WO2021227846A1 - 适于电子设备液冷散热的液冷板及散热单元 - Google Patents

适于电子设备液冷散热的液冷板及散热单元 Download PDF

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Publication number
WO2021227846A1
WO2021227846A1 PCT/CN2021/089655 CN2021089655W WO2021227846A1 WO 2021227846 A1 WO2021227846 A1 WO 2021227846A1 CN 2021089655 W CN2021089655 W CN 2021089655W WO 2021227846 A1 WO2021227846 A1 WO 2021227846A1
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WIPO (PCT)
Prior art keywords
heat dissipation
liquid
liquid cooling
cooling plate
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/089655
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English (en)
French (fr)
Inventor
陈前
刘方宇
高阳
巫跃凤
宁洪燕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen MicroBT Electronics Technology Co Ltd
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Shenzhen MicroBT Electronics Technology Co Ltd
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Application filed by Shenzhen MicroBT Electronics Technology Co Ltd filed Critical Shenzhen MicroBT Electronics Technology Co Ltd
Priority to CA3169872A priority Critical patent/CA3169872A1/en
Priority to US17/801,302 priority patent/US20230086448A1/en
Publication of WO2021227846A1 publication Critical patent/WO2021227846A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • This application relates to the technical field of liquid cooling and heat dissipation of electronic equipment, and in particular to a liquid cooling plate and a heat dissipation unit suitable for liquid cooling and heat dissipation of electronic equipment.
  • a liquid cooling plate can also be installed on the surface of the electronic device to ensure timely heat dissipation of the electronic device.
  • the liquid cooling plate is usually installed on the side of the electronic device with the heating element, and the other side of the electronic device still uses a fan for heat dissipation, that is, the existing liquid cooling
  • the board only solves part of the thermal load of the electronic equipment, and does not completely remove the fan, resulting in poor heat dissipation and inconvenient installation and use.
  • the embodiments of the present application provide a liquid cooling plate and a heat dissipation unit suitable for liquid cooling and heat dissipation of electronic equipment.
  • the embodiment of the present application provides a liquid cooling plate suitable for liquid cooling and heat dissipation of electronic equipment, the liquid cooling plate includes a liquid cooling plate body and at least one heat dissipation channel;
  • the liquid cooling plate body has a first heat dissipation surface and a second heat dissipation surface arranged in parallel, the first heat dissipation surface is a plane, and the second heat dissipation surface is arranged with a plurality of heat dissipation bosses;
  • a heat dissipation flow extending along the heat dissipation boss is provided inside the body of the liquid cooling plate
  • a plurality of the heat dissipation channels are communicated to form a cooling liquid flow path, and the cooling liquid flow path has an inlet and an outlet.
  • the embodiment of the present application also discloses a heat dissipation unit, the heat dissipation unit includes at least two liquid cooling plates, and the liquid cooling plates are the liquid cooling plates of the foregoing embodiments;
  • the first heat dissipation surfaces of the at least two liquid cooling plates are connected to the plane surface of the first electronic device; the cooling liquid flow paths of the at least two liquid cooling plates are arranged in parallel, so that the first electron The equipment is liquid-cooled to dissipate heat; or,
  • the at least two liquid cooling plates are stacked, a second electronic device is arranged between adjacent liquid cooling plates, and the first heat dissipation surface of one of the adjacent liquid cooling plates is connected to the second electronic device
  • the first surface of the first surface is a flat surface
  • the second heat dissipation surface of the other one of the adjacent liquid cooling plates is connected to the second surface of the second electronic device
  • the second surface is arranged with heat generating Unit, the heat dissipation boss on the second heat dissipation surface abuts the heating unit;
  • the coolant flow paths of the at least two liquid cooling plates are arranged in parallel, so that the second electronic device is liquid-cooled and dissipated.
  • the liquid-cooling plate includes a liquid-cooling plate body.
  • the liquid-cooling plate body has a flat first heat dissipation surface and a second heat dissipation surface provided with a plurality of heat dissipation bosses.
  • a heat dissipation channel corresponding to the position of the heat dissipation boss is provided between the surfaces.
  • the heat dissipation channel extends along the heat dissipation boss, and a plurality of heat dissipation channels are connected to form a cooling liquid flow path, and the cooling liquid flow path has an inlet for the cooling liquid to circulate. In this way, the coolant flows in from the inlet of the coolant flow path and flows out from the outlet to cool and dissipate the electronic equipment.
  • the electronic device when the electronic device is a first electronic device such as a power box, the first heat dissipation surface of the liquid cooling plate is used to connect to the plane of the power box to realize heat dissipation.
  • the electronic device when the electronic device is, for example, a computing power board of a data processing device, a plurality of liquid cooling plates are stacked, and the second heat dissipation surfaces of the plurality of liquid cooling plates face the same, and then the adjacent liquid cooling plates A hashrate board is arranged between the cold plates, and a side of the hashrate board with a heating unit is in contact with the second heat dissipation surface.
  • the plurality of liquid cooling plates can achieve complete liquid cooling and heat dissipation of the first surface and the second surface of the calculation force plate.
  • FIG. 1 is a schematic diagram of the structure of a liquid cooling plate in an embodiment of the application.
  • FIG. 2 is a schematic diagram of the installation structure of the first sealing plate, the second sealing plate and the heat dissipation body in the embodiment of the application.
  • FIG. 3 is a schematic diagram of the structure of the heat dissipation runner in the embodiment of the application.
  • FIG. 4 is a schematic diagram of the installation structure of the first heat dissipation surface and the second electronic device in the embodiment of the application.
  • FIG. 5 is a schematic diagram of the installation structure of the liquid cooling plate and the second electronic device in an embodiment of the application.
  • FIG. 6 is a schematic diagram of the installation structure of the liquid cooling plate and the first electronic device in an embodiment of the application.
  • FIG. 7 is a schematic diagram of an installation structure of a plurality of liquid cooling plates on a plurality of second electronic devices in an embodiment of the application.
  • FIG. 8 is a schematic diagram of the parallel structure of heat dissipation runners in an embodiment of the application.
  • 16-second electronic equipment 161-substrate unit, 162-heating unit,
  • the data processing device used for acquiring virtual currency may be a computer for acquiring virtual currency, including at least one computing power board, and each computing power board has a heating unit that provides computing power, and computing power ( Also known as hash rate) refers to the measurement unit of virtual currency network processing capacity, that is, the speed of calculating the output of the hash function.
  • liquid cooling plates can be used for liquid cooling and heat dissipation of hashrate plates.
  • the existing liquid cooling plates only solve part of the heat load of the data processing equipment, and do not completely remove the fans, resulting in a heat dissipation effect. Poor, inconvenient to install and use. For this reason, it is necessary to propose a cold-plate liquid-cooled heat dissipation structure that can solve the entire thermal load of the data processing equipment.
  • the embodiment of the present application provides a liquid cooling plate suitable for liquid cooling and heat dissipation of electronic equipment.
  • the liquid cooling plate 10 includes a liquid cooling plate body and at least one heat dissipation channel 133.
  • the body of the liquid cooling plate has a first heat dissipation surface 131 and a second heat dissipation surface 132 arranged in parallel, the first heat dissipation surface 131 is a plane, and the second heat dissipation surface 132 is arranged with a plurality of heat dissipation bosses 1321; on the first heat dissipation surface 131 and the second heat dissipation surface 132 respectively correspond to the position of at least one heat dissipation boss 1321, the body of the liquid cooling plate is provided with a heat dissipation runner 133 extending along the heat dissipation boss 1321, and a plurality of the heat dissipation runners 133
  • the communication constitutes a cooling liquid flow path, and the
  • one heat dissipation channel may correspond to one heat dissipation boss, or may correspond to two or more heat dissipation bosses, and the inlet and outlet of the cooling liquid flow path are connected with the cooling liquid external circulation heat dissipation system.
  • the first heat dissipation surface 131 is used to interface with the flat surface of the first electronic device 15, and the cooling liquid flows in from the inlet of the cooling liquid flow path and flows out from the outlet, so that the first electronic device 15 is liquid-cooled and dissipated.
  • the first electronic device may be a power box of a data processing device, and the flat first heat dissipation surface on the body of the liquid-cooling plate may be connected to the surface of the power box, so that the liquid-cooling plate is used for The power box dissipates heat.
  • the first heat dissipation surface 131 is used for docking with the first surface of the second electronic device 16
  • the first surface of the second electronic device 16 is flat
  • the second heat dissipation surface 132 is used for docking with the second electronic device 16.
  • a heating unit 162 is arranged on the second surface of the electronic device 16, and the heat dissipation boss 1321 is used to abut the heating unit 162.
  • the width corresponds to at least one heating unit, and the cooling liquid flows in from the inlet of the cooling liquid flow path and flows out from the outlet, so that the second electronic device is liquid-cooled and dissipated.
  • the second electronic device may be a computing power board of a data processing device.
  • the flat first heat dissipation surface on the body of the liquid cooling plate can be connected to the first surface of the calculation plate 1 (that is, the back surface of the calculation plate 1, which is a flat surface), and the first heat dissipation surface with a plurality of heat dissipation bosses can be arranged.
  • the two heat-dissipating surfaces are connected to the second side (that is, the front surface of the hash board 2) of the hash board 2 where the heating unit is provided, so that the liquid-cooled board is used to dissipate heat for the plurality of hash boards.
  • the power board 1 and the power board 2 may also be referred to as a power board group of a data processing device.
  • the heating unit may be a computing chip.
  • the liquid cooling plate used to dissipate the heat of the power box and the liquid cooling board used for the calculation can be set independently.
  • only the computing power board (set) of the data processing device may use the liquid cooling plate provided in this application for heat dissipation, and the power box may use other liquid cooling plates with planar contact surfaces for heat dissipation.
  • the power box and the computing power board can be formed into a sandwich structure with the liquid cooling plate provided in the present application.
  • the plane surface of the power box is butted with the first heat dissipation surface (which is a plane) of the liquid cooling plate, and the second heat dissipation surface (arranged with multiple heat dissipation bosses) of the liquid cooling plate is connected to the front side of the hashrate board (with chips). ) Docking, so that both the power box and the hashrate board realize heat dissipation through the liquid cooling plate. It is also possible to form a sandwich structure between the power box and the hash board group and the liquid-cooled board provided in this application.
  • the flat surface 1 of the power supply box is butted with the first heat dissipation surface (which is a plane) of the liquid cooling plate 1, and the second heat dissipation surface (arranged with a plurality of The heat dissipation boss) is butted with the front side of the computing power board 1 (with chips)
  • the flat surface 2 of the power box is butted with the first heat dissipation surface (which is a plane) of the liquid cooling plate 2
  • the second heat dissipation surface of the liquid cooling plate 2 (Arranged with multiple heat-dissipating bosses) butt with the front side of the hash board 2 (with chips).
  • the back side of the hash board 1 (which is a flat surface with no chip on it) can also be connected to the second side of the liquid cooling board 3.
  • a heat dissipation surface is connected, and the back of the computing power board 2 (which is a flat surface with no chip on it) may also be connected to the first heat dissipation surface of the liquid cooling plate 4.
  • the liquid cooling plates 3 and 4 may not be limited to this application. The liquid-cooling plate in the middle, and so on, until the power box and all the hash boards are cooled by the liquid-cooling plate.
  • the surface of the power box is butted with the first heat dissipation surface (which is a plane) of the liquid cooling plate 1, and the second heat dissipation of the liquid cooling plate 1
  • the surface (arranged with multiple heat dissipation bosses) is butted with the front side (with chips) of the hash board 1, and the back of the hash board 1 (it is a flat surface without a chip on it) is connected to the first heat dissipation surface of the liquid cooling board 2.
  • the second heat dissipation surface of the liquid cooling plate 2 is connected to the front of the hash plate 2, and so on, until the power box and all the hash plates realize heat dissipation through the liquid cooling plate.
  • the liquid-cooling plate body is, for example, in the shape of a flat plate.
  • the first heat dissipation surface is flat, and then, between the first heat dissipation surface and the second heat dissipation surface, the liquid cooling plate body is provided with a coolant flow path formed by a plurality of heat dissipation flow paths communicated with each other to cool
  • the liquid flow path has an inlet and an outlet, and the inlet and the outlet of the cooling liquid flow path are in communication with the cooling liquid external circulation heat dissipation system.
  • the cooling liquid enters from the inlet and then flows through the cooling liquid flow path inside the liquid cooling plate body and then flows out from the outlet, so that the two heat dissipation surfaces of the liquid cooling plate body have a heat dissipation effect.
  • the liquid cooling plate can be applied to the first electronic device 15. At least one surface of the first electronic device is a flat surface.
  • the first electronic device is, for example, a power box of a data processing device.
  • a liquid cooling plate is arranged on the side wall (which is a plane), and the first heat dissipation surface 131 of the liquid cooling plate is installed on the side wall of the power box.
  • the cooling liquid flow paths of the multiple liquid cooling plates can be arranged in parallel, so that the liquid cooling plate can perform liquid cooling and heat dissipation on the first electronic device, and the heat dissipation is uniform. According to actual needs, the liquid cooling plate can be installed on multiple planes of the first electronic device.
  • the liquid-cooled board can be applied to the second electronic device 16, which is, for example, a computing power board of a data processing device.
  • the computing power board includes a substrate unit 161, the first surface of the substrate unit is a plane, and the second surface of the substrate unit is provided with a heating unit 162, for example, computing chips are arranged in an array. Then, the two liquid cooling plates clamp the second electronic device, and the first heat dissipation surface of the first liquid cooling plate is in contact with the first surface of the substrate unit, and the second heat dissipation surface of the second liquid cooling plate is in contact with the substrate.
  • the second surface of the unit abuts, and the heat dissipation boss of the second heat dissipation surface abuts the heat generating unit.
  • the two liquid cooling plates can dissipate heat from both sides of the second electronic device, and can fully meet the heat dissipation requirements of the second electronic device, without using a fan, and the heat dissipation is uniform.
  • the computing power plate is usually arranged in multiple stacks.
  • multiple liquid cooling plates can be stacked and sandwiched with multiple computing power plates.
  • the liquid flow paths can be arranged in parallel, that is, one liquid cooling plate can perform liquid cooling and heat dissipation on the two hash plates on both sides at the same time, or in other words, a hash plate can perform liquid cooling and heat dissipation through the two liquid cooling plates on both sides. Therefore, the heat dissipation efficiency is improved, and the plurality of liquid cooling plates can carry all the heat load of the computing power board, without using a fan.
  • the liquid cooling plate can be applied to the computing power board and/or power supply of data processing equipment.
  • the power box is liquid-cooled to dissipate heat, and the heat dissipation requirements of the hash board can be met without the use of fans, and the heat dissipation is even.
  • the liquid cooling board of the embodiment of the present application can be applied to the liquid cooling heat dissipation of the two electronic devices of the power supply and the computing power board, and can bear the heat dissipation requirements of the above two electronic devices without installing a fan.
  • the liquid-cooling plate includes a liquid-cooling plate body.
  • the liquid-cooling plate body has a flat first heat dissipation surface and a second heat dissipation surface provided with a plurality of heat dissipation bosses.
  • a heat dissipation channel corresponding to the position of the heat dissipation boss is provided between the surfaces.
  • the heat dissipation channel extends along the heat dissipation boss, and a plurality of heat dissipation channels are connected to form a cooling liquid flow path, and the cooling liquid flow path has an inlet and an outlet. In this way, The coolant flows into the coolant flow path from the inlet and flows out from the outlet to cool and dissipate the electronic equipment.
  • the electronic device when the electronic device is a first electronic device such as a power supply box, the first heat dissipation surface of the liquid cooling plate is used to connect to the plane of the power supply box to realize heat dissipation.
  • the electronic device when the electronic device is, for example, a computing power board of a data processing device, a plurality of liquid cooling plates are stacked, and the second heat dissipation surfaces of the plurality of liquid cooling plates face the same, and then the adjacent A hashrate board is arranged between the liquid cooling plates, and the face of the hashrate board with the heating unit is in contact with the second heat dissipation surface.
  • the first heat dissipation surface of one liquid cooling plate is used to connect to the plane of the substrate unit, and the other liquid cooling plate
  • the second heat dissipation surface of the base plate is used to abut the side of the substrate unit where the heating unit is arranged, and the heat dissipation boss of the second heat dissipation surface abuts the heating unit to achieve heat dissipation.
  • the plurality of liquid cooling plates can achieve complete liquid cooling and heat dissipation of the first surface and the second surface of the calculation force plate.
  • the area of the first heat dissipation surface or the second heat dissipation surface of the liquid cooling plate can be determined according to actual needs; and the thickness of the liquid cooling plate, that is, the thickness between the two heat dissipation surfaces, can be determined according to actual needs.
  • the caliber of the required heat dissipation channel is determined.
  • the aforementioned heat dissipation channel should be determined according to the number and position of the heat dissipation boss.
  • a number of heat dissipation bosses are arranged in parallel on the second heat dissipation surface, and the number of heat dissipation runners is the same as the number of heat dissipation bosses, that is, one heat dissipation runner corresponds to one heat dissipation boss, and the first heat dissipation surface and Between the second heat dissipation surfaces, the position of the heat dissipation runner corresponds to the position of the heat dissipation boss; for another example, one heat dissipation runner can correspond to two or more heat dissipation bosses, that is, the number of heat dissipation runners is smaller than that of the heat dissipation boss.
  • the number of platforms can correspond to at least one heat dissipation boss.
  • several heat dissipation channels are connected to form a cooling fluid channel.
  • the cooling liquid flow path has two ports, namely an inlet and an outlet, for circulating the cooling liquid.
  • the interval between the heat dissipation bosses is determined according to the array arrangement of the heating units on the second electronic device, for example, according to the array arrangement of the chips on the computing power board.
  • the interval between the heat dissipation runners may correspond to the interval between the heat dissipation bosses.
  • the width of the heat dissipation boss should be guaranteed to cover the heating unit, for example, the width of the heat dissipation boss is slightly larger than the width of the heating unit.
  • one piece of the above-mentioned heat dissipation boss can also correspond to the width of a plurality of heat generating units, that is, at least one heat generating unit may be provided on the cross-sectional width perpendicular to the flow direction of the cooling liquid.
  • the above-mentioned heat dissipation boss corresponds to the position of the heating unit, and other electronic components are avoided through the gap between adjacent heat dissipation bosses; the center position of the heat dissipation runner should correspond to the center position of the heating unit to ensure The heat of the heating unit can be discharged in time.
  • a plurality of heat dissipation flow channels are connected in series to form a cooling liquid flow path.
  • FIG. 3 for example, a plurality of heat dissipation channels are connected in series to form an S-shaped cooling liquid flow path.
  • the arrow direction in FIG. 3 indicates the flow direction of the cooling liquid along the cooling liquid flow path. In this way, it can be ensured that the cooling liquid flow path connects each heat dissipation flow path in series, thereby ensuring uniform heat dissipation.
  • the liquid cooling plate body further has a first side wall and a second side wall that are arranged oppositely; wherein, the inlet of the cooling liquid flow path And the outlet are both arranged on the first side wall.
  • the inlet and the outlet of the coolant flow path are both provided on the same side wall, that is, the first side wall, and the first side wall is located on the first heat dissipation surface and the first side wall. Between two cooling surfaces.
  • the external pipes of the cooling liquid are located on the same side of the liquid cooling plate, and then interfaces such as power supply or signal lines can be arranged on the other side (the second side wall), that is, to achieve Hydraulic and electric separation, thereby improving the convenience and safety and reliability of use.
  • the liquid cooling plate body includes a heat dissipation body 13 and a first sealing plate 11 and a second sealing plate 12 installed on the heat dissipation body 13; wherein, the heat dissipation body 13 has the above-mentioned first heat dissipation surface 131 And a second heat dissipation surface 132, the heat dissipation main body 13 is provided with heat dissipation runners 133, which penetrate both ends of the heat dissipation main body 13; the first sealing plate 11 and the second sealing plate 12 are respectively mounted on the heat dissipation main body 13 To make the first sealing plate 11 and the second sealing plate 12 close the heat dissipation channel 133, and make the first sealing plate 11 and the second sealing plate 12 constitute a first side wall and a second side wall, respectively; The first sealing plate 11 is provided with a first through hole 111 and a second through hole 112 respectively, and the first through hole 111 and the second through hole 112 respectively constitute the inlet and
  • the liquid cooling plate body includes a heat dissipation body, a first sealing plate, and a second sealing plate.
  • the heat dissipation body has the above-mentioned first heat dissipation surface and second heat dissipation surface.
  • the heat dissipation flow path penetrates the heat dissipation main body, and then the first sealing plate and the second sealing plate are respectively installed on both ends of the heat dissipation main body, that is, the heat dissipation flow path is closed.
  • the first sealing plate constitutes the above-mentioned first side wall
  • the second sealing plate constitutes the above-mentioned second side wall.
  • the first through hole and the second through hole respectively constitute the inlet and the outlet of the coolant flow path.
  • the main body of the liquid cooling plate is composed of three mounting parts.
  • the heat dissipation runner is convenient to process and easy to realize.
  • adjacent heat dissipation channels 133 are separated by a supporting wall 134, and the supporting wall 134 is provided with a notch 135; and, the adjacent supporting wall 134
  • the notches 135 are respectively close to the first sealing plate 11 and the second sealing plate 12, so that a plurality of heat dissipation flow channels 133 are connected in series to form a cooling liquid flow path.
  • a support wall is provided between the first heat dissipation surface and the second heat dissipation surface, a heat dissipation channel is formed between adjacent support walls, and one end of the support wall is provided with a gap, which can provide Coolant passes through;
  • the gaps of the adjacent supporting walls are respectively close to the first and second sealing plates, that is, for example, the gap of the first supporting wall is located on the side of the first sealing plate, and the second adjacent to it
  • the notch of the supporting wall is located on one side of the second sealing plate, and so on.
  • a plurality of heat dissipation runners can be connected in series to form a coolant flow path; then, the heat dissipation runners on both sides penetrate the first sealing plate to form a first through hole and a second through hole, respectively.
  • the size of the gap should be determined according to the actual required coolant flow and flow rate.
  • the first heat dissipation surface 131 is provided with a plurality of first mounting holes 1311, the first mounting holes 1311 avoid the heat dissipation runner 133; the first heat dissipation surface 131 protrudes with a mounting outer edge 1312, The mounting outer edge 1312 is provided with a second mounting hole 1313.
  • a plurality of first mounting holes are provided on the first heat dissipation surface, and the screws 17 pass through the first electronic device.
  • the side wall of the device or the substrate unit of the second electronic device is then fixed to the first mounting hole to achieve fixed installation.
  • the first mounting hole should avoid the position of the heat dissipation channel of the liquid cooling plate.
  • first heat dissipation surface also protrudes with a mounting outer edge, and the mounting outer edge is provided with a second mounting hole.
  • a screw (not shown in the figure) can be used to pass through the second installation. Holes to realize the stacking installation of multiple liquid cooling plates, or to fix the liquid cooling plates on the two side walls of the power box.
  • the second mounting hole can be passed through the screw first to make the two liquid-cooling plates clamp the power supply box, and then, according to actual needs Use screws to locate and install in the first mounting hole from the inside of the power box.
  • the second heat dissipation surface is further provided with an abutment boss 1322, and the abutment boss 1322 is higher than the heat dissipation boss 1321, so that the abutment boss 1322 abuts against the second electronic device 16
  • the heat dissipation boss 1321 abuts the heating unit 162;
  • the abutment boss 1322 is provided at both ends of the second heat dissipation surface 132, and/or, the abutment boss 1322 is disposed on the adjacent heat dissipation boss 1321 between.
  • an abutting boss is also provided on the second heat dissipation surface, and the abutting boss is used to abut the substrate unit of the second electronic device.
  • the heat dissipation boss is used to abut the heating unit, and then the abutment boss is used to abut the substrate unit. Therefore, the height of the abutment boss is It should be greater than the height of the heat dissipation boss, which should be determined according to the height of the heating unit. In other words, the height difference between the abutment boss and the heat dissipation boss should be the height of the heating unit.
  • the heat dissipation boss just abuts the heating unit to ensure the heat dissipation boss Full contact with the heating unit facilitates heat dissipation, and at the same time, the heating unit will not be crushed and damaged by the heat dissipation boss.
  • the abutting boss may be provided at both ends of the second heat dissipation surface; in another embodiment of the present application, the abutting boss may be provided in the middle of the second heat dissipation surface Location, that is, between adjacent heat dissipation bosses.
  • the first heat dissipation surface is coated with thermally conductive silicone grease, and the surface of the heat dissipation boss is provided with a thermally conductive silicon pad.
  • the thermally conductive silicone grease facilitates the conduction of heat from the sidewall of the first electronic device or the substrate unit of the second electronic device to the first heat dissipation surface.
  • the thermally conductive silicon pad facilitates the conduction of heat from the heating unit to the heat dissipation boss
  • the thermally conductive silicon pad plays a buffering role to prevent the heat dissipation boss from squeezing and damage the heating unit.
  • the above-mentioned thermal conductive silicone grease and thermal conductive silicon pad are beneficial to improve heat dissipation efficiency and heat dissipation uniformity.
  • a hollow cavity 136 is further provided inside the body of the liquid cooling plate, and the hollow cavity 136 is located between adjacent heat dissipation channels 133.
  • one or more hollow cavities can also be provided inside the liquid cooling plate body.
  • the hollow cavities are located between adjacent heat dissipation channels. In this way, the hollow cavity can reduce the weight of the liquid cooling plate and save costs.
  • the inner wall of the heat dissipation channel is provided with a turbulence structure; the turbulence structure includes corrugated protrusions 1331 or tooth-shaped protrusions extending along the heat dissipation channel, and/or the turbulence structure includes Spiral protrusions extending from the heat dissipation channel.
  • a turbulence structure can be provided inside the heat dissipation channel.
  • the turbulence structure can enhance the convection and heat transfer of the coolant, that is, increase the flow velocity and increase the intensity of turbulence, thereby reducing the size of the coolant and the heating unit. The temperature difference between the two ensures a better heat exchange effect under a small circulating flow rate of the coolant.
  • the turbulent flow structure can adopt a corrugated convex design with a relatively simple processing technology. This design increases the heat exchange area while reducing the flow interface under a certain flow channel width requirement.
  • the spoiler structure may adopt a spiral protrusion extending along the heat dissipation channel.
  • the spoiler structure can also be realized by designing a spoiler column or filling a spoiler structure inside the heat dissipation channel, such as a coil spring.
  • the first through hole 111 and the second through hole 112 extend outwardly with a butt pipe 14, and the butt pipe 14 is used to connect a cooling liquid.
  • a plurality of heat dissipation flow channels 133 are connected in parallel to form a cooling liquid flow path.
  • the above-mentioned multiple heat dissipation channels can also be connected in parallel to form a cooling fluid channel.
  • the heat dissipation channel 133 should be arranged perpendicular to the direction of the first side wall and the second side wall.
  • the coolant flows through each heat dissipation runner in turn, that is, for the heat dissipation runners after the first heat dissipation runner, the coolant absorbs a certain amount of heat Enter later, which is not good for heat dissipation.
  • the circulation flow rate of the cooling liquid can be reduced, and the flow rate of the cooling liquid can be increased, that is, the series connection of the heat dissipation flow channels is suitable for the case of a small circulation flow rate of the cooling liquid.
  • the coolant flows through each heat dissipation channel at the same time, and there is no such disadvantageous heat dissipation. Therefore, the parallel connection of the heat dissipation channels is suitable for a larger circulation flow of coolant.
  • An embodiment of the present application also provides a heat dissipation unit having a liquid cooling plate, the heat dissipation unit including at least two liquid cooling plates, and the at least two liquid cooling plates are the liquid cooling plates in the foregoing embodiment;
  • the first heat dissipation surfaces of the at least two liquid cooling plates are connected to the plane surface of the first electronic device; the cooling liquid flow paths of the at least two liquid cooling plates are arranged in parallel, so that the first electron The equipment is liquid-cooled to dissipate heat; or,
  • the at least two liquid cooling plates are stacked, a second electronic device is arranged between adjacent liquid cooling plates, and the first heat dissipation surface of one of the adjacent liquid cooling plates is connected to the second electronic device
  • the first surface of the first surface is a flat surface
  • the second heat dissipation surface of the other one of the adjacent liquid cooling plates is connected to the second surface of the second electronic device
  • the second surface is arranged with heat generating Unit, the heat dissipation boss on the second heat dissipation surface abuts the heating unit;
  • the coolant flow paths of the at least two liquid cooling plates are arranged in parallel, so that the second electronic device is liquid-cooled and dissipated.
  • the liquid cooling plate of the above embodiment should be made of a material with better thermal conductivity and lower density, such as metal or alloy material, especially aluminum alloy material.
  • the liquid cooling plate in the embodiment of the present application is provided with parallel planar heat dissipation surfaces and boss heat dissipation surfaces. Furthermore, the two liquid cooling plates can be opposed to a second electronic device with a heating unit (such as a computing power board). ) Dissipate heat from both sides, and the liquid cooling plate is also suitable for first electronic equipment such as power boxes.
  • the liquid cooling plate provided by the embodiment of the present application has good heat dissipation effect, can fully carry the heat dissipation load of the above-mentioned electronic equipment, removes the heat dissipation fan, and solves the technical problems of poor heat dissipation effect and inconvenient installation and use caused by the use of fans for heat dissipation. , So as to achieve the heat dissipation requirements of two electronic devices such as power boxes and hash boards without using fans, and the technical effect of uniform heat dissipation.
  • each component or each step can be decomposed and/or recombined.
  • decompositions and/or recombinations shall be regarded as equivalent solutions of this application.

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Abstract

本申请公开了一种适于电子设备液冷散热的液冷板及散热单元。该液冷板包括液冷板本体和至少一个散热流道，液冷板本体具有平行设置的第一散热面和第二散热面，第一散热面为平面，第二散热面布置有多个散热凸台，在第一散热面和第二散热面之间，分别对应至少一个散热凸台的位置，液冷板本体内部设有一个沿着该散热凸台延伸的散热流道，多个散热流道联通构成冷却液流路，该冷却液流路具有入口和出口。

Description

适于电子设备液冷散热的液冷板及散热单元
本申请要求于2020年5月12日提交中国专利局、申请号为202020778277.8、名称为“适于电子设备液冷散热的液冷板及具有其的散热单元”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备的液冷散热技术领域，尤其涉及一种适于电子设备液冷散热的液冷板及散热单元。
背景技术
随着计算技术的发展，对电子设备的运算性能要求越来越高，这就导致了电子设备中芯片等元器件的功耗及密集程度的提升，而为了保证电子设备的最佳工作状态，需要对电子设备进行散热，但是，目前传统的风冷散热(例如采用风扇进行散热)已经不能满足上述的散热需求。
现有技术中，还可以在电子设备表面加装液冷板，以保证电子设备的及时散热。
然而，在上述方案中，由于液冷板的结构限制，通常是在电子设备设有发热元件的一面加装液冷板，而电子设备另一面仍然采用风扇进行散热，即，现有的液冷板只解决了电子设备的部分热负荷，并没有完全去除风扇，造成散热效果不佳，安装、使用不方便。
申请内容
本申请实施例提供了一种适于电子设备液冷散热的液冷板及散热单元。
本申请实施例提供了一种适于电子设备液冷散热的液冷板，所述液冷板包括液冷板本体和至少一个散热流道；
所述液冷板本体具有平行设置的第一散热面和第二散热面，所述第一散热面为平面，所述第二散热面布置有多个散热凸台；
在所述第一散热面和所述第二散热面之间，分别对应至少一个所述散热凸台的位置，所述液冷板本体内部设有一个沿着所述散热凸台延伸的散热流道，多个所述散热流道联通构成冷却液流路，所述冷却液流路具有入口和出口。
本申请实施例还公开了一种散热单元，所述散热单元包括至少两个液冷板，所述液冷板为上述实施例的液冷板；
其中，所述至少两个液冷板的所述第一散热面对接第一电子设备的平面表面；所述至少两个液冷板的冷却液流路并联设置，以使所述第一电子设备液冷散热；或者，
所述至少两个液冷板堆叠设置，相邻液冷板之间设有第二电子设备，并且，所述相邻液冷板中的一个的第一散热面对接所述第二电子设备的第一面，所述第一面为平面，所述相邻液冷板中的另一个的第二散热面对接所述第二电子设备的第二面，所述第二面布置有发热单元，所述第二散热面上的散热凸台抵接所述发热单元；所述至少两个液冷板的冷却液流路并联设置，以使所述第二电子设备液冷散热。
本申请实施例中提供的一个或多个技术方案至少具有如下技术效果或优点：
本申请实施例中，该液冷板包括液冷板本体，液冷板本体具有平面的第一散热面和设有多个散热凸台的第二散热面，在第一散热面和第二散热面之间设有对应散热凸台位置的散热流道，该散热流道沿散热凸台延伸，并且，多个散热流道联通构成冷却液流路，冷却液流路具有供冷却液循环的入口和出口，这样，冷却液自冷却液流路的入口流入并从出口流出，以对电子设备液冷散热。
本申请实施例中，当电子设备为诸如电源箱等的第一电子设备时，该液冷板的第一散热面用于对接电源箱的平面，以实现散热。本申请另一实施例中，当电子设备为例如数据处理设备的算力板时，多个液冷板堆叠，并且该多个液冷板的第二散热面朝向相同，然后在相邻的液冷板之间设置有算力板，算力板设有发热单元的一面与第二散热面对接。这样，通过液冷板与算力板的堆叠夹心设置，该多个液冷板可以实现对算力板的第一面和第二面完全液冷散热。采用本申请实施例的液冷板，可以不必使用风扇，而且散热效果良好，能够完全承载上述两种电子设备的散热负荷，使用和安装方便。
附图简要说明
图1为本申请实施例中液冷板的结构示意图。
图2为本申请实施例中第一封板、第二封板和散热主体的安装结构示意图。
图3为本申请实施例中散热流道的结构示意图。
图4为本申请实施例中第一散热面与第二电子设备的安装结构示意图。
图5为本申请实施例中液冷板与第二电子设备的安装结构示意图。
图6为本申请实施例中液冷板与第一电子设备的安装结构示意图。
图7为本申请实施例中多个液冷板对多个第二电子设备的安装结构示意图。
图8为本申请实施例中散热流道并联的结构示意图。
附图标记：
10-液冷板，
11-第一封板，111-第一通孔，112-第二通孔，
12-第二封板，
13-散热主体，
131-第一散热面，1311-第一安装孔，1312安装外缘，1313-第二安装孔，
132-第二散热面，1321-散热凸台，1322-抵接凸台，
133-散热流道，1331-波纹凸起，
134-支撑壁，
135-缺口，
136-中空腔，
14-对接管，
15-第一电子设备，
16-第二电子设备，161-基板单元，162-发热单元，
17-螺钉。
具体实施方式
为了更好的理解上述技术方案，下面将结合说明书附图以及具体的实施方式对上述技术方案进行详细的说明。
随着计算技术的发展，特别是随着虚拟货币技术的发展，对用于虚拟货币获取的数据处理设备的需求不断增大，对数据处理设备的体积及芯片算力的性能要求也越来越高，从而导致芯片的功耗及密集程度的提升。同时，为了使芯片保持最佳的工作状态从而使数据处理设备的性能发挥到极致，需要对数据处理设备的算力板和电源箱等电子设备进行散热。然而，传统的依靠风冷散热的数据处理设备不仅工作环境恶劣，而且风冷散热噪音大，算力板进出风位置处的芯片的温度差异也很大。在本申请实施例中，用于虚拟货币获取的数据处理设备可以是用于获取虚拟货币的计算机，包括至少一个算力板，每个算力板上具有提供算力的发热单元，算力(也称哈希率)是指虚拟货币网络处理能力的度量单位，即计算哈希函数输出的速度。
目前，可以使用例如液冷板等对算力板进行液冷散热，然而，现有的液冷板由于结构限制，也只解决了数据处理设备的部分热负荷，没有完全去除风扇，造成散热效果不佳，安装、使用不方便。为此，需要提出一种可以解决数据处理设备的全部热负荷的冷板式液冷散热结构。
本申请实施例提供了一种适于电子设备液冷散热的液冷板，该液冷板10包括液冷板本体和至少一个散热流道133。其中，该液冷板本体具有平行设置的第一散热面131和第二散热面132，第一散热面131为平面，第二散热面132布置有多个散热凸台1321；在第一散热面131和第二散热面132之间，分别对应至少一个散热凸台1321的位置，该液冷板本体内部设有一个沿着散热凸台1321延伸的散热流道133，多个该散热流道133联通构成冷却液流路，该冷却液流路具有入口和出口。在本申请实施例中，一个散热流道可以对应一个散热凸台，也可以对应两个或更多个散热凸台，冷却液流路的入口和出口与冷却液外循环散热系统联通。
在本申请实施例中，该第一散热面131用于对接第一电子设备15的平面表面，冷却液自冷却液流路的入口流入并从出口流出，以使第一电子设备15液冷散热。在具体实施方式中，该第一电子设备可以为数据处理设备的电源箱，则可以将液冷板本体上的平面的第一散热面与电源箱的表面对接，从而将液冷板用于为电源箱散热。
在本申请另一实施例中，该第一散热面131用于对接第二电子设备16的第一面，第二电子设备16的第一面为平面，第二散热面132用于对接第二电子设备16的第二面，第二电子设备的第二面布置有发热单元162，并且，该散热凸台1321用于抵接发热单元162，每个散热凸台在垂直于冷却液流向的截面宽度上对应至少一个发热单元，冷却液自冷却液流路的入口流入并从出口流出，以使第二电子设备液冷散热。在具体实施方式中，该第二电子设备可以为数据处理设备的算力板。例如，可以将液冷板本体上的平面的第一散热面与算力板1的第一面(即算力板1的背面，其为平面)对接，将布置有多个散热凸台的第二散热面与算力板2的设有发热单元的第二面(即算力板2的正面)对接，从而将液冷板用于为多个算力板散热。算力板1和算力板2也可以称为数据处理设备的算力板组。因为一个液冷板只能为算力板1的背面和算力板2的正面散热，则算力板1的正面和算力板2的背面可以分别对接其它的液冷板进行散热。在本申请实施例中，发热单元可以为计算芯 片。
在本申请实施例中，如果数据处理设备的电源箱和算力板(组)都采用本申请提供的液冷板进行散热，则用于为电源箱散热的液冷板和用于为算力板(组)散热的液冷板可以独立设置。在本申请其它实施例中，也可以只有数据处理设备的算力板(组)采用本申请提供的液冷板进行散热，而电源箱可以采用其他具有平面接触面的液冷板散热。
在本申请实施例中，可以将电源箱和算力板与本申请提供的液冷板形成夹心结构。例如，电源箱的平面表面与液冷板的第一散热面(其为平面)对接，液冷板的第二散热面(布置有多个散热凸台)与算力板的正面(设有芯片)对接，使电源箱和算力板都通过液冷板实现散热。也可以将电源箱和算力板组与本申请提供的液冷板形成夹心结构。例如，在电源箱具有2个平面表面时，则电源箱的平面表面1与液冷板1的第一散热面(其为平面)对接，液冷板1的第二散热面(布置有多个散热凸台)与算力板1的正面(设有芯片)对接，电源箱的平面表面2与液冷板2的第一散热面(其为平面)对接，液冷板2的第二散热面(布置有多个散热凸台)与算力板2的正面(设有芯片)对接，此外，算力板1的背面(其为平面，其上无芯片)也可以与液冷板3的第一散热面对接，算力板2的背面(其为平面，其上无芯片)也可以与液冷板4的第一散热面对接，其中，液冷板3、4可以不限于本申请中的液冷板，以此类推，直到电源箱和所有算力板都通过液冷板实现散热。再例如，如果数据处理设备的算力板组包括至少两个算力板，则电源箱的表面与液冷板1的第一散热面(其为平面)对接，液冷板1的第二散热面(布置有多个散热凸台)与算力板1的正面(设有芯片)对接，算力板1的背面(其为平面，其上无芯片)与液冷板2的第一散热面对接，液冷板2的第二散热面与算力板2的正面对接，以此类推，直到电源箱和所有算力板都通过液冷板实现散热。
具体的，结合图1、图2、图5所示，该液冷板本体例如为平板状，液冷板本体的第一散热面和第二散热面平行设置，第二散热面设有多个散热凸台，第一散热面为平面，然后，在第一散热面和所述第二散热面之间，液冷板本体内部设有由多个散热流道联通构成的冷却液流路，冷却液流路具有入口和出口，冷却液流路的入口和出口与冷却液外循环散热系统联通。这样，冷却液从入口进入然后流经液冷板本体内部的冷却液流路后从出口流出，即可使得液冷板本体的两个散热面均具有散热效果。
例如，结合图6，该液冷板可适用于第一电子设备15，第一电子设备的至少一个表面为平面，该第一电子设备例如为数据处理设备的电源箱，然后，在电源箱的侧壁(为平面)上设置液冷板，液冷板的第一散热面131安装在电源箱的侧壁上。当安装有多个液冷板时，多个液冷板的冷却液流路可以并联设置，这样，该液冷板能够对第一电子设备进行液冷散热，并且散热均匀。根据实际需要，该液冷板可以安装在第一电子设备的多个平面上。
例如，结合图4、5、7，该液冷板可适用于第二电子设备16，第二电子设备例如为数据处理设备的算力板。算力板包括基板单元161，基板单元的第一面为平面，基板单元的第二面设有发热单元162，例如以阵列形式布置有计算芯片。然后，两个该液冷板夹住第二电子设备，并且，第一个液冷板的第一散热面与基板单元的第一面对接，第二个液冷板的第二散热面与基板单元的第二面对接，并且第二散热面的散热凸台抵接发热单元。这样，该两个液冷板能够对第二电子设备从两面进行散热，并且能够完全满足第二电子设备的散热需求，不必使用风扇，并且散热均匀。
此外，在本申请实施例中，算力板通常为多个堆叠设置，此时，结合图7，多个该液 冷板可与多个算力板堆叠夹心设置，多个液冷板的冷却液流路可以并联设置，即一个液冷板可以同时对两侧的两个算力板进行液冷散热，或者说，一个算力板可以通过两侧的两个液冷板进行液冷散热，从而提高了散热效率，而且该多个液冷板可以承载算力板的全部热负荷，不必使用风扇。
基于上述实施例可见，通过在液冷板上设置平面的第一散热面和设有散热凸台的第二散热面，使得该液冷板能够适用于数据处理设备的算力板和/或电源设备的散热需求，并且，当数据处理设备具有多个算力板时，可以将多个液冷板和多个算力板和/或电源箱堆叠夹心设置，从而能够从算力板的两面和/或电源箱进行液冷散热，不需使用风扇即可满足算力板的散热需求，并且散热均匀。
也就是说，本申请实施例的液冷板可以适用于电源和算力板两种电子设备的液冷散热，并且能够承载上述两种电子设备的散热需求，不必安装风扇。
本申请实施例中，该液冷板包括液冷板本体，液冷板本体具有平面的第一散热面和设有多个散热凸台的第二散热面，在第一散热面和第二散热面之间设有对应散热凸台位置的散热流道，该散热流道沿散热凸台延伸，并且，多个散热流道联通构成冷却液流路，冷却液流路具有入口和出口，这样，冷却液自入口流入冷却液流路并从出口流出，以对电子设备液冷散热。
在本申请实施例中，当电子设备为诸如电源箱等的第一电子设备时，该液冷板的第一散热面用于对接电源箱的平面，以实现散热。在本申请另一实施例中，当电子设备为例如数据处理设备的算力板时，多个液冷板堆叠，并且该多个液冷板的第二散热面朝向相同，然后在相邻的液冷板之间设置有算力板，算力板设有发热单元的一面与第二散热面对接。例如，当电子设备为基板单元的一面布置有发热元件、基板单元的另一面为平面的算力板时，一个液冷板的第一散热面用于对接基板单元的平面，另一个液冷板的第二散热面用于对接基板单元布置有发热单元的一面，并且，第二散热面的散热凸台与发热单元抵接，以实现散热。这样，通过液冷板与算力板的堆叠夹心设置，该多个液冷板可以实现对算力板的第一面和第二面完全液冷散热。采用本申请实施例的液冷板，可以不必使用风扇，而且散热效果良好，能够完全承载上述两种电子设备的散热负荷，使用和安装方便。
在本申请实施例中，上述液冷板的第一散热面或第二散热面的面积可以根据实际需要确定；并且，该液冷板的厚度，即两个散热面之间的厚度可以根据实际需要的散热流道的口径确定。
在本申请实施例中，上述散热流道应根据散热凸台的数量及位置确定。例如，第二散热面上平行的布置有若干条散热凸台，该散热流道的数量与散热凸台的数量相同，即一个散热流道对应一个散热凸台，并且，在第一散热面和第二散热面之间，该散热流道的位置与散热凸台的位置对应；又例如，一个散热流道可以对应两个或更多个散热凸台，即该散热流道的数量小于散热凸台的数量；或者，换句话说，一个散热流道可以对应至少一个散热凸台。此外，若干条散热流道联通，然后构成冷却液流路。在本申请实施例中，该冷却液流路具有两个端口，即入口和出口，以供冷却液循环流动。
上述实施例中，该散热凸台的间隔根据第二电子设备上发热单元的阵列排布情况确定，例如根据算力板上的芯片的阵列排布情况确定。该散热流道的间隔可与散热凸台的间隔对应。该散热凸台的宽度应保证覆盖发热单元，例如，散热凸台的宽度稍大于发热单元的宽度。此外，一条上述的散热凸台也可对应多个发热单元的宽度，即，在垂直于冷却液流向 的截面宽度上，可以设置至少一个发热单元。
在本申请实施例中，上述散热凸台与发热单元的位置对应，并通过相邻散热凸台的间隙避开其它电子元件；该散热流道的中心位置应对应发热单元的中心位置，以保证发热单元的热量能够及时排出。
一种可能的实施方式中，多个散热流道串联联通，构成冷却液流路。
具体的，结合图3所示，例如，多个散热流道串联联通，构成S型冷却液流路，图3中箭头方向表示冷却液沿冷却液流路的流动方向。这样，可以保证冷却液流路串联起每一个散热流道，从而保证散热均匀。
一种可能的实施方式中，在第一散热面和第二散热面之间，液冷板本体还具有相对设置的第一侧壁和第二侧壁；其中，所述冷却液流路的入口和出口均设于所述第一侧壁。
具体的，结合图2所示，在本实施例中，该冷却液流路的入口和出口均设于同一个侧壁，即第一侧壁，该第一侧壁位于第一散热面和第二散热面之间。这样，在上述的入口和出口外接管道时，可以保证冷却液的外接管道位于液冷板的同一侧，然后可在另一侧(第二侧壁)布置例如电源或信号线等接口，即实现液电分离，从而提高了使用便利性和安全可靠性。
一种可能的实施方式中，该液冷板本体包括散热主体13和装设于散热主体13的第一封板11和第二封板12；其中，该散热主体13具有上述的第一散热面131和第二散热面132，该散热主体13内部设有散热流道133，散热流道133贯穿散热主体13的两端；该第一封板11和第二封板12分别装设于散热主体13的两端，以使第一封板11和第二封板12封闭散热流道133，并使第一封板11和第二封板12分别构成第一侧壁和第二侧壁；其中，第一封板11上分别设有第一通孔111和第二通孔112，该第一通孔111和第二通孔112分别构成上述冷却液的入口和出口。
具体结合图2，该液冷板本体包括散热主体、第一封板和第二封板，该散热主体具有上述的第一散热面和第二散热面，在散热主体内部设有多个散热流道，散热流道贯穿散热主体，然后将第一封板和第二封板分别装设在散热主体两端，即封闭散热流道。这样，该第一封板即构成上述的第一侧壁，第二封板即构成上述的第二侧壁，对应两侧散热流道的位置，在第一封板上分别设有第一通孔和第二通孔，这样，该第一通孔和第二通孔分别构成冷却液流路的入口和出口。
本实施例中，该液冷板本体由三个安装件安装拼接构成，第一封板和第二封板可采用焊接或粘接的方式固定安装在散热主体上，该散热主体设有贯穿的散热流道，加工方便，易于实现。
关于上述冷却液流路的构成，一种可能的实施方式中，相邻的散热流道133通过支撑壁134隔开，该支撑壁134上设有缺口135；并且，相邻的支撑壁134的缺口135分别靠近第一封板11和第二封板12，以使多个散热流道133串联联通，构成冷却液流路。
结合图2和图3，在第一散热面和第二散热面之间设置有支撑壁，相邻的支撑壁之间构成散热流道，并且，该支撑壁一端设有缺口，该缺口可以供冷却液通过；相邻的支撑壁的缺口分别靠近第一封板和第二封板，即，例如，第一个支撑壁的缺口位于第一封板一侧，与之相邻的第二个支撑壁的缺口位于第二封板一侧，依此类推。这样，多个散热流道可串联联通，构成冷却液流路；然后，两侧的散热流道贯穿第一封板，分别形成第一通孔和第二通孔。
本实施例中，通过简单的缺口设计以及将多个散热流道串联联通，可以实现均匀散热，并且，该缺口在散热主体上加工方便，易于实现。此外，该缺口的大小应根据实际需要的冷却液流量和流速确定。
一种可能的实施方式中，该第一散热面131设有多个第一安装孔1311，第一安装孔1311避开散热流道133；该第一散热面131凸出有安装外缘1312，该安装外缘1312设有第二安装孔1313。
可以参看图1和图4，为了使液冷板与第一电子设备或第二电子设备紧贴安装散热，在第一散热面上设有多个第一安装孔，螺钉17穿过第一电子设备的侧壁或第二电子设备的基板单元后固定在该第一安装孔，以实现固定安装。在本申请实施例中，该第一安装孔应避开液冷板散热流道的位置。
此外，该第一散热面还凸出有安装外缘，安装外缘设有第二安装孔，结合图1、图6、图7，可使用螺杆(图中未示出)穿过第二安装孔，以实现多个液冷板的堆叠安装，或使液冷板固定安装在电源箱两侧壁。
在本申请实施例中，例如当两个液冷板安装在电源箱两侧壁时，可以首先通过螺杆穿过第二安装孔以使两个液冷板夹住电源箱，然后，根据实际需要使用螺钉从电源箱内部定位安装在第一安装孔。
一种可能的实施方式中，该第二散热面还设有抵接凸台1322，抵接凸台1322高于散热凸台1321，以使抵接凸台1322抵接第二电子设备16的第二面，同时，该散热凸台1321抵接发热单元162；该抵接凸台1322设于第二散热面132两端，和/或，该抵接凸台1322设于相邻散热凸台1321之间。
参看图2，在第二散热面上还设有抵接凸台，该抵接凸台用于抵接第二电子设备的基板单元。在本申请实施例中，由于基板单元上设有一定高度的发热单元，散热凸台用于抵接发热单元，然后抵接凸台用于抵接基板单元，因此，该抵接凸台的高度应大于散热凸台的高度，具体应根据发热单元的高度确定。也就是说，抵接凸台和散热凸台的高度差应为发热单元的高度，此时，当抵接凸台抵接基板单元时，散热凸台正好抵接发热单元，以保证散热凸台与发热单元充分接触，利于散热，同时发热单元又不至于被散热凸台挤压损坏。
在本申请实施例中，参看图2，该抵接凸台可以设于第二散热面的两端；在本申请另一实施例中，该抵接凸台可以设于第二散热面的中间位置，即位于相邻散热凸台之间。
一种可能的实施方式中，该第一散热面涂覆有导热硅脂，该散热凸台表面设有导热硅垫。
导热硅脂有利于热量从第一电子设备的侧壁或第二电子设备的基板单元传导至第一散热面。导热硅垫一方面有利于热量从发热单元传导至散热凸台，另一方面，该导热硅垫起到缓冲作用，防止散热凸台将发热单元挤压损坏。上述的导热硅脂和导热硅垫利于提高散热效率及散热均匀性。
一种可能的实施方式中，液冷板本体内部还设有中空腔136，中空腔136位于相邻散热流道133之间。
参看图2，在液冷板本体内部，还可设置一个或多个中空腔，中空腔位于相邻的散热流道之间，这样，该中空腔能够减小液冷板的重量，节省成本。
一种可能的实施方式中，该散热流道内壁设有扰流结构；该扰流结构包括沿散热流道延伸的波纹凸起1331或齿状凸起，和/或，该扰流结构包括沿散热流道延伸的螺旋凸起。
本实施例中，可以在散热流道内部上设置扰流结构，该扰流结构可以对冷却液起到对流强化传热的作用，即提高流速，增强湍流强度，从而缩小了冷却液与发热单元之间的温差，保证在较小冷却液循环流量下具有较好换热效果。
参看图2，该扰流结构可以采用加工工艺较为简单的波纹凸起设计，这种设计在增加换热面积的同时，在一定流道宽度要求下减小了流通界面。在其它实施方式中，该扰流结构可以采用沿散热流道延伸的螺旋凸起。在其它实施方式中，该扰流结构还可以通过在散热流道内部设计扰流柱或填充扰流结构件，如螺旋弹簧等实现。
一种可能的实施方式中，结合图1和图2，该第一通孔111和第二通孔112向外延伸有对接管14，该对接管14用于连接冷却液。
一种可能的实施方式中，多个散热流道133并联联通，构成冷却液流路。
本实施例中，结合图8所示，上述多个散热流道还可并联联通，构成冷却液流路。此时，该散热流道133应垂直第一侧壁和第二侧壁方向设置。
在本申请实施例中，多个散热流道串联联通时，冷却液是依次流经每一个散热流道的，即，对于第一个散热流道之后的散热流道，冷却液是吸收一定热量后才进入的，这对散热不利。此时，可以缩小冷却液循环流量、增大冷却液的流速，即，散热流道串联联通适合较小冷却液循环流量的情况。
当多个散热流道并联联通时，冷却液是同时流经每一个散热流道，并不存在上述散热不利的情况，因此，散热流道并联联通适合较大冷却液循环流量的情况。
本申请实施例还提供了一种具有液冷板的散热单元，所述散热单元包括至少两个液冷板，所述至少两个液冷板为上述实施例中的液冷板；
其中，所述至少两个液冷板的所述第一散热面对接第一电子设备的平面表面；所述至少两个液冷板的冷却液流路并联设置，以使所述第一电子设备液冷散热；或者，
所述至少两个液冷板堆叠设置，相邻液冷板之间设有第二电子设备，并且，所述相邻液冷板中的一个的第一散热面对接所述第二电子设备的第一面，所述第一面为平面，所述相邻液冷板中的另一个的第二散热面对接所述第二电子设备的第二面，所述第二面布置有发热单元，所述第二散热面上的散热凸台抵接所述发热单元；所述至少两个液冷板的所述冷却液流路并联设置，以使所述第二电子设备液冷散热。
需要说明的是，上述实施例的液冷板在材质方面，应选用导热性能较好，同时密度较小的材料，例如金属或合金材料，尤其是铝合金材料。
由上述实施例可见，本申请实施例的液冷板设有平行的平面散热面和凸台散热面，进而，两个液冷板可以对设有发热单元的第二电子设备(例如算力板)从两面散热，并且，该液冷板还适用于电源箱等第一电子设备。本申请实施例提供的液冷板散热效果良好，可以完全承载上述电子设备的散热负荷，去除了散热风扇，从而解决了采用风扇进行散热而造成的散热效果不佳，安装、使用不便的技术问题，从而实现了不用风扇散热，适用电源箱和算力板等两种电子设备的散热需求，以及散热均匀的技术效果。
以上结合具体实施例描述了本申请的基本原理，但是，需要指出的是，在本申请中提及的优点、优势、效果等仅是示例而非限制，不能认为这些优点、优势、效果等是本申请的各个实施例必须具备的。另外，上述公开的具体细节仅是为了示例的作用和便于理解的作用，而非限制，上述细节并不限制本申请为必须采用上述具体的细节来实现。
本申请中涉及的器件、装置、设备、系统的方框图仅作为例示性的例子并且不意图要 求或暗示必须按照方框图示出的方式进行连接、布置、配置。如本领域技术人员将认识到的，可以按任意方式连接、布置、配置这些器件、装置、设备、系统。诸如“包括”、“包含”、“具有”等等的词语是开放性词汇，指“包括但不限于”，且可与其互换使用。这里所使用的词汇“或”和“和”指词汇“和/或”，且可与其互换使用，除非上下文明确指示不是如此。这里所使用的词汇“诸如”指词组“诸如但不限于”，且可与其互换使用。
还需要指出的是，在本申请的装置、设备和方法中，各部件或各步骤是可以分解和/或重新组合的。这些分解和/或重新组合应视为本申请的等效方案。
提供所公开的方面的以上描述以使本领域的任何技术人员能够做出或者使用本申请。对这些方面的各种修改对于本领域技术人员而言是非常显而易见的，并且在此定义的一般原理可以应用于其他方面而不脱离本申请的范围。因此，本申请不意图被限制到在此示出的方面，而是按照与在此公开的原理和新颖的特征一致的最宽范围。
为了例示和描述的目的已经给出了以上描述。此外，此描述不意图将本申请的实施例限制在此公开的形式。尽管以上已经讨论了多个示例方面和实施例，但是本领域技术人员将认识到其某些变型、修改、改变、添加和子组合均应包含在本申请保护的范围之内。

Claims (16)

  1. 一种适于电子设备液冷散热的液冷板，其特征在于，所述液冷板包括液冷板本体和至少一个散热流道(133)；
    所述液冷板本体具有平行设置的第一散热面(131)和第二散热面(132)，所述第一散热面(131)为平面，所述第二散热面(132)布置有多个散热凸台(1321)；
    在所述第一散热面(131)和所述第二散热面(132)之间，分别对应至少一个所述散热凸台(1321)的位置，所述液冷板本体内部设有一个沿着所述散热凸台(1321)延伸的散热流道(133)，多个所述散热流道(133)联通构成冷却液流路，所述冷却液流路具有入口和出口。
  2. 根据权利要求1所述的液冷板，其特征在于，所述第一散热面(131)用于对接第一电子设备(15)的平面表面；冷却液自所述冷却液流路的入口流入并从出口流出，以使所述第一电子设备(15)液冷散热；或者，
    所述第一散热面(131)用于对接第二电子设备(16)的第一面，所述第一面为平面，所述第二散热面(132)用于对接所述第二电子设备(16)的第二面，所述第二面布置有发热单元(162)，并且，所述散热凸台(1321)用于抵接所述发热单元(162)，每个散热凸台(1321)在垂直于冷却液流向的截面宽度上对应至少一个发热单元；冷却液自所述冷却液流路的入口流入并从出口流出，以使所述第二电子设备(16)液冷散热。
  3. 根据权利要求1所述的液冷板，其特征在于，多个所述散热流道(133)串联联通，构成所述冷却液流路。
  4. 根据权利要求3所述的液冷板，其特征在于，在所述第一散热面(131)和所述第二散热面(132)之间，所述液冷板本体还具有相对设置的第一侧壁和第二侧壁；其中，所述冷却液流路的入口和出口均设于所述第一侧壁。
  5. 根据权利要求4所述的液冷板，其特征在于，所述液冷板本体包括散热主体(13)和装设于所述散热主体(13)的第一封板(11)和第二封板(12)；其中，
    所述散热主体(13)具有所述第一散热面(131)和所述第二散热面(132)，所述散热主体(13)内部设有所述散热流道(133)，所述散热流道(133)贯穿所述散热主体(13)的两端；
    所述第一封板(11)和所述第二封板(12)分别装设于所述散热主体(13)的两端，以使所述第一封板(11)和所述第二封板(12)封闭所述散热流道(13)，并使所述第一封板(11)和所述第二封板(12)分别构成所述第一侧壁和所述第二侧壁；其中，所述第一封板(11)上分别设有第一通孔(111)和第二通孔(112)，所述第一通孔(111)和所述第二通孔(112)分别构成所述冷却液流路的入口和出口。
  6. 根据权利要求5所述的液冷板，其特征在于，相邻的所述散热流道(133)通过支撑壁(134)隔开，所述支撑壁(134)上设有缺口(135)；并且，相邻的所述支撑壁(134)的所述缺口(135)分别靠近所述第一封板(11)和所述第二封板(12)，以使多个所述散热流道(133)串联联通，构成所述冷却液流路。
  7. 根据权利要求1～6中任一项所述的液冷板，其特征在于，所述第一散热面(131)设有多个第一安装孔(1311)，所述第一安装孔(1311)避开所述散热流道(133)。
  8. 根据权利要求7所述的液冷板，其特征在于，所述第一散热面(131)凸出有安装 外缘(1312)，所述安装外缘(1312)设有第二安装孔(1313)。
  9. 根据权利要求1～6中任一项所述的液冷板，其特征在于，所述第二散热面(132)还设有抵接凸台(1322)，所述抵接凸台(1322)高于所述散热凸台(1321)，以使所述抵接凸台(1333)抵接所述第二电子设备(16)的第二面，同时，所述散热凸台(1321)抵接所述发热单元(162)。
  10. 根据权利要求9所述的液冷板，其特征在于，所述抵接凸台(1322)设于所述第二散热面(132)两端，和/或，所述抵接凸台(1322)设于相邻所述散热凸台(1321)之间。
  11. 根据权利要求1～6中任一项所述的液冷板，其特征在于，所述第一散热面(131)涂覆有导热硅脂，所述散热凸台表面设有导热硅垫。
  12. 根据权利要求1～6中任一项所述的液冷板，其特征在于，所述散热流道(133)内壁设有扰流结构。
  13. 根据权利要求12所述的液冷板，其特征在于，所述扰流结构包括沿所述散热流道延伸的波纹凸起(1331)或齿状凸起，和/或，所述扰流结构包括沿所述散热流道延伸的螺旋凸起。
  14. 根据权利要求1～6中任一项所述的液冷板，其特征在于，所述第一通孔(111)和所述第二通孔(112)向外延伸有对接管(14)，所述对接管(14)用于连接冷却液。
  15. 根据权利要求1所述的液冷板，其特征在于，多个所述散热流道(133)并联联通，构成所述冷却液流路。
  16. 一种散热单元，其特征在于，所述散热单元包括至少两个液冷板，所述液冷板为权利要求1～15中任一项所述的液冷板；
    其中，所述至少两个液冷板的所述第一散热面(131)对接第一电子设备(15)的平面表面；所述至少两个液冷板的冷却液流路并联设置，以使所述第一电子设备(15)液冷散热；或者，
    所述至少两个液冷板堆叠设置，相邻液冷板之间设有第二电子设备(16)，并且，所述相邻液冷板中的一个的第一散热面(131)对接所述第二电子设备(16)的第一面，所述第一面为平面，所述相邻液冷板中的另一个的第二散热面(132)对接所述第二电子设备(16)的第二面，所述第二面布置有发热单元(162)，所述第二散热面(132)上的散热凸台(1321)抵接所述发热单元(162)；所述至少两个液冷板的冷却液流路并联设置，以使所述第二电子设备(16)液冷散热。
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