CN110495258B - 电子元件搭载用基板、电子装置以及电子模块 - Google Patents

电子元件搭载用基板、电子装置以及电子模块 Download PDF

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Publication number
CN110495258B
CN110495258B CN201880024054.8A CN201880024054A CN110495258B CN 110495258 B CN110495258 B CN 110495258B CN 201880024054 A CN201880024054 A CN 201880024054A CN 110495258 B CN110495258 B CN 110495258B
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China
Prior art keywords
substrate
electronic component
component mounting
radiator
main surface
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CN201880024054.8A
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English (en)
Chinese (zh)
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CN110495258A (zh
Inventor
北住登
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
CN201880024054.8A 2017-04-25 2018-04-23 电子元件搭载用基板、电子装置以及电子模块 Active CN110495258B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017-086308 2017-04-25
JP2017086308 2017-04-25
JP2017209387 2017-10-30
JP2017-209387 2017-10-30
PCT/JP2018/016457 WO2018199022A1 (ja) 2017-04-25 2018-04-23 電子素子搭載用基板、電子装置および電子モジュール

Publications (2)

Publication Number Publication Date
CN110495258A CN110495258A (zh) 2019-11-22
CN110495258B true CN110495258B (zh) 2022-06-14

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Family Applications (1)

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CN201880024054.8A Active CN110495258B (zh) 2017-04-25 2018-04-23 电子元件搭载用基板、电子装置以及电子模块

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Country Link
US (2) US20200144153A1 (enExample)
EP (1) EP3618583A4 (enExample)
JP (2) JP7189128B2 (enExample)
CN (1) CN110495258B (enExample)
WO (1) WO2018199022A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720921B (zh) * 2020-07-14 2021-03-01 欣興電子股份有限公司 內埋式元件結構及其製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1984551A (zh) * 2005-12-15 2007-06-20 英业达股份有限公司 散热结构
JP2016157928A (ja) * 2015-02-23 2016-09-01 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板および回路基板の製造方法

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JP2000150743A (ja) * 1998-11-11 2000-05-30 Furukawa Electric Co Ltd:The 半導体装置用基板及びその製造方法
US6207904B1 (en) * 1999-06-02 2001-03-27 Northrop Grumman Corporation Printed wiring board structure having continuous graphite fibers
US7316061B2 (en) * 2003-02-03 2008-01-08 Intel Corporation Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement
JP3988764B2 (ja) * 2004-10-13 2007-10-10 三菱電機株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
US20100177519A1 (en) * 2006-01-23 2010-07-15 Schlitz Daniel J Electro-hydrodynamic gas flow led cooling system
CN101536182B (zh) 2006-11-02 2011-07-06 日本电气株式会社 半导体器件
US20080180014A1 (en) * 2007-01-29 2008-07-31 Tennrich International Corp. LED heat sink
CN101662894B (zh) * 2008-08-27 2011-09-21 富葵精密组件(深圳)有限公司 封装基板以及封装结构
JP5458926B2 (ja) * 2009-10-05 2014-04-02 住友電気工業株式会社 フレキシブル基板、フレキシブル基板モジュール及びそれらの製造方法
TW201123412A (en) 2009-12-30 2011-07-01 Harvatek Corp A light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
JP2011159662A (ja) * 2010-01-29 2011-08-18 Toyota Central R&D Labs Inc 半導体装置
KR200452491Y1 (ko) 2010-05-27 2011-03-03 주식회사 비에이치디스플레이 방열성이 우수한 엘이디용 인쇄회로기판
JP5944690B2 (ja) 2012-02-23 2016-07-05 京セラ株式会社 配線基板の製造方法
JP5904006B2 (ja) 2012-05-21 2016-04-13 株式会社デンソー 半導体装置
US9006095B2 (en) * 2013-02-19 2015-04-14 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices and methods of manufacture thereof
JP5784261B2 (ja) * 2013-02-20 2015-09-24 三菱電機株式会社 冷却装置及びこれを用いた冷却装置付きパワーモジュール
JP6716560B2 (ja) * 2015-06-29 2020-07-01 タツタ電線株式会社 インレイ基板、及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1984551A (zh) * 2005-12-15 2007-06-20 英业达股份有限公司 散热结构
JP2016157928A (ja) * 2015-02-23 2016-09-01 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板および回路基板の製造方法

Also Published As

Publication number Publication date
JP7189128B2 (ja) 2022-12-13
JPWO2018199022A1 (ja) 2020-02-27
WO2018199022A1 (ja) 2018-11-01
CN110495258A (zh) 2019-11-22
EP3618583A1 (en) 2020-03-04
EP3618583A4 (en) 2021-01-20
US20240203818A1 (en) 2024-06-20
US20200144153A1 (en) 2020-05-07
JP2022180570A (ja) 2022-12-06

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