direction in which the force is relieved.
  • the protective cover 4 is adhered to the surface 50A of the sealing material 50 without a gap, the loss of light due to the gap is suppressed and the efficiency is enhanced. Further, as described above, even when the sealing material 50 is contracted, the protective cover 4 is moved according to the force generated by the contraction, so the protective cover 4 does not peel off from the sealing material 50, and the sealing is performed. It is possible to suppress the occurrence of damage such as a crack between the stopper 50 and the protective cover 4.
  • the protective cover 4 is formed such that the gap ⁇ is generated around the entire edge 4A of the protective cover 4 4 is accurate and easily placed.
  • the light emitting device 1 of the present embodiment includes a phosphor layer 52 that emits light by receiving light from the LED 28 between the LED 28 and the protective cover 4.
  • the protective cover 4 can be accurately disposed so that the phosphor layer 52 is positioned directly above the LED 28 of the LED mounting substrate 22.
  • the wiring hole 13 through which the electric wiring 14 electrically connected to the LED mounting substrate 22 passes through the bottom surface 24 of the housing recess 20, and the wiring hole 13 is closed by the LED mounting substrate 22.
  • the airtightness of the accommodation recess 20 is enhanced.
  • the degree of freedom in the manufacturing process is enhanced.
  • the tip portion 14A of the electrical wiring 14 is inserted from the back side of the LED mounting board 22, and is caught on the surface of the circuit board 22B which is the mounting side of the LED mounting board 22 A plug fitting 36 is provided which engages in a non-extractable manner.
  • the circuit board 22B can be engaged with the circuit board 22B in a non-extractable manner only by inserting the insertion fitting 36 into the wiring hole 13. This facilitates manufacturing.
  • the protective cover 4 is formed in a substantially similar shape having a size slightly smaller than the planar shape of the emission opening 6, so that the gap between the entire periphery of the protective cover 4 and the emission opening 6 It was made to provide ⁇ .
  • the shape of the protective cover 4 is arbitrary as long as the gap ⁇ is provided on the entire periphery of the protective cover 4.
  • the gap ⁇ is provided on the entire periphery of the edge 4A of the protective cover 4, but the present invention is not limited to this. That is, if the protective cover 4 moves in response to the expansion and contraction of the sealing material 50 due to heat, and the occurrence of damage in the sealing material 50 can be suppressed, a part of the protective cover 4 is accommodated in the housing recess 20 of the case 2 It may be connected.
  • the phosphor layer 52 is provided on the back surface 4S2 of the protective cover 4, but the phosphor layer 52 is any part between the LED 28 and the protective cover 4 as long as it covers the LED 28. It can be provided in position.
  • the phosphor layer 52 can be provided on the sealing material 50 as follows. That is, after filling the sealing material 50 in the housing recess 20 in step S5 of FIG. 7, before curing the sealing material 50, the material that is the source of the phosphor layer 52 is introduced into the sealing material 50, It is diffused or precipitated in the form of a film in the sealing material 50, and in this state, the sealing material 50 is cured.
  • the phosphor layer 52 can be formed in combination with the sealing by the sealing material 50, and the manufacturing process can be rationalized.
  • the surface of the protective cover 4 may be provided with a lens unit which is an example of an optical member for controlling light distribution.
  • a cylindrical lens can be used suitably, for example.
  • the lens portion can be positioned or shaped corresponding to the mounting position or arrangement of the LEDs 28.
  • the lens unit may include a plurality of cylindrical lenses extending along the straight line.
  • an SMD type (surface mount type) LED may be used as the LED 28.
  • an LED chip is mounted in a cavity, and the inside of the cavity is sealed with a resin in which phosphors are dispersed.
  • the phosphor layer 52 may not be provided in the light emitting device 1.
  • a COB type (chip on board type) LED provided on the mounting surface of the circuit board 22B may be used.
  • the bottom surface 24 of the housing recess 20 may be provided with a heat radiating member for radiating heat generated by the heat-generating component such as the LED 28.
  • a heat radiating member for radiating heat generated by the heat-generating component such as the LED 28.
  • a cooling fin, a refrigerant pipe in which a refrigerant flows, or the like can be used as the heat dissipation member.
  • the LED 28 is illustrated as the light emitting element in the embodiment described above, the present invention is not limited to this, and another element such as a semiconductor laser element can be used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'objectif de la présente invention est d'éviter d'endommager un matériau d'étanchéité. Un dispositif électroluminescent 1 comporte : un substrat de montage de LED 22 sur lequel des LED 28 sont montées ; et un boîtier 2 qui est pourvu d'un évidement de boîtier 20 pour loger le substrat de montage de LED 22, le substrat de montage de LED 22 étant disposé sur la surface inférieure 24 de l'évidement de boîtier 20. Ce dispositif électroluminescent 1 est pourvu de : un matériau d'étanchéité translucide 50 qui remplit l'évidement de boîtier 20 et scelle le substrat de montage de LED 22 ; et un couvercle de protection translucide 4 qui est disposé sur la surface 50A de l'élément d'étanchéité 50. Le couvercle de protection 4 est disposé de sorte qu'un espacement δ soit formé entre le couvercle de protection 4 et l'évidement de boîtier 20. L'espacement δ est rempli d'un adhésif flexible 12, et le couvercle de protection 4 et l'évidement de boîtier 20 sont mutuellement collés par l'adhésif 12.
PCT/JP2018/033638 2017-09-20 2018-09-11 Dispositif électroluminescent, dispositif d'éclairage et procédé de fabrication de dispositif électroluminescent WO2019059047A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019543572A JPWO2019059047A1 (ja) 2017-09-20 2018-09-11 発光装置、照明装置、及び発光装置の製造方法

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JP2017180453 2017-09-20
JP2017-180453 2017-09-20

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WO2019059047A1 true WO2019059047A1 (fr) 2019-03-28

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PCT/JP2018/033638 WO2019059047A1 (fr) 2017-09-20 2018-09-11 Dispositif électroluminescent, dispositif d'éclairage et procédé de fabrication de dispositif électroluminescent

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022061831A (ja) * 2020-10-07 2022-04-19 伊東電機株式会社 発光素子モジュール、防爆照明器具、及び発光素子モジュールの製造方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103841U (ja) * 1983-12-19 1985-07-15 ソニー株式会社 電子部品装置
JPH01162387U (fr) * 1988-04-28 1989-11-13
JP2000349348A (ja) * 1999-03-31 2000-12-15 Toyoda Gosei Co Ltd 短波長ｌｅｄランプユニット
JP2004140185A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
JP2011134785A (ja) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 発光装置
JP2013134834A (ja) * 2011-12-26 2013-07-08 Kyocera Corp 照明装置
JP2014060218A (ja) * 2012-09-14 2014-04-03 Nichia Chem Ind Ltd 発光装置
JP2015018873A (ja) * 2013-07-09 2015-01-29 日機装株式会社 半導体モジュール
US20160111606A1 (en) * 2012-03-05 2016-04-21 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
US20160126426A1 (en) * 2013-05-23 2016-05-05 Lg Innotek Co., Ltd. Light emitting module
JP2016103636A (ja) * 2014-11-28 2016-06-02 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2016119477A (ja) * 2014-12-23 2016-06-30 エルジー イノテック カンパニー リミテッド 発光素子及び照明システム
JP2017049092A (ja) * 2015-09-01 2017-03-09 日亜化学工業株式会社 光照射器及びその光照射方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5192666B2 (ja) * 2006-03-28 2013-05-08 パナソニック株式会社 発光装置
JP2012174620A (ja) * 2011-02-24 2012-09-10 Kyocera Corp 照明装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103841U (ja) * 1983-12-19 1985-07-15 ソニー株式会社 電子部品装置
JPH01162387U (fr) * 1988-04-28 1989-11-13
JP2000349348A (ja) * 1999-03-31 2000-12-15 Toyoda Gosei Co Ltd 短波長ｌｅｄランプユニット
JP2004140185A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
JP2011134785A (ja) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 発光装置
JP2013134834A (ja) * 2011-12-26 2013-07-08 Kyocera Corp 照明装置
US20160111606A1 (en) * 2012-03-05 2016-04-21 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
JP2014060218A (ja) * 2012-09-14 2014-04-03 Nichia Chem Ind Ltd 発光装置
US20160126426A1 (en) * 2013-05-23 2016-05-05 Lg Innotek Co., Ltd. Light emitting module
JP2015018873A (ja) * 2013-07-09 2015-01-29 日機装株式会社 半導体モジュール
JP2016103636A (ja) * 2014-11-28 2016-06-02 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
JP2016119477A (ja) * 2014-12-23 2016-06-30 エルジー イノテック カンパニー リミテッド 発光素子及び照明システム
JP2017049092A (ja) * 2015-09-01 2017-03-09 日亜化学工業株式会社 光照射器及びその光照射方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022061831A (ja) * 2020-10-07 2022-04-19 伊東電機株式会社 発光素子モジュール、防爆照明器具、及び発光素子モジュールの製造方法
JP7502141B2 (ja) 2020-10-07 2024-06-18 伊東電機株式会社 発光素子モジュール、防爆照明器具、及び発光素子モジュールの製造方法

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