WO2019058522A1 - Dispositif d'usinage au laser - Google Patents

Dispositif d'usinage au laser Download PDF

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Publication number
WO2019058522A1
WO2019058522A1 PCT/JP2017/034344 JP2017034344W WO2019058522A1 WO 2019058522 A1 WO2019058522 A1 WO 2019058522A1 JP 2017034344 W JP2017034344 W JP 2017034344W WO 2019058522 A1 WO2019058522 A1 WO 2019058522A1
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WO
WIPO (PCT)
Prior art keywords
signal
offset voltage
integration
laser
processing apparatus
Prior art date
Application number
PCT/JP2017/034344
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English (en)
Japanese (ja)
Inventor
和之 伊藤
篤 池見
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2018511289A priority Critical patent/JP6370517B1/ja
Priority to PCT/JP2017/034344 priority patent/WO2019058522A1/fr
Priority to CN201780079854.5A priority patent/CN110099768B/zh
Priority to KR1020197017125A priority patent/KR102084558B1/ko
Priority to TW107112747A priority patent/TWI658891B/zh
Publication of WO2019058522A1 publication Critical patent/WO2019058522A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam

Definitions

  • the present invention relates to a laser processing apparatus for processing a workpiece by irradiation of pulsed laser light.
  • the laser processing apparatus may cause deterioration in processing quality when the energy of pulse laser light in a spot which is a region to which the pulse laser light is irradiated deviates from a specified value.
  • the laser processing apparatus when the energy of pulsed laser light is smaller than the specified value, the depth of the formed hole is smaller than the desired depth, the diameter of the formed hole is smaller than the desired diameter, or Deterioration of quality may occur, such as leaving machining debris on the workpiece.
  • the laser processing apparatus when the energy of the pulsed laser light is larger than the specified value, the depth of the formed hole is deeper than the desired depth, or the diameter of the formed hole is larger than the desired diameter. It can cause deterioration.
  • the laser processing apparatus can take out part of the pulse laser beam traveling to the workpiece and measure the energy of the pulse laser beam applied to the workpiece based on the result of measuring the intensity of the taken laser beam .
  • the laser processing apparatus converts the intensity of the extracted laser beam into an electric quantity, and calculates the energy of the pulse laser beam based on the result of integrating the obtained electric signal by the integration circuit.
  • the laser processing apparatus can stably obtain high processing quality by controlling the oscillation of the pulse laser beam based on the measurement result of the energy of the pulse laser beam.
  • Patent Document 1 discloses a technique for correcting the output fluctuation due to the offset voltage in the period between pulses.
  • the laser processing apparatus integrates the electric signal output from the light detector that has received the pulse laser light in the integration circuit.
  • the laser processing apparatus integrates an electrical signal output from the light detector when it is not receiving pulsed laser light in an integration circuit, and an offset voltage for calibrating the light detector based on the obtained integration signal. Calculate the value.
  • the integration circuit In calculating the offset voltage value, the integration circuit integrates an electric signal of a minute voltage level near 0 V. Therefore, in order to improve the calculation accuracy of the offset voltage value, it is required to secure an integration time as long as possible. On the other hand, in the technique of Patent Document 1, it is necessary to secure integration time in the pulse interval. The higher the oscillation frequency of the pulse laser light, the shorter the pulse interval. Therefore, in the technique of Patent Document 1, the integration time that can be secured for calculating the offset voltage value is shortened, and the offset voltage value is highly accurate. Calculation becomes difficult.
  • the present invention is made in view of the above, and an object of the present invention is to obtain a laser processing apparatus which can stably obtain high processing quality.
  • a laser processing apparatus comprises a laser oscillator that oscillates pulse laser light, a photodetector that receives pulse laser light and outputs a detection signal, and a laser A first integration circuit that integrates a detection signal when pulsed laser light is on during oscillator operation, and a second integration that integrates a detection signal when pulsed laser light is off during laser oscillator operation And a circuit.
  • the laser processing apparatus according to the present invention has an effect that high processing quality can be stably obtained.
  • FIG. 1 The figure which shows the structure of the laser processing apparatus concerning embodiment of this invention
  • FIG. 1 Block diagram showing functional configuration of control device shown in FIG. 1
  • the figure explaining the electric signal shown in FIG. 7 The figure explaining the case where the integral time designated by the integral command signal shown in FIG. 2 is made variable
  • FIG. 1 is a view showing the configuration of a laser processing apparatus 1 according to an embodiment of the present invention.
  • the laser processing apparatus 1 forms a hole in the workpiece 12 by irradiation of a laser beam 3 which is a pulse laser beam.
  • the X axis and the Y axis are two axes parallel to the horizontal direction and perpendicular to each other.
  • the Z axis is an axis parallel to the vertical direction and perpendicular to the X axis and the Y axis.
  • the workpiece 12 is placed on the upper surface of the table 13 which is a plane parallel to the X axis and the Y axis.
  • the laser processing apparatus 1 includes a laser oscillator 2 that oscillates a laser beam 3 which is a pulse laser beam to be irradiated to the workpiece 12.
  • the laser light 3 is infrared light.
  • the oscillation frequency of pulsed laser light by the laser oscillator 2 is in the range of 100 Hz to 10000 Hz.
  • the pulse width which is the period of one pulse from which the laser light 3 is emitted is included in the range of 1 ⁇ sec to 100 ⁇ sec.
  • the laser oscillator 2 repeats on and off of the laser light 3.
  • the laser beam 3 being on indicates that the laser oscillator 2 emits the laser beam 3.
  • the laser beam 3 being off means that the laser oscillator 2 does not emit the laser beam 3.
  • the partial reflection mirror 4 reflects a part of the laser light 3 from the laser oscillator 2 and transmits the remaining laser light 3. In the embodiment, the partial reflection mirror 4 transmits 95% of the laser light 3 from the laser oscillator 2 and reflects 5%.
  • the laser beam 3 transmitted through the partial reflection mirror 4 travels toward the workpiece 12. Of the laser light 3 from the laser oscillator 2, the laser light 14 branched by the reflection on the partial reflection mirror 4 travels toward the integrated signal calculation device 15.
  • the mirrors 5 and 6 reflect the laser light 3 transmitted through the partial reflection mirror 4.
  • the scan mirror 8 reflects the laser light 3 from the mirror 6.
  • the galvano scanner 7 is a servomotor that rotationally drives the scan mirror 8.
  • the galvano scanner 7 displaces the incident position of the laser beam 3 on the workpiece 12 in the X-axis direction by rotating the scan mirror 8.
  • the scan mirror 10 reflects the laser light 3 from the scan mirror 8.
  • the galvano scanner 9 is a servomotor that rotationally drives the scan mirror 10.
  • the galvano scanner 9 displaces the incident position of the laser beam 3 on the workpiece 12 in the Y-axis direction by rotating the scan mirror 10.
  • the focusing optical system 11 converges the laser light 3 from the scan mirror 10.
  • the condensing optical system 11 includes one or more condensing lenses.
  • the condensing optical system 11 may be an f ⁇ lens.
  • the focusing position of the laser light 3 by the f ⁇ lens is a position of f ⁇ obtained by multiplying the focal length f of the focusing optical system 11 by the deflection angle ⁇ of the scan mirrors 8 and 10.
  • the table 13 is movable in the X-axis direction and the Y-axis direction.
  • the workpiece 12 moves together with the table 13 in the X-axis direction and the Y-axis direction.
  • a 300 mm square workpiece 12 is placed on the table 13.
  • the galvano scanners 7 and 9 scan the laser beam 3 in a 50 mm square area of the workpiece 12 on the table 13.
  • the laser processing apparatus 1 repeats the movement of the table 13 and the irradiation of the laser light 3 to the workpiece 12 to form holes at a plurality of positions of the workpiece 12.
  • the laser processing apparatus 1 forms a hole having a diameter on the order of 10 ⁇ m or 100 ⁇ m.
  • the laser oscillator 2 turns off the laser light 3 while moving the table 13.
  • the laser oscillator 2 turns on the laser beam 3 after the table 13 is stopped at the desired position.
  • optical elements other than the partial reflection mirror 4, the mirrors 5 and 6, the scan mirrors 8 and 10, and the condensing optical system 11 may be provided in an optical path for advancing the laser light 3.
  • any of the partial reflection mirror 4, the mirrors 5 and 6, the scan mirrors 8 and 10, the galvano scanners 7 and 9, the condensing optical system 11, and the table 13 may be omitted.
  • the laser processing device 1 includes an integral signal calculation device 15 and a control device 16.
  • the integral signal calculation device 15 measures the intensity of the laser beam 14 branched by the partial reflection mirror 4.
  • the integral signal calculation device 15 converts the intensity of the laser beam 14 into an electrical quantity, and outputs an integral signal that is the result of integrating the obtained electrical signal.
  • the controller 16 is connected to the integral signal calculator 15 and the laser oscillator 2.
  • the control device 16 obtains the energy value of the laser light 3 to be irradiated to the workpiece 12 based on the integrated signal input from the integrated signal calculation device 15.
  • the controller 16 controls the laser oscillator 2 based on the obtained energy value.
  • the laser processing apparatus 1 can reduce the deterioration in processing quality due to the difference between the energy value of the laser light 3 for each spot and the specified value by adjusting the number of times the laser light 3 is emitted for each spot on the workpiece 12 I assume.
  • the control device 16 may control the galvano scanners 7 and 9 and the table 13. Here, the details of control of the galvano scanners 7 and 9 and the table 13 will be omitted.
  • FIG. 2 is a diagram showing the configuration of the integral signal calculation device 15 shown in FIG.
  • the integral signal calculation device 15 includes an infrared sensor 21 which is a light detector for detecting the laser beam 14 branched by the partial reflection mirror 4.
  • the infrared sensor 21 receives the laser beam 14 and outputs a detection signal.
  • the infrared sensor 21 outputs an electrical signal 31 which is a detection signal of a voltage level corresponding to the intensity of the received laser beam 14.
  • the infrared sensor 21 outputs an electrical signal 31, which is a first electrical signal.
  • the integral signal calculation device 15 includes an amplifier circuit 22 which is an operational amplifier.
  • the amplification circuit 22 amplifies the electric signal 31 output from the infrared sensor 21 and outputs an electric signal 32 after amplification.
  • the amplification circuit 22 may have a configuration for changing the amplification factor.
  • the amplification circuit 22 corrects the electric signal 31 by subtracting the offset voltage value 35 for calibration of the infrared sensor 21 and the amplification circuit 22 from the electric signal 31, and a second electric signal which is the corrected electric signal 31. To amplify.
  • the amplification circuit 22 amplifies a second electric signal which is an electric signal 31 in which an error due to an offset voltage between the infrared sensor 21 and the amplification circuit 22 is canceled, and an electric signal 32 which is a second electric signal after amplification.
  • the integral signal calculation device 15 includes a first integration circuit 23 that integrates the electric signal 32 from the amplification circuit 22 and a second integration circuit 24.
  • the first integration circuit 23 and the second integration circuit 24 are integration circuits including an operational amplifier which is an amplification circuit and a capacitor.
  • the first integration circuit 23 and the second integration circuit 24 are connected in parallel.
  • the first integration circuit 23 integrates, for each pulse, an electrical signal 32 which is a detection signal output from the infrared sensor 21 and the amplification circuit 22 when the laser light 3 is on while the laser oscillator 2 is operating.
  • the first integration circuit 23 integrates the electrical signal 32 at a first integration time specified by the integration command signal 37.
  • the first integration circuit 23 outputs a first integration signal 33 proportional to the time integration of the input electrical signal 32.
  • the first integrated signal 33 which is the integration result of the first integration circuit 23, represents the time integration of the intensity of the laser beam 14.
  • the first integration circuit 23 integrates the electric signal 32 for each pulse.
  • the second integration circuit 24 integrates an electrical signal 32 which is a detection signal output from the infrared sensor 21 and the amplification circuit 22 when the laser light 3 is off during the operation of the laser oscillator 2.
  • the second integration circuit 24 integrates the electrical signal 32 at a second integration time specified by the integration command signal 38.
  • the second integration circuit 24 outputs a second integration signal 34 proportional to the time integration of the input electrical signal 32.
  • the second integration signal 34 which is the integration result of the second integration circuit 24, represents the time integration of the offset voltage in the infrared sensor 21 and the amplification circuit 22.
  • the second integration circuit 24 integrates the electrical signal 32 at each pulse interval.
  • the integral signal calculation device 15 outputs the first integral signal 33 which is the output of the first integral circuit 23 and the second integral signal 34 which is the output of the second integral circuit 24 to the control device 16.
  • the controller 16 controls the laser beam 3 to be oscillated next, using the first integral signal 33 corrected by the second integral signal 34.
  • the offset voltage value 35 from the control device 16, the integration command signals 37 and 38, and the gain signal 39 are input to the integration signal calculation device 15.
  • FIG. 3 is a block diagram showing a functional configuration of the control device 16 shown in FIG.
  • the control unit 40 is a functional unit that controls each functional unit of the control device 16.
  • the control unit 40 controls the delivery of signals between the functional units.
  • the first integrated signal input unit 41 is a functional unit that receives the first integrated signal 33 from the integrated signal calculation device 15.
  • the first integrated signal input unit 41 sends the input first integrated signal 33 to the control unit 40.
  • the control unit 40 sends the first integrated signal 33 to the energy calculating unit 48.
  • the second integral signal input unit 42 is a functional unit that receives the second integral signal 34 from the integral signal calculation device 15.
  • the second integrated signal input unit 42 sends the input second integrated signal 34 to the control unit 40.
  • the control unit 40 sends the second integrated signal 34 to the offset voltage calculation unit 43.
  • the offset voltage calculation unit 43 is a functional unit that calculates the offset voltage value 35.
  • the offset voltage calculation unit 43 calculates the offset voltage value 35 by multiplying the second integral signal 34 by the coefficient parameter.
  • the offset voltage calculation unit 43 sends the offset voltage value 35 to the control unit 40.
  • the control unit 40 sends the offset voltage value 35 to the offset voltage output unit 44.
  • the offset voltage output unit 44 is a functional unit that outputs the offset voltage value 35 to the amplifier circuit 22 shown in FIG.
  • the first integration command output unit 45 is a functional unit that outputs the integration command signal 37 to the first integration circuit 23 shown in FIG. The first integration time is specified by the integration command signal 37.
  • the second integration command output unit 46 is a functional unit that outputs the integration command signal 38 to the second integration circuit 24 shown in FIG. The second integration time is specified by the integration command signal 38.
  • the energy calculating unit 48 has a function of calculating the energy value of the laser beam 3 irradiated to the spot of the workpiece 12 based on the first integrated signal 33 obtained by integrating the electric signal 32 in which the offset voltage is canceled. It is a department.
  • the energy calculation unit 48 calculates the energy value of the laser light 3 for each spot by multiplying the first integral signal 33 by the coefficient parameter.
  • the energy value calculated by the energy calculation unit 48 is appropriately referred to as “measured value”.
  • the energy calculating unit 48 calculates the difference between the specified value of the energy of the laser beam 3 and the actually measured value for each spot.
  • the energy calculation unit 48 sends the difference between the specified value and the actual measurement value to the control unit 40.
  • the control unit 40 sends the difference between the specified value and the actual measurement value to the laser oscillation control unit 47.
  • the laser oscillation control unit 47 is a functional unit that controls the oscillation of the laser beam 3 by the laser oscillator 2 based on the difference between the specified value of energy and the actually measured value.
  • the laser oscillation control unit 47 generates a control signal 36 to which the irradiation of the laser light 3 is added when the measured value of energy is smaller than the specified value.
  • the laser oscillation control unit 47 determines the number of times of irradiation of the laser light 3 in accordance with the difference between the specified value and the actual measurement value. Further, the laser oscillation control unit 47 generates a control signal 36 for turning off the laser light 3 when it is determined that the measured value of the energy becomes larger than the specified value.
  • the laser oscillation control unit 47 outputs a control signal 36 to the laser oscillator 2 shown in FIG.
  • the gain signal output unit 49 is a functional unit that generates the gain signal 39 and outputs the gain signal 39 to the amplification circuit 22 illustrated in FIG.
  • the gain representing the amplification factor of the amplifier circuit 22 is designated by the gain signal 39.
  • the offset voltage storage unit 50 includes a number of data areas corresponding to the number of gains that can be specified by the gain signal 39.
  • the offset voltage storage unit 50 is a functional unit that holds an offset voltage value 35 corresponding to a gain.
  • the control unit 40 determines the offset voltage value 35 corresponding to the changed gain. Are read from the offset voltage storage unit 50.
  • the control unit 40 sends the read offset voltage value 35 to the offset voltage output unit 44.
  • the offset voltage output unit 44 outputs the offset voltage value 35 to the amplifier circuit 22 shown in FIG.
  • FIG. 4 is a block diagram showing a hardware configuration of control device 16 shown in FIG.
  • the hardware configuration of the control device 16 is a microcontroller.
  • the functions of the controller 16 are executed on a program analyzed and executed by the microcontroller. A part of the functions of the control device 16 may be executed on hardware by wired logic.
  • the control device 16 includes a processor 51 which executes various processes, and a memory 52 in which programs for various processes are stored.
  • the processor 51 and the memory 52 are connected to each other via a bus 53.
  • the processor 51 develops the loaded program and executes various processes for controlling the laser processing apparatus 1 by the control device 16.
  • the control unit 40 shown in FIG. 3 a first integral signal input unit 41, a second integral signal input unit 42, an offset voltage calculation unit 43, an offset voltage output unit 44, a first integration command output unit 45, a second Integration command output unit 46, laser oscillation control unit 47, energy calculation unit 48 and gain signal output unit 49 are realized using processor 51.
  • the offset voltage storage unit 50 is realized using the memory 52.
  • FIG. 5 is a first diagram for explaining the first integrated signal 33 shown in FIG.
  • an offset voltage which is an error that the output voltage rises or falls due to a change in temperature may occur.
  • an offset voltage which is an error in which the output voltage rises or falls due to a change in gain may occur in the amplifier circuit 22.
  • the electric signal 32 and the first integrated signal obtained by integrating the electric signal 32 in the case where the temperature drift in which the output fluctuates due to the fluctuation of the offset voltage of the infrared sensor 21 does not occur And 33 are shown.
  • the voltage level of the electric signal 32 is 0 V which is a reference value.
  • the amplifier circuit 22 outputs the electric signal 32 which does not include the variation due to the offset voltage.
  • the first integral command output unit 45 shown in FIG. 3 raises the integral command signal 37 prior to the rise of the pulse of the electric signal 32.
  • the first integral command output unit 45 causes the integral command signal 37 to fall after the fall of the electric signal 32.
  • the first integration circuit 23 integrates the electric signal 32 in the time from the rise to the fall of the integration command signal 37.
  • the time integration of the electrical signal 32 in the first integration circuit 23 corresponds to determining the area of the pulse waveform of the electrical signal 32.
  • the first integration circuit 23 can obtain the accurate first integration signal 33 by inputting the electric signal 32 which does not include the variation due to the offset voltage.
  • the energy calculating unit 48 can calculate an accurate energy value of the pulsed laser light.
  • FIG. 6 is a second diagram for explaining the first integrated signal 33 shown in FIG. FIG. 6 shows the electric signal 32, the integration command signal 37, and the first integration signal 33 in the case where a temperature drift occurs in the infrared sensor 21.
  • the level of the offset voltage of the infrared sensor 21 is a positive level, that is, a level higher than 0 V
  • the voltage level of the electric signal 32 when the laser light 3 is off shifts to the positive side.
  • the amplifier circuit 22 outputs an electrical signal 32 whose voltage level is shifted to the positive side.
  • the first integration circuit 23 obtains a first integration signal 33 whose voltage level is shifted to the positive side.
  • the level of the offset voltage of the infrared sensor 21 is a minus level, that is, a level lower than 0 V
  • the voltage level of the electrical signal 32 when the laser light 3 is off shifts to the minus side.
  • the amplifier circuit 22 outputs an electrical signal 32 whose voltage level is shifted to the negative side.
  • the first integrating circuit 23 obtains a first integrated signal 33 whose voltage level is shifted to the negative side.
  • the amplification circuit 22 subtracts the offset voltage value 35 calculated based on the second integrated signal 34 from the electric signal 31 to obtain the electric signal 32 in which the variation due to the offset voltage is corrected.
  • the first integration circuit 23 can obtain the accurate first integration signal 33 by inputting the electric signal 32 in which the variation due to the offset voltage is corrected. As a result, the energy calculating unit 48 can calculate an accurate energy value of the laser light 3.
  • FIG. 7 is a diagram for explaining an operation for correcting the electric signal 32 by the laser processing apparatus 1 shown in FIG.
  • FIG. 8 is a diagram for explaining the electrical signal 32 shown in FIG.
  • the offset voltage calculation unit 43 calculates an offset voltage value 35 in a period in which the pulse laser beam is off between a period in which the pulse laser beam is on and a period in which the next pulse laser beam is on.
  • the laser processing apparatus 1 performs an operation for correction in a period in which the pulse laser beam is off.
  • the laser processing apparatus 1 performs an operation for correction also between a period in which the next pulse laser beam is on and a period in which the next pulse laser beam is on after the operation for correction is performed. Do.
  • the laser processing apparatus 1 alternately repeats emission of one pulse laser beam and an operation for correction.
  • the laser processing apparatus 1 emits a plurality of pulse laser beams to process a workpiece 12.
  • the laser beam 14 branched from the pulse laser beam traveling to the workpiece 12 is continuously input to the infrared sensor 21.
  • the deviation between the voltage level of the electric signal 32 and the reference value increases with time.
  • the laser processing apparatus 1 performs the correction between the period in which the pulse laser beam is on and the period in which the next pulse laser beam is on, so that the voltage of the electric signal 32 is shown as a solid line in FIG. The deviation between the level and the reference value can be reduced.
  • the first integration command output unit 45 switches the integration command signal 37 from off to on before emission of pulsed laser light is started. While the pulse laser beam is emitted, the amplifier circuit 22 outputs an electric signal 32 of a voltage level according to the intensity of the pulse laser beam. After the emission of the pulse laser light is stopped, the first integrated signal 33 is input to the first integrated signal input unit 41.
  • the first integration circuit 23 integrates the electric signal 32 at integration time T11.
  • the integration time T11 is a time from when the integration command signal 37 rises to when the input of the first integration signal 33 to the first integration signal input unit 41 is started.
  • the first integrated signal input unit 41 reads the first integrated signal 33, which is an analog signal, at the measurement time T12 after the emission of the pulse laser light is stopped.
  • reading of the first integrated signal 33 at the first integrated signal input unit 41 is referred to as measurement of the first integrated signal 33.
  • the first integrated signal input unit 41 performs analog-to-digital (AD) conversion for the measurement of the first integrated signal 33.
  • AD analog-to-digital
  • the first integral command output unit 45 switches the integral command signal 37 from on to off.
  • the first integration circuit 23 releases the charge accumulated in the capacitor at a discharge time T13 after the integration command signal 37 is switched from on to off.
  • the second integration command output unit 46 switches the integration command signal 38 from off to on at the timing when the measurement of the first integration signal 33 by the first integration signal input unit 41 is started. While emission of pulse laser light is stopped, the amplifier circuit 22 outputs an electrical signal 32 according to the level of the offset voltage between the infrared sensor 21 and the amplifier circuit 22. The second integrated signal 34 is input to the second integrated signal input unit 42 before emission of the next pulse laser beam is started. The second integration circuit 24 integrates the electric signal 32 at integration time T21.
  • the integration time T21 is a time from the rise time of the integration command signal 38 to the start of the input of the second integration signal 34 to the second integration signal input unit 42.
  • the second integrated signal input unit 42 reads the second integrated signal 34, which is an analog signal, at the measurement time T22.
  • the reading of the second integrated signal 34 at the second integrated signal input unit 42 is referred to as the measurement of the second integrated signal 34.
  • the second integrated signal input unit 42 performs AD conversion for measurement of the second integrated signal 34.
  • the second integral command output unit 46 switches the integral command signal 38 from on to off.
  • the second integration circuit 24 releases the charge accumulated in the capacitor at a discharge time T23 after the integration command signal 38 is switched from on to off.
  • one integration circuit is used for the integration for calculating the energy value of the pulse laser light and the integration for calculating the offset voltage value 35, after the integration for calculating the energy value of the pulse laser light After the measurement and the discharge, integration for calculating the offset voltage value 35 is started.
  • the second integration circuit 24 performs the electric signal 32 in parallel with the measurement of the first integration signal 33 and the discharge of the first integration circuit 23. Integrable.
  • the laser processing apparatus 1 can start the integration time T21 for calculating the offset voltage value 35 without waiting for the measurement time T12 and the discharge time T13 for the first integral signal 33.
  • the laser processing apparatus 1 can secure a longer integration time T21 than when one integration circuit is used, by providing the first integration circuit 23 and the second integration circuit 24.
  • the laser processing apparatus 1 can secure a long integration time T21 even when the pulse laser beam emission interval is short.
  • the pulse interval is 100 ⁇ s
  • the integration time T11 is 55 ⁇ s
  • the measurement times T12 and T22 are 5 ⁇ s
  • the discharge times T13 and T23 are 10 ⁇ s
  • the time T21 can be 45 microseconds.
  • the laser processing apparatus 1 can accurately calculate the offset voltage value 35 by securing the long integration time T21.
  • the laser processing apparatus 1 may correct the electric signal 32 every time one pulse laser beam is emitted, or may correct the electric signal 32 every time a plurality of pulse laser beams are emitted. good.
  • the first integration command output unit 45 may make the integration time T11 specified by the integration command signal 37 variable.
  • the laser processing apparatus 1 may change the integration time T11 in accordance with the oscillation frequency or the pulse width of the laser oscillator 2.
  • FIG. 9 is a diagram for explaining the case where the integration time T11 specified by the integration command signal 37 shown in FIG. 2 is variable.
  • the first integration command output unit 45 calculates an integration time based on the oscillation frequency or pulse width of the laser oscillator 2.
  • the first integration command output unit 45 switches the integration command signal 37 from off to on before emission of pulsed laser light is started.
  • the first integration command output unit 45 switches the integration command signal 37 from on to off when the integration time T11 elapses after the integration command signal 37 is switched from off to on.
  • the pulse width of the electric signal 32 is 60 ⁇ sec if the integration time T11 is unchanged at 60 ⁇ sec.
  • the integration time T11 is started before the rise of the pulse of the electric signal 32, and the integration time T11 is ended before the fall of the pulse of the electric signal 32. For this reason, part of the pulses of the electrical signal 32 will not be integrated.
  • the laser processing apparatus 1 appropriately sets the integration time T11 to be longer than 60 ⁇ sec for the pulse of the electric signal 32.
  • the laser processing apparatus 1 can set the integration time T11 to 110 ⁇ sec. Thereby, the laser processing apparatus 1 can avoid the situation that a part of pulse of the electric signal 32 is not integrated.
  • the laser processing apparatus 1 appropriately sets the integration time T11 shorter than 120 ⁇ sec for the pulse of the electric signal 32.
  • the laser processing apparatus 1 can set the integration time T11 to 70 ⁇ sec. Thereby, the laser processing apparatus 1 can avoid the situation that two pulses of the electric signal 32 are integrated without being separated.
  • the laser processing apparatus 1 has a problem that part of the signal in the pulse period is not integrated or integration of a signal in a plurality of pulse periods into one integrated signal is performed by making the integration time T11 variable. Can be avoided.
  • the laser processing apparatus 1 can calculate the amount of energy for each pulse laser beam, even when the oscillation frequency or the pulse width changes.
  • the gain signal output unit 49 may make the gain specified by the gain signal 39 variable.
  • the laser processing apparatus 1 may change the gain of the amplification circuit 22 in accordance with the intensity of the pulsed laser light output from the laser oscillator 2.
  • FIG. 10 is a diagram for explaining the case where the gain of the amplifier circuit 22 shown in FIG. 1 is variable.
  • the gain signal output unit 49 sets the gain in accordance with the energy value of the pulse laser light.
  • the gain signal output unit 49 generates a gain signal 39 including designation of the gain.
  • the amplifier circuit 22 corrects the electric signal 31 by subtracting the offset voltage value 35 from the electric signal 31, and amplifies the corrected electric signal 31.
  • the amplification circuit 22 amplifies the electric signal 31 whose offset voltage has been cancelled, and outputs an electric signal 32 after amplification.
  • Level L shown in FIG. 10 represents the upper limit of the voltage level of the first integrated signal 33 which can be measured by the first integrated signal input unit 41. Assuming that the gain is fixed, the voltage level of the first integrated signal 33 may exceed the level L because the energy value of the laser beam 14 incident on the infrared sensor 21 is high.
  • the laser processing apparatus 1 obtains the first integrated signal 33 at a voltage level lower than the level L by decreasing the gain of the amplification circuit 22 when the energy value of the pulsed laser light is high.
  • the laser processing apparatus 1 can measure the first integral signal 33 by the first integral signal input unit 41. In the example shown in FIG.
  • the gain is set to 10 times.
  • the laser processing apparatus 1 puts the voltage level of the first integrated signal 33 in the input possible range of the control device 16 which is in the range from 0 V which is the reference value to the level L.
  • the signal-to-noise ratio (SNR) of the first integrated signal 33 is lowered because the energy value of the laser beam 14 incident on the infrared sensor 21 is low. It is possible. As the SNR of the first integrated signal 33 decreases, accurate measurement of the first integrated signal 33 by the first integrated signal input unit 41 becomes difficult.
  • the laser processing apparatus 1 can accurately measure the first integrated signal 33 by the first integrated signal input unit 41 by raising the gain of the amplification circuit 22 when the energy value of the pulse laser light is low. In the example shown in FIG. 10, when the energy value of the pulse laser light is low to such an extent that the SNR of the first integrated signal 33 decreases, the gain is set to 20 times. As described above, the laser processing apparatus 1 maintains the voltage level of the first integrated signal 33 that can suppress the decrease in SNR.
  • the gain signal output unit 49 sends a gain signal 39 to the amplification circuit 22 before emission of pulsed laser light is started.
  • the amplification circuit 22 switches the gain in accordance with the gain signal 39.
  • the offset voltage calculation unit 43 changes the coefficient parameter according to the gain in order to avoid the fluctuation of the calculation result of the offset voltage value 35 due to the change of the gain.
  • the energy calculating unit 48 changes the coefficient parameter in accordance with the gain in order to avoid the fluctuation of the calculation result of the measured value of the energy due to the change of the gain.
  • the offset voltage of the amplifier circuit 22 changes in accordance with the gain.
  • the laser processing apparatus 1 corrects the fluctuation of the output of the amplifier circuit 22 due to the offset voltage.
  • the second integration command output unit 46 outputs the integration command signal 38 to the second integration circuit 24.
  • the second integration circuit 24 integrates the electric signal 32 when emission of pulse laser light is stopped, and sends the second integration signal 34 to the second integration signal input unit 42.
  • the offset voltage calculation unit 43 calculates an offset voltage value 35 by multiplying the measurement result of the second integrated signal 34 by the second integrated signal input unit 42 by the coefficient parameter changed according to the gain. Thereby, the offset voltage output unit 44 updates the offset voltage value 35 to be output to the amplifier circuit 22 when the gain is changed.
  • the laser oscillation control unit 47 sends a control signal 36 to the laser oscillator 2.
  • the first integrating circuit 23 integrates the electric signal 32 when the pulse laser light is emitted, and sends the first integrated signal 33 to the first integrated signal input unit 41.
  • the energy calculation unit 48 calculates the actual measurement value of the energy of the pulse laser light by multiplying the measurement result of the first integrated signal 33 by the first integrated signal input unit 41 by the coefficient parameter changed according to the gain. Do.
  • the laser processing apparatus 1 updates the offset voltage value 35 to correct the output of the amplifier circuit 22. Further, the laser processing apparatus 1 changes the coefficient parameter in accordance with the gain. Thereby, the laser processing apparatus 1 can calculate an accurate energy value of the pulsed laser light even when the gain is switched.
  • processing conditions Even when the control signal 36 instructing oscillation under the same conditions is input to the laser oscillator 2, the intensity of the pulsed laser light output from the laser oscillator 2 may fluctuate for each processing.
  • the conditions instructed by the control signal 36 are referred to as processing conditions.
  • the laser processing apparatus 1 sequentially emits pulse laser light for each processing condition, and the energy calculation unit 48 calculates the energy value of the pulse laser light to obtain pulse laser light under each processing condition. Measure energy.
  • the laser processing apparatus 1 measures energy while changing the gain designated by the gain signal output unit 49.
  • the gain signal output unit 49 has a gain capable of maintaining the voltage level of the first integrated signal 33 within the above-described input possible range and maintaining the voltage level of the first integrated signal 33 to such an extent that reduction of the SNR can be suppressed. , Select for each processing condition. Thereby, the laser processing apparatus 1 adjusts the gain for each processing condition, and sets the gain suitable for processing.
  • the laser processing apparatus 1 Since the offset voltage of the amplification circuit 22 changes according to the gain, the laser processing apparatus 1 updates the offset voltage value 35 when the gain is changed during processing.
  • the offset voltage output unit 44 reads the offset voltage value 35 corresponding to the changed gain from the offset voltage storage unit 50. , And outputs the read offset voltage value 35.
  • the offset voltage calculation unit 43 calculates the offset voltage value 35, and offsets the calculated offset voltage value 35 Output to voltage output unit 44. Further, the offset voltage calculation unit 43 sends the calculated offset voltage value 35 to the offset voltage storage unit 50.
  • the offset voltage storage unit 50 stores the offset voltage value 35 in the data area.
  • the laser processing apparatus 1 can omit the calculation of the offset voltage value 35 at the time of switching the gain by holding the offset voltage value 35 corresponding to each gain settable to the amplification circuit 22 in the offset voltage storage unit 50. .
  • the laser processing apparatus 1 can reduce the processing required for updating the offset voltage value 35 by switching the gain, and can reduce the time required for updating.
  • the laser processing apparatus 1 calculates offset voltage values 35 for all gains that can be taken by the amplification circuit 22 at times other than processing, and stores the offset voltage values 35 in each data region of the offset voltage storage unit 50. It is good.
  • the laser processing apparatus 1 may calculate and store the offset voltage value 35 when the time when no processing is performed continues for a predetermined time or more.
  • the laser processing apparatus 1 can omit the calculation of the offset voltage value 35 at the time of processing by holding the offset voltage value 35 for all gains before the start of processing next time.
  • the offset voltage calculation unit 43 substitutes the calculation of the offset voltage values 35 for all gains that can be set in the amplification circuit 22, and offset voltage values for the maximum gain and the minimum gain among the gains that can be set in the amplification circuit 22. 35 may be calculated.
  • the offset voltage calculation unit 43 obtains the offset voltage value 35 for gains other than the maximum gain and the minimum gain by linear interpolation between the offset voltage value 35 for the maximum gain and the offset voltage value 35 for the minimum gain. It is good.
  • the laser processing apparatus 1 can hold the offset voltage value 35 for all gains.
  • the energy calculating unit 48 may calculate the energy value using the electrical signal 32 when the pulsed laser light is on, instead of the first integrated signal 33.
  • the offset voltage calculation unit 43 may calculate the offset voltage value 35 using the electrical signal 32 when the pulse laser light is off, instead of the second integral signal 34.
  • the laser processing apparatus 1 performs integration for calculation of the offset voltage value 35 by the second integration circuit 24 provided separately from the first integration circuit 23.
  • the laser processing apparatus 1 enables integration of the electric signal 32 by the second integration circuit 24 in parallel with the measurement of the first integration signal 33 and the discharge of the first integration circuit 23, thereby making the offset voltage value
  • the integration time T21 for calculating 35 can be lengthened.
  • the laser processing apparatus 1 can accurately calculate the offset voltage value 35 by securing the long integration time T21, and can measure the energy of pulse laser light with high accuracy.
  • the laser processing apparatus 1 enables highly accurate adjustment of the energy of pulse laser light, and can stably obtain high processing quality. Thereby, the laser processing apparatus 1 has an effect that high processing quality can be stably obtained.
  • the configuration shown in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and one of the configurations is possible within the scope of the present invention. Parts can be omitted or changed.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

L'invention concerne un dispositif d'usinage au laser, lequel dispositif comporte : un oscillateur de laser (2) qui fait osciller une lumière laser (3), ou, autrement dit, une lumière laser pulsée ; et un capteur d'infrarouges (21), qui est un détecteur optique, qui reçoit la lumière laser pulsée, et qui délivre en sortie un signal de détection. Le dispositif d'usinage au laser comporte également : un premier circuit d'intégration (23) qui intègre le signal de détection quand la lumière laser pulsée est allumée pendant que l'oscillateur de laser (2) fonctionne ; et un second circuit d'intégration (24) qui intègre le signal de détection quand la lumière laser pulsée est éteinte pendant que l'oscillateur de laser (2) fonctionne.
PCT/JP2017/034344 2017-09-22 2017-09-22 Dispositif d'usinage au laser WO2019058522A1 (fr)

Priority Applications (5)

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JP2018511289A JP6370517B1 (ja) 2017-09-22 2017-09-22 レーザ加工装置
PCT/JP2017/034344 WO2019058522A1 (fr) 2017-09-22 2017-09-22 Dispositif d'usinage au laser
CN201780079854.5A CN110099768B (zh) 2017-09-22 2017-09-22 激光加工装置
KR1020197017125A KR102084558B1 (ko) 2017-09-22 2017-09-22 레이저 가공 장치
TW107112747A TWI658891B (zh) 2017-09-22 2018-04-13 雷射加工裝置

Applications Claiming Priority (1)

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PCT/JP2017/034344 WO2019058522A1 (fr) 2017-09-22 2017-09-22 Dispositif d'usinage au laser

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WO2019058522A1 true WO2019058522A1 (fr) 2019-03-28

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JP (1) JP6370517B1 (fr)
KR (1) KR102084558B1 (fr)
CN (1) CN110099768B (fr)
TW (1) TWI658891B (fr)
WO (1) WO2019058522A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114942100A (zh) * 2021-12-31 2022-08-26 西安交通大学 一种用于真空开关真空度检测的装置及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62227587A (ja) * 1986-03-27 1987-10-06 Miyachi Electric Co レ−ザモニタ装置
JPH11287707A (ja) * 1998-03-31 1999-10-19 Sumitomo Heavy Ind Ltd レーザパルスエネルギ計測装置、並びにこれを用いた加工用レーザパルス供給制御装置及び方法
WO2013171848A1 (fr) * 2012-05-15 2013-11-21 トヨタ自動車株式会社 Procédé de soudage, dispositif de soudage et procédé de fabrication de batterie

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4567989B2 (ja) * 2004-02-06 2010-10-27 日立ビアメカニクス株式会社 移動体のサーボ制御装置及びレーザ加工装置
JP5219623B2 (ja) * 2008-05-23 2013-06-26 三菱電機株式会社 レーザ加工制御装置およびレーザ加工装置
JP5597503B2 (ja) * 2010-09-30 2014-10-01 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
JP5879747B2 (ja) * 2011-05-26 2016-03-08 オムロン株式会社 光増幅装置およびレーザ加工装置
TWI569688B (zh) * 2014-07-14 2017-02-01 Ａｓｍｌ荷蘭公司 雷射源中之光電磁感測器之校正技術
JP6310358B2 (ja) * 2014-08-01 2018-04-11 株式会社キーエンス レーザ加工装置
CN204639434U (zh) * 2015-01-29 2015-09-16 北京金洋恒泰科技发展有限公司 一种驱动装置及打标装置
JP2017227587A (ja) * 2016-06-24 2017-12-28 セイコーエプソン株式会社 圧力センサー、圧力センサーの製造方法、高度計、電子機器および移動体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62227587A (ja) * 1986-03-27 1987-10-06 Miyachi Electric Co レ−ザモニタ装置
JPH11287707A (ja) * 1998-03-31 1999-10-19 Sumitomo Heavy Ind Ltd レーザパルスエネルギ計測装置、並びにこれを用いた加工用レーザパルス供給制御装置及び方法
WO2013171848A1 (fr) * 2012-05-15 2013-11-21 トヨタ自動車株式会社 Procédé de soudage, dispositif de soudage et procédé de fabrication de batterie

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114942100A (zh) * 2021-12-31 2022-08-26 西安交通大学 一种用于真空开关真空度检测的装置及方法

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KR20190075143A (ko) 2019-06-28
JPWO2019058522A1 (ja) 2019-11-14
CN110099768A (zh) 2019-08-06
JP6370517B1 (ja) 2018-08-08
CN110099768B (zh) 2021-03-26
TWI658891B (zh) 2019-05-11
KR102084558B1 (ko) 2020-03-05

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