WO2018184281A1 - 显示装置及其四面发光led - Google Patents

显示装置及其四面发光led Download PDF

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Publication number
WO2018184281A1
WO2018184281A1 PCT/CN2017/084694 CN2017084694W WO2018184281A1 WO 2018184281 A1 WO2018184281 A1 WO 2018184281A1 CN 2017084694 W CN2017084694 W CN 2017084694W WO 2018184281 A1 WO2018184281 A1 WO 2018184281A1
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Prior art keywords
metal substrate
light emitting
emitting led
sided
sided light
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English (en)
French (fr)
Inventor
樊勇
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US15/528,750 priority Critical patent/US10319885B2/en
Publication of WO2018184281A1 publication Critical patent/WO2018184281A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Definitions

  • the present invention relates to the field of LED technologies, and in particular, to a display device and a four-sided LED thereof.
  • HDR High-Dynamic Range, high dynamic contrast
  • the addition of the secondary lens increases the cost of the lens and the cost of the lens, and the light control area is approximately circular rather than square.
  • the LED Since the four-sided LED has a square control light, the LED is more spaced in a direct-lit application than the one-sided LED, thereby saving the number of LEDs and saving the LED cost.
  • the embodiment of the invention provides a display device and a four-sided LED thereof, so as to solve the problem that the cost of the flip-chip packaging technology of the four-sided LED in the prior art is higher.
  • a technical solution adopted by the embodiment of the present invention is to provide a four-sided light emitting LED, and the four-sided light emitting LED includes:
  • a metal substrate comprising a first metal substrate and a second metal substrate
  • a transparent support fixed to the outer sides of the first metal substrate and the second metal substrate by a thermoplastic method and forming a receiving cavity with the surfaces of the first metal substrate and the second metal substrate;
  • a light emitting chip disposed across the first metal substrate and the second metal substrate;
  • a reflective white glue layer is disposed on the top surface of the luminescent material.
  • another technical solution adopted by the embodiment of the present invention is to provide a display device, where the display device includes a backlight module and a display module, and the backlight module is used to display the display module.
  • a backlight is provided, wherein the backlight module uses the above-described four-sided LED as a light source.
  • the invention has the beneficial effects that the four-sided light-emitting LED provided by the present invention avoids the problem of high cost in manufacturing the four-sided light-emitting LED by using the flip-chip packaging technology in the prior art, and the four-sided light-emitting provided by the present invention is different from the prior art. LEDs are simple to manufacture and low in cost.
  • FIG. 1 is a six-view view of a four-sided LED according to an embodiment of the present invention.
  • Figure 2 is a schematic cross-sectional view showing a first embodiment at A-A of the four-sided light-emitting LED shown in Figure 1;
  • Figure 3 is a schematic cross-sectional view showing a first embodiment at B-B of the four-sided light-emitting LED shown in Figure 1;
  • Figure 4 is a schematic cross-sectional view showing a first embodiment of C-C of the four-sided light-emitting LED shown in Figure 1;
  • Figure 5 is a cross-sectional view showing a second embodiment at A-A of the four-sided light-emitting LED shown in Figure 1;
  • Figure 6 is a schematic cross-sectional view showing a second embodiment at B-B of the four-sided light-emitting LED shown in Figure 1;
  • FIG. 7 is a schematic diagram of a simplified structure of a display device according to an embodiment of the invention.
  • an embodiment of the present invention provides a four-sided LED 100
  • the four-sided LED 100 includes a metal substrate 110, a transparent support 120, a light emitting chip 130, a gold wire 140, a luminescent material 150, and a reflective white glue layer 160.
  • FIG. 1 is a four-sided LED provided by an embodiment of the present invention.
  • Six views of 100 In FIG. 1, the upper side is a bottom view, and the lower side is a top view, and the middle from left to center is a right view, a front view, a left view, and a rear view.
  • the four-sided LED provided by the embodiment of the present invention 100 is symmetrically symmetrical, four-sided LED
  • the left and right sides of 100 have the same structure, and the front structure and the rear structure are the same.
  • the structure of the four-sided LED provided by the present invention is not limited thereto. In other embodiments, the four-sided LED may also be an asymmetric structure.
  • the metal substrate 110 includes a first metal substrate 111 and a second metal substrate 112.
  • the metal substrate 110 has a certain thickness and can be made of materials with good electrical conductivity, such as gold, silver, copper, and aluminum. Wait.
  • the first metal substrate 111 includes a first electrical connection end 113 protruding from the transparent support 120
  • the second metal substrate 112 includes a second electrical connection end 114 protruding from the transparent support 120.
  • the specific shape structure of the first metal substrate 111, the second metal substrate 112, the first power receiving end 113, and the second power receiving end 114 constitutes a limitation of the present invention.
  • the transparent holder 120 is fixed to the outer sides of the first metal substrate 111 and the second metal substrate 112 by a thermoplastic method and forms a receiving cavity with the surfaces of the first metal substrate 111 and the second metal substrate 112.
  • the transparent support 120 can be a transparent plastic, a transparent silicone, a transparent ceramic, or a transparent glass.
  • the light emitting chip 130 is disposed across the first metal substrate 111 and the second metal substrate 112. In a specific embodiment, the light emitting chip 130 is a blue light chip.
  • the gold wire 140 electrically connects the light emitting chip 130 to the first metal substrate 111 and the second metal substrate 112, respectively.
  • the luminescent material 150 is filled in the accommodating cavity and covers the light emitting chip 130.
  • the luminescent material 150 is a phosphor, and the luminescent material 150 is doped in the silica gel 151 and refilled into the accommodating cavity.
  • a reflective white glue layer 160 is disposed on the top surface of the luminescent material 150.
  • the reflective white glue layer 160 may be made of PA6T, PA9T, PCT, EMC or SMC material, and may be disposed on the top surface of the luminescent material 150 by spraying or attaching and form a seal with the top of the transparent support 120. .
  • the transparent holder 120 includes a surrounding wall 121 and a connecting arm 122 interposed between the first metal substrate 111 and the second metal substrate 112.
  • the transparent support 120 When the transparent support 120 is viewed from a plan view, the transparent support 120 has a "day" shape, and two shaped mouth portions are formed to respectively enclose the first metal substrate 111 and the second metal substrate 112 (see the bottom view in FIG. 1). ).
  • the cross-sectional area of the surrounding wall 121 gradually decreases from the surface of the first metal substrate 111 and the second metal substrate 112 toward the reflective white glue layer 160, and the surrounding wall 121 is integrally formed. Trumpet-shaped, light-emitting effect is better. The light is reflected from the four sides of the transparent holder 120 after being reflected by the top reflective white glue layer 160 and the bottom first metal substrate 111 and the second metal substrate 112.
  • the cross section of the surrounding wall 121 may also be rectangular.
  • an embodiment of the present invention further provides a display device 10 .
  • the display device 10 includes a backlight module 200 and a display module 300 .
  • the backlight module 200 is configured to provide backlight to the display module 300 , wherein the backlight is provided.
  • the module 200 adopts the above four-sided LED 100 as a light source.
  • the four-sided LED provided by the present invention The problem of high cost of manufacturing the four-sided LED 100 by using the chip packaging technology in the prior art is avoided.
  • the four-sided LED 100 provided by the invention is simple in manufacture and low in cost.

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Abstract

一种显示装置(10)及其四面发光LED(100)，四面发光LED(100)包括金属基板(110)、蓝光芯片(130)、金线(140)、发光材料(150)以及反光白胶层(160)，金属基板(110)包括第一金属基板(111)和第二金属基板(112)；透明支架(120)与第一金属基板(111)和第二金属基板(112)相固定并形成容置腔；蓝光芯片(130)横跨设置在第一金属基板(111)和第二金属基板(112)上；发光材料(150)填充在容置腔内并覆盖蓝光芯片(130)；反光白胶层(160)设置在发光材料(150)的顶面。四面发光LED(100)制造简单、成本低廉。

Description

显示装置及其四面发光LED
【技术领域】
本发明涉及LED技术领域，特别涉及一种显示装置及其四面发光LED。
【背景技术】
目前薄型化大尺寸HDR（High-Dynamic Range，高动态对比度）电视成为高端电视的重要规格，对于HDR电视，背光分区越多，单个分区的控光区域越接近方形，理论上HDR越好。
传统的直下式LED（Light Emitting Diode，发光二极管）由于只有一个出光面，若不采用二次透镜的情况下，控光区域非常狭窄，所以一般直下式背光LED都具有二次透镜来拓展控光区域，达到减少灯数降低成本的目的。
但二次透镜的加入，会增加透镜成本和透镜打件成本，且控光区域近似圆形而非方形。
由于四面发光LED具有方形控光，较一般一面发光的LED在直下式应用中，LED的间距也更大，从而节省LED数目，节省了LED成本。
然而目前的四面发光LED采用倒装芯片封装技术，倒装芯片封装技术的成本较一般水平结构的芯片成本更高。
【发明内容】
本发明实施例提供一种显示装置及其四面发光LED，以解决现有技术中四面发光LED采用倒装芯片封装技术成本更高的问题。
为解决上述技术问题，本发明实施例采用的一个技术方案是：提供一种四面发光LED，所述四面发光LED包括：
金属基板，包括间隔设的第一金属基板和第二金属基板；
透明支架，通过热塑方式与所述第一金属基板和所述第二金属基板的外侧边相固定并与所述第一金属基板和所述第二金属基板的表面形成容置腔；
发光芯片，横跨设置在所述第一金属基板和所述第二金属基板上；
金线，将所述发光芯片分别与所述第一金属基板和所述第二金属基板电连接；
发光材料，填充在所述容置腔内并覆盖所述发光芯片；
反光白胶层，设置在所述发光材料的顶面。
为解决上述技术问题，本发明实施例采用的另一个技术方案是：提供一种显示装置，所述显示装置包括背光模组和显示模组，所述背光模组用于向所述显示模组提供背光，其中所述背光模组采用上述的四面发光LED作为光源。
本发明的有益效果是：区别于现有技术的情况，本发明提供的四面发光LED避免了现有技术中采用倒装芯片封装技术制造四面发光LED成本较高的问题，本发明提供的四面发光LED制造简单、成本低廉。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1是本发明实施例提供的四面发光LED的六视图；
图2是图1中所示的四面发光LED的A-A处的第一实施例的截面示意图；
图3是图1中所示的四面发光LED的B-B处的第一实施例的截面示意图；
图4是图1中所示的四面发光LED的C-C处的第一实施例的截面示意图；
图5是图1中所示的四面发光LED的A-A处的第二实施例的截面示意图；
图6是图1中所示的四面发光LED的B-B处的第二实施例的截面示意图；
图7是本发明实施例提供的显示装置的简化结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1至图4，本发明实施例提供一种四面发光LED 100，该四面发光LED 100包括金属基板110、透明支架120、发光芯片130、金线140、发光材料150以及反光白胶层160。
其中，图1是本发明实施例提供的四面发光LED 100的六视图。在图1中，上面是仰视图、下面的俯视图，中间从左往中依次是右视图、前视图、左视图和后视图。从图1中可以看出，本发明实施例提供的四面发光LED 100为对称对构，四面发光LED 100的左面结和右面结构相同，前面结构和后面结构相同。当然，本发明提供的四面发光LED的结构并不限于此，在其他实施例中，四面发光LED也可以是非对称结构。
本发明实施例中，金属基板110包括间隔设的第一金属基板111和第二金属基板112，金属基板110具有一定的厚度，可采用导电性能较好的材料，如金、银、铜、铝等。第一金属基板111包括凸出于透明支架120的第一接电端113，第二金属基板112包括凸出于透明支架120的第二接电端114。第一金属基板111、第二金属基板112、第一接电端113以及第二接电端114的具体形状结构构成对本发明的限定。
透明支架120通过热塑方式与第一金属基板111和第二金属基板112的外侧边相固定并与第一金属基板111和第二金属基板112的表面形成容置腔。在具体实施例中，透明支架120可为透明塑料、透明硅胶、透明陶瓷或透明玻璃。
发光芯片130横跨设置在第一金属基板111和第二金属基板112上。在一具体实施例中，发光芯片130为蓝光芯片。
金线140将发光芯片130分别与第一金属基板111和第二金属基板112电连接。
发光材料150填充在容置腔内并覆盖发光芯片130。在一实施例中，发光材料150为荧光粉，发光材料150掺杂在硅胶151内再填充至容置腔内。
反光白胶层160设置在发光材料150的顶面。在本发明实施例中，反光白胶层160可采用PA6T、PA9T、PCT、EMC或SMC材料，可通过喷涂或贴附的方式设置在发光材料150的顶面并与透明支架120的顶部形成密封。
如图2和图3所示，透明支架120包括围壁121和嵌入在第一金属基板111与第二金属基板112间隔处的连接臂122。从俯视的视角看透明支架120时，透明支架120呈“日”字型，形成有两个形口部以分别围合第一金属基板111和第二金属基板112（如图1中的仰视图）。
在图2和图3所示的第一实施例中，围壁121的截面积自第一金属基板111和第二金属基板112的表面朝向反光白胶层160逐渐减小，围壁121整体形成喇叭状，出光效果较好。光经顶部的反光白胶层160和底部的第一金属基板111和第二金属基板112反射后从透明支架120的4个侧面发光。
在图5和图6所示的第二实施例中，围壁121的截面也可为矩形。
请一并参阅图7，本发明实施例还提供一种显示装置10，该显示装置10包括背光模组200和显示模组300，背光模组200用于向显示模组300提供背光，其中背光模组200采用上述的四面发光LED 100作为光源。
综上所述，本领域技术人员容易理解，本发明提供的四面发光LED 100避免了现有技术中采用装芯片封装技术制造四面发光LED 100成本较高的问题，本发明提供的四面发光LED 100制造简单、成本低廉。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (19)

  1. 一种四面发光LED，其中，所述四面发光LED包括：
    金属基板，包括间隔设的第一金属基板和第二金属基板；
    透明支架，通过热塑方式与所述第一金属基板和所述第二金属基板的外侧边相固定并与所述第一金属基板和所述第二金属基板的表面形成容置腔；
    发光芯片，横跨设置在所述第一金属基板和所述第二金属基板上；
    金线，将所述发光芯片分别与所述第一金属基板和所述第二金属基板电连接；
    发光材料，填充在所述容置腔内并覆盖所述发光芯片；
    反光白胶层，设置在所述发光材料的顶面；
    其中，所述透明支架包括围壁和嵌入在所述第一金属基板与所述第二金属基板间隔处的连接臂；所述围壁的截面积自所述第一金属基板和所述第二金属基板的表面朝向所述反光白胶层逐渐减小。
  2. 一种四面发光LED，其中，所述四面发光LED包括：
    金属基板，包括间隔设的第一金属基板和第二金属基板；
    透明支架，通过热塑方式与所述第一金属基板和所述第二金属基板的外侧边相固定并与所述第一金属基板和所述第二金属基板的表面形成容置腔；
    发光芯片，横跨设置在所述第一金属基板和所述第二金属基板上；
    金线，将所述发光芯片分别与所述第一金属基板和所述第二金属基板电连接；
    发光材料，填充在所述容置腔内并覆盖所述发光芯片；
    反光白胶层，设置在所述发光材料的顶面。
  3. 根据权利要求2所述的四面发光LED，其中，所述透明支架为透明塑料、透明硅胶、透明陶瓷或透明玻璃。
  4. 根据权利要求2所述的四面发光LED，其中，所述发光材料掺杂在硅胶内再填充至所述容置腔内。
  5. 根据权利要求2所述的四面发光LED，其中，所述反光白胶层采用PA6T、PA9T、PCT、EMC或SMC材料。
  6. 根据权利要求2所述的四面发光LED，其中，所述第一金属基板包括凸出于所述透明支架的第一接电端，所述第二金属基板包括凸出于所述透明支架的第二接电端。
  7. 根据权利要求2所述的四面发光LED，其中，所述透明支架包括围壁和嵌入在所述第一金属基板与所述第二金属基板间隔处的连接臂。
  8. 根据权利要求7所述的四面发光LED，其中，所述围壁的截面积自所述第一金属基板和所述第二金属基板的表面朝向所述反光白胶层逐渐减小。
  9. 根据权利要求7所述的四面发光LED，其中，所述围壁的截面为矩形。
  10. 根据权利要求2所述的四面发光LED，其中，所述发光芯片为蓝光芯片，所述发光材料为荧光粉。
  11. 一种显示装置，其中，所述显示装置包括背光模组和显示模组，所述背光模组用于向所述显示模组提供背光，其中所述背光模组四面发光LED作为光源，所述四面发光LED包括：
    金属基板，包括间隔设的第一金属基板和第二金属基板；
    透明支架，通过热塑方式与所述第一金属基板和所述第二金属基板的外侧边相固定并与所述第一金属基板和所述第二金属基板的表面形成容置腔；
    发光芯片，横跨设置在所述第一金属基板和所述第二金属基板上；
    金线，将所述发光芯片分别与所述第一金属基板和所述第二金属基板电连接；
    发光材料，填充在所述容置腔内并覆盖所述发光芯片；
    反光白胶层，设置在所述发光材料的顶面。
  12. 根据权利要求11所述的四面发光LED，其中，所述透明支架为透明塑料、透明硅胶、透明陶瓷或透明玻璃。
  13. 根据权利要求11所述的四面发光LED，其中，所述发光材料掺杂在硅胶内再填充至所述容置腔内。
  14. 根据权利要求11所述的四面发光LED，其中，所述反光白胶层采用PA6T、PA9T、PCT、EMC或SMC材料。
  15. 根据权利要求11所述的四面发光LED，其中，所述第一金属基板包括凸出于所述透明支架的第一接电端，所述第二金属基板包括凸出于所述透明支架的第二接电端。
  16. 根据权利要求11所述的四面发光LED，其中，所述透明支架包括围壁和嵌入在所述第一金属基板与所述第二金属基板间隔处的连接臂。
  17. 根据权利要求16所述的四面发光LED，其中，所述围壁的截面积自所述第一金属基板和所述第二金属基板的表面朝向所述反光白胶层逐渐减小。
  18. 根据权利要求16所述的四面发光LED，其中，所述围壁的截面为矩形。
  19. 根据权利要求11所述的四面发光LED，其中，所述发光芯片为蓝光芯片，所述发光材料为荧光粉。
PCT/CN2017/084694 2017-04-07 2017-05-17 显示装置及其四面发光led Ceased WO2018184281A1 (zh)

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