WO2017202148A1 - 压力触控模组、压力检测方法、驱动方法及显示装置 - Google Patents

压力触控模组、压力检测方法、驱动方法及显示装置 Download PDF

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Publication number
WO2017202148A1
WO2017202148A1 PCT/CN2017/079929 CN2017079929W WO2017202148A1 WO 2017202148 A1 WO2017202148 A1 WO 2017202148A1 CN 2017079929 W CN2017079929 W CN 2017079929W WO 2017202148 A1 WO2017202148 A1 WO 2017202148A1
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Prior art keywords
pressure
touch module
pressure sensor
substrate
disposed
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PCT/CN2017/079929
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English (en)
French (fr)
Inventor
杨清
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京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Priority to US15/573,437 priority Critical patent/US10372254B2/en
Publication of WO2017202148A1 publication Critical patent/WO2017202148A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0447—Position sensing using the local deformation of sensor cells
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position

Definitions

  • the present disclosure relates to the field of pressure touch technology, and in particular, to a pressure touch module, a pressure detecting method, a driving method, and a display device.
  • 3D touch by increasing the detection of the pressure, more touch functions are realized, and at the same time, pressure feedback of different levels is output through the judgment of the magnitude of the pressure, thereby bringing a better touch experience to the consumer. It is expected that 3D touch (Force Touch) will be used more and more on consumer electronics.
  • the structure of the conventional touch display module shown in FIG. 1 includes: an upper polarizer, a touch module Tx (Rx) ITO layer 2, a color film substrate 3, and a touch mode.
  • the conventional pressure sensor 10 the sensor carrier 11 and the shield layer 12 are disposed on the side of the lower polarizer 9 facing away from the substrate.
  • the present disclosure provides a pressure touch module, a pressure detecting method, a driving method, and a display device, which can integrate a touch module and a pressure on the same substrate.
  • the two functional layers of the force sensor make the thickness of the pressure touch module thinner, the product integration has higher physical strength, and the process flow is saved, and the sensing capacitor based on the pressure sensor and the back plate can detect the touch. Control the size of the pressure.
  • the present disclosure provides a pressure touch module, including: a substrate, a touch module and a pressure sensor disposed on the substrate, and a backboard, wherein:
  • the touch module is disposed on a first side of the substrate
  • the pressure sensor is disposed on the second side of the substrate facing away from the touch module, and is in contact with the substrate;
  • the backing plate is disposed on a side of the pressure sensor facing away from the substrate, and maintains a certain gap with the pressure sensor.
  • the pressure touch module further includes: a backlight unit;
  • the backlight unit is disposed on a side of the pressure sensor facing away from the substrate and between the pressure sensor and the backboard, and the backlight unit maintains a certain gap with the pressure sensor.
  • the pressure sensor is a self-capacitance sensing block array.
  • the pressure touch module further includes: a display switching device disposed on the first side of the substrate.
  • the pressure touch module further includes: a driving chip;
  • the driving chip is disposed on the first side of the substrate, and is disposed on the non-display area of the pressure touch module;
  • the driving chip is electrically connected to the display switching device, the touch module and the pressure sensor, and drives the switching device, the touch module and the pressure sensor in a time-sharing manner.
  • the pressure touch module further includes: a flexible circuit board FPC for connection and a main control FPC;
  • connection FPC is connected to the lead line of the pressure sensor, and is connected to the main control FPC;
  • the master FPC is connected to the driving chip for guiding the pressure sensor
  • the outgoing line is connected to a pin corresponding to the driving chip.
  • the pressure touch module further includes: an FPC for connection;
  • connection FPC is connected to the lead line of the pressure sensor, and is connected to the binding area of the substrate, and is used for connecting the lead line of the pressure sensor to the driving chip through the binding area of the substrate. Corresponding pins.
  • the present disclosure provides a touch pressure detecting method based on any of the above pressure touch modules, the method comprising:
  • the pressure sensor In the pressure detection phase, the pressure sensor is loaded with a pressure detection signal
  • the magnitude of the touch pressure is obtained according to the capacitance change of the capacitor.
  • the present disclosure provides a driving method of any one of the above pressure touch modules, the method comprising:
  • the first preset time period, the second preset time period, and the third preset time period do not coincide.
  • the first preset time period is within a display time of the LCD
  • the second preset time period and the third preset time period are within a display interval time of the LCD.
  • the disclosure provides a display device, including: any one of the above pressure touch modules.
  • the present disclosure provides a pressure touch module, a pressure detecting method, a driving method, and a display device.
  • the pressure touch module includes: a substrate, a touch module disposed on the substrate, and a pressure Sensor, and backplane.
  • a touch sensor is disposed on one side of the substrate, and a force sensor is disposed in contact with the other side of the same substrate.
  • the touch module and the pressure sensor are simultaneously integrated on the same substrate, which saves the force sensor to produce the required carrier material (Glass or PET).
  • the thickness of the pressure touch module is reduced, the product integration has higher physical strength, and the process flow is saved; and, based on the structure of the pressure touch module, the pressure sensor and the back plate can be used as pressure
  • the two plates of the sensing capacitor are in the pressure detecting phase, and the touch pressure acts to change the distance between the pressure sensor and the backing plate, thereby causing the capacitance of the pressure sensor and the backing plate to change, thereby detecting the pressure sensor and the back.
  • the value of the touch pressure can be obtained by changing the capacitance of the inter-board capacitor.
  • FIG. 1 is a schematic structural view of a pressure touch module in the prior art
  • FIG. 2 is a schematic cross-sectional structural view of a pressure touch module according to an embodiment of the present disclosure
  • FIG. 3 is a schematic top plan view of a pressure touch module according to another embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of a self-capacitance sensing block array according to another embodiment of the present disclosure.
  • FIG. 5 is a schematic flow chart of a touch pressure detecting method according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of a time-division driving scan signal according to another embodiment of the present disclosure.
  • the markings in Figures 1 to 3 illustrate: 1-upper polarizer; 2-touch module Tx (Rx) ITO layer; 3-color film substrate; 4-touch module Rx (Tx) ITO layer; 5-touch Driver IC; 6-touch FPC; 7-LCD array substrate; 8-LCD driver IC; 9-low polarizer; 10-pressure sensor; 11-sensor carrier; 12-shield; 13-pressure sensor driver IC; - pressure sensor FPC; 15- liquid crystal layer; 200-display area; 201-upper polarizer; 202-color film base Board; 203-touch module; 204-substrate; 205-pressure sensor; 206-lower polarizer; 207-drive chip; 208-master FPC; 209-connected FPC; 210-backplane; Connector; 212-liquid crystal layer; 401-pressure sensing block.
  • the pressure touch module includes a substrate 204 and a touch module disposed on the substrate 204 .
  • the touch module 203 is disposed on the first side of the substrate 204.
  • the pressure sensor 205 is disposed on the second side of the substrate 204 facing away from the touch module 203 and is in contact with the substrate 204.
  • the back plate 210 is disposed on a side of the pressure sensor 205 facing away from the substrate 204 and maintains a certain gap with the pressure sensor.
  • the touch module 203 is disposed on the first side of the substrate 204, and the specific arrangement manner is the same as the prior art.
  • the touch sensor may specifically include two ITO layers as touch electrodes and sensing electrodes of the touch module, wherein the plurality of sensing electrodes and the plurality of touch electrodes are crossed and insulated. .
  • the pressure touch module in this embodiment includes: a substrate, a touch module and a pressure sensor disposed on the substrate, and a back plate. That is, the touch module 203 is disposed on one side of the substrate 204, and the pressure sensor 205 is disposed on the other side of the same substrate 204. Thus, the touch module 203 is integrated on the same substrate 204 in this embodiment.
  • the functional layer such as the pressure sensor 205 can save the pressure sensor to produce the required carrier material (Glass or PET), so that the thickness of the pressure touch module is thinned and the product is made one.
  • the physical strength has higher physical strength and saves the process flow.
  • the pressure sensor and the back plate can be used as two plates of the pressure sensing capacitor, and in the pressure detecting phase,
  • the touch pressure changes the distance between the pressure sensor and the back plate, which causes the capacitance of the pressure sensor and the back plate to change, so that the touch pressure can be obtained by detecting the capacitance change of the capacitance between the pressure sensor and the back plate. the size of.
  • the pressure touch module further includes: a backlight unit.
  • the backlight unit is disposed on a side of the pressure sensor facing away from the substrate and between the back plate and the pressure sensor, and the backlight unit maintains a certain gap with the pressure sensor 205.
  • the pressure sensor described in the above embodiments may be a self-capacitance sensing block array.
  • the self-capacitance sensing block array is formed by a plurality of arrays of pressure sensing blocks 401, each of which serves as a plate for deforming the pressure sensor when an external force acts.
  • the gap between the pressure sensing block and the backlight unit BLU (Back Light Unit) is changed, so that the electric field changes, so that the pressure sensing block detects the self-contained value change. It can be seen that the self-capacitance sensing block array can sensitively sense the change in the capacitance caused by the pressure deformation.
  • the pressure touch module further includes: a display switching device disposed on a first side of the substrate. That is, a display switching device, such as a thin film transistor, is disposed on a side of the substrate on which the touch module is disposed, for controlling the pressure touch module to perform display.
  • a display switching device such as a thin film transistor
  • a display switching device In this embodiment, three functional layers of a display switching device, a touch sensor, and a pressure sensor are integrated on the same substrate, so that the integration of the pressure touch module is higher. Conducive to thickness reduction, product integration has higher physical strength, and saves process.
  • the pressure touch module further includes: a driving chip 207.
  • the driving chip 207 is disposed on the first side of the substrate 204 (ie, the side on which the touch module 203 is disposed), and is disposed on the non-display area of the pressure touch module.
  • the driving chip 207 is electrically connected to the display switching device (not shown in FIG. 2), the touch module 203, and the pressure sensor 205, and the driving chip 207 uses time sharing.
  • the driving scan algorithm drives the display switching device, the touch module 203, and the pressure sensor 205.
  • the driving chip 207 in the embodiment can drive the display switching device, the touch module 203 and the pressure sensor 205 to work respectively, that is, the driving chip 207 simultaneously realizes the display driving, the touch module and the pressure sensor scanning.
  • this embodiment uses a time-division driving method, so that one driver chip can drive three layers to work independently and work in a time-sharing manner, without the need for LCD driver IC, pressure sensor Driver IC and touch module driver as in the prior art.
  • the ICs are separately disposed.
  • the embodiment can further simplify the thickness and product structure of the pressure touch module, save the manufacturing process, and thereby improve the efficiency.
  • FIG. 2 is a cross-sectional view of a pressure touch module in the embodiment
  • FIG. 3 is the pressure shown in FIG. A schematic view of a partial structure of the touch module.
  • the pressure touch module includes a flexible circuit board FPC 209 and a main control FPC 208 in addition to the components in the above embodiments.
  • connection FPC 209 is connected to the lead line of the pressure sensor 205 and is connected to the main control FPC 208.
  • the master FPC 208 is connected to the driving chip 207 for connecting the lead line of the pressure sensor 205 to the corresponding pin of the driving chip 207.
  • connection flexible circuit board FPC 209 and the main control FPC 208 are disposed in the non-display area of the pressure touch module. Specifically, as shown in FIG. 3, the connection FPC 209 and the master FPC 208 are connected by a plug connector 211.
  • the lead line of the pressure sensor 205 is bound by Bonding a FPC 209 for connection, and then connecting the FPC 209 to the main control FPC 208, the main control FPC 208 connects the lead wires to the corresponding pins (PIN) of the driving chip 207, thus, the pressure sensor
  • the driving chip 205 and the driving chip 207 are connected by the connection FPC 209 and the main control FPC 208, thereby realizing drive control of the pressure sensor 205 by the driving chip 207.
  • the pressure touch module further includes: an FPC for connection.
  • connection FPC is connected to the lead line of the pressure sensor, and is connected to a binding area of the substrate, and is used for connecting the lead line of the pressure sensor to the bonding area of the substrate to the Drive the corresponding pin of the chip.
  • the lead wire of the pressure sensor is bonded by bonding a FPC for connection, and the connecting FPC is bent and bonded to the substrate to be provided with a binding area on the side of the touch module, and then through the substrate.
  • the binding area connects the lead line of the pressure sensor to the pin corresponding to the driving chip.
  • the pressure sensor is connected to the driving chip through a connection FPC to implement driving control of the pressure sensor by the driving chip.
  • the pressure touch module further includes: a color film substrate 202, a liquid crystal layer 212, an upper polarizer 201, and a lower polarizer 206.
  • the liquid crystal layer 212 is disposed on a side of the touch module 203 facing away from the substrate 204, and the color film substrate 202 is disposed on a side of the liquid crystal layer 212 facing away from the touch module 203.
  • the upper polarizer 201 is disposed on a side of the color filter substrate 202 facing away from the liquid crystal layer 212, and the lower polarizer 206 is disposed on a side of the pressure sensor 205 facing away from the substrate 204.
  • the lower polarizer 206 in this embodiment is disposed between the pressure sensor 205 and the back plate 210 for supporting the gap between the pressure sensor 205 and the back plate 210, and the lower polarizer 206 is used as a capacitor. An insulating layer between the two electrodes.
  • the display switch is integrated on the same substrate in this embodiment.
  • Piece, Touch Sensor, Force Sensor three functional layers.
  • three layers of independent work can be realized by one driving chip. Therefore, the pressure of the pressure touch is determined by detecting a change in the gap between the pressure sensor and the back plate, and the deformation of the external force causes the value of the gap to change, thereby detecting the pressure sensor (Force Sensor).
  • the backplane constitutes a capacitance change of the capacitance, thereby obtaining the touch pressure according to the change of the capacitance value.
  • FIG. 5 is a touch pressure detecting method for a pressure touch module according to any one of the embodiments of the present invention. As shown in FIG. 5, the method includes the following steps:
  • the external force causes the gap between the pressure sensor 205 and the back plate 210 to change, that is, the distance change, further causing the pressure sensor 205 to detect a change in capacitance, thereby
  • the pressure data is calculated based on the detected change in capacitance value to determine the pressure used for the touch.
  • the pressure sensor is a self-capacitance sensing block array
  • the self-capacitance sensing block array is formed by a plurality of arrays of pressure sensing blocks, and when the pressure sensor is deformed when an external force acts, the pressure sensing block is made The electric field between the two changes, causing the pressure sensing block to detect a change in capacitance. Further, the magnitude of the touch pressure can be obtained according to the change in the capacitance value.
  • Another embodiment of the present disclosure provides a driving method of a pressure touch module according to any of the above embodiments, the method comprising the following steps:
  • the display switching device is driven to operate during the first preset time period; the touch module is driven to operate during the second preset time period; and the pressure sensor is driven to operate during the third predetermined time period.
  • the first preset time period, the second preset time period, and the third preset time period do not overlap, so that the display switching device, the touch module, and the driving method are driven by the driving method.
  • the pressure sensor works independently and works in a time-sharing manner.
  • the algorithm for the time-division driven scan includes:
  • the display switching device (such as a thin film transistor) is driven to operate during a display time of the LCD during one frame of scanning the LCD;
  • the touch module and the pressure sensor are driven to operate during the display interval of the LCD.
  • the time-division driving scan signal VS is a frame synchronization signal
  • TE is an enable signal
  • the touch scan signal is a scan signal for driving the touch module
  • the force scan signal is a scan signal for driving the pressure sensor.
  • the interval between the rising edge of the frame synchronization signal VS and the falling edge of the enable signal TE is VBP
  • the interval from the rising edge of the enable signal TE to the falling edge of the frame synchronization signal VS is VFP
  • the frame synchronization signal VS is low.
  • the flat (non-active level) duration is called VSW.
  • the thin film transistor is driven during the display time of the LCD (TE is low) during a vertical time of scanning the LCD. During the display interval of the LCD (when the TE is at a high level), the touch module and the pressure sensor are driven to operate.
  • the LCD Display+Touch scan+Force scan is performed within one frame of the LCD, and the Touch scan and the Force scan are performed at the LCD blanking time.
  • the touch sensor is equivalent to the shielding layer (Shielding layer), which can shield the noise, and the pressure sensor (Force Sensor) detects the direction of the gap downward, that is, The gap change between the film and the backlight unit is detected.
  • the order of the Force scan and the Touch scan may be first and foremost in the frame of the LCD. This embodiment does not limit this.
  • an embodiment of the present disclosure provides a display device, including: any one of the above pressure touch modules.
  • the display device can be any product or component having a display and touch pressure sensing function, such as a liquid crystal display panel, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator, and the like.
  • the display device includes the above The display device of any pressure touch module can solve the same technical problem and achieve the same technical effect.
  • the orientation or positional relationship of the terms “upper”, “lower” and the like is based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present disclosure and simplified description. It is not intended to be a limitation or limitation of the invention.
  • the terms “mounted,” “connected,” and “connected” are used in a broad sense, and may be, for example, a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be directly connected, or it can be connected indirectly through an intermediate medium, which can be the internal connection of two components.
  • the specific meanings of the above terms in the present disclosure can be understood by those skilled in the art on a case-by-case basis.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Position Input By Displaying (AREA)

Abstract

一种压力触控模组、压力检测方法、驱动方法及显示装置，压力触控模组包括：基板（204）、设置于基板（204）上的触控模组（203）及压力传感器（205）、以及背板（210）；触控模组（203）设置于基板（204）的第一侧，压力传感器（205）设置于基板（204）背离触控模组（203）的第二侧，且与基板（204）相接触；背板（210）设置于压力传感器（205）背离基板（204）的一侧，且与压力传感器（205）保持一定间隙。在同一个基板（204）上集成触控模组（203）及压力传感器（205）等功能层，节省了压力传感器（205）制作所需载材，使得该压力触控模组的厚度减薄、使产品一体化拥有更高的物理强度，而且节省了工艺流程，而且基于压力传感器（205）与背板（210）组成的感应电容能够检测触控压力的大小。

Description

压力触控模组、压力检测方法、驱动方法及显示装置 技术领域
本公开涉及压力触控技术领域，尤其涉及一种压力触控模组、压力检测方法、驱动方法及显示装置。
背景技术
当前，3D触控技术中通过增加压力大小的检测，实现更多的触控功能，同时通过压力的大小的判断，输出不同层次的压力反馈，给消费者带来更好的触控体验。可以预判3D触控(Force Touch)在消费电子上的应用会越来越多。
现有技术中，如图1所示的现有触控显示模组结构示意图，该显示模组包括：上偏光片1、触摸模组Tx(Rx)ITO层2、彩膜基板3、触摸模组Rx(Tx)ITO层4、触摸driver IC5、触摸FPC6、LCD阵列基板7、LCD driver IC 8、下偏光片9、压力传感器10、传感器载材11、屏蔽层12、压力传感器驱动IC 13、压力传感器FPC 14及液晶层15。则由图1可知，现有的压力传感器10、传感器载材11和屏蔽层12设置在下偏光片9背离基板的一侧。
由此可见，为了实现触控功能，需增加额外的压力传感器(Force sensor)及其驱动芯片(Driver IC)和外围电路，除增加成本之外，还带来厚度的增加，这是与消费者意愿相违背的。其触摸传感器与压力传感器分开设计的方式也使得组装及制程更为复杂。
发明内容
针对现有技术的缺陷，本公开提供一种压力触控模组、压力检测方法、驱动方法及显示装置，能够在同一个基板上集成触控模组及压 力传感器两个功能层，使得该压力触控模组的厚度减薄、使产品一体化拥有更高的物理强度，而且节省了工艺流程，而且基于压力传感器与背板组成的感应电容能够检测触控压力的大小。
第一方面，本公开提供了一种压力触控模组，包括：基板、设置于所述基板上的触控模组及压力传感器、以及背板，其中：
所述触控模组设置于所述基板的第一侧；
所述压力传感器设置于所述基板背离所述触控模组的第二侧，且与所述基板相接触；
所述背板设置于所述压力传感器背离所述基板的一侧，且与所述压力传感器保持一定间隙。
优选地，所述压力触控模组还包括：背光单元；
所述背光单元设置于所述压力传感器背离所述基板的一侧且位于所述压力传感器与所述背板之间，所述背光单元与所述压力传感器保持一定间隙。
优选地，所述压力传感器为自容感测块阵列。
优选地，所述压力触控模组还包括：设置于所述基板的第一侧的显示开关器件。
优选地，所述压力触控模组还包括：驱动芯片；
所述驱动芯片设置于所述基板的第一侧，且设置于所述压力触控模组的非显示区域；
所述驱动芯片与所述显示开关器件、所述触控模组及所述压力传感器均电连接，且分时驱动所述开关器件、所述触控模组及所述压力传感器。
优选地，所述压力触控模组还包括：连接用柔性电路板FPC及主控FPC；
所述连接用FPC与所述压力传感器的引出线连接，且与所述主控FPC连接；
所述主控FPC与所述驱动芯片连接，用于将所述压力传感器的引 出线连接至所述驱动芯片对应的管脚。
优选地，所述压力触控模组还包括：连接用FPC；
所述连接用FPC与所述压力传感器的引出线连接，且与所述基板的绑定区域连接，用于将所述压力传感器的引出线通过所述基板的绑定区域连接至所述驱动芯片对应的管脚。
第二方面，本公开提供了一种基于上述任意一种压力触控模组的触控压力检测方法，所述方法包括：
在压力检测阶段，向压力传感器加载压力检测信号；
检测所述压力传感器与所述背板形成的电容的容值变化；
根据所述电容的容值变化，获得触控压力的大小。
第三方面，本公开提供了一种上述任意一种压力触控模组的驱动方法，所述方法包括：
在第一预设时间段，驱动显示开关器件工作；
在第二预设时间段，驱动触控模组工作；
在第三预设时间段，驱动压力传感器工作；
其中，所述第一预设时间段、所述第二预设时间段及所述第三预设时间段不重合。
优选地，所述第一预设时间段在LCD的显示时间内；
所述第二预设时间段和所述第三预设时间段在所述LCD的显示间隔时间内。
第四方面，本公开提供了一种显示装置，包括：上述任意一种压力触控模组。
由上述技术方案可知，本公开提供一种压力触控模组、压力检测方法、驱动方法及显示装置，该压力触控模组包括：基板、设置于所述基板上的触控模组及压力传感器、以及背板。通过在基板的一侧设置触控模组，并在同一基板的另一侧接触设置了压力传感器(force sensor)。如此，在同一个基板上同时集成了触控模组及压力传感器，节省了压力传感器(force sensor)制作所需载材(Glass或者PET)， 使得该压力触控模组的厚度减薄、使产品一体化拥有更高的物理强度，而且节省了工艺流程；而且，基于压力触控模组的此种结构，压力传感器和背板可作为压力感应电容的两个极板，则在压力检测阶段，触控压力作用使得压力传感器和背板间的距离变化从而导致压力传感器与背板形成电容的容值发生变化，从而通过检测压力传感器和背板间电容的容值变化，即可获得触控压力的大小。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些图获得其他的附图。
图1是现有技术中压力触控模组的结构示意图；
图2是本公开一实施例提供的一种压力触控模组的剖面结构示意图；
图3是本公开另一实施例提供的一种压力触控模组的俯视结构示意图；
图4是本公开另一实施例提供的一种自容感测块阵列的示意图；
图5是本公开一实施例提供的一种触控压力检测方法的流程示意图；
图6是本公开另一实施例提供的分时驱动扫描信号的示意图；
图1～图3中的标记说明：1-上偏光片；2-触控模组Tx(Rx)ITO层；3-彩膜基板；4-触摸模组Rx(Tx)ITO层；5-触摸driver IC；6-触摸FPC；7-LCD阵列基板；8-LCD driver IC；9-下偏光片；10-压力传感器；11-传感器载材；12-屏蔽层；13-压力传感器驱动IC；14-压力传感器FPC；15-液晶层；200-显示区域；201-上偏光片；202-彩膜基 板；203-触控模组；204-基板；205-压力传感器；206-下偏光片；207-驱动芯片；208-主控FPC；209-连接用FPC；210-背板；211-插接连接器；212-液晶层；401-压力感测块。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
图2是本公开一实施例提供的一种压力触控模组的结构示意图，如图2所示，该压力触控模组包括：基板204、设置于所述基板204上的触控模组203及压力传感器205(force sensor)、以及背板210。
所述触控模组203设置于所述基板204的第一侧；所述压力传感器205设置于所述基板204背离所述触控模组203的第二侧，且与所述基板204相接触；所述背板210设置于所述压力传感器205背离所述基板204的一侧，且与所述压力传感器保持一定间隙。
需要说明的是，本实施例中触控模组203设置在基板204的第一侧，具体设置方式可与现有技术相同。举例来说，触控模组(touch sensor)可具体包括两层ITO层，分别作为触控模组的触控电极和感应电极，其中，多条感应电极和多条触控电极交叉且绝缘设置。
由此可见，本实施例中的压力触控模组包括：基板、设置于所述基板上的触控模组及压力传感器、以及背板。即通过在基板204的一侧设置触控模组203，并在同一基板204的另一侧接触设置了压力传感器205，如此，本实施例在同一个基板204上集成了触控模组203及压力传感器205等功能层，能够节省压力传感器(force sensor)制作所需载材(Glass或者PET)，使得该压力触控模组的厚度减薄、使产品一 体化拥有更高的物理强度，而且节省了工艺流程；而且，基于压力触控模组的此种结构，压力传感器和背板可作为压力感应电容的两个极板，则在压力检测阶段，触控压力作用使得压力传感器和背板间的距离变化从而导致压力传感器与背板形成电容的容值发生变化，从而通过检测压力传感器和背板间电容的容值变化，即可获得触控压力的大小。
进一步地，在本公开的一个可选实施例中，所述压力触控模组还包括：背光单元。
其中，所述背光单元设置于所述压力传感器背离所述基板的一侧且位于所述背板与所述压力传感器之间，而且所述背光单元与所述压力传感器205保持一定间隙。
相应地，上述实施例中所述的压力传感器可为自容感测块阵列。
具体来说，如图4所示，自容感测块阵列由多个阵列排布的压力感测块401形成，每个压力感测块作为一个极板，当外力作用时使得压力传感器发生形变时，压力感测块与背光单元BLU(Back Light Unit)膜材之间的间隙发生变化，从而电场发生变化，从而使得压力感测块侦测到自容值变化。由此可见，自容感测块阵列能够灵敏地感测压力产生形变导致的容值变化。
在本公开的一个可选实施例中，所述压力触控模组还包括：设置于所述基板的第一侧的显示开关器件。即在基板设置有触控模组的一侧还设置有显示开关器件，例如薄膜晶体管，用于控制该压力触控模组进行显示。
如此，本实施例中在同一基板上集成了显示开关器件、触控模组(Touch Sensor)、压力传感器(Force Sensor)三个功能层，使得该压力触控模组的集成度更高，有利于厚度减薄、使产品一体化拥有更高的物理强度，而且节省了工艺流程。
进一步地，在本公开的一个可选实施例中，如图2所示，所述压力触控模组还包括：驱动芯片207。
具体来说，所述驱动芯片207设置于所述基板204的第一侧(即设置有触控模组203的一侧)，且设置于所述压力触控模组的非显示区域。
进一步地，所述驱动芯片207与所述显示开关器件(在图2中未示出)、所述触控模组203及所述压力传感器205均电连接，且所述驱动芯片207运用分时驱动扫描的算法驱动所述显示开关器件、所述触控模组203及所述压力传感器205。
由此可见，本实施例中的驱动芯片207能够驱动显示开关器件、触控模组203及压力传感器205分别工作，即该驱动芯片207同时实现了显示驱动、触控模组及压力传感器扫描的功能，本实施例通过分时驱动的方法，使得一个驱动芯片即可驱动三个层独立工作且分时工作，无需如现有技术中将LCD driver IC、压力传感器Driver IC及触控模组driver IC分开设置，如此，本实施例能够使得压力触控模组的厚和产品结构进一步简化，节省制作工艺，从而提高效益。
进一步地，在本公开的一个可选实施例中，如图2和图3所示，图2是本实施例中一种压力触控模组的剖面示意图，图3是图2所示的压力触控模组的俯视局部结构示意图。参见图2，该压力触控模组除了包括上述实施例中的各组成结构，还包括：连接用柔性电路板FPC209及主控FPC 208。
其中，所述连接用FPC 209与所述压力传感器205的引出线连接，且与所述主控FPC 208连接。
而所述主控FPC 208与所述驱动芯片207连接，用于将所述压力传感器205的引出线连接至所述驱动芯片207对应的管脚。
需要说明的是，如图3示出的显示区域200，连接用柔性电路板FPC 209及主控FPC 208设置于压力触控模组的非显示区域。具体地，如图3所示，连接用FPC 209与主控FPC 208通过插接连接器211连接。
由此可见，本实施例中将压力传感器205的引出线通过绑定 (bonding)一个连接用FPC 209，然后连接用FPC 209弯折后连接至主控FPC 208，主控FPC 208将这些引出线接至驱动芯片207对应的管脚(PIN)，如此，将压力传感器205和驱动芯片207通过连接用FPC 209和主控FPC 208连接起来，从而实现驱动芯片207对压力传感器205的驱动控制。
可选地，在本公开的另一个实施例中，所述压力触控模组还包括：连接用FPC。
其中，所述连接用FPC与所述压力传感器的引出线连接，且与所述基板的绑定区域连接，用于将所述压力传感器的引出线通过所述基板的绑定区域连接至所述驱动芯片对应的管脚。
本实施例中，由将压力传感器的引出线通过绑定(bonding)一个连接用FPC，且连接用FPC弯折后bonding至基板设置有触控模组一侧的绑定区域，进而通过基板的绑定区域将压力传感器的引出线与驱动芯片对应的管脚连接，如此，本实施例通过一个连接用FPC将压力传感器与驱动芯片连接起来，以实现驱动芯片对压力传感器的驱动控制。
进一步地，如图2所示，除了上述实施例中的各组成结构，所述压力触控模组还包括：彩膜基板202、液晶层212、上偏光片201及下偏光片206。
具体地，所述液晶层212设置于所述触控模组203背离所述基板204的一侧，所述彩膜基板202设置于所述液晶层212背离所述触控模组203的一侧；所述上偏光片201设置于所述彩膜基板202背离所述液晶层212的一侧，所述下偏光片206设置于所述压力传感器205背离所述基板204的一侧。
需要说明的是，本实施例中的下偏光片206设置于压力传感器205与背板210之间，用于支撑压力传感器205与背板210之间的间隙，并将下偏光片206作为电容的两个电极之间的绝缘层。
与现有技术相比，本实施例中的在同一基板上集成了显示开关器 件，触控模组(Touch Sensor)，压力传感器(Force Sensor)三个功能层。且通过分时驱动的形式，通过一个驱动芯片能够实现三个层的独立工作。从而，通过检测压力传感器(Force Sensor)与背板之间的间隙变化来判断压力触控的压力大小，具体因外力产生的形变使得该间隙的数值发生变化，从而检测到压力传感器(Force Sensor)和背板组成电容的容值变化，从而根据容值变化获得触控压力的大小。
图5是本公开一实施例中的一种基于上述任一实施例提供的压力触控模组的触控压力检测方法，如图5所示，该方法包括如步骤：
S1：在压力检测阶段，向压力传感器加载压力检测信号。
S2：检测所述压力传感器与所述背板形成的电容的容值变化。
具体来说，根据平板电容公式C＝(ξ·S)/d，可知当触控压力作用使得压力传感器与背板之间的距离发生变化时，会使得压力传感器和背板形成电容的容值变化，因此能够检测到电容变化值。
S3：根据所述电容的容值变化，获得触控压力的大小。
举例来说，如图2所示的压力触控模组，外力作用使得压力传感器205与背板210之间的间隙变化，即距离变化，进一步使得所述压力传感器205检测到容值变化，从而根据检测到的容值变化计算出压力数据，以判断触控所用的压力。
另外，当压力传感器为自容感测块阵列时，自容感测块阵列由多个阵列排布的压力感测块形成，则当外力作用时使得压力传感器发生形变时，使得压力感测块两两之间的电场发生变化，从而使得压力感测块侦测到容值变化。进一步地，根据容值变化可获得触控压力的大小。
本公开另一实施例提供了一种上述任一实施例中的压力触控模组的驱动方法，该方法包括如下步骤：
基于分时驱动扫描的算法，在第一预设时间段，驱动显示开关器件工作；在第二预设时间段，驱动触控模组工作；在第三预设时间段，驱动压力传感器工作。
需要说明的是，所述第一预设时间段、所述第二预设时间段及所述第三预设时间段不重合，如此，通过该驱动方法驱动显示开关器件、触控模组及压力传感器独立工作且分时工作。
举例来说，所述分时驱动扫描的算法，包括：
扫描LCD的一帧时间内，在LCD的显示时间驱动所述显示开关器件(如薄膜晶体管)工作；
在所述LCD的显示间隔时间，驱动所述触控模组及压力传感器工作。
举例来说，如图6所示的分时驱动扫描信号，VS为帧同步信号，TE为使能信号，touch扫描信号为驱动触控模块的扫描信号，force扫描信号为驱动压力传感器的扫描信号。其中，帧同步信号VS的上升沿到使能信号TE的下降沿的间隔为VBP，使能信号TE的上升沿到帧同步信号VS的下降沿的间隔为VFP,把帧同步信号VS的低电平(非有效电平)持续时间称为VSW。则由图6可知，在扫描LCD的一帧时间内(vertical total time)，在LCD的显示时间(TE为低电平时)驱动所述薄膜晶体管工作。在所述LCD的显示间隔时间(TE为高电平时)，驱动所述触控模组及压力传感器工作。
需要说明的是，在LCD一帧的时间里完成LCD Display+Touch扫描+Force扫描的动作，而Touch扫描及Force扫描在LCD的显示间隔时间(LCD Blanking)时间进行。在Force扫描时，触控模组(touch sensor)相当于屏蔽层(Shielding层)，能够起到对杂讯的屏蔽作用，同时使压力传感器(Force Sensor)侦测间隙的方向为向下，即侦测与背光单元膜材之间的间隙变化。其中，在LCD一帧的时间内，Force扫描与Touch扫描的顺序可先可后，本实施例对此不加以限制。
基于同样的发明构思，本公开一实施例提供了一种显示装置，包括：上述任意一种压力触控模组。该显示装置可以为：液晶显示面板、手机、平板电脑、电视机、笔记本电脑、数码相框、导航仪等任何具有显示及触控压力感应功能的产品或部件。该显示装置由于包括上述 任意一种压力触控模组的显示装置，因而可以解决同样的技术问题，并取得相同的技术效果。
在本公开的描述中，需要说明的是，术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本公开中的具体含义。
还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (11)

  1. 一种压力触控模组，包括：基板、设置于所述基板上的触控模组及压力传感器、以及背板，其中：
    所述触控模组设置于所述基板的第一侧；
    所述压力传感器设置于所述基板背离所述触控模组的第二侧，且与所述基板相接触；
    所述背板设置于所述压力传感器背离所述基板的一侧，且与所述压力传感器保持一定间隙。
  2. 根据权利要求1所述的压力触控模组，其中，所述压力触控模组还包括：背光单元；
    所述背光单元设置于所述压力传感器背离所述基板的一侧且位于所述压力传感器与所述背板之间，所述背光单元与所述压力传感器保持一定间隙。
  3. 根据权利要求2所述的压力触控模组，其中，所述压力传感器为自容感测块阵列。
  4. 根据权利要求1所述的压力触控模组，其中，所述压力触控模组还包括：设置于所述基板的第一侧的显示开关器件。
  5. 根据权利要求4所述的压力触控模组，其中，所述压力触控模组还包括：驱动芯片；
    所述驱动芯片设置于所述基板的第一侧，且设置于所述压力触控模组的非显示区域；
    所述驱动芯片与所述显示开关器件、所述触控模组及所述压力传感器均电连接，且分时驱动所述开关器件、所述触控模组及所述压力传感器。
  6. 根据权利要求5所述的压力触控模组，其中，所述压力触控模组还包括：连接用柔性电路板FPC及主控FPC；
    所述连接用FPC与所述压力传感器的引出线连接，且与所述主控 FPC连接；
    所述主控FPC与所述驱动芯片连接，用于将所述压力传感器的引出线连接至所述驱动芯片的对应的管脚。
  7. 根据权利要求5所述的压力触控模组，其中，所述压力触控模组还包括：连接用FPC；
    所述连接用FPC与所述压力传感器的引出线连接，且与所述基板的绑定区域连接，用于将所述压力传感器的引出线通过所述基板的绑定区域连接至所述驱动芯片的对应的管脚。
  8. 一种基于权利要求1～7中任一项所述的压力触控模组的触控压力检测方法，其特征在于，所述方法包括：
    在压力检测阶段，向压力传感器加载压力检测信号；
    检测所述压力传感器与所述背板形成的电容的容值变化；
    根据所述电容的容值变化，获得触控压力的大小。
  9. 一种如权利要求1～7中任一项所述的压力触控模组的驱动方法，其特征在于，所述方法包括：
    在第一预设时间段，驱动显示开关器件工作；
    在第二预设时间段，驱动触控模组工作；
    在第三预设时间段，驱动压力传感器工作；
    其中，所述第一预设时间段、所述第二预设时间段及所述第三预设时间段不重合。
  10. 根据权利要求9所述的驱动方法，其特征在于，
    所述第一预设时间段在LCD的显示时间内；
    所述第二预设时间段和所述第三预设时间段在所述LCD的显示间隔时间内。
  11. 一种显示装置，其特征在于，包括：如权利要求1～7中任一项所述的压力触控模组。
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