WO2018196141A1 - 一种功率放大器 - Google Patents

一种功率放大器 Download PDF

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Publication number
WO2018196141A1
WO2018196141A1 PCT/CN2017/089477 CN2017089477W WO2018196141A1 WO 2018196141 A1 WO2018196141 A1 WO 2018196141A1 CN 2017089477 W CN2017089477 W CN 2017089477W WO 2018196141 A1 WO2018196141 A1 WO 2018196141A1
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WO
WIPO (PCT)
Prior art keywords
fan
fins
power amplifier
housing body
amplifier according
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PCT/CN2017/089477
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English (en)
French (fr)
Inventor
卢宁川
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歌尔丹拿音响有限公司
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Application filed by 歌尔丹拿音响有限公司 filed Critical 歌尔丹拿音响有限公司
Publication of WO2018196141A1 publication Critical patent/WO2018196141A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Definitions

  • the present invention relates to the field of heat dissipation structures, and more particularly to a power amplifier.
  • the heat-dissipating shell and the bottom cover integrally formed by die-casting constitute a main structural member and have a built-in PCBA.
  • This structure has poor heat dissipation and is suitable for low power power amplifiers.
  • a power amplifier includes a housing body, side fins, a fan and a baffle, the inner wall of the housing body is in contact with a high power component of the power amplifier for heat conduction, the side fins are two, and juxtaposed Provided on an outer surface of the housing body, the baffle is disposed opposite to the outer surface, and the side fins, the outer surface and the baffle form an air flow path, and the fan is located at the One end of the airflow path.
  • a heat conducting protrusion is disposed on the inner wall, and the heat conducting protrusion is disposed opposite to an area between the side fins or the two side fins, and the high power component and the heat conduction Raised contact.
  • a thermally conductive silicone pad is disposed between the high power component and the thermally conductive bump.
  • the distance between the two side fins is gradually reduced from an end adjacent the fan toward an end remote from the fan.
  • an intermediate fin disposed between the two side fins is further included.
  • the intermediate fins are plural, the intermediate fins are spaced apart from the fan, and a spacing between the intermediate fins near the center line and the fan is greater than the middle distance from the center line. The spacing between the fins and the fan.
  • a plurality of said intermediate fins form an inlet region of approximately "V" shape.
  • the height of the fan is greater than the height of the intermediate fin, and a first slope from the fan to the middle fin is disposed at a position opposite to the air inlet region of the outer surface And/or a second slope from the fan to the intermediate fin being disposed at a position opposite the air inlet region of the deflector.
  • a distance between the baffle and an outer surface of the housing body is gradually reduced from an end near the fan toward an end away from the fan.
  • a PCBA is further included, the PCBA being disposed in the housing body, and the high power component of the PCBA is in contact with an inner wall of the housing body.
  • the power amplifier has poor heat dissipation effect and is not suitable for heat dissipation of high power components. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • the power amplifier of the embodiment of the present invention forms an air flow path through the side fins, the outer surface, and the deflector, and the wind generated by the fan is restricted to flow in the air flow path. In this way, airflow loss can be reduced and the flow rate can be increased.
  • the power amplifier has a good heat dissipation effect and is suitable for heat dissipation of high power components.
  • the heat dissipation structure is disposed outside the housing body, does not occupy the internal space, and the heat is lost quickly.
  • the power amplifier has a simple structure and is convenient to disassemble and install.
  • the fins increase the heat dissipation area and enable faster heat dissipation.
  • FIG. 1 is an exploded view of a portion of a power amplifier in accordance with one embodiment of the present invention.
  • FIG. 2 is an exploded view of a power amplifier in accordance with one embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a housing body according to an embodiment of the present invention.
  • Figure 4 is a view of another angle of Figure 3.
  • Figure 5 is an assembled view of a fan and housing body in accordance with one embodiment of the present invention.
  • 11 housing body; 12: side fins; 13: intermediate fins; 14: fan; 15: heat conducting protrusions; 16: baffles; 17: second slope; 18: first slope; 19: inlet air District; 20: PCBA.
  • 1 is an exploded view of a portion of a power amplifier in accordance with one embodiment of the present invention.
  • 2 is an exploded view of a power amplifier in accordance with one embodiment of the present invention.
  • a power amplifier is provided.
  • This power amplifier is especially suitable for on-board use in various vehicles.
  • the power amplifier includes a housing body 11, side fins 12, a fan 14, and a baffle 16.
  • the housing body 11 is plate-shaped having an inner wall and an outer surface.
  • the inner wall of the housing body 11 is in contact with the high power components of the power amplifier for heat conduction.
  • the casing body 11 is made of a copper alloy or an aluminum alloy. These materials have good thermal conductivity and are easy to process.
  • high power components are in direct contact with the inner wall.
  • the side fins 12 are two and are juxtaposed on the outer surface of the casing body 11. For example, the side fins 12 are perpendicular to the outer surface. The two side fins 12 are arranged in parallel with a set distance therebetween; or the two side fins 12 are not parallel, but extend in substantially the same direction.
  • the deflector 16 is disposed opposite the outer surface of the housing body 11. The deflector 16 is used to direct the air flow.
  • the side fins 12 are integrally formed with the housing body 11.
  • the housing body 11 is integrally molded by casting or die casting, which simplifies the processing steps and has high joint strength.
  • a threaded hole perpendicular to the outer surface is provided on the side fin 12.
  • the user secures the baffle 16 to the side fins 12 by screws. In this way, the disassembly and assembly of the deflector 16 is facilitated.
  • the fins 12, the outer surface and the baffle 16 form an air flow path, and the fan 14 is located at one end of the air flow path.
  • the wind generated by the fan 14 passes through the air flow path to carry away heat conducted by the internal heating elements to the outer surface and the side fins 12.
  • the power amplifier of the embodiment of the present invention forms an air flow path through the outer surface of the side fin 12 and the deflector 16, and the wind generated by the fan 14 is restricted to flow in the air flow path. In this way, airflow loss can be reduced and the flow rate can be increased.
  • the power amplifier has a good heat dissipation effect and is suitable for heat dissipation of high power components.
  • the heat dissipation structure of the power amplifier is disposed outside the casing body, does not occupy the internal space, and the heat is lost quickly.
  • the power amplifier has a simple structure and is convenient to disassemble and install.
  • the fins 12 increase the heat dissipation area, enabling faster heat dissipation.
  • the power amplifier includes a PCBA 20 (Printed Circuit Board Assembly) PCBA 20 disposed in the housing body 11, and the high power component of the PCBA 20 is in contact with the inner wall of the housing body 11. For heat conduction.
  • PCBA 20 Print Circuit Board Assembly
  • a thermally conductive bump 15 is provided on the inner wall. As shown in FIG. 4, the heat conducting projection 15 protrudes from the inner wall of the housing body 11 to be in contact with the high power component.
  • the high power component is in contact with the thermally conductive bumps 15.
  • high power components are chips, resistive components, capacitive components, and the like.
  • the thermally conductive bumps 15 are disposed opposite the regions between the side fins 12 or the two side fins 12 to facilitate conduction of heat to the outer surface or to the side fins 12.
  • the heat transfer protrusion 15 is made of a material having good heat conduction. For example, copper alloys, aluminum alloys, and the like.
  • the heat conductive protrusions 15 and the side fins 12 are integrally formed with the case body 11.
  • it is integrally molded by casting or die casting. In this way, the processing steps are simplified and the joint strength is high.
  • a thermally conductive silicone pad is disposed between the high power component and the thermally conductive bumps 15.
  • Thermally conductive silicone pads are effective in increasing the efficiency of heat transfer.
  • thermal conductive silicone pad has elasticity and can function to buffer vibration.
  • the distance between the two side fins 12 is gradually reduced from the end adjacent the fan 14 toward the end remote from the fan 14.
  • the two side fins 12 form a wedge structure.
  • the cross-sectional area of the airflow passage is gradually reduced from the air inlet region 19 to the air outlet, which can effectively compensate for the pressure loss caused by the extension of the airflow passage distance, increase the wind pressure, and improve the airflow speed, which is beneficial to The heat is lost.
  • the power amplifier further includes an intermediate fin 13 disposed between the two side fins 12.
  • the arrangement of the intermediate fins 13 effectively increases the heat dissipation area, enabling the heat of the high power components to be quickly dissipated.
  • the intermediate fins 13 are perpendicular to the outer surface, and the intermediate fins 13 extend in substantially the same direction as the side fins 12 to form a plurality of flow paths.
  • the height of the intermediate fins 13 is uniform to facilitate uniform flow of the plurality of flow paths.
  • the intermediate fins 13, the side fins 12, the heat conducting protrusions 15 and the housing body 11 are The body is molded, for example, by casting or die casting. In this way, the processing steps are simplified and the joint strength is high.
  • the integrated structure facilitates the rapid conduction of heat.
  • the intermediate fins 13 are plural.
  • the intermediate fins 13 are spaced apart from the fan 14.
  • the spacing between the intermediate fins 13 adjacent the centerline and the fan 14 is greater than the spacing between the intermediate fins 13 away from the centerline and the fan 14.
  • the center line is the same distance to the two side fins 12, as shown in FIG. In this way, the pressure loss of the wind during the flow can be reduced.
  • the occurrence of turbulence can be reduced, the energy loss of the wind is reduced, and the wind pressure is increased.
  • the distance from the center line to the two side fins 12 is equal.
  • the middle fins 13 are four, and the two are distributed on both sides of the center line.
  • the distance between the two intermediate fins 13 near the centerline and the fan 14 is greater than the distance between the two intermediate fins 13 away from the centerline and the fan 14.
  • the plurality of intermediate fins 13 form an air inlet region 19 of approximately "V” shape.
  • an air intake region 19 of an approximately "V” shape is formed.
  • the approximate "V" shape may be an air inlet region 19 that forms a "V" shape, a U shape, or an arc shape. This structure can further reduce pressure loss and reduce turbulence.
  • the height of the fan 14 is greater than the height of the intermediate fins 13. In this way, it is ensured that the air supply area of the fan 14 is greater than or equal to the cross-sectional area of the air flow path to ensure that sufficient wind enters the air flow path.
  • a first slope 18 that is excessive from the fan 14 to the intermediate fin 13 is disposed at a position of the outer surface opposite to the air inlet region 19, and/or a fan 14 is disposed at a position of the deflector 16 opposite the air inlet region 19.
  • To the second slope 17 of the intermediate fin 13 is excessive. In this way, it is possible to effectively reduce the wind resistance and increase the wind pressure after reaching the intermediate fins 13.
  • the outer surface of the casing body 11 is recessed at a portion where the fan 14 is mounted, and the first slope 18 is provided in the air inlet region 19.
  • the first ramp 18 enables the wind of the fan 14 to smoothly enter the gap between the intermediate fins 13 and the gap between the intermediate fins 13 and the side fins 12.
  • the deflector 16 is shaped to contract inwardly at the inlet region 19 to form a second ramp 17.
  • the second ramp 17 enables the wind of the fan 14 to smoothly enter A gap between the fins 13 and a gap between the intermediate fins 13 and the fins 12.
  • the height of the casing body 11 can be reduced, which facilitates assembly into other equipment, and conforms to the trend of thinning and miniaturization of electronic equipment.
  • the distance between the baffle 16 and the outer surface of the housing body 11 is gradually reduced from the end adjacent the fan 14 toward the end remote from the fan 14.
  • the cross-sectional area of the airflow passage is gradually reduced from the air inlet region 19 to the air outlet, and the pressure loss caused by the extension of the airflow passage distance can be effectively compensated, the wind pressure is increased, and the airflow speed is increased. Conducive to heat loss.

Abstract

一种功率放大器，包括壳体本体(11)、边翅片(12)、风扇(14)和导流板(16)，所述壳体本体(11)的内壁与所述功率放大器的大功率元件接触以进行热传导，所述边翅片(12)为两个，并且并列设置在所述壳体本体(11)的外表面上，所述导流板(16)与所述外表面相对设置，所述边翅片(12)、所述外表面和所述导流板(16)构成气流通路，所述风扇(14)位于所述气流通路的一端。该功率放大器具有散热效果良好的特点。

Description

一种功率放大器 技术领域
本发明涉及散热结构技术领域，更具体地，涉及一种功率放大器。
背景技术
功率放大器在工作时，内部元器件会产生大量的热量。当热量不能及时散发时，会严重影响电子元件的可靠性和使用寿命。同时随着功率放大器性能的不断提高，芯片功率也随之不断提升，从而直接导致了更多的热量产生。
现有功率放大器的散热结构通常有两种。
例如，压铸一体成型的散热壳体与底盖构成主结构件，内置PCBA。这种结构散热效果差，适用于低功率的功率放大器。
例如，在芯片位置加装散热器，并增加风扇进行散热。这种方式虽然可以通过风冷迅速的降低芯片上的温度，但整个热量仍聚集在壳体内部，需要合理的器件排布以及风道设计才能起到散热效果，对器件的布置要求高。壳体内部整体热量偏高，对器件的运行环境不利，同时这样的组装较为复杂，体积大，生产效率低。
发明内容
本发明的一个目的是提供一种功率放大器的新技术方案。
根据本发明的第一方面，提供了一种功率放大器。该功率放大器包括壳体本体、边翅片、风扇和导流板，所述壳体本体的内壁与所述功率放大器的大功率元件接触以进行热传导，所述边翅片为两个，并且并列设置在所述壳体本体的外表面上，所述导流板与所述外表面相对设置，所述边翅片、所述外表面和所述导流板构成气流通路，所述风扇位于所述气流通路的一端。
可选地，在所述内壁上设置有导热凸起，所述导热凸起与所述边翅片或者两个所述边翅片之间的区域相对设置，所述大功率元件与所述导热凸起接触。
可选地，在所述大功率元件与所述导热凸起之间设置有导热硅胶垫。
可选地，两个所述边翅片之间的距离由靠近所述风扇的一端向远离所述风扇的一端逐渐减小。
可选地，还包括设置在两个所述边翅片之间的中间翅片。
可选地，所述中间翅片为多个，所述中间翅片与所述风扇相间隔，靠近中线的所述中间翅片与所述风扇之间的间距大于远离所述中线的所述中间翅片与所述风扇之间的间距。
可选地，多个所述中间翅片形成近似“V”字形的进风区。
可选地，所述风扇的高度大于所述中间翅片的高度，在所述外表面的与所述进风区相对的位置设置有由所述风扇到所述中间翅片过度的第一斜坡，和/或在所述导流板的与所述进风区相对的位置设置有由所述风扇到所述中间翅片过度的第二斜坡。
可选地，所述导流板与所述壳体本体的外表面之间的距离由靠近所述风扇的一端向远离所述风扇的一端逐渐减小。
可选地，还包括PCBA，所述PCBA被设置在所述壳体本体内，所述PCBA的大功率元件与所述壳体本体的内壁接触。本发明的发明人发现，在现有技术中，功率放大器的散热效果差，不适用于大功率元件的散热。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
本发明实施例的功率放大器通过边翅片、外表面和导流板形成气流通路，风扇产生的风被限定在气流通路内流动。通过这种方式，能够减少气流损失，增加了流速。
此外，该功率放大器具有良好的散热效果，适用于大功率元件的散热。
此外，散热结构设置在壳体本体外侧，不占用内部空间，热量散失迅速。
此外，该功率放大器的结构简单，拆、装方便。
此外，边翅片增加了散热面积，能够使散热更迅速。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是根据本发明一个实施例的功率放大器局部的分解图。
图2是根据本发明一个实施例的功率放大器的分解图。
图3是根据本发明一个实施例的壳体本体的结构示意图。
图4是图3另一个角度的视图。
图5是根据本发明一个实施例的风扇与壳体本体的装配图。
附图标记说明：
11：壳体本体；12：边翅片；13：中间翅片；14：风扇；15：导热凸起；16：导流板；17：第二斜坡；18：第一斜坡；19：进风区；20：PCBA。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步 讨论。
图1是根据本发明一个实施例的功率放大器局部的分解图。图2是根据本发明一个实施例的功率放大器的分解图。
根据本发明的一个实施例，提供了一种功率放大器。该功率放大器尤其适用于各种车辆的车载使用。该功率放大器包括壳体本体11、边翅片12、风扇14和导流板16。例如，壳体本体11为板状，其具有内壁和外表面。
壳体本体11的内壁与功率放大器的大功率元件接触以进行热传导。例如，壳体本体11由铜合金或者铝合金制造而成。这些材料导热性能良好并且便于加工。例如，大功率元件直接与内壁接触。
边翅片12为两个，并且并列设置在壳体本体11的外表面上。例如，边翅片12垂直于外表面。两个边翅片12平行设置，二者之间具有设定的距离；或者是两个边翅片12不平行，但延伸方向大致相同。导流板16与壳体本体11的外表面相对设置。导流板16用于引导气流。
优选的是，边翅片12与壳体本体11一体成型。例如，采用浇铸或者压铸的方式一体成型，这样能简化加工步骤并且二者的连接强度高。
例如，如图1所示，在边翅片12上设置有垂直于外表面的螺纹孔。用户通过螺钉将导流板16固定到边翅片12上。通过这种方式，导流板16的拆、装变得方便。
边翅片12、外表面和导流板16构成气流通路，风扇14位于气流通路的一端。风扇14产生的风经由气流通路，以带走由内部发热元件传导至外表面和边翅片12的热量。
本发明实施例的功率放大器通过边翅片12外表面和导流板16形成气流通路，风扇14产生的风被限定在气流通路内流动。通过这种方式，能够减少气流损失，增加了流速。
此外，该功率放大器具有良好的散热效果，适用于大功率元件的散热。
此外，该功率放大器的散热结构设置在壳体本体外侧，不占用内部空间，热量散失迅速。
此外，该功率放大器的结构简单，拆、装方便。
此外，边翅片12增加了散热面积，能够使散热更迅速。
在一个例子中，如图2所示，该功率放大器包括PCBA20(Printed Circuit Board Assembly，印刷线路板组件)PCBA20被设置在壳体本体11内，PCBA20的大功率元件与壳体本体11的内壁接触，以便进行热传导。
在一个例子中，在内壁上设置有导热凸起15。如图4所示，导热凸起15凸出于壳体本体11的内壁，以便与大功率元件接触。大功率元件与导热凸起15接触。例如，大功率元件为芯片、电阻元件、电容元件等。
导热凸起15与边翅片12或者两个边翅片12之间的区域相对设置，以便于将热量传导至外表面或者边翅片12上。导热凸起15采用热传导良好的材质。例如，铜合金、铝合金等。
例如，优选的是，导热凸起15和边翅片12与壳体本体11一体成型。例如，采用浇铸或者压铸的方式一体成型。通过这种方式，简化了加工步骤并且连接强度高。
优选的是，在大功率元件与导热凸起15之间设置有导热硅胶垫。导热硅胶垫能够有效地提高热量传导的效率。
此外，导热硅胶垫具有弹性，能够起到缓冲振动的作用。
如果两个边翅片12平行设置，随着风扇14的风逐渐远离风扇14，由于风阻的作用，风压会逐渐降低，风速逐渐降低，这样不利于热量的散失。
在一个例子中，两个边翅片12之间的距离由靠近风扇14的一端向远离风扇14的一端逐渐减小。例如，两个边翅片12形成斜楔结构。通过这种方式，气流通路的横截面积由进风区19到出风口逐渐减小，能够有效地弥补气流通路距离延长带来的压力损失，增大了风压，提高了气流速度，有利于热量散失。
在一个例子中，功率放大器还包括设置在两个边翅片12之间的中间翅片13。中间翅片13的设置有效地增加了散热面积，能够使大功率元件的热量迅速散发。
例如，中间翅片13垂直于外表面，中间翅片13的延伸方向与边翅片12大致相同，以便形成多股流道。中间翅片13的高度一致，以便于多股流道的气流均匀。
优选的是，中间翅片13、边翅片12、导热凸起15与壳体本体11一 体成型，例如采用浇铸或者压铸的方式一体成型。通过这种方式，简化了加工步骤并且连接强度高。
此外，一体化的结构有利于热量的快速传导。
本领域技术人员能够根据实际需要设置中间翅片13的数量。
在一个例子中，中间翅片13为多个。中间翅片13与风扇14相间隔。靠近中线的中间翅片13与风扇14之间的间距大于远离中线的中间翅片13与风扇14之间的间距。例如，中线为到两个边翅片12的距离相同的线，如图3所示。通过这种方式，能够降低风在流动过程中的压力损失。
此外，能够降低紊流现象的发生，降低了风的能量损失，提高了风压。
例如，如图3所示，中线到两个边翅片12的距离相等。中间翅片13为4个，两两分布在中线的两侧。靠近中线的两个中间翅片13与风扇14之间的距离大于远离中线的两个中间翅片13与风扇14之间的距离。这种结构能够降低压力损失，降低紊流。
优选的是，多个中间翅片13形成近似“V”字形的进风区19。例如，如图3和5所示，由于多个中间翅片13与风扇14之间距离不同，形成近似“V”字形的进风区19。例如,近似“V”字形可以是形成“V”字形、U形或者弧形的进风区19。这种结构能够进一步降低压力损失，降低紊流。
在一个例子中，风扇14的高度大于中间翅片13的高度。通过这种方式，能保证风扇14送风面积大于等于气流通路的截面积，以保证足够的风进入气流通路中。
在外表面的与进风区19相对的位置设置有由风扇14到中间翅片13过度的第一斜坡18，和/或在导流板16的与进风区19相对的位置设置有由风扇14到中间翅片13过度的第二斜坡17。通过这种方式，能够有效地减小风阻，并且增大到达中间翅片13后的风压。
例如，如图3所示，壳体本体11的外表面在安装风扇14的部位凹陷下去，在进风区19设置有第一斜坡18。第一斜坡18能够使风扇14的风平滑进入中间翅片13之间的间隙以及中间翅片13与边翅片12之间的间隙。
例如，如图1所示，将导流板16做成在进风区19处向内收缩的形状以形成第二斜坡17。同样地，第二斜坡17能够使风扇14的风平滑进入中 间翅片13之间的间隙以及中间翅片13与边翅片12之间的间隙。
此外，这样能够减小壳体本体11局部的高度，便于装配到其他设备中，顺应了电子设备轻薄化、小型化的发展趋势。
在一个例子中，导流板16与壳体本体11的外表面之间的距离由靠近风扇14的一端向远离风扇14的一端逐渐减小。通过这种方式，气流通路的横截面积由进风区19到出风口逐渐减小，同样能够有效地弥补气流通路距离延长带来的压力损失，增大了风压，提高了气流速度，有利于热量散失。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种功率放大器，其特征在于，包括壳体本体(11)、边翅片(12)、风扇(14)和导流板(16)，所述壳体本体(11)的内壁与所述功率放大器的大功率元件接触以进行热传导，所述边翅片(12)为两个，并且并列设置在所述壳体本体(11)的外表面上，所述导流板(16)与所述外表面相对设置，所述边翅片(12)、所述外表面和所述导流板(16)构成气流通路，所述风扇(14)位于所述气流通路的一端。
  2. 根据权利要求1所述的功率放大器，其特征在于，在所述内壁上设置有导热凸起(15)，所述导热凸起(15)与所述边翅片(12)或者两个所述边翅片(12)之间的区域相对设置，所述大功率元件与所述导热凸起(15)接触。
  3. 根据权利要求1或2所述的功率放大器，其特征在于，在所述大功率元件与所述导热凸起(15)之间设置有导热硅胶垫。
  4. 根据权利要求1-3中的任意一项所述的功率放大器，其特征在于，两个所述边翅片(12)之间的距离由靠近所述风扇(14)的一端向远离所述风扇(14)的一端逐渐减小。
  5. 根据权利要求1-4中的任意一项所述的功率放大器，其特征在于，还包括设置在两个所述边翅片(12)之间的中间翅片(13)。
  6. 根据权利要求1-5中的任意一项所述的功率放大器，其特征在于，所述中间翅片(13)为多个，所述中间翅片(13)与所述风扇(14)相间隔，靠近中线的所述中间翅片(13)与所述风扇(14)之间的间距大于远离所述中线的所述中间翅片(13)与所述风扇(14)之间的间距。
  7. 根据权利要求1-6中的任意一项所述的功率放大器，其特征在于，多个所述中间翅片(13)形成近似“V”字形的进风区(19)。
  8. 根据权利要求1-7中的任意一项所述的功率放大器，其特征在于，所述风扇(14)的高度大于所述中间翅片(13)的高度，在所述外表面的与所述进风区(19)相对的位置设置有由所述风扇(14)到所述中间翅片(13)过度的第一斜坡(18)，和/或在所述导流板(16)的与所述进风区(19)相对的位置设置有由所述风扇(14)到所述中间翅片(13)过度的第二斜坡(17)。
  9. 根据权利要求1-8中的任意一项所述的功率放大器，其特征在于，所述导流板(16)与所述壳体本体(11)的外表面之间的距离由靠近所述风扇(14)的一端向远离所述风扇(14)的一端逐渐减小。
  10. 根据权利要求1-9中的任意一项所述的功率放大器，其特征在于，还包括PCBA(20)，所述PCBA(20)被设置在所述壳体本体(11)内，所述PCBA(20)的大功率元件与所述壳体本体(11)的内壁接触。
PCT/CN2017/089477 2017-04-27 2017-06-22 一种功率放大器 WO2018196141A1 (zh)

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