WO2018192389A1 - Tête de transposition pour le transfert de micro-éléments - Google Patents

Tête de transposition pour le transfert de micro-éléments Download PDF

Info

Publication number
WO2018192389A1
WO2018192389A1 PCT/CN2018/082436 CN2018082436W WO2018192389A1 WO 2018192389 A1 WO2018192389 A1 WO 2018192389A1 CN 2018082436 W CN2018082436 W CN 2018082436W WO 2018192389 A1 WO2018192389 A1 WO 2018192389A1
Authority
WO
WIPO (PCT)
Prior art keywords
micro
adhesive layer
transposition head
flexible adhesive
substrate body
Prior art date
Application number
PCT/CN2018/082436
Other languages
English (en)
Chinese (zh)
Inventor
徐宸科
郑建森
邵小娟
林科闯
Original Assignee
厦门市三安光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 厦门市三安光电科技有限公司 filed Critical 厦门市三安光电科技有限公司
Publication of WO2018192389A1 publication Critical patent/WO2018192389A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present invention relates to a transposition head, and more particularly to a transposition head for micro component transfer.
  • Micro-element technology refers to an array of minute-sized components that are integrated at a high density on a substrate.
  • micro-light-emitting diode (Micro LED) technology is becoming a hot research topic, and the industry expects high-quality micro-component products to enter the market.
  • High-quality micro-pitch LED products can have a profound impact on traditional display products such as LCD/OL ED that are already on the market.
  • a micro-element is first formed on a donor substrate, and then the micro-element is transferred onto a receiving substrate.
  • the receiving substrate is, for example, a display screen.
  • One difficulty in the fabrication of microcomponents is how to transfer the microcomponents from the donor substrate to the receiving substrate.
  • a conventional method of transferring micro-elements is to transfer micro-elements from a transfer substrate to a receiving substrate by wafer bonding.
  • One of the implementation methods of the transfer method is direct transfer, that is, directly bonding the micro-element array from the transfer substrate to the receiving substrate, and then removing the transfer substrate.
  • Another method of implementation is indirect transfer.
  • the method comprises two steps of joining/stripping. First, the transfer substrate extracts the array of microelements from the donor substrate, then transfers the substrate and then bonds the array of microelements to the receiving substrate, and finally removes the transferred substrate.
  • the extraction micro-element array is generally performed by means of electrostatic pickup.
  • An array of transfer heads is required during electrostatic pickup.
  • the structure of the transfer head array is relatively complex and needs to be considered for its reliability. Manufacturing transfer head arrays requires additional cost. A phase change needs to be generated before picking up the transfer head array. In addition, the transfer process is limited in efficiency and results in low yield and poor reliability.
  • the technical solution adopted by the present invention includes: a transposition head for micro component transfer, comprising: a substrate body; a convex structure protruding from the substrate body; and flexibility An adhesion layer covering the surface of the raised structure.
  • the convex structure utilizes a flexible adhesive layer to transfer the adsorption force of the micro component.
  • the convex structure includes a mesa formed by a side surface and a lower surface.
  • the protruding structure includes a through hole extending from the substrate body and penetrating the flexible adhesive layer.
  • the protruding structure excludes air by using a through hole, and transfers the micro component by vacuum pressure
  • the flexible adhesive layer covers a side surface of the convex structure and a portion of a lower surface of the substrate body.
  • the substrate body is selected from silicon or ceramic or metal or polymer or one of any combination of the foregoing.
  • the flexible adhesive layer is made of silicone resin or glass or polyimide (PI) or polydimethylsiloxane (PI)
  • PDMS polymethyl methacrylate
  • PMMA polymethyl methacrylate
  • the thickness of the flexible adhesive layer is on the order of micrometers.
  • the flexible adhesive layer has a thickness of 10 ⁇ m to 1000 ⁇ m.
  • the utility model at least includes the following advantages:
  • the transposition head provided by the utility model utilizes a convex structure protruding from the substrate body and flexible by covering the convex structure
  • the adhesion layer transfers the adsorption force of the micro-component, which is especially suitable for transferring micro-components with a certain surface roughness;
  • the convex structure uses the through-hole to remove air, and the micro-component is transferred by vacuum pressure to improve the high-quality rapid transfer micro Component reliability.
  • FIG. 1 is a schematic view of a transposition head for micro component transfer described in Embodiment 1.
  • FIG. 2 is a schematic view of a transposition head for micro component transfer described in Embodiment 2. [0019] FIG.
  • FIG. 3 is a schematic view of a transposition head for micro component transfer described in Embodiment 3. [0020] FIG.
  • FIG. 4 is a schematic view of a transposition head for micro component transfer described in Embodiment 4. [0021] FIG.
  • 100 substrate body; 101: raised structure; 200: flexible adhesive layer; 300: micro-component; 400: carrier substrate; 500: through-hole.
  • a carrier substrate 400 is provided, which may be made of glass, silicon, polycarbonate (PC), acrylonitrile butadiene styrene (ABS), or any combination thereof.
  • a plurality of micro-elements 300 are placed on the carrier substrate 400, and the micro-components may be a light-emitting element, a liquid crystal control element, a photoelectric conversion element, a piezoelectric element, a thin film transistor element, a thin film diode element, a resistance element, a gate element,
  • the micro element is preferably a thin film LED (Thin Light-emitting Diode) light emitting element, and has a thickness of about 0.5 ⁇ m to about 100 ⁇ m.
  • the shape of the micro-component 300 may be a cylinder, and the radius of the cylinder may be about 0.5 ⁇ m to about 500 ⁇ m.
  • the micro-element 300 may be formed into a triangular cylinder, a cube, a rectangular parallelepiped, a hexagonal cylinder, and an octagonal prism. Body or other polygonal cylinder.
  • the transposition head for micro component transfer of the present embodiment includes: a substrate body 100; a convex structure 101 including a mesa formed by a side surface and a lower surface, which is removed from the substrate body 100. And a flexible adhesive layer 200 covering the mesa of the raised structure, that is, the lower surface of the raised structure and the side surface.
  • the transposition head When the transposition head is used to transfer the micro-component ⁇ , the transposition head is directed toward the micro-element 300 located on the carrier substrate 400, and further, the protruding structure 101 of the transposition head is aligned with the micro-element 300 located on the carrier substrate, The protruding structure protrudes from the substrate body to provide an effective contact point for adsorbing the micro-component, and the adsorption force of the micro-component is adsorbed by the flexible adhesive layer to realize the transfer of the micro-component.
  • the substrate body 100 is made of silicon or ceramic or metal or polymer or any combination of the foregoing.
  • silicon is preferably used as the substrate body, which may be monocrystalline silicon or polycrystalline silicon.
  • the flexible adhesive layer 200 is made of silicone resin or glass or polyimide (PD) or polydimethylsiloxane (PDMS) or polymethyl methacrylate ( ⁇ ). MMA) or one of any combination of the foregoing, this embodiment preferably uses PDMS as a flexible adhesive layer having a thickness on the order of micrometers, preferably between 10 ⁇ m and 1000 ⁇ m, having a sufficiently thin and excellent flexibility.
  • the transposition head achieves an effective clamping force on a micro-component that does not have a flat surface of roughness for adsorption or grasping. In the case of adsorbing or grasping a micro-element having a certain surface roughness, it is difficult. In addition, if several micro-components are picked up in the same way, there may be a deviation in the height direction. With the flexible adhesive layer having excellent flexibility (used as a buffer) in this embodiment, the deviation can be overcome to some extent, thereby improving the reliability of the transfer of the micro-component.
  • the flexible adhesive layer 200 of the transposition head of the present embodiment covers the lower surface and the side surface of the convex structure 101, and covers the substrate body 100.
  • Part of the lower surface, that is, the flexible adhesive layer 200 covers between the gaps of the plurality of convex structures, that is, the coverage area of the flexible adhesive layer is increased, which is advantageous for enhancing the contact area between the flexible adhesive layer and the micro-component, thereby enhancing adsorption.
  • the clamping force of the micro-components on the uneven surface is suitable for adsorbing or grasping micro-components with irregular shapes, such as micro-components having a roughened or grooved structure on the surface. Based on the van der Waals force, the transposition head provided in this embodiment can provide a greater clamping force to the surface of the less irregular micro-component.
  • the flexible adhesive layer 200 of the transposition head of the present embodiment does not cover the side surface of the convex structure 101, and covers only the lower surface of the convex structure 101. Suitable for absorbing or grabbing micro-components with a regular shape (lower height difference).
  • the protruding structure 101 of the transposition head of the embodiment further includes a through hole 500 extending from the substrate body 100 and penetrating through the flexible adhesive layer 200.
  • This embodiment utilizes the through holes of the raised structure to remove air, and vacuum transfer is performed to effect transfer of the micro-elements. Since the transposition head of the present embodiment can provide the clamping force using the vacuum state, the reliability of the high-quality rapid transfer micro-element is further improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne une tête de transposition pour transférer des micro-éléments, comprenant : un corps de substrat; une structure saillante, faisant saillie à partir du corps de substrat; et une couche adhésive souple recouvrant la surface de la structure saillante. La tête de transposition fournie dans le présent modèle d'utilité utilise une structure saillante faisant saillie à partir du corps de substrat et la force d'aspiration de la couche adhésive souple recouvrant la couche saillante sur les micro-éléments pour mettre en œuvre un transfert, étant particulièrement adaptée pour transférer des micro-éléments ayant un certain degré de rugosité de surface; la structure saillante utilise des trous traversants pour expulser l'air, et utilise une pression de vide pour transférer les micro-éléments, améliorant la fiabilité du transfert rapide de haute qualité de micro-éléments.
PCT/CN2018/082436 2017-04-21 2018-04-10 Tête de transposition pour le transfert de micro-éléments WO2018192389A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201720426695.9U CN207116403U (zh) 2017-04-21 2017-04-21 一种用于微元件转移的转置头
CN201720426695.9 2017-04-21

Publications (1)

Publication Number Publication Date
WO2018192389A1 true WO2018192389A1 (fr) 2018-10-25

Family

ID=61596721

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/082436 WO2018192389A1 (fr) 2017-04-21 2018-04-10 Tête de transposition pour le transfert de micro-éléments

Country Status (2)

Country Link
CN (1) CN207116403U (fr)
WO (1) WO2018192389A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780643B (zh) * 2020-03-30 2022-10-11 日商Ｔｄｋ股份有限公司 壓模工具保持裝置、壓模工具定位裝置、多元件傳送裝置以及元件陣列之製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207116403U (zh) * 2017-04-21 2018-03-16 厦门市三安光电科技有限公司 一种用于微元件转移的转置头
CN110265291A (zh) * 2018-03-12 2019-09-20 天津大学 一种转移器件的印章和利用该印章转移器件的方法
CN111128833B (zh) * 2018-10-31 2021-08-17 成都辰显光电有限公司 一种微元件的转移装置
CN111128819B (zh) * 2018-10-31 2023-09-29 成都辰显光电有限公司 一种微器件转移装置及其制备方法
CN109304681B (zh) * 2018-11-06 2020-12-29 业成科技（成都）有限公司 吸附装置及贴合系统
CN111199907A (zh) * 2018-11-20 2020-05-26 昆山工研院新型平板显示技术中心有限公司 微发光器件的转移方法及转移设备
CN111199908A (zh) * 2018-11-20 2020-05-26 昆山工研院新型平板显示技术中心有限公司 微发光器件的转移方法及转移设备
CN111244009B (zh) * 2018-11-29 2022-10-28 成都辰显光电有限公司 微元件的转移装置
JP7145096B2 (ja) * 2019-02-12 2022-09-30 信越化学工業株式会社 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法
KR20200099019A (ko) * 2019-02-13 2020-08-21 (주)포인트엔지니어링 마이크로 led 흡착체
CN112018218B (zh) * 2019-05-31 2023-02-28 成都辰显光电有限公司 微发光二极管的转移方法及显示面板的制作方法
CN110416139B (zh) * 2019-09-11 2021-08-31 京东方科技集团股份有限公司 一种转移载板、其制作方法及发光二极管芯片的转移方法
WO2021237511A1 (fr) * 2020-05-27 2021-12-02 重庆康佳光电技术研究院有限公司 Substrat de transfert de micro-diodes électroluminescentes et son procédé de préparation
CN112967986B (zh) * 2020-10-19 2022-06-21 重庆康佳光电技术研究院有限公司 一种转移构件及其制备方法、转移头
CN112582328B (zh) * 2020-12-10 2023-06-02 深圳市华星光电半导体显示技术有限公司 转移基板及其制作方法、转移装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1491436A (zh) * 2001-02-08 2004-04-21 �Ҵ���˾ 芯片转移方法及装置
CN1777832A (zh) * 2004-04-09 2006-05-24 信越工程株式会社 粘结卡盘装置
KR20140122861A (ko) * 2013-04-11 2014-10-21 (주)엠프리시젼 접촉 패드 및 그 제조 방법
CN106328576A (zh) * 2016-09-30 2017-01-11 厦门市三安光电科技有限公司 用于微元件转移的转置头的制作方法
CN207116403U (zh) * 2017-04-21 2018-03-16 厦门市三安光电科技有限公司 一种用于微元件转移的转置头

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1491436A (zh) * 2001-02-08 2004-04-21 �Ҵ���˾ 芯片转移方法及装置
CN1777832A (zh) * 2004-04-09 2006-05-24 信越工程株式会社 粘结卡盘装置
KR20140122861A (ko) * 2013-04-11 2014-10-21 (주)엠프리시젼 접촉 패드 및 그 제조 방법
CN106328576A (zh) * 2016-09-30 2017-01-11 厦门市三安光电科技有限公司 用于微元件转移的转置头的制作方法
CN207116403U (zh) * 2017-04-21 2018-03-16 厦门市三安光电科技有限公司 一种用于微元件转移的转置头

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780643B (zh) * 2020-03-30 2022-10-11 日商Ｔｄｋ股份有限公司 壓模工具保持裝置、壓模工具定位裝置、多元件傳送裝置以及元件陣列之製造方法

Also Published As

Publication number Publication date
CN207116403U (zh) 2018-03-16

Similar Documents

Publication Publication Date Title
WO2018192389A1 (fr) Tête de transposition pour le transfert de micro-éléments
WO2018058747A1 (fr) Tête de transposition permettant de transférer des micro-composants et procédé de transfert de micro-composants
WO2019095659A1 (fr) Procédé de transfert de masse de micro-composants
WO2018107793A1 (fr) Système de transfert de microélément, procédé de transfert, procédé de fabrication, dispositif et dispositif électronique
WO2016078430A1 (fr) Procédé de transfert de dispositif
WO2020057584A1 (fr) Dispositif et procédé de transfert discontinu de micropuces
JP5652940B2 (ja) 半導体チップ付着装置、及び半導体チップ付着方法
WO2019062117A1 (fr) Procédé de transfert et appareil de transfert pour micro-élément semi-conducteur
CN110165024B (zh) 微型元件转移方法
TWI659486B (zh) 轉移載板與晶粒載板
SG172283A1 (en) Method for separating a layer system comprising a wafer
EP2267796A3 (fr) Procédé de séparation d'une couche semi-conductrice de nitrure, dispositif semi-conducteur, son procédé de fabrication, tranche semi-conductrice et procédé de fabrication correspondant
WO2016155198A1 (fr) Structure de fixation, procédé de décollement et processus de fixation de verre ultra fin, procédé de fabrication de dispositif d'affichage
WO2016150120A1 (fr) Dispositif flexible et son procédé de fabrication, appareil d'affichage
WO2018058748A1 (fr) Tête de transfert destinée à être utilisée dans le transfert de micro-composant et procédé de transfert de micro-composant
JP2007046053A5 (fr)
US20220410550A1 (en) Transfer method of devices
TWI221010B (en) A method for transferably pasting an element
CN112967971B (zh) 一种Micro-LED的转移基板及其制备方法
US9630440B2 (en) Stamp structures and transfer methods using the same
TWI752369B (zh) 用於轉移微型元件的方法
CN109950367A (zh) 元件转移方法
WO2021237511A1 (fr) Substrat de transfert de micro-diodes électroluminescentes et son procédé de préparation
WO2008088069A1 (fr) Procédé de fabrication de corps de structure fin, corps de structure fin et micro-dispositif
TWI695416B (zh) 用於轉移微型元件的方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18787457

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18787457

Country of ref document: EP

Kind code of ref document: A1