WO2019035557A1 - Appareil de transfert d'élément électrique - Google Patents

Appareil de transfert d'élément électrique Download PDF

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Publication number
WO2019035557A1
WO2019035557A1 PCT/KR2018/007836 KR2018007836W WO2019035557A1 WO 2019035557 A1 WO2019035557 A1 WO 2019035557A1 KR 2018007836 W KR2018007836 W KR 2018007836W WO 2019035557 A1 WO2019035557 A1 WO 2019035557A1
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WO
WIPO (PCT)
Prior art keywords
micro
led
adhesive member
porous material
jig
Prior art date
Application number
PCT/KR2018/007836
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English (en)
Korean (ko)
Inventor
장현태
박민
이병훈
이영철
이창준
장지영
문영준
박민영
윤정근
최원
장시호
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180069718A external-priority patent/KR102572669B1/ko
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to US16/638,645 priority Critical patent/US11805633B2/en
Priority to CN201880052299.1A priority patent/CN110998819B/zh
Publication of WO2019035557A1 publication Critical patent/WO2019035557A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • Various embodiments of the present invention are directed to a transfer device for an electrical device.
  • Micro LEDs applied to pixels in a near-field display have a size in the range of 30 to 40 ⁇ m and can be fabricated on a substrate (eg, wafer, sapphire substrate, quartz substrate, etc.) have.
  • the micro-LEDs thus fabricated must be mounted on a PCB of the display and must be transportable with an accurate, fast and low defect rate.
  • a multi-chip transfer method in which a plurality of micro-LEDs are transferred to the substrate by one transfer can be used.
  • a multichip transfer method a method of transferring a plurality of micro-LEDs from a mother substrate to a display substrate using a conventional stamp, tape, or high-speed mounter is used. As a result, a defect rate of the process itself is high, Lt; / RTI >
  • the various embodiments of the present invention can provide an electric element transfer apparatus which can have a high transfer rate and a low defect rate.
  • the present invention accurately picks up a microdevice chip using the adhesive force of a porous material and a tape, picks up a precise microdevice chip using the attraction force provided by the vacuum, the porous material and the tape, It is possible to provide a rearrangement device capable of preventing deformation of a micro-LED chip which is not picked up adjacent to the chip.
  • an electric element transferring apparatus comprising: a stationary jig in which each of the plurality of electric elements is arranged at a constant interval; a movable jig which is disposed movably above the stationary jig, A moving jig including a plurality of first receiving grooves for receiving the plurality of electric devices and a plurality of electric devices disposed near the moving jig, wherein each of the plurality of electric devices is attached to the first receiving groove of the moving jig by a magnetic force through the moving jig It is possible to provide an electric element transferring apparatus including the attracting apparatus.
  • a transfer device for a microdevice chip comprising: a second device in which a plurality of microdevice chips are placed on a fixed carrier film; And a plurality of first through holes opened spatially connected to the first vacuum, and a first porous material coupled to the first vacuum, and a second porous material fixed to the first porous material, And a first device including a first adhesive member that is adsorbed to the first porous material portion by a first vacuum, wherein the first device causes the plurality of micro-LED chips prepared by the adhesive force of the first adhesive member to be selectively And the individual microdevice chips picked up and transported can be lowered by the first device and rearranged on the temporary fixing film.
  • a micro-LED transfer device comprising: a fixing device for holding a plurality of micro-LED chips with a fixed carrier film thereon; And a pick-up device for selectively picking up and transporting the plurality of micro-LED chips, wherein the pick-up device comprises: A first porous material portion including a plurality of first through holes spatially connected to the first vacuum; And a first adhesive member that is fixed to the first porous material portion and is adsorbed to a portion of the first multi-processing material portion in accordance with an ON operation of the first vacuum. A second porous material portion including a plurality of second through holes spatially connected to the second vacuum; And a second adhesive member that is fixed to the second porous material portion and is adsorbed to the second porous material portion by an on operation of the second vacuuming.
  • the various embodiments of the present invention can be applied to a fixing jig for rearranging electric devices by type and a transfer jig for picking up electric devices arranged in the fixing jig and transferring the electric devices to the PCB of the electronic device,
  • the microdevice chip transferring apparatus is a device for transferring a microdevice chip of a large-size display device (e.g., a TV) by picking up and dropping a plurality of micro-LED chips precisely at a time
  • the production time can be effectively shortened.
  • FIG. 1A is a block diagram illustrating a substrate substrate for manufacturing a micro LED according to various embodiments of the present invention.
  • FIG. 1A is a block diagram illustrating a substrate substrate for manufacturing a micro LED according to various embodiments of the present invention.
  • FIG. 1B is a block diagram of a micro-LED according to various embodiments of the present invention.
  • FIG. 2 is a view showing a configuration of a fixing jig according to various embodiments of the present invention.
  • FIG 3 shows a schematic system of a transfer device according to various embodiments of the present invention.
  • FIG. 4 is a process diagram illustrating a process of transferring a micro-LED according to various embodiments of the present invention.
  • 5A to 5H are schematic diagrams illustrating a process of transferring a micro-LED according to various embodiments of the present invention.
  • 6A to 6D are views showing a configuration of a fixing jig for aligning micro-LEDs according to various embodiments of the present invention.
  • FIG. 7 is a configuration diagram of a transfer device according to various embodiments of the present invention.
  • FIG. 8 is a view showing a screen configuration of a display manufactured using micro-LEDs transferred using a transfer device according to various embodiments of the present invention.
  • FIG. 9 is a view showing a process of rearranging a plurality of prepared micro-LED chips according to various embodiments.
  • FIG. 10A is a diagram showing a rearrangement device of a micro-LED chip according to various embodiments of the present invention, and shows a state before pickup of a micro-LED chip.
  • FIG. 10A is a diagram showing a rearrangement device of a micro-LED chip according to various embodiments of the present invention, and shows a state before pickup of a micro-LED chip.
  • FIG. 10B is a diagram showing a state in which the first device is moved downward and attached to a selected micro-LED chip among the micro-LED chip rearrangement devices according to various embodiments of the present invention.
  • 10C is a view illustrating a state in which the first device moves the selected micro LED chip upward among the micro LED chip rearrangement devices according to various embodiments of the present invention.
  • FIG. 10D is a view showing a state in which a selected micro-LED chip is attached to a temporary fixing film after the first device is horizontally moved and moved downward, among the rearrangement devices of micro-LED chips according to various embodiments of the present invention.
  • 11A is a view showing a cross section of an adhesive member according to various embodiments of the present invention.
  • 11B is a cross-sectional view of another adhesive member according to various embodiments of the present invention.
  • a or B “at least one of A or / and B,” or “one or more of A and / or B,” etc. may include all possible combinations of the listed items .
  • “A or B,” “at least one of A and B,” or “at least one of A or B” includes (1) at least one A, (2) at least one B, (3) at least one A and at least one B all together.
  • first,” “second,” “first,” or “second,” etc. used in various embodiments may describe various components in any order and / or importance, Lt; / RTI > The representations may be used to distinguish one component from another.
  • the first user equipment and the second user equipment may represent different user equipment, regardless of order or importance.
  • the first component may be referred to as a second component, and similarly, the second component may be named as the first component.
  • a component eg. a first component
  • another component eg., a second component
  • a component e.g., a first component
  • the element may be directly connected to the other element or may be connected through another element (e.g., a third element).
  • a component e.g., a first component
  • another component e.g., a second component
  • there is no other component e.g., a third component
  • An electronic device in accordance with various embodiments of the present disclosure can be, for example, a smartphone, a tablet personal computer, a mobile phone, a videophone, an electronic book reader e- book reader, a desktop personal computer, a laptop personal computer, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP) Player, a mobile medical device, a camera, or a wearable device (e.g. smart glasses, head-mounted-device (HMD)), electronic apparel, electronic bracelets, electronic necklaces, An electronic device, an electronic device, an apparel, an electronic tattoo, a smart mirror, or a smart watch).
  • PDA personal digital assistant
  • PMP portable multimedia player
  • HMD head-mounted-device
  • the electronic device may be a smart home appliance.
  • Smart home appliances include, for example, televisions, digital video disk players, audio, refrigerators, air conditioners, vacuum cleaners, ovens, microwaves, washing machines, air cleaners, set- (Such as a home automation control panel, a security control panel, a TV box, such as Samsung HomeSync TM , Apple TV TM or Google TV TM , a game console such as Xbox TM , PlayStation TM , An electronic key, a camcorder, or an electronic photo frame.
  • the electronic device may be any of a variety of medical devices (e.g., various portable medical measurement devices such as a blood glucose meter, a heart rate meter, a blood pressure meter, or a body temperature meter), magnetic resonance angiography (MRA) A global positioning system receiver, an event data recorder (EDR), a flight data recorder (FDR), an automotive infotainment device, a navigation system, a navigation system, Electronic devices (eg marine navigation devices, gyro compass, etc.), avionics, security devices, head units for vehicles, industrial or home robots, ATMs (automatic teller's machines) point of sale or internet of things such as light bulbs, various sensors, electric or gas meters, sprinkler devices, fire alarms, thermostats, street lights, toasters, A water tank, a heater, a boiler, and the like).
  • medical devices e.g., various portable medical measurement devices such as a blood glucose meter, a heart rate meter, a blood pressure meter, or a
  • the electronic device is a piece of furniture or a part of a building / structure, an electronic board, an electronic signature receiving device, a projector, Water, electricity, gas, or radio wave measuring instruments, etc.).
  • the electronic device may be a combination of one or more of the various devices described above.
  • An electronic device according to some embodiments may be a flexible electronic device.
  • the electronic device according to the embodiment of the present disclosure is not limited to the above-described devices, and may include a new electronic device according to technological advancement.
  • the configuration of the display according to the exemplary embodiment of the present invention can be implemented regardless of the size of the LED, so that the size of the LED to be used is not limited.
  • a large-sized display such as an indoor / outdoor signage uses a few hundred micrometers of LEDs, and an LED of several tens of micrometers can be used for a display. have.
  • the exemplary embodiments of the present invention illustrate and describe the transport apparatus and method for a micro-LED, but the present invention is not limited thereto.
  • a variety of electrical devices that can utilize the transport devices and methods disclosed herein can be applied.
  • FIG. 1A is a block diagram illustrating a substrate substrate for manufacturing a micro LED according to various embodiments of the present invention.
  • FIG. 1A is a block diagram illustrating a substrate substrate for manufacturing a micro LED according to various embodiments of the present invention.
  • the micro-LED 110 may have a thickness of several tens of micrometers (e.g., 30 to 40 micrometers) to be applied to the sub-pixels (e.g., Pr, Pg, Size.
  • the micro-LEDs 110 may be fabricated in a single crystal state of a compound semiconductor at a high temperature / high pressure on a sapphire or SiX base substrate 100 (e.g., a wafer) : red, green, blue) can be configured differently.
  • red is made of GaAs
  • green is made of InGaP
  • blue is made of compound semiconductor of GaN
  • wavelength is determined according to the inherent energy bandgap value of each composition, and the implemented color is different.
  • the grown micro-LED 110 in order for the grown micro-LED 110 to emit light, it may be subjected to several tens of semiconductor processes in an electrically connectable structure in which holes and electrons can be supplied.
  • a pair of connection pads 112 protruding from the body 111 of the micro-LED 110 may be formed in a pad-up type of the base substrate 100.
  • FIG. 1B is a block diagram of a micro-LED according to various embodiments of the present invention.
  • a micro-LED 110 fabricated on a mother substrate includes a body 111 as a light emitting portion and a pair of The connection pad 112 may be formed of a metal.
  • the micro LED 110 can be used as an electronic device (e.g., a display) (e.g., a display (not shown) of FIG. 8 using a transport device (E.g., a solder pad) (e.g., a conductive pad 241 of FIG. 3) disposed on a substrate (e.g., substrate 240 of FIG.
  • the micro-LED 110 attached on the substrate 100 may be subjected to a laser lift-off (LLO) process through a laser (e.g., a gas laser or a solid laser (DPSS) laser) And can be separated from the base substrate 100 by using the same.
  • LLO laser lift-off
  • DPSS solid laser
  • a micro LED 110 may be incorporated into an LED attraction device (e.g., the attraction device 300 of FIG. 3) applied to a transfer device (e.g., the transfer device 300 of FIG. 3) 230) can be attracted to a moving jig (e.g., the moving jig 220 in Fig. 3) of the transfer device (e.g., the transfer device 300 in Fig. 3).
  • the micro-LED 110 may include an element that is attracted to the magnetic force of the EL attracting device (e.g., the attracting device 230 of FIG. 3).
  • the element 113 may include a metal member that is applied to at least a portion of the area of the micro-LED 110.
  • the element 113 may comprise a layer of nickel (Ni) applied to at least a portion of the area of the micro-LED 110.
  • the nickel layer is disposed on at least one of the bottom surface of the body 111 of the micro-LED 110, the pad bottom surface 1121 of the pair of contact pads 113, or the pad side surface 1122 . Therefore, the micro-LED 110 can be attracted toward the bottom surface of the moving jig by the magnetic force of the LED attracting device (e.g., the attracting device 230 of FIG. 3) and the conveying device 300 for conveying.
  • FIG. 2 is a view showing a configuration of a fixing jig according to various embodiments of the present invention.
  • the micro-LEDs 110 manufactured on the mother substrate 100 may be rearranged on at least one fixing jig 210.
  • the micro-LED 110 may include a fixed jig (not shown) to match the elements constituting the display pixel, such as pitch, color (R / G / B) 210 at regular intervals.
  • the micro-LED 110 manufactured on the mother substrate 100 can be moved to the stationary jig 210 through the pickup device only by the micro-LED 110 normally operating through the good product inspection.
  • the fixing jig 210 may be configured in units of sub-pixels (e.g., Pr, Pg, Pb) that constitute pixels of the display, for example.
  • one fixing jig e.g., the first fixing jig 210-1 in Fig. 3
  • another fixing jig e.g., the second fixing jig 210-2 in Fig. 3
  • the remaining one fixing jig can accommodate only a plurality of micro LEDs 110 that display B colors.
  • the fixing jig 210 may include a first receiving groove 2111 formed to accommodate at least a part of the area of the micro-LED 110 at each position where the plurality of micro-LEDs 110 are disposed.
  • the first receiving groove 2111 may be formed lower than the upper surface 211 of the fixing jig 210 facing the moving jig (e.g., the moving jig 220 in Fig. 3).
  • the first receiving groove 2111 is connected to the connection pad 112 of the micro LED 110 facing the forward direction (e.g., the direction in which the connection pad 112 is directed downward) after being transferred by the pickup device, To at least a portion of the body 111.
  • the fixing jig 210 may be formed of a material such as a non-magnetic metal, plastic, ceramic, glass, or silicone. According to one embodiment, when the micro-LED 110 is accommodated in the first receiving groove 2111, since the micro-LED 110 is interrupted by the first receiving groove 2111, . According to one embodiment, the first receiving groove 2111 may be formed in a shape that is equal to or larger than the size of the micro-LED 110.
  • FIG 3 shows a schematic system of a transfer device according to various embodiments of the present invention.
  • the transfer device 300 includes at least one fixing jig 210, a moving jig 220 and a moving jig 220 (not shown) And an attracting device 230 for attracting at least one micro LED 110 arranged in the fixing jig 210 through a plurality of micro LEDs 110.
  • the at least one fixing jig 210 includes a first fixing jig 210-1 in which a plurality of micro-LEDs corresponding to a sub-pixel Pr in which R color is expressed, for example, A plurality of micro-LEDs corresponding to the second fixing jig 210-2 in which a plurality of micro-LEDs corresponding to the sub-pixel Pg in which the G color is expressed and the sub-pixels Pb in which the B color is expressed are arranged And a third fixing jig 210-3.
  • the moving jig 220 may also include a second receiving groove 2211 formed on the lower surface 221 facing the fixing jig 210 so as to be lower than the lower surface 221.
  • the second receiving groove 2211 also has a depth capable of accommodating at least a part of the micro LED 110 disposed in the first receiving groove 2111 of the fixing jig 210, As shown in FIG.
  • the micro-LED 110 may be arranged to receive at least a part of the body 111 in the second receiving groove 2211 of the moving jig 220.
  • the moving jig 220 may also be formed of a non-magnetic metal, plastic, ceramic, glass, silicon, or the like.
  • the LED attracting device 230 may include magnetic force generating means for attracting an element responsive to a magnetic force (e.g., the element 113 responsive to the magnetic force of FIG. 1B).
  • the magnetic force generating means may comprise a ferrite magnet, a neodymium magnet, a rare earth magnet or a common metal magnet.
  • the LED attracting device 230 for generating magnetic force may be formed in a plate shape, a cylindrical shape, a coin shape, a projection shape, an entire coil shape, or a partial coil shape.
  • the LED attracting device 230 may be selectively moved in a generally contact manner with the upper portion of the moving jig 220 and may include at least one micro LED 110 disposed in the fixing jig 210, To the second receiving groove 2211 of the moving jig 220 by using a magnetic force.
  • the LED attraction device 230 for generating magnetic force may be replaced by an electromagnet device that generates magnetic force only when power is applied.
  • the LED attracting device 230 may be integrally formed with the moving jig 220, or the moving jig 220 itself may be formed of an electromagnet without a separate attracting device.
  • the moving jig 220 which includes at least one micro-LED 110 attracted by the LED attracting device 230, moves a certain distance and is positioned on top of the PCB 240 And the magnetic attraction of the LED attracting device 230 may be removed at the alignment position of the micro LED 110 of the substrate 240.
  • the micro-LED 110 is separated from the moving jig 220, and a process (for example, soldering or the like) in which the connection pad 112 is electrically connected to the conductive pad 231 of the substrate 240, Can be implemented.
  • FIG. 4 is a process diagram illustrating a process of transferring a micro-LED according to various embodiments of the present invention.
  • 5A to 5H are schematic diagrams illustrating a process of transferring a micro-LED according to various embodiments of the present invention.
  • the electrical device 110 includes a micro-LED 110 having a size of sub-pixel units (e.g., 30 to 40 mu m in size) constituting a pixel of a display (e.g., the display 800 of Fig. 8) .
  • the micro-LED 110 can be fabricated on a base substrate (e.g., a wafer) (e.g., the base substrate 100 of FIG. 1A) through a high-level semiconductor process.
  • a plurality of electrical elements (hereinafter referred to as "micro-LEDs") fabricated on a base substrate (for example, the base substrate 100 of FIG. 1A) are subjected to a cutting process (eg, singulation and flipping) And can be arranged in the fixing jig 210 by a pickup device.
  • a cutting process eg, singulation and flipping
  • the fixing jig 210 is provided on the first receiving groove 2111 in such a manner as to accommodate at least a part of each of the micro-LEDs 110 on the plurality of first receiving grooves 2111. In this embodiment, It is possible to prevent the LED from randomly flowing.
  • At least one immobilization jig 210 may include a pixel (e.g., pixel P of FIG. 8) of a display (e.g., display 800 of FIG. 8)
  • the microLEDs 110 in units of subpixels e.g., subpixels Pr, Pg, Pb in FIG. 8) may be separately included.
  • one fixing jig e.g., the first fixing jig 210-1 in Fig. 3
  • another fixing jig e.g., the second fixing jig 210-2 in Fig. 3
  • the remaining one fixing jig (for example, the third fixing jig 210-3 in FIG. 3) can accommodate only a plurality of micro LEDs 110 that display B colors.
  • the moving jig 220 may be disposed on the upper portion of the fixing jig 210 in the 405 operation.
  • the micro-LED 110 arranged in each of the plurality of first receiving grooves 2111 moves the moving jig 220 to the upper portion of the fixing jig 210, At least some areas may be accommodated in each of the second receiving grooves 2211 formed in the bottom surface 221 of the base plate 220.
  • the first receiving groove 2111 of the fixing jig 210 and the second receiving groove 2211 of the moving jig 220 are moved in the upward direction of the fixing jig 210, And the micro-LED 110 may be supported on the space formed by the first receiving groove 2111 and the second receiving groove 2211.
  • the micro-LED 110 arranged in each of the plurality of first receiving grooves 2111 moves the moving jig 220 to the upper portion of the fixing jig 210, At least some areas may be accommodated in each of the second receiving grooves 2211 formed in the bottom surface 221
  • a magnetic force can be applied to the moving jig 220.
  • the LED attracting device 230 attracts the micro-LED 110 including the element (for example, the element 113 of FIG. 1B)
  • the magnetic force generating device may include a magnetic force generating device. 5B and 5C, the LED attracting device 230 may be disposed on the upper portion of the moving jig 220, and may be disposed in such a manner as to move in the direction of the moving jig and come close to or in contact with the moving jig 220 have.
  • the micro-LED 110 attached via the attraction of the attracting device can be moved to the PCB (PCB) 240 using the moving jig 220.
  • the micro-LED mounted on the first receiving groove 2111 of the fixing jig 210 110 may be moved to the second receiving groove 2211 of the moving jig 220 by the magnetic force of the LED attracting device 230 and then the position thereof may be fixed.
  • the transport jig 220 can then be transported to the top of the substrate 240 (e.g., main substrate) used for an electronic device (e.g., a display) by a transport mechanism.
  • the micro-LED 110 can be mounted on the substrate 240.
  • the moving jig 220 can be moved to an upper portion of the substrate 240.
  • the moving jig 220 can be moved in such a manner that the connection pad 112 of the micro-LED 110 is in close proximity to or in contact with the top of the substrate 240.
  • the LED attracting device 230 can be removed from the magnetic force.
  • the LED attracting device 230 may be moved away from the moving jig 220 in order to remove the magnetic force, or the magnetic force applied to the LED attracting device may be removed by electrical disconnection (for example, in the case of an electromagnet) .
  • the micro-LEDs 110 may be disposed in such a manner as to contact the upper surface of the substrate 240.
  • the micro LEDs 110 may be disposed in a manner such that the connection pads 112 physically contact the conductive pads 241 of the substrate 240 and may be electrically coupled to the conductive pads 241 of the substrate 240 by an electrical bonding process such as soldering, Or the like) to be electrically connected to the substrate 240.
  • 6A to 6D are views showing a configuration of a fixing jig for aligning micro-LEDs according to various embodiments of the present invention.
  • the fixing jig 610 does not have a separate receiving groove formed on the upper surface 611 thereof.
  • an adhesive member 612 may be disposed on the upper surface 611 of the fixing jig 610 instead of the receiving groove.
  • the micro-LED 110 is transported from a base substrate (e.g., the base substrate 100 of FIG. 1A) and can be maintained in a rearranged position via the adhesive member 612 of the fixing jig 610 have.
  • the adhesive property of the adhesive member 612 can be set to be weaker than the attracting force (e.g., magnetic force, vacuum suction force, etc.) of the attracting device 230 disposed at the upper portion of the moving jig 220.
  • the fixing jig 610 may be formed of an uncured resin (such as liquid poly (PI), polydimethylsiloxane (PDMS), polyethylene terephthalate (EP), epoxy or the like, UV tape, A tape (non-UV tape) or a heat foaming tape or the like may be used together with the adhesive member 612.
  • an uncured resin such as liquid poly (PI), polydimethylsiloxane (PDMS), polyethylene terephthalate (EP), epoxy or the like, UV tape, A tape (non-UV tape) or a heat foaming tape or the like may be used together with the adhesive member 612.
  • the fixing jig 620 may include a receiving groove 6211 formed to be lower than the upper surface 621 to accommodate at least a portion of the micro-LED 110, as described above.
  • an adhesive member 622 may be disposed on the bottom surface of the receiving groove 6211. [ According to one embodiment, the adhesive member 622 may assist the function of the receiving groove 6211 to prevent the micro LED 110 from flowing arbitrarily.
  • an LED attraction device 632 may be disposed below the fixing jig 630.
  • the LED attracting device 632 is configured to lower the micro LED 110 including the element (e.g., the element 113 of FIG. 1B) that is responsive to the magnetic force lower than the upper surface 631 of the fixing jig 630 And a magnetic force generating device for holding it in the formed receiving groove 6311.
  • the LED attracting device 632 may be a magnet or an electromagnet of various materials described above.
  • an LED attraction device 642 may be disposed below the fixing jig 640.
  • the LED attraction device 642 may include a vacuum device.
  • the fixing jig 640 is formed lower than the upper surface 641 and may include a plurality of receiving grooves 6411 for receiving the respective micro LEDs 110.
  • each of the receiving grooves 6411 may have an intake hole 6412 from the bottom of the receiving groove 6411 to a bottom surface opposite to the top surface of the fixing jig 640,
  • the attracting device 642 can maintain the vacuum suction state so that the micro-LEDs 110 accommodated in the receiving grooves 6411 through the suction holes 6412 are not detached from the receiving grooves 6411 or are not allowed to flow.
  • the vacuum suction state by the attracting device 642 is selectively applied or removed depending on whether the micro jig 110 is conveyed by the moving jig (e.g., the moving jig 220 in Fig. 3) .
  • FIG. 7 is a configuration diagram of a transfer device according to various embodiments of the present invention.
  • the transfer device 700 may include a moving jig 720 to which an LED attraction device 730 using vacuum suction is applied.
  • the LED attraction device 730 may include a vacuum device.
  • the moving jig 720 is formed lower than the bottom surface 721 and may include a plurality of receiving grooves 7211 for receiving the respective micro-LEDs 110.
  • Each of the receiving grooves 7211 may be formed with an intake hole 7212 from the bottom surface of the receiving groove 7211 to an upper surface facing the bottom surface 721 of the moving jig 720,
  • the LED driving device 730 uses a vacuum suction state such that the micro-LED 110 accommodated in the receiving groove 7211 can be separated from the receiving groove 7211 through the suction hole 7212, Lt; / RTI >
  • the vacuum suction state by the attraction device 730 can be selectively applied or removed depending on whether the micro jig 720 moves the micro-LED 110 or not.
  • the LED attraction device using a vacuum suction or a magnetic force can be applied to a fixing jig or a moving jig, or to both a fixing jig and a moving jig.
  • FIG. 8 is a view showing a screen configuration of a display manufactured using micro-LEDs transferred using a transfer device according to various embodiments of the present invention.
  • FIG. 8 is a schematic view showing a state in which micro-LEDs (for example, the micro-LEDs 110 in FIG. 1A) are arranged for sub-pixels Pr, Pg and Pb from the parent substrate 100 (For example, the micro-LED 110 of FIG. 1A) corresponding to the pixel is disposed on a substrate (e.g., a substrate of the display 800) of the display 800, (E.g., the substrate 240 in Fig. 3).
  • the display 800 may have a plurality of pixels P arranged at regular intervals, and each pixel may include sub-pixels Pr, Pg, and Pb.
  • micro-LEDs corresponding to the respective sub-pixels Pr, Pg and Pb are transferred by the transfer device according to the invention to the substrate of the display 800 (e.g. the substrate 240 of FIG. 3) It can be mounted quickly and accurately.
  • FIG. 9 is a view showing a process of rearranging a plurality of prepared micro-LED chips according to various embodiments.
  • a plurality of micro-LED chips (R / G / B) that are attached in an aligned fashion include elements constituting a display pixel such as pitch, color (R / G / B) And may be rearranged on the temporary fixing film 122 in accordance with a gap or the like.
  • R represents a micro-LED chip emitting red color
  • G represents a micro-LED chip emitting green color
  • B represents a micro-LED chip emitting blue color.
  • a method of rearranging a plurality of micro-LEDs is performed by using micro-LED chips R / G / B by using a pickup tool or picker 925
  • the LED chip can be picked up and fixed on the temporary fixing film 922.
  • the method of rearranging the plurality of micro-LED chips R / G / B may be a method of picking up the micro-LED chips R / G / B and transferring them to a temporary fixing film, (R / G / B) is picked up and fixed on a temporary fixing film, or a method of picking up a micro-LED chip (R / G / B) using a magnetic field and fixing it on a temporary fixing film, (R / G / B) is picked up and fixed on a temporary fixing film by using a micro-LED chip (R / G / B) Any of which may be applied.
  • the aligned micro LEDs G for emitting green color and the micro LEDs for emitting red color are prepared, (R / G / B) selected by the R / G / B can be moved and rearranged on the temporary fixing film 922.
  • Arrow directions (?,?,?) Indicate the moving direction of the pickup device 925.
  • the moving direction of the pick-up device 925 moves the selected micro LED chip R / G / B vertically upward (1), horizontally (2), vertically downward (3)
  • the micro-LED chip (R / G / B) can be rearranged by being placed on the temporary fixing film 925.
  • the shifted microLED chip (R / G / B) can be fixed in a state in which RGB is rearranged into one set.
  • the temporary fixing film 925 can be attached to the carrier film 920. [ Thereafter, the micro-LED chips attached on the temporary fixing film 925 are formed in a board form by a molding process and can be fixed by a molding portion.
  • FIG. 10A is a diagram showing a rearrangement device of a micro-LED chip according to various embodiments of the present invention, and shows a state before pickup of a micro-LED chip.
  • FIG. 10B is a diagram showing a state in which the first device is moved downward and attached to a selected micro-LED chip among the micro-LED chip rearrangement devices according to various embodiments of the present invention.
  • FIG. 10C is a view illustrating a state in which the first device moves the selected micro LED chip upward among the micro LED chip rearrangement devices according to various embodiments of the present invention.
  • FIG. 10D is a view showing a state in which a selected micro-LED chip is attached to a temporary fixing film after the first device is horizontally moved and moved downward, among the rearrangement devices of micro-LED chips according to various embodiments of the present invention.
  • the rearrangement device 101 of the present invention may mean that the prepared micro LED chips 1010 are arranged in one set of RGB.
  • the rearrangement device 101 may include a first device 1000 for selectively picking up, transporting and dropping the prepared micro-LED chip 1010.
  • the rearrangement device 101 includes a second device 1020 that prevents the micro-LED chips from being picked up or flowing out of the prepared micro-LED chips 1010 that are adjacent to the picked-up micro- can do.
  • the first apparatus 1000 may be referred to as a pick-up apparatus or a transfer apparatus
  • the second apparatus 1020 may be referred to as a holding apparatus or holding apparatus.
  • the first device 1000 may be located above the prepared microdevice chip 1010 and may be referred to as an upper device and the second device 1020 may be located below the prepared microdevice chip 1010, .
  • the first device 1000 can pick up the micro-LED chip 1010 using the adhesive force of the adhesive member 1003 and precisely pick up the prepared micro-LED chip 1010 using the attraction force .
  • the prepared micro-LED chip 1010 may be a plurality of micro-LED chips mounted on the carrier film 1011.
  • the micro-LED chips 1010 attached on the carrier film 1011 are arranged on the second device 1020 before being picked up, so that the pre-pickup state can be prepared.
  • the first apparatus 1000 may include a first vacuum 1001, a first porous material portion 1002, and a first adhesive member 1003.
  • the first vacuum 1001 may be received in an enclosed structure in an outer casing frame (not shown) and spatially connected to the first porous material 1002.
  • the first vacuum 1001 can be turned on or off by a control unit (not shown).
  • the first porous material 1002 may include a plurality of first through holes 1002a spatially connected to the first vacuum 1001. Each of the first through holes 1002a may be regularly arranged in the first porous material portion 202. [ However, the first through apertures 1002a may be non-regularly arrayed, and may be symmetrically or non-symmetrically arranged. Also, the first through-hole 1002a may extend linearly in cross-section. However, the cross-sectional shape of the first through-hole need not be limited to a linear shape, but may be non-linear, e.g., a curved shape.
  • Each of the first through holes 1002a is formed in the shape of a hole and the first portion (one end portion) is directed toward the first vacuum 1001 and the second portion (the other end) And can face the first adhesive member 1003.
  • the first adhesive member 1003 can be adsorbed to the first porous material portion in accordance with the ON operation of the first vacuum 1001.
  • the first porous material portion 1002 may include at least one concavo-convex portion in a portion facing the first adhesive member 1003.
  • the irregularities may be repeatedly formed in the first porous material portion 1002 at regular intervals.
  • the concave-convex portion may include a protrusion 10020 and a concave portion 10022 disposed adjacent to the protrusion 10020.
  • the micro-LED chip 1010 can be selectively picked up by the protrusion 10020.
  • the protrusion 10020 may protrude downward and may be spaced away from the prepared micro-LED chip 1010. This state is shown in FIG. 10A.
  • the protrusions 10020 and the recesses 10022 may be alternately arranged along the portion of the first porous material portion 1002 facing the first contact member 1003.
  • the protrusion height of the protrusion 10020 may be formed to be the same.
  • the irregular portion can be manufactured by laser processing, plasma processing, machining, or the like.
  • the micro-LED chip 1010 is attached to a portion of each first adhesive member 1003 facing each projection portion 10020, It can be.
  • the protrusions 10020 include an adsorption face 10020a facing the first adhesive member 1003 and the adsorption face 10020a is bonded to the first adhesive 10020 in accordance with the ON action of the first vacuum 1001. [ Can be adsorbed to at least part of the member (1003). Further, at the time of turning off the first vacuum 1001, at least a part of the first adhesive member 1003 may be disposed apart from each of the projections 10020 or the adsorption face 10020a of the projections.
  • the second device 1020 may include a second vacuum 1021, a second porous material 1022, and a second adhesive material 1023.
  • the second vacuum 1021 may be received in the sealed structure of the outer casing frame and spatially connected to the second porous material 1022.
  • the second vacuum 1021 can be turned on or off by a control unit (not shown).
  • the second porous material 1022 may include a plurality of second through holes 1022a spatially connected to the second vacuum 1001. [ Each of the second through-holes 1022a may be regularly arranged in the second porous material portion 1022. [ However, the second through-holes 1022a may be non-regularly arrayed, and may be symmetrically or non-symmetrically arranged. Also, the second through-hole 1022a may extend linearly in cross-section. However, the cross-sectional shape of the second through-hole need not be limited to a linear shape, but may be non-linear, e.g., a curved shape.
  • Each of the second through holes 1022a is formed as a hole and the first portion (one end portion) is directed toward the first vacuum 1021, the second portion is directed toward the second adhesive member 1022, It can face the adhesive member 1022.
  • the second bonding member 1023 can be adsorbed to the second porous material portion 1022 in accordance with the ON operation of the second vacuum 1021.
  • the second adhesive member 1023 may be fixed to the second porous material 1022 and may be disposed in the second porous material 1022 by the second vacuum 1021 .
  • the second adhesive member 1023 may be at least partially attached to the carrier film 1011 to which a plurality of micro-LED chips 1010 are attached.
  • the rearrangement device 100 may configure the first and second porous material portions 1002 and 1022 to be different from each other.
  • the different structures may be the number, shape or diameter of each of the first and second through-holes 1002a and 1022a, and the like.
  • the first through-hole 1002a may be configured to be larger than the second through-hole 1022a.
  • the diameter of the first through-hole 1002a may be larger than the diameter of the second through-hole 1022a.
  • the first attraction force originating from the first vacuum 1001 through the first through-hole 1002a passes through the second through-hole 1022a and the second suction force resulting from the second vacuum 1021 Can be configured to be larger than the attraction force.
  • the materials of the first and second porous materials 1002 and 1022 may include any one of metals, films, wafers, and ceramics including aluminum oxide.
  • each of the first and second adhesive members 1003 and 1023 may include an ultraviolet curable material or a heat foaming resin including any one of epoxy, acrylic, polyester, polyurethane, and silicone have.
  • the plurality of micro-LED chips 10010 can be rearranged in an aligned state on the prepared temporary fixing film 1030 by the rearrangement apparatus 100 according to various embodiments.
  • the first adhesive force between the picked-up Micro LED chip 1010 and the first adhesive member 1002 may be smaller than the second adhesive force between the micro-LED chip 1010 and the temporary fixing film 1030.
  • the micro-LED chip 210 can be attached to the temporary fixing film 1030.
  • the rearrangement apparatus 100 allows the first adhesive member 1003 to precisely pick up the microdroid chip 1010 prepared with the first adhesive force, It is possible to precisely pick up and rearrange a large number of micro-LED chips at a time, since the pickup micro-LED chip 1010 is prevented from being tilted when the pick-up force is picked up.
  • 11A is a view showing a cross section of an adhesive member according to various embodiments of the present invention.
  • 11B is a cross-sectional view of another adhesive member according to various embodiments of the present invention.
  • each of the first and second adhesive tapes may be composed of one side or both sides of the tape.
  • the adhesive member 1130 may be the same adhesive member as the first adhesive member 1003 shown in FIG. 10A.
  • the adhesive member 1130 may include a resin layer 11301 and an adhesive layer 11302 formed on one side of the resin layer 11301.
  • the prepared micro-LED chip can be attached to the adhesive layer 11302.
  • Such an adhesive member 1130 may be a one-sided adhesive tape.
  • the adhesive member 1132 may be the same adhesive member as the first adhesive member 1003 shown in FIG. 2A.
  • the adhesive member 1132 may include a resin layer 11321 and first and second adhesive layers 11322 and 11323 formed on one surface and the other surface of the resin layer 11321.
  • the prepared micro-LED chip can be attached to the first adhesive layer 11322.
  • Such an adhesive member 1132 may be a double-sided adhesive tape.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Selon divers modes de réalisation, l'invention concerne un appareil de transfert d'élément électrique comprenant : un gabarit de fixation dans lequel chacun d'une pluralité d'éléments électriques est agencé à un intervalle prédéterminé ; un gabarit de mouvement agencé de façon mobile au niveau d'une partie supérieure du gabarit de fixation, et comprenant une pluralité de premières rainures de réception pour recevoir au moins une partie de chacun de la pluralité d'éléments électriques ; et un dispositif d'attraction disposé autour du gabarit mobile et fixant chacun de la pluralité d'éléments électriques à travers le gabarit mobile à la première rainure de réception du gabarit mobile par l'intermédiaire d'une force magnétique. Divers autres modes de réalisation sont possibles.
PCT/KR2018/007836 2017-08-14 2018-07-11 Appareil de transfert d'élément électrique WO2019035557A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/638,645 US11805633B2 (en) 2017-08-14 2018-07-11 Electrical element transfer apparatus
CN201880052299.1A CN110998819B (zh) 2017-08-14 2018-07-11 电气元件传送装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20170102922 2017-08-14
KR10-2017-0102922 2017-08-14
KR20170112421 2017-09-04
KR10-2017-0112421 2017-09-04
KR10-2018-0069718 2018-06-18
KR1020180069718A KR102572669B1 (ko) 2017-08-14 2018-06-18 전기 소자 이송 장치

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WO2019035557A1 true WO2019035557A1 (fr) 2019-02-21

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CN113785388A (zh) * 2019-04-25 2021-12-10 脸谱科技有限责任公司 用于转移半导体器件的桥拾取头
EP4009354A1 (fr) * 2020-12-03 2022-06-08 Commissariat à l'Energie Atomique et aux Energies Alternatives Outil de transfert collectif de micropuces d'un substrat source vers un substrat destination

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JP2009253019A (ja) * 2008-04-07 2009-10-29 Denso Corp 半導体チップのピックアップ装置及び半導体チップのピックアップ方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113785388A (zh) * 2019-04-25 2021-12-10 脸谱科技有限责任公司 用于转移半导体器件的桥拾取头
EP4009354A1 (fr) * 2020-12-03 2022-06-08 Commissariat à l'Energie Atomique et aux Energies Alternatives Outil de transfert collectif de micropuces d'un substrat source vers un substrat destination
FR3117265A1 (fr) * 2020-12-03 2022-06-10 Commissariat A L'energie Atomique Et Aux Energies Alternatives Outil de transfert collectif de micropuces d'un substrat source vers un substrat destination

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