WO2019029301A1 - 光伏组件的封装方法 - Google Patents

光伏组件的封装方法 Download PDF

Info

Publication number
WO2019029301A1
WO2019029301A1 PCT/CN2018/094792 CN2018094792W WO2019029301A1 WO 2019029301 A1 WO2019029301 A1 WO 2019029301A1 CN 2018094792 W CN2018094792 W CN 2018094792W WO 2019029301 A1 WO2019029301 A1 WO 2019029301A1
Authority
WO
WIPO (PCT)
Prior art keywords
photovoltaic module
packaging
flexible substrate
film
roll
Prior art date
Application number
PCT/CN2018/094792
Other languages
English (en)
French (fr)
Inventor
霍艳寅
曹志峰
Original Assignee
北京铂阳顶荣光伏科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京铂阳顶荣光伏科技有限公司 filed Critical 北京铂阳顶荣光伏科技有限公司
Publication of WO2019029301A1 publication Critical patent/WO2019029301A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/044—PV modules or arrays of single PV cells including bypass diodes
    • H01L31/0443—PV modules or arrays of single PV cells including bypass diodes comprising bypass diodes integrated or directly associated with the devices, e.g. bypass diodes integrated or formed in or on the same substrate as the photovoltaic cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present disclosure relates to a method of fabricating a solar cell, and more particularly to a method of packaging a photovoltaic module.
  • Solar photovoltaic modules can be divided into crystalline silicon components and flexible photovoltaic components. Due to the presence of glass, it is difficult to carry out continuous "roll-to-roll” production. Flexible PV modules, such as CIGS batteries, are made of stainless steel or organic materials, enabling continuous “roll-to-roll” production, which greatly increases production efficiency.
  • the present disclosure provides a packaging method of a photovoltaic module capable of achieving uninterrupted, continuous production to improve production efficiency.
  • a method of packaging a photovoltaic module including:
  • the second intermediate film, the water blocking film and the back plate are respectively packaged to the flexibility of sequentially conveying through the first station, the second station, the third station and the fourth station at a preset speed Forming a photovoltaic module on the substrate to wind up the photovoltaic module to form a photovoltaic module roll;
  • the temperature and pressure step is: performing temperature and pressure control processing on the photovoltaic module roll.
  • the conductive film is a conductive copper film
  • the first and second encapsulating films are thermoplastic polyolefin films
  • the material of the polymer substrate is polyethylene terephthalate or polyethylene naphthalate.
  • the first and second intermediate films are polyvinyl butyral films.
  • the encapsulating step may include:
  • the flexible substrate is conveyed through the fourth station at a third predetermined speed, and the lower surface of the flexible substrate is bonded to the back sheet, thereby obtaining a photovoltaic module.
  • the first preset speed, the second preset speed, and the third preset speed may each be 0.2-5 m/min.
  • the back sheet may be a single-sided fluorine-containing back sheet or a double-sided fluorine-containing back sheet.
  • the packaging method may further include:
  • the photovoltaic module is delivered to the preheating chamber of the roller press at a fourth preset speed in sequence for the following three preheating stages:
  • a first preheating stage for preheating in a temperature range of 50-70 ° C;
  • a second preheating phase for preheating in a temperature range of 90-110 ° C;
  • a third preheating stage of preheating is carried out in a temperature range of 130-150 °C.
  • the fourth preset speed may be 0.5-3 m/min.
  • the packaging method may further include: heating and pressurizing the photovoltaic module after the photovoltaic module is delivered to the preheating chamber of the roller press at a fourth preset speed for preheating.
  • the packaging method may further include: cooling and heating the photovoltaic module after heating and pressurizing the photovoltaic module, and when the temperature falls below 40 ° C, the photovoltaic module is wound up to obtain a photovoltaic module roll.
  • a spacer may be placed between adjacent layers while the photovoltaic module is being wound up.
  • the separator may be a silica gel plate.
  • the warm pressing step may include: conveying the photovoltaic module roll into a pressure forming device, and adjusting a temperature and a pressure inside the pressure forming device to perform layering on the photovoltaic module roll Pressure.
  • adjusting the temperature and pressure inside the pressure forming apparatus may include:
  • the PV module coil is subjected to a step-down temperature drop.
  • the upper pressure limit is maintained at 10-12 bar in the temperature rising and boosting phase
  • the lower temperature limit is controlled to 50 ° C in the pressure holding and cooling phase
  • the step of depressurizing and cooling The pressure drops to standard atmospheric pressure and the temperature is lowered to room temperature.
  • the first preset time period is 30-50 minutes
  • the first preset temperature is 130-140 ° C
  • the second preset time period is 50-70 minutes
  • the third preset time period is 120-150 minutes.
  • the encapsulation method may further include, after performing the warm pressure control process on the roll of photovoltaic modules, exhausting the pressure forming apparatus and taking out the roll of photovoltaic modules from the press forming apparatus.
  • the pressure forming apparatus may be an autoclave.
  • the packaging method of the photovoltaic module provided by the present disclosure, the second encapsulant film, the second encapsulant film, is continuously passed through the respective stations in the laminating machine at a preset speed, and when the flexible substrate sequentially passes through the respective stations, Film materials such as first and second intermediate films, water blocking films, and the like are packaged onto a flexible substrate to form a photovoltaic module.
  • the packaging method according to an embodiment of the present disclosure omits the cutting process, thereby saving time, and achieves an uninterrupted, continuous production, and roll-to-roll production efficiency from a battery to a component.
  • the products manufactured by the packaging method of the photovoltaic module provided by the present disclosure have good light transmittance and strong adhesion of each film layer, thereby improving the water resistance and aging resistance of the layered material constituting the photovoltaic module, Photovoltaic modules work more stably and last longer.
  • FIG. 1 is a flow chart showing a packaging method of a photovoltaic module according to an embodiment of the present disclosure
  • FIG. 2 is a flow chart showing a method of packaging a photovoltaic module in accordance with an embodiment of the present disclosure
  • FIG. 3 is a flow chart showing a method of packaging a photovoltaic module in accordance with an embodiment of the present disclosure
  • FIG. 4 is a flow chart showing a method of packaging a photovoltaic module in accordance with an embodiment of the present disclosure
  • FIG. 5 is a process flow diagram showing a packaging method of a photovoltaic module according to an embodiment of the present disclosure.
  • FIGS. 1 through 4 illustrate a flow chart of a method of packaging a photovoltaic component in accordance with an embodiment of the present disclosure.
  • FIG. 5 illustrates a process flow diagram of a method of packaging a photovoltaic component in accordance with an embodiment of the present disclosure.
  • a packaging method of a photovoltaic module of the present disclosure will be described by taking a package of a flexible photovoltaic module as an example in conjunction with FIGS. 1 to 5.
  • a packaging method of a photovoltaic module according to an embodiment of the present disclosure includes the following steps:
  • Step S1 that is, the unwinding step, providing the flexible substrate roll 1 and unwinding the flexible substrate roll 1 at a set unwinding speed Vf to obtain the unfolded flexible substrate 2, the flexible substrate 2 including from top to bottom
  • the patterned conductive film 21, the first encapsulant film 22, and the polymer substrate 23 are sequentially stacked, and the conductive film 21 is connected with the chip 211 and the diode 212.
  • the humidity of the storage environment of the flexible substrate 2 stored in the winding form in this step is controlled to be ⁇ 5% RH, and the thickness of the flexible substrate 2 is about 0.3 to 0.5 mm.
  • Step S2 that is, a connecting step, providing a chip 211 and a diode 212, and the chip 211 and the diode 212 are connected to the conductive film 21 of the flexible substrate 2;
  • Step S3 that is, a packaging step, provides a second encapsulation film 24, a first intermediate film 25, a second intermediate film 26, a water blocking film 27, and a backing plate 28, and sequentially transports through the flexible substrate 2 at a preset speed V.
  • the second encapsulating film 24, the first intermediate film 25, and the second intermediate film are sequentially disposed, respectively. 26.
  • the water blocking film 27 and the backing plate 28 are packaged onto the flexible substrate 2 to form a photovoltaic module 30, which is wound up to form a photovoltaic module roll 40;
  • step S7 the temperature and pressure step is performed to perform temperature and pressure control on the photovoltaic module roll 40.
  • the conductive film 21 may be a conductive copper film
  • the first and second encapsulant films 22, 24 may be a thermoplastic polyolefin (TPO) film
  • the material of the polymer substrate 23 may be Polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polyimide (PI) or a combination thereof
  • the first and second intermediate films 25, 26 may be poly Vinyl butyral (PVB) film.
  • a packaging method of a photovoltaic module by continuously passing a flexible substrate through respective stations in a laminating machine at a preset speed, and applying a second encapsulating film when the flexible substrate sequentially passes through respective stations
  • the film materials of the first and second interlayer films, the water blocking film and the like are packaged onto the flexible substrate to form a photovoltaic module, and the photovoltaic module is wound up to form a roll of the photovoltaic module.
  • the packaging method according to an embodiment of the present disclosure omits the cutting process, thereby saving time and achieving uninterrupted from the battery to the component, compared to the existing packaging method, which requires cutting the photovoltaic component into a predetermined size during the packaging process. The efficiency of continuous production and roll-to-roll production has been improved.
  • step S2 may include:
  • step S21 the chip 211 and the diode 212 are connected to the conductive film 21.
  • the chip 211 and the diode 212 are placed on the side of the flexible substrate 11 close to the conductive film 21 by a robot, and the chip 211 and the diode 212 are soldered to the electrode reserved on the conductive film 21 by laser. Solder joints (not shown) are used to achieve series and parallel connection of the chips 211 and bypass connections of the diodes 212. That is, the chip 211 and the diode 212 are connected to the conductive film 21.
  • step S3 may include:
  • step S31 the flexible substrate 2, which has completed chip laying and diode connection, continues through the first station 51 of the laminating machine 50.
  • the upper surface of the flexible substrate 2 is bonded to the second encapsulation film 24.
  • the flexible substrate 2 obtained in step S31 may be subjected to a heat press treatment by a roll press.
  • the flexible substrate 2 is then directly transferred to the next process, or the flexible substrate 2 can be air-cooled, and the flexible substrate 2 is passed through a winder (not shown) when the temperature drops below about 40 °C. Winding to form a roll having a diameter greater than about 800 mm.
  • step S32 the flexible substrate 2 obtained in step S31 is conveyed through the second station 52 of the laminating machine 50 at a first preset speed V1.
  • the two opposite surfaces (the upper surface and the lower surface facing away from the upper surface) of the flexible substrate 2 are respectively brought into contact with the first intermediate film 25 and the second intermediate film 26 in synchronization;
  • step S33 the flexible substrate 2 obtained in step S32 is conveyed through the third station 53 of the laminating machine 50 at the second preset speed V2.
  • the upper surface of the first intermediate film 25 on the flexible substrate 2 is bonded to the water blocking film 27 (for example, the weather resistant water blocking film);
  • step S34 the flexible substrate 2 obtained in step S33 is continuously conveyed through the fourth station 54 of the laminating machine 50 at the third preset speed V3.
  • the lower surface of the flexible substrate 2 is bonded to the backing plate 28, thereby obtaining the photovoltaic module 30.
  • the backing plate 28 may be a single-sided fluorine-containing backsheet having a long-term aging resistance (humid heat, dry heat, ultraviolet), electrical insulation resistance, water vapor barrier, etc., and a double-sided fluorine-containing back. Board and so on.
  • the first preset speed V1, the second preset speed V2, and the third preset speed V3 may be equal, that is, the flexible substrate 2 may be conveyed in a continuously constant manner to achieve lamination.
  • the flexible substrate 2 can also be transported in a variable speed manner.
  • the preset speed is set according to the technical requirements of the photovoltaic module roll to be formed.
  • the first preset speed V1, the second preset speed V2, and the third preset speed V3 are equal, and the range is about 0.2-5 m/min to achieve a sufficient lamination effect.
  • the foregoing packaging method may further include:
  • step S4 the photovoltaic module 30 is delivered to the preheating chamber 71 of the roller press 70 at a fourth preset speed V4 (fourth preheating speed) for preheating.
  • the fourth preheating rate V4 is preferably about 0.5-3 m/min.
  • the fourth preheat rate is about 1-2 m/min.
  • the photovoltaic modules can be fully preheated to further improve the thermal performance of the photovoltaic modules.
  • the heating method adopted by the roller press 70 is, for example, resistance heating (for example, resistance wire heating) or infrared heating (for example, infrared tube heating), and the roller press 70 adopts two upper and lower high temperature resistant rubber rollers (not shown).
  • the relative rolling is to apply pressure to the photovoltaic component 30.
  • the preheating chamber 71 of the roller press 70 is divided into three sections, namely, a first preheating phase, a second preheating phase, and a third preheating phase, and the temperature is delivered in the three segments. The second rise.
  • the chamber length of the first preheating stage is about 1-2 m, the temperature range is about 50-70 ° C; the length of the chamber of the second preheating stage is about 1-2 m, and the temperature range is about 90-110. °C; the chamber length of the third preheating stage is about 1-2 m, and the temperature range is about 130-150 °C.
  • the step S4 of preheating the photovoltaic module 30 to the preheating chamber 71 of the roller press 70 at the fourth preset speed V4 may include sequentially performing the following three warm-up phases:
  • Step S41 performing a first preheating stage of preheating in a temperature range of 50-70 ° C;
  • Step S42 performing a second preheating phase of preheating in a temperature range of 90-110 ° C;
  • step S43 a third preheating stage of preheating is performed in a temperature range of 130-150 °C.
  • the foregoing packaging method may further include:
  • step S5 the photovoltaic module 30 is heated and pressurized, and the stage is preferably divided into two stages, namely, a first stage and a second stage.
  • the temperature range of the first stage is about 130-150 ° C
  • the distance between the upper and lower rubber rolls is about 0.5-1 mm smaller than the total height of the material after compounding
  • the diameter of the rubber roll is about 1-1.6 m
  • the length is about 2-3 m.
  • the temperature range of the second stage is about 130-150 ° C
  • the distance between the upper and lower rubber rolls is about 1-2 mm smaller than the total height of the material after compounding
  • the diameter of the rubber roll is about 1-1.6 m
  • the length is about 2-3 m.
  • the foregoing packaging method may further include:
  • step S6 the photovoltaic module 30 is cooled (for example, air-cooled), and when the temperature falls below about 40 ° C, the photovoltaic module 30 is wound up to obtain a photovoltaic module roll 40.
  • the winding diameter is greater than about 1000 mm.
  • the above packaging method may further include: step S61, placing a thickness of about 8-10 mm between the adjacent layers by manual or mechanical loading while the semiconductor assembly 30 is being wound up.
  • a separator 411 for example, a silica gel plate having a width slightly smaller than the width of the photovoltaic module and having a width of about 10 mm.
  • the above step S7 may include: transporting the photovoltaic module roll 40 into the pressure forming device 60 as a whole, and performing temperature and pressure control on the photovoltaic module roll 40 .
  • the temperature control process includes, for example, adjusting the temperature and pressure inside the pressure forming apparatus 60 to laminate the photovoltaic module roll 40.
  • the pressure forming device 60 is, for example, an autoclave.
  • the packaging method of the photovoltaic module enhances the photovoltaic module 30 by performing a temperature control process on the photovoltaic module roll 40 within the pressure forming device 60 by integrally transporting the photovoltaic module roll 40 into the pressure forming device 60. performance.
  • the temperature and pressure inside the pressure forming apparatus 60 are adjusted to include four stages of temperature rising and boosting, heat holding pressure, pressure holding temperature drop, and pressure drop cooling.
  • the four phases are:
  • Step S71 the temperature rising and boosting phase, that is, heating and boosting the photovoltaic module coil 40 in the first preset temperature range and in the first preset temperature range (increasing the temperature and pressure in the pressure forming device), and maintaining The upper pressure limit is about 10-12 bar; the first predetermined time period can be about 30-50 minutes, and the first preset temperature range can be about 130-140 °C.
  • Step S72 the heat preservation and holding phase, that is, holding and holding the photovoltaic module roll 40 in the second preset time period (maintaining the current temperature and pressure in the pressure forming device 60); the second preset time period may be About 50-70 minutes.
  • Step S73 the pressure maintaining and cooling stage, that is, holding and cooling the photovoltaic module roll 40 in the third preset time period (maintaining the pressure in the pressure forming device 60 and lowering the temperature in the pressure forming device), and controlling the lower temperature limit. It is 50 ° C; the third preset period of time can be about 120-150 minutes.
  • Step S74 the step of lowering the temperature of the step of lowering, that is, stepping down the temperature of the photovoltaic module roll 40 (reducing the pressure and temperature in the pressure forming device 60), and the pressure in the step of reducing the temperature drop to the standard atmospheric pressure, and the temperature is lowered to room temperature.
  • the temperature is maintained, the pressure is kept down, and the pressure is lowered and the temperature is lowered, so that the photovoltaic module 30 is more transparent than the photovoltaic module obtained by the ordinary lamination process. It has good properties, and at the same time, it has an enhanced effect on the adhesion of each film layer, which makes the bonding force stronger, improves the water resistance and aging resistance of the layered material, and makes the photovoltaic module work more stably and has a longer life.
  • the separator 411 provided as described above can effectively separate the adjacent layers so that each of the layers can Heat evenly.
  • the above packaging method may further include: step S8, after the pressure forming device 60 is exhausted, the pressure forming device 60 is opened to push the photovoltaic module roll 40 out.
  • the photovoltaic module roll 40 is mechanically unwound while the separator plate 411 between the photovoltaic module rolls 40 is removed, and then the unwound photovoltaic module 30 is cleaned.
  • a junction box (not shown) is mounted at the reserved lead of the photovoltaic module 30. The PV modules with the junction box installed are power tested, tested and packaged.
  • the packaging method of the photovoltaic module by continuously passing the flexible substrate through respective stations in the laminating machine at a preset speed, and when the flexible substrate sequentially passes through the respective stations, such as The second encapsulant film, the first and second intermediate films, the water blocking film, and the like are packaged onto the flexible substrate to form a photovoltaic module.
  • the packaging method according to an embodiment of the present disclosure omits the cutting process, thereby saving time, and achieves an uninterrupted, continuous production from the battery to the assembly, and the efficiency of roll-to-roll production is improved. And low energy consumption, high degree of automation, and easy to control quality.
  • the packaging method of the photovoltaic module makes the photovoltaic module more transparent by performing a temperature control process on the photovoltaic module roll by using a pressure forming device. Therefore, compared with the ordinary lamination process, the obtained product has good light transmittance and strong adhesion of each film layer, and improves the water resistance and aging resistance of the layered material constituting the photovoltaic module, so that the photovoltaic module works more stably and has a long life. Longer

Abstract

本公开提供了一种光伏组件的封装方法，包括：提供柔性衬底卷，并且将所述柔性衬底卷以设定的放卷速度放卷以获得展开的柔性衬底，所述柔性衬底包括自上向下依次叠置的导电膜、第一封装胶膜和聚合物衬底；提供芯片和二极管，并且将所述芯片和所述二极管与所述柔性衬底的所述导电膜连接；以及提供第二封装胶膜、第一中间膜、第二中间膜、阻水膜和背板，并且在所述柔性衬底以预设速度依次输送通过第一工位、第二工位、第三工位和第四工位时，依次分别将所述第二封装胶膜、所述第一中间膜、所述第二中间膜、所述阻水膜和所述背板封装到所述柔性衬底上，以形成光伏组件，卷收成卷后进行温压控制处理。

Description

光伏组件的封装方法
相关申请的交叉引用
本申请要求2017年8月11日在中国国家知识产权局提交的中国专利申请No.201710685904.6的优先权，该申请的全部内容以引用方式并入本文。
技术领域
本公开涉及太阳能电池的制造方法，尤其涉及一种光伏组件的封装方法。
背景技术
太阳能光伏组件可以分为晶硅组件和柔性光伏组件，晶硅组件由于玻璃的存在，难以进行连续“卷对卷”的生产。而柔性光伏组件，例如CIGS电池以不锈钢或有机材料为衬底，可以进行连续“卷对卷”的生产，极大的提升了生产效率。
在现有的柔性光伏组件(例如CIGS电池)在封装过程中，利用层压机等封装设备进行加热和层压，但是现有工艺中，采用在封装过程中将柔性光伏组件切割成预定尺寸再继续加热加压处理的方式进行加工，使得无法实现连续生产，因此影响生产效率。
公开内容
为了至少部分解决现有技术中存在的技术问题而完成了本公开，本公开提供了一种能够实现无间断、连续化生产从而提高生产效率的光伏组件的封装方法。
根据本公开的一个方面，提供了一种光伏组件的封装方法，包括：
放卷步骤，所述放卷步骤为：提供柔性衬底卷，并且将所述柔性衬底卷以设定的放卷速度放卷以获得展开的柔性衬底，所述柔性衬底包括自上向下依次叠置的导电膜、第一封装胶膜和聚合物衬底；
连接步骤，所述连接步骤为：提供芯片和二极管，并且将所述芯片和所述二极管与所述柔性衬底的所述导电膜连接；
封装步骤，所述封装步骤为：提供第二封装胶膜、第一中间膜、第二中间膜、阻水膜和背板，并且将所述第二封装胶膜、所述第一中间膜、所述第二中间膜、所述阻水膜和所述背板分别封装到以预设速度依次输送通过第一工位、第二工位、第三工位和第四工位的所述柔性衬底上，以形成光伏组件，将所述光伏组件卷收形成光伏组件卷；以及
温压步骤，所述温压步骤为：对所述光伏组件卷进行温压控制处理。
所述导电膜为导电铜膜，所述第一和第二封装胶膜为热塑性聚烯烃胶膜，所述聚合物衬底的材料为聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯或聚酰亚胺或其组合，并且所述第一和第二中间膜为聚乙烯醇缩丁醛胶膜。
所述封装步骤可以包括：
将所述柔性衬底输送通过所述第一工位，使所述柔性衬底的上表面与所述第二封装胶膜贴合；
将所述柔性衬底以第一预设速度输送通过所述第二工位，使所述柔性衬底的两个相对表面分别与所述第一中间膜和所述第二中间膜同步贴合；
将所述柔性衬底以第二预设速度输送通过所述第三工位，使所述柔性衬底上的所述第一中间膜的上表面与所述阻水膜贴合；以及
将所述柔性衬底以第三预设速度输送通过所述第四工位，使所述柔性衬底的下表面与所述背板贴合，从而得到光伏组件。
所述第一预设速度、所述第二预设速度和所述第三预设速度可以均为0.2-5m/min。
所述背板可以是单面含氟背板或双面含氟背板。
所述封装方法还可以包括：
将光伏组件以第四预设速度输送至辊压机的预热腔室依次进行下述三个预热阶段：
在50-70℃的温度范围内进行预热的第一预热阶段；
在90-110℃的温度范围内进行预热的第二预热阶段；以及
在130-150℃的温度范围内进行预热的第三预热阶段。
所述第四预设速度可以为0.5-3m/min。
所述封装方法还可以包括：在将所述光伏组件以第四预设速度输送至所述辊压机的预热腔室进行预热之后，对所述光伏组件进行加热加压。
所述封装方法还可以包括：在对所述光伏组件进行加热加压之后，对所述光伏组件进行冷却，当温度降至40℃以下时，将所述光伏组件卷收以获得光伏组件卷。
在所述封装方法中，在将所述光伏组件卷收的同时，可以在相邻的卷层之间放置隔离板。
在所述封装方法中，所述隔离板可以为硅胶板。
在所述封装方法中，所述温压步骤可以包括：将所述光伏组件卷输送进入压力成型设备，对所述压力成型设备内部的温度和压力进行调整，以对所述光伏组件卷进行层压。
在所述封装方法中，对所述压力成型设备内部的温度和压力进行调整可以包括：
在第一预设时间段内、第一预设温度范围内对所述光伏组件卷进行升温升压；
在第二预设时间段内对所述光伏组件卷进行保温保压；
在第三预设时间段内对所述光伏组件卷进行保压降温；以及
对所述光伏组件卷进行降压降温。
在所述封装方法中，在所述升温升压阶段中将压力上限保持为10-12bar，在所述保压降温阶段中将温度下限控制为50℃，并且在所述降压降温阶段中将压力降至标准大气压且将温度降至室温。
在所述封装方法中，所述第一预设时间段为30-50分钟，所述第一预设温度为130-140℃，所述第二预设时间段为50-70分钟，并且所述第三预设时间段为120-150分钟。
所述封装方法还可以包括：在对所述光伏组件卷进行所述温压控制处理之后，对所述压力成型设备进行排气并且从所述压力成型设备取出所述光伏组件卷。
所述压力成型设备可以为高压釜。
根据本公开提供的光伏组件的封装方法，通过将柔性衬底以预设速度连续地通过层压机中的各个工位，并且在柔性衬底依次通过各个工位时将第二封装胶膜、第一和第二中间膜、阻水膜等膜料封装到柔性衬底上以形成光伏组件。与现有的封装方法相比，根据本公开实施例的封装方法省略了切割工序从而节省了时间，并且实现了从电池到组件的无间断、连续化生产、卷对卷生产的效率得到提高。此外，通过本公开提供的光伏组件的封装方法而制造出的产品的透光性好、各膜层的粘结力强，提高了构成光伏组件的层状材料的耐水性和耐老化性，使得光伏组件工作更稳定，寿命更长。
附图说明
图1为示出根据本公开实施例的光伏组件的封装方法的流程图；
图2为示出根据本公开实施例的光伏组件的封装方法的流程图；
图3为示出根据本公开实施例的光伏组件的封装方法的流程图；
图4为示出根据本公开实施例的光伏组件的封装方法的流程图；以及
图5为示出根据本公开实施例的光伏组件的封装方法的工艺流程示意图。
具体实施方式
下面结合附图详细描述本公开的实施例，在附图中，用相同或类似的附图标记表示相同或类似的元件或具有相同或类似功能的元件。应当理解的是，下面通过参考附图描述的实施例是示例性的，仅用于解释本公开，而不能解释为对本公开的限制。
图1至图4示出了根据本公开实施例的光伏组件的封装方法的流程图。图5示出了根据本公开实施例的光伏组件的封装方法的工艺流程示意图。下面，结合图1至图5以柔性光伏组件的封装为例来对本公开实 施例的光伏组件的封装方法进行说明。如图1至图5所示，根据本公开实施例的光伏组件的封装方法包括如下步骤：
步骤S1，即放卷步骤，提供柔性衬底卷1，并且将柔性衬底卷1以设定的放卷速度Vf放卷以获得展开的柔性衬底2，柔性衬底2包括自上向下依次叠置图案化的导电膜21、第一封装胶膜22和聚合物衬底23，并且导电膜21连接有芯片211和二极管212。该步骤中以卷绕形式存放的柔性衬底2存放环境的湿度控制在＜5％RH，柔性衬底2的厚度为约0.3-0.5mm。
步骤S2，即连接步骤，提供芯片211和二极管212，并且芯片211和二极管212与柔性衬底2的导电膜21连接；
步骤S3，即封装步骤，提供第二封装胶膜24、第一中间膜25、第二中间膜26、阻水膜27和背板28，并且在柔性衬底2以预设速度V依次输送通过层压机50的第一工位51、第二工位52、第三工位53和第四工位54时，依次分别将第二封装胶膜24、第一中间膜25、第二中间膜26、阻水膜27和背板28封装到柔性衬底2上，以形成光伏组件30，将光伏组件30卷收形成光伏组件卷40；以及
步骤S7，温压步骤，对光伏组件卷40进行温压控制处理。
在一示例性实施例中，例如，导电膜21可以为导电铜膜，第一和第二封装胶膜22、24可以为热塑性聚烯烃(TPO)胶膜，聚合物衬底23的材料可以为聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)或聚酰亚胺(PI)或其组合，并且第一和第二中间膜25、26可以为聚乙烯醇缩丁醛(PVB)胶膜。
根据本公开实施例的光伏组件的封装方法，通过将柔性衬底以预设速度连续地通过层压机中的各个工位，并且在柔性衬底依次通过各个工位时将第二封装胶膜、第一和第二中间膜、阻水膜等膜料封装到柔性衬底上以形成光伏组件，并且将光伏组件卷收形成光伏组件卷。与现有的封装方法(需要在封装过程中将光伏组件切割成预定尺寸)相比，根据本公开实施例的封装方法省略了切割工序从而节省了时间，并且实现了从电池到组件的无间断、连续化生产、卷对卷生产的效率得到提高。
如图2和图5所示，在一示例性实施例中，步骤S2可以包括：
步骤S21，将芯片211和二极管212与导电膜21连接。具体地，在 该步骤S21中，将芯片211和二极管212通过机械手放置在柔性衬底11上靠近导电膜21的一侧，通过激光把芯片211和二极管212焊接在导电膜21上预留的电极焊接点(图中未示出)上，以实现芯片211的串联和并联以及二极管212的旁路连接。即，使得芯片211和二极管212与导电膜21连接。
如图2和图5所示，在一示例性实施例中，步骤S3可以包括：
步骤S31，将已完成芯片敷设和二极管连接的柔性衬底2继续通过层压机50的第一工位51。在第一工位51，使柔性衬底2的上表面与第二封装胶膜24贴合。在一示例性实施例中，可以将步骤S31获得的柔性衬底2经辊压机加热加压处理。然后将柔性衬底2直接输送到下一工序，或者可以将柔性衬底2进行风冷，并且在温度降至约40℃以下时通过收卷机(图中未示出)对柔性衬底2绕卷以形成直径大于约800mm的卷。将该卷暂时地放置在湿度＜5％RH的环境中；
步骤S32，将步骤S31获得的柔性衬底2以第一预设速度V1输送通过层压机50的第二工位52。在第二工位52，使柔性衬底2的两个相对表面(上表面和背对该上表面的下表面)分别与第一中间膜25和第二中间膜26同步贴合；
步骤S33，将步骤S32获得的柔性衬底2以第二预设速度V2输送通过层压机50的第三工位53。在第三工位53，使柔性衬底2上的第一中间膜25的上表面与阻水膜27(例如耐候阻水膜)贴合；以及
步骤S34，将步骤S33获得的柔性衬底2以第三预设速度V3继续输送通过层压机50的第四工位54。在第四工位54，使柔性衬底2的下表面与背板28贴合，从而得到光伏组件30。在一示例性实施例中，例如，背板28可以是具有耐长期老化(湿热、干热、紫外)、耐电气绝缘、水蒸气阻隔等性能的单面含氟背板和双面含氟背板等。
本领域技术人员可以理解的是，第一预设速度V1、第二预设速度V2和第三预设速度V3可以相等，即柔性衬底2可以速度连续不变的方式输送从而实现层压。柔性衬底2也可以可变速度的方式输送。根据所要成型的光伏组件卷的技术要求来设置上述预设速度。
在本实施例中，第一预设速度V1、第二预设速度V2和第三预设速 度V3相等，范围均是约0.2-5m/min，以实现充分的层压效果。
如图1、图3和图5所示，在一示例性实施例中，上述封装方法还可以包括：
步骤S4，将光伏组件30以第四预设速度V4(第四预热速度)输送至辊压机70的预热腔室71进行预热。该第四预热速度V4优选为约0.5-3m/min。在一示例性实施中，该第四预热速度为约1-2m/min。在此预热速度下，可以对光伏组件进行充分预热，从而进一步提高光伏组件的热性能。
辊压机70采用的加热方式为例如电阻加热(例如，电阻丝加热)或红外加热(例如，红外管加热)，并且辊压机70采用上下两个耐高温橡胶辊(图中未示出)的相对滚动来对光伏组件30施加压力。在一示例性实施例中，辊压机70的预热腔室71分为三段，即，第一预热阶段、第二预热阶段和第三预热阶段，温度在该三段中递次上升。具体而言，第一预热阶段的腔室长度为约1-2m，温度范围为约50-70℃；第二预热阶段的腔室长度为约1-2m，温度范围为约90-110℃；第三预热阶段的腔室长度为约1-2m，温度范围为约130-150℃。换言之，将光伏组件30以第四预设速度V4输送至辊压机70的预热腔室71进行预热的步骤S4可以包括依次进行下述三个预热阶段：
步骤S41，在50-70℃的温度范围内进行预热的第一预热阶段；
步骤S42，在90-110℃的温度范围内进行预热的第二预热阶段；以及
步骤S43，在130-150℃的温度范围内进行预热的第三预热阶段。
如图1和图5所示，在一示例性实施例中，上述封装方法还可以包括：
步骤S5，对光伏组件30进行加热加压，该阶段优选地分为两段，即，第一阶段和第二阶段。第一阶段的温度范围为约130-150℃，上下胶辊辊间距离比材料复合后的总高度小约0.5-1mm，胶辊的直径为约1-1.6m，长度为约2-3m。第二阶段的温度范围为约130-150℃，上下胶辊辊间距离比材料复合后的总高度小约1-2mm，胶辊的直径为约1-1.6m，长度为约2-3m。
如图1、图3和图5所示，在一示例性实施例中，上述封装方法还可以包括：
步骤S6，对光伏组件30进行冷却(例如风冷)，当温度降至约40℃以下时，将光伏组件30卷收，以得到光伏组件卷40。绕卷直径大于约1000mm。在一示例性实施例中，上述封装方法还可以包括：步骤S61，可在对光伏组件30卷收的同时，通过人工或机械在相邻的卷层之间放置厚度为约8-10mm，长度略小于光伏组件宽度，宽度为约10mm的隔离板411(例如硅胶板)。
如图1、图4和图5所示，在一示例性实施例中，上述步骤S7可以包括：将光伏组件卷40整体输送进入压力成型设备60中，对光伏组件卷40进行温压控制处理。在一示例性实施例中，温压控制处理例如包括：对压力成型设备60内部的温度和压力进行调整，以对光伏组件卷40进行层压。压力成型设备60例如为高压釜。
根据本公开实施例的光伏组件的封装方法通过将光伏组件卷40整体输送到压力成型设备60中，在压力成型设备60内对光伏组件卷40进行温压控制处理，从而提升了光伏组件30的性能。
在一示例性实施例中，在上述步骤S7中，对压力成型设备60内部的温度和压力进行调整包括升温升压、保温保压、保压降温和降压降温四个阶段。具体地，这四个阶段分别为：
步骤S71，升温升压阶段，即，在第一预设时间段内、第一预设温度范围内对光伏组件卷40进行升温升压(升高压力成型设备内的温度和压力)，并保持压力上限为约10-12bar；该第一预设时间段可以是约30-50分钟，第一预设温度范围可以为约130-140℃。
步骤S72，保温保压阶段，即，在第二预设时间段内对光伏组件卷40进行保温保压(保持压力成型设备60内的当前温度和压力)；该第二预设时间段可以是约50-70分钟。
步骤S73，保压降温阶段，即，在第三预设时间段内对光伏组件卷40进行保压降温(保持压力成型设备60内的压力并且降低压力成型设备内的温度)，并控制温度下限为50℃；该第三预设时间段可以为约 120-150分钟。
步骤S74，降压降温阶段，即对光伏组件卷40进行降压降温(降低压力成型设备60内的压力和温度)，降压降温阶段的压力降至标准大气压，温度降至室温。
通过在压力成型设备60内对光伏组件卷40进行升温升压、保温保压、保压降温和降压降温，从而使得光伏组件30更加透明，比通过普通层压工艺获得的光伏组件的透光性好，同时对各膜层的粘结力也产生了增强的作用，使得粘结力变强，提高了层状材料的耐水性和耐老化性，使得光伏组件工作更稳定，寿命更长。
在将光伏组件卷40输送进入压力成型设备60内进行温压控制处理的情况下，如上所述设置的隔离板411能够有效地将相邻的卷层隔开，以使每个卷层均能均匀受热。
如图1和图5所示，在一示例性实施例中，上述封装方法还可以包括：步骤S8，在压力成型设备60排气完毕后，打开压力成型设备60以将光伏组件卷40推出。在去除光伏组件卷40之间的隔离板411的同时对光伏组件卷40进行机械放卷，然后对放卷后的光伏组件30进行清洁。在光伏组件30的预留引线处安装接线盒(图中未示出)。对安装好接线盒的光伏组件经过功率测试，检测并包装。
如上所述，根据本公开实施例的光伏组件的封装方法，通过将柔性衬底以预设速度连续地通过层压机中的各个工位，并且在柔性衬底依次通过各个工位时将诸如第二封装胶膜、第一和第二中间膜、阻水膜等膜料封装到柔性衬底上以形成光伏组件。与现有的封装方法相比，根据本公开实施例的封装方法省略了切割工序从而节省了时间，并且实现了从电池到组件的无间断、连续化生产、卷对卷生产的效率得到提高，且能耗低，自动化程度高，品质易于控制。
此外，根据本公开实施例的光伏组件的封装方法，通过利用压力成型设备对光伏组件卷进行温压控制处理，从而使得光伏组件更加透明。因此，与普通层压工艺，所得产品的透光性好、各膜层的粘结力强，提高了构成光伏组件的层状材料的耐水性和耐老化性，使得光伏组件工作更稳定，寿 命更长
出于解释和说明的目的提供了本公开的示例性实施例的前面的说明。不意在穷举或将本公开限制为所公开的确切形式。显然，对于本技术领域的技术人员可以进行许多修改和变型。选择和说明本示例性实施例是为了更好地解释本公开的原理及其实际应用，因此使得本技术领域的其他人能够为实现各种实施例理解本公开和各种适合于所构想的特定应用的修改。目的在于通过所附权利要求及其等同内容限定本公开的范围。

Claims (17)

  1. 一种光伏组件的封装方法，包括：
    放卷步骤，所述放卷步骤为：提供柔性衬底卷，并且将所述柔性衬底卷以设定的放卷速度放卷以获得展开的柔性衬底，所述柔性衬底包括自上向下依次叠置的导电膜、第一封装胶膜和聚合物衬底；
    连接步骤，所述连接步骤为：提供芯片和二极管，并且将所述芯片和所述二极管与所述柔性衬底的所述导电膜连接；
    封装步骤，所述封装步骤为：提供第二封装胶膜、第一中间膜、第二中间膜、阻水膜和背板，并且在所述柔性衬底以预设速度依次输送通过第一工位、第二工位、第三工位和第四工位时，依次分别将所述第二封装胶膜、所述第一中间膜、所述第二中间膜、所述阻水膜和所述背板封装到所述柔性衬底上，以形成光伏组件，将所述光伏组件卷收形成光伏组件卷；以及
    温压步骤，所述温压步骤为：对所述光伏组件卷进行温压控制处理。
  2. 根据权利要求1所述的光伏组件的封装方法，其中，所述导电膜为导电铜膜，所述第一和第二封装胶膜为热塑性聚烯烃胶膜，所述聚合物衬底的材料为聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯或聚酰亚胺或其组合，并且所述第一和第二中间膜为聚乙烯醇缩丁醛胶膜。
  3. 根据权利要求1所述的光伏组件的封装方法，其中，所述封装步骤包括：
    将所述柔性衬底输送通过所述第一工位，使所述柔性衬底的上表面与所述第二封装胶膜贴合；
    将所述柔性衬底以第一预设速度输送通过所述第二工位，使所述柔性衬底的两个相对表面分别与所述第一中间膜和所述第二中间膜同步贴合；
    将所述柔性衬底以第二预设速度输送通过所述第三工位，使所述柔性衬底上的所述第一中间膜的上表面与所述阻水膜贴合；以及
    将所述柔性衬底以第三预设速度输送通过所述第四工位，使所述柔 性衬底的下表面与所述背板贴合，从而得到光伏组件。
  4. 根据权利要求3所述的光伏组件的封装方法，其中，所述第一预设速度、所述第二预设速度和所述第三预设速度均为0.2-5m/min。
  5. 根据权利要求3所述的光伏组件的封装方法，其中，所述背板是单面含氟背板或双面含氟背板。
  6. 根据权利要求3所述的光伏组件的封装方法，其中，所述封装方法还包括：
    将光伏组件以第四预设速度输送至辊压机的预热腔室依次进行下述三个预热阶段：
    在50-70℃的温度范围内进行预热的第一预热阶段；
    在90-110℃的温度范围内进行预热的第二预热阶段；以及
    在130-150℃的温度范围内进行预热的第三预热阶段。
  7. 根据权利要求6所述的封装方法，其中，所述第四预设速度为0.5-3m/min。
  8. 根据权利要求6所述的光伏组件的封装方法，还包括：在将所述光伏组件以第四预设速度输送至所述辊压机的预热腔室进行预热之后，对所述光伏组件进行加热加压。
  9. 根据权利要求8所述的光伏组件的封装方法，还包括：在对所述光伏组件进行加热加压之后，对所述光伏组件进行冷却，当温度降至40℃以下时，将所述光伏组件卷收以获得光伏组件卷。
  10. 根据权利要求9所述的光伏组件的封装方法，其中，在将所述光伏组件卷收的同时，在相邻的卷层之间放置隔离板。
  11. 根据权利要求10所述的光伏组件的封装方法，其中，所述隔离 板为硅胶板。
  12. 根据权利要求1所述的光伏组件的封装方法，其中，所述温压步骤包括：将所述光伏组件卷输送进入压力成型设备，对所述压力成型设备内部的温度和压力进行调整，以对所述光伏组件卷进行层压。
  13. 根据权利要求12所述的光伏组件的封装方法，其中，对所述压力成型设备内部的温度和压力进行调整包括：
    在第一预设时间段内、第一预设温度范围内对所述光伏组件卷进行升温升压；
    在第二预设时间段内对所述光伏组件卷进行保温保压；
    在第三预设时间段内对所述光伏组件卷进行保压降温；以及
    对所述光伏组件卷进行降压降温。
  14. 根据权利要求13所述的光伏组件的封装方法，其中，在所述升温升压阶段中将压力上限保持为10-12bar，在所述保压降温阶段中将温度下限控制为50℃，并且在所述降压降温阶段中将压力降至标准大气压且将温度降至室温。
  15. 根据权利要求13所述的光伏组件的封装方法，其中，所述第一预设时间段为30-50分钟，所述第一预设温度为130-140℃，所述第二预设时间段为50-70分钟，并且所述第三预设时间段为120-150分钟。
  16. 根据权利要求12所述的光伏组件的封装方法，还包括：在对所述光伏组件卷进行所述温压控制处理之后，对所述压力成型设备进行排气并且从所述压力成型设备取出所述光伏组件卷。
  17. 根据权利要求12所述的光伏组件的封装方法，其中，所述压力成型设备为高压釜。
PCT/CN2018/094792 2017-08-11 2018-07-06 光伏组件的封装方法 WO2019029301A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710685904.6 2017-08-11
CN201710685904.6A CN107316912B (zh) 2017-08-11 2017-08-11 卷对卷柔性光伏组件的封装方法

Publications (1)

Publication Number Publication Date
WO2019029301A1 true WO2019029301A1 (zh) 2019-02-14

Family

ID=60175723

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/094792 WO2019029301A1 (zh) 2017-08-11 2018-07-06 光伏组件的封装方法

Country Status (9)

Country Link
US (1) US20190051780A1 (zh)
EP (1) EP3442035A1 (zh)
JP (1) JP2019036722A (zh)
KR (1) KR20190017666A (zh)
CN (1) CN107316912B (zh)
AU (1) AU2018213984A1 (zh)
CA (1) CA3013382A1 (zh)
SG (1) SG10201806736WA (zh)
WO (1) WO2019029301A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107316912B (zh) * 2017-08-11 2018-10-16 北京铂阳顶荣光伏科技有限公司 卷对卷柔性光伏组件的封装方法
CN110581191A (zh) * 2018-06-08 2019-12-17 君泰创新（北京）科技有限公司 一种光伏电池组件的制造方法
CN111403543B (zh) * 2018-12-27 2022-02-08 龙焱能源科技（杭州）有限公司 一种光伏夹层玻璃封装方法、及光伏夹层玻璃
CN112201716B (zh) * 2020-08-31 2022-07-01 重庆神华薄膜太阳能科技有限公司 一种用于柔性光伏组件的封装装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011166075A (ja) * 2010-02-15 2011-08-25 Hitachi Ltd 太陽電池モジュールの製造方法、太陽電池モジュールの製造装置及びロール状太陽電池モジュール
CN102725865A (zh) * 2010-01-26 2012-10-10 积水化学工业株式会社 太阳能电池用密封材料、太阳能电池保护片以及太阳能电池组件的制造方法
CN102856403A (zh) * 2012-10-08 2013-01-02 深圳市创益科技发展有限公司 一种柔性太阳能电池组件阵列及其封装方法
CN104241442A (zh) * 2013-06-21 2014-12-24 米尔鲍尔股份公司 用于制造太阳能电池模组链的方法及设备以及包括柔性太阳能电池的太阳能电池模组链
CN107316912A (zh) * 2017-08-11 2017-11-03 北京铂阳顶荣光伏科技有限公司 卷对卷柔性光伏组件的封装方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992006144A1 (en) * 1990-10-01 1992-04-16 United Solar Systems Corporation Method of laminating composite structures for photovoltaic devices
US5273608A (en) * 1990-11-29 1993-12-28 United Solar Systems Corporation Method of encapsulating a photovoltaic device
JP2000294815A (ja) * 1999-04-09 2000-10-20 Fuji Electric Co Ltd 可撓性太陽電池モジュールの製造方法
US8309163B2 (en) * 2004-02-19 2012-11-13 Nanosolar, Inc. High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor and inter-metallic material
US20090101204A1 (en) * 2007-10-22 2009-04-23 Biosolar, Inc. Photovoltaic laminated module backsheet, films and coatings for use in module backsheet, and processes for making the same
US20110239450A1 (en) * 2008-08-11 2011-10-06 Basol Bulent M Roll-to-roll manufacturing of flexible thin film photovoltaic modules
US20100031996A1 (en) * 2008-08-11 2010-02-11 Basol Bulent M Structure and method of manufacturing thin film photovoltaic modules
JP5281986B2 (ja) * 2009-08-26 2013-09-04 富士フイルム株式会社 積層フィルムおよび複合フィルム
US20110290296A1 (en) * 2010-05-27 2011-12-01 Palo Alto Research Center Incorporated Flexible tiled photovoltaic module
US20130167928A1 (en) * 2010-10-06 2013-07-04 Hiroshi Hiraike Solar cell sealing sheet and flexible solar cell module
WO2012058053A2 (en) * 2010-10-29 2012-05-03 Applied Materials, Inc. Monolithic module assembly using back contact solar cells and metal ribbon
US20140338739A1 (en) * 2011-10-31 2014-11-20 E I Du Pont De Nemours And Company Integrated back-sheet for back contact photovoltaic module
CN104900755A (zh) * 2015-04-15 2015-09-09 中节能太阳能科技（镇江）有限公司 太阳能电池双玻组件预封装方法及流水线

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102725865A (zh) * 2010-01-26 2012-10-10 积水化学工业株式会社 太阳能电池用密封材料、太阳能电池保护片以及太阳能电池组件的制造方法
JP2011166075A (ja) * 2010-02-15 2011-08-25 Hitachi Ltd 太陽電池モジュールの製造方法、太陽電池モジュールの製造装置及びロール状太陽電池モジュール
CN102856403A (zh) * 2012-10-08 2013-01-02 深圳市创益科技发展有限公司 一种柔性太阳能电池组件阵列及其封装方法
CN104241442A (zh) * 2013-06-21 2014-12-24 米尔鲍尔股份公司 用于制造太阳能电池模组链的方法及设备以及包括柔性太阳能电池的太阳能电池模组链
CN107316912A (zh) * 2017-08-11 2017-11-03 北京铂阳顶荣光伏科技有限公司 卷对卷柔性光伏组件的封装方法

Also Published As

Publication number Publication date
KR20190017666A (ko) 2019-02-20
SG10201806736WA (en) 2019-03-28
CN107316912B (zh) 2018-10-16
US20190051780A1 (en) 2019-02-14
AU2018213984A1 (en) 2019-02-28
CA3013382A1 (en) 2019-02-11
EP3442035A1 (en) 2019-02-13
CN107316912A (zh) 2017-11-03
JP2019036722A (ja) 2019-03-07

Similar Documents

Publication Publication Date Title
WO2019029301A1 (zh) 光伏组件的封装方法
JP5604236B2 (ja) 太陽電池モジュールの製造方法、太陽電池セルの接続装置、太陽電池モジュール
EP2525395B1 (en) Machine for manufacturing electrode tapes
JP2004193448A (ja) 太陽電池モジュールのラミネート方法
JP2010527142A (ja) 光起電性モジュールの製造におけるポリマー複合体の使用
US8936690B2 (en) Apparatus and method for large area hermetic encapsulation of one or more organic light emitting diodes (OLEDs)
JP6170042B2 (ja) 多層フルオロポリマーフィルムまたはシートを得る方法
TW201101426A (en) Method for forming an electrical connection
WO2012073675A1 (ja) 薄膜系太陽電池モジュール、及び薄膜系太陽電池モジュールの製造方法
JP2002039631A (ja) 光熱ハイブリッドパネル及びそれを用いたハイブリッドパネル本体及び光熱ハイブリッドパネルの製造方法
JP6110244B2 (ja) 導電性接着テープ及び導電性接着テープの接続方法、並びに太陽電池モジュール及びその製造方法
JP3564889B2 (ja) 太陽電池モジュールのロール式製造方法および製造装置
CN201222504Y (zh) 一种太阳能光电幕墙铝塑板
JPH09153631A (ja) 可撓性太陽電池の製造方法
JP2011132295A (ja) 接着フィルムの貼付方法および太陽電池モジュールの製造方法
CN107768465A (zh) 一种太阳能电池组件及其制备方法
US20110053307A1 (en) Repatterning of polyvinyl butyral sheets for use in solar panels
JP2007048861A (ja) 太陽電池モジュールの製造方法
JP2004153137A (ja) 太陽電池モジュールの製造方法および製造装置
TW201302475A (zh) 對封裝材料具改良之貼附力的太陽能電池背板
US20120260973A1 (en) Busing sub-assembly for photovoltaic modules
JPH11254526A (ja) ラミネート装置及びラミネート方法
CN115394866B (zh) 一种消除柔性组件表面褶皱的方法及组件
JP2007027282A (ja) 薄膜太陽電池モジュール製造方法および製造装置
JP5477088B2 (ja) 薄膜太陽電池の製造装置及び製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18844607

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18844607

Country of ref document: EP

Kind code of ref document: A1