WO2018190085A1 - Feuille adhésive pour traitement de tranche - Google Patents

Feuille adhésive pour traitement de tranche Download PDF

Info

Publication number
WO2018190085A1
WO2018190085A1 PCT/JP2018/010950 JP2018010950W WO2018190085A1 WO 2018190085 A1 WO2018190085 A1 WO 2018190085A1 JP 2018010950 W JP2018010950 W JP 2018010950W WO 2018190085 A1 WO2018190085 A1 WO 2018190085A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
plasticizer
adhesive layer
wafer processing
Prior art date
Application number
PCT/JP2018/010950
Other languages
English (en)
Japanese (ja)
Inventor
水野浩二
▲高▼橋智一
亀井勝利
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201880024706.8A priority Critical patent/CN110494958A/zh
Publication of WO2018190085A1 publication Critical patent/WO2018190085A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to an adhesive sheet for wafer processing that can be used for wafer dicing and the like.
  • a wafer dicing process for dividing a semiconductor wafer into a plurality of semiconductor chips may be performed using a rotating blade provided in the dicing device.
  • the wafer dicing step for example, in a state where the semiconductor wafer is held on the adhesive surface of the wafer processing adhesive sheet having an adhesive surface, the semiconductor wafer is cut by a rotating blade and separated into a plurality of semiconductor chips.
  • the present invention has been conceived under the circumstances as described above, and provides a wafer processing pressure-sensitive adhesive sheet suitable for suppressing adhesion of dust generated during wafer dicing to an object to be processed. With the goal.
  • the wafer processing pressure-sensitive adhesive sheet provided by the present invention has a laminated structure including a polyolefin-based substrate and a pressure-sensitive adhesive layer.
  • the polyolefin-based substrate contains a plasticizer
  • the pressure-sensitive adhesive layer contains a pressure-sensitive adhesive and a plasticizer.
  • the polyolefin-based substrate refers to a substrate in which the polyolefin-based resin occupies the largest mass ratio in the substrate-constituting material.
  • the wafer processing pressure-sensitive adhesive sheet having such a configuration can be used in a dicing process in which cutting is performed in the manufacturing process of a semiconductor device.
  • a dicing process for example, while the processing object such as a semiconductor wafer closely adhered to the pressure-sensitive adhesive layer of the wafer processing pressure-sensitive adhesive sheet, flowing water is continuously supplied toward the rotating blade and the processing object provided in the dicing apparatus. Then, the cutting process proceeds.
  • a plasticizer is contained in the pressure-sensitive adhesive layer, and in addition, a plasticizer is also contained in the base material.
  • the rotating blade advances cutting, the rotating blade is slippery with respect to the sheet at the contact interface between the rotating blade and the wafer processing pressure-sensitive adhesive sheet. It will be efficiently removed from the cutting location and its vicinity. The more dust removed from the cutting location and its vicinity in the dicing process, the less dust will adhere to the workpiece to be subjected to the dicing process.
  • the pressure-sensitive adhesive is less than when the rotating blade for dicing advances cutting with respect to the pressure-sensitive adhesive layer not containing the plasticizer.
  • the present inventors have obtained the knowledge that the adhesive tends to break finely and scatter at the cutting site of the layer.
  • the pressure-sensitive adhesive waste generated by cutting of the rotating blade is likely to become fine particles.
  • the pressure-sensitive adhesive scrap group generated in the dicing process has a larger surface area per unit volume as the average particle size is smaller, and therefore, it is considered that other dusts such as semiconductor scraps and metal scraps derived from the workpiece are easily captured.
  • Adhesive waste has a significantly lower specific gravity than other dust such as semiconductor waste and metal waste, and the trapping of other dust by such adhesive waste is not possible for composite dust having a lower specific gravity than the other dust itself. Means formation. This composite dust is less likely to settle on water because it has a lower specific gravity than semiconductor waste, metal waste, and the like, and is less likely to remain on the workpiece. Therefore, the configuration in which the pressure-sensitive adhesive sheet for processing a wafer has a plasticizer-containing pressure-sensitive adhesive layer in which pressure-sensitive adhesive scraps generated by cutting of the rotating blade are likely to be fine particles contributes to suppressing dust from adhering to the workpiece.
  • this pressure-sensitive adhesive sheet for wafer processing is suitable for suppressing the adhesion of dust generated during wafer dicing to an object to be processed.
  • the base material of the pressure-sensitive adhesive sheet for wafer processing is a polyolefin base material as described above, and can function as an environmentally friendly vinyl chloride-free sheet support.
  • the wafer processing pressure-sensitive adhesive sheet having such a base material does not produce vinyl chloride-containing cutting waste as cutting waste derived from the base material during wafer dicing, and in addition to the dust such as cutting waste on the workpiece. It is suitable for suppressing adhesion.
  • the content of the plasticizer in the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for wafer processing is preferably 1 part by weight or more, more preferably 4 parts by weight or more, more preferably 8 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer. It is 12 parts by mass or more, more preferably 12 parts by mass or more. It exists in the tendency which can enjoy the above-mentioned dust adhesion amount reduction effect resulting from a plasticizer from soot, so that content of the plasticizer in an adhesive layer is large.
  • the content of the plasticizer in the pressure sensitive adhesive layer of the pressure sensitive adhesive sheet for wafer processing is the pressure sensitive adhesive 100 in the pressure sensitive adhesive layer.
  • it is 100 mass parts or less with respect to a mass part, More preferably, it is 80 mass parts or less, More preferably, it is 70 mass parts or less.
  • the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for wafer processing preferably contains an aromatic carboxylic acid ester plasticizer and / or a polyester plasticizer as a plasticizer.
  • the polyester base material of the pressure-sensitive adhesive sheet for wafer processing preferably contains an aromatic carboxylic acid ester plasticizer and / or a polyester plasticizer as a plasticizer.
  • the aromatic carboxylic acid ester plasticizer in the pressure-sensitive adhesive layer or the polyester-based substrate di-2-ethylhexyl terephthalate is preferable. These configurations are suitable for obtaining the above-described dust adhesion reduction effect.
  • the polyolefin base material of the pressure-sensitive adhesive sheet for wafer processing is preferably free of vinyl chloride. Such a configuration is suitable for obtaining an environmentally friendly adhesive sheet for wafer processing.
  • the polyolefin-based substrate of the present wafer processing pressure-sensitive adhesive sheet contains an ethylene-vinyl acetate copolymer or an ethylene-propylene copolymer as a resin main component.
  • the resin main component of the base material occupies the largest mass ratio among the resin components contained in the base material.
  • Such a configuration is suitable for securing sufficient properties in terms of strength and the like even if the substrate of the pressure-sensitive adhesive sheet for wafer processing is free of vinyl chloride.
  • FIG. 1 It is a cross-sectional schematic diagram of the adhesive sheet for wafer processing which concerns on one Embodiment of this invention.
  • the example of the usage condition of the adhesive sheet for wafer processing shown in FIG. 1 is represented.
  • FIG. 1 is a schematic cross-sectional view of an adhesive sheet 10 for wafer processing according to one embodiment of the present invention.
  • the wafer processing pressure-sensitive adhesive sheet 10 has a laminated structure including a base material 11 and a pressure-sensitive adhesive layer 12, and can be used for a dicing process in which cutting is performed in the manufacturing process of a semiconductor device.
  • the wafer processing adhesive sheet 10 has, for example, a disk shape having a size corresponding to a processing object such as a semiconductor wafer or a wafer laminate.
  • the substrate 11 of the wafer processing pressure-sensitive adhesive sheet 10 is an element that functions as a support in the sheet, and is, for example, in the form of a plastic film.
  • the base material 11 is a polyolefin-type base material, and contains polyolefin resin in the largest mass ratio in the constituent material.
  • polyolefin resins include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, and ethylene-propylene copolymer (for example, random copolymer polypropylene and block copolymer).
  • polymerized polypropylene Polymerized polypropylene), homopolypropylene, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer , Ethylene-butene copolymer, and ethylene-hexene copolymer.
  • EVA ethylene-vinyl acetate copolymer
  • ionomer resin ethylene- (meth) acrylic acid copolymer
  • ethylene- (meth) acrylic acid ester copolymer ethylene- (meth) acrylic acid ester copolymer
  • Ethylene-butene copolymer Ethylene-butene copolymer
  • ethylene-hexene copolymer ethylene-hexene copolymer.
  • the substrate 11 preferably contains an ethylene-vinyl acetate cop
  • the base material 11 may contain other resin in the constituent material together with the polyolefin resin.
  • other resins include polyvinyl chloride, polyvinylidene chloride, polyester, polyurethane, polycarbonate, polyether ether ketone, polyimide, polyether imide, polyamide, wholly aromatic polyamide, polyphenyl sulfide, aramid, fluorine.
  • examples include resins, cellulosic resins, and silicone resins.
  • the polyester include polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT).
  • PET polyethylene terephthalate
  • PBT polybutylene terephthalate
  • the substrate 11 is preferably free of vinyl chloride.
  • the content ratio of the resin material in the substrate 11 is, for example, 100% by mass or less, and preferably 90% by mass or less.
  • the base material 11 contains a plasticizer together with the resin material as described above.
  • the plasticizer include aromatic carboxylic acid ester plasticizers, aliphatic carboxylic acid ester plasticizers, and polyester plasticizers.
  • aromatic carboxylic acid ester plasticizer include phthalic acid ester, terephthalic acid ester, adipic acid ester, benzoic acid ester, trimellitic acid ester, and pyromellitic acid ester.
  • Examples of the aliphatic carboxylic acid ester plasticizer include sebacic acid ester, azelaic acid ester, maleic acid ester, and citrate ester.
  • phthalic acid ester examples include di-n-octyl phthalate, di-2-ethylhexyl phthalate, diisononyl phthalate, diisodecyl phthalate, and dibutyl phthalate.
  • terephthalic acid ester examples include di-2-ethylhexyl terephthalate.
  • adipic acid ester examples include di-n-octyl adipate, di-2-ethylhexyl adipate, and diisononyl adipate.
  • benzoic acid ester examples include benzoic acid glycol ester.
  • trimellitic acid ester examples include trimellitic acid tri-n-octyl, trimellitic acid tri-2-ethylhexyl, trimellitic acid triisononyl, trimellitic acid tri-n- Decyl, and triisodecyl trimellitic acid.
  • Examples of the pyromellitic acid ester include pyromellitic acid tetra-n-octyl, pyromellitic acid tetra-2-ethylhexyl, and pyromellitic acid tetra-n-decyl.
  • Examples of the citrate ester include tributyl acetylcitrate.
  • polyester plasticizer examples include aliphatic dicarboxylic acids having 2 to 10 carbon atoms (adipic acid, azelaic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, etc.) and / or aromatic dicarboxylic acids, Examples thereof include polyesters obtained by polycondensation with glycols having 2 to 10 carbon atoms (ethylene glycol, propylene glycol, butylene glycol, neopentyl glycol, hexanediol, etc.). As the component contained in the substrate 11, one type of plasticizer may be used, or two or more types of plasticizers may be used.
  • the base material 11 preferably contains an aromatic carboxylic acid ester plasticizer and / or a polyester plasticizer as a plasticizer.
  • aromatic carboxylic acid ester plasticizer in the substrate 11 di-2-ethylhexyl terephthalate is preferable.
  • the content of the plasticizer in the substrate 11 is preferably 1% by mass or more, more preferably 3% by mass or more, more preferably 5% by mass or more, more preferably 7% by mass or more, more preferably 9% by mass or more, More preferably, it is 11 mass% or more.
  • the content ratio of the plasticizer in the substrate 11 is preferably 100% by mass or less, more preferably 70% by mass or less, and more preferably 50% by mass or less.
  • the base material 11 may contain other components in addition to the resin material and the plasticizer as described above.
  • the base material 11 may have a single layer structure or a multilayer structure.
  • the composition of the resin material and the plasticizer described above may or may not be uniform.
  • the base material 11 having a multilayer structure there may be a layer not containing a polyolefin-based resin, or a layer not containing a plasticizer.
  • the substrate 11 is made of a plastic film, it may be an unstretched film, a uniaxially stretched film, or a biaxially stretched film.
  • the adhesive layer 12 on the base material 11 is an ultraviolet curable type as will be described later, the base material 11 preferably has ultraviolet transparency.
  • the surface on the pressure-sensitive adhesive layer 12 side of the substrate 11 may be subjected to a physical treatment, a chemical treatment, or an undercoat treatment for improving the adhesion with the pressure-sensitive adhesive layer 12.
  • a physical treatment include corona treatment, plasma treatment, sand mat processing treatment, ozone exposure treatment, flame exposure treatment, high piezoelectric impact exposure treatment, and ionizing radiation treatment.
  • chemical treatment include chromic acid treatment.
  • the thickness of the base material 11 is preferably 40 ⁇ m or more, more preferably 50 ⁇ m or more, more preferably 55 ⁇ m from the viewpoint of ensuring the strength required for the base material 11 to function as a support in the wafer processing pressure-sensitive adhesive sheet 10. As mentioned above, More preferably, it is 60 micrometers or more. Further, from the viewpoint of realizing appropriate flexibility in the wafer processing pressure-sensitive adhesive sheet 10, the thickness of the base material 11 is preferably 200 ⁇ m or less, more preferably 180 ⁇ m or less, and more preferably 150 ⁇ m or less.
  • the pressure-sensitive adhesive layer 12 of the wafer processing pressure-sensitive adhesive sheet 10 contains a pressure-sensitive adhesive and a plasticizer.
  • the pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 may be a pressure-sensitive adhesive (adhesive strength reducing pressure-sensitive adhesive) capable of intentionally reducing the pressure-sensitive adhesive force by an external action such as radiation irradiation or heating. Depending on the action of the adhesive, it may be an adhesive (adhesive strength non-reducing adhesive) with little or no reduction in adhesive strength, and in a workpiece to be processed while being held on the wafer processing adhesive sheet 10 It can select suitably according to a processing method, processing conditions, etc.
  • the pressure-sensitive adhesive layer 12 is relatively low in comparison with the state showing a relatively high pressure. It is possible to properly use the state showing the adhesive strength.
  • the pressure-sensitive adhesive layer 12 uses a state in which the pressure-sensitive adhesive layer 12 exhibits a relatively high adhesive force. It is possible to suppress or prevent the semiconductor wafer held on the layer 12 from floating or peeling from the pressure-sensitive adhesive layer 12.
  • adhesive pressure-reducing adhesives examples include radiation-curable adhesives (radiation-curable adhesives) and heat-foaming adhesives.
  • radiation-curable adhesives radiation-curable adhesives
  • heat-foaming adhesives examples include heat-foaming adhesives.
  • one type of pressure-sensitive adhesive type adhesive may be used, or two or more types of pressure-sensitive adhesive type pressure-sensitive adhesives may be used.
  • the entire pressure-sensitive adhesive layer 12 may be formed from a pressure-reducing adhesive, or a part of the pressure-sensitive adhesive layer 12 may be formed from a pressure-reducing adhesive.
  • the entire pressure-sensitive adhesive layer 12 may be formed of a pressure-sensitive adhesive layer-type pressure-sensitive adhesive, or a predetermined part of the pressure-sensitive adhesive layer 12 (for example, processing such as a semiconductor wafer)
  • the central area that is the target area of the object) is formed from an adhesive-reducing adhesive, and the other part (for example, the target area of the ring frame that is outside the central area) is adhesive. It may be formed from a non-force reducing adhesive.
  • all the layers constituting the laminated structure may be formed of a pressure-reducing adhesive, or some of the layers in the laminated structure are reduced in pressure-sensitive adhesive. May be formed.
  • the radiation curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 for example, a pressure-sensitive adhesive that is cured by irradiation with electron beams, ultraviolet rays, ⁇ rays, ⁇ rays, ⁇ rays, or X rays can be used.
  • a curable adhesive (ultraviolet curable adhesive) can be particularly preferably used.
  • Examples of the radiation curable pressure sensitive adhesive in the pressure sensitive adhesive layer 12 include a base polymer such as an acrylic polymer that is an acrylic pressure sensitive adhesive and a radiation polymerizable monomer having a functional group such as a radiation polymerizable carbon-carbon double bond.
  • a base polymer such as an acrylic polymer that is an acrylic pressure sensitive adhesive and a radiation polymerizable monomer having a functional group such as a radiation polymerizable carbon-carbon double bond.
  • An additive type radiation curable pressure-sensitive adhesive containing components and oligomer components can be mentioned.
  • the above-mentioned acrylic polymer preferably contains a monomer unit derived from an acrylic ester and / or a methacrylic ester as a main monomer unit having the largest mass ratio.
  • (meth) acryl means “acryl” and / or “methacryl”.
  • Examples of the (meth) acrylic acid ester for forming the monomer unit of the acrylic polymer include, for example, hydrocarbon groups such as (meth) acrylic acid alkyl ester, (meth) acrylic acid cycloalkyl ester, and (meth) acrylic acid aryl ester. Examples thereof include (meth) acrylic acid esters.
  • Examples of (meth) acrylic acid alkyl esters include (meth) acrylic acid methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester or lauryl ester, tridecyl ester, tetradecyl ester, hexa Examples include decyl esters, octadecyl esters, and eicosyl esters.
  • Examples of (meth) acrylic acid cycloalkyl ester include cyclopentyl ester and cyclohexyl ester of (meth) acrylic acid.
  • Examples of the (meth) acrylic acid aryl ester include phenyl (meth) acrylate and benzyl (meth) acrylate.
  • As the (meth) acrylic acid ester as the main monomer for the acrylic polymer one kind of (meth) acrylic acid ester may be used, or two or more kinds of (meth) acrylic acid esters may be used. .
  • the ratio is preferably 40% by mass or more, more preferably 60% by mass or more.
  • the acrylic polymer may contain a monomer unit derived from another monomer copolymerizable with (meth) acrylic acid ester in order to modify its cohesive strength and heat resistance.
  • monomer components include carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, acrylamide, and functional groups such as acrylonitrile. Examples thereof include monomers.
  • carboxy group-containing monomer examples include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
  • acid anhydride monomer examples include maleic anhydride and itaconic anhydride.
  • Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, ( Examples include 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate.
  • Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate.
  • Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth) ) Acryloyloxynaphthalene sulfonic acid.
  • Examples of the phosphate group-containing monomer include 2-hydroxyethyl acryloyl phosphate.
  • Examples of acrylamide include N-acryloylmorpholine.
  • the other monomer for the acrylic polymer one type of monomer may be used, or two or more types of monomers may be used.
  • the ratio of the other monomer components in the total monomer components for forming the acrylic polymer is preferably Is 60% by mass or less, more preferably 40% by mass or less.
  • An acrylic polymer contains a monomer unit derived from a multifunctional monomer copolymerizable with a monomer component such as (meth) acrylic acid ester as a main monomer in order to form a crosslinked structure in the polymer skeleton. Also good.
  • polyfunctional monomers examples include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate (ie polyglycidyl (meth) acrylate), polyester Examples include (meth) acrylate and urethane (meth) acrylate.
  • polyfunctional monomer for an acrylic polymer one type of polyfunctional monomer may be used, or two or more types of polyfunctional monomers may be used.
  • the ratio of the polyfunctional monomer in all the monomer components for forming the acrylic polymer is preferably such that the adhesive layer 12 appropriately develops basic characteristics such as adhesiveness due to the (meth) acrylic acid ester. It is 40 mass% or less, More preferably, it is 30 mass% or less.
  • the acrylic polymer can be obtained by polymerizing raw material monomers for forming the acrylic polymer.
  • Examples of the polymerization technique include solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization. From the viewpoint of a high degree of cleanliness in the semiconductor device manufacturing method in which the wafer processing pressure-sensitive adhesive sheet 10 is used, it is preferable that the low molecular weight substance in the pressure-sensitive adhesive layer 12 in the wafer processing pressure-sensitive adhesive sheet 10 is smaller.
  • the number average molecular weight is preferably 100,000 or more, more preferably 200,000 to 3,000,000.
  • the pressure-sensitive adhesive layer 12 or the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer may contain, for example, an external crosslinking agent in order to increase the number average molecular weight of the base polymer such as an acrylic polymer.
  • an external crosslinking agent for reacting with a base polymer such as an acrylic polymer to form a crosslinked structure include polyisocyanate compounds, epoxy compounds, polyol compounds (such as polyphenol compounds), aziridine compounds, and melamine crosslinking agents.
  • the content of the external crosslinking agent in the pressure-sensitive adhesive layer 12 or the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer is preferably 10 parts by mass or less, more preferably 0.1 to 7 parts by mass with respect to 100 parts by mass of the base polymer.
  • Examples of the radiation-polymerizable monomer component for forming a radiation-curable pressure-sensitive adhesive include, for example, urethane oligomer, urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra Examples include (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate.
  • the radiation-polymerizable oligomer component for forming the radiation-curable pressure-sensitive adhesive examples include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based polymers having a molecular weight of about 100 to 30000. Things are appropriate.
  • the total content of the radiation-polymerizable monomer component and oligomer component in the radiation-curable pressure-sensitive adhesive is determined within a range in which the adhesive force of the pressure-sensitive adhesive layer 12 to be formed can be appropriately reduced, and is a base polymer such as an acrylic polymer.
  • the amount is 5 to 500 parts by mass, preferably 40 to 150 parts by mass with respect to 100 parts by mass.
  • the addition-type radiation curable pressure-sensitive adhesive for example, those disclosed in JP-A-60-196956 may be used.
  • the radiation-curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 includes, for example, a base polymer having a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer side chain or at the polymer main chain terminal in the polymer main chain. And an internal radiation curable pressure sensitive adhesive.
  • Such an internal radiation-curable pressure-sensitive adhesive is suitable for suppressing an unintended change in the pressure-sensitive adhesive property due to the movement of a low molecular weight component in the pressure-sensitive adhesive layer 12 to be formed.
  • the base polymer contained in the intrinsic radiation curable pressure-sensitive adhesive those having an acrylic polymer as a basic skeleton are preferable.
  • the acrylic polymer having such a basic skeleton the above-mentioned acrylic polymer can be employed.
  • a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer for example, a raw material monomer including a monomer having a predetermined functional group (first functional group) is copolymerized to form an acrylic polymer. After obtaining the compound having a predetermined functional group (second functional group) capable of binding by reacting with the first functional group and a radiation-polymerizable carbon-carbon double bond, carbon-carbon is obtained. Examples thereof include a method of subjecting an acrylic polymer to a condensation reaction or an addition reaction while maintaining the radiation polymerization property of a double bond.
  • Examples of the combination of the first functional group and the second functional group include, for example, carboxy group and epoxy group, epoxy group and carboxy group, carboxy group and aziridyl group, aziridyl group and carboxy group, hydroxy group and isocyanate group, and isocyanate group. And a hydroxy group.
  • a combination of a hydroxy group and an isocyanate group or a combination of an isocyanate group and a hydroxy group is preferable from the viewpoint of easy reaction tracking.
  • the group is a hydroxy group and the second functional group is an isocyanate group.
  • the isocyanate compound having both a radiation-polymerizable carbon-carbon double bond and an isocyanate group as the second functional group include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate is mentioned.
  • the acrylic polymer with the first functional group preferably includes a monomer unit derived from the above-mentioned hydroxy group-containing monomer, and is preferably 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether. Those containing a monomer unit derived from an ether compound such as are also preferred.
  • the radiation curable pressure sensitive adhesive in the pressure sensitive adhesive layer 12 preferably contains a photopolymerization initiator.
  • photopolymerization initiators include ⁇ -ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, camphors.
  • photopolymerization initiators include ⁇ -ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, camphors.
  • examples include quinones, halogenated ketones, acyl phosphinoxides, and acyl phosphonates.
  • Examples of ⁇ -ketol compounds include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, 2-methyl-2-hydroxypro Piophenone and 1-hydroxycyclohexyl phenyl ketone are mentioned.
  • Examples of acetophenone compounds include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, and 2-methyl-1- [4- (methylthio) -phenyl] -2-morpholino. Propane-1 is mentioned.
  • benzoin ether compounds include benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether.
  • the ketal compound include benzyl dimethyl ketal.
  • the aromatic sulfonyl chloride compound include 2-naphthalenesulfonyl chloride.
  • the photoactive oxime compound include 1-phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime.
  • benzophenone-based compound include benzophenone, benzoylbenzoic acid, and 3,3′-dimethyl-4-methoxybenzophenone.
  • thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropyl.
  • Thioxanthone is mentioned.
  • the content of the photopolymerization initiator in the radiation curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of the base polymer such as an acrylic polymer.
  • the above-mentioned heat-foamable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 is a pressure-sensitive adhesive containing a component that foams or expands when heated (such as a foaming agent or a heat-expandable microsphere).
  • a component that foams or expands when heated such as a foaming agent or a heat-expandable microsphere.
  • the thermally expandable microsphere include a microsphere having a structure in which a substance that is easily gasified and expanded by heating is encapsulated in a shell.
  • the inorganic foaming agent include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and azides.
  • organic foaming agent examples include chloroalkanes such as trichloromonofluoromethane and dichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, azodicarbonamide, barium azodicarboxylate, and paratoluenesulfonyl.
  • chloroalkanes such as trichloromonofluoromethane and dichloromonofluoromethane
  • azo compounds such as azobisisobutyronitrile, azodicarbonamide, barium azodicarboxylate, and paratoluenesulfonyl.
  • Hydrazine compounds such as hydrazide, diphenylsulfone-3,3′-disulfonylhydrazide, 4,4′-oxybis (benzenesulfonylhydrazide), allylbis (sulfonylhydrazide), ⁇ -toluylenesulfonylsemicarbazide and 4,4′-oxybis Semicarbazide compounds such as (benzenesulfonyl semicarbazide), triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole, and N, N′-dinitrosopentamethylenetetramine and N, N′-dimethyl -N, N'-Dinitrosote N- nitroso compounds such as phthalamide may be mentioned.
  • thermally expandable microspheres examples include isobutane, propane, and pentane.
  • Thermally expandable microspheres can be produced by encapsulating a substance that expands easily by heating into a shell-forming substance by a coacervation method or an interfacial polymerization method.
  • the shell forming substance a substance exhibiting heat melting property or a substance that can be ruptured by the action of thermal expansion of the encapsulated substance can be used.
  • Such materials include, for example, vinylidene chloride-acrylonitrile copolymers, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.
  • a pressure-sensitive adhesive includes an adhesive having a form in which a predetermined adhesive force is ensured while the radiation-curable adhesive described above with respect to the adhesive-reducing adhesive is cured in advance by irradiation with radiation. Even if the adhesive strength of the radiation-cured pressure-sensitive adhesive (cured radiation-cured pressure-sensitive adhesive) that has been pre-cured by radiation irradiation is reduced by the radiation irradiation, depending on the content of the polymer component It can exhibit adhesiveness due to the polymer component, and can exhibit an adhesive force that can be used to adhere and hold the adherend in a dicing process or the like.
  • one type of non-reducing adhesive may be used, or two or more types of non-reducing adhesive may be used.
  • the whole adhesive layer 12 may be formed from a non-adhesive pressure-reducing adhesive, or a part of the adhesive layer 12 may be formed from a non-reducing adhesive.
  • the whole pressure-sensitive adhesive layer 12 may be formed from a non-adhesive pressure-reducing pressure-sensitive adhesive, or a predetermined part of the pressure-sensitive adhesive layer 12 (for example, a ring frame)
  • An adhesion target area which is an area outside the adhesion target area of a processing object such as a semiconductor wafer, is formed from a non-adhesive adhesive, and other parts (for example, an object to be processed)
  • the central region that is the region) may be formed from a pressure-sensitive adhesive.
  • the entire pressure-sensitive adhesive layer 12 may be formed of a radiation-cured radiation curable pressure-sensitive adhesive in the surface spreading direction of the pressure-sensitive adhesive layer 12.
  • a part of the pressure-sensitive adhesive layer 12 may be formed from a radiation-cured radiation-curable pressure-sensitive adhesive and the other part may be formed from a radiation-cured pressure-sensitive adhesive that has not been irradiated.
  • all the layers constituting the laminated structure may be formed from a non-adhesive pressure-reducing adhesive, or some of the layers in the laminated structure are non-adhesive strength type. You may form from an adhesive.
  • a pressure sensitive adhesive other than the radiation-cured radiation curable adhesive in the adhesive layer 12 for example, an acrylic adhesive having an acrylic polymer as a base polymer or a rubber adhesive is preferably used. Can do.
  • the acrylic polymer that is the base polymer of the acrylic pressure-sensitive adhesive is preferably a mass ratio of monomer units derived from (meth) acrylic acid esters. As the main monomer unit.
  • the acrylic polymer mentioned above regarding the radiation-curable adhesive is mentioned, for example.
  • the plasticizer in the pressure-sensitive adhesive layer 12 examples include aromatic carboxylic acid ester plasticizers, aliphatic carboxylic acid ester plasticizers, and polyester plasticizers. As mentioned above, the plasticizers mentioned above can be mentioned.
  • the pressure-sensitive adhesive layer 12 preferably contains an aromatic carboxylic acid ester plasticizer and / or a polyester plasticizer as a plasticizer.
  • the aromatic carboxylic acid ester plasticizer in the pressure-sensitive adhesive layer 12 di-2-ethylhexyl terephthalate is preferable.
  • the content of the plasticizer in the pressure-sensitive adhesive layer 12 is preferably 1 part by mass or more, more preferably 4 parts by mass or more, more preferably 8 parts by mass or more, more than 100 parts by mass of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12. Preferably it is 12 parts by mass or more. Further, the content of the plasticizer in the pressure-sensitive adhesive layer 12 is preferably 100 parts by weight or less, more preferably 80 parts by weight or less, more preferably 70 parts by weight or less, with respect to 100 parts by weight of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12. It is.
  • the pressure-sensitive adhesive layer 12 may contain other components in addition to the above-described components as long as the effects of the present invention are not impaired.
  • a crosslinking accelerator, an anti-aging agent, a colorant such as a pigment or a dye, and the like may be contained.
  • the colorant may be a compound that is colored by irradiation. Examples of such a compound include leuco dyes.
  • the thickness of the pressure-sensitive adhesive layer 12 is preferably 1 to 50 ⁇ m, more preferably 2 to 30 ⁇ m, and more preferably 5 to 25 ⁇ m. Such a configuration is suitable, for example, when the adhesive layer 12 contains a radiation curable adhesive and balances the adhesive force to the adherend before and after the radiation curing of the adhesive layer 12.
  • the wafer processing pressure-sensitive adhesive sheet 10 having the above-described configuration can be produced by providing a pressure-sensitive adhesive layer containing a plasticizer together with a pressure-sensitive adhesive on a polyolefin-based substrate containing a plasticizer ( First method).
  • the wafer processing pressure-sensitive adhesive sheet 10 is provided with a pressure-sensitive adhesive layer containing a plasticizer together with a pressure-sensitive adhesive on a polyolefin base material to be the base material 11, and thereafter, the plasticizer in the pressure-sensitive adhesive layer is partially applied.
  • It can also be produced by performing an aging treatment for transition to a simple substrate (that is, diffusion to the substrate) (second method).
  • the substrate can be produced by a film forming method such as a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, or a dry lamination method. .
  • the film or the substrate after film formation is subjected to a predetermined surface treatment as necessary.
  • the pressure-sensitive adhesive layer for example, after preparing a pressure-sensitive adhesive solution for forming a pressure-sensitive adhesive layer, first, the pressure-sensitive adhesive solution is first applied onto a substrate or a predetermined separator (that is, a release liner). Form a coating film. Examples of the method for applying the adhesive solution include roll coating, screen coating, and gravure coating.
  • a crosslinking reaction is caused by heating, if necessary, and the solvent is removed if necessary.
  • the heating temperature for removing the solvent is, for example, 80 to 150 ° C.
  • the heating time for removing the solvent is, for example, 0.5 to 5 minutes.
  • the temperature for the aging treatment in the second method described above is, for example, 80 to 150 ° C.
  • the time for the aging treatment is, for example, 0.5 to 5 minutes.
  • the wafer processing adhesive sheet 10 may be provided with a separator (not shown) so as to cover the adhesive layer 12.
  • the separator is an element for protecting the pressure-sensitive adhesive layer 12 from being exposed, and is peeled off from the sheet when the wafer processing pressure-sensitive adhesive sheet 10 is used.
  • the separator include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, and a plastic film or paper whose surface is coated with a release agent such as a fluorine-type release agent or a long-chain alkyl acrylate-type release agent. .
  • the wafer processing pressure-sensitive adhesive sheet 10 having such a configuration can be used in a dicing process in which cutting is performed in the manufacturing process of a semiconductor device.
  • a rotary blade including a semiconductor wafer or a wafer laminate
  • the cutting of the workpiece 20 proceeds.
  • This cutting process is advanced while flowing water continues to be supplied toward the rotary blade and the workpiece 20.
  • the cutting groove G formed by the rotating blade for dicing is formed, for example, at a depth reaching the wafer processing adhesive sheet 10 (the cutting groove G in FIG. 2B). Is schematically represented by a bold line).
  • the workpiece 20 is separated into element chips 21 such as semiconductor chips.
  • the pressure-sensitive adhesive layer 12 includes a plasticizer, and in addition, the base material 11 includes a plasticizer. Therefore, in the dicing process, when the rotary blade advances the cutting with respect to the wafer processing adhesive sheet 10 together with the workpiece 20, the wafer rotates at the contact interface between the rotary blade and the wafer processing adhesive sheet 10. The blade is slippery, and as a result, dust such as cutting waste is efficiently removed from the cutting location and the vicinity thereof with the supplied flowing water. The more dust removed from the cutting location and its vicinity in the dicing process, the less dust will adhere to the workpiece 20 to be subjected to the dicing process.
  • the pressure-sensitive adhesive is less than when the rotating blade for dicing advances cutting with respect to the pressure-sensitive adhesive layer not containing the plasticizer.
  • the present inventors have obtained the knowledge that the adhesive tends to break finely and scatter at the cutting site of the layer.
  • the pressure-sensitive adhesive waste generated by cutting of the rotating blade is likely to become fine particles.
  • the pressure-sensitive adhesive scrap group generated in the dicing process has a larger surface area per unit volume as the average particle size is smaller, and therefore, it is considered that other dust such as semiconductor scrap and metal scrap derived from the workpiece 20 can be easily captured. .
  • Adhesive waste has a significantly lower specific gravity than other dust such as semiconductor waste and metal waste, and the trapping of other dust by such adhesive waste is not possible for composite dust having a lower specific gravity than the other dust itself. Means formation. Since this composite dust has a specific gravity smaller than that of semiconductor waste, metal waste, etc., it is difficult for the composite dust to settle in water and to remain on the workpiece 20. Therefore, the configuration in which the wafer processing pressure-sensitive adhesive sheet 10 has the plasticizer-containing pressure-sensitive adhesive layer 12 in which the pressure-sensitive adhesive waste generated by cutting of the rotating blade is easily finely divided suppresses adhesion of dust to the workpiece 20. To contribute.
  • the wafer processing pressure-sensitive adhesive sheet 10 is suitable for suppressing the adhesion of dust to the workpiece 20 generated during wafer dicing.
  • the content of the plasticizer in the pressure-sensitive adhesive layer 12 of the wafer processing pressure-sensitive adhesive sheet 10 is preferably 1 part by mass or more, more preferably 4 masses with respect to 100 parts by mass of the pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12. Part or more, more preferably 8 parts by weight or more, more preferably 12 parts by weight or more. It exists in the tendency which can enjoy the above-mentioned dust adhesion amount reduction effect resulting from a plasticizer from soot, so that content of the plasticizer in the adhesive layer 12 is large. Further, from the viewpoint of appropriately expressing basic characteristics such as adhesiveness of the contained pressure sensitive adhesive in the pressure sensitive adhesive layer 12, the content of the plasticizer in the pressure sensitive adhesive layer 12 is as described above. Preferably it is 100 mass parts or less with respect to 100 mass parts of adhesives, More preferably, it is 80 mass parts or less, More preferably, it is 70 mass parts or less.
  • the substrate 11 of the wafer processing pressure-sensitive adhesive sheet 10 is preferably free of vinyl chloride. Such a configuration is suitable for obtaining an environmentally friendly pressure-sensitive adhesive sheet 10 for wafer processing.
  • the substrate 11 contains an ethylene-vinyl acetate copolymer or an ethylene-propylene copolymer as a resin main component. Such a configuration is suitable for securing sufficient characteristics in terms of strength and the like even when the substrate 11 is free of vinyl chloride.
  • the substrate 11 of the wafer processing pressure-sensitive adhesive sheet 10 preferably contains an aromatic carboxylic acid ester plasticizer and / or a polyester plasticizer as a plasticizer.
  • the pressure-sensitive adhesive layer 12 of the wafer processing pressure-sensitive adhesive sheet 10 preferably contains an aromatic carboxylic acid ester plasticizer and / or a polyester plasticizer as a plasticizer.
  • the aromatic carboxylate plasticizer in the substrate 11 and the pressure-sensitive adhesive layer 12 di-2-ethylhexyl terephthalate is preferable.
  • the content of the photopolymerization initiator is 5 parts by mass with respect to 100 parts by mass of the base polymer
  • the content of the crosslinking agent is 2.5 parts by mass
  • the content of di-2-ethylhexyl terephthalate as a plasticizer is included.
  • the amount is 5 parts by mass
  • the solid content concentration concentration of components other than ethyl acetate
  • EVA base material ethylene-vinyl acetate copolymer (EVA), which is a polyolefin resin, was prepared as follows. First, an ethylene-vinyl acetate copolymer resin (trade name “Evaflex P1007”, manufactured by Mitsui DuPont Polychemical Co., Ltd.) was formed by a T-die extrusion method to obtain
  • ⁇ Preparation of wafer processing adhesive sheet> The above-mentioned pressure-sensitive adhesive solution in this example was applied to the silicone-treated surface of a PET release liner having a silicone-treated surface for light release to form a coating film. Next, this coating film was heated at 80 ° C. for 2 minutes to remove the solvent, thereby forming a pressure-sensitive adhesive layer having a thickness of 15 ⁇ m. Next, the above-mentioned EVA base material was bonded to the exposed surface of this pressure-sensitive adhesive layer using a hand roller, and then an aging treatment was performed at 50 ° C. for 72 hours.
  • the pressure-sensitive adhesive layer was brought into close contact with the substrate, and the plasticizer in the pressure-sensitive adhesive layer was partially transferred to the substrate, that is, diffused into the substrate.
  • the pressure-sensitive adhesive sheet for wafer processing of Example 1 having a laminated structure including the base material and the pressure-sensitive adhesive layer was produced.
  • the configuration of the pressure-sensitive adhesive sheet for wafer processing in Example 1 is listed in Table 1 (the same applies to Examples and Comparative Examples described later. In Table 1, the unit of each numerical value representing the composition is relative “mass”. Part ").
  • Example 2 and 3 In the preparation of the pressure-sensitive adhesive solution, the amount of di-2-ethylhexyl terephthalate as a plasticizer (trade name “Adekasizer D-810”, manufactured by ADEKA Corporation) was changed to 5 parts by mass and 20 parts by mass (Example) Except for 2) and 40 parts by mass (Example 3), the wafer processing adhesive sheet of Examples 2 and 3 was produced in the same manner as the wafer processing adhesive sheet of Example 1.
  • Example 4 In preparing the pressure-sensitive adhesive solution, instead of 5 parts by mass of di-2-ethylhexyl terephthalate (trade name “ADEKA SIZER D-810”, manufactured by ADEKA Corporation) as a plasticizer, a polyester plasticizer (trade name “POLIZER W” -360-ELS "(manufactured by DIC Corporation) was used in the same manner as the wafer processing pressure-sensitive adhesive sheet of Example 1 except that 20 parts by mass was used.
  • ADEKA SIZER D-810 di-2-ethylhexyl terephthalate
  • POLIZER W -360-ELS "(manufactured by DIC Corporation
  • Example 5 In a toluene solvent in a reaction vessel equipped with a Liebig condenser, a nitrogen inlet tube, a separatory funnel, a thermometer, and a stirrer, 0.75 mol of 2-ethylhexyl acrylate and N-acryloylmorpholine 0 .25 mol and 0.22 mol of 2-hydroxyethyl acrylate were copolymerized to obtain an acrylic copolymer. In this polymerization reaction, the reaction temperature was 60 ° C., and the reaction time was 8 hours.
  • 1-hydroxycyclohexyl phenyl ketone (trade name “Irgacure 184”, manufactured by BASF) as a photopolymerization initiator and a polyisocyanate compound (trade name “Coronate L”, Nippon Polyurethane Co., Ltd.), di-2-ethylhexyl terephthalate as a plasticizer (trade name “Adekasizer D-810”, manufactured by ADEKA Co., Ltd.), and ethyl acetate as a solvent are added and mixed together.
  • An agent solution was prepared.
  • the content of the photopolymerization initiator is 5 parts by mass with respect to 100 parts by mass of the base polymer
  • the content of the crosslinking agent is 2.5 parts by mass
  • the content of di-2-ethylhexyl terephthalate as a plasticizer is included.
  • the amount is 20 parts by mass
  • the solid content concentration concentration of components other than ethyl acetate
  • the adhesive sheet for wafer processing of Example 5 was produced like the adhesive sheet for wafer processing of Example 1 except having used this adhesive solution instead of the adhesive solution mentioned above in Example 1. .
  • Example 6 A base material (EPR base material) made of an ethylene-propylene copolymer (EPR), which is a polyolefin resin, was prepared as follows. First, a resin composed of an ethylene-propylene copolymer (trade name “Vistamax 3000”, manufactured by ExxonMobil) was formed by a T-die extrusion method to obtain an EPR film having a thickness of 100 ⁇ m. Next, a corona treatment was performed on one side of the EPR film. Thus, an EPR substrate (thickness: 100 ⁇ m) was produced. And the adhesive sheet for wafer processing of Example 6 was produced like the adhesive sheet for wafer processing of Example 1 except having used this EPR base material instead of the EVA base material mentioned in Example 1. .
  • EPR base material ethylene-propylene copolymer
  • EPR ethylene-propylene copolymer
  • Comparative Example 1 A wafer processing adhesive sheet of Comparative Example 1 was prepared in the same manner as the wafer processing adhesive sheet of Example 1, except that di-2-ethylhexyl terephthalate was not used in the preparation of the adhesive solution.
  • Example 2 A pressure-sensitive adhesive solution was prepared by the same method as the pressure-sensitive adhesive solution preparation method in Example 5 except that di-2-ethylhexyl terephthalate was not used. And the adhesive sheet for wafer processing of the comparative example 2 was produced like the adhesive sheet for wafer processing of Example 1 except having used this adhesive solution instead of the adhesive solution mentioned above in Example 1. .
  • the Z1 blade (trade name “ZH05-SD3500-” is applied to the wafer held on the wafer processing adhesive sheet. N1-70 “, manufactured by Disco Corporation), followed by two stages of grinding, followed by Z2 blade (trade name" ZH05-SD4000-N1-70 ", manufactured by Disco Corporation) and second grinding Then, full cut dicing was performed. In this dicing process, the cut mode is down cut, the blade rotation speed is 35000 rpm, the dicing speed is 50 mm / sec, the cutting depth of the Z1 blade is 190 ⁇ m, and the cutting depth of the Z2 blade is 90 ⁇ m.
  • the cut mode is down cut
  • the blade rotation speed is 35000 rpm
  • the dicing speed is 50 mm / sec
  • the cutting depth of the Z1 blade is 190 ⁇ m
  • the cutting depth of the Z2 blade is 90 ⁇ m.
  • the dicing size was 4.0 mm ⁇ 5.0 mm, and a cutting groove (280 ⁇ m) having a depth extending beyond the wafer on the wafer processing adhesive sheet and into the wafer processing adhesive sheet was formed.
  • running water was continuously supplied to the rotating blade and the wafer.
  • a cleaning process was performed under the conditions of a wafer rotation speed of 1000 rpm and 90 seconds.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne une feuille adhésive (10) pour traitement de tranche qui présente une structure multicouche comprenant un substrat (11) qui est composé d'un substrat de polyoléfine contenant un plastifiant et une couche adhésive (12) qui contient un plastifiant. La teneur du plastifiant dans la couche adhésive (12) est, par exemple, de 1 à 100 parties en masse par rapport à 100 parties en masse de l'adhésif dans la couche adhésive (12). Cette feuille adhésive pour traitement de tranche est appropriée pour supprimer l'adhérence de poussière à un objet du traitement, ladite poussière étant générée pendant le découpage en dés de tranche.
PCT/JP2018/010950 2017-04-12 2018-03-20 Feuille adhésive pour traitement de tranche WO2018190085A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880024706.8A CN110494958A (zh) 2017-04-12 2018-03-20 晶圆加工用粘合片

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-079259 2017-04-12
JP2017079259A JP2018182054A (ja) 2017-04-12 2017-04-12 ウエハ加工用粘着シート

Publications (1)

Publication Number Publication Date
WO2018190085A1 true WO2018190085A1 (fr) 2018-10-18

Family

ID=63792370

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/010950 WO2018190085A1 (fr) 2017-04-12 2018-03-20 Feuille adhésive pour traitement de tranche

Country Status (4)

Country Link
JP (1) JP2018182054A (fr)
CN (1) CN110494958A (fr)
TW (1) TW201842116A (fr)
WO (1) WO2018190085A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI783530B (zh) * 2021-06-18 2022-11-11 李志雄 暫時接著積層體及應用彼之晶圓薄化製備方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4845065B2 (ja) * 2009-08-05 2011-12-28 古河電気工業株式会社 粘着フィルム及び半導体ウエハ加工用テープ
JP5977954B2 (ja) * 2012-02-09 2016-08-24 リンテック株式会社 半導体ウエハ加工用シート
JP6075832B2 (ja) * 2011-10-17 2017-02-08 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291258A (ja) * 1996-04-26 1997-11-11 Lintec Corp 粘着剤組成物およびこれを用いた粘着シート
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
KR20090081103A (ko) * 2008-01-23 2009-07-28 제일모직주식회사 반도체 패키징용 다이싱 테이프 및 그의 제조방법
US20100215882A1 (en) * 2009-02-23 2010-08-26 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
KR101920086B1 (ko) * 2011-10-17 2018-11-19 닛토덴코 가부시키가이샤 점착 테이프용 필름 및 점착 테이프
KR101924484B1 (ko) * 2011-10-17 2018-12-04 닛토덴코 가부시키가이샤 점착 테이프용 필름 및 점착 테이프
CN103305139A (zh) * 2012-03-13 2013-09-18 日东电工株式会社 半导体器件生产用耐热性压敏粘合带以及使用其生产半导体器件的方法
JP6180139B2 (ja) * 2013-03-11 2017-08-16 リンテック株式会社 保護膜形成用複合シートおよび保護膜形成用フィルム付チップの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4845065B2 (ja) * 2009-08-05 2011-12-28 古河電気工業株式会社 粘着フィルム及び半導体ウエハ加工用テープ
JP6075832B2 (ja) * 2011-10-17 2017-02-08 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP5977954B2 (ja) * 2012-02-09 2016-08-24 リンテック株式会社 半導体ウエハ加工用シート

Also Published As

Publication number Publication date
JP2018182054A (ja) 2018-11-15
CN110494958A (zh) 2019-11-22
TW201842116A (zh) 2018-12-01

Similar Documents

Publication Publication Date Title
JP4970863B2 (ja) 被加工物の加工方法
TWI466976B (zh) Hot peeling double sided adhesive sheet and processed body processing method
JP2018182276A (ja) ダイシングダイボンドフィルム
JP7041475B2 (ja) ダイシングテープ、ダイシングダイボンドフィルム、及び半導体装置の製造方法
JP2004300231A (ja) 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP2010129701A (ja) ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2007070432A (ja) 粘着シート及びこの粘着シートを用いた製品の加工方法
JP2008143924A (ja) 再剥離型粘着剤組成物、及び粘着テープ又はシート
CN109148350B (zh) 切割带一体型粘接性片
JP2006013452A (ja) 半導体装置の製造方法、及びそれに用いる半導体基板加工用の粘着シート
JP6063863B2 (ja) 易剥離性粘着フィルム
KR102515684B1 (ko) 반도체 장치의 제조 방법
CN108727999B (zh) 切割芯片接合薄膜
JP2018195746A (ja) ダイシングダイボンドフィルム
JP2005116610A (ja) 半導体ウエハの加工方法および半導体ウエハ加工用粘着シート
JPWO2013042698A1 (ja) 電子部品切断用加熱剥離型粘着シート及び電子部品切断方法
WO2019216262A1 (fr) Procédé de fabrication de puce semi-conductrice
JP2015151453A (ja) 伸長可能シートおよび積層チップの製造方法
KR20180116754A (ko) 다이싱 다이 본드 필름
JP2019016634A (ja) ダイシングテープおよびダイシングダイボンドフィルム
JP2019204886A (ja) ダイシングダイボンドフィルムおよび半導体装置製造方法
CN113613893A (zh) 粘合片及半导体装置的制造方法
JP2010209158A (ja) 粘着シート及びそれを用いた半導体ウェハの加工方法
WO2018190085A1 (fr) Feuille adhésive pour traitement de tranche
JP2007238789A (ja) 加熱剥離型粘着シート及びチップ部品の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18784323

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18784323

Country of ref document: EP

Kind code of ref document: A1