WO2019108045A1 - Appareil de transfert de composant électronique - Google Patents

Appareil de transfert de composant électronique Download PDF

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Publication number
WO2019108045A1
WO2019108045A1 PCT/KR2018/015198 KR2018015198W WO2019108045A1 WO 2019108045 A1 WO2019108045 A1 WO 2019108045A1 KR 2018015198 W KR2018015198 W KR 2018015198W WO 2019108045 A1 WO2019108045 A1 WO 2019108045A1
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WO
WIPO (PCT)
Prior art keywords
plate
hole
pin
electronic
holes
Prior art date
Application number
PCT/KR2018/015198
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English (en)
Korean (ko)
Inventor
이창준
이병훈
박민
장경운
윤정근
장현태
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180069255A external-priority patent/KR102594397B1/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to CN201880077784.4A priority Critical patent/CN111418050A/zh
Priority to US16/761,905 priority patent/US11355365B2/en
Publication of WO2019108045A1 publication Critical patent/WO2019108045A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Definitions

  • Various embodiments of the present invention are directed to an apparatus for transferring electronic devices.
  • An LED Light Emitting Diode
  • LCD panel can not directly emit light, and indirectly uses external light to output light, which limits the improvement of light efficiency. Accordingly, it is necessary to improve the OLED panel in terms of difficulty in enlargement, low yield in mass production, and deterioration in luminance characteristics when used for a long period of time. Therefore, a new type of display Devices are required.
  • the various embodiments of the present invention are intended to provide a transfer device capable of transferring a large number of electronic devices at a time to a fine-sized electronic device such as an LED package.
  • the microchip gripper includes a pin plate having one side joined to another device; A hole plate having one surface facing the other surface of the fin plate and spaced apart from each other by a predetermined distance, driven together with the driving of the pin plate, and having a plurality of holes having a predetermined pattern; A pin inserted into the hole of the hole plate and having one end supported by the pin plate; And an adhesive layer covering the other surface of the hole plate.
  • a microchip transfer apparatus includes a main body; A robot arm connected to the main body and rotating or linearly moving; A pin plate having one surface coupled to an end of the robot arm; A hole plate having one surface facing the other surface of the fin plate and spaced apart from each other by a predetermined distance, driven together with the driving of the pin plate, and having a plurality of holes having a predetermined pattern; A pin inserted into the hole of the hole plate and having one end supported by the pin plate; And an adhesive layer covering the other surface of the hole plate.
  • the microchip gripper includes a pin plate having one side joined to another device; A hole plate having one surface facing the other surface of the fin plate and spaced apart from each other by a predetermined distance, driven together with the driving of the pin plate, and having a plurality of holes having a predetermined pattern; A pin inserted into the hole of the hole plate and having one end supported by the pin plate; And an adhesive layer covering the other surface of the hole plate.
  • a microchip transfer apparatus includes a main body; A robot arm connected to the main body and rotating or linearly moving; A pin plate having one surface coupled to an end of the robot arm; A hole plate having one surface facing the other surface of the fin plate and spaced apart from each other by a predetermined distance, driven together with the driving of the pin plate, and having a plurality of holes having a predetermined pattern; A pin inserted into the hole of the hole plate and having one end supported by the pin plate; And an adhesive layer covering the other surface of the hole plate.
  • An electronic device transfer apparatus includes: a plurality of pins; A first plate coupled to the plurality of pins to support the plurality of pins; And a second surface facing the first surface, the second surface facing the first surface of the first plate, and the second surface facing the first surface in a direction opposite to the first surface, wherein the plurality of holes A second plate comprising a first plate; And a third plate having a first surface attached to the second surface of the second plate and including a plurality of hole areas through which the plurality of pins can pass as the first plate is driven, May comprise a PDMS (polydimethylsiloxane) layer.
  • PDMS polydimethylsiloxane
  • a large number of electronic devices can be transferred to the substrate quickly and accurately.
  • a transfer device capable of transferring a large number of micro-sized electronic devices such as a micro-LED package at one time.
  • the electronic device to be held e.g., a microchip
  • the angle at which the transfer device (e.g., microchip gripper) approaches the electronic device is inclined,
  • the electronic device can be transferred to a desired position without missing.
  • FIG. 1 is a conceptual diagram showing a transfer apparatus according to various embodiments of the present invention.
  • FIGS. 2A to 2D are diagrams sequentially illustrating a method of holding an electronic device by a transfer device according to various embodiments of the present invention.
  • 3A to 3C are views sequentially showing a method of transferring an electronic device by a transfer device according to various embodiments of the present invention
  • 4A is a cross-sectional view of a transfer device of an electronic device according to various embodiments of the present invention.
  • 4B is a cross-sectional view of a transfer device of an electronic device according to various embodiments of the present invention.
  • 5A to 5F are views showing a method of transferring by an image transferring apparatus according to various embodiments of the present invention.
  • FIG. 6 is a view for explaining a shape of a plurality of pins included in a transfer device of an electronic device according to an embodiment of the present invention.
  • FIG. 7 is a view showing a method of forming a plurality of hole areas in a hole plate according to various embodiments of the present invention.
  • the expressions "A or B,” “at least one of A or / and B,” or “one or more of A and / or B,” etc. may include all possible combinations of the listed items .
  • “A or B,” “at least one of A and B,” or “at least one of A or B” includes (1) at least one A, (2) Or (3) at least one A and at least one B all together.
  • first,” “second,” “first,” or “second,” etc. used in various embodiments may describe various components in any order and / or importance, Lt; / RTI > The representations may be used to distinguish one component from another.
  • the first user equipment and the second user equipment may represent different user equipment, regardless of order or importance.
  • the first component may be referred to as a second component, and similarly, the second component may be named as the first component.
  • any such element may be directly connected to the other element or may be connected through another element (e.g., a third element).
  • a component e.g., a first component
  • another component e.g., a second component
  • there is no other component e.g., a third component
  • the phrase " configured to " (or set) to be " configured according to circumstances may include, for example, having the capacity to, To be designed to, "" adapted to, “” made to, “or” capable of ".
  • the term " configured (or set) to " may not necessarily mean " specifically designed to " Instead, in some situations, the expression " configured to " may mean that the device can " do " with other devices or components.
  • a processor configured (or configured) to perform the phrases " A, B, and C " may be a processor dedicated to performing the operation (e.g., an embedded processor), or one or more software programs
  • a generic-purpose processor e.g., a CPU or an application processor
  • An electronic device may be a device including a communication function.
  • the electronic device can be a smartphone, a tablet personal computer, a mobile phone, a videophone, an e-book reader, a desktop personal computer, a laptop
  • a laptop Such as a laptop personal computer (PC), a netbook computer, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device
  • a head-mounted device such as electronic glasses, an electronic garment, an electronic bracelet, an electronic necklace, an electronic app apparel, an electronic tattoo, or a smart watch.
  • the electronic device may be a smart home appliance with communication capabilities.
  • Smart household appliances such as electronic devices, are widely used in the fields of television, digital video disk (DVD) player, audio, refrigerator, air conditioner, vacuum cleaner, oven, microwave oven, washing machine, air cleaner, set- (E. G., Samsung HomeSync, Apple TV, or Google TV), game consoles, electronic dictionaries, electronic keys, camcorders, or electronic frames.
  • the electronic device may be a variety of medical devices (e.g., magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT) (global positioning system receiver), EDR (event data recorder), flight data recorder (FDR), automotive infotainment device, marine electronic equipment (eg marine navigation device and gyro compass), avionics,
  • MRA magnetic resonance angiography
  • MRI magnetic resonance imaging
  • CT computed tomography
  • EDR event data recorder
  • FDR flight data recorder
  • automotive infotainment device e.g., a head unit for a vehicle, an industrial or home robot, an ATM (automatic teller machine) of a financial institution, or a point of sale (POS) of a shop.
  • POS point of sale
  • the electronic device may be a piece of furniture or a structure / structure including a communication function, an electronic board, an electronic signature receiving device, a projector, (E.g., water, electricity, gas, or radio wave measuring instruments, etc.).
  • An electronic device according to various embodiments of the present invention may be one or more of the various devices described above. Further, the electronic device according to various embodiments of the present invention may be a flexible device. It should also be apparent to those skilled in the art that the electronic device according to various embodiments of the present invention is not limited to the above-described devices.
  • FIG. 1 is a conceptual view showing a microchip gripper 100 according to an embodiment of the present invention.
  • the microchip gripper 100 may refer to a transfer device for transferring a fine-sized electronic device.
  • the microchip gripper 100 may include a fin plate 110, a hole plate 120, a fin 140, and an adhesive layer 130.
  • the pin plate 110 may be a basic skeleton of the microchip gripper 100, and one side thereof may be engaged with other devices.
  • the pin plate 110 may be connected to a power source for operating the microchip gripper 100, or may be coupled to a robot arm (not shown) connected to a main body (not shown) of the microchip transfer apparatus.
  • the other surface of the pin plate 110 may contact the pin 140 to support the pin 140.
  • the hole plate 120 may face the other surface of the pin plate 110 and be spaced apart from the pin plate 110 by a predetermined distance.
  • the hole plate 120 may be disposed in parallel with the pin plate 110, but spaced apart from the pin plate 110 and spaced apart.
  • the hole plate 120 may have a minute hole through which the fin 140 to be described later can pass.
  • the hole plate 120 may include a plurality of holes, and the holes of the hole plate 120 may have a size and / or arrangement of electronic devices (e.g., microchips) to be held by the microchip gripper 100, As shown in Fig.
  • the transfer device 100 may include holes At least a portion of the electronic components of the wafer may be gripped.
  • the hole plate 120 may include at least one protrusion 123 at a position corresponding to the position of the plurality of holes.
  • the protrusion 123 may be formed at least partially protruding from the other surface of the hole plate 120.
  • the position of the protrusion 123 may overlap with the position of the hole, and a hole may be formed through the protrusion 123.
  • At least one or more holes may be formed corresponding to the number of protrusions 123.
  • a plurality of holes may be formed in one protrusion 123.
  • the projecting portion 123 may serve to press the adhesive layer 130 so that the electronic element and the adhesive layer 130 can be adhered to each other in the course of holding the electronic element by the adhesive force of the adhesive layer 130, 140 may comprise a resilient material.
  • the fin 140 may include platinum, silver, nickel, copper, gold, or an alloy thereof.
  • the pin 140 may be inserted and disposed at each hole formed in the hole plate 120, and may move through the hole. For example, when a plurality of holes are formed in the protrusion 123, one pin 140 may be disposed in each hole, and a plurality of pins 140 may be disposed on one protrusion 123, And through the hole.
  • the pin 140 may be formed at least partially longer than the distance from the other surface of the pin plate 110 to the other surface of the hole plate 120. For example, when one end of the pin 140 contacts the pin plate 110, the other end may protrude through the hole of the hole plate 120. For example, the other end of the protruded fin 140 may push out the adhesive layer 130 to reduce the area where the electronic element and the protrusion 123 of the hole plate 120 are bonded, Thereby reducing the adhesive force to the device.
  • At least a part of the bend 141 may be formed in the fin 140 corresponding to a predetermined space defined between the pin plate 110 and the hole plate 120.
  • the elastic force of the bending 141 can prevent the pin 140 from slipping off the hole plate 120 completely.
  • the bending 141 of the pin 140 may cause the pin 140 to bend, while the other end of the pin 140 provides an elastic force to push the adhesive layer 130 in the course of the adhesive layer 130 gripping the electronic device. So that it can be guided in the direction of deformation so as to be slid vertically through the holes in the hole plate 120.
  • the adhesive layer 130 may be formed to cover at least a part of the other surface of the hole plate 120.
  • the adhesive layer 130 is a portion in direct contact with the electronic element to be gripped, and can hold the electronic element by the adhesive force of the adhesive layer 130.
  • the adhesive layer 130 may include at least one of an adhesive tape, for example, an acrylic adhesive, an epoxy adhesive, a UV curable adhesive, and a thermosetting adhesive tape, and may include adhesive silicone.
  • an adhesive tape for example, an acrylic adhesive, an epoxy adhesive, a UV curable adhesive, and a thermosetting adhesive tape, and may include adhesive silicone.
  • FIGS. 2A to 2D are views sequentially showing a method of holding an electronic device by a transfer device (for example, a microchip gripper) 100 according to an embodiment of the present invention.
  • a transfer device for example, a microchip gripper
  • the electronic device to be gripped may be, for example, a micro LED chip mounted on a display panel.
  • the micro LED chips to be mounted are arranged corresponding to the respective pixels of the display panel and are directly connected to the resolution of the display panel, and the microchips may be omitted or precisely arranged without being distorted.
  • protrusions 123 and / or holes of the hole plate 120 may be formed corresponding to positions of electronic elements to be gripped.
  • the transfer device 100 approaches the electronic device to be gripped as shown in FIG. 2B, and the adhesive layer 130 can contact the electronic device.
  • some of the electronic devices may be held by the contact with the adhesive layer 130, but the difference in adhesive strength between the adhesive layers 130 or the flatness of the plane At least some of the electronic components may not be gripped.
  • the hole plate 120 approaches the electronic elements, even if the electronic elements do not approach the plane in which they are placed, the at least some of the electronic elements may not be grasped.
  • the protrusion 123 of the hole plate 120 presses the adhesive layer 130 and the electronic elements so that the respective electronic elements are bonded to the adhesive layer 130. As shown in FIG. can do.
  • the projecting pin 140 may be pushed into the hole plate 120 at least partially by the bending portion 141.
  • the pins 140 are projected again to push the electronic devices, thereby reducing the area of adhesion between the adhesive layer 130 and the electronic devices .
  • the electronic device may not be separated from the adhesive layer 130 in the process of separating the electronic device from the transfer device 100.
  • the adhesive force between the adhesive layer 130 and the electronic device is lowered by reducing the area of adhesion between the adhesive layer 130 and the electronic device by pushing the electronic device from the pin 140. For example, It can be effectively detached.
  • 3A to 3C are views showing, in order, a method of mounting at least one electronic device on a circuit board by the transfer apparatus 100 according to an embodiment of the present invention.
  • the electronic device to be held by the transfer device 100 may be a micro LED chip mounted on the display panel, and the micro LED chip held on the display panel may be mounted on the circuit board 200.
  • a metal paste such as silver (Ag) or copper (Cu) may be disposed on the circuit board 200 at a position where the micro LED chip is to be mounted, such as lead 210 for soldering, Non-conductive tape or the like may be disposed.
  • the lead 210 may be self-tacky as a molten liquid state, or the lead 210 in powder form may be applied in a viscous state mixed with a flux.
  • the viscosity of the lead 210 disposed on the circuit board 200 is weaker than the adhesion strength between the adhesive layer 130 and the micro LED chip in the state of FIG. 2C, and the adhesive strength between the adhesive layer 130 and the micro LED chip in the state of FIG. It can be stronger than adhesion.
  • the transfer device 100 aligns and positions the electronic elements (for example, micro LED chips) held by the lead 210 on the circuit board 200 .
  • the transfer device 100 is configured to approach the circuit board 200 so that the electronic device can contact the lead 210 of the circuit board 200 as shown in FIG. So that the projection 123 of the plate 120 does not directly press the electronic element.
  • the adhesive force between the electronic element and the adhesive layer 130 may be similar to the adhesive force shown in FIG. 2D.
  • the pin 140 of the transfer apparatus 100 pushes the electronic element to reduce the adhesive area between the adhesive layer 130 and the electronic element
  • the adhesive strength may be in a weakened state.
  • the viscosity of the lead 210 disposed on the circuit board 200 may be stronger than the adhesive force between the adhesive layer 130 and the electronic element shown in FIG. 3B.
  • the electronic device may be detached from the adhesive layer 130 and mounted on the circuit board 200.
  • the transfer apparatus 100 simultaneously grasps a plurality of electronic elements arranged in a predetermined pattern through the processes of FIGS. 2A to 3C, and is mounted on the circuit board 200 without missing or disturbing some electronic elements. can do.
  • An electronic device e.g., a microchip gripper
  • a pin plate having one side joined to another device
  • a hole plate having one surface facing the other surface of the fin plate and spaced apart from each other by a predetermined distance, driven together with the driving of the pin plate, and having a plurality of holes having a predetermined pattern
  • a pin inserted into the hole of the hole plate and having one end supported by the pin plate
  • an adhesive layer covering the other surface of the hole plate.
  • the holes formed in the hole plate may be formed corresponding to the arrangement pattern of the microchips to be held.
  • the protrusion may be formed on the other surface of the hole plate corresponding to the arrangement pattern of the microchip to be gripped.
  • the hole of the hole plate may be formed corresponding to the position of the protrusion.
  • the holes of the hole plate are formed corresponding to the positions of the protrusions, and at least one hole may be formed corresponding to one protrusion.
  • the length of the fin may be longer than the distance from the other surface of the pin plate to the other surface of the hole plate.
  • the pin may be bent at a position corresponding to a space between the pin plate and the hole plate.
  • a microchip transfer apparatus includes a main body; A robot arm connected to the main body and rotating or linearly moving; A pin plate having one surface coupled to an end of the robot arm; A hole plate having one surface facing the other surface of the fin plate and spaced apart from each other by a predetermined distance, driven together with the driving of the pin plate, and having a plurality of holes having a predetermined pattern; A pin inserted into the hole of the hole plate and having one end supported by the pin plate; And an adhesive layer covering the other surface of the hole plate.
  • the holes formed in the hole plate may be formed corresponding to the arrangement pattern of the microchips to be held.
  • the protrusion may be formed on the other surface of the hole plate corresponding to the arrangement pattern of the microchip to be gripped.
  • the hole of the hole plate may be formed corresponding to the position of the protrusion.
  • the holes of the hole plate are formed corresponding to the positions of the protrusions, and at least one hole may be formed corresponding to one protrusion.
  • the length of the fin may be longer than the distance from the other surface of the pin plate to the other surface of the hole plate.
  • the pin may be bent at a position corresponding to a space between the pin plate and the hole plate.
  • 4A is a cross-sectional view of a transfer device of an electronic device according to various embodiments of the present invention.
  • a transfer device for transferring an electronic device includes a first plate 410, a hole plate 430 (e.g., a second plate 432 and a third plate 434) And a plurality of pins 470.
  • the first plate 410 may be coupled to a plurality of pins 470 to support the pins 470.
  • the first plate 410 may be driven to move at least partially up and down.
  • the plurality of pins 470 connected to the first plate 410 can move up and down together with the first plate 410 as the first plate 410 moves up and down.
  • the hole plate 430 may include a first plate 432 and a second plate 434.
  • the second plate 432 may be positioned opposite one side of the first plate 410.
  • the second plate 432 may be attached to a third plate 434 formed of a different material from the second plate 432.
  • the second plate 432 may include a first surface and a second surface.
  • the first side of the first plate 410 faces the first side of the first plate 410, and the second side of the first side of the first plate 410 is opposite to the side of the first plate 410, .
  • the second plate 432 and the third plate 434 may be formed of different materials.
  • the second plate 432 may be formed of a material having excellent flatness characteristics.
  • the second plate 432 may be formed of any one of metal, ceramics, and glass.
  • the third plate 434 may be formed of a material having adhesive force characteristics higher than that of the second plate 432.
  • the third plate 434 may comprise PDMS (polydimethylsiloxane).
  • the second plate 432 and the third plate 434 may each include a plurality of hole regions.
  • the plurality of hole regions may be an area through which a plurality of fins 470 may pass, according to various embodiments of the present invention.
  • each of the plurality of hole regions included in the second plate 432 and the third plate 434 may include a plurality of hole regions that move together with the first plate 410 as the first plate 410 is driven And may be an area through which fins 470 can penetrate.
  • each of the fins 470 may pass through the end of the third plate 434 and protrude or not protrude out of the third plate 434.
  • the hole plate 430 may include a second plate 432 having excellent flatness characteristics and high strength characteristics; And the third plate 434 having excellent adhesive properties, it is possible to transfer the electronic device to the correct position and to form the size of the hole area of the required specification.
  • the hole area of the hole plate 430 needs to satisfy a size condition such that the pin can pass through and the electronic element can not pass through.
  • the electronic device may include an LED package.
  • the electronic device may include a minute element having a long diameter of 1 mm or less.
  • the transfer device of the electronic device may further include a support shaft 490 for supporting the first plate 410 and the second plate 432 when the first plate 410 is driven.
  • the support shaft 490 is rotated by the first plate 410, the second plate 432, and the third plate 432 attached to the second plate 432, It is possible to support each plate such that the plate 434 does not turn in the left and right direction and the plurality of pins 470 are positioned on the same axis as the plurality of hole areas of the second plate 432 and the third plate 434 .
  • the transfer device of the electronic device may further include a fourth plate 450.
  • the fourth plate 450 may serve as a cover so that the first plate 410 does not separate from the support shaft 490 when the first plate 410 is driven.
  • FIG. 4B is a view showing a transfer device for transferring an electronic device according to another embodiment of the present invention. As shown in FIG. 4B, the transfer apparatus according to various embodiments may not include the fourth plate 450, unlike the transfer apparatus of FIG. 4A.
  • 5A to 5F are views showing a method of transferring by an image transferring apparatus according to various embodiments of the present invention.
  • An electronic device transfer apparatus can lift an electronic device (for example, an LED package chip) placed at a specific position to another position.
  • an electronic device for example, an LED package chip
  • the transfer apparatus may be adjusted in position corresponding to the position where the electronic elements 400 of the substrate 501 are placed, in order to lift a plurality of electronic elements 400 placed on the substrate 501 .
  • the transfer apparatus can access the substrate 501 so that the electronic elements 400 of the substrate 501 are attached to the protruding portions 435 of the third plate 434.
  • the transfer device may be lifted up to the upper end of the substrate 501 and the transferred device holding the devices 400 may be moved to another position to transfer the electronic devices 400, The position can be shifted corresponding to a predetermined position of the substrate 503.
  • the substrate 503 may be bonded to the substrate 503 such that when the electronic devices 400 are transferred to the substrate 503, the electronic devices 400 may be bonded to the substrate 503, as shown in Figures 5C and 5D,
  • the solder paste 505 can be applied in advance.
  • the first plate 410, the second plate 432, and the third plate 434 of the transfer device move together without driving the first plate 410 of the transfer device to descend ,
  • the plurality of pins 470 of the transfer apparatus may not come out of the protruding portion 435 of the third plate 434.
  • the electronic elements 400 placed on the substrate 501 are brought into contact with the protrusions 435 of the third plate 434, And can be lifted up by being attached to the base 435.
  • the transfer device of the electronic device moves the first plate 410 by the operation in which the first plate 410 is lowered after the electronic devices 400 are moved to the position to be transferred And can be driven to approach the second plate 432.
  • the plurality of fins 470 are moved downward together with the first plate 410 and the plurality of fins 470 pass through the plurality of hole areas of the second plate 432 and the third plate 434 And can be projected to the outside.
  • the plurality of outwardly projecting pins 470 push out the electronic elements 400 attached to the protrusions 435 of the third plate 434 and move the electronic elements 400 from the protrusions 435, Can be physically separated.
  • the electronic elements 400 are detached from the protruding portion 435 of the third plate 434 and adhered to the substrate 503 due to the difference in adhesion between the third plate 434 and the solder paste 505 of the substrate 503 But can be appropriately transferred to a desired position of the substrate 503 without deviating from a specific position on the substrate 503 by the physical pressing by the plurality of fins 470.
  • the transfer device when the transfer to the electronic elements 400 is completed, the transfer device can move to the upper portion of the substrate 503 and start the transfer operation with respect to the other electronic elements 400.
  • the first plate 410 can be lifted up again after the plurality of pins 470 push the electronic elements 400 out of the protrusions 435,
  • the plurality of fins 470 may move upwardly together into the interior of the third plate 434 and may not protrude outward.
  • FIG. 6 is a view for explaining a shape of a plurality of fins 470 included in a transfer device of an electronic device according to an embodiment of the present invention.
  • a plurality of pins 470 are connected at least partly to the first plate 410, and a structure capable of penetrating a plurality of hole areas of the second plate 432 and the third plate 434 As shown in FIG. 6,
  • the plurality of fins 470 may be formed in a shape in which at least a part of the region is bent in a spaced space between the first plate 410 and the second plate 432.
  • the bent portion is at least partially compressed, and the elastic force of the compressed plurality of pins 470 is lowered, 410).
  • the first plate 410 may move up and down by an external driving force, and may be moved downward by an external driving force, but may be moved upward by using the elastic force.
  • FIG. 7 is a view showing a method of forming a plurality of hole areas in a hole plate according to various embodiments of the present invention.
  • the hole plate of the transfer apparatus may include hole areas through which a plurality of pins can pass.
  • the hole plate may have a shape in which a second plate 432 and a third plate 434 made of different materials are attached together.
  • the second plate 432 may be formed of a material (e.g., metal, ceramic, glass, or the like) having excellent flatness characteristics
  • the third plate 434 may be formed of a material ).
  • the second plate 432 may support the third plate 434 and allow the pins passing through the hole area to be perpendicular to the hole plate.
  • the hole plate can form a plurality of hole areas in consideration of the material characteristics of each plate.
  • the hole areas of the second plate 432 may be formed through drilling in a step before the second plate 432 is mated with the third plate 434.
  • the hole areas of the third plate 434 may be formed by attaching a third plate 434 to a second plate 432 having a hole area formed by a drilling method, And may be formed by irradiating the laser in the region direction.
  • the hole region is formed by the laser irradiation method, as shown in Fig. 7, the hole diameter in the direction in which the laser is irradiated can be formed larger than the hole diameter in the opposite direction.
  • the hole plate in the case of forming the hole plate by only the third plate 434 having the excellent adhesive property without the second plate 432, since the hole area is formed by the laser irradiation method, there is a problem that the hole diameter on both sides of the plate is wide Can be. For example, in the direction in which the hole plate is in contact with the electronic device, if the hole diameter is widened, the electronic device may be smaller than the hole area of the hole plate and may not be lifted. Further, if the hole diameter is wider in the direction in which the hole plate is opposed to the first plate, there is a problem that the pin is excessively shaken at the time of up-down movement and the position is changed.
  • the hole plate is attached to the third plate 434
  • the second plate 432 may be provided with an additional plate 436 having a hole area smaller in diameter than the hole area of the second plate 432 by a drilling method, They can be formed by cementing.
  • the additional plate 436 may be formed of any one of metal, ceramics, and glass.
  • the size of the protrusion of the third plate 434 included in the transfer device and the size of the hole area can be determined according to the size of the electronic device to be transferred and the size of the pin.
  • the protrusion of the third plate 434 may be formed larger than the size of the electronic device.
  • the size of the hole region may be larger than the size of the pin passing through the hole region.
  • the size of the hole region may be 100 to 120% of the size of the pin.
  • the hole area of the third plate may be formed to have a predetermined size corresponding to the size of the fin.
  • the size of the hole region in the direction of looking at the protrusion of the third plate may be about 82 ⁇ m in diameter.
  • the size of the hole region in the direction facing away from the projection of the third plate may be about 146 mu m in diameter.
  • the third plate is formed of a material having excellent adhesion properties, for example, when PDMS is formed, a hole region is formed through a laser irradiation method so that the hole region on one side can be formed larger than the hole region on the other side have.
  • the second plate including the hole area formed to be smaller than the hole area of the third plate is attached to the third plate The excessive shaking of the pin can be prevented.
  • " module &quot may refer to a unit comprising, for example, one or a combination of two or more of hardware, software or firmware.
  • a " module " may be interchangeably used with terms such as, for example, unit, logic, logical block, component, or circuit.
  • a " module " may be a minimum unit or a portion of an integrally constructed component.
  • a " module " may be a minimum unit or a portion thereof that performs one or more functions.
  • &Quot; Modules &quot may be implemented either mechanically or electronically.
  • a "module” may be an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs) or programmable-logic devices And may include at least one.
  • ASIC application-specific integrated circuit
  • FPGAs field-programmable gate arrays
  • programmable-logic devices may include at least one.
  • At least a portion of a device (e.g., modules or functions thereof) or a method (e.g., operations) may include, for example, computer-readable storage media in the form of program modules, As shown in FIG.
  • the instructions when executed by the processor, may cause the one or more processors to perform functions corresponding to the instructions.
  • the computer readable storage medium may be, for example, the memory.
  • the computer readable recording medium may be a hard disk, a floppy disk, a magnetic media (e.g., a magnetic tape), an optical media (e.g., a compact disc read only memory (CD-ROM) but are not limited to, digital versatile discs, magneto-optical media such as floptical discs, hardware devices such as read only memory (ROM), random access memory (RAM) Etc.), etc.
  • the program instructions may also include machine language code such as those produced by a compiler, as well as high-level language code that may be executed by a computer using an interpreter, etc.
  • the above- May be configured to operate as one or more software modules to perform the operations of the various embodiments, and vice versa.
  • Modules or program modules may include at least one or more of the elements described above, some of which may be omitted, or may further include additional other elements. Operations performed by modules, program modules, or other components in accordance with various embodiments may be performed in a sequential, parallel, iterative, or heuristic manner. Also, some operations may be performed in a different order, omitted, or other operations may be added.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un dispositif de préhension de micro-puces comprenant : une plaque à broches dont une surface est accouplée à un autre appareil; une plaque à trous dont une surface est en regard de l'autre surface de la plaque à broches tout en étant disposée de façon à en être espacée d'une distance fixe, et qui est entraînée conjointement avec l'entraînement de la plaque à broches, et dans laquelle une pluralité de trous constituant un motif fixe sont formés; des broches qui sont insérées dans les trous de la plaque à trous et dont une partie d'extrémité est supportée par la plaque à broches; et une couche d'adhérence qui recouvre l'autre surface de la plaque à trous. D'autres modes de réalisation sont possibles.
PCT/KR2018/015198 2017-12-01 2018-12-03 Appareil de transfert de composant électronique WO2019108045A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880077784.4A CN111418050A (zh) 2017-12-01 2018-12-03 电子组件的传送设备
US16/761,905 US11355365B2 (en) 2017-12-01 2018-12-03 Transfer apparatus of an electronic component

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20170164103 2017-12-01
KR10-2017-0164096 2017-12-01
KR20170164096 2017-12-01
KR10-2017-0164103 2017-12-01
KR10-2018-0069255 2018-06-15
KR1020180069255A KR102594397B1 (ko) 2017-12-01 2018-06-15 전자 소자의 전사 장치

Publications (1)

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WO2019108045A1 true WO2019108045A1 (fr) 2019-06-06

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WO (1) WO2019108045A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140042320A (ko) * 2012-09-28 2014-04-07 하나 마이크론(주) 유연 집적회로 소자 패키지 제조용 전사 장치
KR20140053883A (ko) * 2011-04-15 2014-05-08 뮐바우어 아게 전자 부품을 제1 캐리어로부터 제2 캐리어로 이송하기 위한 장치 및 방법
US20150111329A1 (en) * 2011-07-25 2015-04-23 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
KR20170099028A (ko) * 2016-02-22 2017-08-31 삼성디스플레이 주식회사 전사 장치, 이를 이용한 전사 방법 및 표시 장치
KR101800367B1 (ko) * 2016-08-24 2017-11-28 한국기계연구원 마이크로 소자 전사방법 및 마이크로 소자 전사방법으로 제조된 마이크로 소자 기판

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140053883A (ko) * 2011-04-15 2014-05-08 뮐바우어 아게 전자 부품을 제1 캐리어로부터 제2 캐리어로 이송하기 위한 장치 및 방법
US20150111329A1 (en) * 2011-07-25 2015-04-23 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
KR20140042320A (ko) * 2012-09-28 2014-04-07 하나 마이크론(주) 유연 집적회로 소자 패키지 제조용 전사 장치
KR20170099028A (ko) * 2016-02-22 2017-08-31 삼성디스플레이 주식회사 전사 장치, 이를 이용한 전사 방법 및 표시 장치
KR101800367B1 (ko) * 2016-08-24 2017-11-28 한국기계연구원 마이크로 소자 전사방법 및 마이크로 소자 전사방법으로 제조된 마이크로 소자 기판

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