WO2018230189A1 - Composition de silicone thermoconductrice - Google Patents

Composition de silicone thermoconductrice Download PDF

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Publication number
WO2018230189A1
WO2018230189A1 PCT/JP2018/017750 JP2018017750W WO2018230189A1 WO 2018230189 A1 WO2018230189 A1 WO 2018230189A1 JP 2018017750 W JP2018017750 W JP 2018017750W WO 2018230189 A1 WO2018230189 A1 WO 2018230189A1
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Prior art keywords
component
group
compounds
silicone composition
conductive silicone
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PCT/JP2018/017750
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English (en)
Japanese (ja)
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謙一 辻
野歩 加藤
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信越化学工業株式会社
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Publication of WO2018230189A1 publication Critical patent/WO2018230189A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Definitions

  • the present invention relates to a thermally conductive silicone composition in which the hardness after curing does not increase and the initial curing rate does not decrease even when exposed to a high temperature for a long time.
  • Electronic parts such as LSIs and IC chips are widely known to generate heat during use and performance degradation associated therewith, and various heat dissipation techniques are used as means for solving this.
  • a heat sink or other cooling application member is placed near the heat generating part, and by bringing them into close contact with each other, efficient heat transfer to the cooling member is promoted to cool the heat generation, thereby efficiently dissipating the heat from the heat generating part. It is known to do. At this time, if there is a gap between the heat generating member and the cooling member, heat transfer becomes inefficient due to the presence of air having low heat conductivity, and the temperature of the heat generating member cannot be sufficiently lowered.
  • a heat-dissipating material, a heat-dissipating sheet or a heat-dissipating grease having a good thermal conductivity and following the surface of the member is used for the purpose of preventing the air from interposing between the heat-generating member and the cooling member ( Japanese Patent No. 2938428, Japanese Patent No. 2938429, Japanese Patent No. 3952184: Patent Documents 1 to 3).
  • the heat dissipating grease exhibits a high performance from the viewpoint of thermal resistance because it can be used with a reduced thickness when mounted.
  • thermal grease Some types are used after being cured between heat and heat.
  • the heat-cured heat-dissipating grease is further heated when the element is in operation, so that the hardness may increase during use. If the hardness increases, there is a concern that the material becomes inflexible and cannot follow the “sleigh” during operation. When the follow-up cannot be performed, a gap is generated between the member and the heat-dissipating grease, so that the heat-dissipating characteristics are deteriorated.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thermally conductive silicone composition in which the increase in hardness during high-temperature aging after curing is small and at the same time, the decrease in the curing rate is suppressed.
  • E hydrogenated organohydrogenpolysiloxane
  • F platinum compounds
  • G triazole compounds
  • isocyanate compounds each containing a specific ratio
  • the present invention provides the following thermally conductive silicone composition.
  • (A) Organopolysiloxane having at least two alkenyl groups in one molecule and a kinematic viscosity at 25 ° C. of 10 to 100,000 mm 2 / s
  • (B) The following general formula (1) (In the formula, R 1 is an alkyl group having 1 to 6 carbon atoms, and a is a positive number having 5 to 100.)
  • One-terminal trifunctional hydrolyzable methylpolysiloxane represented by: (A) 10 to 150 parts by mass with respect to 100 parts by mass of component (C) Thermally conductive filling having a thermal conductivity of 10 W / m ⁇ ° C.
  • reaction control agent selected from acetylene compounds, nitrogen compounds, organic phosphorus compounds, oxime compounds and organic chloro compounds: an amount of 0.1 to 5% by mass based on component (A) [1 ]-The heat conductive silicone composition in any one of [5].
  • the thermally conductive silicone composition of the present invention can suppress the increase in hardness during high-temperature aging of the cured product and suppress the decrease in the curing rate by blending specific amounts of triazole compound and isocyanate compound, respectively. it can.
  • the organopolysiloxane of component (A) constituting the present invention has at least 2, preferably 2 to 10, more preferably 2 to 5, alkenyl groups directly bonded to silicon atoms in one molecule.
  • the chain may be branched or branched, and a mixture of two or more different viscosities may be used.
  • alkenyl group examples include those having 2 to 6 carbon atoms such as a vinyl group, an allyl group, a 1-butenyl group, and a 1-hexenyl group, but a vinyl group is preferable from the viewpoint of ease of synthesis and cost.
  • the remaining organic group bonded to the silicon atom is preferably an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, particularly 1 to 6 carbon atoms and not containing an aliphatic unsaturated bond.
  • alkyl groups such as methyl group, ethyl group, propyl group, butyl group, hexyl group and dodecyl group, aryl groups such as phenyl group, aralkyl groups such as 2-phenylethyl group and 2-phenylpropyl group, etc.
  • aryl groups such as phenyl group
  • aralkyl groups such as 2-phenylethyl group and 2-phenylpropyl group
  • halogen-substituted hydrocarbon groups such as chloromethyl group and 3,3,3-trifluoropropyl group.
  • a methyl group is preferred from the viewpoint of ease of synthesis and cost.
  • the alkenyl group bonded to the silicon atom may be present at either the terminal or the middle of the molecular chain of the organopolysiloxane, but is preferably present at least at the terminal.
  • the kinematic viscosity of the component (A) measured at 25 ° C. with an Ostwald meter is in the range of 10 to 100,000 mm 2 / s, preferably in the range of 100 to 50,000 mm 2 / s, and more preferably in the range of 100 to 1,000 mm 2 / s is preferable. If the kinematic viscosity is less than 10 mm 2 / s, the oil bleed of the composition will be severe and the reliability will be poor, and if it exceeds 100,000 mm 2 / s, the viscosity of the composition will increase and the extensibility will be poor. .
  • component (A) for example, dimethylpolysiloxane blocked with a dimethylvinylsiloxy group blocked at both ends of the molecular chain, and one end of the molecular chain blocked with a dimethylvinylsiloxy group and the other end of the molecular chain blocked with a trimethylsiloxy group Siloxane / methylvinylpolysiloxane copolymer, molecular chain both ends trimethylsiloxy group-blocked dimethylsiloxane / methylvinylsiloxane copolymer, molecular chain both ends trimethylsiloxy group-blocked methylvinylpolysiloxane, molecular chain both ends dimethylvinylsiloxy group-blocked Examples thereof include, but are not limited to, a dimethylsiloxane / methylvinylsiloxane copolymer, and two or more of these may be used in combination.
  • the component (B) has the following general formula (1) (Wherein R 1 is an alkyl group having 1 to 6 carbon atoms, such as a methyl group, an ethyl group, a propyl group, a butyl group, or a hexyl group, and a is a positive number of 5 to 100.) Is a one-terminal trifunctional hydrolyzable methylpolysiloxane.
  • the oil bleed of the composition becomes so bad that the reliability becomes worse. If it is large, the wettability is not sufficient, so it is a positive number of 5 to 100, preferably in the range of 10 to 60.
  • this one-terminal trifunctional hydrolyzable methylpolysiloxane is less than 10 parts by mass with respect to 100 parts by mass of component (A), sufficient wettability cannot be exhibited, and if more than 150 parts by mass, oil bleed Is in the range of 10 to 150 parts by mass, preferably 20 to 140 parts by mass.
  • the component (C) is a thermally conductive filler having a thermal conductivity of 10 W / m ⁇ ° C. or higher.
  • the thermally conductive filler of component (C) those having a thermal conductivity of 10 W / m ⁇ ° C. or higher, preferably 15 W / m ⁇ ° C. or higher are used. This is because if the thermal conductivity of the filler is less than 10 W / m ⁇ ° C., the thermal conductivity of the thermally conductive silicone composition itself becomes small.
  • Such heat conductive fillers include aluminum powder, copper powder, silver powder, iron powder, nickel powder, gold powder, tin powder, metal silicon powder, aluminum nitride powder, boron nitride powder, alumina powder, diamond powder, carbon powder. Indium powder, gallium powder, zinc oxide powder, etc., any filler may be used as long as it is 10 W / m ⁇ ° C. or more, and one or a mixture of two or more may be used.
  • the average particle size of the component (C) is preferably in the range of 0.1 to 100 ⁇ m, more preferably in the range of 0.1 to 90 ⁇ m, and still more preferably in the range of 0.1 to 20 ⁇ m. If the average particle size is less than 0.1 ⁇ m, the resulting composition may not be in the form of grease and may have poor extensibility. If the average particle size is greater than 100 ⁇ m, the thermal resistance of the heat dissipating grease will increase and the performance will deteriorate. This is because there are cases. In the present invention, the average particle diameter can be measured by Nikkiso Co., Ltd. Microtrac MT330OEX, and is a volume-based volume average diameter.
  • the shape of the component (C) may be indefinite, spherical, or any shape.
  • the amount of the (C) component is less than 500 parts by mass with respect to 100 parts by mass of the total of the (A) component and the (B) component, the thermal conductivity of the composition becomes low and 3,000 parts by mass. If it is more, the viscosity of the composition increases and the extensibility becomes poor. Therefore, it is in the range of 500 to 3,000 parts by mass, preferably in the range of 500 to 2,800 parts by mass, more preferably 500 A range of ⁇ 2,500 parts by mass is preferable.
  • the organohydrogenpolysiloxane of component (D) has at least two, preferably 2 to 50, hydrogen atoms (Si—H groups) directly linked to silicon atoms in order to reticulate the composition by crosslinking. More preferably, it is necessary to have 2 to 30.
  • the Si—H group may be located at either the molecular chain end or in the middle of the molecular chain, or may be located at both.
  • the remaining organic group other than the Si—H group bonded to the silicon atom is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, particularly 1 to 6 carbon atoms and not containing an aliphatic unsaturated bond.
  • an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group or a dodecyl group, an aryl group such as a phenyl group, a 2-phenylethyl group, or a 2-phenylpropyl group
  • halogen-substituted hydrocarbon groups such as aralkyl group, chloromethyl group, 3,3,3-trifluoropropyl group, etc., and 2-glycidoxyethyl group, 3-glycidoxypropyl group, 4- Examples include epoxy-substituted hydrocarbon groups such as glycidoxybutyl groups.
  • Such an organohydrogenpolysiloxane having a Si—H group may be linear, branched or cyclic, or a mixture thereof.
  • the number of silicon atoms in the organohydrogenpolysiloxane is preferably 10 to 250, particularly 10 to 200.
  • This organohydrogenpolysiloxane may be used alone or in combination of two or more.
  • Examples of the component (D) include a copolymer comprising (CH 3 ) 2 HSiO 1/2 units and (CH 3 ) 2 SiO units, (CH 3 ) 2 HSiO 1/2 units and (CH 3 ) 3 SiO.
  • a copolymer comprising 1/2 units and (CH 3 ) 2 SiO units a copolymer comprising (CH 3 ) 3 SiO 1/2 units, (CH 3 ) 2 SiO units and (CH 3 ) HSiO units
  • a copolymer comprising units and (CH 3 ) HSiO units a copolymer comprising (CH 3 ) 2 HSiO 1/2 units, (CH 3 ) 2 SiO units and (CH 3 ) HSiO units, (CH 3 ) 3 SiO
  • the blending amount of the component (D) is such that the composition cannot be reticulated sufficiently if the ⁇ number of Si—H groups in the component (D) ⁇ / ⁇ number of alkenyl groups in the component (A) ⁇ is less than 0.5. Is pumped out, and if it is larger than 1.5, the crosslinking density becomes too high and peels off during the reliability test, so the range is 0.5 to 1.5, preferably 0.7. A range of ⁇ 1.3 is good.
  • the catalyst selected from platinum and platinum compounds as the component (E) is a component for promoting the addition reaction between the alkenyl group in the component (A) and the Si—H group in the component (D).
  • Examples of the component (E) include platinum alone, chloroplatinic acid, platinum-olefin complexes, platinum-alcohol complexes, platinum coordination compounds, and the like.
  • the amount of component (E) is less than 0.1 ppm as platinum atoms with respect to the mass of component (A), and there is no effect as a catalyst. Therefore, it is in the range of 0.1 to 500 ppm, preferably 0.1 to 400 ppm.
  • the (F) component triazole compound, together with the component (G) described later, is added to the composition at a specific blending amount to suppress a decrease in the curing rate of the thermally conductive silicone composition, and after curing.
  • the increase in hardness during high temperature aging can be suppressed.
  • Examples of the (F) component triazole-based compound include 1,2,3-triazole, 1,2,4-triazole, and derivatives thereof.
  • the derivatives of 1,2,3-triazole include benzotriazole, 4-hydroxy-1,2,3-triazole, 1,2,3-triazole-4-aldehyde, 4-cyano-1,2 , 3-triazole and the like.
  • Examples of the 1,2,4-triazole derivatives include 5-amino-3-methyl-1,2,4-triazole, 3-mercapto-1,2,4-triazole and the like.
  • preferred are benzotriazole, 1,2,3-triazole, and 1,2,4-triazole, and most preferred is benzotriazole. These may be used alone or in combination of two or more.
  • the compounding amount of component (F) is 2 to 1,000 mol, preferably 2 to 800 mol, more preferably 2 to 500 mol, per 1 mol of platinum atom in component (E). If the blending amount is less than 2 mol, the increase in hardness cannot be sufficiently suppressed, and if it is more than 1,000 mol, the curing rate becomes slow.
  • Examples of the isocyanate compound as component (G) include alkyl isocyanate compounds such as methyl isocyanate, butyl isocyanate and octyl isocyanate, aryl isocyanate compounds such as phenyl isocyanate and tolyl isocyanate, and further, for example, the following general formula (2) And an isocyanate silane compound containing an isocyanate group and a silyl group, as shown in FIG. (Wherein R 2 represents an alkyl group or a trialkylsilyl group, and b represents an integer of 1 to 6)
  • the alkyl group represented by R 2 is preferably one having 1 to 4 carbon atoms, particularly a methyl group or ethyl group, and the alkyl group of the trialkylsilyl group is also one having 1 to 4 carbon atoms, particularly a methyl group or ethyl group.
  • the alkyl group represented by R 2 is preferably one having 1 to 4 carbon atoms, particularly a methyl group or ethyl group
  • the alkyl group of the trialkylsilyl group is also one having 1 to 4 carbon atoms, particularly a methyl group or ethyl group.
  • a trimethylsilyl group and a triethylsilyl group are preferable.
  • octyl isocyanate 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, and 3-isocyanatopropyltris (trimethylsiloxy) silane are most preferred. These may be used alone or in combination of two or more.
  • the amount of component (G) is 0.1 to 10 moles, preferably 0.5 to 5 moles, and more preferably 0.5 to 2 moles per mole of component (F). If the blending amount is less than 0.1 mol, the curing rate decreases, and if it exceeds 10 mol, the hardness increase after aging cannot be sufficiently suppressed.
  • a reaction control agent in the thermally conductive silicone composition of the present invention, can be further blended as the component (H) for the purpose of suppressing the catalytic activity of the component (E).
  • the reaction control agent of component (H) suppresses the progress of the hydrosilylation reaction at room temperature and extends shelf life and pot life.
  • Known reaction control agents can be used, and acetylene compounds, various nitrogen compounds, organic phosphorus compounds, oxime compounds, organic chloro compounds, and the like can be used.
  • the blending amount of the component (H) is less than 0.1% by mass relative to the component (A), sufficient shelf life and pot life may not be obtained. Since the speed may decrease, the range of 0.1 to 5% by mass is preferable, and the range of 0.1 to 4% by mass is particularly preferable. These may be used by diluting with a solvent such as toluene in order to improve dispersibility in the heat conductive silicone composition.
  • an antioxidant or the like may be added to the thermally conductive silicone composition of the present invention as necessary in order to prevent deterioration.
  • the components (A) to (H) are trimix, twin mix, planetary mixer (all are registered trademarks of a mixer manufactured by Inoue Seisakusho Co., Ltd.), ultra mixer It can be produced by mixing with a mixer such as (registered trademark of Mizuho Kogyo Co., Ltd.), Hibis Disper Mix (registered trademark of Special Kikai Kogyo Co., Ltd.).
  • the absolute viscosity at 25 ° C. of the obtained heat conductive silicone composition measured with a rotational viscometer is preferably 5 to 2,000 Pa ⁇ s, particularly 10 to 900 Pa ⁇ s.
  • the obtained heat conductive silicone composition can be made into a cured product by heating at 80 to 180 ° C., particularly 90 to 170 ° C. for 30 to 150 minutes, particularly 30 to 140 minutes.
  • the thermally conductive silicone composition of the present invention can suppress a decrease in curing rate, and the cured product of the composition can suppress an increase in hardness during high-temperature aging. It can use suitably as a use of the heat conductive material to a cooling member.
  • the heat conductive silicone composition was applied in a thickness of 2 mm between two parallel plates having a diameter of 2.5 cm. After the temperature of the coated plate was increased from 25 ° C. at 5 ° C./min, a program was created to maintain the temperature at 150 ° C. for 90 minutes, and the storage elastic modulus G ′ and loss elastic modulus G ′′ were measured. . The time when the value of the storage elastic modulus G ′ exceeded the loss elastic modulus G ′′ was defined as the crossover time, and was used as an index of the curing rate. The measurement was carried out using a viscoelasticity measuring device (Type ARES-G2 manufactured by TA Instruments).
  • the thermally conductive silicone composition was poured into a 6 cm ⁇ 6 cm ⁇ 6 mm mold and heated at 150 ° C. for 90 minutes to prepare a sheet-like sample. About what superposed
  • thermo resistance measurement A heat conductive silicone composition is sandwiched between a 15 mm ⁇ 15 mm ⁇ 1 mmt Si chip and a 15 mm ⁇ 15 mm ⁇ 1 mmt Ni plate so as to have a thickness of 80 ⁇ m, compressed at 0.7 MPa for 15 minutes, and then loaded. The sample was placed in an oven at 150 ° C. for 90 minutes with heat applied, and the thermally conductive silicone composition was heated and cured to prepare a test piece for measuring thermal resistance. Further, after that, a heat cycle test (-55 ° C. to 125 ° C.) was carried out for 500 cycles, and changes in thermal resistance were observed. In addition, this thermal resistance measurement was performed by nanoflash (the Niche company make, LFA447).
  • the following components were prepared in order to prepare the thermally conductive silicone composition of the present invention.
  • Component A-1 Dimethylpolysiloxane having both ends blocked with dimethylvinylsilyl groups and a kinematic viscosity at 25 ° C. of 600 mm 2 / s
  • Component (C) The following aluminum powder or alumina powder and zinc oxide powder were mixed for 15 minutes at room temperature using a 5-liter planetary mixer (manufactured by Inoue Seisakusho Co., Ltd.) at the mass mixing ratio shown in Table 1 below. 1 or C-2 was obtained.
  • Aluminum powder with an average particle size of 10 ⁇ m (thermal conductivity: 236 W / m ⁇ ° C.)
  • G Component G-1: 3-isocyanatopropyltriethoxysilane
  • G-2 3-isocyanatopropyltrimethoxysilane
  • G-3 3-isocyanatopropyltris (trimethylsiloxy) silane
  • the components (A) to (H) were mixed as follows to obtain thermally conductive silicone compositions of Examples 1 to 6 and Comparative Examples 1 to 6. That is, take the component (A) into a 5 liter planetary mixer (manufactured by Inoue Seisakusho Co., Ltd.), add the components (B) and (C) in the amounts shown in Tables 2 and 3, and mix at 170 ° C. for 1 hour. did. The mixture was cooled to room temperature, and then the components (D), (E), (F), (G), and (H) were added in the blending amounts shown in Tables 2 and 3 and mixed to be uniform.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

L'invention concerne une composition de silicone thermoconductrice qui présente, après durcissement, une faible augmentation de dureté lorsqu'elle est vieillie à une température élevée, toute diminution de la vitesse de durcissement étant également limitée, la composition contenant (A) un organopolysiloxane ayant au moins deux groupes alcényle par molécule, et ayant une viscosité cinématique de 10 à 100 000 mm2/s à 25 °C, (B) un polysiloxane méthyle hydrolysable ayant trois groupes fonctionnels à une de ses extrémités, (C) une charge thermoconductrice ayant une conductivité thermique de 10 W/m·°C ou plus, (D) un organohydrogénopolysiloxane ayant des atomes d'hydrogène liés directement à au moins deux atomes de silicium par molécule, (E) un catalyseur choisi dans le groupe constitué par le platine et les composés du platine, (F) une quantité spécifique d'un composé triazole, et (G) une quantité spécifique d'un composé isocyanate.
PCT/JP2018/017750 2017-06-15 2018-05-08 Composition de silicone thermoconductrice WO2018230189A1 (fr)

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JP2017117347A JP6943028B2 (ja) 2017-06-15 2017-06-15 熱伝導性シリコーン組成物

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020149335A1 (fr) * 2019-01-17 2020-07-23 バンドー化学株式会社 Feuille thermoconductrice
WO2021235214A1 (fr) * 2020-05-22 2021-11-25 信越化学工業株式会社 Composition de silicone hautement thermoconductrice

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022185620A (ja) * 2021-06-03 2022-12-15 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004168920A (ja) * 2002-11-21 2004-06-17 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンエラストマー組成物
JP2017031364A (ja) * 2015-08-05 2017-02-09 信越化学工業株式会社 付加硬化性シリコーンゴム組成物
WO2018079309A1 (fr) * 2016-10-26 2018-05-03 信越化学工業株式会社 Composition de silicone thermoconductrice

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004168920A (ja) * 2002-11-21 2004-06-17 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンエラストマー組成物
JP2017031364A (ja) * 2015-08-05 2017-02-09 信越化学工業株式会社 付加硬化性シリコーンゴム組成物
WO2018079309A1 (fr) * 2016-10-26 2018-05-03 信越化学工業株式会社 Composition de silicone thermoconductrice

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020149335A1 (fr) * 2019-01-17 2020-07-23 バンドー化学株式会社 Feuille thermoconductrice
JP6754917B1 (ja) * 2019-01-17 2020-09-16 バンドー化学株式会社 熱伝導性シート
WO2021235214A1 (fr) * 2020-05-22 2021-11-25 信越化学工業株式会社 Composition de silicone hautement thermoconductrice
JPWO2021235214A1 (fr) * 2020-05-22 2021-11-25
JP7371249B2 (ja) 2020-05-22 2023-10-30 信越化学工業株式会社 高熱伝導性シリコーン組成物

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