WO2019019273A1 - 一种切割装置及切割方法 - Google Patents

一种切割装置及切割方法 Download PDF

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Publication number
WO2019019273A1
WO2019019273A1 PCT/CN2017/100693 CN2017100693W WO2019019273A1 WO 2019019273 A1 WO2019019273 A1 WO 2019019273A1 CN 2017100693 W CN2017100693 W CN 2017100693W WO 2019019273 A1 WO2019019273 A1 WO 2019019273A1
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WO
WIPO (PCT)
Prior art keywords
cutting
blade
flexible material
glass substrate
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/100693
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English (en)
French (fr)
Inventor
杜骁
蒋谦
沐俊应
倪晶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US15/737,657 priority Critical patent/US20190030741A1/en
Publication of WO2019019273A1 publication Critical patent/WO2019019273A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/28—Splitting layers from work; Mutually separating layers by cutting
    • B26D3/282—Splitting layers from work; Mutually separating layers by cutting by peeling-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
    • B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
    • B26D1/08—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type
    • B26D1/09—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type with a plurality of cutting members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/08—Means for actuating the cutting member to effect the cut
    • B26D5/12—Fluid-pressure means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a cutting device and a cutting method.
  • the flexible display device refers to a display device formed on a flexible substrate, which is characterized by ultra-light, ultra-thin, bendable deformation, and portability. As the screen size of the mobile terminal product becomes larger and larger, the flexible display device is portable in the future. Both product and display technology fields have broad application prospects and market potential.
  • the manufacturing process of such a display device is difficult to be performed on a single flexible substrate surface, so the existing production process usually uses a glass substrate as a A rigid substrate is coated on the rigid substrate as a flexible substrate and a flexible display screen is sequentially prepared by various process processes.
  • Cutting techniques applied to the cutting process of such display devices include: cutter wheel cutting and laser cutting.
  • the cutter wheel cutting method is a cutting method of a conventional glass substrate, and generally adopts a cutter wheel made of a high-hardness material as a main cutting portion, and the cutting process is divided into two processes of a scribe line and a cleavage. Since the hardness of the cutter wheel is much larger than that of the glass, the pressure exerted by the cutter head causes a score on the glass as the cutter wheel passes during the scribing process. However, when cutting the glass substrate covering the flexible material layer, the obtuse edge portion of the cutter wheel cannot effectively cut the flexible material layer, that is, the flexible material layer and the glass substrate cannot be completely cut during the cutting process.
  • the flexible material layer and the glass substrate can be cut by using a high-permeability, multi-tooth number of cutter wheels, due to the flexibility of the flexible material layer, the edges of the cut product may be irregular, during the process of edging after cutting, due to The friction wheel and the edge of the flexible material layer are involved in irregularities, so that the flexible material layer edging process subsequently exhibits cracks.
  • Laser cutting has the advantages of high precision and high efficiency.
  • due to the disadvantages of expensive equipment, complicated process and heat-affected zone a lot of work still needs to be done in the mass production process of flexible panels.
  • the object of the present invention is to provide a cutting device and a cutting method, which can completely cut the flexible material layer and the glass substrate, and the flexible material layer does not have cracks in the subsequent edging process, and the process is simple and economical.
  • the present invention provides a cutting device for cutting a flexible substrate, the flexible substrate comprising a glass substrate and a layer of flexible material on the glass substrate, wherein the cutting device comprises: a cutting platform, and is located above the cutting platform And a cutting blade assembly, a peeling device, and a cutter wheel disposed in order from right to left; wherein
  • the cutting platform is configured to carry the flexible substrate
  • the cutting blade assembly is for cutting the layer of flexible material
  • the stripping device is configured to peel the strip of flexible material after cutting from the glass substrate;
  • the cutting blade wheel is configured to form a cutting scratch on the bare glass substrate after the flexible material layer is peeled off;
  • the cutting blade assembly includes two oppositely disposed cutting blade sets; wherein each of the cutting blade sets includes a blade holder and a blade coupled to the blade holder;
  • the stripping device includes a roller and a conveyor belt disposed on the roller, and the rolling of the flexible material layer on the flexible material layer causes the flexible material layer to be peeled off from the glass substrate by the conveyor belt.
  • the holder may be pressurized by a cylinder to press the blade into the layer of flexible material.
  • the seat is coupled to the blade by a joint, the joint being operable to adjust a position of the blade on the seat such that between the two blades
  • the spacing is adjustable; the connecting portion can also be used to adjust an angle of the blade to the seat such that an angle between the blade and the flexible substrate is adjustable.
  • the interval between the two blades may be set between 0.5 mm and 2 mm.
  • the angle between the blade and the flexible substrate may be set to an acute angle.
  • the roller and the conveyor belt are each provided with a viscous material.
  • the present invention also provides a cutting device for cutting a flexible substrate, the flexible substrate comprising a glass substrate and a layer of flexible material on the glass substrate, wherein the cutting device comprises: a cutting platform, and a location a cutting blade assembly, a peeling device, and a cutter wheel disposed above the cutting platform and disposed from right to left; wherein
  • the cutting platform is configured to carry the flexible substrate
  • the cutting blade assembly is for cutting the layer of flexible material
  • the stripping device is configured to peel the strip of flexible material after cutting from the glass substrate;
  • the cutter wheel is configured to form a cut scratch on the exposed glass substrate after the flexible material layer is peeled off.
  • the cutting blade assembly includes two oppositely disposed cutting blade sets; wherein each of the cutting blade sets includes a blade holder and a blade coupled to the holder.
  • the holder may be pressurized by a cylinder to press the blade into the layer of flexible material.
  • the seat is coupled to the blade by a joint, the joint being operable to adjust a position of the blade on the seat such that between the two blades
  • the spacing is adjustable; the connecting portion can also be used to adjust an angle of the blade to the seat such that an angle between the blade and the flexible substrate is adjustable.
  • the interval between the two blades may be set between 0.5 mm and 2 mm.
  • the angle between the blade and the flexible substrate may be set to an acute angle.
  • the peeling device includes a roller and a conveyor belt disposed on the roller, and the rolling of the roller on the layer of flexible material causes the layer of flexible material to be driven by the conveyor belt The glass substrate is peeled off.
  • the roller and the conveyor belt are each provided with a viscous material.
  • the present invention also provides a cutting method comprising:
  • the flexible substrate comprising a glass substrate and a layer of flexible material on the glass substrate;
  • a cut scratch is formed on the bare glass substrate.
  • the cutting device and the cutting method of the invention cut the flexible material layer by providing a cutting blade set, and the interval between the two blades is adjustable, and the angle between the blade and the flexible material layer is adjustable, so that the cutting flexibility can be more easily
  • the material layer improves the cutting quality, and the angle of the cutting surface of the flexible material layer is an acute angle, which avoids the contact with the groove of the grinding wheel in the subsequent edging process, thereby overcoming the damage of the grinding wheel to the flexible material layer in the edging process.
  • FIG. 1 is a schematic structural view of a cutting device according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a cutting blade assembly in a cutting device according to a preferred embodiment of the present invention
  • FIG. 3 is a schematic structural view of a collecting device in a cutting device according to a preferred embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a cutting blade assembly cutter wheel in a cutting device according to a preferred embodiment of the present invention
  • FIG. 5 is a schematic view showing the edging of the cut glass substrate according to a preferred embodiment of the present invention.
  • FIG. 1 is a schematic structural view of a cutting device according to a preferred embodiment of the present invention.
  • a cutting device provided by a preferred embodiment of the present invention is used for cutting a flexible substrate 105 .
  • the flexible substrate 105 includes a glass substrate 1051 and a flexible material layer 1052 on the glass substrate 1051 .
  • the cutting device comprises: a cutting platform. 101.
  • a cutting blade assembly 102, a stripping device 103, and a cutting wheel 104 disposed above the cutting platform 101 and disposed from right to left.
  • the cutting platform 101 is used to carry the flexible substrate 105; the cutting blade assembly 102 is used to cut the flexible material layer 1052; the peeling device 103 is used to peel the cut flexible material layer 1052 from the glass substrate 1051; A dicing scratch is formed on the bare glass substrate 1051, and the glass substrate 1051 is lobed and edging by a subsequent process.
  • FIG. 2 is a schematic structural view of a cutting blade assembly in a cutting device according to a preferred embodiment of the present invention
  • FIG. 3 is a schematic structural view of a collecting device in a cutting device according to a preferred embodiment of the present invention
  • FIG. 4 is a cutting according to a preferred embodiment of the present invention. Schematic diagram of the cutting blade assembly cutter wheel in the device.
  • the cutting blade assembly 102 includes two oppositely disposed cutting blade sets 201 and 202, wherein each cutting blade set 201 and 202 includes a blade holder 203 and a blade coupled to the blade holder 203. 204.
  • the relative arrangement herein is understood to mean that the two cutting blade sets 201 and 202 are respectively disposed on both sides of the cutting platform 101; in FIG. 2, the cutting platform 101 and the flexible substrate 105 on the cutting platform 101 are used.
  • the flexible substrate 105 includes a glass substrate 1051 and a flexible cutting layer 1052 on the glass substrate 1051.
  • the two cutting blade groups 201 and 202 are respectively a first cutting blade group on one side of the cutting platform 101. 201 and the second cutting blade set 202 on the other side of the cutting platform 101, the first cutting blade set 201 and the second cutting blade set 202 have a uniform structure.
  • the preferred embodiment may provide a cylinder (not shown) on the cutting blade assembly for applying a pressure to the seat 203, thereby causing the blade 204 coupled to the seat 203 to be pressed to the layer of flexible material. in.
  • the blade holder 203 is coupled to the blade 204 via a connecting portion 205.
  • the blade holder 203 in the cutting device provided by the preferred embodiment of the present invention is coupled to the blade 204 via a connecting portion 205, which can be used to adjust the first cutting blade set.
  • the interval between the blade 204 in the first cutting blade set 201 and the blade 204 in the second cutting blade set 202 can be set between 0.5 mm and 2 mm. .
  • the angle between the blade 204 in the first cutting blade set 201 and the flexible substrate 105 and the angle between the blade 204 and the flexible substrate 105 in the second cutting blade set 202 can be set at an acute angle, which makes it easier to cut the layer of flexible material.
  • the angle of the cutting surface of the flexible material layer 1052 can be made an acute angle to avoid contact with the groove of the grinding wheel in the subsequent edging process, thereby overcoming the damage of the grinding wheel to the flexible material layer in the edging process.
  • the stripping device 103 includes a roller 301 and a conveyor belt 302 disposed on the roller 301.
  • the roller 301 and the conveyor belt 302 are each provided with a viscous material 303 on the flexible material layer 1052.
  • the rolling causes the flexible material layer 1052 to be peeled off from the glass substrate 1051 by the conveyor belt 302.
  • the cutting blade 104 includes a cutting blade holder 401 and a cutting blade 402 connected to the cutting blade holder 401 for forming a cutting scratch on the bare glass substrate 1051. Further, the glass substrate 1051 is split and edging by a subsequent process.
  • the flexible substrate 105 is placed on the cutting platform 101 such that the flexible substrate 105 is fixed on the cutting platform 101.
  • the layer of flexible material 1052 is cut by a cutting blade assembly 102 located on the cutting platform 101. Specifically, the interval between the two blades 204 is adjusted by the connecting portion 205 and the angle between the blade 204 and the flexible substrate 105 is set, and pressure is applied to the blade holder 203 through the cylinder so that the blade 204 connected to the blade holder 203 is caused. Pressed into the layer of flexible material 1052.
  • the cut flexible material layer 1052 is peeled off from the glass substrate 1051 by the peeling device 103.
  • the roller 301 is rolled on the flexible material layer 1052 after the cutting is completed, so that the flexible material layer 1052 is separated from the glass substrate by the belt 302 with the viscous material on the roller 301.
  • FIG. 5 is a schematic view showing the edging of the cut glass substrate according to a preferred embodiment of the present invention. As shown in FIG. 5, the diced glass substrate 5011 is edging, due to the flexibility after cutting. The material layer 5012 is cut at an acute angle. When the edge is edging, the groove 5013 on the grinding wheel 501 is not in direct contact with the cut flexible material layer 5012, and the tearing and rubbing of the flexible material layer 5012 can be avoided. Wait.
  • the cutting device of the preferred embodiment cuts the layer of flexible material by providing a cutting blade set, and the interval between the two blades is adjustable, and the angle of the blade and the layer of flexible material is adjustable, so that the flexible material can be more easily cut.
  • the layer can also make the angle of the cutting surface of the flexible material layer an acute angle, avoiding the contact with the groove of the grinding wheel in the subsequent edging process, thereby overcoming the damage of the grinding wheel to the flexible material layer in the edging process.
  • the present invention also provides a cutting method for cutting a flexible substrate using the cutting device of the above preferred embodiment, the method comprising:
  • the flexible substrate comprising a glass substrate and a layer of flexible material on the glass substrate;
  • a cut scratch is formed on the bare glass substrate.
  • the cutting device and the cutting method of the invention cut the flexible material layer by providing a cutting blade set, and the interval between the two blades is adjustable, and the angle between the blade and the flexible material layer is adjustable, so that the cutting flexibility can be more easily
  • the material layer can make the angle of the cutting surface of the flexible material layer an acute angle, avoiding the contact with the groove of the grinding wheel in the subsequent edging process, thereby overcoming the damage of the grinding wheel to the flexible material layer in the edging process.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

一种切割装置及切割方法，包括切割平台（101）、及位于切割平台（101）上方依次设置的切割刀片组件（102）、剥离装置（103）以及切割刀轮（104），其中，切割平台（101）用于承载柔性基板（105）；切割刀片组件（102）用于切割柔性材料层（1052）；剥离装置（103）用于将切割完成后的柔性材料层（1052）从玻璃基板（1051）上剥离；切割刀轮（104）用于在柔性材料层（1052）剥离后，在裸露出的玻璃基板（1051）上形成切割划痕。

Description

一种切割装置及切割方法 技术领域
本发明涉及显示技术领域，尤其涉及一种切割装置及切割方法。
 背景技术
柔性显示装置是指在柔性基板上制作成型的显示设备，具备超轻、超薄、可弯曲变形、便于携带等特性，随着移动终端产品屏幕尺寸越来越大，柔性显示装置在未来的便携产品和显示技术领域均具有广阔的应用前景及市场潜力。
在柔性显示装置制造的过程中，由于柔性基板存在变形、褶皱、位置偏移等问题，使此类显示设备的制造过程难以在单一的柔性基板表面进行，所以现有生产工艺通常利用玻璃基板作为刚性基底，在刚性基底上涂覆柔性材料层作为柔性基底并依次通过各制程工艺制备柔性显示屏。应用于此类显示装置切割制程的切割技术有：刀轮切割和激光切割。
刀轮切割是传统玻璃基板的切割方法，其通常采用高硬度材料制成的刀轮作为主要切割部，切割制程分为划线和裂片两个过程。由于刀轮硬度远大于玻璃，在划线过程中，刀头施加的压力使刀轮经过时在玻璃上形成刻痕。然而，在切割覆盖柔性材料层的玻璃基板时，刀轮的钝角刃部无法有效完成对柔性材料层的切割，即无法在切割制程时将柔性材料层与玻璃基板完全切开。虽然使用高渗透、多齿数的刀轮可以将柔性材料层与玻璃基板切开，但是由于柔性材料层的柔性，其切割产品的边缘会呈现不规整，在切割后磨边的制程过程中，由于磨轮与柔性材料层边缘不规则部的牵扯，使得柔性材料层磨边制程后续呈现裂痕。而激光切割具有高精度、高效率等优点，但由于设备昂贵、制程复杂和具有热影响区等缺点，在柔性面板量产过程中仍需做大量工作。
故，有必要提供一种切割装置及切割方法，以解决现有技术所存在的问题。
 技术问题
本发明的目的在于提供一种切割装置及切割方法，可以将柔性材料层与玻璃基板完全切开，且柔性材料层不会在后续磨边制程过程中出现裂痕，制程简单经济。
 技术解决方案
本发明提供一种切割装置，用于切割柔性基板，所述柔性基板包括玻璃基板以及位于所述玻璃基板上的柔性材料层，其中所述切割装置包括：切割平台、及位于所述切割平台上方且从右往左依次设置的切割刀片组件、剥离装置以及切割刀轮；其中，
所述切割平台用于承载所述柔性基板；
所述切割刀片组件用于切割所述柔性材料层；
所述剥离装置用于将切割完成后的所述柔性材料层从所述玻璃基板上剥离；
所述切割刀轮用于在所述柔性材料层剥离后，在裸露出的所述玻璃基板上形成切割划痕；
所述切割刀片组件包括两个相对设置的切割刀片组；其中，每个所述切割刀片组均包括刀座以及与所述刀座连接的刀片；
所述剥离装置包括滚轮以及设置在所述滚轮上的传送带，通过滚轮在所述柔性材料层上的滚动，使得所述柔性材料层在所述传送带的带动下与所述玻璃基板剥离。
在本发明的切割装置中，可通过气缸加压作用于所述刀座，以使得所述刀片压至所述柔性材料层中。
在本发明的切割装置中，所述刀座通过连接部与所述刀片连接，所述连接部可用于调整所述刀片在所述刀座上的位置，以使得两个所述刀片之间的间隔可调；所述连接部还可用于调整所述刀片与所述刀座的角度，以使得所述刀片与所述柔性基板之间的角度可调。
在本发明的切割装置中，两个所述刀片之间的间隔可设置介于0.5毫米-2毫米之间。
在本发明的切割装置中，所述刀片与所述柔性基板之间的角度可设置成锐角。
在本发明的切割装置中，所述滚轮和所述传送带上均设有粘性材料。
本发明还提供一种切割装置，用于切割柔性基板，所述柔性基板包括玻璃基板以及位于所述玻璃基板上的柔性材料层，其特征在于，所述切割装置包括：切割平台、及位于所述切割平台上方且从右往左依次设置的切割刀片组件、剥离装置以及切割刀轮；其中，
所述切割平台用于承载所述柔性基板；
所述切割刀片组件用于切割所述柔性材料层；
所述剥离装置用于将切割完成后的所述柔性材料层从所述玻璃基板上剥离；
所述切割刀轮用于在所述柔性材料层剥离后，在裸露出的所述玻璃基板上形成切割划痕。
在本发明的切割装置中，所述切割刀片组件包括两个相对设置的切割刀片组；其中，每个所述切割刀片组均包括刀座以及与所述刀座连接的刀片。
在本发明的切割装置中，可通过气缸加压作用于所述刀座，以使得所述刀片压至所述柔性材料层中。
在本发明的切割装置中，所述刀座通过连接部与所述刀片连接，所述连接部可用于调整所述刀片在所述刀座上的位置，以使得两个所述刀片之间的间隔可调；所述连接部还可用于调整所述刀片与所述刀座的角度，以使得所述刀片与所述柔性基板之间的角度可调。
在本发明的切割装置中，两个所述刀片之间的间隔可设置介于0.5毫米-2毫米之间。
在本发明的切割装置中，所述刀片与所述柔性基板之间的角度可设置成锐角。
在本发明的切割装置中，所述剥离装置包括滚轮以及设置在所述滚轮上的传送带，通过滚轮在所述柔性材料层上的滚动，使得所述柔性材料层在所述传送带的带动下与所述玻璃基板剥离。
在本发明的切割装置中，所述滚轮和所述传送带上均设有粘性材料。
依据上述目的，本发明还提供一种切割方法，其包括：
将柔性基板置于切割平台上，所述柔性基板包括玻璃基板以及位于所述玻璃基板上的柔性材料层；
切割所述柔性材料层；
将切割完成后的所述柔性材料层从所述玻璃基板上剥离；
在裸露的所述玻璃基板上形成切割划痕。
 有益效果
本发明的切割装置及切割方法，通过设置切割刀片组对柔性材料层进行切割，且两个刀片之间的间隔可调、及刀片与柔性材料层的角度可调，这样既可以更容易切割柔性材料层，改善切割品质，又可以使柔性材料层切割面夹角为锐角，避免后续磨边制程中与磨轮沟槽的接触，从而可以克服磨边制程中磨轮对柔性材料层的破坏。
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
图1为本发明优选实施例提供的切割装置的结构示意图；
图2为本发明优选实施例提供的切割装置中切割刀片组件的结构示意图；
图3为本发明优选实施例提供的切割装置中收集装置的结构示意图；
图4为本发明优选实施例提供的切割装置中切割刀片组件刀轮的结构示意图；
图5为本发明优选实施例提供的对切割后的玻璃基板进行磨边的示意图。
 本发明的最佳实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参阅图1，图1为本发明优选实施例提供的切割装置的结构示意图。如图1所示，本发明优选实施例提供的切割装置，用于切割柔性基板105，该柔性基板105包括玻璃基板1051以及位于玻璃基板1051上的柔性材料层1052，该切割装置包括：切割平台101、及位于切割平台101上方且从右往左依次设置的切割刀片组件102，剥离装置103以及切割刀轮104。其中，切割平台101用于承载柔性基板105；切割刀片组件102用于切割柔性材料层1052；剥离装置103用于将切割完成后的柔性材料层1052从玻璃基板1051上剥离；切割刀轮104用于在裸露的玻璃基板1051上形成切割划痕，进而通过后续的制程将玻璃基板1051裂片、磨边。
下面结合图2、图3、图4对本发明优选实施例的切割装置进行详细的描述。图2为本发明优选实施例提供的切割装置中切割刀片组件的结构示意图；图3为本发明优选实施例提供的切割装置中收集装置的结构示意图；图4为本发明优选实施例提供的切割装置中切割刀片组件刀轮的结构示意图。
结合图1、图2所示，该切割刀片组件102包括两个相对设置的切割刀片组201与202，其中，每个切割刀片组201与202均包括刀座203以及与刀座203连接的刀片204。
具体地，这里所说的相对设置可以理解为这两个切割刀片组201和202分别设置在切割平台101的两侧；在图2中，以切割平台101以及位于切割平台101上的柔性基板105为例进行说明，其中，该柔性基板105包括玻璃基板1051以及位于玻璃基板1051上的柔性切割层1052，这两个切割刀片组201和202分别为位于切割平台101一侧的第一切割刀片组201和位于切割平台101另一侧的第二切割刀片组202，第一切割刀片组201以及第二切割刀片组202具有一致的结构。
进一步的，本优选实施例可在切割刀片组件上设置气缸（图中未标示）），该气缸用于施加一压力至刀座203，进而使得与刀座203连接的刀片204压至柔性材料层中。
特别地，刀座203通过连接部205与刀片204连接，本发明优选实施例提供的切割装置中的刀座203通过连接部205与刀片204连接，该连接部205可用于调整第一切割刀片组201中的刀片204与第二切割刀片组202中的刀片204之间的间隔以及用于调整刀片204与刀座203之间的角度，进而使得刀片204与柔性基板105之间的角度可调，在对柔性材料层1052进行切割时，可以根据需要进行调整，使得刀片204以特定的角度进入柔性材料层1052中。
优选的，本发明优选实施例提供的切割装置中，第一切割刀片组201中的刀片204与第二切割刀片组202中的刀片204之间的间隔可设置介于0.5毫米-2毫米之间。第一切割刀片组201中的刀片204与柔性基板105之间的角度以及第二切割刀片组202中刀片204与柔性基板105之间的角度可设置成锐角，这样既可以更容易切割柔性材料层1052，又可以使柔性材料层1052切割面夹角为锐角，避免后续磨边制程中与磨轮沟槽的接触，从而可以克服磨边制程中磨轮对柔性材料层的破坏。
结合图1、图3所示，该剥离装置103包括滚轮301以及设置在滚轮301上的传送带302，其中，滚轮301和传送带302上均设有粘性材料303，通过滚轮301在柔性材料层1052上的滚动，使得柔性材料层1052在传送带302的带动下与玻璃基板1051剥离。
结合图1、图4所示，该切割刀轮104包括切割刀座401以及与切割刀座401连接的切割刀402，该切割刀轮104用于在裸露的玻璃基板1051上形成切割划痕，进而通过后续的制程将玻璃基板1051裂片、磨边。
下面对本优选实施例提供的切割装置对柔性基板进行切割的过程进行详细描述。
首先，将柔性基板105置于切割平台101上，使得柔性基板105固定在该切割平台101上。
随后，通过位于切割平台101上的切割刀片组件102对柔性材料层1052进行切割。具体地，通过连接部205调整两个刀片204之间的间隔以及设置刀片204与柔性基板105之间的角度，再通过气缸在刀座203上施加压力，以使得与刀座203连接的刀片204压入柔性材料层1052中。
接着，通过剥离装置103将切割完成后的柔性材料层1052从玻璃基板1051上剥离。具体的，通过滚轮301在切割完成后的柔性材料层1052上进行滚动，从而柔性材料层1052通过位于滚轮301上带有粘性材料的传送带302的带动下与玻璃基板分离。
然后，通过切割刀轮104在裸露的玻璃基板1051上形成切割划痕。
最后，参阅图5，图5为本发明优选实施例提供的对切割后的玻璃基板进行磨边的示意图；如图5所示，对切割后的玻璃基板5011进行磨边，由于切割后的柔性材料层5012切割角度为锐角，磨边时磨轮501上的沟槽5013与切割后的柔性材料层5012不会直接接触，可避免磨边柔性材料层5012时所产生的拉扯撕裂、摩擦烧焦等。
本优选实施例的切割装置，通过设置切割刀片组对柔性材料层进行切割，且两个刀片之间的间隔可调、及刀片与柔性材料层的角度可调，这样既可以更容易切割柔性材料层，又可以使柔性材料层切割面夹角为锐角，避免后续磨边制程中与磨轮沟槽的接触，从而可以克服磨边制程中磨轮对柔性材料层的破坏。
本发明还提供一种切割方法，该切割方法为使用上述优选实施例中的切割装置对柔性基板进行切割，该方法包括：
将柔性基板置于切割平台上，所述柔性基板包括玻璃基板以及位于所述玻璃基板上的柔性材料层；
切割所述柔性材料层；
将切割完成后的所述柔性材料层从所述玻璃基板上剥离；
在裸露的所述玻璃基板上形成切割划痕。
本发明的切割装置及切割方法，通过设置切割刀片组对柔性材料层进行切割，且两个刀片之间的间隔可调、及刀片与柔性材料层的角度可调，这样既可以更容易切割柔性材料层，又可以使柔性材料层切割面夹角为锐角，避免后续磨边制程中与磨轮沟槽的接触，从而可以克服磨边制程中磨轮对柔性材料层的破坏。
综上，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (15)

  1. 一种切割装置，用于切割柔性基板，所述柔性基板包括玻璃基板以及位于所述玻璃基板上的柔性材料层，其中所述切割装置包括：切割平台、及位于所述切割平台上方且从右往左依次设置的切割刀片组件、剥离装置以及切割刀轮；其中，
    所述切割平台用于承载所述柔性基板；
    所述切割刀片组件用于切割所述柔性材料层；
    所述剥离装置用于将切割完成后的所述柔性材料层从所述玻璃基板上剥离；
    所述切割刀轮用于在所述柔性材料层剥离后，在裸露出的所述玻璃基板上形成切割划痕；
    所述切割刀片组件包括两个相对设置的切割刀片组；其中，每个所述切割刀片组均包括刀座以及与所述刀座连接的刀片；
    所述剥离装置包括滚轮以及设置在所述滚轮上的传送带，通过滚轮在所述柔性材料层上的滚动，使得所述柔性材料层在所述传送带的带动下与所述玻璃基板剥离。
  2. 根据权利要求1所述的切割装置，其可通过气缸加压作用于所述刀座，以使得所述刀片压至所述柔性材料层中。
  3. 根据权利要求1所述的切割装置，其中所述刀座通过连接部与所述刀片连接，所述连接部可用于调整所述刀片在所述刀座上的位置，以使得两个所述刀片之间的间隔可调；所述连接部还可用于调整所述刀片与所述刀座的角度，以使得所述刀片与所述柔性基板之间的角度可调。
  4. 根据权利要求3所述的切割装置，其中两个所述刀片之间的间隔可设置介于0.5毫米-2毫米之间。
  5. 根据权利要求3所述的切割装置，其中所述刀片与所述柔性基板之间的角度可设置成锐角。
  6. 根据权利要求1所述的切割装置，其中所述滚轮和所述传送带上均设有粘性材料。
  7. 一种切割装置，用于切割柔性基板，所述柔性基板包括玻璃基板以及位于所述玻璃基板上的柔性材料层，其中所述切割装置包括：切割平台、及位于所述切割平台上方且从右往左依次设置的切割刀片组件、剥离装置以及切割刀轮；其中，
    所述切割平台用于承载所述柔性基板；
    所述切割刀片组件用于切割所述柔性材料层；
    所述剥离装置用于将切割完成后的所述柔性材料层从所述玻璃基板上剥离；
    所述切割刀轮用于在所述柔性材料层剥离后，在裸露出的所述玻璃基板上形成切割划痕。
  8. 根据权利要求7所述的切割装置，其中所述切割刀片组件包括两个相对设置的切割刀片组；其中，每个所述切割刀片组均包括刀座以及与所述刀座连接的刀片。
  9. 根据权利要求8所述的切割装置，其可通过气缸加压作用于所述刀座，以使得所述刀片压至所述柔性材料层中。
  10. 根据权利要求8所述的切割装置，其中所述刀座通过连接部与所述刀片连接，所述连接部可用于调整所述刀片在所述刀座上的位置，以使得两个所述刀片之间的间隔可调；所述连接部还可用于调整所述刀片与所述刀座的角度，以使得所述刀片与所述柔性基板之间的角度可调。
  11. 根据权利要求10所述的切割装置，其中两个所述刀片之间的间隔可设置介于0.5毫米-2毫米之间。
  12. 根据权利要求10所述的切割装置，其中所述刀片与所述柔性基板之间的角度可设置成锐角。
  13. 根据权利要求7所述的切割装置，其中所述剥离装置包括滚轮以及设置在所述滚轮上的传送带，通过滚轮在所述柔性材料层上的滚动，使得所述柔性材料层在所述传送带的带动下与所述玻璃基板剥离。
  14. 根据权利要求13所述的切割装置，其中所述滚轮和所述传送带上均设有粘性材料。
  15. 一种切割方法，其包括：
    将柔性基板置于切割平台上，所述柔性基板包括玻璃基板以及位于所述玻璃基板上的柔性材料层；
    切割所述柔性材料层；
    将切割完成后的所述柔性材料层从所述玻璃基板上剥离；
    在裸露的所述玻璃基板上形成切割划痕。
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