WO2018199022A1 - 電子素子搭載用基板、電子装置および電子モジュール - Google Patents

電子素子搭載用基板、電子装置および電子モジュール Download PDF

Info

Publication number
WO2018199022A1
WO2018199022A1 PCT/JP2018/016457 JP2018016457W WO2018199022A1 WO 2018199022 A1 WO2018199022 A1 WO 2018199022A1 JP 2018016457 W JP2018016457 W JP 2018016457W WO 2018199022 A1 WO2018199022 A1 WO 2018199022A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electronic element
element mounting
main surface
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/016457
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
登 北住
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to US16/607,754 priority Critical patent/US20200144153A1/en
Priority to CN201880024054.8A priority patent/CN110495258B/zh
Priority to EP18791890.9A priority patent/EP3618583A4/en
Priority to JP2019514489A priority patent/JP7189128B2/ja
Publication of WO2018199022A1 publication Critical patent/WO2018199022A1/ja
Anticipated expiration legal-status Critical
Priority to JP2022153129A priority patent/JP2022180570A/ja
Priority to US18/590,248 priority patent/US20240203818A1/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Definitions

  • the present invention relates to an electronic element mounting substrate, an electronic device, and an electronic module.
  • an electronic element mounting substrate has an insulating substrate having a first main surface, a second main surface, and side surfaces, and an electronic element mounting portion and a wiring layer located on the first main surface of the insulating substrate. Yes.
  • an electronic element mounting substrate an electronic element is mounted on an electronic element mounting portion, and then mounted on an electronic element mounting package to form an electronic device (see, for example, JP 2013-175508 A).
  • the electronic element mounting substrate of the present disclosure includes a substrate having a rectangular shape having a first main surface and a second main surface opposite to the first main surface, and embedded in a continuous manner with the substrate, and made of a carbon material.
  • a heat dissipating body having a third main surface located on the first main surface side in the thickness direction and a fourth main surface opposite to the third main surface. The heat conduction in the direction perpendicular to the direction in which the heat radiators are connected is greater than the heat conduction in the direction in which the heat radiators are connected.
  • An electronic device includes an electronic element mounting substrate having the above-described configuration, an electronic element mounted on the mounting portion of the electronic element mounting substrate, and a wiring board or electronic element mounted with the electronic element mounting substrate. And a storage package.
  • the electronic module of the present disclosure includes the electronic device having the above-described configuration and a module substrate to which the electronic device is connected.
  • FIG. 1 is a top view which shows the board
  • (b) is a bottom view of (a). It is the perspective view which decomposed
  • (A) is a top view showing a state in which an electronic element is mounted on the electronic element mounting substrate shown in FIG. 1 (a), and (b) is a longitudinal sectional view taken along line BB in (a). is there.
  • FIG. 5A is a longitudinal sectional view taken along line AA of the electronic element mounting substrate shown in FIG. 5A
  • FIG. 5B is an electronic element mounting substrate shown in FIG. It is a longitudinal cross-sectional view in the BB line.
  • FIG. 5A is a top view showing a state in which an electronic element is mounted on the electronic element mounting substrate shown in FIG. 5A
  • FIG. 5B is a longitudinal sectional view taken along line BB in FIG. is there.
  • FIG. 9A is a top view which shows the board
  • (b) is a bottom view of (a). It is the perspective view which decomposed
  • FIG. 9B is an electronic element mounting substrate shown in FIG. 9A. It is a longitudinal cross-sectional view in the BB line.
  • (A) is a top view showing a state in which an electronic element is mounted on the electronic element mounting substrate shown in FIG. 9 (a), and (b) is a longitudinal sectional view taken along line BB in (a). is there.
  • FIG. 14 is an exploded perspective view of a substrate and a heat dissipating body of the electronic element mounting substrate shown in FIG.
  • FIG. 13A is a longitudinal sectional view taken along line AA of the electronic element mounting substrate shown in FIG. 13A
  • FIG. 13B is an electronic element mounting substrate shown in FIG. It is a longitudinal cross-sectional view in the BB line.
  • (A) is a top view showing a state in which an electronic element is mounted on the electronic element mounting substrate shown in FIG. 13 (a), and (b) is a longitudinal sectional view taken along line BB in (a). is there.
  • FIG. 18 is an exploded perspective view of a substrate and a heat radiating body of the electronic element mounting substrate shown in FIG.
  • FIG. 17A is a longitudinal sectional view taken along the line AA of the electronic element mounting substrate shown in FIG. 17A
  • FIG. 17B is an electronic element mounting substrate shown in FIG. It is a longitudinal cross-sectional view in the BB line.
  • (A) is a top view showing a state in which an electronic element is mounted on the electronic element mounting substrate shown in FIG. 17 (a), and (b) is a longitudinal sectional view taken along line BB in (a). is there.
  • FIG. 22 is an exploded perspective view of a substrate and a heat radiator of the electronic element mounting substrate shown in FIG.
  • FIG. 21A is a longitudinal sectional view taken along the line AA of the electronic element mounting substrate shown in FIG. 21A
  • FIG. 21B is an electronic element mounting substrate shown in FIG. It is a longitudinal cross-sectional view in the BB line.
  • (A) is a top view showing a state in which an electronic element is mounted on the electronic element mounting substrate shown in FIG. 21 (a), and (b) is a longitudinal sectional view taken along line BB in (a). is there.
  • FIG. 27 is an exploded perspective view of a substrate and a heat dissipating body of the electronic element mounting substrate shown in FIG. 26A is a longitudinal sectional view taken along line AA of the electronic element mounting substrate shown in FIG. 26A, and FIG. 26B is an electronic element mounting substrate shown in FIG. It is a longitudinal cross-sectional view in the BB line.
  • FIG. 32 is an exploded perspective view of a substrate and a heat radiator of the electronic element mounting substrate shown in FIG. 31.
  • FIG. 31A is a longitudinal sectional view taken along the line AA of the electronic element mounting substrate shown in FIG. 31A
  • FIG. 31B is an electronic element mounting substrate shown in FIG. It is a longitudinal cross-sectional view in the BB line.
  • FIG. 31A is a top view showing a state in which an electronic element is mounted on the electronic element mounting substrate shown in FIG. 31A
  • FIG. 31B is a longitudinal sectional view taken along line BB in FIG. is there.
  • (A) is a top view which shows the other example of the board
  • (b) is a bottom view of (a).
  • the electronic element mounting substrate 1 in the first embodiment includes a substrate 11, a substrate 11, and a heat radiating body 12, as in the example shown in FIGS.
  • the electronic device includes an electronic element substrate 1, an electronic element 2 mounted on an electronic element mounting substrate mounting portion 11 a, and a wiring substrate 3 on which the electronic element mounting substrate 1 is mounted.
  • the electronic device is connected to a connection pad on a module substrate constituting the electronic module by using a bonding material.
  • the electronic element mounting substrate 1 in the present embodiment is embedded in a continuous manner with a substrate 11 having a rectangular shape having a first main surface 111 and a second main surface 112 opposite to the first main surface 111, It has a third main surface 121 made of a carbon material and located on the first main surface 111 side in the thickness direction, and a radiator 12 having a fourth main surface 122 opposite to the third main surface 121.
  • the heat radiator 12 has greater heat conduction in a direction perpendicular to the direction in which the heat radiators 12 are connected than in the direction in which the heat radiators 12 are connected, in a plan view.
  • the substrate 11 has a metal layer 13 on the surface.
  • the electronic element 2 is mounted on an xy plane in a virtual xyz space. 1 to 4, the upward direction means the positive direction of the virtual z axis. Note that the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the electronic element mounting substrate 1 or the like is actually used.
  • the heat radiator 12 is indicated by shading in the examples shown in FIGS.
  • the metal layer 13 is shown by shading in the examples shown in FIGS. 1 (a), 3 (b), and 4.
  • the substrate 11 shows the outer surface of the substrate 11 and the inner surface of the hole 11 c that are invisible in perspective by broken lines.
  • the mounting portion 11b of the electronic element 2 is disposed so as to overlap the heat radiating body 12 in a plan view.
  • a plurality of mounting portions 11b of the electronic component 2 are arranged in a direction (y direction) in which the heat dissipating bodies 12 are connected in a plan view.
  • the substrate 11 is composed of a single layer or a plurality of insulating layers 11a, and has a first main surface 111 (upper surface in FIGS. 1 to 4) and a second main surface 112 (lower surface in FIGS. 1 to 4). .
  • the substrate 11 includes a single insulating layer 11a in the examples shown in FIGS.
  • the substrate 11 has a rectangular plate-like shape having two sets of opposite sides (four sides) with respect to each of the first main surface 111 and the second main surface 112 in plan view. In the example shown in FIGS. 1 to 4, the substrate 11 has a rectangular shape that is long in the direction of the arrangement of the plurality of electronic elements 2 (the arrangement of the mounting portions 11b) in plan view.
  • the substrate 11 functions as a support for supporting the plurality of electronic elements 2, and the plurality of electronic elements 2 are respectively connected to the plurality of mounting portions 11 b located on the first main surface 111 of the substrate 11 via bonding members. Glued and fixed.
  • ceramics such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body can be used.
  • the substrate 11 is an aluminum nitride sintered body, for example, an organic binder suitable for a raw material powder such as aluminum nitride (AlN), erbium oxide (Er 2 O 3 ), yttrium oxide (Y 2 O 3 ), etc. And a solvent etc. are added and mixed and a slurry is produced.
  • a ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method. If necessary, a plurality of ceramic green sheets are laminated, and the ceramic green sheets are fired at a high temperature (about 1800 ° C.) to produce a substrate 11 made of a single layer or a plurality of insulating layers 11a.
  • the substrate 11 has a hole 11c for accommodating the radiator 12.
  • the hole 11c penetrates the first main surface 111 side and the second main surface 112 side of the substrate 11.
  • the hole 11c can be formed, for example, by forming a through hole to be the hole 11c in the ceramic green sheet by performing laser processing, punching processing using a mold, or the like on the ceramic green sheet for the substrate 11.
  • the heat radiator 12 has a third main surface 121 (upper surface in FIGS. 1 to 4) and a fourth main surface 122 (lower surface in FIGS. 1 to 4).
  • the heat radiator 12 has a rectangular plate-like shape having two sets of opposite sides (four sides) with respect to each of the third main surface 121 and the fourth main surface 122 in plan view.
  • the heat radiator 12 is formed of, for example, a structure made of a carbon material and laminated with graphene in which six-membered rings are connected by a covalent bond. It is a material in which the faces are joined by van der Waals forces.
  • the heat radiator 12 is housed in the hole 11c of the base 11 and embedded in the base 11.
  • the heat dissipating body 12 is housed in each of the three holes 11 c arranged side by side (continuously) in the longitudinal direction of the base body 11 and embedded in the base body 11.
  • the radiator 12 has the third main surface 121 exposed on the first main surface 111 side in the thickness direction of the substrate 11 and on the second main surface 112 side in the thickness direction of the substrate 11.
  • the fourth main surface 122 is exposed.
  • the substrate 11 may be an aluminum nitride sintered body having excellent thermal conductivity.
  • the substrate 11 and the radiator 12 are bonded to the inner surface of the hole 11c of the substrate 11 and the outer surface of the radiator 12 by a bonding material made of an active brazing material such as a TiCuAg alloy.
  • the bonding material is disposed between the substrate 11 and the radiator 12 to a thickness of about 10 ⁇ m.
  • the substrate thickness T1 of the substrate 11 and the substrate thickness T2 of the radiator 12 are each about 100 ⁇ m to 2500 ⁇ m. In the electronic element mounting substrate 1 of the first embodiment, the substrate thickness T1 of the substrate 11 and the substrate thickness T2 of the radiator 12 are equivalent within a range of about 5% (0.95T1 ⁇ T2). ⁇ 1.05T1).
  • the thermal conductivity ⁇ of the substrate 11 is substantially constant in the x direction and the y direction in the planar direction, and is also substantially constant in the planar direction and the thickness direction of the substrate 11 ( ⁇ x ⁇ ⁇ y ⁇ z).
  • the substrate 11 having a thermal conductivity ⁇ of about 100 to 200 W / m ⁇ K is used.
  • the thermal conductivity ⁇ of the radiator 12 is different in the x direction and the y direction in the plane direction.
  • the relationship between the thermal conductivities ⁇ x, ⁇ y, and ⁇ z in the respective directions of the radiator 12 is “thermal conductivity ⁇ x ⁇ thermal conductivity ⁇ z >> thermal conductivity ⁇ y” as shown in FIG.
  • the thermal conductivity ⁇ x and the thermal conductivity ⁇ z of the radiator 12 are about 1000 W / m ⁇ K, and the thermal conductivity ⁇ y of the radiator 12 is about 4 W / m ⁇ K.
  • the heat dissipating body 12 is arranged so that the heat conduction in the direction perpendicular to the direction in which the heat dissipating bodies 12 intersect is greater than the heat conduction in the direction in which the heat dissipating bodies 12 are continuous in plan perspective.
  • the thermal conductivity of the electronic element mounting substrate 1 of this embodiment can be measured by an analysis method such as a laser flash method.
  • an analysis method such as a laser flash method.
  • the heat dissipating body 12 has a heat conductivity ⁇ y with respect to the longitudinal direction of the substrate 11, that is, the direction between the mounting portions 11 b of the adjacent electronic elements 2. It is arranged so as to be smaller than the thermal conductivity ⁇ z of 12 in the thickness direction.
  • the metal layer 13 is positioned on the first main surface 111 of the substrate 11 so as to sandwich the heat dissipating body 12 in the longitudinal direction of the substrate 11 (direction in which the heat dissipating bodies 12 are connected) in plan view (plan view).
  • the metal layers 13 and the radiators 12 are alternately positioned in the longitudinal direction of the substrate 11 in plan view (plan view).
  • the metal layer 13 is used as, for example, a connection portion with a connection member 3 such as a bonding wire with an electrode of the electronic element 2.
  • the metal layer 13 includes a thin film layer and a plating layer.
  • the thin film layer has, for example, an adhesion metal layer and a barrier layer.
  • the adhesion metal layer constituting the thin film layer is formed on the first main surface of the substrate 11.
  • the adhesion metal layer is made of, for example, tantalum nitride, nickel-chromium, nickel-chromium-silicon, tungsten-silicon, molybdenum-silicon, tungsten, molybdenum, titanium, chromium, etc., and vapor deposition, ion plating, sputtering, etc.
  • the substrate 11 is placed in a film forming chamber of a vacuum evaporation apparatus, and a metal piece serving as an adhesion metal layer is disposed in a vapor deposition source in the film forming chamber, and then the film is formed.
  • the inside of the chamber is in a vacuum state (pressure of 10 ⁇ 2 Pa or less), the metal piece placed in the vapor deposition source is heated and vapor-deposited, and the molecules of the vapor-deposited metal piece are adhered to the substrate 11 to thereby adhere to each other.
  • a thin metal layer that forms the metal layer is formed.
  • an excess metal film layer is removed by etching, thereby forming an adhesion metal layer.
  • a barrier layer is deposited on the upper surface of the adhesion metal layer, and the barrier layer has good bondability and wettability between the adhesion metal layer and the plating layer. It acts to prevent interdiffusion with the layers.
  • the barrier layer is made of, for example, nickel-chromium, platinum, palladium, nickel, cobalt, and the like, and is deposited on the surface of the adhesion metal layer by a thin film forming technique such as a vapor deposition method, an ion plating method, or a sputtering method.
  • the thickness of the adhesive metal layer is preferably about 0.01 to 0.5 ⁇ m. If it is less than 0.01 ⁇ m, it tends to be difficult to firmly adhere the adhesion metal layer on the substrate 11. When the thickness exceeds 0.5 ⁇ m, peeling of the adhesion metal layer is likely to occur due to internal stress during the formation of the adhesion metal layer.
  • the thickness of the barrier layer is preferably about 0.05 to 1 ⁇ m. If it is less than 0.05 ⁇ m, defects such as pinholes tend to occur, making it difficult to function as a barrier layer. When the thickness exceeds 1 ⁇ m, the barrier layer is easily peeled off due to internal stress during film formation.
  • the plating layer is deposited on the surface of the thin film layer by electrolytic plating or electroless plating.
  • the plating layer is made of a metal having excellent corrosion resistance such as nickel, copper, gold, or silver, and connectivity with a connection member.
  • the layers are deposited sequentially. As a result, corrosion of the metal layer 13 can be effectively suppressed, and the bonding between the metal layer 13 and the wiring conductor formed on the wiring board can be strengthened.
  • a metal layer such as copper (Cu) or gold (Au) may be disposed on the barrier layer so that the plating layer is formed satisfactorily.
  • a metal layer is formed by the same method as the thin film layer.
  • the metal layer 13 is formed on the first main surface 111 of the substrate 11 and the metal plating layer is formed on the metal layer 13, the third main surface 121 and the fourth main surface 122 from which the radiator 12 is exposed in advance.
  • the radiator 12 made of a carbon material is not exposed when the electronic device mounting board 1 is manufactured, so that deterioration due to chemicals or the like can be reduced. it can.
  • the electronic element 2 mounted on the electronic element mounting substrate 1 is, for example, a light emitting element such as an LD (Laser Diode) or LED (Light Emitting Diode), or a light receiving element such as a PD (Photo Diode).
  • a light emitting element such as an LD (Laser Diode) or LED (Light Emitting Diode)
  • a light receiving element such as a PD (Photo Diode).
  • the electrode of the electronic element 2 and the metal layer 13 are electrically connected via the connecting member 3 such as a bonding wire. By being connected, the electronic element mounting substrate 1 is mounted.
  • the wiring board or electronic element mounting package on which the electronic element mounting substrate 1 is mounted can use an insulating base such as ceramics, for example, similarly to the substrate 11, and has a wiring conductor on the surface. Then, the metal layer 13 of the electronic element mounting board 1 and the wiring conductor of the wiring board or electronic element mounting package are electrically connected.
  • the electronic device of the present embodiment is connected to the wiring conductor and the connection pad of the module substrate via a bonding material such as solder to form an electronic module. Thereby, the electronic element 2 and the connection pad of the module substrate are electrically connected.
  • the substrate 11 having a rectangular shape having the first main surface 111 and the second main surface 112 opposite to the first main surface 111 and the substrate 11 are embedded.
  • a heat dissipating member 12 having a third main surface 121 located on the first main surface 111 side in the thickness direction and a fourth main surface 122 opposite to the third main surface 121,
  • the heat radiator 12 has a higher heat conduction in the direction perpendicular to the direction in which the heat sinks 12 are connected than in the direction in which the heat sinks 12 are connected.
  • an optical element such as an LD or LED
  • the electronic element 2 it is possible to mount the electronic element for an optical device that can emit light with high accuracy by suppressing distortion of the electronic element mounting substrate 1.
  • the substrate 1 can be obtained.
  • the electronic element mounting substrate 1 in the present embodiment can be suitably used in a thin and high-power electronic device, and the reliability of the electronic element mounting substrate 1 can be improved.
  • an optical element such as an LD or LED
  • it can be suitably used as the electronic element mounting substrate 1 for an optical device that is thin and excellent in directivity.
  • the radiator 12 when the radiator 12 is larger than the mounting portion 11 b (larger than the electronic element 2) in a plan view, the heat of the electronic element 2 transferred to the radiator 12 is increased. Since the heat transfer in the direction perpendicular to the direction in which the heat dissipating bodies 12 are perpendicular to each other is facilitated and the heat transfer in the direction in which the heat dissipating bodies 12 are adjacent to each other is suppressed, the electronic element mounting substrate 1 distortion can be suppressed.
  • the heat of the electronic element 2 is increased.
  • the heat of the electronic element 2 is more easily transferred to the heat dissipating body 12 side than the metal layer 13 side, making it difficult for the heat of the electronic element 2 to be transferred to the position facing the electronic element 2 through the metal layer 13. It can suppress well.
  • the metal layer 13 when the metal layer 13 is positioned so as to sandwich the heat dissipator 12 in a direction in which the heat dissipators 12 are connected in a plan view (plan view), the heat transmitted to the metal layer 13 is more dissipated by the metal layer 13. Since heat transfer in the direction in which the electronic elements 2 are adjacent to each other through the metal layer 13 and the heat radiating bodies 12 are connected is suppressed, the heat of the electronic elements 2 is transmitted through the heat radiating bodies 12 to the heat radiating bodies 12. The heat is transferred favorably in the direction perpendicular to the direction in which the two are connected, and the distortion of the electronic element mounting substrate 1 can be more effectively suppressed.
  • the heat transferred to the metal layer 13 is effectively dissipated in the metal layer 13. Since heat transfer in the direction in which the electronic elements 2 are adjacent to each other through the metal layer 13 and the heat radiating bodies 12 are connected is suppressed, the heat of the electronic elements 2 is radiated through the heat radiating bodies 12. Heat is transferred favorably in the direction perpendicular to the direction in which the 12s are connected, and the distortion of the electronic element mounting substrate 1 can be more effectively suppressed.
  • the radiator 12 is likely to conduct heat in the thickness direction of the radiator 12 if the heat conduction in the thickness direction is greater than the direction perpendicular to the thickness direction. Further, heat transfer in the direction in which the radiators 12 are connected can be satisfactorily suppressed.
  • each radiator 12 when the substrate 11 has a rectangular shape in plan view and the radiator 12 is continuously located in the longitudinal direction of the substrate 11, each radiator 12 The heat transfer in the longitudinal direction of the substrate 11 can be suppressed, and the heat of the electronic element 2 can be favorably transferred in the direction perpendicular to the longitudinal direction of the substrate 11 through the radiator 12.
  • the heat dissipating body 12 is mounted when the electronic element 2 is mounted on the heat dissipating body 12 (mounting portion 11b).
  • the heat of the electronic element 2 can be directly transferred to the heat radiating body 12, the heat transfer in the direction in which the heat radiating bodies 12 are connected is suppressed, and the heat is transmitted in a direction perpendicular to the direction in which the heat radiating bodies 12 are connected. Since it is heated, the distortion of the substrate 11 can be satisfactorily suppressed.
  • the heat dissipating body 12 externally transfers heat transferred to the fourth main surface 122 side via the heat dissipating body 12. Can be released easily.
  • the electronic element mounting substrate 1 having the above configuration, the electronic element 2 mounted on the mounting portion 11b of the electronic element mounting substrate 1, and the electronic element mounting substrate 1 are mounted.
  • the wiring board or the electronic element storage package an electronic device having excellent long-term reliability can be obtained.
  • the electronic device having the above configuration and the module substrate to which the electronic device is connected can provide excellent long-term reliability.
  • the electronic device according to the second embodiment is different from the electronic device according to the above-described embodiment in that the substrate 11 has a hole 11c having a bottom surface.
  • the substrate 11 is formed of two insulating layers 11a.
  • the heat dissipating body 12 has the third main surface 121 exposed on the first main surface 111 side in the thickness direction of the substrate 11.
  • the radiator 1 is shown by shading in the examples shown in FIGS. 5 (a), 6 and 8 (a).
  • the metal layer 13 is shown by shading in the examples shown in FIGS. 5A, 7B, and 8.
  • the substrate 11 shows the outer surface of the substrate 11 and the inner surface of the hole 11 c that are invisible in perspective by broken lines.
  • the substrate 11 is indicated by a broken line in a region that overlaps the side surface of the radiator 12 in a plan view.
  • the electronic element mounting substrate 1 in the second embodiment similarly to the electronic element mounting substrate 1 in the above-described embodiment, heat transfer in the direction in which the heat radiating bodies 12 are connected is suppressed. Since heat transfer in the direction perpendicular to the connected direction can be increased, heat is prevented from staying on the substrate 11, heat dissipation of the electronic device mounting board 1 is improved, and the electronic device mounting is performed. The distortion of the substrate 1 can be suppressed.
  • the hole 11c has an opening on the first main surface 111 side of the substrate 11 and a bottom surface on the second main surface 112 side.
  • the electronic element mounting substrate 1 of the second embodiment can be manufactured by bonding the bottom surface of the hole 11c of the substrate 11 and the fourth main surface 122 of the radiator 12. According to the electronic device mounting substrate 1 of the second embodiment, since the insulating layer 11a is provided on the fourth main surface 122 side of the radiator 12, the electronic device including the fourth main surface 122 of the radiator 12 is included. The entire lower surface side of the mounting substrate 1 can be held and the distortion of the electronic element mounting substrate 1 can be reduced. Further, the entire surface of the substrate 11 on the second main surface 112 side is flat, and other heat radiating members can be satisfactorily bonded to the second main surface 112 of the substrate 11, and the electronic element mounting substrate 1 having excellent reliability. It can be.
  • the hole 11c is formed by, for example, forming a through-hole serving as the hole 11c in the ceramic green sheet by performing laser processing, punching processing using a mold, or the like on the ceramic green sheet for the substrate 11, and other ceramic green sheets. It can be formed by stacking.
  • the bottom surface of the hole 11c of the substrate 11 and the fourth main surface 122 of the radiator 2 are bonded by a bonding material made of an active brazing material such as a TiCuAg alloy.
  • the bonding material is disposed between the substrate 11 and the radiator 12 to a thickness of about 10 ⁇ m.
  • the substrate thickness T1 of the substrate 11 is, for example, about 150 ⁇ m to 2500 ⁇ m
  • the substrate thickness T2 of the radiator 12 is, for example, about 100 ⁇ m to 2000 ⁇ m.
  • the thickness T12 of the insulating layer 11a on the second main surface 112 side of the substrate 11 is smaller than the thickness T11 of the insulating layer 11a on the first main surface 111 side of the substrate 11, that is, the height (depth) of the hole 11c. It is good (T11> T12).
  • the electronic element mounting substrate 1 of the second embodiment is disposed on the second main surface 112 side of the substrate 11 and the fourth main surface 122 side of the radiator 12 of the electronic element mounting substrate 1 of the first embodiment.
  • it may be formed by bonding another substrate 11 that is substantially the same material as the substrate 11.
  • the electronic element mounting substrate 1 of the second embodiment can be manufactured using the same manufacturing method as the electronic element mounting substrate 1 of the above-described embodiment.
  • the electronic element mounting substrate 1 according to the third embodiment is different from the electronic element mounting substrate 1 according to the above-described embodiment in that the substrate 11 has a hole 11c having a bottom surface opened to the second main surface 112 side.
  • the heat dissipating body 12 has a circular shape in plan perspective.
  • the substrate 11 is formed of two insulating layers 11a.
  • the heat dissipating body 12 has the fourth main surface 122 exposed on the second main surface 112 side in the thickness direction of the substrate 11.
  • the mounting portion 11b and the heat radiating body 12 of the electronic element 2 are shown by shading in the examples shown in FIG. 9B and FIG.
  • the metal layer 13 and the mounting layer 14 are shown by shading in the examples shown in FIGS.
  • the substrate 11 shows the outer surface of the substrate 11 and the inner surface of the hole 11c that are invisible in perspective by broken lines.
  • the substrate 11 is indicated by a broken line in a region that overlaps the side surface of the heat radiating body 12 in a plan view.
  • the heat transfer in the direction in which the radiators 12 are connected is suppressed, and the radiator 12 Since heat transfer in the direction perpendicular to the connected direction can be increased, heat is prevented from staying on the substrate 11, heat dissipation of the electronic device mounting board 1 is improved, and the electronic device mounting is performed.
  • the distortion of the substrate 1 can be suppressed.
  • the electronic element mounting substrate 1 according to the third embodiment can be manufactured by bonding the bottom surface of the hole 11c of the substrate 11 and the third main surface 121 of the radiator 12. Since the insulating layer 11a is provided on the third main surface 121 side of the radiator 12, the entire upper surface side of the electronic element mounting substrate 1 including the third main surface 121 of the radiator 12 is held for mounting the electronic element. By reducing the distortion of the substrate 1, the electronic element mounting substrate 1 having excellent reliability can be obtained. In addition, the entire surface of the substrate 11 on the first main surface 111 side is flat, and the electronic element 2 can be satisfactorily mounted on the mounting portion 11b.
  • the hole 11c is formed by, for example, forming a through-hole serving as the hole 11c in the ceramic green sheet by performing laser processing, punching processing using a mold, or the like on the ceramic green sheet for the substrate 11, and other ceramic green sheets. It can be formed by stacking.
  • the electronic element mounting substrate 1 is bonded by a bonding material made of an active brazing material such as a TiCuAg alloy.
  • the bonding material is disposed between the substrate 11 and the radiator 12 to a thickness of about 10 ⁇ m.
  • the thickness T1 of the substrate 11 is, for example, about 150 ⁇ m to 2500 ⁇ m
  • the thickness T2 of the radiator 12 is, for example, about 100 ⁇ m to 2000 ⁇ m.
  • the thickness T12 of the insulating layer 11a on the second main surface 112 side of the substrate 11 is larger than the thickness T11 of the insulating layer 11a on the first main surface 111 side of the substrate 11, that is, the height (depth) of the hole 11c. (T12> T11).
  • the mounting layer 14 that becomes the mounting portion 11b of the electronic element 2 may be provided.
  • the mounting layer 14 can be manufactured by the same material and method as the metal layer 13. With the mounting layer 14, the electronic element 2 can be mounted on the electronic element mounting substrate 1 more favorably.
  • the thickness T3 of the substrate 11 between the first main surface 111 of the substrate 11 and the third main surface 121 of the heat radiator 12 is determined by a distance W between the outer edge of the mounting layer 14 and the outer edge of the heat radiator 12 in a plan view. Is smaller, the heat of the electronic element 2 is more easily transferred to the radiator 12 side than the outside of the outer edge of the radiator 12 in the direction in which the radiator 12 is connected, and the heat transfer in the direction in which the radiator 12 is connected. Therefore, it is possible to suppress heat from staying on the substrate 11, heat dissipation of the electronic element mounting substrate 1 is improved, and distortion of the electronic element mounting substrate 1 can be suppressed.
  • the heat radiating body 12 heats the electronic element 2 in the direction in which the heat radiating body 12 is connected. Therefore, it is possible to suppress heat from staying on the substrate 11, heat dissipation of the electronic element mounting substrate 1 is improved, and distortion of the electronic element mounting substrate 1 can be suppressed.
  • the electronic element mounting substrate 1 of the third embodiment is disposed on the first main surface 111 side of the substrate 11 and the third main surface 121 side of the radiator 12 of the electronic element mounting substrate 1 of the first embodiment. Alternatively, it may be formed by bonding another substrate 11 that is substantially the same material as the substrate 11.
  • the electronic element mounting substrate 1 of the third embodiment can be manufactured using the same manufacturing method as the electronic element mounting substrate 1 of the above-described embodiment.
  • the electronic element mounting substrate 1 according to the fourth embodiment is different from the electronic element mounting substrate 1 according to the above-described embodiment in that the radiator 12 includes the third main surface 121 and the fourth main surface 122 of the radiator 12. Is embedded in the substrate 11 so as not to be exposed on the surface.
  • the substrate 11 is formed of three insulating layers 11a.
  • the radiator 12 is shown by hatching in the example shown in FIG.
  • the metal layer 13 and the mounting layer 14 are shown by shading in the examples shown in FIG. 13 (a), FIG. 15, and FIG.
  • the substrate 11 shows the outer surface of the substrate 11 and the inner surface of the hole 11 c that are invisible in perspective by broken lines.
  • the substrate 11 is indicated by a broken line in a region that overlaps the side surface of the radiator 12 in a plan view.
  • the heat transfer in the direction in which the radiators 12 are connected is suppressed, and the radiator 12 Since heat transfer in the direction perpendicular to the connected direction can be increased, heat is prevented from staying on the substrate 11, heat dissipation of the electronic device mounting board 1 is improved, and the electronic device mounting is performed.
  • the distortion of the substrate 1 can be suppressed.
  • the radiator 12 is embedded in the substrate 11 so that the third main surface 121 and the fourth main surface 122 of the radiator 12 are not exposed on the surface.
  • the third main surface 121 and the fourth main surface 122 of the radiator 12 can be manufactured by being satisfactorily bonded to the substrate 11.
  • the third main surface 121 and the fourth main surface 122 of the heat radiating body 12 become the electronic element mounting substrate 1 in which the insulating layer 11a of the substrate 11 is covered.
  • the substrate thickness T1 of the substrate 11 is, for example, about 200 ⁇ m to 3000 ⁇ m
  • the substrate thickness T2 of the radiator 12 is, for example, about 100 ⁇ m to 2000 ⁇ m.
  • the thickness T4 of the substrate 11 may be smaller than the substrate thickness T2 of the radiator 12 (T2> T3, T2> T4).
  • T2> T3, T2> T4 The same applies to the electronic element mounting substrates 1 of the fifth to eighth embodiments.
  • the first main surface 111 of the substrate 11 and the third main surface of the radiator 12 are the same as the electronic element mounting substrate 1 of the third embodiment.
  • the thickness T3 of the substrate 11 between the substrate 121 and the substrate 121 may be smaller than the interval W between the outer edge of the mounting layer 14 and the outer edge of the radiator 12 in a plan view.
  • the mounting layer 14 may be formed on the first main surface of the substrate 11 in the same manner as the electronic element mounting substrate 1 of the third embodiment. Absent. As in the third embodiment, the mounting layer 14 may be smaller than the radiator 12 in plan perspective.
  • the thickness T4 of the substrate 11 may be equal to the thickness.
  • the thickness T3 of the substrate 11 between the first main surface 111 of the substrate 11 and the third main surface 121 of the radiator 12 is 100 ⁇ m
  • the second main surface 112 of the substrate 11 and the fourth of the radiator 12 are the same.
  • the thickness T4 of the substrate 11 between the main surface 122 may be about 90 ⁇ m to 110 ⁇ m. Since the thickness of the substrate 11 across the radiator 12 is equal, the distortion of the electronic element mounting substrate 1 can be reduced.
  • the electronic element mounting substrate 1 of the fourth embodiment includes a substrate 11 on each of the first main surface 111 side and the second main surface 112 side of the substrate 11 of the electronic element mounting substrate 1 of the first embodiment. It can be formed by bonding another substrate 11 of substantially the same material.
  • the electronic element mounting substrate 1 of the fourth embodiment is disposed on the first main surface 111 side of the substrate 11 and the third main surface 121 side of the radiator 12 of the electronic element mounting substrate 1 of the second embodiment.
  • the substrate 11 may be formed by bonding another substrate 11 that is substantially the same material as the substrate 11, the second main surface 112 side of the substrate 11 of the electronic element mounting substrate 1 of the third embodiment, and the radiator. Another substrate 11 that is substantially the same material as the substrate 11 may be bonded to the 12th main surface 122 side.
  • the electronic element mounting substrate 1 of the fourth embodiment can be manufactured using the same manufacturing method as the electronic element mounting substrate 1 of the above-described embodiment.
  • the electronic element mounting substrate 1 according to the fifth embodiment is different from the electronic element mounting substrate 1 according to the above-described embodiment in that the radiator 12 is long in the direction perpendicular to the longitudinal direction of the substrate 11. .
  • the substrate 11 is formed of three insulating layers 11a.
  • the radiator 12 is shown by hatching in the example shown in FIG.
  • the metal layer 13 and the mounting layer 14 are shown by shading in the examples shown in FIG. 17A, FIG. 19, and FIG.
  • the substrate 11 shows the outer surface of the substrate 11 and the inner surface of the hole 11 c that are invisible in perspective by broken lines.
  • the substrate 11 is indicated by a broken line in a region that overlaps the side surface of the radiator 12 in a plan view.
  • the heat transfer in the direction in which the radiators 12 are connected is suppressed, and the radiator 12 Since heat transfer in the direction perpendicular to the connected direction can be increased, heat is prevented from staying on the substrate 11, heat dissipation of the electronic device mounting board 1 is improved, and the electronic device mounting is performed.
  • the distortion of the substrate 1 can be suppressed.
  • the electronic device mounting substrate 1 of the fifth embodiment when the heat radiating body 12 is long in the direction perpendicular to the longitudinal direction of the substrate 11, heat transfer in the direction perpendicular to the direction in which the heat radiating bodies 12 are continuous is performed. Therefore, the distortion of the electronic element mounting substrate 1 can be suppressed.
  • radiator 12 extends to the side surface of the substrate 11 in a direction perpendicular to the direction in which the radiators 12 are connected, as in the examples shown in FIGS. Heat transfer is suppressed, heat dissipation of the electronic element mounting substrate 1 becomes favorable, and distortion of the electronic element mounting substrate 1 can be suppressed.
  • the substrate thickness T1 of the substrate 11 is, for example, about 200 ⁇ m to 3000 ⁇ m
  • the substrate thickness T2 of the radiator 12 is, for example, about 100 ⁇ m to 2000 ⁇ m.
  • the substrate 11 of the substrate 11 is similar to the electronic element mounting substrate 1 of the third embodiment and the electronic element mounting substrate 1 of the fourth embodiment.
  • the thickness T3 of the substrate 11 between the first main surface 111 and the third main surface 121 of the radiator 12 may be smaller than the interval W between the outer edge of the mounting layer 14 and the outer edge of the radiator 12 in plan view.
  • the substrate 11 of the substrate 11 is the same as the electronic element mounting substrate 1 of the third embodiment and the electronic element mounting substrate 1 of the fourth embodiment.
  • the mounting layer 14 may be formed on one main surface. As in the third embodiment, the mounting layer 14 may be smaller than the radiator 12 and located inside the radiator 12 in a plan view.
  • the third main surface 121 side of the radiator 12 and the third main surface 121 side of the radiator 12 and the fourth main surface 122 are not exposed on the surface.
  • the 4 main surface 122 side is joined by the insulating layer 11a.
  • the thickness T4 of the substrate 11 between them may be equal to the thickness.
  • the second main surface 112 of the substrate 11 and the fourth of the radiator 12 are the same.
  • the thickness T4 of the substrate 11 between the main surface 122 may be about 90 ⁇ m to 110 ⁇ m. Since the thickness of the substrate 11 across the radiator 12 is equal, the distortion of the electronic element mounting substrate 1 can be reduced.
  • the electronic element mounting substrate 1 of the fifth embodiment can be manufactured using the same manufacturing method as the electronic element mounting substrate 1 of the above-described embodiment.
  • the electronic element mounting substrate 1 in the sixth embodiment is different from the electronic element mounting substrate 1 in the above-described embodiment in that the sizes of the plurality of radiators 12 are different from each other in plan perspective.
  • the radiator 12 is shown by hatching in the example shown in FIG.
  • the metal layer 13 and the mounting layer 14 are shaded in the examples shown in FIGS. 21 (a), 23, and 24 (a).
  • the substrate 11 is indicated by a broken line in a region that overlaps the side surface of the radiator 12 in a plan view.
  • the heat transfer in the direction in which the radiators 12 are connected is suppressed, and the radiator 12 Since heat transfer in the direction perpendicular to the connected direction can be increased, heat is prevented from staying on the substrate 11, heat dissipation of the electronic device mounting board 1 is improved, and the electronic device mounting is performed.
  • the distortion of the substrate 1 can be suppressed.
  • the radiator 12 has a size of the radiator 12 arranged near the center of the electronic element mounting substrate 1 in a plan view. If it is larger than the size of the heat dissipating body 12 arranged near the outer peripheral portion of 1, the heat transfer in the direction perpendicular to the direction in which the heat dissipating members 12 are connected in the vicinity of the central portion of the electronic device mounting board 1 is increased. Therefore, it is possible to suppress heat from staying in the vicinity of the center of the substrate 11, improve heat dissipation of the electronic element mounting substrate 1, and suppress distortion of the electronic element mounting substrate 1.
  • the electronic element mounting substrate 1 of the sixth embodiment can be suitably used also in an electronic device in which the sizes of the plurality of electronic elements 2 to be mounted are different. Further, as in the example shown in FIG. 25, the size of the mounting layer 14 may be different in plan view.
  • the electronic element mounting substrate 1 of the sixth embodiment can be manufactured using the same manufacturing method as the electronic element mounting substrate 1 of the above-described embodiment.
  • a plurality of continuous radiators 12 are arranged in a direction perpendicular to the direction in which the radiators 12 are connected in a plan view.
  • the substrate 11 is formed of three insulating layers 11a.
  • the radiator 12 is shown by hatching in the example shown in FIG.
  • the metal layer 13 and the mounting layer 14 are shaded in the examples shown in FIGS. 26, 28, and 29.
  • the substrate 11 shows the outer surface of the substrate 11 and the inner surface of the hole 11c, which are invisible in perspective, with broken lines.
  • the substrate 11 is indicated by a broken line in a region that overlaps the side surface of the heat radiating body 12 in a plan view.
  • the heat transfer in the direction in which the radiators 12 are connected is suppressed, and the radiator 12 Since heat transfer in the direction perpendicular to the connected direction can be increased, heat is prevented from staying on the substrate 11, heat dissipation of the electronic device mounting board 1 is improved, and the electronic device mounting is performed.
  • the distortion of the substrate 1 can be suppressed.
  • the interval L1 between the radiators 12 adjacent in the direction orthogonal to the direction in which the radiators 12 are connected is larger than the interval L2 between the radiators adjacent in the direction in which the radiators 12 are connected (L1> L2), Since heat transfer in a direction orthogonal to the direction in which the bodies 12 are connected is difficult to be prevented, the heat dissipation of the electronic element mounting substrate 1 is improved, and distortion of the electronic element mounting substrate 1 can be suppressed.
  • the interval L1 between the radiators 12 adjacent to each other in the direction orthogonal to the direction in which the radiators 12 are connected is not less than twice the interval L2 between the radiators adjacent in the direction in which the radiators 12 are connected (L1> 2L2). May be.
  • a plurality of continuous radiators 12 arranged in a direction orthogonal to the direction in which the radiators 12 are connected are shifted from each other in the direction in which the radiators 12 are connected. Since the heat transfer in the direction orthogonal to the direction in which the heat dissipating bodies 12 are continuous is more difficult to prevent, the heat dissipation of the electronic element mounting board 1 is improved, and the distortion of the electronic element mounting board 1 can be suppressed. .
  • the electronic element mounting substrate 1 of the seventh embodiment can be manufactured using the same manufacturing method as the electronic element mounting substrate 1 of the above-described embodiment.
  • the radiators 12 are arranged in three rows in a direction orthogonal to the direction in which the radiators 12 are connected, but in two directions in a direction orthogonal to the direction in which the radiators 12 are connected, Alternatively, four or more rows may be arranged.
  • one heat dissipating body 12 is positioned so as to overlap the mounting portions 11b of the plurality of electronic components 2 in a plan view perspective.
  • the substrate 11 is formed of three insulating layers 11a.
  • the radiator 12 is shown by hatching in the example shown in FIG.
  • the metal layer 13 and the mounting layer 14 are shown by shading in the examples shown in FIG. 31, FIG. 33, and FIG.
  • the substrate 11 shows the outer surface of the substrate 11 and the inner surface of the hole 11c, which are invisible in perspective, with broken lines.
  • the substrate 11 is indicated by a broken line in a region that overlaps with the side surface of the radiator 12 in a plan view.
  • the heat radiator 12 has a rectangular shape in a plan view, and the mounting portion 11b of the electronic component 2 is located continuously in the longitudinal direction of the heat radiator 12. It should be noted that the heat radiator 12 may have a rectangular shape in a plan view.
  • the electronic element mounting substrate 1 in the eighth embodiment similarly to the electronic element mounting substrate 1 in the above-described embodiment, heat transfer in the direction of the mounting portion 11b of the adjacent electronic component 2 is suppressed, Since heat transfer in a direction perpendicular to the direction of the mounting portion 11b of the adjacent electronic component 2 can be increased, heat is prevented from staying on the substrate 11, and heat dissipation of the electronic element mounting substrate 1 is good. Thus, distortion of the electronic element mounting substrate 1 can be suppressed.
  • the single heat dissipating body 12 overlaps the mounting portions 11b of the plurality of electronic components 2 in a plan view.
  • one heat dissipating body 12 overlaps the mounting portions 11b of the five electronic components 2 in a plan view.
  • the heat dissipating body 12 is configured so that the thermal conductivity ⁇ y in the direction in which the mounting portions 11a of the plurality of electronic components 2 are arranged (y direction) is smaller than the thermal conductivity ⁇ y of the substrate 11 ( ⁇ y ⁇ y).
  • heat transfer between adjacent electronic components 2 can be suppressed and the interval between the mounting portions 11a can be set small, so that it can be suitably used as a small electronic device.
  • a light-emitting element when used as the electronic component 2, a large number of light-emitting elements can be mounted by reducing the interval between the mounting portions 11a, and a light-emitting device having excellent luminance can be obtained.
  • each heat dissipating body 12 is positioned such that the heat conduction in the direction perpendicular to the direction in which the front heat dissipating elements are connected is greater than the heat conduction in the direction in which the heat dissipating elements 12 are connected.
  • the electronic element mounting substrate 1 of the eighth embodiment can be manufactured by using the same manufacturing method as the electronic element mounting substrate 1 of the above-described embodiment.
  • the metal layer 13 positioned on the first main surface 111 of the substrate 11 is formed by a thin film method in the above-described example, but is a metal layer using a conventionally known cofire method or postfire method. It doesn't matter.
  • the metal layer 13 is provided in advance on the first main surface of the substrate 11 before the substrate 11 and the radiator 12 are joined. Note that the above-described method may be used in order to improve the flatness of the substrate 11.
  • the electronic element mounting substrate 1 may have a chamfer, a cutout, or the like at a corner or a side of the substrate 11 in plan view.
  • the electronic element mounting substrate 1 of the first embodiment to the electronic element mounting substrate 1 of the seventh embodiment are formed by single to three insulating layers 11a.
  • the number of insulating layers 11a is as follows. It may be different.
  • the electronic element mounting substrate 1 of the first embodiment may be formed of two or more insulating layers 11a.
  • three heat dissipating bodies 12 are accommodated in the three holes 11c of the base 11, but four It may be the electronic element mounting substrate 1 in which the holes 11c and the radiator 12 are arranged.
  • the electronic element mounting substrate 1 of the first embodiment to the electronic element mounting substrate 1 of the seventh embodiment may be combined.
  • the electronic device mounting substrate 1 of the third embodiment, the electronic device mounting substrate 1 of the fourth embodiment, the electronic device mounting substrate 1 of the sixth embodiment, and the electronic device mounting of the seventh embodiment In the circuit board 1 and the like, the heat radiating body 12 may have a circular shape in a plan view as in the electronic device mounting board 1 of the second embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
PCT/JP2018/016457 2017-04-25 2018-04-23 電子素子搭載用基板、電子装置および電子モジュール Ceased WO2018199022A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US16/607,754 US20200144153A1 (en) 2017-04-25 2018-04-23 Electronic element mounting substrate, electronic device, and electronic module
CN201880024054.8A CN110495258B (zh) 2017-04-25 2018-04-23 电子元件搭载用基板、电子装置以及电子模块
EP18791890.9A EP3618583A4 (en) 2017-04-25 2018-04-23 ASSEMBLY SUBSTRATE FOR ELECTRONIC ELEMENT, ELECTRONIC DEVICE AND ELECTRONIC MODULE
JP2019514489A JP7189128B2 (ja) 2017-04-25 2018-04-23 電子素子搭載用基板、電子装置および電子モジュール
JP2022153129A JP2022180570A (ja) 2017-04-25 2022-09-26 電子素子搭載用基板、電子装置および電子モジュール
US18/590,248 US20240203818A1 (en) 2017-04-25 2024-02-28 Electronic element mounting substrate, electronic device, and electronic module for improving and obtaining long-term reliability

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-086308 2017-04-25
JP2017086308 2017-04-25
JP2017209387 2017-10-30
JP2017-209387 2017-10-30

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US16/607,754 A-371-Of-International US20200144153A1 (en) 2017-04-25 2018-04-23 Electronic element mounting substrate, electronic device, and electronic module
US18/590,248 Continuation US20240203818A1 (en) 2017-04-25 2024-02-28 Electronic element mounting substrate, electronic device, and electronic module for improving and obtaining long-term reliability

Publications (1)

Publication Number Publication Date
WO2018199022A1 true WO2018199022A1 (ja) 2018-11-01

Family

ID=63919093

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/016457 Ceased WO2018199022A1 (ja) 2017-04-25 2018-04-23 電子素子搭載用基板、電子装置および電子モジュール

Country Status (5)

Country Link
US (2) US20200144153A1 (enExample)
EP (1) EP3618583A4 (enExample)
JP (2) JP7189128B2 (enExample)
CN (1) CN110495258B (enExample)
WO (1) WO2018199022A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720921B (zh) * 2020-07-14 2021-03-01 欣興電子股份有限公司 內埋式元件結構及其製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110157868A1 (en) * 2009-12-30 2011-06-30 Harvatek Corporation Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
JP2011159662A (ja) * 2010-01-29 2011-08-18 Toyota Central R&D Labs Inc 半導体装置
JP2013175508A (ja) 2012-02-23 2013-09-05 Kyocera Corp 配線基板および電子装置ならびに配線基板の製造方法
JP2016157928A (ja) * 2015-02-23 2016-09-01 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板および回路基板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150743A (ja) * 1998-11-11 2000-05-30 Furukawa Electric Co Ltd:The 半導体装置用基板及びその製造方法
US6207904B1 (en) * 1999-06-02 2001-03-27 Northrop Grumman Corporation Printed wiring board structure having continuous graphite fibers
US7316061B2 (en) * 2003-02-03 2008-01-08 Intel Corporation Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement
JP3988764B2 (ja) * 2004-10-13 2007-10-10 三菱電機株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
CN100466895C (zh) * 2005-12-15 2009-03-04 英业达股份有限公司 散热结构
US20100177519A1 (en) * 2006-01-23 2010-07-15 Schlitz Daniel J Electro-hydrodynamic gas flow led cooling system
CN101536182B (zh) 2006-11-02 2011-07-06 日本电气株式会社 半导体器件
US20080180014A1 (en) * 2007-01-29 2008-07-31 Tennrich International Corp. LED heat sink
CN101662894B (zh) * 2008-08-27 2011-09-21 富葵精密组件(深圳)有限公司 封装基板以及封装结构
JP5458926B2 (ja) * 2009-10-05 2014-04-02 住友電気工業株式会社 フレキシブル基板、フレキシブル基板モジュール及びそれらの製造方法
KR200452491Y1 (ko) 2010-05-27 2011-03-03 주식회사 비에이치디스플레이 방열성이 우수한 엘이디용 인쇄회로기판
JP5904006B2 (ja) 2012-05-21 2016-04-13 株式会社デンソー 半導体装置
US9006095B2 (en) * 2013-02-19 2015-04-14 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices and methods of manufacture thereof
JP5784261B2 (ja) * 2013-02-20 2015-09-24 三菱電機株式会社 冷却装置及びこれを用いた冷却装置付きパワーモジュール
JP6716560B2 (ja) * 2015-06-29 2020-07-01 タツタ電線株式会社 インレイ基板、及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110157868A1 (en) * 2009-12-30 2011-06-30 Harvatek Corporation Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
JP2011159662A (ja) * 2010-01-29 2011-08-18 Toyota Central R&D Labs Inc 半導体装置
JP2013175508A (ja) 2012-02-23 2013-09-05 Kyocera Corp 配線基板および電子装置ならびに配線基板の製造方法
JP2016157928A (ja) * 2015-02-23 2016-09-01 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板および回路基板の製造方法

Also Published As

Publication number Publication date
JP7189128B2 (ja) 2022-12-13
JPWO2018199022A1 (ja) 2020-02-27
CN110495258A (zh) 2019-11-22
CN110495258B (zh) 2022-06-14
EP3618583A1 (en) 2020-03-04
EP3618583A4 (en) 2021-01-20
US20240203818A1 (en) 2024-06-20
US20200144153A1 (en) 2020-05-07
JP2022180570A (ja) 2022-12-06

Similar Documents

Publication Publication Date Title
JP7055870B2 (ja) 電子素子搭載用基板、電子装置および電子モジュール
JP7460704B2 (ja) 複合基板および電子装置
US12193145B2 (en) Substrate for mounting electronic element, electronic device, and electronic module preliminary class
US20240203818A1 (en) Electronic element mounting substrate, electronic device, and electronic module for improving and obtaining long-term reliability
JP6983178B2 (ja) 電子素子搭載用基板、電子装置および電子モジュール
JP7425130B2 (ja) 基板
JP7084134B2 (ja) 電子装置
JP7174046B2 (ja) 電子素子搭載用基板、電子装置および電子モジュール

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18791890

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019514489

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2018791890

Country of ref document: EP

Effective date: 20191125