WO2019057143A1 - 一种由多个电路板封装模组组合制成的led灯泡 - Google Patents

一种由多个电路板封装模组组合制成的led灯泡 Download PDF

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WO2019057143A1
WO2019057143A1 PCT/CN2018/106896 CN2018106896W WO2019057143A1 WO 2019057143 A1 WO2019057143 A1 WO 2019057143A1 CN 2018106896 W CN2018106896 W CN 2018106896W WO 2019057143 A1 WO2019057143 A1 WO 2019057143A1
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circuit board
glass
bulb
modules
package modules
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PCT/CN2018/106896
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English (en)
French (fr)
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王定锋
徐文红
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王定锋
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source

Definitions

  • the present application relates to the field of LED applications, and in particular to an LED light bulb made up of a plurality of circuit board package modules.
  • LED bulbs on the market usually use conventional circuit boards to solder LED lamp beads and then fold into a multi-body module.
  • the cost is high, and there is a soldering resin in the circuit board material or/and the circuit board soldering ink.
  • the small molecular substance overflows.
  • the module is made into a bulb, it is sealed in the bulb, and the small molecular substance that overflows is deposited on the inner surface of the glass bulb, causing the bulb to decay.
  • LED bulbs assembled by strip filaments on the market are also assembled by strip filaments on the market.
  • the heat in the middle of the filament strip is higher than the heat of the two ends, and the intermediate temperature is higher than the two ends, so that the middle chip is easy to be necrotic and dead, and the strip filament is installed in the bulb, and the illumination is irradiated in the angular direction. Inconsistent with brightness, resulting in dark areas.
  • an LED bulb made of a plurality of circuit board package modules, which is formed by metal etching and molding, or by die-cutting metal injection molding.
  • a circuit board, or a foldable metal-based circuit board is injection molded on the circuit board to form a reflective cup, the chip is packaged in a cup reflective cup, and then connected in series and parallel by a plurality of package modules on the glass stem.
  • the LED bulb is made to solve the problem of small molecular substance overflow problem and single illumination direction of LED light, improve the light efficiency of the LED light bulb, and has good heat dissipation performance, simple structure, high efficiency and low cost.
  • the present invention relates to an LED bulb made up of a plurality of circuit board package modules, comprising: a glass bulb; a lamp cap; a driving power module; a circuit board package module; a glass core post; the circuit board is etched after metal etching
  • the package module is connected in series and parallel to the glass stem, assembled and sintered with the glass bulb, and sealed with a heat-conducting gas sealed in the glass bulb, and the power output end of the driving power module is connected to the electrode on the glass stem.
  • the power input end is connected to the electrode of the lamp cap, the driving power module is placed in the lamp cap, and the glass bulb is firmly bonded to the lamp cap to form an LED bulb made by combining a plurality of circuit board package modules.
  • an LED light bulb made up of a plurality of circuit board package modules, comprising: a glass bulb; a lamp holder; a driving power module; a circuit board packaging module; a glass core column;
  • the circuit board is a circuit board formed by injection molding after metal etching, or a circuit board formed by die-cutting metal injection molding, or a foldable metal-based circuit board on which a reflective cup formed by injection molding is disposed.
  • the chip package is formed in the reflective cup to form a circuit board package module, and then is connected to the glass core column by a plurality of package modules in series or parallel or in series, and is assembled and sintered with the glass bulb, and simultaneously
  • the glass bulb is filled with a heat-conducting gas sealed in the glass bulb, and the power output end of the driving power module is connected to the electrode lead on the glass stem, and the power input end is connected to the electrode of the lamp cap to drive
  • the power module is placed in the lamp holder, and the glass bulb is firmly bonded to the lamp cap to form an LED bulb made of a plurality of circuit board package modules.
  • the LED light bulb is composed of a plurality of circuit board package modules, wherein the heat conduction gas is mainly composed of a heat conduction gas of helium.
  • the LED light bulb is composed of a plurality of circuit board package modules, wherein the plurality of package modules are connected in series and parallel to a mold connected to a glass core column.
  • the number of groups is 2 to 12, which is 2 or 4 or 6 or 8 or 10 or 12.
  • the LED light bulb is composed of a plurality of circuit board package modules, wherein the connections between the modules are connected in series, or in parallel, or in series and then in parallel. Or first and then string.
  • the LED light bulb is composed of a plurality of circuit board package modules, wherein one module is a flat surface, or is bent into a polyhedron, or is bent into Surface.
  • the LED light bulb is composed of a plurality of circuit board package modules, wherein the shape of the module is small in the middle and small in both ends.
  • an LED bulb made of a plurality of circuit board package modules is assembled, wherein a plurality of modules are assembled on a stem to form an olive shape.
  • Figure 1 is a schematic view of a circuit board formed by die-cutting metal injection molding.
  • Figure 2 is a schematic view of the package after bending and slitting into a single package module.
  • FIG. 3 is a schematic diagram of an LED bulb made by combining a plurality of circuit board package modules.
  • a metal strip of 0.25 mm thickness is used to punch out a part of the metal which is not needed in the Hongrui bracket punching machine, and the raw circuit board 1 is fabricated, and then the welding is required in the subsequent order.
  • Electroplating silver surface treatment is performed at the position where the line and the LED chip are illuminating, and then injection molding is performed on the Nikken injection molding machine, and the plastic is formed at a predetermined position to form a fixed support 2, and at the same time, the LED chip needs to be packaged.
  • the reflecting cup 2.1 is formed at the position, and then the pre-breaking connection point for supporting the connection is punched and removed by the mold on the Hongrui's cutting foot punching machine, and the circuit board is fixed and shaped by the injection molding plastic.
  • the LED chip is crystallized in the reflective cup 2.1, baked and solidified, and then the LED chip and the circuit board bonding wire are connected by a metal wire bonding wire through the ASM-AB350 wire bonding machine, and the phosphor powder is contained.
  • the glue for the package glue is evenly placed in the reflector cup 2.2. After baking and curing, the circuit board package module is formed into a plurality of pieces, and then the frame 1.1 on both sides is removed by the mold, and the cut and bent are as shown in the figure. A single package module as shown in 2.
  • the six individual package modules as shown in FIG. 2 are respectively welded and assembled on the glass stem 3, and then placed in the glass bulb 4, sintered and sealed with the glass bulb 4, and filled with a helium seal for heat conduction.
  • the power output end of the driving power module 5 is connected to the electrode lead on the glass stem, the power input end is connected to the electrode of the lamp cap 6, and the driving power module is placed on the lamp cap.
  • the glass bulb 4 and the base 6 are firmly bonded to each other to form an LED bulb formed by six circuit board package modules (as shown in FIG. 3).
  • An LED bulb made of a plurality of circuit board package modules is a circuit board formed by metal etching, or a circuit board formed by die-cutting metal injection molding, or a foldable metal base.
  • the circuit board is injection molded on the circuit board to form a reflective cup.
  • the chip is packaged in a cup reflector cup, and then connected to the glass stem by series and parallel welding with a plurality of package modules, and the LED bulb is prepared, and the small molecule is solved simultaneously.
  • the problem of material spillage and the single direction of LED light illumination improves the light efficiency of the LED bulb, and has good heat dissipation performance, simple structure, high efficiency and low cost.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本申请涉及一种由多个电路板封装模组组合制成的LED灯泡，包括：玻璃泡壳；灯头；驱动电源模组；电路板封装模组；玻璃芯柱；电路板是金属蚀刻后通过注塑定型的电路板、或者是模具冲切金属注塑定型制成的电路板，或者是可折叠的金属基电路板，在电路板上注塑形成反射杯，芯片封装在反射杯里，然后用多个封装模组进行串并联焊接连接在玻璃芯柱上，与玻璃泡壳组装烧结密封，同时充入导热气体密封在玻璃泡壳内，驱动电源模组的电源输出端连接在玻璃芯柱上的电极引线上，电源输入端连接在所述的灯头的电极上，驱动电源模组置放在灯头里，玻璃泡壳与灯头牢固粘接，形成多个电路板封装模组组合制成的LED灯泡。

Description

一种由多个电路板封装模组组合制成的LED灯泡
本申请要求享有申请日为2017年09月22日、申请人为王定锋的中国实用新型专利申请“一种由多个电路板封装模组组合制成的LED灯泡”(申请号为201721287145.X)的优先权，该中国专利申请的全部内容通过引用而结合于本申请中。
技术领域
本申请涉及LED应用领域，具体涉及一种由多个电路板封装模组组合制成的LED灯泡。
背景技术
现在市面上的LED灯泡，通常都是用传统电路板焊接LED灯珠后再折叠成立体多面体模组，成本高，而且制作线路板材料的胶树脂里或/和线路板的阻焊油墨里有小分子物质溢出，当用模组做成灯泡，密封在泡壳里，溢出的小分子物质沉积到玻璃泡壳内表面导致灯泡光衰，市面上也有种条形灯丝组装而成的LED灯泡，条型灯丝点亮时，灯丝条中间的热量高于两头的热量，中间温度高于两端，导致中间的芯片易坏死而死灯，条形灯丝在装在泡壳里，发光后照射角度方向和亮度不一致，导致有暗区。
为了克服以上的和其它的缺陷和不足，本申请提出一种由多个电路板封装模组组合制成的LED灯泡，采用金属蚀刻注塑定型的电路板、或者是模具冲切金属注塑定型制成的电路板，或者是可折叠的金属基电路板，在电路板上注塑形成反射杯，芯片封装在杯反射杯里，然后用多个封装模组进行串并联焊接连接在玻璃芯柱上，其制成的LED灯泡，同时解决了小分子物质溢出问题和LED光照射方向单一的问题，提高了LED灯泡的光效，并且散热性能好，结构简单，效率高，成本低。
发明内容
本申请涉及一种由多个电路板封装模组组合制成的LED灯泡，包括：玻璃泡壳；灯头；驱动电源模组；电路板封装模组；玻璃芯柱；电路板是金属蚀刻后通过注塑定型的电路板、或者是模具冲切金属注塑定型制成的电路板，或者是可折叠的金属基电路板，在电路板上注塑形成反射杯，芯片封装在反射杯里，然后用多个封装模组进行串并联焊接连接在玻璃芯柱上，与玻璃泡壳组装烧结密封，同时充入导热气体密封在玻璃泡壳内，驱动电源模组的电源输出端连接在玻璃芯柱上的电极引线上，电源输入端连接在所述的灯头的电极上，驱动电源模组置放在灯头里，玻璃泡壳与灯头牢固粘接，形成多个电路板封装模组组合制成的LED灯泡。
根据本申请，提供了一种由多个电路板封装模组组合制成的LED 灯泡，包括：玻璃泡壳；灯头；驱动电源模组；电路板封装模组；玻璃芯柱；其中，所述的电路板是金属蚀刻后通过注塑定型的电路板、或者是模具冲切金属注塑定型制成的电路板，或者是可折叠的金属基电路板，在电路板上设置有通过注塑形成的反射杯，芯片封装在反射杯里形成电路板封装模组，然后用多个封装模组进行串或者并联或者串并结合焊接连接在玻璃芯柱上，与所述的玻璃泡壳组装烧结密封，同时向玻璃泡壳充入导热气体密封在玻璃泡壳内，所述的驱动电源模组的电源输出端连接在玻璃芯柱上的电极引线上，电源输入端连接在所述的灯头的电极上，驱动电源模组置放在灯头里，玻璃泡壳与灯头牢固粘接，形成多个电路板封装模组组合制成的LED灯泡。
根据本申请的一实施例，所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，所述的导热气体，其主要成份为氦气的导热气体。
根据本申请的一实施例，所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，所述的多个封装模组进行串并联焊接连接在玻璃芯柱上的模组数量为2～12个，是2或者4或者6或者8或者10或者12个。
根据本申请的一实施例，所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，模组之间的连接是串联，或者是并联，或者是先串后并联，或者是先并后串。
根据本申请的一实施例，所述的一种由多个电路板封装模组组合 制成的LED灯泡，其中，一个模组是一个平面，或者是折弯成了多面体，或者折弯成了曲面。
根据本申请的一实施例，所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，模组的形状是中间大两头小。
根据本申请的一实施例，所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，多个模组组装在芯柱上，形成橄榄形。
在以下对附图和具体实施方式的描述中，将阐述本申请的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书，本申请的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。
图1是模具冲切金属注塑定型制成的电路板的示意图。
图2是封装后折弯分切成单个封装模组的示意图。
图3是多个电路板封装模组组合制成的LED灯泡的示意图。
具体实施方式
下面将以优选实施例为例来对本申请进行详细的描述。
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本申请的权利要求并不具有任何限制。
如图1所示，根据设计的资料，用0.25mm厚的金属带，在虹瑞 支架冲床上用模具冲切除去不需要的哪部分金属，制作成雏形电路板1，然后在后序需要焊线和LED芯片发光反光的位置处进行电镀银表面处理，接下来在日精注塑机上用设计制作好的注塑模具进行注塑，在设计预定的位置注入塑料形成固定支撑2，同时在需要封装LED芯片的位置处形成反射杯2.1，然后在虹瑞的切脚冲床上用模将起作连接支撑作用的预断连接点冲切除去，制作成注塑塑料支撑固定定型的电路板。在佑光DB382固晶机上，将LED芯片固晶在反射杯2.1中，烘烤固化，然后通过ASM-AB350焊线机用金属焊线将LED芯片与电路板焊线连接起来，将含有荧光粉的封装胶水用点胶机均匀的点在反射杯2.2内，烘烤固化后，制作成多片连片的电路板封装模组，然后用模具除去两边的边框1.1，同时分切折弯成如图2所示的单个封装模组。
将如图2所示的6个单个封装模组分别焊接组装在玻璃芯柱3上，然后置入玻璃泡壳4内，与玻璃泡壳4烧结密封，同时充入起导热作用的氦气密封在玻璃泡壳4内，将驱动电源模组5的电源输出端连接在玻璃芯柱上的电极引线上，电源输入端连接在所述的灯头6的电极上，驱动电源模组置放在灯头6里，玻璃泡壳4与灯头6牢固粘接，制作成由6个电路板封装模组形成的LED灯泡(如图3所示)。
本申请的一种由多个电路板封装模组组合制成的LED灯泡，采用金属蚀刻注塑定型的电路板、或者是模具冲切金属注塑定型制成的电路板，或者是可折叠的金属基电路板，在电路板上注塑形成反射杯， 芯片封装在杯反射杯里，然后用多个封装模组进行串并联焊接连接在玻璃芯柱上，其制成的LED灯泡，同时解决了小分子物质溢出问题和LED光照射方向单一的问题，提高了LED灯泡的光效，并且散热性能好，结构简单，效率高，成本低。
以上结合附图将一种由多个电路板封装模组组合制成的LED灯泡的具体实施例对本申请进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本用新型的范围，尤其是权利要求的范围，并不具有任何限制。

Claims (7)

  1. 一种由多个电路板封装模组组合制成的LED灯泡，包括：
    玻璃泡壳；
    灯头；
    驱动电源模组；
    电路板封装模组；和
    玻璃芯柱；
    其中，所述的电路板是金属蚀刻后通过注塑定型的电路板、或者是模具冲切金属注塑定型制成的电路板，或者是可折叠的金属基电路板，在电路板上设置有通过注塑形成的反射杯，芯片封装在反射杯里形成电路板封装模组，然后用多个封装模组进行串或者并联或者串并结合焊接连接在玻璃芯柱上，与所述的玻璃泡壳组装烧结密封，同时向玻璃泡壳充入导热气体密封在玻璃泡壳内，所述的驱动电源模组的电源输出端连接在玻璃芯柱上的电极引线上，电源输入端连接在所述的灯头的电极上，驱动电源模组置放在灯头里，玻璃泡壳与灯头牢固粘接，形成多个电路板封装模组组合制成的LED灯泡。
  2. 根据权利要求1所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，所述的导热气体是主要成份为氦气的导热气体。
  3. 根据权利要求1所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，所述的多个封装模组进行串并联焊接连接在玻璃芯柱上的模组数量为2～12个，是2或者4或者6或者8或者10或 者12个。
  4. 根据权利要求1所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，模组之间的连接是串联，或者是并联，或者是先串联后并联，或者是先并联后串联。
  5. 根据权利要求1所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，一个模组是一个平面，或者是折弯成了多面体，或者折弯成了曲面。
  6. 根据权利要求1所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，模组的形状是中间大两头小。
  7. 根据权利要求1所述的一种由多个电路板封装模组组合制成的LED灯泡，其中，多个模组组装在芯柱上，形成橄榄形。
PCT/CN2018/106896 2017-09-22 2018-09-21 一种由多个电路板封装模组组合制成的led灯泡 WO2019057143A1 (zh)

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