WO2019047751A1 - 板材及其制备方法、制备板材的装置和电子设备 - Google Patents

板材及其制备方法、制备板材的装置和电子设备 Download PDF

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Publication number
WO2019047751A1
WO2019047751A1 PCT/CN2018/102906 CN2018102906W WO2019047751A1 WO 2019047751 A1 WO2019047751 A1 WO 2019047751A1 CN 2018102906 W CN2018102906 W CN 2018102906W WO 2019047751 A1 WO2019047751 A1 WO 2019047751A1
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WO
WIPO (PCT)
Prior art keywords
layer
sub
substrate
coating layer
sublayer
Prior art date
Application number
PCT/CN2018/102906
Other languages
English (en)
French (fr)
Inventor
黄志勇
杨光明
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201721144662.1U external-priority patent/CN207388443U/zh
Priority claimed from CN201710797448.4A external-priority patent/CN107718815A/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019047751A1 publication Critical patent/WO2019047751A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties

Definitions

  • the present application relates to the field of electronic device manufacturing, and in particular to a sheet material and a method of preparing the same, an apparatus for preparing a sheet material, and an electronic device.
  • the housing materials for electronic devices are also enriched.
  • sheet metal has a more beautiful texture, wear resistance and scratch resistance, and is widely used in electronic devices such as mobile phones and tablet computers.
  • materials such as plastics and glass are also used to prepare housings for electronic devices.
  • users are increasingly demanding the appearance of metal casings. Therefore, in addition to the need to have a certain mechanical strength to protect electronic equipment, and to have certain heat dissipation and scratch resistance, the current electronic device housing needs to be able to form a variety of colors, textures, etc., to enrich the appearance of the electronic device. .
  • the present application proposes a method of making a sheet.
  • the method includes providing a coating layer including an adhesive sub-layer, a color sub-layer, and a hard sub-layer, the color sub-layer being disposed on the adhesive sub-layer and Between the hard sub-layers; the coating layer is hot pressed against the surface of the substrate, wherein the adhesive sub-layer of the coating layer is in contact with the substrate.
  • the application proposes a sheet material prepared by the method described above.
  • the present application provides a sheet material comprising: a substrate, the material forming the substrate comprising at least one of metal, plastic, and glass; and a coating layer, the covering
  • the film layer includes an adhesive sub-layer, a color sub-layer, and a hard sub-layer disposed between the adhesive sub-layer and the hard sub-layer, the adhesive sub-layer and the lining Bottom contact.
  • the present application proposes an electronic device housing (mobile terminal housing).
  • the housing is made of the sheet material previously described.
  • the present application provides an apparatus for making a sheet.
  • the apparatus includes: a substrate processing unit; a film thermal compression unit, the film thermal compression unit being coupled to the substrate processing unit, and adapted to heat press the coating layer to a substrate processed by the substrate processing unit, wherein the coating layer includes an adhesive sub-layer, a color sub-layer, and a hard sub-layer, the color sub-layer being disposed on the adhesive sub-layer and the hard Between the sublayers, the adhesive sublayer of the coating layer is in contact with the substrate.
  • the present application proposes an electronic device.
  • the electronic device includes: a body; and a housing, at least a portion of which is made of the sheet material described above. At least a portion of the housing is made of sheet material obtained by the method previously described, or obtained using the apparatus previously described; or the housing is a shell as described above body.
  • FIG. 1 shows a flow chart of a method of preparing a board according to an embodiment of the present application
  • FIG. 2 shows a flow chart of a method of preparing a board according to another embodiment of the present application
  • FIG. 3 shows a flow chart of a method of preparing a board according to still another embodiment of the present application
  • Figure 6 shows a schematic structural view of a sheet material according to an embodiment of the present application
  • Figure 7 shows a schematic structural view of a sheet material according to still another embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 9 is a schematic structural view of an apparatus for preparing a board according to an embodiment of the present application.
  • FIG. 10 is a schematic structural view of a coating layer processing unit according to an embodiment of the present application.
  • Figure 11 is a schematic view showing the structure of a film lamination unit according to an embodiment of the present application.
  • 10 adhesive sublayer; 20: color sublayer; 30: hard sublayer; 40: process auxiliary sublayer; 50: release film sublayer; 110: coating layer; 120: substrate; 200: housing; 510: clamp; 520: second heating member; 410: table; 420: vacuum hot pressing mold; 300: substrate processing unit; 400: film hot pressing unit; 430: vacuum pump; 440: heating 450; a closed cavity structure; 500: a coating layer processing unit; 2000: a device for preparing a sheet; 1000: an electronic device.
  • the commonly used surface treatment methods include spray coating, oxidation, coating, etc., but these methods have certain limitations and cannot be applied to a variety of shell materials: for example, spray coating, mainly used for plastic surfaces. Processing, and spraying method mainly achieves different appearance effects by spraying paint, so it is difficult to realize the color of metal and the appearance of metallic luster, and it is also difficult to form a textured visual effect; and anodizing can be used not only for processing metal-formed shells Body, and there are certain restrictions on the specific type of metal. For example, die-cast aluminum alloy cannot be treated by anodizing. For the treatment of die-cast aluminum alloy, it is generally sprayed or electrophoresed.
  • the above treatment method will affect the appearance of the metal itself, and the spraying cost is high due to the die casting sand hole. Therefore, if a housing processing method which can be applied to a plurality of materials and has a rich appearance effect can be provided, the above problem can be greatly alleviated.
  • the present application proposes a method of making a sheet.
  • the method includes:
  • the coating layer may comprise a plurality of sub-layer structures.
  • the coating layer may sequentially include an adhesive sub-layer, a color sub-layer, and a hard sub-layer, that is, the color sub-layer is disposed between the adhesive sub-layer and the hard sub-layer.
  • the subsequent sub-layer may be formed of a material having a viscosity which achieves a bonding effect to bond the film layer to the substrate in a subsequent step.
  • the colored sub-layers can be sub-layers printed with different patterns or colors to provide an appearance to the sheet.
  • the hard sub-layer not only provides protection for the colored sub-layer, but also forms a structure having a certain texture on the hard sub-layer by means such as mold transfer, thereby improving the tactile sensation of the sheet.
  • the coating layer can form different textures, colors, and the like, and can be easily composited onto a substrate formed of different materials.
  • the coating layer may be formed by the following steps:
  • a hard sublayer can be formed first.
  • a hard sub-layer can be formed on a table such as a mold or a flat plate.
  • the specific preparation method of the hard sub-layer is not particularly limited as long as a film layer having a certain protective function and hardness can be realized.
  • a UV layer can be used, which is a hard sub-layer.
  • the hard sub-layer may be formed by techniques including, but not limited to, ink printing techniques and mold transfer techniques.
  • the hard sub-layer can serve as the outermost protective layer of the coating layer.
  • mold transfer may be used to form a structure having a certain texture on the hard sub-layer, that is, the hard sub-layer is formed into a three-dimensional (3D) texture structure, thereby achieving a tactile texture effect.
  • a process auxiliary sublayer is formed on the surface of the hard sublayer.
  • the process auxiliary sub-layer may facilitate the removal of the hard sub-layer from the mold or the flat sheet, and may be on the other side of the hard sub-layer, that is, the side of the hard sub-layer that is in contact with the mold. Subsequent sublayer structures were prepared.
  • the process auxiliary layer may be covered on the hard sub-layer, and after curing, the subsequent steps may be performed.
  • the hard sub-layer and the process auxiliary sub-layer are peeled off from the mold after the mold surface is cured. Thereby, the hard sub-layer can be easily separated from the mold or the flat plate.
  • a color sub-layer and a colorant sub-layer are sequentially formed on the side of the hard sub-layer away from the process auxiliary sub-layer.
  • the color sub-layer may be a lacquer layer having a certain color or a printed pattern.
  • the specific thickness of the color sub-layer is not particularly limited, and those skilled in the art can design the thickness of the color sub-layer according to the appearance effect desired.
  • an adhesive sublayer was prepared on the side of the color sublayer away from the hard sublayer.
  • the subsequent sublayer may be formed by spraying or applying an adhesive.
  • the specific material of the adhesive sub-layer is not particularly limited, and a material having a better bonding ability may be selected to form an adhesive sub-layer according to a specific material of the substrate, so as to ensure the coating layer and the substrate. The degree of bonding between the two.
  • the process auxiliary sub-layer formed above may also be peeled off by adding a release film sub-layer, thereby allowing the final plate to include only hard sub-layers, color sub-layers,
  • the structure of the sub-layer of the agent further facilitates further enhancing the appearance of the sheet.
  • the foregoing process may be implemented by the following steps:
  • a release film sublayer is disposed on the surface of the hard sublayer away from the mold. Thereby, it is advantageous for the subsequent process to assist the peeling of the sublayer. Subsequently, on the release film sublayer, a process auxiliary sublayer is formed and subjected to subsequent treatment.
  • the previously prepared coating layer is composited with the substrate.
  • the adhesive sublayer of the coating layer is brought into contact with the substrate, and the coating layer is tightly bonded to the substrate by hot pressing. It will be understood by those skilled in the art that the coating layer is adhered to the substrate by a heat-pressing process through the adhesive sub-layer.
  • the term "hot pressing” specifically refers to laminating a coating layer to a surface of a substrate through an adhesive sublayer under heating. That is to say, under the heating and a certain pressure, the adhesive sublayer in the coating layer is brought into contact with the substrate to realize the bonding of the coating layer and the substrate.
  • the specific processing parameters of the above hot pressing are not particularly limited.
  • the coating layer may be formed on the surface of the substrate by vacuum hot pressing.
  • hot pressing should be understood in a broad sense, that is, heating and pressing can be carried out stepwise or simultaneously; heat treatment can be performed first, followed by heat treatment of the coating layer at a certain pressure
  • the film is bonded to the surface of the substrate; or the film layer and the substrate may be heat treated while being pressed.
  • the coating layer may be heat treated in advance before the pressing is performed to soften the coating layer while restoring the adhesiveness of the bonding sublayer, so that the flexible coating layer can be better adhered to the substrate. surface.
  • the temperature and time of the heat treatment are not particularly limited, and may be selected according to the material of the coating layer.
  • the temperature of the heat treatment may be 80-140 ° C.
  • the temperature of the heat treatment when in the coating layer When the PO (polyolefin copolymer) is contained in the sublayer structure, the temperature of the heat treatment may be about 120 ° C, and the heating time may be about 60 seconds.
  • the above heat treatment may be performed before the press-fitting, or the above-described heat treatment may be simultaneously performed on the film layer during the press-bonding process.
  • the coating layer may be heat-treated in advance, and then the film may be laminated on the surface of the substrate while maintaining the heating temperature.
  • the film layer subjected to the heat softening treatment may be placed on the surface of the substrate, and the film layer and the substrate may be placed in a sealed space to be pressurized or evacuated (negative pressure).
  • the adhesive sub-layer having a viscosity can be closely attached to the surface of the substrate during pressurization or vacuuming.
  • the pressure of the pressurization and the degree of vacuum of the vacuum can be selected according to the structure of the product. For example, when the side curvature of the product is large, 12-15 kg of force can be used, and at the same time, after vacuum treatment, the airtightness is sealed. The degree of vacuum in the space is -1 atmosphere. Thereby, the tight bonding between the coating layer and the substrate can be achieved, and the excessive pressure and the sub-layer of the coating can be avoided.
  • the substrate and the coating layer may be simultaneously heat-treated during the above-mentioned pressing or vacuuming process, so that the bonding of the coating layer to the substrate may be further improved. degree.
  • the specific material of the substrate is not particularly limited.
  • the substrate can include at least one of metal, plastic, and glass.
  • the sublayer of the adhesive in the coating layer is selected depending on the material of the substrate.
  • the coating layer can be provided on the surface of the substrate formed of different materials by a uniform processing method. Therefore, the same set of production lines can be used to realize the operation of laminating different substrates, thereby contributing to reducing the equipment cost of the manufacturer.
  • the specific shape of the plate substrate by the above-mentioned operation can be not particularly limited: since the coating layer is a multilayer structure having a certain toughness, and the bonding mode of the coating layer and the substrate is The heat is pressed, so that the surface of the substrate may have an irregular structure such as a curved surface without affecting the bonding of the coating layer and the substrate.
  • the method can be used to prepare a sheet material for forming a curved shell or a curved cover.
  • the method may further include:
  • the release film sublayer is peeled off from the surface of the hard sublayer. Since the process auxiliary sublayer is formed on the surface of the release film sublayer away from the hard sublayer side, the process auxiliary sublayer and the substrate and the adhesive agent can be realized while peeling off the release film sublayer. Peeling of structures such as layers and color sublayers. Thereby, the process auxiliary sublayer can be easily removed.
  • the above method may include the following steps: Referring to (a) and (b) of FIG. 4, a coating layer 110 is first provided, and the coating layer 110 may include an adhesive. Sublayer, color sublayer, hard sublayer, release film sublayer, and process auxiliary sublayer (not shown).
  • the substrate 120 is placed on the stage 410.
  • the edge of the substrate 120 may be a curved surface, and the table 410 may have a contoured fixed block conforming to the curved edge.
  • the coating layer 110 is fixed by the jig 510 to heat-treat the coating layer 110 by the heating member 520.
  • both the coating layer 110 and the substrate 120 can be placed in a closed cavity structure (not shown). Subsequently, the inside of the chamber is evacuated, and the coating layer 110 is subjected to the above-described heat softening treatment. Then, referring to (c) of FIG. 4, the film layer 110 subjected to the heat softening treatment is placed on the substrate 120. Since the coating layer 110 has been subjected to heat softening treatment, it can be well covered on the substrate 120 having curved edges, and the uniform coating treatment can be performed simultaneously on the planar portion of the substrate 120 and the curved edge. In order to obtain a uniform appearance of the finally obtained sheet.
  • the softened film may be covered on the casing by high pressure and negative pressure and by vacuum hot pressing of the mold 420.
  • the sublayer of the adhesive layer in the coating layer 110 can be melted, and the casing and the coating layer can be bonded together by pressure.
  • the laminated film layer 110 has a curved surface structure conforming to the curved edge of the substrate 120.
  • the coating layer 110 is correspondingly cut (not shown) to obtain a sheet material according to an embodiment of the present application.
  • the process auxiliary sublayer in the coating layer 110 can be peeled off by adding a release film sublayer. Specifically, referring to (e) of FIG. 5, after the release film 110 and the substrate are subjected to hot pressing, the release film sub-layer 50 is removed, and the process auxiliary sub-layer above the release film sub-layer 50 is performed. 40 can achieve the peeling simultaneously. Finally, a sheet 100 that does not contain a process auxiliary sublayer is obtained.
  • the method according to an embodiment of the present application has at least one of the following advantages:
  • a variety of appearances such as metal appearance, printed pattern, three-dimensional texture, etc., can be realized by designing each sub-layer structure of the coating layer;
  • the method can be applied to substrates formed by various materials, which is beneficial to the preparation of the board by using a unified production line, thereby saving equipment costs;
  • the method has no special requirements on the material and shape of the substrate, and can be used for preparing a flat or curved plate.
  • the application proposes a sheet of material.
  • the sheet is prepared by the method described above.
  • the sheet material has all the advantages of the method of preparing the sheet material described above, and will not be described herein.
  • the present application proposes a sheet material.
  • the sheet material may have the same features and advantages as the previously described method, the sheet material obtained, and will not be described again.
  • the board 100 includes a substrate 120 and a coating layer 110 .
  • the film layer 110 may include an adhesive sub-layer 10, a color sub-layer 20, and a hard sub-layer 30 disposed between the adhesive sub-layer 10 and the hard sub-layer 30. Subsequent sublayer 10 is in contact with substrate 120.
  • the film layer 110 and the various sub-layer structures it comprises may have the same structural features and advantages as the ones obtained from the previously described method of preparing the board.
  • the sheet can simultaneously exhibit a three-dimensional texture and a color or a pattern appearance effect, that is, a good appearance such as color and texture.
  • the preparation process of the plate material is simple, and the production cost can be reduced.
  • the specific shape and structure of the substrate 120 are not particularly limited.
  • the surface of the substrate 120 may also have a curved surface.
  • the substrate 120 may be formed of at least one of metal, plastic, and glass.
  • the coating layer 110 of the sheet material 100 may further include a process auxiliary sub-layer 40.
  • the process assist sub-layer 40 can be disposed on the side of the hard sub-layer 30 that is remote from the color sub-layer 20.
  • the addition of the process auxiliary sub-layer 40 to the overcoat layer 110 facilitates the formation of the color sub-layer 20 and the hard sub-layer 30.
  • the sub-layer 40 can be easily peeled off by adding a structure of the release film sub-layer (not shown), thereby obtaining the structure as shown in FIG. Plate 100.
  • the present application proposes an electronic device (mobile terminal) housing.
  • the housing is made of the sheet material previously described.
  • the present application provides an apparatus for making a sheet.
  • the apparatus 2000 for preparing a sheet material includes: a substrate processing unit 300 and a film coating hot pressing unit 400, and the film coating heat pressing unit 400 is connected to the substrate processing unit 300, and is adapted to be covered.
  • the film layer is hot pressed onto the substrate processed through the substrate processing unit.
  • the coating layer includes an adhesive sub-layer, a color sub-layer and a hard sub-layer, the color sub-layer is disposed between the adhesive sub-layer and the hard sub-layer, and the adhesive sub-layer of the coating layer is in contact with the substrate .
  • the apparatus for preparing a sheet material can obtain the above-mentioned coating layer on a sheet material formed of a plurality of materials, and can obtain a sheet material having effects of different textures, colors, and the like, and the implementation process is simple, and the production cost can be reduced.
  • the apparatus for preparing a sheet material may be a sheet material as described above.
  • the coating layer and the substrate used may be the above-mentioned coating layer and substrate, which have all the features and advantages of the above-mentioned coating layer and substrate, and are not Let me repeat.
  • the apparatus 2000 for preparing a sheet further includes a coating layer processing unit 500 including a jig 510 and a second heating member 520.
  • the clamp 510 is suitable for fixing the coating layer, which is advantageous for the implementation of the subsequent process.
  • the second heating member 520 is disposed adjacent to the jig 510 and is adapted to heat the jig 520 and the coating layer. After heat treatment, the adhesive sublayer of the coating layer is softened by heat, so that the coating layer and the substrate can be better bonded in the subsequent process.
  • the coating layer processing unit can easily soften the coating layer and thereby conform to the curved surface of the substrate without performing a special curved surface forming treatment on the coating layer in advance.
  • the jig 510 may be formed of a material having a certain thermal conductivity, for example, may be formed of metal.
  • the heat transfer performance of the metal is relatively good, which is advantageous for the effective heating of the coating layer by the second heating member 520.
  • the metal material is simply processed, which is advantageous for reducing the production cost of the jig 510.
  • the position and number of the second heating members 520 are not particularly limited, and those skilled in the art can design according to actual needs.
  • the jig 510 may include an upper jig and a lower jig for fixing the film layer.
  • the second heating member 520 may also include an upper heating member and a lower heating member respectively disposed on a side of the upper clamp away from the coating layer and a side of the lower clamp away from the coating layer.
  • the film lamination unit 400 may include a table 410, a hot pressing mold (such as the vacuum hot pressing mold 420 shown in the drawing), and an air pump (shown in the drawing). Vacuum pump 430) and heating element 440.
  • the table 410, the vacuum hot stamping die 420, and the heating member 440 are all disposed in the closed cavity structure 450 to facilitate pressurization or vacuuming during the hot pressing process, thereby between the coating layer and the substrate. The fit is even closer.
  • substrate processing unit 300 can include a first curved mold that is adapted to form a curved surface on a surface of the substrate.
  • the substrate processed by the substrate processing unit 300 may be placed on the stage 410, and the coating layer may be placed on the substrate such that the adhesive sub-layer in the coating layer is in contact with the substrate. Subsequently, the vacuum pump 430 is activated to create a negative pressure throughout the closed cavity structure 450, thereby allowing the adhesive sublayer to be fixed to the substrate surface under pressure. According to an embodiment of the present application, the coating layer may be heated by the heating member 440 before or at the same time as the vacuum pump 430 is activated to restore the adhesive sublayer in the coating layer to a certain viscosity.
  • the film hot pressing unit facilitates the implementation of the film coating process and enables the film layer to be in close contact with the substrate.
  • the gas is slowly deflated to restore the pressure in the closed cavity structure 450 to normal.
  • the coating layer that has been bonded to the surface of the substrate is trimmed to adapt to the shape of the substrate.
  • the vacuum hot stamping die 420 may have a curved surface that matches the curved surface of the first curved mold. Thereby, the curved surface of the vacuum hot stamping die and the first curved surface are matched, and the film can be coated on the curved substrate.
  • the apparatus has no particular limitation on the specific material of the substrate, and therefore, the attachment of the coating layer on a plurality of types of substrates can be realized. Therefore, the same set of equipment can be used to prepare plates of different materials, such as metal, plastic, glass, and the like.
  • each sub-layer of the coating layer so that the sheet after attachment has a variety of appearances.
  • the adhesive sub-layer may be formed of a material having a viscosity which can achieve a bonding effect so as to bond the coating layer to the substrate in a subsequent step.
  • the colored sub-layers can be sub-layers printed with different patterns or colors to provide a rich appearance for the sheet.
  • the hard sub-layer not only provides protection for the colored sub-layer, but also forms a structure having a certain texture on the hard sub-layer by means such as mold transfer, thereby improving the tactile sensation of the sheet.
  • the apparatus for preparing the sheet material can be used to obtain sheets having different textures, colors, and the like, and the implementation process is simple, and the production cost can be reduced.
  • the present application proposes an electronic device.
  • the electronic device 1000 includes a body and a housing 200.
  • the housing 200 is fabricated from the sheet material described above.
  • the sheet may be a sheet as previously described, or may be obtained by the method described above, or may be obtained by the apparatus for preparing sheets described above. Therefore, the electronic device has all the features and advantages of the foregoing plate, and details are not described herein.
  • the orientation or positional relationship of the terms “upper”, “lower”, etc. is based on the orientation or positional relationship shown in the drawings, only for convenience of description of the present application and simplified description. It is not intended to be a limitation or limitation of the invention.
  • the "upper surface” of a casing or sheet refers to the side of the sheet or structure that faces the external environment away from the interior of the electronic device in practical applications.

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  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

一种板材及其制备方法、制备板材的装置和电子设备，该方法包括：提供覆膜层（110），该覆膜层（110）依序包括接着剂亚层（10）、颜色亚层（20）以及硬质亚层（30），将覆膜层（110）热压在衬底（120）表面，其中，覆膜层（110）的接着剂亚层（10）与衬底（120）接触。

Description

板材及其制备方法、制备板材的装置和电子设备
优先权信息
本申请请求2017年09月06日向中国国家知识产权局提交的、专利申请号为201710797448.4，以及2017年09月06日向中国国家知识产权局提交的、专利申请号为201721144662.1的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及电子设备制造领域，具体地，涉及板材及其制备方法、制备板材的装置和电子设备。
背景技术
随着电子设备领域制备技术的不断发展，用于电子设备的壳体材料也随之丰富。例如，金属板材具有更加美观的质感、耐磨耐刮等性能，被广泛应用于手机、平板电脑等电子设备中。此外，塑胶、玻璃等材料，也被用于制备电子设备的壳体。随着金属等材料的板材普及，用户对于金属壳体外观的要求也越来越高。因此，目前的电子设备壳体，除需要具有一定的机械强度，以保护电子设备，并具有一定的散热、耐刮性能以外，还需要能够形成多种颜色、纹理等，以丰富电子设备的外观。
发明内容
在本申请的一个方面，本申请提出了一种制备板材的方法。根据本申请的实施例，该方法包括：提供覆膜层，所述覆膜层包括接着剂亚层、颜色亚层以及硬质亚层，所述颜色亚层设置在所述接着剂亚层以及所述硬质亚层之间；将所述覆膜层热压在衬底表面，其中，所述覆膜层的所述接着剂亚层与所述衬底接触。
在本申请的另一方面，本申请提出了一种板材，所述板材是利用前面所述的方法制备的。
在本申请的又一方面，本申请提出了一种板材，所述板材包括：衬底，形成所述衬底的材料包括金属、塑胶以及玻璃的至少之一；以及覆膜层，所述覆膜层包括接着剂亚层、颜色亚层以及硬质亚层，所述颜色亚层设置在所述接着剂亚层以及所述硬质亚层之间，所述接着剂亚层与所述衬底接触。
在本申请的又一方面，本申请提出了一种电子设备壳体(移动终端壳体)。根据本申请的实施例，该壳体是由前面所述的板材制成的。
在本申请的又一方面，本申请提出了一种制备板材的装置。根据本申请的实施例，该装 置包括：衬底处理单元；覆膜热压单元，所述覆膜热压单元与所述衬底处理单元相连，适于将覆膜层热压至经过所述衬底处理单元处理的衬底上，其中，所述覆膜层包括接着剂亚层、颜色亚层以及硬质亚层，所述颜色亚层设置在所述接着剂亚层以及所述硬质亚层之间，所述覆膜层的所述接着剂亚层与所述衬底接触。
在本申请的又一方面，本申请提出了一种电子设备。根据本申请的实施例，该电子设备包括：本体；以及壳体，所述壳体的至少一部分是由前面所述的板材制成的。所述壳体的至少一部分是由板材制成的，所述板材是利用前面所述的方法获得的，或者是利用前面所述的装置获得的；或者，所述壳体为前面所述的壳体。
附图说明
图1显示了根据本申请一个实施例的制备板材的方法流程图；
图2显示了根据本申请另一个实施例的制备板材的方法流程图；
图3显示了根据本申请又一个实施例的制备板材的方法流程图；
图4以及图5显示了根据本申请又一个实施例的制备板材的方法流程图；
图6显示了根据本申请一个实施例的板材的结构示意图；
图7显示了根据本申请又一个实施例的板材的结构示意图；
图8显示了根据本申请一个实施例的电子设备的结构示意图；
图9显示了根据本申请一个实施例的制备板材的装置的结构示意图；
图10显示了根据本申请一个实施例的覆膜层处理单元的结构示意图；
图11显示了根据本申请一个实施例的覆膜热压单元的结构示意图。
附图标记说明：
10：接着剂亚层；20：颜色亚层；30：硬质亚层；40：工艺辅助亚层；50：离型膜亚层；110：覆膜层；120：衬底；100：板材；200：壳体；510：夹具；520：第二加热件；410：工作台；420：真空热压模具；300：衬底处理单元；400：覆膜热压单元；430：真空泵；440：加热件；450：密闭腔体结构；500：覆膜层处理单元；2000：制备板材的装置；1000：电子设备。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
需要说明的是，在本申请的各个方面中所描述的特征和效果可以互相适用，在此不再赘述。
本申请是基于申请人对以下事实和问题的发现和认识作出的：
申请人发现，目前常用的表面处理方法有喷涂法、氧化法、镀膜法等，但是这些方法都存在一定的局限性，无法适用于多种壳体材料：例如喷涂法，主要用于塑胶的表面处理，且喷涂法主要通过喷涂油漆实现不同的外观效果，所以难以实现金属的颜色以及金属光泽的外观，也较难形成具有纹理的视觉效果；而阳极氧化不仅只能够用于处理金属形成的壳体，且对金属的具体类型也有一定限制，例如压铸铝合金就无法采用阳极氧化法进行处理。而针对压铸铝合金的处理方式，一般为喷涂或者电泳。上述处理方式会影响金属自身的外观效果，而且由于压铸沙孔原因，喷涂成本偏高。因此，如能够提供一种可以适用于多种材质的壳体，且外观效果较为丰富的壳体处理方法，将大幅缓解上述问题。
在本申请的一个方面，本申请提出了一种制备板材的方法。根据本申请的实施例，参考图1，该方法包括：
S100：提供覆膜层
在该步骤中，提供覆膜层。根据本申请的具体实施例，覆膜层可以包括多个亚层结构。例如，具体地，覆膜层可以依次包括接着剂亚层、颜色亚层以及硬质亚层，也即是说，颜色亚层设置在接着剂亚层以及硬质亚层之间。接着剂亚层可以由具有一定粘度、可实现粘接效果的材料形成，以便在后续步骤中，将覆膜层粘接在衬底上。着色亚层可以是印刷有不同图案或颜色的亚层，为该板材提供外观效果。硬质亚层不仅可以为着色亚层提供保护，并且，还可以通过诸如模具转印等方式，在硬质亚层上形成具有一定纹理的结构，提高该板材的触感。由此，该覆膜层可以形成不同的纹理、颜色等外观效果，且可以简便地复合到不同材质形成的衬底上。
根据本申请的实施例，参考图2，覆膜层可以是通过以下步骤形成的：
S10：在模具表面形成硬质亚层
在该步骤中，可以首先形成硬质亚层。根据本申请的实施例，可以在模具或是平面板等工作台上，形成硬质亚层。需要说明的是，硬质亚层的具体制备方式不受特别限制，只要能够实现具有一定保护功能以及硬度的膜层即可。例如，可以采用UV层，为硬质亚层。根据本申请的具体实施例，硬质亚层可以是通过包括但不限于油墨印刷技术以及模具转印技术形成的。由此，硬质亚层可以作为覆膜层最外面的保护层。或者，也可以利用模具转印，在硬质亚层上形成具有一定纹路的结构，即将硬质亚层制作成三维(3D)纹理结构，因而可以实现有触感的纹理效果。
S20：形成工艺辅助层
在该步骤中，在硬质亚层的表面形成工艺辅助亚层。根据本申请的实施例，工艺辅助亚层可以便于将硬质亚层从模具或平面板上揭除，进而可以在硬质亚层的另一面，即硬质亚层与模具接触的一面上，制备后续的亚层结构。根据本申请的具体实施例，在该步骤中，可以将工艺辅助层覆盖在硬质亚层上，固化后，即可进行后续步骤。
S30：剥离硬质亚层以及工艺辅助亚层
在该步骤中，待硬质亚层和工艺辅助亚层在模具表面固化后，将其与模具剥离。由此，可以简便地将硬质亚层与模具或是平面板分离。
S40：形成颜色亚层、接着剂亚层
在该步骤中，在硬质亚层远离工艺辅助亚层的一侧，依次印刷形成颜色亚层和着色剂亚层。根据本申请的实施例，颜色亚层可以为具有一定颜色，或是印刷图案的漆层。颜色亚层的具体厚度不受特别限制，本领域技术人员可以根据需要实现的外观效果，对颜色亚层的厚度进行设计。随后，在颜色亚层远离硬质亚层的一侧，制备接着剂亚层。接着剂亚层可以是通过喷涂或是涂覆接着剂而形成的。根据本申请的实施例，接着剂亚层的具体材料不受特别限制，可以根据衬底的具体材料，选择粘结能力较好的材料形成接着剂亚层，以便保证覆膜层以及衬底之间的粘结牢固程度。
根据本申请的实施例，前面形成的工艺辅助亚层，也可以通过增设离型膜亚层的方式进行剥离，由此，可以令最终的板材中，仅包含硬质亚层、颜色亚层、接着剂亚层的结构，进而有利于进一步提高该板材的外观效果。具体的，参考图3，根据本申请的实施例，上述过程可以是通过以下步骤实现的：
首先，在模具表面形成硬质亚层之后，可以进一步包括：
S50：形成离型膜亚层
在该步骤中，在硬质亚层远离模具的表面，设置离型膜亚层。由此，有利于后续工艺辅助亚层的剥离。随后，在离型膜亚层上，形成工艺辅助亚层，并进行后续处理即可。
S200：将所述覆膜层热压在衬底表面
在该步骤中，将前面制备的覆膜层，与衬底进行复合。具体的，根据本申请的实施例，在该步骤中，将覆膜层的接着剂亚层与衬底接触，并通过热压的方式，将覆膜层与衬底形成紧密结合。本领域技术人员能够理解的是，覆膜层是通过接着剂亚层，经热压过程，紧密贴合在衬底上的。
需要特别说明的是，在本申请中，术语“热压”特指在加热条件下，将覆膜层通过接着剂亚层，压合到衬底表面。也即是说，在加热以及一定压力下，令覆膜层中的接着剂亚层与衬底接触，实现覆膜层以及衬底的贴合。根据本申请的实施例，上述热压的具体处理参数不受特别限制。例如，可以利用真空热压的方式，将覆膜层形成在衬底表面。
还需要说明的是，“热压”应做广义理解，即：加热以及压合可以分步进行，也可以同时进行；可以首先进行加热处理，随后将经过加热处理的覆膜层，在一定压力下贴合到衬底表面；或者，也可以在进行压合的同时，对覆膜层以及衬底进行加热处理。例如，可以在进行压合之前，预先对覆膜层进行加热处理，以便在恢复粘结亚层的粘性的同时，软化覆膜层，使得柔性的覆膜层能够更好的贴合在衬底表面。具体的，加热处理的温度和时间不受特别限制，可以根据覆膜层的材质进行选择，例如，加热处理的温度可以为80-140℃，根据本申请的实施例，当覆膜层中的亚层结构中，含有PO(聚烯烃类共聚物)时，加热处理的温度可以为120℃左右，加热时间可以为60秒左右。上述加热处理可以在压合之前进行，或者，也可以在压合的过程中，同步对覆膜层进行上述加热处理。又或者，可以预先对覆膜层经加热处理后，在保持该加热温度的条件下，将覆膜层压合在衬底表面。例如，可以将经过加热软化处理的覆膜层，置于衬底的表面，并将覆膜层以及衬底置于密闭的空间中，进行加压或是抽真空(负压)处理。由此，在加压或是抽真空的过程中，具有粘性的接着剂亚层即可以紧密的贴合在衬底表面。根据本申请的实施例，加压的压力和抽真空的真空度可以根据产品结构的不同进行选择，例如，产品侧面弧度较大时，可采用12-15kg力，同时，抽真空处理后，密闭空间中的真空度为-1个大气压。由此，即可以实现覆膜层以及衬底之间的紧密结合，又可以避免压力过大，损坏覆膜亚层。根据本申请的另一些实施例，还可以在上述加压或是抽真空的过程中，同步对衬底以及覆膜层进行加热处理，从而可以进一步提高覆膜层以衬底之间结合的紧密程度。
根据本申请的实施例，衬底的具体材料不受特别限制。例如，根据本申请的具体实施例，衬底可以包括金属、塑胶、玻璃的至少之一。如前所述，覆膜层中的接着剂亚层，是依据衬底的材质进行选择的。由此，可以利用统一的处理方式，将覆膜层设置在不同材质形成的衬底表面。由此，可以利用同一套生产线，实现对不同衬底进行覆膜的操作，进而有利于降低生产厂商的设备成本。
根据本申请的实施例，利用上述操作制备的板材，板材衬底的具体形状可以不受特别限制：由于覆膜层为具有一定韧性的多层结构，且覆膜层与衬底的结合方式为热压，因此衬底表面可以具有诸如曲面等不规则结构，而不会对覆膜层以及衬底的结合造成影响。由此，可以利用该方法，制备用于形成曲面壳体或曲面盖板的板材。
根据本申请的实施例，如前所述，当覆膜层中的工艺辅助亚层需要进行剥离时，该方法还可以进一步包括：
S60：将离型膜亚层和工艺辅助亚层从硬质亚层表面剥离
根据本申请的实施例，在该步骤中，将离型膜亚层从硬质亚层表面剥离。由于工艺辅助亚层是形成在离型膜亚层远离硬质亚层一侧的表面的，因此，在剥离离型膜亚层的同时， 即可实现工艺辅助亚层与衬底以及接着剂亚层、颜色亚层等结构的剥离。由此，可以简便地去除工艺辅助亚层。
根据本申请的具体实施例，参考图4以及图5，上述方法可以包括以下步骤：参考图4中的(a)以及(b)，首先提供覆膜层110，覆膜层110可以包括接着剂亚层、颜色亚层、硬质亚层、离型膜亚层以及工艺辅助亚层(图中未示出)。将衬底120置于工作台410上。根据本申请的实施例，衬底120的边缘可以为曲面，工作台410上可以具有与该曲面边缘一致的仿形固定块。随后，利用夹具510将覆膜层110进行固定，以便利用加热件520，对覆膜层110进行加热软化处理。在该步骤中，可以将覆膜层110以及衬底120，均置于密闭的腔体结构中(图中未示出)。随后，对腔体内部进行抽真空处理，再对覆膜层110进行上述加热软化处理。然后，参考图4中的(c)，将经过加热软化处理的覆膜层110，置于衬底120上。由于覆膜层110已经经过加热软化处理，因此，可以较好地覆盖在具有曲面边缘的衬底120上，进而可以同步在衬底120的平面部分，以及曲面边缘上，进行统一的覆膜处理，以便最终获得的板材能够具有统一的外观。例如，在该步骤中，可以通过高压和负压，并利用真空热压模具420，将软化后的薄膜覆盖在壳体上。例如，在加热软化过程中，可令覆膜层110中的接着剂亚层融化，进而可以将壳体以及覆膜层，通过压力贴合在一起。由此，贴合后的覆膜层110，即具有了与衬底120的曲面边缘相一致的曲面结构。
根据本申请的实施例，参考图5中的(c)以及(d)，在实现了覆膜层110以及衬底的结合之后，仅需恢复腔室内的气压，取下真空热压模具420，即可获得复合有覆膜层110的衬底。最后根据衬底的形状，对覆膜层110进行相应剪裁(图中未示出)，即可获得根据本申请实施例的板材。
如前所述，覆膜层110中的工艺辅助亚层，可以通过加设离型膜亚层实现剥离。具体地，参考图5中的(e)，在实现覆膜层110以及衬底之间的热压之后，揭除离型膜亚层50，则离型膜亚层50上方的工艺辅助亚层40既可以同步实现剥离。最终，获得不包含工艺辅助亚层的板材100。
综上所述，根据本申请实施例的方法，具有以下优点的至少之一：
(1)步骤简单，操作成本低廉，不涉及昂贵的仪器以及精密的操作；
(2)可以通过对覆膜层各个亚层结构的设计，实现多种外观，如金属外观、印花图案、三维纹理等等；
(3)该方法可以适用于多种材质形成的衬底，有利于利用统一的生产线进行板材的制备，节约设备成本；
(4)该方法对于衬底的材质、形状无特殊要求，可以用于制备平面或是曲面结构的板材。
在本申请的另一方面，本申请提出了一种板材。根据本申请的实施例，该板材是利用前面所述的方法制备的。由此，板材具有前面所述制备板材的方法的全部优点，在此不再赘述。
在本申请的又一方面，本申请提出了一种板材。根据本申请的实施例，该板材可以具有与前面描述的方法，所获得的板材相同的特征以及优点，再次不再赘述。具体的，参考图6，该板材100包括：衬底120以及覆膜层110。覆膜层110可以包括接着剂亚层10、颜色亚层20以及硬质亚层30，颜色亚层20设置在接着剂亚层10以及硬质亚层30之间。接着剂亚层10与衬底120接触。覆膜层110及其所包括的各个亚层结构，可以具有与前面描述的制备板材的方法所获得的板材中，相对应的结构相同的特征以及优点。由此，板材可同时呈现出三维纹理以及色彩或是图案的外观效果，即：具有良好的颜色以及纹理等外观效果。并且所述板材的制备工艺简单，可降低生产成本。
根据本申请的实施例，衬底120的具体形状、结构，均不受特别限制。例如，根据本申请的实施例，衬底120的表面还可以具有曲面。根据本申请的实施例，衬底120可以是由金属、塑胶以及玻璃的至少之一形成的。
根据本申请的实施例，参考图7，该板材100的覆膜层110可以进一步包括：工艺辅助亚层40。工艺辅助亚层40可以设置在硬质亚层30远离颜色亚层20的一侧。如前所述，在覆膜层110中增设工艺辅助亚层40，可以便于形成颜色亚层20以及硬质亚层30。当需要在板材100中去除工艺辅助亚层40时，可以简便地通过增设离型膜亚层的结构(图中未示出)，剥离工艺辅助亚层40，进而获得如图6中所示出的板材100。
在本申请的又一方面，本申请提出了一种电子设备(移动终端)壳体。根据本申请的实施例，该壳体是由前面所述的板材制成的。由此，该可以具有前面所述板材的全部特征及优点，在此不再赘述。
在本申请的又一方面，本申请提出了一种制备板材的装置。根据本申请的实施例，参考图9，该制备板材的装置2000包括：衬底处理单元300和覆膜热压单元400，覆膜热压单元400与衬底处理单元300相连，适于将覆膜层热压至经过所述衬底处理单元处理的衬底上。该覆膜层包括接着剂亚层、颜色亚层以及硬质亚层，颜色亚层设置在接着剂亚层以及所述硬质亚层之间，覆膜层的接着剂亚层与衬底接触。由此，利用该制备板材的装置可在多种材质形成的板材上获得上述覆膜层，可以制得具有不同纹理、颜色等效果的板材，并且实施工艺简单，可降低生产成本。根据本申请的实施例，该制备板材的装置，制备的板材可以为前面描述的板材。利用该装置制备上述板材时，所使用的覆膜层和衬底，可以为前面描述的覆膜层和衬底，其具有前面描述的覆膜层和衬底的全部特征以及优点，在此不再赘述。
根据本申请的实施例，参考图10，该制备板材的装置2000进一步包括覆膜层处理单元500，该覆膜层处理单元500包括夹具510和第二加热件520。夹具510适用于固定覆膜层，有利于后续工艺的实施。第二加热件520与夹具510相邻设置，适用于对夹具520以及覆膜层进行加热。经过加热处理后，覆膜层的接着剂亚层会受热软化，进而在后续过程中可以更好地粘合覆膜层和衬底。尤其是当衬底表面具有曲面时，该覆膜层处理单元，可以简便地令覆膜层软化，进而贴合到衬底的曲面上，而无需事先对覆膜层进行特殊的曲面成型处理。需要说明的是，夹具510可以是由具有一定导热性能的材料形成的，例如，可以是由金属形成的。金属的传热性能比较优良，有利于第二加热件520对覆膜层的有效加热。且金属材料加工简单，有利于降低夹具510的生产成本。第二加热件520的设置位置以及数量不受特别限制，本领域技术人员可以根据实际需求进行设计。例如，根据本申请的实施例，夹具510可以包括上夹具以及下夹具，用于固定覆膜层。第二加热件520也可以包括上加热件以及下加热件，分别设置在上夹具远离覆膜层的一侧，以及下夹具远离覆膜层的一侧。由此，可以实现对夹具以及固定在其中的覆膜层的均匀加热。
下面根据本申请的实施例，对利用该制备板材的装置2000制备板材的具体步骤作详细说明。
根据本申请的实施例，参考图11，覆膜热压单元400可以包括：工作台410、热压模具(如图中所示出的真空热压模具420)、气泵(如图中所示出的真空泵430)以及加热件440。工作台410、真空热压模具420、以及加热件440都设置在密闭腔体结构450中，便于在热压过程中，进行加压或是抽真空处理，从而令覆膜层以及衬底之间的贴合更加紧密。例如，根据本申请的一个具体实施例，衬底处理单元300可以包括第一曲面模具，第一曲面模具适于在衬底的表面形成曲面。可以将经过衬底处理单元300处理后的衬底放置在工作台410上，并将覆膜层置于衬底上，令覆膜层中的接着剂亚层与衬底相接触。随后，启动真空泵430，使整个密闭腔体结构450内形成负压，从而可以令接着剂亚层在压力作用下，固定在衬底表面。根据本申请的实施例，在启动真空泵430之前或是同时，可以利用加热件440对覆膜层进行加热，以便令覆膜层中的接着剂亚层恢复一定粘度。由此，该覆膜热压单元有利于覆膜工艺的实施，并且能使所述覆膜层和所述衬底紧密贴合。热压结束后，缓慢放气使密闭腔体结构450中的压强恢复正常，待冷却后，对已经粘合到衬底表面的覆膜层进行裁剪处理，以适应衬底的形状，即可获得根据本申请实施例的板材。
需要说明的是，根据本申请的实施例，真空热压模具420可以具有与第一曲面模具的曲面相配合的曲面。由此，真空热压模具的曲面与第一曲面相互配合，可以较好地在曲面衬底上，进行覆膜。
综上，该设备对衬底的具体材料没有特别限制，因此，可以实现在多种类型的衬底上进 行覆膜层的贴附。由此，可以利用同一套设备，制备不同材质的板材，如金属、塑胶、玻璃等。此外，还可以对覆膜层的各个亚层进行设计，以便令贴附之后的板材，具有多种外观。具体地，接着剂亚层可以由具有一定粘度、可实现粘接效果的材料形成，以便在后续步骤中，将覆膜层粘接在衬底上。着色亚层可以是印刷有不同图案或颜色的亚层，为该板材提供丰富的外观效果。硬质亚层不仅可以为着色亚层提供保护，并且，还可以通过诸如模具转印等方式，在硬质亚层上形成具有一定纹理的结构，提高该板材的触感。由此，利用该制备板材的装置可以制得具有不同纹理、颜色等效果的板材，并且实施工艺简单，可降低生产成本。
在本申请的又一方面，本申请提出了一种电子设备。根据本申请的实施例，参考图8，该电子设备1000包括本体以及壳体200。根据本申请的实施，壳体200的至少一部分是由上面所述的板材制成的。该板材可以是前面描述的板材，也可以是由前面描述的方法获得的，还可以是经前面描述的制备板材的装置获得的。由此，该电子设备具有前面所述板材的全部特征及优点，在此不再赘述。
以上详细描述了本申请的实施方式，但是，本申请并不限于上述实施方式中的具体细节，在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合。
在本申请的描述中，需要理解的是，术语“上”、“下”、等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。例如，在本申请中，壳体或是板材的“上表面”是指在实际应用中，该板材或结构朝向外部环境而远离电子设备内部的一侧。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (20)

  1. 一种制备板材的方法，所述方法包括：
    提供覆膜层，所述覆膜层包括接着剂亚层、颜色亚层以及硬质亚层，所述颜色亚层设置在所述接着剂亚层以及所述硬质亚层之间；
    将所述覆膜层热压在衬底的表面，其中，所述覆膜层的所述接着剂亚层与所述衬底接触。
  2. 根据权利要求1所述的方法，形成所述衬底的材料包括金属、塑胶以及玻璃的至少之一。
  3. 根据权利要求1或2所述的方法，所述覆膜层进一步包括：
    工艺辅助亚层，所述工艺辅助亚层设置在所述硬质亚层远离所述颜色亚层的一侧。
  4. 根据权利要求3所述的方法，所述覆膜层是通过以下步骤制备的：
    在模具表面形成所述硬质亚层；
    在所述硬质亚层上形成所述工艺辅助亚层；
    将所述工艺辅助亚层以及所述硬质亚层由所述模具表面剥离；
    在所述硬质亚层远离所述工艺辅助亚层的一侧，依次印刷形成所述颜色亚层以及所述接着剂亚层。
  5. 根据权利要求4所述的方法，形成所述工艺辅助亚层之前，进一步包括：
    在所述硬质亚层表面形成离型膜亚层。
  6. 根据权利要求5所述的方法，进一步包括：
    将所述离型膜亚层以及所述工艺辅助亚层，由所述硬质亚层表面剥离。
  7. 根据权利要求1-6任一项所述的方法，将所述覆膜层热压在衬底的表面进一步包括：
    对所述覆膜层进行加热处理，以便软化所述覆膜层；
    将经过所述软化的所述覆膜层，在真空或负压条件下，热压在所述衬底表面。
  8. 根据权利要求1-7任一项所述的方法，所述衬底的表面具有曲面。
  9. 根据权利要求1-8任一项所述的方法，所述硬质亚层是通过油墨印刷技术以及模具转印技术的至少之一而形成的。
  10. 一种板材，所述板材是利用权利要求1-9任一项所述的方法制备的。
  11. 一种板材，所述板材包括：
    衬底，形成所述衬底的材料包括金属、塑胶以及玻璃的至少之一；以及
    覆膜层，所述覆膜层包括接着剂亚层、颜色亚层以及硬质亚层，所述颜色亚层设置在所述接着剂亚层以及所述硬质亚层之间，所述接着剂亚层与所述衬底接触。
  12. 根据权利要求11所述的板材，所述覆膜层进一步包括：
    工艺辅助亚层，所述工艺辅助亚层设置在所述硬质亚层远离所述颜色亚层的一侧。
  13. 根据权利要求11所述的板材，所述衬底的表面具有曲面。
  14. 一种电子设备的壳体，其特征在于，所述壳体是由权利要求10-13任一项所述的板材制成的。
  15. 一种制备板材的装置，所述装置包括：
    衬底处理单元，所述衬底处理单元适于对衬底进行处理；
    覆膜热压单元，所述覆膜热压单元与所述衬底处理单元相连，适于将覆膜层热压至经过所述衬底处理单元处理的衬底上，
    其中，所述覆膜层包括接着剂亚层、颜色亚层以及硬质亚层，所述颜色亚层设置在所述接着剂亚层以及所述硬质亚层之间，所述覆膜层的所述接着剂亚层与所述衬底接触。
  16. 根据权利要求15所述的装置，所述衬底处理单元包括第一曲面模具，所述第一曲面模具适于在所述衬底的表面形成曲面。
  17. 根据权利要求15所述的装置，所述覆膜热压单元包括：
    工作台，所述工作台上具有衬底设置空间；
    热压模具，所述热压模具设置在所述工作台上；
    气泵以及加热件，所述气以及所述加热件分别与所述真空热压模具相连，
    所述衬底以及所述覆膜层之间，可形成真空或负压。
  18. 根据权利要求16或17所述的装置，所述真空热压模具具有与所述第一曲面模具的曲面相配合的曲面。
  19. 根据权利要求15-18任一项所述的装置，进一步包括：
    覆膜层处理单元，所述覆膜层处理单元与所述覆膜热压单元相连，适于在将覆膜层热压至所述衬底上之前，预先对所述覆膜层进行加热软化处理，
    所述覆膜层处理单元包括：夹具，所述夹具适于固定所述覆膜层；以及
    第二加热件，所述第二加热件与所述覆膜层固定模具相邻设置，适于对所述夹具以及所述覆膜层进行加热。
  20. 一种电子设备，所述电子设备包括：
    本体；以及
    壳体，所述壳体的至少一部分是由板材制成的，所述板材是利用权利要求1-9任一项所述的方法获得的，或者是利用权利要求15-19任一项所述的装置获得的；
    或者，所述壳体为利用权利要求10-13任一项所述的板材制备的。
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CN104333991A (zh) * 2014-11-06 2015-02-04 天津三星通信技术研究有限公司 电子设备外壳及其制造方法
CN107718815A (zh) * 2017-09-06 2018-02-23 广东欧珀移动通信有限公司 板材及其制备方法、电子设备、制备板材的装置
CN207388443U (zh) * 2017-09-06 2018-05-22 广东欧珀移动通信有限公司 板材、制备板材的装置、移动终端壳体以及电子设备

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