WO2019003336A1 - Tete de machine de montage de composants - Google Patents

Tete de machine de montage de composants Download PDF

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Publication number
WO2019003336A1
WO2019003336A1 PCT/JP2017/023724 JP2017023724W WO2019003336A1 WO 2019003336 A1 WO2019003336 A1 WO 2019003336A1 JP 2017023724 W JP2017023724 W JP 2017023724W WO 2019003336 A1 WO2019003336 A1 WO 2019003336A1
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WO
WIPO (PCT)
Prior art keywords
head
component mounting
log information
mounting machine
stored
Prior art date
Application number
PCT/JP2017/023724
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English (en)
Japanese (ja)
Inventor
崇 平野
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2017/023724 priority Critical patent/WO2019003336A1/fr
Priority to JP2019526457A priority patent/JP6746788B2/ja
Publication of WO2019003336A1 publication Critical patent/WO2019003336A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present specification relates to a head for a component mounting machine.
  • the head for a component mounting machine which is provided in the component mounting machine and mounts a component such as an electronic component on a substrate.
  • the head for a component mounting machine has a head main body on which a component holding unit such as a suction nozzle or a holding chuck for holding a component is mounted.
  • a plurality of types of component holding portions and component mounting machine heads are provided corresponding to various types of components of different types and sizes.
  • the component placement machine head is detachably provided to the component placement machine main body.
  • the head body is communicably connected to the main body side of the component mounting machine, and power is supplied from the main body side of the component mounting machine.
  • the head body is powered integrally with the main body side of the component mounting machine, and moves the position of the component holding portion, suction, gripping, suction release, gripping release, etc. according to the instruction from the main body side of the component mounting machine I do.
  • the storage unit stores information of each head itself.
  • the information stored in the storage unit includes information on the component holding unit of the head, information on the size of the component to be suctioned and held, information on the magnitude of the suction and holding speed, the number of components held by suction and the number of defects when suctioned and held. , And information on the number of defects of the component attitude.
  • the information about the head itself such as the size and speed of the component holding unit and components is stored in the read / write unit provided on the main body of the component mounting machine when replacing the head.
  • the control device on the part mounting machine main body side It is read and sent to the control device on the part mounting machine main body side. Also, among the information stored in the storage unit, information as a result of actual operation of the head, such as the number of parts held by suction and the number of defects, is read from the storage unit of the head and read / write unit immediately before head replacement. Is read and sent to the control device on the component mounting machine main body side. Therefore, the information stored in the storage unit provided in the head can be appropriately sent to the component mounting machine main body side.
  • the present specification provides a head for a component mounting machine capable of extracting information stored in a volatile memory by storing the information stored in a volatile memory in a non-volatile memory when a head error occurs, even after the power is turned off.
  • the purpose is
  • the specification includes a head body on which a component holding unit for holding a component is mounted, an operation control unit communicatively connected to the component mounting machine body, and operating the head body according to an instruction from the component mounting machine body side;
  • a head control device having a state output unit for outputting information indicating the state of the head body to the component mounting machine body side at a predetermined cycle; and a ring buffer for storing the information at a timing including at least a time of change of the state.
  • the non-volatile memory capable of storing the information, wherein the head control device detects the head error by an error detection unit that detects a head error, and the error detection unit detects the head error.
  • a storage control unit for storing the information stored in the volatile memory in the non-volatile memory. .
  • the present disclosure when a head error occurs, information stored in volatile memory is transferred to and stored in nonvolatile memory.
  • the information stored in the non-volatile memory is held without being erased. Therefore, the same log information as the log information stored in the volatile memory at the time of head error occurrence can be taken out from the non-volatile memory after recovery after the head error occurs, so power off etc. occur after the head error occurs. Also, it is possible to confirm the state of the head for the component mounting machine immediately before the head error occurs.
  • FIG. 7 is a diagram for explaining transfer of log information from the RAM to the ROM when there is no overlap between log information at the time of head error detection and log information at the time of head power supply voltage drop detection in the present embodiment.
  • FIG. 7 is a diagram for describing transfer of log information from the RAM to the ROM when there is overlap between log information at the time of head error detection and log information at the time of head power supply voltage drop detection in the present embodiment. It is a figure for demonstrating transfer from RAM to ROM of log information at the time of head power supply voltage fall detection in this embodiment. It is a flowchart of an example of the control routine performed in the control device of a head for a component mounting machine according to a modification of the first embodiment. It is a flowchart of an example of the control routine performed in the control apparatus of the head for component mounting machines which concerns on 2nd Embodiment. It is the figure which represented typically ROM which the control apparatus of the head for component mounting machines of this embodiment has. FIG.
  • FIG. 7 is a diagram for explaining transfer of log information from the RAM to the ROM when there is no overlap between log information at the time of head error detection and log information at the time of head power supply voltage drop detection in the present embodiment.
  • FIG. 7 is a diagram for describing transfer of log information from the RAM to the ROM when there is overlap between log information at the time of head error detection and log information at the time of head power supply voltage drop detection in the present embodiment. It is a figure for demonstrating transfer from RAM to ROM of log information at the time of head power supply voltage fall detection in this embodiment.
  • First Embodiment 1-1 Configuration of Head for Component Mounting Machine and Peripheral Area
  • the head for component mounting machine 10 of the present embodiment is a mounting head mounted on the component mounting machine 1 for mounting components on a substrate such as a circuit board.
  • the component placement machine 1 includes a substrate transfer device 20, a component supply device 30, and a component transfer device 40.
  • the substrate transfer apparatus 20 is an apparatus for transferring the substrate 2.
  • the substrate transfer apparatus 20 includes a pair of guide rails 21 and 22 and a substrate holding unit 23.
  • the substrate transport apparatus 20 transports the substrate 2 guided in the transport direction X by a pair of guide rails 21 and 22 placed on the substrate holding unit 23 and arranged in parallel with each other at an interval, by rotating the conveyor belt. Transport in direction X When the substrate 2 is transported by the substrate transport apparatus 20 to a predetermined component mounting position, the substrate 2 is positioned by the clamp device.
  • the guide rails 21 and 22 of the substrate transfer device 20, the substrate holding unit 23, and the clamp device may be replaced as appropriate depending on the type, size, shape, and the like of the substrate 2.
  • the component supply device 30 is a device that supplies components to be mounted on the substrate 2 to a predetermined supply position L.
  • the parts supply device 30 has a parts feeder 31.
  • the parts feeder 31 is detachably and exchangeably held in a slot provided on the main body side of the parts mounting machine 1.
  • the parts feeder 31 detachably and rotatably holds a reel 32 on which a carrier tape containing a plurality of parts is wound.
  • the reels 32 are provided for each type of part.
  • the parts feeder 31 causes the carrier tape wound on the reel 32 to travel toward the predetermined supply position L by rotation of the electric motor.
  • the component transfer device 40 is a device for transferring a component supplied to a predetermined supply position L toward the substrate 2 positioned at the predetermined component mounting position.
  • the component transfer device 40 has the component mounting machine head 10, the Y-axis slider 41, and the X-axis slider 42 described above.
  • the Y-axis slider 41 is a device movable by a Y-axis servomotor along a guide rail extending in a direction (hereinafter, referred to as an orthogonal direction Y) orthogonal to the transport direction X of the substrate 2.
  • the X-axis slider 42 is attached to the Y-axis slider 41 so as to be movable in the transport direction X.
  • the X-axis slider 42 is integrally moved in the orthogonal direction Y integrally with the Y-axis slider 41 with the movement of the Y-axis slider 41 in the orthogonal direction Y, and the transport direction X of the substrate 2 by the X-axis servomotor.
  • the device is moved to the
  • the component mounting machine head 10 is attached to the X-axis slider 42.
  • the component mounting machine head 10 has a head main body 11.
  • the head main body 11 holds a suction nozzle capable of suctioning a component which has reached a predetermined supply position L and a holding chuck (hereinafter referred to as a nozzle 12 etc.) capable of holding a component.
  • the head body 11 may be capable of simultaneously holding a plurality of nozzles 12 and the like.
  • the component mounting machine head 10 is removable and replaceable with respect to the X-axis slider 42.
  • the head 10 for the component mounting machine can be appropriately changed according to the type, size, shape, etc. of the target component.
  • the component mounting machine head 10 can move in the vertical direction Z perpendicular to both the transport direction X and the orthogonal direction Y with respect to the X-axis slider 42.
  • the nozzle or the like 12 of the head 10 for component mounting machine sucks and grips the component which has reached the predetermined supply position L of the component supply device 30 using a negative pressure or the like, and releases the component gripped and held.
  • the apparatus 20 is mounted on the substrate 2 positioned at a predetermined component mounting position.
  • the component mounting machine 1 includes a control device 50 mounted on the main body side of the component mounting machine 1.
  • the control device 50 is mainly configured of a computer provided with a central processing unit (CPU) 51, a read only memory (ROM), a random access memory (RAM) and the like.
  • the control device 50 can execute control processing by being supplied with power from the power supply 52.
  • the CPU 51 is communicably connected to a management server 3 provided in a factory where the component mounting device 1 is installed.
  • the CPU 51 produces the substrate 2 in accordance with the production job downloaded from the management server 3.
  • the units of the apparatuses 20, 30, 40 to be used for example, among a plurality of held parts feeders 31 should be used according to the relationship between the production job stored in advance and the used apparatus and used parts
  • a control device (hereinafter referred to as a head control device) 60 is integrally attached to the component mounting machine head 10.
  • the head control device 60 is mainly configured of a computer, and has a CPU (hereinafter referred to as a head side CPU) 61, an IO device 62, a RAM 63, a ROM 64, and a power supply voltage drop detection unit 65. doing.
  • the head control device 60 can execute control processing by being supplied with power from the power supply 52 on the main body side of the component mounting device 1 through the power supply line 53.
  • the head control device 60 may incorporate an auxiliary battery or a capacitor which is charged by the power supply from the power supply 52.
  • the head CPU 61 is communicably connected to the CPU 51 of the main body side of the component mounting device 1 (hereinafter referred to as the main CPU 51) via the communication line 54.
  • the main CPU 51 controls the operation of the IO device 62 of the component mounting machine head 10 via the head CPU 61.
  • the main CPU 51 instructs the head CPU 61 to operate the IO device 62 through the communication line 54 in a predetermined cycle.
  • the head side CPU 61 operates the IO device 62 in accordance with the operation command from the machine side CPU 51.
  • the head CPU 61 can obtain information from the IO device 62 and various head error information, and can generate log information at a timing including a state change of the head main body 11.
  • the head CPU 61 outputs the obtained and generated information to the main CPU 51 via the communication line 54 in a predetermined cycle.
  • the main CPU 51 acquires information output by the head CPU 61 at a predetermined cycle.
  • the main CPU 51 executes processing based on the information (for example, attitude control of the head 10 for component mounting machine, information update to the management server 3, etc.).
  • the IO device 62 is a generic term for input devices and output devices provided in the head main body 11 connected to the head CPU 61.
  • the input device includes various sensors, switches, etc. For example, a sensor that outputs a signal according to the posture position of the head main body 11 or a sensor that outputs a signal according to the temperature on the CPU substrate of the head control device 60 It is.
  • the input device transmits the generated signal as information to the head CPU 61.
  • the output device is, for example, a solenoid or a motor required to operate the head main body 11 such as lifting and lowering of a component holding unit such as a suction nozzle and a holding chuck.
  • the output device operates in accordance with a command from the head CPU 61.
  • the head side CPU 61 detects a head error occurring in the component mounting machine head 10 based on the information obtained from the IO device 62 and the information via the communication line 54 for exchanging information with the machine side CPU 51. It is possible.
  • the head error is, for example, a communication abnormality between the head side CPU 61 and the main unit side CPU 51, a sensor abnormality of the IO device 62, a signal transmission / reception abnormality, or the like.
  • the communication abnormality and the signal exchange abnormality are, for example, that the signal is stuck or a signal indicating an abnormal change is included.
  • the sensor abnormality is that the signal output from the sensor indicates a value that can not normally occur.
  • the machine side CPU 51 acquires the log information of the units of the respective devices 20, 30, 40 while the substrate 2 is being produced, and uploads the acquired log information to the management server 3.
  • the log information is information indicating the history of processing associated with the acquisition time or the up time, and the model name of the component mounting machine 1 and the work machine individual identification information, the state thereof, and the devices 20, 30, 40 Unit type, unit identification information, unit operation status, etc. are summarized.
  • the unit operating state of the head for component mounting machine 10 refers to the IO information of signals input to and output from the IO device 62, the command execution status of the output device in response to the operation command from the CPU 51 of the machine (for example, "before execution” (“In operation”, “after operation”, etc.), the operation speed of the output device, the temperature on the CPU substrate, and the like.
  • the units of the devices 20, 30 and 40 operate while the parts mounting machine 1 is operating.
  • the component placement machine 1 starts the automatic operation
  • the component placement machine 1 finishes the automatic operation when the component placement machine 1 completes the production of one substrate 2, etc.
  • the RAM 63 is connected to the head CPU 61.
  • the RAM 63 is a volatile memory capable of holding stored data only while power is supplied from any of the power supply 52 and an auxiliary battery.
  • the RAM 63 stores various types of information generated by execution of a program by the head CPU 61.
  • the RAM 63 has a ring buffer area in which the above log information is stored, and a management area in which management information is stored.
  • the ring buffer area of the RAM 63 is configured like a ring buffer, and is divided into a plurality of predetermined areas.
  • the ring buffer area has a capacity sufficient to store a predetermined number of pieces of log information.
  • the number of log information that can be stored in the ring buffer area that is, the capacity of the ring buffer area is sufficient for the maximum number of log information that can be acquired within the time interval that is the communication cycle between the machine CPU 51 and the head CPU 61 It is set to be able to memorize in.
  • the writing of the log information to the ring buffer area of the RAM 63 is sequentially performed from the top area to the last area among the predetermined plurality of divided areas. Then, after the log information is written in the last area, the next log information is overwritten in the first area.
  • information of the current data write destination in the ring buffer area (that is, the write destination of the log information) is stored as management information.
  • the log information is sequentially generated by the head CPU 61 and sequentially written to the ring buffer area of the RAM 63.
  • the head side CPU 61 writes the generated log information in the correct address of the ring buffer area by storing the write destination of the log information in the ring buffer area in the management area of the RAM 63 or updating the storage destination.
  • the ROM 64 is connected to the head CPU 61.
  • the ROM 64 is a non-volatile memory capable of holding stored data even when power is not supplied.
  • the log information stored in the ring buffer area of the RAM is transferred and written to the ROM 64 at a predetermined timing described later in detail.
  • the ROM 64 has a capacity capable of storing all log information stored in the RAM 63.
  • the power supply voltage drop detection unit 65 is connected to the head CPU 61.
  • the power supply voltage drop detection unit 65 is a part that detects a voltage drop of the head power supply input from the power supply 52 to the head control device 60 via the power supply line 53.
  • the power supply voltage drop detection unit 65 detects that the head power supply voltage has dropped to a predetermined value or less, the power supply voltage drop detection unit 65 outputs the voltage drop information to the head CPU 61.
  • the head side CPU 61 detects the presence or absence of the voltage drop of the head power supply based on the presence or absence of the voltage decrease information from the power supply voltage decrease detection unit 65.
  • the head CPU 61 is the IO device according to the operation command of the IO device 62 sent from the CPU 51 at a predetermined predetermined cycle. Execute processing to activate 62 output devices.
  • the head side CPU 61 obtains information from the input device of the IO device 62 about the operation of the output device at a cycle shorter than a predetermined cycle of the operation command from the machine side CPU 51. Then, during operation processing of the output device, the head side CPU 61 calculates a deviation between a current value and a target value based on the input information, and outputs a target command value according to the deviation.
  • the head side CPU 61 stores the log information generated by the series of processes in the ring buffer area of the RAM 63. Further, the head CPU 61 can store log information generated along with head error detection and power supply voltage drop detection by the power supply voltage drop detection unit 65 in a ring buffer area of the RAM 63.
  • the storage of the log information in the ring buffer area of the RAM 63 described above stores the generated log information in the current write destination stored in the management area.
  • the write destination information in the ring buffer area of the log information stored in the management area is updated to the next area.
  • the head CPU 61 outputs the log information stored in the RAM 63 to the main CPU 51 via the communication line 54 at a predetermined cycle. Therefore, the main unit CPU 51 can acquire log information of the component mounting machine head 10 from the head CPU 61 at a predetermined cycle, and a component generated between the previous communication with the head CPU 61 and the current communication Log information of the mounting machine head 10 can be acquired. Therefore, the main CPU 51 can acquire a state change in a short time which has occurred in the head 10 for a component mounting machine during communication with the head CPU 61.
  • the main CPU 51 of the head of the component mounting machine head 10 acquires Upload log information to the management server 3.
  • the head side CPU 61 After the power is turned on, the head side CPU 61 causes a failure in communication with the head 10 for a component mounting machine, based on information obtained from the IO device 62 and information via the communication line 54 for exchanging information with the main CPU 51. It is determined whether a head error such as a sensor abnormality has occurred (step S100 shown in FIG. 3). As a result, when the head CPU 61 determines that a head error does not occur in the component mounting machine head 10, next, based on the information from the power supply voltage drop detection unit 65, the head of the component mounting machine head 10 It is determined whether the power supply voltage has dropped to a predetermined value or less (step S110). As a result, when the head-side CPU 61 determines that the power supply voltage is not reduced in the head 10 for the component mounting machine, the process of step S100 is performed again.
  • a head error such as a sensor abnormality
  • the head side CPU 61 determines that a head error has occurred in the head 10 for a component mounting machine in step S100, all the log information stored in the ring buffer area of the RAM 63 is read, and the read log information is The ROM 64 is written and stored (step S120). At this time, the head side CPU 61 stores the log information based on the information obtained at the time of head error occurrence in the head for component mounting machine 10 in the ring buffer area of the RAM 63 and thereafter from the ring buffer area. All the read log information may be written to the ROM 64. Alternatively, the log information based on the information obtained when the head error occurs may be written in the ROM 64 together with the log information read from the ring buffer area without storing the log information in the ring buffer area of the RAM 63.
  • step S110 determines in step S110 that a voltage drop of the head power is generated in the component mounting machine head 10 in step S100. It is determined whether or not it has been detected (step S130). As a result, when the head-side CPU 61 determines that head error detection has been performed, the current routine ends without proceeding with any processing.
  • step S140 the head side CPU 61 stores the log information based on the information obtained at the time of the power supply voltage drop in the ring buffer area of the RAM 63 and thereafter, all the log information read from the ring buffer area You may write to Alternatively, the log information based on the information obtained when the power supply voltage is lowered may be written directly to the ROM 64 together with the log information read from the ring buffer area without storing the log information in the ring buffer area of the RAM 63.
  • the log stored in the RAM 63 when a head error such as a communication abnormality between the head side CPU 61 and the main unit side CPU 51 or a sensor abnormality of the IO device 62 is detected.
  • the information is transferred to and stored in the ROM 64. Since the RAM 63 is a volatile memory, the information stored in the RAM 63 is erased when the power is turned off after the occurrence of a head error. On the other hand, since the ROM 64 is a non-volatile memory, even if the power is turned off after the occurrence of a head error, the information stored in the ROM 64 is held without being erased.
  • the head error is generated even if the power is turned off after the head error occurs.
  • the state of the component mounting machine head 10 immediately before the occurrence can be confirmed after the occurrence of the head error. Therefore, according to the head for component mounting machine 10, the log information stored in the RAM 63 at the time of head error detection is written to the ROM 64, and then output to the CPU 51 of the machine via the communication line 54 for example. It is possible to make the main body recognize and analyze the log information after recovery after the occurrence of the head error.
  • the log information stored in the RAM 63 is transferred to the ROM 64 and stored.
  • the ROM 64 is a non-volatile memory. Therefore, even if the power is turned off after a head error occurs, the information stored in the ROM 64 is held without being erased.
  • log information stored in the RAM 63 at the time of detection of the head power supply voltage drop can be taken out from the ROM 64 after recovery after the voltage drop, so power off etc. occur after the head power supply voltage drops. Even in this case, the state of the head for component mounting machine 10 immediately before the reduction of the head power supply voltage can be confirmed after the reduction of the head power supply voltage. Therefore, according to the head for component mounting machine 10, log information stored in the RAM 63 at the time of detection of a reduction in head power supply voltage can be analyzed after restoration after the reduction in head power supply voltage. It can be output to the side CPU 51.
  • transfer of log information from the RAM 63 to the ROM 64 due to the voltage drop of the head power supply is executed only when transfer of log information from the RAM 63 to the ROM 64 due to the occurrence of a head error is not performed before the transfer. It is not executed if the transfer accompanying the occurrence of the head error has been performed. That is, when head error occurrence is detected first and head power supply voltage drop is detected thereafter, only transfer of log information from RAM 63 to ROM 64 accompanying head error occurrence when both detections overlap in timing. Is executed.
  • the determination as to whether or not the head error detection and the head power supply voltage drop detection overlap in timing is performed based on whether or not the same log information is stored in the RAM 63 at the time of both detections. Also, based on whether or not the head power supply voltage drop is caused due to the occurrence of a head error, or based on whether or not the time interval between both detections is less than a predetermined predetermined time. May be performed.
  • the log information A stored in the RAM 63 at the head error detection time Ta and the log information B stored in the RAM 63 at the head power supply voltage decrease detection time Tb after the head error occurrence If the same log information is not included and there is no duplication of both log information, only the log information A stored in the RAM 63 at the time of head error detection is ROM64 if the time interval between both detections is less than a predetermined time. Transferred to and stored. Further, as shown in FIG. 5, the log information A stored in the RAM 63 at the head error detection time Ta, and the log information B stored in the RAM 63 at the head power supply voltage decrease detection time Tb after the head error occurrence.
  • the same log information is included, and even when there is duplication of both log information, only the log information A stored in the RAM 63 is transferred to the ROM 64 and stored when the head error is detected. Then, as shown in FIG. 6, the log information B stored in the RAM 63 is transferred to the ROM 64 and stored when the head power supply voltage drop is detected Tb before the head power error when the head power supply voltage drop is detected Tb. Is not detected.
  • the transfer of log information from the RAM 63 to the ROM 64 due to the occurrence of a head error and the transfer of log information from the RAM 63 to the ROM 64 due to the decrease in head power supply voltage after the occurrence of the head error are duplicated. Being avoided is avoided. For this reason, it is possible to prevent the time required for transferring the log information from the RAM 63 to the ROM 64 at the time of head error detection to be extended for a long time.
  • both log information Since it is avoided that both are written to the ROM 64, it is possible to prevent the same log information from being stored redundantly in the ROM 64.
  • log information stored in the ROM 64 log information associated with a drop in the head power supply voltage alone and a log associated with the head power supply voltage drop after a head error occurs. Mixing information and is avoided. For this reason, after recovery, after the log information accompanying the head power supply voltage drop is taken out from the ROM 64, it is not necessary to distinguish whether the log information is generated after the occurrence of a head error, so analysis of the log information Time and effort can be prevented, and the analysis efficiency of log information can be improved.
  • the head for component mounting machine 10 of the present embodiment is communicably connected to the head main body 11 on which the nozzle etc. 12 for holding components is mounted and the component mounting machine 1
  • a head control unit 60 having a head side CPU 61 that operates head main body 11 according to an instruction from the machine 1 side and outputs log information indicating the state of the head main body 11 to the component mounting machine 1 side at predetermined intervals,
  • the head-side CPU 61 of the head control device 60 detects a head error, and stores the log information stored in the RAM 63 in the ROM 64 when the head error is detected.
  • the information stored in the RAM 63 is transferred to the ROM 64 and stored.
  • the information stored in the ROM 64 is held without being erased. For this reason, since the same log information as log information stored in the RAM 63 at the time of head error detection can be taken out from the ROM 64 after recovery after the head error occurs, the head error is generated even if the power is turned off after the head error occurs. The state of the component mounting machine head 10 immediately before the occurrence can be confirmed after the occurrence of the head error.
  • the head control device 60 further includes a power supply voltage drop detection unit 65 that detects a drop in the power supply voltage to the head main body 11.
  • the head side CPU 61 stores the log information stored in the RAM 63 in the ROM 64 when the power supply voltage drop detection unit 65 detects a drop in the head power supply voltage.
  • the log information stored in the RAM 63 is transferred to the ROM 64 and stored when the voltage drop of the head power supply occurs.
  • the information stored in the ROM 64 is held without being erased.
  • the same log information as log information stored in the RAM 63 at the time of head power supply voltage drop detection can be taken out from the ROM 64 after recovery after the voltage drop, so power off etc. occur after the head power voltage drops.
  • the state of the head for component mounting machine 10 immediately before the head power supply voltage drop can be confirmed after the head power supply voltage drop.
  • the head side CPU 61 detects the head error earlier than the detection of the head power supply voltage drop when the detection of the head error and the detection of the head power supply voltage drop overlap in timing.
  • the ROM 64 stores log information stored in the RAM 63 when the head error is detected.
  • the head side CPU 61 is caused to execute the routine shown in FIG.
  • the present invention is not limited to this.
  • the head CPU 61 may execute the routine shown in FIG.
  • the steps for executing the same processing as in the routine shown in FIG. 3 will be assigned the same reference numerals, and the description thereof will be omitted or simplified.
  • step S100 when the head side CPU 61 determines that a head error has occurred in the head 10 for a component mounting machine in step S100, all the log information stored in the ring buffer area of the RAM 63 is read and the read log The information is written to the ROM 64 and stored (step S200 shown in FIG. 7). At this time, the head side CPU 61 stores the log information based on the information obtained at the time of head error occurrence in the head for component mounting machine 10 in the ring buffer area of the RAM 63 and thereafter from the ring buffer area. All the read log information may be written to the ROM 64.
  • the log information based on the information obtained when the head error occurs may be written in the ROM 64 together with the log information read from the ring buffer area without storing the log information in the ring buffer area of the RAM 63.
  • the head side CPU 61 ends the current routine.
  • step S110 If the head CPU 61 determines in step S110 that a drop in the power supply voltage occurs in the head 10 for a component mounting machine, all the log information stored in the ring buffer area of the RAM 63 is read and read. The log information is written to the ROM 64 and stored (step S210). At this time, the head side CPU 61 stores the log information based on the information obtained at the time of the power supply voltage drop in the ring buffer area of the RAM 63 and thereafter, all the log information read from the ring buffer area You may write to Alternatively, the log information based on the information obtained when the power supply voltage is lowered may be written directly to the ROM 64 together with the log information read from the ring buffer area without storing the log information in the ring buffer area of the RAM 63. After writing the log information in the RAM 63 to the ROM 64 in step S210, the head side CPU 61 ends the current routine.
  • the head for component mounting machine 10 of the modified embodiment when a head error such as a communication abnormality between the head side CPU 61 and the main unit side CPU 51 or a sensor abnormality of the IO device 62 occurs, and a voltage of the head power supply When a drop occurs, log information stored in the RAM 63 is transferred to the ROM 64 and stored. Therefore, the same log information as log information stored in the RAM 63 at the time of head error detection or head power supply voltage drop detection can be taken out from the ROM 64 after recovery. Even if an off or the like occurs, the state of the head for component mounting machine 10 immediately before the occurrence of a head error or immediately before the decrease of the head power supply voltage can be confirmed after the occurrence of the head error or after the decrease of the head power supply voltage.
  • a head error such as a communication abnormality between the head side CPU 61 and the main unit side CPU 51 or a sensor abnormality of the IO device 62 occurs
  • a voltage of the head power supply When a drop occurs, log information stored in the RAM 63
  • step S110 is not performed. Transfer of log information from the RAM 63 to the ROM 64 is not performed in accordance with the reduction of the head power supply voltage at time t. That is, transfer of log information accompanying the decrease in head power supply voltage (processing of step S210) is limited to the case where it is determined in step S100 that no head error has occurred.
  • both of the log information are Since writing to the ROM 64 is avoided, the same log information can be prevented from being stored redundantly in the ROM 64.
  • log information stored in the ROM 64 log information associated with a drop in head power supply voltage alone and log information associated with a drop in head power supply voltage after a head error occur are mixed. As a result, after recovery, it is possible to prevent time-consuming analysis after the log information associated with the reduction in head power supply voltage is taken out from the ROM 64.
  • the configuration and processing of a head for a component mounting machine according to the present embodiment will be described with reference to FIGS.
  • the component mounting machine head 10 of this embodiment differs from the component mounting machine head 10 of the first embodiment in the structure of the ROM 64 of the head control device 60, and the head CPU 61 replaces the routine shown in FIG. This is realized by executing the routine shown in FIG.
  • the routine shown in FIG. 8 the same reference numerals are given to steps performing the same processing as in the routine shown in FIG. 3, and the description thereof will be omitted or simplified.
  • the ROM 64 has a first memory area 64a and a second memory area 64b, as shown in FIG.
  • the first memory area 64a is a head error area in which log information stored in the RAM 63 at the time of head error detection is stored.
  • the second memory area 64b is an area for power supply voltage reduction in which log information stored in the RAM 63 at the time of detection of head power supply voltage reduction is stored.
  • the first memory area 64a is referred to as a head error area 64a
  • the second memory area 64b is referred to as a power supply voltage reduction area 64b.
  • step S100 When the head side CPU 61 determines that a head error has occurred in the head 10 for a component mounting machine in step S100, all the log information stored in the ring buffer area of the RAM 63 is read, and the read log information is The ROM 64 is written and stored (step S120). At this time, the log information is written to the head error area 64 a of the ROM 64.
  • step S110 If the head CPU 61 determines in step S110 that a drop in the power supply voltage occurs in the head 10 for a component mounting machine, all the log information stored in the ring buffer area of the RAM 63 is read and read. The log information is written to the ROM 64 and stored (step S300 shown in FIG. 8).
  • the head side CPU 61 stores the log information based on the information obtained at the time of the power supply voltage drop in the ring buffer area of the RAM 63 and thereafter, all the log information read from the ring buffer area You may write to Alternatively, the log information based on the information obtained when the power supply voltage is lowered may be written directly to the ROM 64 together with the log information read from the ring buffer area without storing the log information in the ring buffer area of the RAM 63. At this time, the log information is written to the power supply voltage reduction area 64 b of the ROM 64. After writing the log information in the RAM 63 to the ROM 64 in step S300, the head-side CPU 61 ends the current routine.
  • the head for component mounting machine 10 of the present embodiment when a head error such as a communication abnormality between the head side CPU 61 and the main unit side CPU 51 or a sensor abnormality of the IO device 62 occurs, When a voltage drop occurs, log information stored in the RAM 63 is transferred to the ROM 64 and stored. Therefore, the same log information as log information stored in the RAM 63 at the time of head error detection or head power supply voltage drop detection can be taken out from the ROM 64 after recovery. Even if an off or the like occurs, the state of the head for component mounting machine 10 immediately before the occurrence of a head error or immediately before the decrease of the head power supply voltage can be confirmed after the occurrence of the head error or after the decrease of the head power supply voltage.
  • transfer of log information from the RAM 63 to the ROM 64 accompanying the occurrence of a head error and transfer of log information from the RAM 63 to the ROM 64 due to the voltage drop of the head power are independently performed. That is, the transfer of log information from the RAM 63 to the ROM 64 accompanying the voltage drop of the head power supply is executed even if the transfer accompanying the occurrence of a head error is performed before the transfer.
  • the transfer associated with the occurrence of the head error and the transfer associated with the reduction of the head power supply voltage are performed with different storage areas in the ROM 64. That is, transfer associated with the occurrence of a head error is performed to the head error area 64 a of the ROM 64. Further, transfer associated with the reduction of the head power supply voltage is performed to the power supply voltage reduction region 64 b of the ROM 64.
  • log information A stored in the RAM 63 at head error detection time and log information B stored in the RAM 63 at head power supply voltage decrease detection time Tb after the head error occurrence When the same log information is not included and there is no duplication of both log information, the log information A is transferred to and stored in the head error area 64a of the ROM 64 and the log information B is an area for the power supply voltage reduction of the ROM 64. It is transferred to 64b and stored. Further, as shown in FIG. 11, the log information A stored in the RAM 63 at the head error detection time Ta, and the log information B stored in the RAM 63 at the head power supply voltage decrease detection time Tb after the head error occurrence.
  • log information A is transferred to and stored in the head error area 64a of the ROM 64 and log information B is for reduction of the power supply voltage of the ROM 64 even when there is duplication of both log information. It is transferred to area 64b and stored. Then, as shown in FIG. 12, when the head power supply voltage drop occurs alone at time Tb, the log information B stored in the RAM 63 at the head power supply voltage drop detection Tb is the power supply voltage drop area 64b of the ROM 64. Transferred to and stored.
  • the log information stored in the RAM 63 at the time of head error detection and the log information stored in the RAM 63 at the time of head power supply voltage drop detection can be stored in separate areas of the ROM 64.
  • Log information can be divided for each type and stored in the ROM 64. Therefore, when extracting log information from the ROM 64, only the log information that matches the purpose of the extraction can be extracted, and the extraction can be easily performed, so the efficiency in analyzing the log information is improved. be able to.
  • the ROM 64 has a head error area 64a in which log information stored in the RAM 63 is stored at the time of head error detection; And a power supply voltage reduction area 64b different from the error area 64a and storing log information stored in the RAM 63 when the head power supply voltage reduction is detected.
  • the head side CPU 61 stores the log information stored in the RAM 63 in the head error area 64a at the time of head error detection, and stores the log information in the power supply voltage reduction area 64b at the time of head power supply voltage reduction detection.
  • the log information stored in the RAM 63 at the time of head error detection and the log information stored in the RAM 63 at the time of head power supply voltage drop detection can be stored in separate areas of the ROM 64.
  • Log information can be divided for each type and stored in the ROM 64. Therefore, when extracting log information from the ROM 64, it is possible to extract only log information of a type that matches the purpose of the extraction, and the extraction can be easily performed.
  • 1 Component mounting machine
  • 2 Board
  • 10 Head for component mounting machine
  • 11 Head main body
  • 12 nozzle etc.
  • 50 Control device
  • 51 Main unit side CPU
  • 52 Power supply
  • 60 Head control device
  • 61 head side CPU
  • 62 IO device
  • 63 RAM
  • 64 ROM
  • 64a first memory area (head error area)
  • 64b second memory area (power supply voltage reduction area)
  • 65 power supply voltage Decrease detection unit.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne une tête de machine de montage de composant qui génère le stockage et la conservation dans une mémoire non volatile d'informations stockées dans une mémoire volatile lorsqu'une erreur de tête se produit, de sorte que les informations peuvent être récupérées même après l'arrêt de la machine, la tête de machine de montage de composant comprenant : un corps; un dispositif de commande de tête pourvu d'une unité de commande d'activation reliée de façon à communiquer avec un corps de machine de montage de composant pour activer le corps de tête conformément à une instruction provenant du côté corps de machine de montage de composant, et une unité de sortie d'état pour délivrer en sortie des informations indiquant l'état du corps de tête au côté corps de machine de montage de composant avec une période prescrite; une mémoire volatile tampon annulaire pour stocker des informations à un instant comprenant au moins le moment du changement de l'état; et une mémoire non volatile pouvant stocker des informations. Le dispositif de commande de tête comprend une unité de détection d'erreur pour détecter une erreur de tête, et une unité de commande de stockage générant le stockage dans la mémoire non volatile des informations stockées dans la mémoire volatile.
PCT/JP2017/023724 2017-06-28 2017-06-28 Tete de machine de montage de composants WO2019003336A1 (fr)

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PCT/JP2017/023724 WO2019003336A1 (fr) 2017-06-28 2017-06-28 Tete de machine de montage de composants
JP2019526457A JP6746788B2 (ja) 2017-06-28 2017-06-28 部品装着機用ヘッド

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WO2020148895A1 (fr) * 2019-01-18 2020-07-23 株式会社Ｆｕｊｉ Tête de montage, procédé destiné à sauvegarder des données de fonctionnement pour la tête de montage, et dispositif de montage de composants
WO2021005667A1 (fr) * 2019-07-05 2021-01-14 株式会社Ｆｕｊｉ Dispositif de montage de composant

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JP2006173442A (ja) * 2004-12-17 2006-06-29 Matsushita Electric Ind Co Ltd 部品実装装置
JP2011519460A (ja) * 2008-05-01 2011-07-07 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． チェックポイントデータの不揮発性メモリへの保存
JP2012008672A (ja) * 2010-06-23 2012-01-12 Lenovo Singapore Pte Ltd メイン・メモリのバックアップ方法およびデータ保護システム
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WO2020148895A1 (fr) * 2019-01-18 2020-07-23 株式会社Ｆｕｊｉ Tête de montage, procédé destiné à sauvegarder des données de fonctionnement pour la tête de montage, et dispositif de montage de composants
CN113228844A (zh) * 2019-01-18 2021-08-06 株式会社富士 安装头及其运转数据存储方法以及元件安装装置
JPWO2020148895A1 (ja) * 2019-01-18 2021-10-14 株式会社Ｆｕｊｉ 実装ヘッドおよびその稼動データ記憶方法並びに部品実装装置
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JP7169374B2 (ja) 2019-01-18 2022-11-10 株式会社Fuji 実装ヘッド
CN113228844B (zh) * 2019-01-18 2022-12-13 株式会社富士 安装头及其运转数据存储方法以及元件安装装置
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WO2021005667A1 (fr) * 2019-07-05 2021-01-14 株式会社Ｆｕｊｉ Dispositif de montage de composant
JPWO2021005667A1 (fr) * 2019-07-05 2021-01-14
JP7223136B2 (ja) 2019-07-05 2023-02-15 株式会社Fuji 部品実装装置

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