WO2019019234A1 - Cof柔性电路板及触摸显示面板 - Google Patents

Cof柔性电路板及触摸显示面板 Download PDF

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Publication number
WO2019019234A1
WO2019019234A1 PCT/CN2017/098131 CN2017098131W WO2019019234A1 WO 2019019234 A1 WO2019019234 A1 WO 2019019234A1 CN 2017098131 W CN2017098131 W CN 2017098131W WO 2019019234 A1 WO2019019234 A1 WO 2019019234A1
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WO
WIPO (PCT)
Prior art keywords
control chip
area
circuit board
touch
display panel
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PCT/CN2017/098131
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English (en)
French (fr)
Inventor
蔡育徵
张洲
徐盼
马长文
周亚玲
Original Assignee
武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US15/576,636 priority Critical patent/US20190037682A1/en
Publication of WO2019019234A1 publication Critical patent/WO2019019234A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the invention relates to a display panel technology, in particular to a COF flexible circuit board and a touch display panel.
  • the touch and display functions of the smart phone are independently controlled by the touch chip and the display driver chip.
  • the COF (chip on film) of the touch display panel for supporting the product is packaged.
  • TDDI IC touch and display driver integration
  • the biggest feature of TDDI IC is to integrate the touch chip and the display chip into a single chip, along with the fingerprint recognition module in smart products such as smart phones.
  • how to further save the material cost and wiring space of smart products has become a direction of research in the industry.
  • the present invention provides a COF flexible circuit board and a touch display panel, which integrates a fingerprint recognition function into a COF flexible circuit board, thereby saving space and wiring space, and saving cost.
  • the present invention provides a COF flexible circuit board comprising a flexible package substrate and a control chip packaged on the flexible package substrate, wherein the flexible package substrate is provided with an input terminal wiring and an output terminal wiring connected to the control chip, the control chip
  • the invention comprises a display driver for controlling the display panel, a touch controller for implementing the touch function, and a fingerprint recognition controller for implementing fingerprint recognition.
  • control chip further includes an encapsulation layer, and the encapsulation layer encapsulates the display driver, the touch controller, and the fingerprint recognition controller.
  • control chip is provided with a fingerprint sensor connected to the fingerprint recognition controller, and a bracket for fixing the fingerprint sensor is disposed on the surface of the encapsulation layer, and the fingerprint sensor is fixed in the bracket on the surface of the encapsulation layer. A fingerprint identification area is formed.
  • control chip is provided with a fingerprint sensor connected to the fingerprint recognition controller, and the fingerprint sensor is embedded in the encapsulation layer to form a fingerprint identification area on the surface of the encapsulation layer.
  • the encapsulation layer includes a circuit package area and a mosaic area, and the display driver, the touch controller and the fingerprint recognition controller are encapsulated in the circuit package area, and the fingerprint sensor is embedded in the mosaic area.
  • the flexible package substrate includes a non-bending area, a bending area disposed on one side of the non-bending area, and a folding area disposed on a side of the bending area away from the non-bending area.
  • control chip is disposed in the non-bending area.
  • control chip is disposed in the bending zone.
  • control chip is disposed in the fold region.
  • the invention also provides a touch display panel, comprising a display panel and a touch screen, and further comprising the COF flexible circuit board, wherein the flexible package substrate is connected to the display panel and the touch screen.
  • the present invention saves material cost and wiring space by integrally integrating display, touch and fingerprint identification into one control chip.
  • Embodiment 1 is a schematic structural view of Embodiment 1 of the present invention.
  • Figure 2 is a schematic structural view of Embodiment 2 of the present invention.
  • Figure 3 is a schematic illustration of a first mode of connection of the present invention to a touch screen display
  • Figure 4 is a schematic illustration of a second mode of the present invention coupled to a touch screen display
  • Figure 5 is a schematic illustration of a third mode of the present invention coupled to a touch screen display.
  • the COF flexible circuit board of the present invention comprises a flexible package substrate 1 and a control chip 2 packaged on the flexible package substrate 1 , and an input terminal wiring connected to the control chip 2 is disposed on the flexible package substrate 1 .
  • output wiring, the control chip 2 includes being packaged together by the encapsulation layer 6.
  • the display driver 3 for controlling the display panel, the touch controller 4 for implementing the touch function, and the fingerprint recognition controller 5 for implementing fingerprint recognition, the present invention passes the display driver 3, the touch controller 4, and The fingerprint recognition controller 5 is integrated into one chip, so that the COF flexible circuit board integrates the corresponding fingerprint recognition function, thereby saving materials, saving cost, and improving cost performance.
  • the COF flexible circuit board is provided with an input terminal (ILB) and an output terminal (OLB) at both ends, so that the acquisition of the touch signal and the fingerprint signal are sent to the control board of the smart product for processing.
  • ILB input terminal
  • OLB output terminal
  • the COF flexible circuit board in the first embodiment includes a flexible package substrate 1 and a control chip 2 packaged on the flexible package substrate 1 , and an input connected to the control chip 2 is disposed on the flexible package substrate 1 .
  • Terminal wiring and output terminal wiring the control chip 2 includes a display driver 3 for controlling the display panel packaged by the package layer 6, a touch controller 4 for implementing a touch function, and for implementing fingerprint recognition
  • the fingerprint recognition controller 5 is provided with a fingerprint sensor 8 on the surface of the encapsulation layer 6, the fingerprint sensor 8 is disposed on the surface of the encapsulation layer 6 via the bracket 15, and the fingerprint sensor 8 is connected with the fingerprint recognition controller 5, thereby A fingerprint identification area is formed on the encapsulation layer 6.
  • the support 15 can be fixed to the encapsulation layer 6 by means of bonding, and is not specifically limited herein.
  • the fingerprint sensor 8 can also be provided with a cover plate.
  • the cover plate can also be directly replaced by a cover plate for touching the display panel, further saving material cost.
  • the flexible package substrate 1 is provided with a non-bending area 12, a bending area 13 and a folding area 14, wherein the bending area 13 is used for bending the flexible package substrate 1, and the folding area 14 is folded. Then, it is located on the back side (non-viewing surface) of the touch display panel or the back side of the smart product (the side facing away from the touch display panel), thereby realizing the effect of the narrow bezel.
  • the control chip 2 there are three cases in the setting position of the control chip 2. One is that the control chip 2 is disposed in the non-bending region 12 (shown in FIG. 3), the second is that the control chip 2 is disposed in the bending region 13 (shown in FIG. 4), and the third is the control chip 2 It is arranged in the folding area 14 (shown in FIG. 5), and the above three methods can meet the requirements of the conventional setting position of the fingerprint identification of the smart product.
  • An input pin (ILB) and an output pin (OLB) are provided on the non-bending area 12 and the fold area 14.
  • the COF flexible circuit board in Embodiment 2 includes a flexible package substrate 1 and a control chip 2 packaged on the flexible package substrate 1.
  • the flexible package substrate 1 is provided with an input connected to the control chip 2.
  • Terminal wiring and output terminal wiring, the control chip 2 includes a display driver 3 for controlling the display panel packaged by the package layer 6, a touch controller 4 for implementing a touch function, and for implementing fingerprint recognition
  • the fingerprint recognition controller 5 has a fingerprint sensor 8 embedded on the surface of the encapsulation layer 6, and the fingerprint sensor 8 is connected to the fingerprint recognition controller 5, thereby forming a fingerprint recognition area on the encapsulation layer 6.
  • the encapsulation layer 6 includes a circuit package area 10 and a mosaic area 11, the display driver 3, the touch controller 4 and the fingerprint recognition controller 5 are packaged in the circuit package area 10, and the fingerprint sensor 8 is embedded in the mosaic area. 11 to further save material costs.
  • the fingerprint sensor 8 can also be provided with a cover plate.
  • the cover plate can also be directly replaced by a cover plate for touching the display panel, which further saves material cost.
  • the flexible package substrate 1 is provided with a non-bending area 12, a bending area 13 and a folding area 14, wherein the bending area 13 is used for bending the flexible package substrate 1, and the folding area 14 is folded. Then, it is located on the back side (non-viewing surface) of the touch display panel or the back side of the smart product (the side facing away from the touch display panel), thereby realizing the effect of the narrow bezel.
  • the control chip 2 there are three cases in the setting position of the control chip 2. One is that the control chip 2 is disposed in the non-bending region 12 (shown in FIG. 3), the second is that the control chip 2 is disposed in the bending region 13 (shown in FIG. 4), and the third is the control chip 2 It is arranged in the folding area 14 (shown in FIG. 5), and the above three methods can meet the requirements of the conventional setting position of the fingerprint identification of the smart product.
  • An input pin (ILB) and an output pin (OLB) are provided on the non-bending area 12 and the fold area 14.
  • the surface area of the encapsulation layer 6 is adjusted according to the area of the fingerprint identification area, that is, if the fingerprint identification area is disposed on the cover side and the back cover side of the smart product, the fingerprint identification area thereof
  • the area is larger than that of the smart product frame, and is not specifically limited herein.
  • FIG. 3 it is a schematic structural diagram of a first touch display panel according to the present invention.
  • the touch display panel includes a display panel and a touch screen 16 , and further includes the above-mentioned COF flexible circuit board, and the flexible package substrate 1 is disposed through Input pin (ILB) and output pin (OLB) in the bend region 12 Connected to the display panel and the touch screen 16, where the control chip 2 is disposed in the non-bending area 12, and when the second touch display panel is applied to the smart product, the fingerprint recognition area and the touch display panel are disposed on the same side
  • the front cover is covered by the glass cover 18 on the touch display panel and the fingerprint recognition area, thereby realizing the integration of the appearance.
  • the flexible package substrate 1 passes through the input terminal pin (ILB) disposed in the fold-out area 14. And the output terminal (OLB) is connected to the printed circuit board 17 (FPCA) of the smart product to realize signal transmission with the motherboard of the smart product.
  • ILB Input pin
  • OLB output pin
  • FIG. 4 it is a schematic structural diagram of a second touch display panel according to the present invention.
  • the touch display panel includes a display panel and a touch screen 16 , and further includes the above-mentioned COF flexible circuit board, and the flexible package substrate 1 is disposed through
  • the input terminal pin (ILB) and the output terminal pin (OLB) in the bending region 12 are connected to the display panel and the touch screen 16, where the control chip 2 is disposed in the bending region 13, and when the second touch display panel
  • the fingerprint identification area is disposed on the frame 19 of the smart product, and a fingerprint cover 7 is disposed on the frame 19 corresponding to the position of the fingerprint identification area, and the flexible package substrate 1 is disposed in the folding area 14
  • the input pin (ILB) and the output pin (OLB) are connected to the printed circuit board 17 (FPCA) of the smart product to enable signal transmission with the motherboard of the smart product.
  • FPCA printed circuit board 17
  • FIG. 5 is a schematic structural diagram of a third touch display panel according to the present invention.
  • the touch display panel includes a display panel and a touch screen, and further includes the COF flexible circuit board.
  • the flexible package substrate 1 is disposed in a non-bend.
  • the input terminal pin (ILB) and the output terminal pin (OLB) in the folding area 12 are connected to the display panel and the touch screen 16, where the control chip 2 is disposed in the folding area 14, when the third touch display panel is applied.
  • the fingerprint identification area and the touch display panel are disposed on the opposite side, that is, the rear side, and the fingerprint cover panel 7 is disposed at the fingerprint recognition area on the back cover 9 of the smart product, thereby realizing fingerprint recognition.
  • the flexible package substrate 1 is connected to the printed circuit board 17 (FPCA) of the smart product through an input terminal pin (ILB) and an output terminal pin (OLB) provided in the fold region 14 to be implemented with the motherboard of the smart product. Signal transmission.
  • FPCA printed circuit board 17

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种COF柔性电路板，包括柔性封装基板(1)及封装于柔性封装基板(1)上的控制芯片(2)，在柔性封装基板(1)上设置有与控制芯片(2)连接的输入端布线和输出端布线，控制芯片(2)包括通过封装在一起的用于对显示面板进行控制的显示驱动器(3)、用于实现触控功能的触摸控制器(4)及用于实现指纹识别的指纹识别控制器(5)。一种触摸显示面板，包括显示面板及触摸屏(16)，还包括COF柔性电路板，COF柔性电路板与显示面板及触摸屏(16)连接。与现有技术相比，通过将显示、触控以及指纹识别集成封装到一个控制芯片(2)中，节省材料成本以及布线空间。

Description

COF柔性电路板及触摸显示面板 技术领域
本发明涉及一种显示面板技术，特别是一种COF柔性电路板及触摸显示面板。
背景技术
目前，智能手机的触控和显示功能都由触摸芯片和显示驱动芯片两个芯片独立控制，后来为了节省材料，在用于支撑产品的触摸显示面板的COF(chip on film，膜片上芯片封装)柔性电路板上出现了TDDI IC(触控与显示驱动器集成)，而TDDI IC最大的特点是把触控芯片与显示芯片整合进单一芯片中，随着智能手机等智能产品中指纹识别模组成为标配的情况下，如何能够进一步的节省智能产品的材料成本以及布线空间，成为目前行业内研究的一个方向。
发明内容
为克服现有技术的不足，本发明提供一种COF柔性电路板及触摸显示面板，将指纹识别功能集成到COF柔性电路板中，从而节省空间以及布线的空间，节省成本。
本发明提供了一种COF柔性电路板，包括柔性封装基板及封装于柔性封装基板上的控制芯片，在柔性封装基板上设置有与控制芯片连接的输入端布线和输出端布线，所述控制芯片包括封装在一起的用于对显示面板进行控制的显示驱动器、用于实现触控功能的触摸控制器及用于实现指纹识别的指纹识别控制器。
进一步地，所述控制芯片还包括封装层，封装层对显示驱动器、触摸控制器、指纹识别控制器进行封装。
进一步地，所述控制芯片上设有与指纹识别控制器连接的指纹传感器，在封装层的表面上设有用于固定指纹传感器的支架，所述指纹传感器固定于支架中，在封装层的表面上形成指纹识别区。
进一步地，所述控制芯片上设有与指纹识别控制器连接的指纹传感器，所述指纹传感器嵌入封装层中，在封装层的表面上形成指纹识别区。
进一步地，所述封装层包括电路封装区以及镶嵌区，所述显示驱动器、触摸控制器以及指纹识别控制器封装于电路封装区中，指纹传感器嵌入到镶嵌区中。
进一步地，所述柔性封装基板包括非弯折区、设于非弯折区一侧的弯折区以及设于弯折区远离非弯折区一侧的翻折区。
进一步地，所述控制芯片设于非弯折区中。
进一步地，所述控制芯片设于弯折区中。
进一步地，所述控制芯片设于翻折区中。
本发明还提供了一种触摸显示面板，包括显示面板及触摸屏，还包括所述的COF柔性电路板，所述柔性封装基板与显示面板及触摸屏连接。
本发明与现有技术相比，通过将显示、触控以及指纹识别集成封装到一个控制芯片中，节省材料成本以及布线空间。
附图说明
图1是本发明实施例1的结构示意图；
图2是本发明实施例2的结构示意图；
图3是本发明与触摸显示屏连接的第一种方式的示意图；
图4是本发明与触摸显示屏连接的第二种方式的示意图；
图5是本发明与触摸显示屏连接的第三种方式的示意图。
具体实施方式
下面结合附图和实施例对本发明作进一步详细说明。
如图1所示，本发明的COF柔性电路板，包括柔性封装基板1、及封装于柔性封装基板1上的控制芯片2，在柔性封装基板1上设置有与控制芯片2连接的输入端布线和输出端布线，所述控制芯片2包括通过封装层6封装在一起 的用于对显示面板进行控制的显示驱动器3、用于实现触控功能的触摸控制器4及用于实现指纹识别的指纹识别控制器5，本发明通过将显示驱动器3、触摸控制器4以及指纹识别控制器5整合到一个芯片中，从而使COF柔性电路板集成相应的指纹识别功能，从而节省材料，节约成本，提升性价比。
其中COF柔性电路板的两端均设置有输入端引脚(ILB)以及输出端引脚(OLB)，从而对触控信号的获取以及指纹信号并发送至智能产品的控制板进行处理。
如图1所示，实施例1中的COF柔性电路板，包括柔性封装基板1、及封装于柔性封装基板1上的控制芯片2，在柔性封装基板1上设置有与控制芯片2连接的输入端布线和输出端布线，所述控制芯片2包括通过封装层6封装在一起的用于对显示面板进行控制的显示驱动器3、用于实现触控功能的触摸控制器4及用于实现指纹识别的指纹识别控制器5，在封装层6的表面上设有指纹传感器8，所述指纹传感器8通过支架15设于封装层6的表面上，指纹传感器8与指纹识别控制器5连接，从而在封装层6上形成指纹识别区，这里需要注意的是，支架15可通过粘贴的方式与封装层6进行固定，在此不做具体限定。
在实施例1中，指纹传感器8上还可以设置有盖板，当然，盖板也可以直接采用用于触摸显示面板的盖板替代，进一步的节省材料成本。
实施例1中在柔性封装基板1上设置有非弯折区12、弯折区13以及翻折区14，其中，弯折区13用于对柔性封装基板1进行弯折，而翻折区14则是位于触摸显示面板的背面(非观看面)或智能产品的背面(背离触摸显示面板的一侧)，从而实现窄边框的效果，在上述实施例1中控制芯片2的设置位置有三种情况，一种是控制芯片2设于非弯折区12中(图3所示)、第二种是控制芯片2设于弯折区13中(图4所示)、第三种是控制芯片2设于翻折区14中(图5所示)，上述三种方式，可以满足智能产品指纹识别的常规设置位置的需求。
在非弯折区12与翻折区14上均设有输入端引脚(ILB)以及输出端引脚(OLB)。
如图2所示，实施例2中的COF柔性电路板，包括柔性封装基板1、及封装于柔性封装基板1上的控制芯片2，在柔性封装基板1上设置有与控制芯片2连接的输入端布线和输出端布线，所述控制芯片2包括通过封装层6封装在一起的用于对显示面板进行控制的显示驱动器3、用于实现触控功能的触摸控制器4及用于实现指纹识别的指纹识别控制器5，在封装层6的表面上嵌入有指纹传感器8，指纹传感器8与指纹识别控制器5连接，从而在封装层6上形成指纹识别区。
如图2所示，封装层6包括电路封装区10以及镶嵌区11，所述显示驱动器3、触摸控制器4以及指纹识别控制器5封装于电路封装区10中，指纹传感器8嵌入到镶嵌区11中，从而进一步地节省材料成本。
在实施例2中，指纹传感器8上还可以设置有盖板，当然，盖板也可以直接采用用于触摸显示面板的盖板替代，更近进一步的节省材料成本。
实施例2中在柔性封装基板1上设置有非弯折区12、弯折区13以及翻折区14，其中，弯折区13用于对柔性封装基板1进行弯折，而翻折区14则是位于触摸显示面板的背面(非观看面)或智能产品的背面(背离触摸显示面板的一侧)，从而实现窄边框的效果，在上述实施例1中控制芯片2的设置位置有三种情况，一种是控制芯片2设于非弯折区12中(图3所示)、第二种是控制芯片2设于弯折区13中(图4所示)、第三种是控制芯片2设于翻折区14中(图5所示)，上述三种方式，可以满足智能产品指纹识别的常规设置位置的需求。
在非弯折区12与翻折区14上均设有输入端引脚(ILB)以及输出端引脚(OLB)。
在上述两个实施例中，封装层6的表面积根据指纹识别区的面积而相应的进行调整，即，若指纹识别区设置在智能产品的盖板侧以及后盖侧时，其指纹识别区的面积相比设置在智能产品边框时的面积大，在此不作具体限定。
如图3所示，为本发明的第一种触摸显示面板的结构示意图，该触摸显示面板包括显示面板及触摸屏16，还包括上述的COF柔性电路板，所述柔性封装基板1通过设置在非弯折区12中的输入端引脚(ILB)以及输出端引脚(OLB) 与显示面板及触摸屏16连接，此处，控制芯片2设于非弯折区12中，当第二种触摸显示面板应用到智能产品中时，指纹识别区与触摸显示面板设置在相同的一侧，即前置，通过玻璃盖板18盖在触摸显示面板以及指纹识别区上，从而实现了外观上的一体化，柔性封装基板1通过设置在翻折区14中的输入端引脚(ILB)以及输出端引脚(OLB)与智能产品的印刷电路板17(FPCA)连接，实现与智能产品的主板进行信号的传输。
如图4所示，为本发明的第二种触摸显示面板的结构示意图，该触摸显示面板包括显示面板及触摸屏16，还包括上述的COF柔性电路板，所述柔性封装基板1通过设置在非弯折区12中的输入端引脚(ILB)以及输出端引脚(OLB)与显示面板及触摸屏16连接，此处，控制芯片2设于弯折区13中，当第二种触摸显示面板应用到智能产品中时，指纹识别区设置在智能产品的边框19上，在边框19上与指纹识别区位置相对应处设有指纹盖板7，柔性封装基板1通过设置在翻折区14中的输入端引脚(ILB)以及输出端引脚(OLB)与智能产品的印刷电路板17(FPCA)连接，实现与智能产品的主板进行信号的传输。
如图5所示，为本发明的第三种触摸显示面板的结构示意图，该触摸显示面板包括显示面板及触摸屏，还包括上述的COF柔性电路板，所述柔性封装基板1通过设置在非弯折区12中的输入端引脚(ILB)以及输出端引脚(OLB)与显示面板及触摸屏16连接，此处，控制芯片2设于翻折区14中，当第三种触摸显示面板应用到智能产品中时，指纹识别区与触摸显示面板设置在相反的一侧，即后置，通过在智能产品的后盖9上位于指纹识别区处设置指纹盖板7，从而实现了指纹识别的功能，柔性封装基板1通过设置在翻折区14中的输入端引脚(ILB)以及输出端引脚(OLB)与智能产品的印刷电路板17(FPCA)连接，实现与智能产品的主板进行信号的传输。
通过上述三种设置方式，实现了智能产品的窄边框，提升产品显示屏占比。
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。

Claims (18)

  1. 一种COF柔性电路板，其中：包括柔性封装基板及封装于柔性封装基板上的控制芯片，在柔性封装基板上设置有与控制芯片连接的输入端布线和输出端布线，所述控制芯片包括封装在一起的用于对显示面板进行控制的显示驱动器、用于实现触控功能的触摸控制器及用于实现指纹识别的指纹识别控制器。
  2. 根据权利要求1所述的COF柔性电路板，其中：所述控制芯片还包括封装层，封装层对显示驱动器、触摸控制器、指纹识别控制器进行封装。
  3. 根据权利要求2所述的COF柔性电路板，其中：所述控制芯片上设有与指纹识别控制器连接的指纹传感器，在封装层的表面上设有用于固定指纹传感器的支架，所述指纹传感器固定于支架中，在封装层的表面上形成指纹识别区。
  4. 根据权利要求2所述的COF柔性电路板，其中：所述控制芯片上设有与指纹识别控制器连接的指纹传感器，所述指纹传感器嵌入封装层中，在封装层的表面上形成指纹识别区。
  5. 根据权利要求4所述的COF柔性电路板，其中：所述封装层包括电路封装区以及镶嵌区，所述显示驱动器、触摸控制器以及指纹识别控制器封装于电路封装区中，指纹传感器嵌入到镶嵌区中。
  6. 根据权利要求1所述的COF柔性电路板，其中：所述柔性封装基板包括非弯折区、设于非弯折区一侧的弯折区以及设于弯折区远离非弯折区一侧的翻折区。
  7. 根据权利要求6所述的COF柔性电路板，其中：所述控制芯片设于非弯折区中。
  8. 根据权利要求6所述的COF柔性电路板，其中：所述控制芯片设于弯折区中。
  9. 根据权利要求6所述的COF柔性电路板，其其中：所述控制芯片设于 翻折区中。
  10. 一种触摸显示面板，包括显示面板及触摸屏，其中，还包括COF柔性电路板，所述柔性封装基板与显示面板及触摸屏连接；所述COF柔性电路板包括柔性封装基板及封装于柔性封装基板上的控制芯片，在柔性封装基板上设置有与控制芯片连接的输入端布线和输出端布线，所述控制芯片包括封装在一起的用于对显示面板进行控制的显示驱动器、用于实现触控功能的触摸控制器及用于实现指纹识别的指纹识别控制器。
  11. 根据权利要求10所述的触摸显示面板，其中：所述控制芯片还包括封装层，封装层对显示驱动器、触摸控制器、指纹识别控制器进行封装。
  12. 根据权利要求11所述的触摸显示面板，其中：所述控制芯片上设有与指纹识别控制器连接的指纹传感器，在封装层的表面上设有用于固定指纹传感器的支架，所述指纹传感器固定于支架中，在封装层的表面上形成指纹识别区。
  13. 根据权利要求11所述的触摸显示面板，其中：所述控制芯片上设有与指纹识别控制器连接的指纹传感器，所述指纹传感器嵌入封装层中，在封装层的表面上形成指纹识别区。
  14. 根据权利要求13所述的触摸显示面板，其中：所述封装层包括电路封装区以及镶嵌区，所述显示驱动器、触摸控制器以及指纹识别控制器封装于电路封装区中，指纹传感器嵌入到镶嵌区中。
  15. 根据权利要求10所述的触摸显示面板，其中：所述柔性封装基板包括非弯折区、设于非弯折区一侧的弯折区以及设于弯折区远离非弯折区一侧的翻折区(14)。
  16. 根据权利要求15所述的COF柔性电路板，其中：所述控制芯片设于非弯折区中。
  17. 根据权利要求15所述的COF柔性电路板，其中：所述控制芯片设于弯折区中。
  18. 根据权利要求15所述的COF柔性电路板，其中：所述控制芯片设于翻折区中。
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