TW201906934A - 熱傳導性矽氧烷組成物 - Google Patents

熱傳導性矽氧烷組成物 Download PDF

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Publication number
TW201906934A
TW201906934A TW107116717A TW107116717A TW201906934A TW 201906934 A TW201906934 A TW 201906934A TW 107116717 A TW107116717 A TW 107116717A TW 107116717 A TW107116717 A TW 107116717A TW 201906934 A TW201906934 A TW 201906934A
Authority
TW
Taiwan
Prior art keywords
component
thermally conductive
compounds
silicone composition
conductive silicone
Prior art date
Application number
TW107116717A
Other languages
English (en)
Chinese (zh)
Inventor
辻謙一
加藤野歩
Original Assignee
日商信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TW201906934A publication Critical patent/TW201906934A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
TW107116717A 2017-06-15 2018-05-17 熱傳導性矽氧烷組成物 TW201906934A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-117347 2017-06-15
JP2017117347A JP6943028B2 (ja) 2017-06-15 2017-06-15 熱伝導性シリコーン組成物

Publications (1)

Publication Number Publication Date
TW201906934A true TW201906934A (zh) 2019-02-16

Family

ID=64661001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107116717A TW201906934A (zh) 2017-06-15 2018-05-17 熱傳導性矽氧烷組成物

Country Status (3)

Country Link
JP (1) JP6943028B2 (fr)
TW (1) TW201906934A (fr)
WO (1) WO2018230189A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020149335A1 (fr) * 2019-01-17 2020-07-23 バンドー化学株式会社 Feuille thermoconductrice
EP4155347A4 (fr) * 2020-05-22 2024-06-05 Shin-Etsu Chemical Co., Ltd. Composition de silicone hautement thermoconductrice
JP7523870B2 (ja) 2021-06-03 2024-07-29 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4676671B2 (ja) * 2002-11-21 2011-04-27 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー組成物
JP6344333B2 (ja) * 2015-08-05 2018-06-20 信越化学工業株式会社 付加硬化性シリコーンゴム組成物
US10844196B2 (en) * 2016-10-26 2020-11-24 Shin-Etsu Chemical Co., Ltd. Thermally-conductive silicone composition

Also Published As

Publication number Publication date
JP2019001900A (ja) 2019-01-10
WO2018230189A1 (fr) 2018-12-20
JP6943028B2 (ja) 2021-09-29

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