WO2019024567A1 - 电磁屏蔽结构及具有此电磁屏蔽结构的电子设备 - Google Patents

电磁屏蔽结构及具有此电磁屏蔽结构的电子设备 Download PDF

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Publication number
WO2019024567A1
WO2019024567A1 PCT/CN2018/086597 CN2018086597W WO2019024567A1 WO 2019024567 A1 WO2019024567 A1 WO 2019024567A1 CN 2018086597 W CN2018086597 W CN 2018086597W WO 2019024567 A1 WO2019024567 A1 WO 2019024567A1
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WO
WIPO (PCT)
Prior art keywords
shield
circuit board
electromagnetic shielding
shielding structure
cavity
Prior art date
Application number
PCT/CN2018/086597
Other languages
English (en)
French (fr)
Inventor
梁智颖
Original Assignee
深圳市道通智能航空技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市道通智能航空技术有限公司 filed Critical 深圳市道通智能航空技术有限公司
Priority to EP18781943.8A priority Critical patent/EP3471525A4/en
Priority to US16/156,530 priority patent/US20190045674A1/en
Publication of WO2019024567A1 publication Critical patent/WO2019024567A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present application relates to the field of electromagnetic interference processing technology, and in particular to an electromagnetic shielding structure for an electronic device such as a circuit board.
  • the embodiment of the present application provides an electromagnetic shielding structure with good shielding performance and an electronic device having the electromagnetic shielding structure.
  • the electromagnetic shielding structure includes a first shield and a second shield.
  • the first shield includes a first bottom wall and a first side wall extending from an outer edge of the first bottom wall, the first bottom wall and the first side wall of the first shield forming a first cavity, the first shield includes a first cavity partition wall, the first cavity partition wall partitioning the first cavity into at least two first receiving cavities; the second shield Removably mounted to the first shield to close the first cavity of the first shield; the first shield and the second shield collectively receive the circuit board therebetween To electromagnetically shield the circuit board.
  • one end of the first cavity dividing wall contacts or is connected to the circuit board.
  • the first cavity partition wall further includes a first sealant strip disposed at an end surface of the first cavity partition wall, the first sealant strip contacting the circuit board or The circuit board is connected to seal the at least two first receiving cavities.
  • the circuit board is provided with an electronic component, the circuit board includes two oppositely disposed first surfaces and a second surface, and the electronic components are disposed on the first surface;
  • the second shield is in the form of a flat plate, the first surface faces the first cavity of the first shield, the second surface faces the second shield, and the second surface The entire surface is in contact with the second shield.
  • the first shielding member is provided with a first heat dissipating portion, and the electronic component disposed on the first surface dissipates heat through the first heat dissipating portion.
  • the first heat dissipation portion is in contact with or connected to an electronic component disposed on the first surface.
  • a heat conducting member is disposed between the first heat dissipating portion and the electronic component disposed on the first surface, the heat conducting member and an electronic component disposed on the first surface
  • the device contacts or connects to transfer heat generated by the electronic components disposed on the first surface to the first heat dissipating portion through the heat conducting member.
  • the thermally conductive member is a thermally conductive adhesive or a thermally conductive foam.
  • the circuit board is provided with electronic components, the circuit board includes two oppositely disposed first surfaces and second surfaces, and the electronic components are respectively disposed on the first surface and the a second surface;
  • the second shield includes a second bottom wall and a second side wall extending from an outer edge of the second bottom wall, the second bottom wall and the second side wall forming a second a cavity, the first surface facing the first cavity, and the second surface facing the second cavity.
  • the second shield includes a second cavity dividing wall that divides the second cavity into at least two second receiving cavities, the second cavity One end of the bulk separating wall contacts or is coupled to the second surface.
  • the second cavity partition wall further includes a second sealant strip disposed at an end surface of the second cavity partition wall, the second sealant strip contacting the second surface or The second surface is coupled to seal the at least two second receiving cavities.
  • the first shielding member is provided with a first heat dissipating portion, and the electronic component disposed on the first surface is dissipated through the first heat dissipating portion; There is a second heat dissipating portion, and the electronic component disposed on the second surface dissipates heat through the second heat dissipating portion.
  • the first heat dissipation portion is in contact with or connected to an electronic component disposed on the first surface, and/or the second heat dissipation portion and an electronic component disposed on the second surface The device is in contact or connected.
  • a heat conducting member is disposed between the first heat dissipating portion and the electronic component, and the heat conducting member is in contact with or connected to an electronic component disposed on the first surface, thereby being disposed at The heat generated by the electronic component on the first surface is transmitted to the first heat dissipating portion through the heat conducting member.
  • a heat conducting member is disposed between the second heat dissipating portion and the electronic component, and the heat conducting member is in contact with or connected to an electronic component disposed on the second surface, thereby being disposed at The heat generated by the electronic component on the second surface transfers heat to the second heat dissipating portion through the heat conducting member.
  • the thermally conductive member is a thermally conductive adhesive or a thermally conductive foam.
  • the circuit board includes two parallel disposed circuit boards, wherein the first surface is on one of the circuit boards and the second surface is on the other circuit board.
  • the first shield and/or the second shield are provided with heat sink strips.
  • the first shield and the second shield are connected by snap fit.
  • one of the first shield and the second shield includes a protrusion and the other includes a notch, the protrusion being inserted into the notch.
  • the inner wall of the first shield or the second shield is provided with a recess, and the circuit board is fixed in the electromagnetic shielding structure by being inserted into the recess.
  • the circuit board is provided with a plurality of first through holes, and the first shielding member and/or the second shielding member are disposed with a position distribution and a quantity of the first through holes. a plurality of corresponding second through holes, the first through holes and the second through holes for mounting the circuit board to the electromagnetic shielding structure.
  • the first shield and/or the second shield are integrally formed.
  • the embodiment of the present application further provides the following technical solutions:
  • An electronic device comprising a circuit board and an electromagnetic shielding structure as described above, the first shield and the second shield collectively housing the circuit board therebetween.
  • the first shielding member and the second shielding member collectively house the circuit board therebetween, so that the circuit board can be free from electromagnetic interference from external signals, and can also The radiated electromagnetic of the limiting circuit board is moved out of the electromagnetic shielding structure to enhance the electromagnetic shielding effect.
  • the first shielding member includes at least two mutually independent first receiving cavities, and the electronic components of the circuit board can be respectively received in the mutually independent first receiving cavities, thereby reducing the electronic components of the circuit board. Electromagnetic interference generated between devices.
  • FIG. 1 is a perspective view of an electromagnetic shielding structure provided by one embodiment of the present application.
  • Figure 2 is a cross-sectional view of the electromagnetic shielding structure shown in Figure 1;
  • Figure 3 is an exploded view of the electromagnetic shielding structure shown in Figure 1;
  • Figure 4 is an exploded view of the electromagnetic shielding structure shown in Figure 1 from another angle;
  • FIG. 5 is a perspective view of an electromagnetic shielding structure according to another embodiment of the present application.
  • Figure 6 is a cross-sectional view of the electromagnetic shielding structure shown in Figure 5;
  • Figure 7 is an exploded view of the electromagnetic shielding structure shown in Figure 5;
  • Figure 8 is an exploded perspective view showing another angle of the electromagnetic shielding structure shown in Figure 5;
  • Figure 9 is a partial enlarged view of the joint A of the first shield and the second shield of the electromagnetic shielding structure of Figure 6.
  • an electromagnetic shielding structure 100 provided by one embodiment of the present application is used to shield electromagnetic interference and heat dissipation of the circuit board 200 .
  • the electromagnetic shielding structure 100 includes a first shielding member 10 and a second shielding member 20.
  • the first shield 10 and the second shield 20 collectively house and seal the circuit board 200 therebetween.
  • the circuit board 200 includes two opposite first surfaces 2001 and a second surface 2002.
  • the circuit board 200 is mounted in the electromagnetic shielding structure 100 for facilitating installation.
  • the board 200 is also provided with a plurality of first through holes 2003 penetrating the first surface 2001 and the second surface 2002.
  • the number of the first through holes 2003 can be determined according to actual needs, for example, 4, 6, 8, and the like.
  • the circuit board 200 also includes an antenna interface 2004.
  • the circuit board 200 is a single-sided circuit board, that is, all the electronic components disposed on the circuit board 200 are disposed only on the first surface 2001 of the circuit board 200, and the The second surface 2002 of the circuit board 200 is not provided with electronic components.
  • the number of the circuit boards 200 is not limited to one piece, but may be two or more, and the plurality of circuit boards are collectively housed in the electromagnetic shielding structure 100.
  • the plurality of circuit boards are arranged in parallel.
  • the first surface 2001 described above may be located on one of the circuit boards, and the second surface 2002 may be located on the other circuit board.
  • the first shielding member 10 is a box body and has a substantially hollow rectangular parallelepiped structure. It can be understood that in some other embodiments, the first shield 10 can also be set to other shapes, such as a cube or the like, as needed.
  • the first shielding member 10 may be formed by processing a metal material such as aluminum, copper, stainless steel or the like.
  • the first shielding member 10 receives the circuit board 200.
  • the first shielding member 10 includes a first bottom wall 102, a first sidewall 104, a first cavity partition wall 106, a stud 108, and a first A heat sink 110.
  • the first sidewall 104 extends from an outer edge of the first bottom wall 102, and the first bottom wall 102 and the first sidewall 104 form a first cavity 112.
  • the first cavity partition wall 106 connects the first bottom wall 102 and the first side wall 104, and the first cavity partition wall 106 divides the first cavity 112 into at least two independent ones A receiving cavity 1120.
  • One end of the first cavity isolation wall 106 contacts or is connected to the circuit board 200.
  • the circuit board 200 is received in the first cavity 112 , and the first surface 2001 of the circuit board 200 faces the first cavity 112 of the first shield 10 .
  • the electronic components of the circuit board 200 are respectively disposed in the at least two first receiving cavities 1120 to facilitate mutual electromagnetic interference between the circuits of the circuit board 200.
  • the first cavity isolation wall 106 further includes a sealant strip disposed on an end surface thereof. When the electromagnetic shielding structure 100 is installed, the sealant strip contacts or connects with the circuit board 200, thereby The at least two first receiving cavities 1120 are sealed.
  • the sealant strip may contain a metal substance, so that the sealant body is electrically connected to the first cavity partition wall 106, and at least two separated by the first cavity partition wall 106 can be better realized.
  • the first receiving cavity 1120 shields the circuit board 200.
  • the protrusions 108 and the first heat dissipation portion 110 extend from the first bottom wall 102 and are located in the first receiving cavity 1120 .
  • the position distribution and the number of the protrusions 108 are in one-to-one correspondence with the first through holes 2003 of the circuit board 200. For example, if the number of the first through holes 2003 of the circuit board 200 is four, the number of the protrusions 108 is also four. And, each of the studs 108 has a threaded hole.
  • the first heat dissipating portion 110 is in contact with or connected to an electronic component on the circuit board 200.
  • the first heat dissipating portion 110 is in contact with or connected to an electronic component disposed on the first surface 2001. , to dissipate heat.
  • the heat generated by the electronic components disposed on the circuit board 200 is transmitted to the entire first shield 10 through the first heat dissipation portion 110, and the heat is dissipated through the first shield member 10.
  • the first heat dissipating portion 110 can be in contact with or connected to the electronic component that generates a large amount of heat on the circuit board 200 directly through the surface and the surface, so as to facilitate rapid and effective heat dissipation.
  • the first cavity isolation wall 106 may be omitted, and the at least two first receiving cavities 1120 may be isolated by the first heat dissipation portion 110, the first heat dissipation The end face of the portion 110 contacts or connects the first surface 2001 of the circuit board 200.
  • the first shield member 10 is integrally formed. Specifically, the first bottom wall 102, the first sidewall 104 and the first cavity partition wall 106 are of a unitary structure, and the first bottom wall 102 is A side wall 104 and the first cavity dividing wall 106 can be provided in a unitary structure by any suitable means, such as one-piece casting, stamping, or other suitable means. In order to further ensure the sealing property, one end of the first cavity partitioning wall 106 abuts against the circuit board 200.
  • first cavity partition wall 106 and the first bottom wall 102 and the first sidewall 104 may also be separated structures, and the first cavity may be A partition wall 106 is mounted to the first bottom wall 102 and the first side wall 104, for example, the first cavity partition wall 106 is welded to the first bottom wall 102 and the first side wall 104. Additionally, to ensure sealing, the first cavity dividing wall 106 is snugly mounted to the first bottom wall 102 and the first side wall 104.
  • the second shield 20 is in the shape of a flat plate, and the second surface 2002 of the circuit board 200 faces the second shield 20 . In order to ensure a heat dissipation effect, the second shield 20 abuts against the second surface 2002, and the entire surface of the second surface 2002 is in contact with the second shield 20.
  • the second shield 20 is substantially rectangular. In some embodiments, the second shield 20 can also be disposed in other shapes, such as a square or the like, as needed.
  • the second shield 20 is detachably mounted to the first shield 10 to close the first cavity 112 of the first shield 10.
  • the cross-sectional dimensions of the second shield 20 and the first shield 10 at positions connected to each other are substantially the same,
  • the second shield 20 can be tightly fastened to the opening of the first shield 10 such that the second shield 20 is tightly closed with the frame of the first shield 10.
  • the second shield 20 can be detachably mounted to the first shield 10 by screws, threads or other suitable means.
  • the second shield member 20 may be formed by any material having good thermal conductivity, such as a metal material such as an aluminum alloy or a copper alloy or other suitable material. Good thermal conductivity material.
  • the second shield 20 is provided with a plurality of second through holes 203.
  • the position distribution and the number of the first through holes 2003 of 200 are in one-to-one correspondence.
  • the first through hole 2003 and the second through hole 203 are used to mount the circuit board 200 to the electromagnetic shielding structure 100.
  • the plurality of second through holes 203 may be disposed on the first shielding member 10, or the second through holes 203 may be disposed on the first shielding member 10 and the second shielding member 20.
  • the electromagnetic shielding structure 100 includes a plurality of screws 204.
  • the screw 204 sequentially passes through the second through hole 203, the first through hole 2003, and is fixed to the threaded hole of the protruding post 108, and the first shield 10, the circuit board 200, and The second shield 20 is fixed together.
  • the second shield member 20 is tightly covered on the opening of the first shield member 10.
  • first shield 10 and the second shield 20 may also be other suitable connections, such as snaps, clips, and the like.
  • the inner wall of the first shield 10 or the second shield 20 is provided with a groove, and the circuit board 200a is fixed in the groove by inserting the groove
  • the electromagnetic shielding structure 300 is inside.
  • heat dissipation strips may be disposed on the first shield member 10 and the second shield member 20 to increase heat dissipation.
  • the electromagnetic shielding structure 100 may further include a heat conductive member 30 disposed on the first heat dissipation portion 110 and the first surface 2001 of the circuit board 200 .
  • the heat conducting member 30 is in contact with or connected to the electronic components disposed on the first surface 2001, thereby passing heat generated by the electronic components disposed on the first surface 2001.
  • the heat conducting member 30 is transferred to the first heat dissipating portion 110 to facilitate heat dissipation.
  • the heat conducting member 30 can be used to bond the first shield member 10 and the circuit board 200 tightly together, in addition to being used to diffuse heat generated by the circuit board 200.
  • the heat conductive member 30 may be a thermal conductive rubber or a thermal conductive foam, and the heat conductive member 30 may be composed of a polymer heat conductive material or other suitable materials such as silica gel, rubber, or the like.
  • the first shield 10 further includes an antenna interface hole 113 , an adjustment hole 114 , and a data interface 115 .
  • the antenna interface 2004 of the circuit board 200 protrudes from the antenna interface hole 113 to facilitate plugging the antenna; the adjustment hole 114 is used for adjusting a resistor, a digital switch, etc.; the data interface 115 is used for plugging data line.
  • the second shielding member 20 is sealingly mounted on the first shielding member 10 to form a sealed space, and the circuit board 200 is received in the sealed space, so that The circuit board 200 can be prevented from being interfered by external signals, and can limit the radiation electromagnetic inside the circuit board 20 from the electromagnetic shielding structure 100, thereby improving the shielding effect. Moreover, the heat generated by the circuit board 200 can be effectively diffused through the first shield member 10 and the second shield member 20 to achieve rapid heat dissipation.
  • the first shielding member 10 includes at least two independent receiving chambers 1120.
  • the electronic components of the circuit board 200 are respectively received in the first receiving chambers 1120 that are independent of each other, and the circuit board can be reduced. Electromagnetic interference generated between 200 electronic components.
  • the circuit board is a double-sided circuit board, that is, the opposite surfaces of the circuit board are evenly provided with electronic components
  • the second shielding component can be changed to A similar structure of the first shield, and an electromagnetic shielding structure for mounting the double-sided circuit board will be further described below with reference to FIGS. 5-9.
  • an electromagnetic shielding structure 300 is provided.
  • the electromagnetic shielding structure 300 is substantially similar to the electromagnetic shielding structure 100 provided by the above embodiment, except that the second shielding member 20a of the electromagnetic shielding structure 300 is similar in structure to the first shielding member 10, and the second shielding member is similar.
  • 20a is a casing, and includes a second bottom wall 202a, a second side wall 204a extending from an outer edge of the second bottom wall 202a, and a second heat radiating portion 206a.
  • the second bottom wall 202a and the second side wall 204a form a second cavity 212a.
  • the first shield 10 and the second shield 20a together seal the circuit board 200a therebetween.
  • the first surface 2001a of the circuit board 200a faces the first cavity 112 of the first shield 10
  • the second surface 2002a of the circuit board 200a faces the second cavity 212a of the second shield 20a.
  • the electromagnetic shielding structure 300 can be used to shield the circuit board 200a from electromagnetic interference and heat dissipation.
  • the circuit board 200a is a double-sided circuit board, that is, the first surface 2001a and the second surface 2002a of the circuit board 200a are both provided with electronic components. It can be understood that the number of the circuit boards 200a is not limited to one piece, but may be two or more pieces, and the plurality of circuit boards are collectively housed in the electromagnetic shielding structure 300. Preferably, the plurality of circuit boards are arranged in parallel. For example, when the number of circuit boards is two, the first surface 2001a may be located on one of the circuit boards, and the second surface 2002a may be located on the other circuit board.
  • the second shield 20a further includes a second cavity isolation wall that divides the second cavity 212a into at least two second receiving cavities 2120a, the second cavity One end of the bulk separating wall contacts or is coupled to the second surface 2002a.
  • the second cavity partition wall further includes a sealant strip disposed on an end surface thereof, and when the electromagnetic shield structure 300 is installed, the sealant strip is in contact with the second surface 2002a of the circuit board 200a or Connecting to seal the at least two second receiving cavities 2120a.
  • the sealant strip may contain a metal substance, so that the sealant body is electrically connected to the second cavity partition wall, and at least two second portions separated by the second cavity partition wall can be better realized.
  • the shielding cavity 2120a shields the circuit board 200a.
  • the first receiving cavity 1120 of the first shielding member 10 and the first surface 2001a of the circuit board 200a are located at one side of the circuit board 200a, and the first receiving cavity 1120 of the first shielding member 10 is used for receiving The electronic component on the first surface 2001a; similarly, the second receiving cavity 2120a of the second shielding member 20a and the second surface 2002a of the circuit board 200a are located on the other side of the circuit board 200a.
  • the second receiving cavity 2120a of the second shielding member 20a is configured to receive the electronic component on the second surface 2002a.
  • the electronic component disposed on the first surface 2001a of the circuit board 200a is dissipated through the first heat dissipation portion 110 on the first shield member 10; the electronic component disposed on the second surface 2002a of the circuit board 200a passes through the second shield
  • the second heat radiating portion 206a on the member 20a dissipates heat.
  • the electromagnetic shielding structure 300 can include the thermally conductive member 30 of the above-described embodiments.
  • the heat conducting member 30 may be disposed between the first heat dissipating portion 110 and the electronic component on the first surface 2001a, and the heat conducting member 30 is in contact with or connected with the electronic component disposed on the first surface 2001a, thereby setting The heat generated by the electronic components on the first surface 2001a is transmitted to the first heat dissipation portion 110 through the heat conduction member 30.
  • the heat conducting member 30 may also be disposed between the second heat dissipating portion 206a and the electronic component on the second surface 2002a, and the heat conducting member 30 is in contact with or connected with the electronic component disposed on the second surface 2002a, thereby The heat generated by the electronic components disposed on the second surface 2002a is transferred to the second heat radiating portion 206a through the heat conducting member 30.
  • the heat conducting member 30 can be used to closely bond the heat generated by the circuit board 200a, and the first shield member 10 and/or the second shield member 20a can be closely bonded to the circuit board 200a.
  • the heat conductive member 30 may be a thermal conductive rubber or a thermal conductive foam, and the heat conductive member 30 may be composed of a polymer heat conductive material or other suitable materials such as silica gel, rubber or the like.
  • first heat dissipation portion 110 and/or the second heat dissipation portion 206a are directly in contact with the first surface 2001a and/or the second surface 2002a.
  • the first heat dissipating portion 110 and/or the second heat dissipating portion 206a are respectively connected to the first surface 2001a and/or the second surface 2002a through the heat conducting member 30. Electronic components.
  • a heat dissipation strip may be disposed on the second shield 20a to increase the amount of heat dissipation.
  • the second shielding member 20a is integrally formed.
  • the second bottom wall 202a, the second side wall 204a and the second heat dissipating portion 206a are of a unitary structure, and the second bottom wall 202a and the second side are Wall 204a and second heat sink 206a may be provided in a unitary configuration by any suitable means, such as one-piece casting, stamping, or other suitable means.
  • one end of the second heat radiating portion 206a is in close contact with the circuit board 200.
  • the second heat dissipation portion 206a and the second bottom wall 202a and the second sidewall 204a may also be separated structures, and the second heat dissipation portion 206a may be installed in the The second bottom wall 202a and the second side wall 204a, for example, the second heat dissipation portion 206a are welded to the second bottom wall 202a and the second side wall 204a. Further, in order to ensure the sealing property, the second heat radiating portion 206a is closely attached to the second bottom wall 202a and the second side wall 204a.
  • the antenna interface hole 113, the adjustment hole 114, and the data interface 115 may also be disposed on the second shielding member 20a; or the antenna interface hole 113 and the adjustment hole 114.
  • the data interface 115 is partially disposed on the first shielding member 10, and the other portion is disposed on the second shielding member 20a.
  • the antenna interface hole 113 is disposed in the first shielding member 10
  • the adjusting hole 114 is The data interface 115 is disposed on the second shield 20a.
  • FIG. 9 is a partial enlarged view of the joint A of the first shield 10a and the second shield 20a.
  • the first shielding member 10 and the second shielding member 20a are connected by a fastening manner.
  • the outer side wall of the second shielding member 20a is provided with a notch 220a.
  • the first shielding member 10 is provided.
  • the protrusion 120 may be embedded in the notch 220a to facilitate positioning and mounting the second shield 20a to the first shield 10, and may further ensure sealing.
  • the outer sidewall of the first shield 10 may be provided with a notch
  • the second shield 20a may be provided with a protrusion.
  • the inner wall of the first shield 10 or the second shield 20a is provided with a groove, and the circuit board 200a is fixed in the groove by inserting the groove
  • the electromagnetic shielding structure 300 is inside.
  • the first shielding member 10 houses an electronic component disposed on the first surface 2001a; the second shielding member 20a receives the second surface 2002a.
  • the electronic components are disposed on the electromagnetic shielding structure 300 to effectively shield and dissipate the circuit board 200a.
  • the first shielding member 10 includes at least two mutually independent first receiving cavities 1120.
  • the electronic components disposed on the first surface 2001a are respectively received in the first receiving chambers 1120 that are independent of each other.
  • the second shielding member 20a includes at least two second receiving chambers 2120a that are independent of each other.
  • the electronic components disposed on the second surface 2001a are respectively received in the second receiving chambers 2120a that are independent of each other, thereby reducing the circuit board. Electromagnetic interference generated between the electronic components of 200a.
  • a further embodiment of the present application provides an electronic device including the electromagnetic shielding structure 100 and the circuit board 200.
  • the first shielding member 10 and the second shielding member 20 collectively house and seal the circuit board 200. Between the two.
  • the electronic device includes the electromagnetic shielding structure 300 and the circuit board 200a, and the first shielding member 10 and the second shielding member 20a collectively house and seal the circuit board 200a therebetween.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请涉及电磁干扰处理技术领域，提供一种电磁屏蔽结构，其包括第一屏蔽件和第二屏蔽件。所述第一屏蔽件包括第一底壁和从所述第一底壁的外沿延伸的第一侧壁，所述第一屏蔽件的所述第一底壁和所述第一侧壁形成一凹腔，所述第一屏蔽件包括第一腔体隔离壁，所述第一腔体隔离壁将所述第一凹腔分隔成至少两个第一收容腔；第二屏蔽件可拆卸地安装于所述第一屏蔽件，从而封闭所述第一屏蔽件的第一凹腔；所述第一屏蔽件和所述第二屏蔽件共同将电路板收容于两者之间，以对所述电路板进行电磁屏蔽。所述电磁屏蔽结构可使得所述电路板不受到来自外界信号的干扰，从而提升屏蔽效果。

Description

电磁屏蔽结构及具有此电磁屏蔽结构的电子设备
本申请要求于2017年08月03日提交中国专利局、申请号为201710657156.0、申请名称为“电磁屏蔽结构及具有此电磁屏蔽结构的电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电磁干扰处理技术领域，特别是涉及一种用于电子设备例如电路板的电磁屏蔽结构。
背景技术
随着电子技术的快速发展，新的功能及新的零部件在电子设备中的使用量也在不断的增加。在电子设备向更高的处理能力和更广的应用领域发展的过程中，也伴随着电子设备中的电路板上的线路会更加复杂、稠密，而其中的每条走线的电场又会产生相互干扰，从而造成电路板中的电路之间的电磁干扰，并且，外界信号也会对电子设备产生干扰。因此，在电子设备领域，防止电磁干扰成为目前急需解决的问题。
发明内容
为了解决上述技术问题，本申请实施例提供一种屏蔽性能良好的电磁屏蔽结构及具有此电磁屏蔽结构的电子设备。
为了解决上述技术问题，本申请实施例提供以下技术方案：
一种电磁屏蔽结构，应用于电路板。所述电磁屏蔽结构包括第一屏蔽件和第二屏蔽件。所述第一屏蔽件包括第一底壁和从所述第一底壁的外沿延伸的第一侧壁，所述第一屏蔽件的所述第一底壁和所述第一侧壁形成第一凹腔，所述第一屏蔽件包括第一腔体隔离壁，所述第一腔体隔离壁将所述第一凹腔 分隔成至少两个第一收容腔；所述第二屏蔽件可拆卸地安装于所述第一屏蔽件，从而封闭所述第一屏蔽件的第一凹腔；所述第一屏蔽件和所述第二屏蔽件共同将电路板收容于两者之间，以对所述电路板进行电磁屏蔽。
在一些实施例中，所述第一腔体隔离壁的一端接触所述电路板或与所述电路板连接。
在一些实施例中，所述第一腔体隔离壁还包括设置在所述第一腔体隔离壁的端面的第一密封胶条，所述第一密封胶条接触所述电路板或与所述电路板连接，从而密封所述至少两个第一收容腔。
在一些实施例中，所述电路板上设置有电子元器件，所述电路板包括两个相对设置的第一表面和第二表面，所述电子元器件皆设置于所述第一表面；所述第二屏蔽件为平板状，所述第一表面面对所述第一屏蔽件的所述第一凹腔，所述第二表面面对所述第二屏蔽件，并且所述第二表面的整个表面与所述第二屏蔽件接触。
在一些实施例中，所述第一屏蔽件上设置有第一散热部，设置在所述第一表面上的电子元器件通过所述第一散热部进行散热。
在一些实施例中，所述第一散热部与设置在所述第一表面上的电子元器件接触或连接。
在一些实施例中，所述第一散热部与设置在所述第一表面上的所述电子元器件之间设置有导热件，所述导热件与设置在所述第一表面上的电子元器件接触或连接，从而将设置在所述第一表面上的电子元器件所产生的热量通过所述导热件传递给所述第一散热部。
在一些实施例中，所述导热件为导热胶或导热泡棉。
在一些实施例中，所述电路板上设置有电子元器件，所述电路板包括两个相对设置的第一表面和第二表面，所述电子元器件分别设置于所述第一表面和所述第二表面；所述第二屏蔽件包括第二底壁和从所述第二底壁的外沿延伸的第二侧壁，所述第二底壁和所述第二侧壁形成第二凹腔，所述第一表面面对所述第一凹腔，所述第二表面面对所述第二凹腔。
在一些实施例中，所述第二屏蔽件包括第二腔体隔离壁，所述第二腔体隔离壁将所述第二凹腔分隔成至少两个第二收容腔，所述第二腔体隔离壁一端接触所述第二表面或与所述第二表面连接。
在一些实施例中，所述第二腔体隔离壁还包括设置在所述第二腔体隔离壁的端面的第二密封胶条，所述第二密封胶条接触所述第二表面或与所述第二表面连接，从而密封所述至少两个第二收容腔。
在一些实施例中，所述第一屏蔽件上设置有第一散热部，设置在所述第一表面上的电子元器件通过所述第一散热部进行散热；所述第二屏蔽件上设置有第二散热部，设置在所述第二表面上的电子元器件通过所述第二散热部进行散热。
在一些实施例中，所述第一散热部与设置在所述第一表面上的电子元器件接触或连接，并且/或者所述第二散热部与设置在所述第二表面上的电子元器件接触或连接。
在一些实施例中，所述第一散热部与所述电子元器件之间设置有导热件，所述导热件与设置在所述第一表面上的电子元器件接触或连接，从而将设置在所述第一表面上的电子元器件所产生的热量通过所述导热件传递给所述第一散热部。
在一些实施例中，所述第二散热部与所述电子元器件之间设置有导热件，所述导热件与设置在所述第二表面上的电子元器件接触或连接，从而将设置在所述第二表面上的电子元器件所产生的热量通过所述导热件将热量传递给所述第二散热部。
在一些实施例中，所述导热件为导热胶或导热泡棉。
在一些实施例中，所述电路板包括两块平行设置的电路板，其中，所述第一表面位于其中一块电路板上，所述第二表面位于另一块电路板上。
在一些实施例中，所述第一屏蔽件和/或所述第二屏蔽件设有散热条。
在一些实施例中，所述第一屏蔽件和所述第二屏蔽件通过扣合的方式进行连接。
在一些实施例中，所述第一屏蔽件和所述第二屏蔽件中的一个包括凸起，另一个包括缺口，所述凸起插入所述缺口。
在一些实施例中，所述第一屏蔽件或所述第二屏蔽件的内壁上设有凹槽，所述电路板通过插入所述凹槽而固定在所述电磁屏蔽结构内。
在一些实施例中，所述电路板上设置有多个第一通孔，所述第一屏蔽件和/或所述第二屏蔽件上设置有与所述第一通孔的位置分布及数量一一相对应的多个第二通孔，所述第一通孔和所述第二通孔用于将所述电路板安装于所述电磁屏蔽结构。
在一些实施例中，所述第一屏蔽件和/或所述第二屏蔽件为一体成型的。
为了解决上述技术问题，本申请实施例还提供以下技术方案：
一种电子设备，包括电路板和如上所述的电磁屏蔽结构，所述第一屏蔽件和所述第二屏蔽件共同将所述电路板收容于两者之间。
与现有技术相比较，所述第一屏蔽件和所述第二屏蔽件共同将所述电路板收容于两者之间，使得所述电路板可不受到来自外界信号的电磁干扰，并且还可限制电路板的辐射电磁越出所述电磁屏蔽结构，从而提升电磁屏蔽效果。
另外，所述第一屏蔽件包括至少两个相互独立的第一收容腔，所述电路板的电子元器件可分别被收容于相互独立的第一收容腔，可减少所述电路板的电子元器件之间产生的电磁干扰。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明并不构成对实施例的限定，附图中具有相同参考数字标号的元件表示为类似的元件，除非有特别申明，附图中的图不构成比例限制。
图1为本申请其中一个实施例提供的电磁屏蔽结构的立体图；
图2为图1所示的电磁屏蔽结构的剖视图；
图3为图1所示的电磁屏蔽结构的分解图；
图4为从另一角度示出的图1所示的电磁屏蔽结构的分解图；
图5为本申请另一实施例提供的电磁屏蔽结构的立体图；
图6为图5所示的电磁屏蔽结构的剖视图；
图7为图5所示的电磁屏蔽结构的分解图；
图8为图5所示的电磁屏蔽结构的另一角度的分解图；
图9为图6中所述电磁屏蔽结构的第一屏蔽件和第二屏蔽件连接处A的局部放大图。
具体实施方式
为了便于理解本申请，下面结合附图和具体实施方式，对本申请进行更详细的说明。需要说明的是，当元件被表述“固定于”另一个元件，它可以直接在另一个元件上、或者其间可以存在一个或多个居中的元件。当一个元件被表述“连接”另一个元件，它可以是直接连接到另一个元件、或者其间可以存在一个或多个居中的元件。本说明书所使用的术语“垂直的”、“水平的”、“左”、“右”、“内”、“外”以及类似的表述只是为了说明的目的。
除非另有定义，本说明书所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是用于限制本申请。本说明书所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
此外，下面所描述的本申请不同实施例中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
下面结合附图，对本申请实施例作进一步阐述。
请参阅图1和图2，本申请其中一实施例提供的电磁屏蔽结构100，用于为电路板200屏蔽电磁干扰以及散热。所述电磁屏蔽结构100包括：第一屏 蔽件10和第二屏蔽件20。所述第一屏蔽件10和所述第二屏蔽件20共同将所述电路板200收容、封密于两者之间。
请一并参阅3和图4，所述电路板200包括两相对设置的第一表面2001和第二表面2002，为了便于将所述电路板200安装于所述电磁屏蔽结构100内，所述电路板200还设有多个第一通孔2003，所述第一通孔2003贯穿所述第一表面2001和第二表面2002。所述第一通孔2003的数量可根据实际需要确定，例如4个、6个、8个等。所述电路板200还包括天线接口2004。在本实施例中，所述电路板200为单面电路板，也即，所述电路板200上设置的所有电子元器件仅设置于所述电路板200的第一表面2001上，而所述电路板200的第二表面2002不设置电子元器件。可以理解的是，电路板200的数量不限于为一块，而是可以为两块或更多，多块电路板共同收容在电磁屏蔽结构100中。优选地，所述多块电路板平行设置。例如，当电路板的数量为两块时，上述的第一表面2001可以位于其中一块电路板上，上述的第二表面2002可以位于另一块电路板上。
所述第一屏蔽件10为盒体，大致为中空长方体结构。可以理解的是，在一些其它实施例中，还可根据需要将所述第一屏蔽件10设置为其它形状，如正方体等。所述第一屏蔽件10可采用铝、铜、不锈钢等金属材料或其它合适材料加工形成。
所述第一屏蔽件10收容所述电路板200，具体的，所述第一屏蔽件10包括第一底壁102，第一侧壁104，第一腔体隔离壁106、凸柱108以及第一散热部110。所述第一侧壁104从所述第一底壁102的外沿延伸而出，所述第一底壁102和所述第一侧壁104形成第一凹腔112。所述第一腔体隔离壁106连接所述第一底壁102和第一侧壁104，所述第一腔体隔离壁106将所述第一凹腔112分隔成至少两个相互独立的第一收容腔1120。该第一腔体隔离壁106一端接触电路板200或与电路板200连接。所述电路板200被收容于所述第一凹腔112，所述电路板200的第一表面2001面对所述第一屏蔽件10的所述第一凹腔112。所述电路板200的电子元器件分别设置于所述至少两个第一收 容腔1120内，便于屏蔽所述电路板200的电路之间的相互电磁干扰。在一些实现方式中，所述第一腔体隔离壁106还包括设置在其端面的密封胶条，当电磁屏蔽结构100安装好后，该密封胶条与电路板200接触或连接，从而对所述至少两个第一收容腔1120进行密封。具体地，在该密封胶条中可以含有金属物质，使得该密封胶体与第一腔体隔离壁106电连接，能够更好地实现由第一腔体隔离壁106所分隔而成的至少两个第一收容腔1120对电路板200的屏蔽作用。
所述凸柱108和第一散热部110皆从所述第一底壁102延伸而出，并位于所述第一收容腔1120内。
所述凸柱108的位置分布及数量与所述电路板200的第一通孔2003一一对应。例如所述电路板200的第一通孔2003的数量为4个，则所述凸柱108的数量也为4个。并且，每个所述凸柱108具有螺纹孔。
所述第一散热部110与所述电路板200上的电子元器件接触或连接，具地的，所述第一散热部110与设置在所述第一表面2001上的电子元器件接触或连接，对其进行散热。所述电路板200上设置的电子元器件产生的热量通过所述第一散热部110传递至整个第一屏蔽件10，再通过所述第一屏蔽件10将热量散发。所述第一散热部110可以与所述电路板200上的产生较大热量的电子元器件直接通过面与面的方式接触或连接，便于快速有效的散热。
可以理解的是，在一些其它实施例中，所述第一腔体隔离壁106可以省略，所述至少两个第一收容腔1120可通过所述第一散热部110隔离，所述第一散热部110的端面接触或连接所述电路板200的第一表面2001。
所述第一屏蔽件10为一体成型的，具体的，所述第一底壁102，第一侧壁104和第一腔体隔离壁106为一体式结构，所述第一底壁102，第一侧壁104和第一腔体隔离壁106可以通过任何合适的方式设置成一体式结构，如一体式铸造、冲压或者其它合适的方式。为了进一步保证密封性所述第一腔体隔离壁106的一端紧贴所述电路板200。
可以理解的是，在一些其它实施例中，所述第一腔体隔离壁106与所述 第一底壁102和第一侧壁104也可以为分离式结构，可将所述第一腔体隔离壁106安装于所述第一底壁102和第一侧壁104，例如将所述第一腔体隔离壁106焊接于所述第一底壁102和第一侧壁104。另外，为了保证密封性，所述第一腔体隔离壁106紧贴地安装于所述第一底壁102和第一侧壁104。
所述第二屏蔽件20为平板状，所述电路板200的第二表面2002面对所述第二屏蔽件20。为了保证散热效果，所述第二屏蔽件20紧贴所述第二表面2002，并且所述第二表面2002的整个表面与所述第二屏蔽件20接触。所述第二屏蔽件20大致为长方形，在一些实施例中，还可根据需要将所述第二屏蔽件20设置为其它形状，如正方形等。所述第二屏蔽件20可拆卸地安装于所述第一屏蔽件10，从而封闭所述第一屏蔽件10的第一凹腔112。
在一些实施例中，为了与所述第一屏蔽件10配合，形成一个密封结构，所述第二屏蔽件20与所述第一屏蔽件10在彼此连接的位置处的横截面尺寸大致相同，所述第二屏蔽件20可以紧密地扣合于所述第一屏蔽件10的开口，使得所述第二屏蔽件20与所述第一屏蔽件10的边框紧密闭合。所述第二屏蔽件20可通过螺钉、螺纹或其它合适的方式可拆卸地安装于所述第一屏蔽件10。并且，为了将所述电路板200在工作时产生的热量更有效的扩散出去，所述第二屏蔽件20可由任何导热性好的材料加工形成，如铝合金、铜合金等金属材料或者其它合适的导热性佳的材料。
所述第二屏蔽件20设有多个第二通孔203。为了确保所述第二屏蔽件20能安装于所述第一屏蔽件10，所述第一屏蔽件10的凸柱108、所述第二屏蔽件20的第二通孔203及所述电路板200的第一通孔2003的位置分布及数量一一对应。所述第一通孔2003和所述第二通孔203用于将所述电路板200安装于所述电磁屏蔽结构100。在另一实现方式中，所述多个第二通孔203可设置在第一屏蔽件10上，或者，可以在第一屏蔽件10和第二屏蔽件20上均设置第二通孔203。
所述电磁屏蔽结构100包括多个螺钉204。组装所述电磁屏蔽结构100时，所述螺钉204依次穿过第二通孔203、第一通孔2003，并固定于所述凸柱108 的螺纹孔，将第一屏蔽10，电路板200以及第二屏蔽件20固定在一起。并且，为了保证密封性，所述第二屏蔽件20紧密盖设于所述第一屏蔽件10的开口。
可以理解的是，在一些其它实施例中，所述第一屏蔽件10与所述第二屏蔽件20还可以为其它合适的连接方式，例如扣合、卡箍等。
可以理解的是，在一些实施例中，所述第一屏蔽件10或所述第二屏蔽件20的内壁上设有凹槽，所述电路板200a通过插入所述凹槽而固定在所述电磁屏蔽结构300内。
在一些实施例中，为了更有效的散热，可以在所述第一屏蔽件10与所述第二屏蔽件20上均设有散热条，以便增加散热量。
在一些实施例中，请复参阅图2，所述电磁屏蔽结构100还可包括导热件30，所述导热件30设置于所述第一散热部110与电路板200的第一表面2001上的电子元器件之间，所述导热件30与设置在所述第一表面2001上的电子元器件接触或连接，从而将设置在所述第一表面2001上的电子元器件所产生的热量通过所述导热件30传递给所述第一散热部110，便于散热。所述导热件30除了可用于将所述电路板200产生的热量扩散出去，还可将所述第一屏蔽件10与所述电路板200紧密的粘接在一起。所述导热件30可为导热胶或导热泡棉，所述导热件30可以由高分子的导热材料或其它合适的材料构成，如硅胶、橡胶等。
请复参阅图1，所述第一屏蔽件10还包括：天线接口孔113、调整孔114以及数据接口115。所述电路板200的天线接口2004凸伸出所述天线接口孔113，便于插接天线；所述调整孔114用于对电阻，数字开关等进行调整；所述数据接口115用于插接数据线。
在本申请实施例提供的电磁屏蔽结构100中，所述第二屏蔽件20密封的安装于所述第一屏蔽件10，形成密封空间，将所述电路板200收容于密封空间内，使得所述电路板200既可不受到来自外界信号的干扰，又可限制电路板20内部的辐射电磁越出所述电磁屏蔽结构100，从而提升屏蔽效果。并且，通过所述第一屏蔽件10和所述第二屏蔽件20还能将所述电路板200产生的 热量有效扩散出去，实现快速散热。
另外，所述第一屏蔽件10包括至少两个相互独立的第一收容腔1120，所述电路板200的电子元器件分别被收容于相互独立的第一收容腔1120，可减少所述电路板200的电子元器件之间产生的电磁干扰。
需要说明的是，本领域的技术人员应该理解，在一些实施例中，若电路板为双面电路板，即电路板的两相对表面匀设置有电子元器件，第二屏蔽件可变为与第一屏蔽件类似的结构，下面结合图5-9，对用于安装双面电路板的电磁屏蔽结构作进一步阐述。
请参阅图5-8，为本申请另一实施例提供的电磁屏蔽结构300。所述电磁屏蔽结构300与上述实施例提供的电磁屏蔽结构100基本相似，区别点在于所述电磁屏蔽结构300的第二屏蔽件20a与第一屏蔽件10的结构相似，所述第二屏蔽件20a为盒体，包括第二底壁202a、从第二底壁202a的外沿延伸的第二侧壁204a以及第二散热部206a。所述第二底壁202a和第二侧壁204a形成第二凹腔212a。
所述第一屏蔽件10和所述第二屏蔽件20a共同将电路板200a封密于两者之间。其中，电路板200a的第一表面2001a面对第一屏蔽件10的第一凹腔112，电路板200a的第二表面2002a面对第二屏蔽件20a的第二凹腔212a。所述电磁屏蔽结构300可用于为所述电路板200a屏蔽电磁干扰以及散热。
所述电路板200a为双面电路板，也即所述电路板200a的第一表面2001a与第二表面2002a均设置有电子元器件。可以理解的是，电路板200a的数量不限于为一块，而是可以为两块或更多，多块电路板共同收容在电磁屏蔽结构300中。优选地，所述多块电路板平行设置。例如，当电路板的数量为两块时，上述的第一表面2001a可以位于其中一块电路板上，上述的所述第二表面2002a可以位于另一块电路板上。
在一些实施例中，所述第二屏蔽件20a还包括第二腔体隔离壁，第二腔体隔离壁将第二凹腔212a分隔成至少两个第二收容腔2120a，所述第二腔体 隔离壁一端接触所述第二表面2002a或与所述第二表面2002连接。在一些实现方式中，所述第二腔体隔离壁还包括设置在其端面上的密封胶条，当电磁屏蔽结构300安装好后，该密封胶条与电路板200a的第二表面2002a接触或连接，从而对所述至少两个第二收容腔2120a进行密封。具体地，在该密封胶条中可以含有金属物质，使得该密封胶体与第二腔体隔离壁电连接，能够更好地实现由第二腔体隔离壁中分隔而成的至少两个第二收容腔2120a对电路板200a的屏蔽作用。
所述第一屏蔽件10的第一收容腔1120与所述电路板200a的第一表面2001a位于所述电路板200a的一侧，所述第一屏蔽件10的第一收容腔1120用于收容所述第一表面2001a上的电子元器件；类似地，所述第二屏蔽件20a的第二收容腔2120a与所述电路板200a的第二表面2002a位于所述电路板200a的另一侧，所述第二屏蔽件20a的第二收容腔2120a用于收容所述第二表面2002a上的电子元器件。
设置在电路板200a的第一表面2001a上的电子元器件通过第一屏蔽件10上的第一散热部110进行散热；设置在电路板200a的第二表面2002a上的电子元器件通过第二屏蔽件20a上的第二散热部206a进行散热。
可以理解的是，在一些实施例中，所述电磁屏蔽结构300可包括上述实施例中的所述导热件30。所述导热件30可以设置在第一散热部110与第一表面2001a上的电子元器件之间，所述导热件30与设置在第一表面2001a上的电子元器件接触或连接，从而将设置在所述第一表面2001a上的电子元器件所产生的热量通过所述导热件30传递给所述第一散热部110。所述导热件30还可以设置在第二散热部206a与第二表面2002a上的电子元器件之间，所述导热件30与设置在第二表面2002a上的电子元器件接触或连接，从而将设置在所述第二表面2002a上的电子元器件所产生的热量通过所述导热件30传递给所述第二散热部206a。
所述导热件30除了可用于将电路板200a产生的热量扩散出去，还可将所述第一屏蔽件10和/或所述第二屏蔽件20a与所述电路板200a紧密的粘接 在一起。导热件30可为导热胶或导热泡棉，所述导热件30可以由高分子的导热材料或其它合适的材料构成，如硅胶、橡胶等。
可以理解的是，在不同的实现方式中，所述第一散热部110和/或所述第二散热部206a分别直接接触设置于所述第一表面2001a和/或所述第二表面2002a上的电子元器件，或者，所述第一散热部110和/或所述第二散热部206a通过所述导热件30分别连接设置于所述第一表面2001a和/或所述第二表面2002a上的电子元器件。
可以理解的是，在一些实施例中，为了更有效的散热，可以在所述第二屏蔽件20a上设置散热条，以便增加散热量。
所述第二屏蔽件20a为一体成型的，具体的，所述第二底壁202a，第二侧壁204a和第二散热部206a为一体式结构，所述第二底壁202a，第二侧壁204a和第二散热部206a可以通过任何合适的方式设置成一体式结构，如一体式铸造、冲压或者其它合适的方式。为了进一步保证密封性所述第二散热部206a的一端紧贴所述电路板200。
可以理解的是，在一些其它实施例中，所述第二散热部206a与所述第二底壁202a和第二侧壁204a也可以为分离式结构，可将第二散热部206a安装于所述第二底壁202a和第二侧壁204a，例如将所述第二散热部206a焊接于所述第二底壁202a和第二侧壁204a。另外，为了保证密封性，所述第二散热部206a紧贴地安装于所述第二底壁202a和第二侧壁204a。
可以理解的是，在一些其它实施例中，所述天线接口孔113、调整孔114以及数据接口115还可设置于所述第二屏蔽件20a；或者，所述天线接口孔113、调整孔114以及数据接口115部分设置于所述第一屏蔽件10，另一部分设置于所述第二屏蔽件20a，例如，所述天线接口孔113设置于所述第一屏蔽件10，而调整孔114以及数据接口115设置于所述第二屏蔽件20a。
请参阅图9，为所述第一屏蔽件10a和所述第二屏蔽件20a连接处A的局部放大图。所述第一屏蔽件10和所述第二屏蔽件20a通过扣合的方式进行连接，具体的，所述第二屏蔽件20a的外侧壁设有缺口220a；所述第一屏蔽件 10设有凸起120，所述凸起120可嵌入所述缺口220a中，以便于将所述第二屏蔽件20a定位及安装于所述第一屏蔽件10，并且还可进一步保证密封性。可以理解的是，在一些其它实施例中，所述第一屏蔽件10的外侧壁可设有缺口，而第二屏蔽件20a可设有凸起。
可以理解的是，在一些实施例中，所述第一屏蔽件10或所述第二屏蔽件20a的内壁上设有凹槽，所述电路板200a通过插入所述凹槽而固定在所述电磁屏蔽结构300内。
在本申请另一实施例提供的电磁屏蔽结构300中，所述第一屏蔽件10收容所述第一表面2001a上设置的电子元器件；所述第二屏蔽件20a收容所述第二表面2002a上设置的电子元器件，从而使得所述电磁屏蔽结构300可对所述电路板200a进行有效的屏蔽及散热。
另外，所述第一屏蔽件10包括至少两个相互独立的第一收容腔1120，设置于所述第一表面2001a上的电子元器件分别被收容于相互独立的第一收容腔1120，所述第二屏蔽件20a包括至少两个相互独立的第二收容腔2120a，设置于所述第二表面2001a上的电子元器件分别被收容于相互独立的第二收容腔2120a，可减少所述电路板200a的电子元器件之间产生的电磁干扰。
本申请又一实施例提供一电子设备，其包括所述电磁屏蔽结构100和所述电路板200，所述第一屏蔽件10和所述第二屏蔽件20共同将电路板200收容、封密于两者之间。或者，所述电子设备包括所述电磁屏蔽结构300和所述电路板200a，所述第一屏蔽件10和所述第二屏蔽件20a共同将电路板200a收容、封密于两者之间。
最后还应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；在本申请的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，步骤可以以任意顺序实现，并存在如上所述的本申请的不同方面的许多其它变化，为了简明，它们没有在细节中提供；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本 申请各实施例技术方案的范围。

Claims (24)

  1. 一种电磁屏蔽结构(100，300)，应用于电路板(200，200a)，其特征在于，包括：
    第一屏蔽件(10)，所述第一屏蔽件(10)包括第一底壁(102)和从所述第一底壁(102)的外沿延伸的第一侧壁(104)，所述第一屏蔽件(10)的所述第一底壁(102)和所述第一侧壁(104)形成第一凹腔(112)，所述第一屏蔽件(10)包括第一腔体隔离壁(106)，所述第一腔体隔离壁(106)将所述第一凹腔(112)分隔成至少两个第一收容腔(1120)；
    第二屏蔽件(20，20a)，其可拆卸地安装于所述第一屏蔽件(10)，从而封闭所述第一屏蔽件(10)的第一凹腔(112)；
    所述第一屏蔽件(10)和所述第二屏蔽件(20，20a)共同将电路板(200，200a)收容于两者之间，以对所述电路板(200，200a)进行电磁屏蔽。
  2. 根据权利要求1所述的电磁屏蔽结构(100，300)，其特征在于，所述第一腔体隔离壁(106)的一端接触所述电路板(200)或与所述电路板(200)连接。
  3. 根据权利要求2所述的电磁屏蔽结构(100)，其特征在于，所述第一腔体隔离壁(106)还包括设置在所述第一腔体隔离壁(106)的端面的第一密封胶条，所述第一密封胶条接触所述电路板(200)或与所述电路板(200)连接，从而密封所述至少两个第一收容腔(1120)。
  4. 根据权利要求1至3任一项所述的电磁屏蔽结构(100)，其特征在于，所述电路板(200)上设置有电子元器件，所述电路板(200)包括两个相对设置的第一表面(2001)和第二表面(2002)，所述电子元器件皆设置于所述第一表面(2001)；所述第二屏蔽件(20)为平板状，所述第一表面(2001) 面对所述第一屏蔽件(10)的所述第一凹腔(112)，所述第二表面(2002)面对所述第二屏蔽件(20)，并且所述第二表面(2002)的整个表面与所述第二屏蔽件(20)接触。
  5. 根据权利要求4所述的电磁屏蔽结构(100)，其特征在于，所述第一屏蔽件(10)上设置有第一散热部(110)，设置在所述第一表面(2001)上的电子元器件通过所述第一散热部(110)进行散热。
  6. 根据权利要求5所述的电磁屏蔽结构(100)，其特征在于，所述第一散热部(110)与设置在所述第一表面(2001)上的电子元器件接触或连接。
  7. 根据权利要求5或6所述的电磁屏蔽结构(100)，其特征在于，所述第一散热部(110)与设置在所述第一表面(2001)上的所述电子元器件之间设置有导热件(30)，所述导热件(30)与设置在所述第一表面(2001)上的电子元器件接触或连接，从而将设置在所述第一表面(2001)上的电子元器件所产生的热量通过所述导热件(30)传递给所述第一散热部(110)。
  8. 根据权利要求7所述的电磁屏蔽结构(100)，其特征在于，所述导热件(30)为导热胶或导热泡棉。
  9. 根据权利要求1至3任一项所述的电磁屏蔽结构(300)，其特征在于，所述电路板(200a)上设置有电子元器件，所述电路板(200a)包括两个相对设置的第一表面(2001a)和第二表面(2002a)，所述电子元器件分别设置于所述第一表面(2001a)和所述第二表面(2002a)；所述第二屏蔽件(20a)包括第二底壁(202a)和从所述第二底壁(202a)的外沿延伸的第二侧壁(204a)，所述第二底壁(202a)和所述第二侧壁(204a)形成第二凹腔(212a)，所述第一表面(2001a)面对所述第一凹腔(112)，所述第二表面(2002a)面对所述第二凹腔(212a)。
  10. 根据权利要求9所述的电磁屏蔽结构(300)，其特征在于，所述第二屏蔽件(20a)包括第二腔体隔离壁，所述第二腔体隔离壁将所述第二凹腔(212a)分隔成至少两个第二收容腔(2120a)，所述第二腔体隔离壁一端接触所述第二表面(2002a)或与所述第二表面(2002a)连接。
  11. 根据权利要求10所述的电磁屏蔽结构(300)，其特征在于，所述第二腔体隔离壁还包括设置在所述第二腔体隔离壁的端面的第二密封胶条，所述第二密封胶条接触所述第二表面(2002a)或与所述第二表面(2002a)连接，从而密封所述至少两个第二收容腔(2120a)。
  12. 根据权利要求9至11任一项所述的电磁屏蔽结构(300)，其特征在于，所述第一屏蔽件(10)上设置有第一散热部(110)，设置在所述第一表面(2001a)上的电子元器件通过所述第一散热部(110)进行散热；所述第二屏蔽件(20a)上设置有第二散热部(206a)，设置在所述第二表面(2002a)上的电子元器件通过所述第二散热部(206a)进行散热。
  13. 根据权利要求12所述的电磁屏蔽结构(300)，其特征在于，所述第一散热部(110)与设置在所述第一表面(2001a)上的电子元器件接触或连接，并且/或者所述第二散热部(206a)与设置在所述第二表面(2002a)上的电子元器件接触或连接。
  14. 根据权利要求12或13所述的电磁屏蔽结构(300)，其特征在于，所述第一散热部(110)与所述电子元器件之间设置有导热件(30)，所述导热件(30)与设置在所述第一表面(2001a)上的电子元器件接触或连接，从而将设置在所述第一表面(2001a)上的电子元器件所产生的热量通过所述导热件(30)传递给所述第一散热部(110)。
  15. 根据权利要求14所述的电磁屏蔽结构(300)，其特征在于，所述第二散热部(206a)与所述电子元器件之间设置有导热件(30)，所述导热件(30)与设置在所述第二表面(2002a)上的电子元器件接触或连接，从而将设置在所述第二表面(2002a)上的电子元器件所产生的热量通过所述导热件(30)传递给所述第二散热部(206a)。
  16. 根据权利要求14或15所述的电磁屏蔽结构(300)，其特征在于，所述导热件(30)为导热胶或导热泡棉。
  17. 根据权利要求1至16任一项所述的电磁屏蔽结构(100，300)，其特征在于，所述电路板(200a)包括两块平行设置的电路板，其中，所述第一表面(2001，2001a)位于其中一块电路板上，所述第二表面(2002，2002a)位于另一块电路板上。
  18. 根据权利要求1至17任一项所述的电磁屏蔽结构(100，300)，其特征在于，所述第一屏蔽件(10)和/或所述第二屏蔽件(20，20a)设有散热条。
  19. 根据权利要求1至18任一项所述的电磁屏蔽结构(100，300)，其特征在于，所述第一屏蔽件(10)和所述第二屏蔽件(20，20a)通过扣合的方式进行连接。
  20. 根据权利要求19所述的电磁屏蔽结构(300)，其特征在于，所述第一屏蔽件(10)和所述第二屏蔽件(20a)中的一个包括凸起，另一个包括缺口，所述凸起插入所述缺口。
  21. 根据权利要求1至20任一项所述的电磁屏蔽结构(100，300)，其特征在于，所述第一屏蔽件(10)或所述第二屏蔽件(20，20a)的内壁上设 有凹槽，所述电路板(200，200a)通过插入所述凹槽而固定在所述电磁屏蔽结构(100，300)内。
  22. 根据权利要求1至20任一项所述的电磁屏蔽结构(100，300)，其特征在于，所述电路板(200，200a)上设置有多个第一通孔(2003)，所述第一屏蔽件(10)和/或所述第二屏蔽件(20，20a)上设置有与所述第一通孔(2003)的位置分布及数量一一相对应的多个第二通孔(203)，所述第一通孔(2003)和所述第二通孔(203)用于将所述电路板(200，200a)安装于所述电磁屏蔽结构(100，300)。
  23. 根据权利要求1至22任一项所述的电磁屏蔽结构(100，300)，其特征在于，所述第一屏蔽件(10)和/或所述第二屏蔽件(20a)为一体成型的。
  24. 一种电子设备，其特征在于，包括电路板(200，200a)和权利要求1至23任一项所述的电磁屏蔽结构(100，300)，所述第一屏蔽件(10)和所述第二屏蔽件(20，20a)共同将所述电路板(200，200a)收容于两者之间。
PCT/CN2018/086597 2017-08-03 2018-05-11 电磁屏蔽结构及具有此电磁屏蔽结构的电子设备 WO2019024567A1 (zh)

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