WO2019047959A1 - 一种金属多面体的led封装模组 - Google Patents

一种金属多面体的led封装模组 Download PDF

Info

Publication number
WO2019047959A1
WO2019047959A1 PCT/CN2018/104912 CN2018104912W WO2019047959A1 WO 2019047959 A1 WO2019047959 A1 WO 2019047959A1 CN 2018104912 W CN2018104912 W CN 2018104912W WO 2019047959 A1 WO2019047959 A1 WO 2019047959A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
circuit board
plastic
led
hole
Prior art date
Application number
PCT/CN2018/104912
Other languages
English (en)
French (fr)
Inventor
王定锋
徐文红
Original Assignee
王定锋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 王定锋 filed Critical 王定锋
Publication of WO2019047959A1 publication Critical patent/WO2019047959A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of LED applications, and in particular, to a metal polyhedron LED package module.
  • the conventional circuit board is used to solder the LED lamp beads and then folded to form a multi-body module, which is costly, and there is a small molecular substance overflow in the glue resin of the circuit board material, or/and the solder mask ink of the circuit board.
  • the bulb is made of a module and sealed in the bulb, and the overflowing small molecular substance is deposited on the inner surface of the glass bulb to cause the bulb to decay.
  • the applicant's prior invention patent number "201220381225.2” LED circuit module is only a flat bracket plate package, without folding to form a body polyhedron, resulting in a single illumination direction of the LED light, uneven, can not achieve LED light into three-dimensional space Ambient illumination, some places form dark spots.
  • a metal polyhedral LED package module of the present application adopts a circuit board which is formed by injection molding a metal plate, and then packages the LED chip and/or the soldering component to be folded into a polyhedron.
  • the three-dimensional structure, the LED bulb produced by the same solves the problem of small molecular substance overflow problem and single direction of LED light irradiation, improves the light efficiency of the LED bulb, and has good heat dissipation performance, simple structure, high efficiency and low cost.
  • the present application relates to a metal polyhedron LED package module.
  • the metal plate is made into a circuit board supported by injection molded plastic, and then the LED chip and/or the soldered LED element are packaged, folded to form a polyhedral three-dimensional structure, and folded.
  • the fixing is fixed by the following fixed methods: the first and last metal are welded together; or the metal connecting piece on one side is fastened to the plastic surface on the other side, or buckled in the hole or half hole; or the plastic buckle on one side
  • the button is fastened to the hole or half hole of the plastic hole; or the metal buckle is fastened to the metal hole or half hole of the other side to form a metal polyhedron LED package module.
  • a metal polyhedron LED package module comprising: a metal circuit board supported by injection molded plastic; an LED chip packaged on a metal circuit board; and/or a soldered LED component; wherein the metal plate is made A circuit board supported by injection molding is provided with no plastic support on the folded fold line, and the LED chip and/or the soldering component are packaged on the circuit board, folded into a multi-faceted three-dimensional structure, and the folded metal between the back and the face is folded.
  • the connecting ribs are connected together, and the first and last joints after folding are fixed by the following fixing methods: the first and last metal pieces are fixed together by welding, or the metal connecting piece of one side is fastened to the plastic surface of the other side or buckled in the hole or the half hole Inside, or a plastic buckle to the plastic hole or half hole in the other side, or a metal buckle to the metal hole or half hole of the other side, or a metal connecting piece on the other side The surface of the metal.
  • a metal polyhedral LED package module wherein the metal circuit board supported by injection molding plastic is provided with an injection molded plastic reflective cup at a position of the packaged LED chip.
  • a metal polyhedral LED package module wherein the LED chip packaged on a metal circuit board is a front-mounted wire-bonding chip or a flip-chip soldered on a circuit The chip, or a CSP chip soldered to the holder.
  • the metal polyhedral LED package module wherein the metal circuit board supported by the injection molding plastic can directly solder the power driving component to the circuit board.
  • a metal polyhedral LED package module wherein the LED package module is used for manufacturing a light bulb.
  • Figure 1 is a schematic illustration of a metal circuit board supported by injection molded plastic.
  • Fig. 2 is a schematic view showing the bonding of a bonding wire on a metal circuit board.
  • FIG. 3 is a perspective view of a metal polyhedral LED package module.
  • FIG. 4 is a schematic cross-sectional view showing the manner in which the end-to-end joints of the LED package module are folded into a polyhedron by welding the first and last metal together, and the metal connecting piece is fastened to the surface of the metal on the other side.
  • FIG. 5 is a schematic cross-sectional view showing the manner in which the end of the LED package module is folded into a polyhedron and the metal tabs on one side are fastened to the plastic surface on the other side.
  • FIG. 6 is a schematic cross-sectional view showing the manner in which the LED package module is folded into a polyhedron and the end-to-end joints are fixed by a plastic buckle to the plastic buckle hole of the other side.
  • FIG. 7 is a schematic cross-sectional view showing the manner in which the LED package module is folded into a polyhedron and the end-to-end joints are fastened by a metal buckle to the metal buttonhole of the other side.
  • the metal plate is punched out with a pre-designed die to remove the unnecessary metal, and the metal connecting piece buckle is punched out on the side of the end-to-end joint after the subsequent folding.
  • the metal plate is punched out with a pre-designed die to remove the unnecessary metal, and the metal connecting piece buckle is punched out on the side of the end-to-end joint after the subsequent folding.
  • the bonding circuit between the metal circuits is connected, and the sealing glue containing the phosphor is evenly spotted in the reflecting cup 2.2, and after baking and solidifying, the semi-finished product of the metal polyhedron LED packaging module as shown in FIG. 2 is fabricated. .
  • the semi-finished product of the LED package module shown in FIG. 2 is folded into a three-dimensional structure of a polyhedron as shown in FIG. 3, and the folded back and the surface are connected by a bent metal connecting rib 1.1, and the folded first and last phases are
  • the metal connecting piece buckle 1.2 on one side of the joint is firmly fixed in the plastic pin hole 2.1 on the other side to form a metal polyhedron LED package module (as shown in FIG. 3).
  • the fixing manner of the folded end-to-end joints can also be fixed by the following fixing manner: the first and last tail metals 1a, 1b are fixed together in the manner shown in FIG. 4; the metal connecting piece 1b of one side as shown in FIG.
  • a metal polyhedral LED package module of the present application the metal plate is made into a circuit board supported by injection molding, and then the LED chip and/or the soldering component are packaged, folded into a multi-faceted three-dimensional structure, and the LED bulb is manufactured at the same time.
  • the problem of small molecular substance overflow and the single direction of LED light irradiation is solved, the light effect of the LED light bulb is improved, the heat dissipation performance is good, the structure is simple, the efficiency is high, and the cost is low.

Abstract

一种金属多面体的LED封装模组，将金属板制成用注塑进行支撑的电路板，在折叠折线位置上不设置塑料支撑（2），在所述电路板上封装LED芯片（3）和/或焊接元件，折叠成多面体的立体结构，折叠后面与面间由折弯的金属连接筋（1.1）连接在一起，在折叠后的首尾相接处，采取以下固定方式进行固定：首尾金属（1a、1b）焊接在一起固定，或者是一边的金属连接片（1b）扣在另一边的塑料（2a）表面或者扣在孔或半孔里，或者一边塑料的扣钉（2b）扣到另一边塑料的孔或半孔（2a）里，或者是一边金属的扣钉（1b）扣到另一边金属的孔或半孔（1a）里，或者是一边金属的连接片（1b）扣在另一边金属（1a）的表面，形成一种金属多面体的LED封装模组。

Description

一种金属多面体的LED封装模组
本申请要求享有申请日为2017年09月11日、申请人为王定锋的中国实用新型专利申请″一种金属多面体的LED封装模组″(申请号为201721198576.9)的优先权，该中国专利申请的全部内容通过引用而结合于本申请中。
技术领域
本申请涉及LED应用领域，具体涉及一种金属多面体的LED封装模组。
背景技术
现在市面上用传统电路板焊接LED灯珠后再折叠成立体多面体模组，成本高，而且制作线路板材料的胶树脂里、或/和线路板的阻焊油墨里有小分子物质溢出，当用模组做成灯泡，密封在泡壳里，溢出的小分子物质沉积到玻璃泡壳内表面导致灯泡光衰。
本申请人的之前发明的专利号为“201220381225.2”的LED电路模组，只是一个平面的支架板封装，没有折叠成立体多面体，导致LED光照射方向单一，不均匀，不能实现LED发光向三维空间周围照射， 一些地方形成暗点。
为了克服以上和其它的缺陷和不足，本申请的一种金属多面体的LED封装模组，采用将金属板制成用注塑进行支撑的电路板，然后封装LED芯片和/或焊接元件，折叠成多面体的立体结构，其制作的LED灯泡，同时解决了小分子物质溢出问题和LED光照射方向单一的问题，提高了LED灯泡的光效，并且散热性能好，结构简单，效率高，成本低。
发明内容
本申请涉及一种金属多面体的LED封装模组，具体而言，将金属板制成用注塑塑料支撑的电路板，然后封装LED芯片和/或焊接LED元件，折叠形成多面体的立体结构，在折叠后的首尾相接处，采取以下固定方式进行固定：首尾金属焊接在一起固定；或者是一边的金属连接片扣在另一边的塑料表面、或者扣在孔或半孔里；或者一边塑料的扣钉扣到另边塑料的孔或半孔里；或者是一边金属的扣钉扣到另一边金属的孔或半孔里，形成一种金属多面体的LED封装模组。
根据本申请提供了一种金属多面体的LED封装模组，包括：用注塑塑料支撑的金属电路板；封装在金属电路板上的LED芯片、和/或焊接LED元件；其中，将金属板制成用注塑进行支撑的电路板，在折叠折线位上不设置塑料支撑，在所述电路板上封装LED芯片和/或焊接元件，折叠成多面体的立体结构，折叠后面与面间由折弯的金属 连接筋连接在一起，在折叠后的首尾相接处，采取以下固定方式进行固定：首尾金属焊接在一起固定，或者是一边的金属连接片扣在另一边的塑料表面或者扣在孔或半孔里，或者一边塑料的扣钉扣到另一边塑料的孔或半孔里，或者是一边金属的扣钉扣到另一边金属的孔或半孔里，或者是一边金属的连接片扣在另一边金属的表面。
根据本申请的一实施例，所述的一种金属多面体的LED封装模组，其中，所述用注塑塑料支撑的金属电路板，在封装LED芯片位置处设置有注塑塑料反射杯。
根据本申请的一实施例，所述的一种金属多面体的LED封装模组，其中，所述封装在金属电路板上的LED芯片，是正装打线芯片、或者是焊接在电路上的倒装芯片、或者是焊接在支架上的CSP芯片。
根据本申请的一实施例，所述的一种金属多面体的LED封装模组，其中，用注塑塑料支撑的金属电路板，可将电源驱动元件直接焊接在电路板上。
根据本申请的一实施例，所述的一种金属多面体的LED封装模组，其中，所述的LED封装模组用于灯泡的制作。
在以下对附图和具体实施方式的描述中，将阐述本申请的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书，本申请的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。
图1是用注塑塑料支撑的金属电路板的示意图。
图2是在金属电路板上固晶焊线后的示意图。
图3是金属多面体的LED封装模组的立体示意图。
图4是LED封装模组折叠成多面体后的首尾相接处采用首尾金属焊接在一起，和一边金属的连接片扣在另一边金属的表面的方式固定的截面示意图。
图5是LED封装模组折叠成多面体后的首尾相接处采用一边的金属连接片扣在另一边的塑料表面的方式固定的截面示意图。
图6是LED封装模组折叠成多面体后的首尾相接处采用一边塑料的扣钉扣到另一边塑料扣孔里的方式固定的截面示意图。
图7是LED封装模组折叠成多面体后的首尾相接处采用一边金属的扣钉扣到另一边金属的扣孔里的方式固定的截面示意图。
具体实施方式
下面将以优选实施例为例来对本申请进行详细的描述。
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本申请的权利要求并不具有任何限制。
如图1所示，根据设计的资料，将金属板用预先设计好的模具冲切除去不需要的金属，并在后序折叠后的首尾相接处的一边冲切加工 出金属连接片扣1.2，制作成电路板雏形1，然后在后序需要焊线和LED芯片发光反光的位置处的表面进行电镀银处理，接下来在日精注塑机上将镀银处理后的电路板置入注塑模具中，注入原料注塑，在设计预定的位置形成塑料支撑2，和在需要封装LED芯片的位置处形成反射杯2.2，和在后序折叠后的首尾相接处的另一边形成与金属连接片扣1.2配套的塑料扣孔2.1，在后序折叠折线位置1.1处不设置塑料支撑，制作成用注塑塑料支撑的金属电路板。然后在佑光DB382固晶机上，将LED芯片3固晶在电路板上的反射杯2.2内，烘烤固化，然后通过ASM-AB350焊线机用金属焊线4将芯片与芯片之间和芯片与金属电路之间焊线连接，将含有荧光粉的封装胶水用点胶机均匀的点在反射杯2.2内，烘烤固化后，制作成如图2所示的金属多面体的LED封装模组的半成品。
将如图2所示的LED封装模组的半成品用模具折叠成如图3所示的多面体的立体结构，折叠后面与面间由折弯的金属连接筋1.1连接在一起，折叠后的首尾相接处的一边的金属连接片扣1.2扣在另一边的塑料扣孔2.1里牢固固定成型，制作成金属多面体的LED封装模组(如图3所示)。当然折叠后的首尾相接处的固定方式还可以采取以下固定方式进行固定：如图4所示的首尾金属1a、1b焊接在一起的方式固定；如图5所示的一边的金属连接片1b扣在另一边的塑料2a表面的方式固定；如图6所示的一边塑料的扣钉2b扣到另一边塑料扣孔2a里的方式固定；如图7所示的一边金属的扣钉1b扣到另一边 金属的扣孔1a里的方式固定；如图4所示的一边金属的连接片1b扣在另一边金属1a的表面的方式固定。
本申请的一种金属多面体的LED封装模组，将金属板制成用注塑进行支撑的电路板，然后封装led芯片和/或焊接元件，折叠成多面体的立体结构，其制作的LED灯泡，同时解决了小分子物质溢出问题和LED光照射方向单一的问题，提高了LED灯泡的光效，并且散热性能好，结构简单，效率高，成本低。
以上结合附图将一种金属多面体的LED封装模组的具体实施例对本申请进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本用新型的范围，尤其是权利要求的范围，并不具有任何限制。

Claims (5)

  1. 一种金属多面体的LED封装模组，包括：
    用注塑塑料支撑的金属电路板；
    封装在金属电路板上的LED芯片和/或焊接的LED元件；
    其中，将金属板制成用注塑进行支撑的电路板，在折叠折线位上不设置塑料支撑，在所述电路板上封装LED芯片和/或焊接元件，折叠成多面体的立体结构，折叠后的面与面之间由折弯的金属连接在一起，在折叠后的首尾相接处，采取以下固定方式进行固定：首尾金属焊接在一起固定，或者是一边的金属连接片扣在另一边的塑料表面，或者一边金属的扣钉扣在另一边的塑料孔或半孔里，或者一边塑料的扣钉扣到另一边塑料的孔或半孔里，或者是一边金属的扣钉扣到另一边金属的孔或半孔里，或者是一边金属的连接片扣在另一边金属的表面。
  2. 根据权利要求1所述的一种金属多面体的LED封装模组，其中，所述用注塑塑料支撑的金属电路板在封装LED芯片位置处设置有注塑塑料反射杯。
  3. 根据权利要求1所述的一种金属多面体的LED封装模组，其中，所述封装在金属电路板上的LED芯片是正装打线芯片、或者是焊接在电路上的倒装芯片、或者是焊接在支架上的CSP芯片。
  4. 根据权利要求1所述的一种金属多面体的LED封装模组，其中，用注塑塑料支撑的金属电路板，可将电源驱动元件直接焊接在电 路板上。
  5. 根据权利要求1所述的一种金属多面体的LED封装模组，其中，所述的LED封装模组用于灯泡的制作。
PCT/CN2018/104912 2017-09-11 2018-09-10 一种金属多面体的led封装模组 WO2019047959A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201721198576.9U CN207353245U (zh) 2017-09-11 2017-09-11 一种金属多面体的led封装模组
CN201721198576.9 2017-09-11

Publications (1)

Publication Number Publication Date
WO2019047959A1 true WO2019047959A1 (zh) 2019-03-14

Family

ID=62410154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/104912 WO2019047959A1 (zh) 2017-09-11 2018-09-10 一种金属多面体的led封装模组

Country Status (2)

Country Link
CN (1) CN207353245U (zh)
WO (1) WO2019047959A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207353245U (zh) * 2017-09-11 2018-05-11 王定锋 一种金属多面体的led封装模组
CN207349841U (zh) * 2017-09-22 2018-05-11 王定锋 一种由多个电路板封装模组组合制成的led灯泡

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202927518U (zh) * 2012-07-19 2013-05-08 王定锋 三维发光的led灯泡模组
CN203784697U (zh) * 2014-03-27 2014-08-20 四川新力光源股份有限公司 一种球泡灯
JP2016115645A (ja) * 2014-12-18 2016-06-23 岩崎電気株式会社 Ｌｅｄランプ
CN106402681A (zh) * 2016-10-17 2017-02-15 漳州立达信光电子科技有限公司 发光二极管照明装置
CN207353245U (zh) * 2017-09-11 2018-05-11 王定锋 一种金属多面体的led封装模组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202927518U (zh) * 2012-07-19 2013-05-08 王定锋 三维发光的led灯泡模组
CN203784697U (zh) * 2014-03-27 2014-08-20 四川新力光源股份有限公司 一种球泡灯
JP2016115645A (ja) * 2014-12-18 2016-06-23 岩崎電気株式会社 Ｌｅｄランプ
CN106402681A (zh) * 2016-10-17 2017-02-15 漳州立达信光电子科技有限公司 发光二极管照明装置
CN207353245U (zh) * 2017-09-11 2018-05-11 王定锋 一种金属多面体的led封装模组

Also Published As

Publication number Publication date
CN207353245U (zh) 2018-05-11

Similar Documents

Publication Publication Date Title
TW560045B (en) Surface mountable optocoupler package
JP5731674B2 (ja) 上面接続部のみを有するフォトン構成デバイス
JP2014057101A (ja) パッケージ回路、及び集積回路をパッケージングする方法
US20130292812A1 (en) Lead frame for semiconductor device and semiconductor device package using the lead frame
JP2008300553A (ja) 表面実装型発光ダイオードのフレーム組合せ部材の製造方法及びその構造
WO2009079892A1 (fr) Grille de connexion à del et procédé de fabrication des del à l'aide de la grille de connexion
WO2012113249A1 (zh) Led封装支架结构及led器件
US20130099275A1 (en) Led package and method of making the same
WO2019047959A1 (zh) 一种金属多面体的led封装模组
CA2428401A1 (en) Adhesive type led lead frame
TWI482320B (zh) 具有藉由單一囊封材料圍繞的反射體杯狀物之引線框架晶片載體封裝
CN107785474A (zh) 发光二极管元件装置与其制作方法
EP2639841A1 (en) Light-emitting device, and method for manufacturing circuit board
JP2593702B2 (ja) 半導体装置の製造方法
CN204424311U (zh) 一种终端、led闪光灯及其支架、模组
CN108400218B (zh) 一种基于csp型式的led封装方法
CN203910845U (zh) 一种朗伯型led大功率封装结构
TWI424549B (zh) 改良導線的二極體封裝及其製作方法
CN208655679U (zh) 一种倒装led器件
TW495936B (en) LED package
WO2018058924A1 (zh) 一种带环形灯丝的立体led封装模组
JPS62202574A (ja) Ｌｅｄランプ及びその製法
CN209981213U (zh) 一种led器件
JPH05145121A (ja) 発光ダイオードの実装構造
CN207349841U (zh) 一种由多个电路板封装模组组合制成的led灯泡

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18853555

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18853555

Country of ref document: EP

Kind code of ref document: A1