WO2019000773A1 - 用注塑制成的由塑料做绝缘载体的电路板 - Google Patents

用注塑制成的由塑料做绝缘载体的电路板 Download PDF

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WO2019000773A1
WO2019000773A1 PCT/CN2017/109169 CN2017109169W WO2019000773A1 WO 2019000773 A1 WO2019000773 A1 WO 2019000773A1 CN 2017109169 W CN2017109169 W CN 2017109169W WO 2019000773 A1 WO2019000773 A1 WO 2019000773A1
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metal
circuit board
circuit
plated
plastic
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PCT/CN2017/109169
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English (en)
French (fr)
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马培中
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马培中
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers

Definitions

  • the present invention relates to the field of circuit boards, and in particular to a circuit board made of plastic as an insulating carrier.
  • the conventional circuit board is made of a phenolic resin paper composite board, or a glass fiber epoxy resin composite board, or a polyimide film, or a PET film, or a ceramic plate, or a metal plate through the heat of insulation.
  • the solid glue and the copper foil are glued together to form a copper clad plate, and then formed into a circuit board circuit by a chemical etching process, and then the ink or the cover film is used for solder resist to form a pad of the circuit board, and the component is soldered on the pad.
  • the process flow of the conventional circuit board is long and complicated, and the cost is high, and the thermal conductivity of the resin, the glue, the film and the like in the conventional circuit board structure is low, resulting in poor heat conduction and heat transfer of the circuit board.
  • a circuit board made of plastic and made of an insulating carrier by injection molding uses a metal plate according to a designed circuit, and is required to be removed by chemical etching or laser cutting or die cutting. A part of the metal is then injection molded at a part of the gap or all the gaps of the broken metal.
  • the injection molding plastic firmly connects the metal on both sides of the gap, and then uses a mold or a laser to cut off another part of the metal that is not needed in the circuit to form a plastic.
  • the circuit board of the insulating carrier, and the pad is directly formed during the injection molding, and no need to make ink or cover film to form the pad. Soldering components on the pads of the circuit board, or directly packaging the chip devices, has good heat conduction, simple structure, high production efficiency, and low cost.
  • the invention relates to a circuit board made of plastic as an insulating carrier by injection molding, in particular, according to a designed circuit, the metal plate is chemically etched or laser cut or die cut to remove a part of metal which is not needed for the circuit, and The holes or semi-holes for fixing the injection-molded plastic are cut off on the metal on both sides of the slit after the metal is removed, and the metal plates excluding part of the metal are still connected, and then injection molded at the slit or all the slits of the broken metal, injection molding
  • the plastic is embedded in the hole or half hole of the metal, and the metal on both sides of the gap is firmly connected and fixed together, and then the metal plate of the plastic insulating carrier is formed on the circuit board by using a mold or a laser to cut another part of the metal which is not needed for the circuit.
  • the chip device is directly packaged, and/or the components are soldered on the pads formed by injection molding.
  • the circuit board of the invention has good heat conduction, simple structure,
  • a method of injection molding a circuit board made of plastic as an insulating carrier in particular, according to a circuit designed, the metal plate is removed by chemical etching or laser cutting or die cutting. A part of the metal that is not needed in the circuit, the metal plate except part of the metal is still connected, and then injection molded on both sides of the metal or single-sided injection molding, the metal is wrapped by plastic or fixed after being embedded, and the solder joint on the metal is left after the injection molding, The solder pad is formed by plastic, and then the mold or laser is used to cut off another part of the metal that is not needed by the circuit, and the circuit board of the plastic insulating carrier can be directly packaged on the solder joint of the circuit board, and/or The components are soldered on the pads formed by injection molding, and the fabricated circuit board is provided with pads at a plurality of positions, and can solder or package a plurality of electronic components.
  • the metal circuit on the circuit board can be designed according to design. Into a variety of circuit
  • a circuit board made of plastic as an insulating carrier comprising: a circuit formed of a metal plate; an insulating carrier carrier formed by injection molding to form a metal circuit; a pad, or a soldering hole with a soldering ring; characterized in that the circuit formed by the metal plate is laser-cut, or chemically etched, or die-cutting to remove a portion of the metal that is not required for the circuit, and then the mold or laser is used to cut the circuit after injection molding.
  • the injection molded carrier is injection molded on one or both sides of the metal, and And the plastic is wrapped or embedded in the metal, so that the circuit is firmly grasped and fixed into a whole by the plastic.
  • One or both sides of the metal circuit board have a pad formed by plastic after injection molding or a welding hole with a welding ring, and the pad is used for welding.
  • a chip component, or directly packaged chip device, or an in-line component is soldered to the soldering hole and soldered to the soldering ring, and the insulating plastic connecting carrier circuit board is characterized in that a pad is provided at a plurality of positions on the circuit board. It can be used to solder and/or package multiple electronic components.
  • the metal circuit on the circuit board can be made into a variety of circuits according to the design.
  • a method of injection molding a circuit board made of plastic as an insulating carrier comprising: removing a metal plate by chemical etching or laser cutting or die cutting according to a designed circuit A part of the metal is not required in the circuit, wherein the metal plate from which part of the metal is removed is still integrated; the metal surface of the metal plate is injection molded or single-sided injection molding, wherein the metal is wrapped by plastic or fixed after being embedded, and retained after injection molding.
  • solder joints directly encapsulate the chip device and/or solder the components on the pads formed by injection molding, and the fabricated circuit board is provided with pads at a plurality of locations, which can be used for soldering or packaging a plurality of electronic components.
  • the metal circuit on the circuit board can be made into a variety of circuits according to the design.
  • a circuit board made of plastic as an insulating carrier comprising: a circuit formed of a metal plate; an insulating carrier carrier formed by injection molding to form a metal circuit; and a metal circuit a pad on the pad, or a pad with a solder ring; wherein the circuit formed by the metal plate is formed by laser cutting, chemical etching, or die cutting to remove a portion of the metal that is not required for the circuit, and then using a mold or laser after injection molding Another part of the metal that is not needed for the cutting circuit, the injection molded carrier is injection molded on one or both sides of the metal, and the plastic is wrapped or embedded in the metal, so that the circuit is firmly grasped and fixed by the plastic, and one or both sides of the metal circuit board are formed after injection molding.
  • a pad formed by a plastic or a soldering hole with a solder ring wherein the pad is used to solder a chip component or directly package a chip device, wherein a soldering hole with a soldering ring is used for inserting an in-line component and soldering it a soldering ring in which a plurality of pads are provided on a plurality of locations on the circuit board for soldering and/or packaging a plurality of electronic components
  • the metal circuit on the board can be made into a variety of circuits according to the design.
  • the circuit board is a circuit board of a single layer circuit.
  • the metal plate is a copper plate, or a copper plate with tin plating on the copper surface, nickel plated on the copper surface, gold plated on the copper surface or silver plated on the copper surface.
  • the metal plate is an iron plate or an aluminum plate whose surface is plated with copper, tinned on the surface, nickel plated on the surface, silver plated on the surface or gold plated on the surface.
  • FIG. 1 is a schematic plan view of a copper plated iron plate in accordance with an embodiment of the present invention.
  • FIG. 2 is a circuit schematic of a design in accordance with an embodiment of the present invention.
  • Figure 3 is a schematic illustration of a portion of the metal that is not required for the circuit to be removed by the mold according to the design.
  • FIG. 4 is a schematic view showing injection molding of a plastic in a part of a gap in which a metal has been broken, in which an injection molded plastic is embedded in a hole or a half hole of a metal, and the metal on both sides of the slit is firmly connected and fixed together according to an embodiment of the present invention.
  • FIG. 5 is a schematic view of a circuit board made of a plastic insulating carrier by using a mold to cut another portion of the metal that is not required by the circuit according to an embodiment of the present invention.
  • Figure 6 is a schematic illustration of the back side of a circuit board of a fabricated plastic insulated carrier in accordance with an embodiment of the present invention.
  • the copper plated iron plate 1 shown in FIG. 1 is selectively cut off from a portion of the metal 1.1 which is not required for the circuit by a mold designed according to the circuit principle shown in FIG. 2, and the metal on both sides of the gap after removing the metal.
  • the hole 1.2 for fixing the injection molding plastic is cut off to form a structure of a part of the metal which is not required for the circuit mold removal circuit according to the embodiment of the present invention, as shown in FIG. 3, wherein FIG. 3 is used according to the designed circuit.
  • FIG. 3 A schematic representation of a portion of the metal that is not required for the mold removal circuit.
  • a method of cutting an undesired metal with a mold can also be obtained by a conventional chemical etching method or laser ablation method.
  • an injection mold can be used for injection molding at a portion of the slit or all the slits of the broken metal, and the injection molded plastic 2 is embedded in the hole or half hole of the metal to secure the metal on both sides of the slit.
  • the connections are secured together while the pads 2.2 that require soldering elements are exposed.
  • the injection molded plastic 2 can be injection molded on one or both sides of the circuit board according to the needs of the design circuit board, and the exposed pad 2.2 can also be disposed on one or both sides of the circuit board, as shown in FIG. 4, wherein FIG. 4 is based on
  • the injection molded plastic is embedded in a metal hole or a half hole, and the metal on both sides of the gap is firmly connected and fixed together.
  • FIG. 5 is a cut by a mold according to an embodiment of the invention.
  • FIG. 6 is a schematic view of the back side of the circuit board of the fabricated plastic insulating carrier in accordance with an embodiment of the present invention.
  • a metal plate can be used according to the designed circuit, and a part of the metal which is not required for the circuit can be removed by chemical etching or laser cutting or die cutting, and then injection molding is performed at a part of the slit or all the gaps of the broken metal, and the injection molding plastic will be
  • the metal on both sides of the gap is firmly connected and fixed together, and then the other part of the metal which is not needed for the circuit is cut by a mold or a laser to form a circuit board of a plastic insulating carrier, soldering the component on the pad of the circuit board, or directly packaging the chip device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

一种用注塑制成的由塑料做绝缘载体的电路板，具体而言，根据设计的电路，将金属板用化学蚀刻或者激光切割或者模具分切去除电路不需要的一部分金属（1.1），并在去除金属后的缝隙两边的金属上切除用于固定注塑塑料的孔或者半孔，除去部分金属的金属板仍然连为一体，然后在已断开金属的部分缝隙处或者全部缝隙处注塑，注塑塑料镶嵌在金属的孔里或者半孔里，将缝隙两边的金属牢固连接固定在一起，然后再用模具或者激光切除电路不需要的另一部分金属（1.3），制成塑料绝缘载体的电路板，在电路板上的焊点处，直接封装芯片器件，和/或在注塑形成的焊盘上用焊锡焊接元器件，电路板导热好，结构简单，生产效率高，成本低。

Description

用注塑制成的由塑料做绝缘载体的电路板
本申请要求享有申请日为2017年6月26日、申请人为马培中的中国发明专利申请“一种用注塑制成的由塑料做绝缘载体的电路板”(申请号为201710536834.8)的优先权，该中国专利申请的全部内容通过引用而结合于本申请中。
技术领域
本发明涉及电路板领域，具体涉及用注塑制成的由塑料做绝缘载体的电路板。
背景技术
传统电路板是采用酚醛树脂纸复合板、或者是用玻纤环氧树脂复合板、或者是用聚酰亚胺薄膜、或者用PET膜、或者是用陶瓷板、或者是用金属板通过绝缘热固胶和铜箔粘在一起制成覆铜板，然后通过化学腐蚀的工艺制作成电路板电路，再用油墨或者覆盖膜做阻焊形成电路板的焊盘，在焊盘上焊接元件，这种传统制作电路板的工艺流程长而繁杂，成本高，并且这种传统电路板结构中的树脂、胶、膜等材料的导热率低，导致电路板的导热传热差。
为了克服以上的缺陷和不足，本发明的一种用注塑制成的由塑料做绝缘载体的电路板，采用金属板根据设计的电路，用化学蚀刻或者激光切割或者模具分切去除电路不需要的一部分金属，然后在已断开金属的部分缝隙处或者全部缝隙处注塑，注塑塑料将缝隙两边的金属牢固连接固定在一起，然后再用模具或者激光切除电路不需要的另一部分金属，制成塑料绝缘载体的电路板，而且注塑时直接制成了焊盘，不需再做油墨或者覆盖膜形成焊盘。在电路板的焊盘上焊接元件、或者直接封装芯片器件，导热好，并且结构简单，生产效率高，成本低。
发明内容
本发明涉及一种用注塑制成的由塑料做绝缘载体的电路板，具体而言，根据设计的电路，将金属板用化学蚀刻或者激光切割或者模具分切去除电路不需要的一部分金属，并在去除金属后的缝隙两边的金属上切除用于固定注塑塑料的孔或者半孔，除去部分金属的金属板仍然连为一体，然后在已断开金属的部分缝隙处或者全部缝隙处注塑，注塑塑料镶嵌在金属的孔里或者半孔里，将缝隙两边的金属牢固连接固定在一起，然后再用模具或者激光切除电路不需要的另一部分金属，制成塑料绝缘载体的电路板，在电路板上的焊点处，直接封装芯片器件，和/或在注塑形成的焊盘上用焊锡焊接元器件，本发明的电路板导热好，结构简单，生产效率高，成本低。
根据本发明的一方面，提供了一种用注塑制成的由塑料做绝缘载体的电路板的方法，具体而言，根据设计的电路，将金属板用化学蚀刻或者激光切割或者模具分切去除电路不需要的一部分金属，除去部分金属的金属板仍然连为一体，然后在金属两面注塑或者单面注塑，金属被塑料包裹或者被镶嵌后固定住，同时注塑后保留金属上的焊点露出，焊锡焊盘由塑料包围形成，然后再用模具或者激光切除电路不需要的另一部分金属，制成塑料绝缘载体的电路板，可在电路板上的焊点处，直接封装芯片器件，和/或在注塑形成的焊盘上用焊锡焊接元器件，并且制成的电路板是在多个位置设有焊盘，可焊接或者封装多个电子元器件，电路板上的金属电路是可根据设计制成多种电路。
根据本发明的另一方面，还提供了一种用注塑制成的由塑料做绝缘载体的电路板，包括：金属板形成的电路；注塑形成的连接金属电路的绝缘承载载体；金属电路上的焊盘，或者带焊环的焊孔；其特征在于，金属板形成的电路是采用激光切割、或者化学蚀刻、或者模具冲切去除电路不需要的一部分金属，注塑后再用模具或者激光切除电路不需要的另一部分金属，注塑载体注塑在金属的一面或者两面，并 且塑料包裹或者镶嵌在金属上，使电路被塑料牢固抓牢固定成一整体，金属电路板的一面或者两面有注塑后塑料围成的焊盘或者是带焊环的焊孔，焊盘用于焊接贴片元件，或者直接封装芯片器件，或者在焊孔上插直插元件并焊在焊环上，所述绝缘塑料连接载体电路板的特征在于，在电路板上多个位置设有焊盘，可用于焊接和/或封装多个电子元器件，电路板上的金属电路是可根据设计制成多种电路。
更具体而言，根据本发明，提供了一种用注塑制成的由塑料做绝缘载体的电路板的方法，包括：根据设计的电路，将用化学蚀刻或者激光切割或者模具分切去除金属板上的电路不需要的一部分金属，其中，除去部分金属的金属板仍然连为一体；在金属板的金属两面注塑或者单面注塑，其中，金属被塑料包裹或者被镶嵌后固定住，注塑后保留金属上的焊点露出，并且焊锡焊盘由塑料包围形成；和利用模具或者激光切除金属板上的电路不需要的另一部分金属，制成塑料绝缘载体的电路板，其中，可在电路板上的焊点处直接封装芯片器件和/或在注塑形成的焊盘上用焊锡焊接元器件，并且制成的电路板在多个位置设有焊盘，可用于焊接或者封装多个电子元器件，并且，其中电路板上的金属电路可根据设计制成多种电路。
更具体而言，根据本发明，还提供了一种用注塑制成的由塑料做绝缘载体的电路板，包括：金属板形成的电路；注塑形成的连接金属电路的绝缘承载载体；和金属电路上的焊盘，或者带焊环的焊孔；其中，金属板形成的电路是这样形成的：采用激光切割、化学蚀刻或模具冲切去除电路不需要的一部分金属，注塑后再用模具或者激光切除电路不需要的另一部分金属，注塑载体注塑在金属的一面或者两面，并且塑料包裹或者镶嵌在金属上，使得电路被塑料牢固抓牢固定成一整体，金属电路板的一面或者两面形成有注塑后塑料围成的焊盘或者带焊环的焊孔，其中，焊盘用于焊接贴片元件或者直接封装芯片器件，其中，带焊环的焊孔用于在其上插直插元件并焊在焊环上，其中，在电路板上多个位置设有焊盘，可用于焊接和/或封装多个电子元器 件，电路板上的金属电路可根据设计制成多种电路。
根据本发明的一实施例，所述电路板是单层电路的电路板。
根据本发明的一实施例，所述金属板是铜板，或者是铜表面镀锡、铜表面镀镍、铜表面镀金或铜表面镀银的铜板。
根据本发明的一实施例，所述金属板是表面镀铜、表面镀锡、表面镀镍，表面镀银或表面镀金的铁板或者铝板。
在以下对附图和具体实施方式的描述中，将阐述本发明的一个或多个实施例的细节。从这些描述、附图以及权利要求中，可以清楚本发明的其它特征、目的和优点。
附图说明
结合在说明书中并构成说明书一部分的附图图示了本发明的实施例，并且与说明一起用于解释和说明本发明的原理和一些具体实施方案。
本说明书中描述了针对本领域普通技术人员的本发明的完整而能够实施的公开，包括其优选实施方式，其中引用了附图，这些附图仅仅是为了图示和辅助描述具体实施例起见，而不具有任何限制性，并且附图中的尺寸并非严格按照比例绘制。
这些附图包括：
图1为根据本发明一实施例的镀铜的铁板的平面示意图。
图2为根据本发明一实施例的设计的电路原理图。
图3为根据设计的电路用模具去除电路不需要的一部分金属的示意图。
图4为根据本发明一实施例的在已断开金属的部分缝隙处注塑，注塑的塑料镶嵌在金属的孔里或者半孔里，将缝隙两边的金属牢固连接固定在一起的示意图。
图5为根据本发明一实施例的用模具切除电路不需要的另一部分金属，制成塑料绝缘载体的电路板的示意图。
图6为根据本发明一实施例的制成的塑料绝缘载体的电路板的背面的示意图。
具体实施方式
下面将对本发明一种用注塑制成的由塑料做绝缘载体的电路板的具体实施例进行更详细的描述。
但是，这些具体实施例仅起到具体说明和演示本发明的作用，对本发明的范围无任何限制。本发明的保护范围仅由所附权利要求来限定。
将如图1所示的镀铜的铁板1，用根据如图2所示电路原理设计的模具，选择性地切除掉电路不需要的一部分金属1.1，同时在去除金属后的缝隙两边的金属上切除用于固定注塑塑料用孔1.2，形成本发明一实施例的根据设计的电路用模具去除电路不需要的一部分金属后的结构，如图3所示，其中图3是根据设计的电路用模具去除电路不需要的一部分金属的示意图。但是，本领域的技术人员可以理解，此种用模具切除不需要的金属的方法，同样也可以采用传统的化学蚀刻的方法、或者激光切除的方法得到。
然后，根据本发明的一实施例，例如可用注塑模具在已断开金属的部分缝隙处或者全部缝隙处注塑，注塑的塑料2镶嵌在金属的孔里或者半孔里，将缝隙两边的金属牢固连接固定在一起，同时将需要焊接元件的焊盘2.2露出。当然，注塑的塑料2可根据设计电路板的需要注塑在电路板的一面或者两面，露出的焊盘2.2也可以设在电路板的一面或者两面，如图4所示，其中，图4为根据本发明一实施例的在已断开金属的部分缝隙处注塑，注塑的塑料镶嵌在金属的孔里或者半孔里，将缝隙两边的金属牢固连接固定在一起的示意图。
之后，再用模具切除电路不需要的另一部分金属1.3，制成根据本发明的优选实施例的用注塑制成的由塑料做绝缘载体的电路板，例如如图5、图6所示。其中，图5是根据本发明一实施例的用模具切 除电路不需要的另一部分金属，制成塑料绝缘载体的电路板的示意图；图6是根据本发明一实施例的制成的塑料绝缘载体的电路板的背面的示意图。
根据本发明，可采用金属板根据设计的电路，可用化学蚀刻或者激光切割或者模具分切去除电路不需要的一部分金属，然后在已断开金属的部分缝隙处或者全部缝隙处注塑，注塑塑料将缝隙两边的金属牢固连接固定在一起，然后再用模具或者激光切除电路不需要的另一部分金属，制成塑料绝缘载体的电路板，在电路板的焊盘上焊接元件、或者直接封装芯片器件，导热好，并且结构简单，生产效率高，成本低。
以上结合附图针对用注塑制成的由塑料做绝缘载体的电路板的具体实施例对本发明进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本发明的范围，尤其是权利要求的范围，并不具有任何限制。本发明的范围由所附权利要求来限定。

Claims (8)

  1. 一种用注塑制成的由塑料做绝缘载体的电路板的方法，包括：
    根据设计的电路，将用化学蚀刻或者激光切割或者模具分切去除金属板上的电路不需要的一部分金属，其中，除去部分金属的金属板仍然连为一体；
    在金属板的金属两面注塑或者单面注塑，其中，金属被塑料包裹或者被镶嵌后固定住，注塑后保留金属上的焊点露出，并且焊锡焊盘由塑料包围形成；和
    利用模具或者激光切除金属板上的电路不需要的另一部分金属，制成塑料绝缘载体的电路板，
    其中，可在电路板上的焊点处直接封装芯片器件和/或在注塑形成的焊盘上用焊锡焊接元器件，并且制成的电路板在多个位置设有焊盘，可用于焊接或者封装多个电子元器件，并且，其中电路板上的金属电路可根据设计制成多种电路。
  2. 根据权利要求1所述的方法，其特征在于，所述电路板是单层电路的电路板。
  3. 根据权利要求1所述的方法，其特征在于，所述金属板是铜板，或者是铜表面镀锡、铜表面镀镍、铜表面镀金或铜表面镀银的铜板。
  4. 根据权利要求1所述的方法，其特征在于，所述金属板是表面镀铜、表面镀锡、表面镀镍，表面镀银或表面镀金的铁板或者铝板。
  5. 一种用注塑制成的由塑料做绝缘载体的电路板，包括：
    金属板形成的电路；
    注塑形成的连接金属电路的绝缘承载载体；和
    金属电路上的焊盘，或者带焊环的焊孔；
    其中，所述金属板形成的电路是这样形成的：采用激光切割、化学蚀刻或模具冲切去除电路不需要的一部分金属，注塑后再用模具或者激光切除电路不需要的另一部分金属，注塑载体注塑在金属的一面 或者两面，并且塑料包裹或者镶嵌在金属上，使得电路被塑料牢固抓牢固定成一整体，金属电路板的一面或者两面形成有注塑后塑料围成的焊盘或者带焊环的焊孔，其中，焊盘用于焊接贴片元件或者直接封装芯片器件，其中，带焊环的焊孔用于在其上插直插元件并焊在焊环上，其中，在电路板上多个位置设有焊盘，可用于焊接和/或封装多个电子元器件，电路板上的金属电路可根据设计制成多种电路。
  6. 根据权利要求5所述的电路板，其特征在于，所述电路板是单层电路的电路板。
  7. 根据权利要求5所述的电路板，其特征在于，所述金属板是铜板，或者是铜表面镀锡、铜表面镀镍、铜表面镀金或铜表面镀银的铜板。
  8. 根据权利要求5所述的电路板，其特征在于，所述金属板是表面镀铜、表面镀锡、表面镀镍，表面镀银或表面镀金的铁板或者铝板。
PCT/CN2017/109169 2017-06-26 2017-11-02 用注塑制成的由塑料做绝缘载体的电路板 WO2019000773A1 (zh)

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