WO2018181526A1 - 医療器具とその製造方法 - Google Patents
医療器具とその製造方法 Download PDFInfo
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- WO2018181526A1 WO2018181526A1 PCT/JP2018/012869 JP2018012869W WO2018181526A1 WO 2018181526 A1 WO2018181526 A1 WO 2018181526A1 JP 2018012869 W JP2018012869 W JP 2018012869W WO 2018181526 A1 WO2018181526 A1 WO 2018181526A1
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- tag
- synthetic resin
- irradiating
- laser beam
- medical device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/681—Component parts, details or accessories; Auxiliary operations
- B29C70/683—Pretreatment of the preformed part, e.g. insert
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/28—Surgical forceps
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/28—Surgical forceps
- A61B17/2812—Surgical forceps with a single pivotal connection
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/30—Surgical pincettes without pivotal connections
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B17/32—Surgical cutting instruments
- A61B17/3209—Incision instruments
- A61B17/3211—Surgical scalpels, knives; Accessories therefor
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
- A61B90/90—Identification means for patients or instruments, e.g. tags
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
- A61B90/90—Identification means for patients or instruments, e.g. tags
- A61B90/98—Identification means for patients or instruments, e.g. tags using electromagnetic means, e.g. transponders
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
- A61B2017/00526—Methods of manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/12—Iron
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/753—Medical equipment; Accessories therefor
- B29L2031/7546—Surgical equipment
Definitions
- the present invention relates to medical instruments such as a scalpel, scissors, forceps, and tweezers, and a method for manufacturing the same.
- medical instruments used in medical practices such as surgery
- strict use history is managed for each medical device, and management is performed to prevent loss.
- medical instruments include surgical instruments such as a scalpel, scissors, forceps, and tweezers.
- WO2014 / 017530 proposes an invention of a medical device to which an IC tag is fixed and a method for fixing the medical device.
- WO 2014/017530 describes a method of attaching an IC tag to a medical device using a covering and an adhesive. Summary of the Invention
- An object of the present invention is to provide a medical device to which an IC tag is attached with very strong adhesion and a method for manufacturing the medical device.
- the present invention relates to a metal medical instrument having a sealed IC tag, which is a synthetic resin fixed to a roughened portion having a porous structure having a hole having a depth of 10 to 900 ⁇ m of the metal medical instrument. And a medical instrument having the IC tag sealed inside the synthetic resin portion.
- the present invention also relates to a method for manufacturing the above-described medical device, the step of irradiating a part of the surface of the metal medical device with a laser beam to roughen and form a roughened portion, Forming a base portion of the synthetic resin by attaching a synthetic resin in a molten state or a solution state to the portion of the medical device including the chemical portion; A step of placing an IC tag on the base, and a synthetic resin in a molten state or a solution is attached on the base and the IC tag to cover the base of the synthetic resin and the IC tag.
- a method of manufacturing a medical device is provided, which includes a step of sealing the IC tag in a synthetic resin portion including the base portion and the covering portion by forming a covering portion.
- the medical tag of the present invention is attached with a strong adhesive force in a state where the IC tag is covered with a synthetic resin, the IC tag may be dropped even when the used medical device is repeatedly washed and sterilized. Absent.
- the partial expanded sectional view of the medical device shown in FIG. 1 or FIG. The figure for demonstrating the manufacturing method of the medical device shown in FIG.
- the metal medical instrument shown in FIG. 1 is a forceps 10, which, as shown in FIG. 3, has a porous structure formed on a part of the surface 11 of the forceps 10 and having a large number of holes having a depth of 10 to 900 ⁇ m. It has a roughened portion 12, a synthetic resin portion 30 fixed to the roughened portion 12, and an IC tag 40 sealed inside the synthetic resin portion 30.
- the “hole” is a concept including a groove.
- the metal medical device shown in FIG. 2 is a tweezers 20, which is a porous structure having a large number of pores having a depth of 10 to 900 ⁇ m formed in a part of the surface 21 of the tweezers 20 as shown in FIG.
- a roughened portion 22, a synthetic resin portion 30 fixed to the roughened portion 22, and an IC tag 40 sealed inside the synthetic resin portion 30 are provided.
- the synthetic resin portion 30 includes a base portion (lower layer portion) 31 and a covering portion (upper layer portion) 32.
- the base portion 31 and the covering portion 32 are integrated, and the IC tag 40 is sealed inside.
- the synthetic resin is selected from known thermoplastic resins, thermosetting resins, energy ray curable resins, and the like, and may be a synthetic resin adhesive or a rubber adhesive.
- the base portion 31 and the covering portion 32 may be made of the same synthetic resin or different synthetic resins.
- the base portion 31 is made of a thermoplastic resin and the covering portion 32 is made of an energy ray curable resin. It may be.
- the thickness of the synthetic resin portion 30 from the surface 11 (surface 21) is preferably 2 to 20 mm.
- Step shown in FIG. 4A In the first step, as shown in FIG. 4A, a part of the surface 21 of the tweezers 20 is irradiated with laser light to roughen the surface, and a roughened portion 22 having a porous structure having a large number of holes is formed. Form (roughening step).
- the roughened portion 12 may be a portion of the surface of the tweezers 20 that does not come into contact with the affected part during surgery, and is preferably a portion that does not touch the hand at the root portion.
- the area of the roughened portion 12 may be larger than the area of the IC tag 40, and may be about 10 to 100 mm 2 , for example.
- a method of irradiating a continuous wave laser beam or a pulsed laser beam can be used.
- the method of irradiating the continuous wave laser beam is disclosed in Japanese Patent No. 5774246, Japanese Patent No. 5701414, Japanese Patent No. 5860190, Japanese Patent No. 5890054, Japanese Patent No. 5995989, Japanese Patent Application Laid-Open No. 2016-43413, Japanese Patent Application No. 2016. It can be carried out in the same manner as the continuous laser beam irradiation method described in JP-A-36884 and JP-A-2016-44337.
- a method of continuously irradiating laser light at an irradiation speed of 2000 mm / sec or more with an energy density of 1 MW / cm 2 or more using a laser device is preferable.
- the energy density (W / ⁇ m 2 ) at the time of laser light irradiation is determined from the laser output (W) and the laser irradiation spot area ( ⁇ ⁇ [spot diameter / 2] 2 ).
- Energy density at the irradiation with the laser beam is preferably 2 ⁇ 1000MW / cm 2, more preferably 10 ⁇ 800MW / cm 2, more preferably 10 ⁇ 700MW / cm 2.
- the irradiation rate of laser light is more preferably 2,000 to 20,000 mm / sec, further preferably 2,000 to 18,000 mm / sec, and further preferably 3,000 to 15,000 mm / sec.
- the laser beam output is preferably 4 to 4000 W, more preferably 50 to 2500 W, and even more preferably 150 to 2000 W. If the other laser light irradiation conditions are the same, the depth of the hole (groove) becomes deeper as the output increases, and the depth of the hole (groove) becomes shallower as the output decreases.
- the wavelength of the laser beam is preferably 500 to 11,000 nm.
- the beam diameter (spot diameter) of the laser beam is preferably 5 to 80 ⁇ m.
- the defocus distance of the laser beam is preferably ⁇ 5 to +5 mm, more preferably ⁇ 1 to +1 mm, and further preferably ⁇ 0.5 to +0.1 mm.
- the defocus distance may be irradiated with laser with a set value being constant, or laser irradiation may be performed while changing the defocus distance. For example, at the time of laser irradiation, the defocusing distance may be decreased, or may be periodically increased or decreased. If the defocus distance is an appropriate value of-(minus), the depth of the formed hole becomes deep.
- the depth of the hole can be adjusted by adjusting the number of repetitions when irradiating the laser beam.
- the number of repetitions (total number of times of laser light irradiation for forming one hole or groove) is preferably 1 to 9 times, and more preferably 2 to 5 times. Under the same laser irradiation conditions, the depth of the hole (groove) becomes deeper as the number of repetitions increases, and the depth of the hole (groove) becomes shallower as the number of repetitions decreases.
- Japanese Patent No. 5848104 Japanese Patent No. 578836, Japanese Patent No. 5798534, Japanese Patent No. 5798535, Japanese Patent Laid-Open No. 2016 It can be carried out in the same manner as the pulsed laser beam irradiation method described in Japanese Patent No. -206343.
- a method of irradiating pulsed laser light a method of irradiating pulsed laser light by adjusting one or more selected from the following requirements (a) to (f) can be used.
- a method of irradiating a laser beam from a direction perpendicular to the surface including the surface layer portion of the metal medical instrument, and an angle of 15 to 85 degrees with respect to the surface including the surface layer portion of the metal medical instrument can be controlled by combining the methods of irradiating laser light and irradiating laser light from different angles.
- the laser beam irradiation speed is preferably 1 to 10,000 mm / sec, and more preferably 10 to 1,000 mm / sec.
- the energy density is preferably 0.3 GW / cm 2 or more.
- the energy density at the time of laser beam irradiation is determined from the laser beam output (W) and the laser beam spot area (cm 2 ) ( ⁇ ⁇ [spot diameter / 2] 2 ).
- Energy density at the irradiation with the laser beam is more preferably 0.3 ⁇ 1000GW / cm 2, more preferably 1 ⁇ 800GW / cm 2, more preferably 1 ⁇ 500GW / cm 2. The higher the energy density, the deeper and larger the holes.
- the laser beam output is preferably 4 to 400 W, more preferably 5 to 100 W, and even more preferably 10 to 100 W. If the other laser light irradiation conditions are the same, the larger the output, the deeper and larger the hole, and the smaller the output, the shallower and smaller the hole.
- the number of repetitions (total number of times of laser light irradiation for forming one hole) is preferably 1 to 200 times, and more preferably 3 to 100 times. Under the same laser irradiation conditions, the larger the number of repetitions, the deeper and larger the hole, and the smaller the number of repetitions, the shallower and smaller the hole.
- This irradiation mode is (e-1) a mode in which a laser beam is irradiated in a state where the metal medical device is in contact with a molded body having a thermal conductivity different from that of the metal constituting the metal medical device, or (E-2) In this embodiment, the metal medical instrument is irradiated with laser light while being held in a hollow state.
- the following method (i) or (ii) can be applied.
- (I) A non-irradiated surface of a metal medical instrument with a laser beam and a material having a higher thermal conductivity than the metal constituting the metal medical instrument (for example, a material having a thermal conductivity of 100 W / m ⁇ k or more)
- a method of irradiating a laser beam in contact with a substrate comprising: As the method (i), the method described in JP-A-2016-78090 can be applied.
- the method (i) can suppress an increase in temperature by dissipating the heat generated when the metal medical instrument is irradiated with laser light.
- the method (ii) can suppress the heat radiation generated when the metal medical instrument is irradiated with laser light.
- Requirement (e-2) irradiation mode is a mode in which a metal medical instrument is irradiated with laser light while being held hollow by a holding means such as a clamp. By holding the medical device made of metal in a hollow state, it is possible to suppress heat radiation generated when the laser beam is irradiated.
- irradiation can be performed while supplying an assist gas selected from air, oxygen, nitrogen, and argon when irradiating laser light.
- Laser light can be irradiated even in a vacuum atmosphere (reduced pressure atmosphere).
- selection of argon gas can prevent surface oxidation
- selection of oxygen can promote surface oxidation
- selection of nitrogen gas can improve surface hardness
- Pulse wave laser light cannot irradiate laser light in a continuous straight line like continuous wave laser light, but irradiates dots (dots) to form a line by connecting a plurality of the dots. Therefore, it is possible to irradiate the pulse wave laser beam so that a large number of dots are formed at intervals without forming a line.
- the line interval or dot interval is preferably in the range of 0.01 to 1 mm.
- the adjacent lines or dots will also have a thermal effect, resulting in larger holes, more complex hole shapes, and deeper hole depths, If the thermal effect becomes too great, an appropriate hole shape may not be formed.
- the wavelength of the pulsed laser beam is preferably 500 to 11,000 nm, and the beam diameter (spot diameter) of the pulsed laser beam is preferably 5 to 80 ⁇ m.
- the frequency of the pulsed laser beam is preferably 1 to 100 kHz, and the pulse width is preferably 1 to 10000 nsec.
- a fiber laser apparatus in which a direct modulation type modulation apparatus that directly converts a laser driving current is connected to a laser power source is used, and laser irradiation is performed with a duty ratio adjusted.
- pulse excitation There are two types of laser excitation, pulse excitation and continuous excitation, and pulse wave lasers based on pulse excitation are generally called normal pulses.
- a pulse wave laser can be produced by a direct modulation method in which a pulse wave laser is generated by directly modulating a laser beam.
- the pulse method, the pulse method by operating the galvano controller, and the direct modulation method in which the pulse current laser is generated by directly modulating the laser driving current are preferable.
- a pulsed laser is produced by continuously exciting a laser by using a fiber laser device in which a direct modulation type modulation device that directly converts a laser driving current is connected to a laser power source. Is.
- the duty ratio is a ratio obtained from the ON time and OFF time of the laser light output by the following equation.
- Duty ratio (%) ON time / (ON time + OFF time) ⁇ 100
- the duty ratio corresponds to L1 / (L1 + L2), where L1 is the length of the laser light irradiation portion and L2 is the length of the non-irradiation portion of the laser light, and the duty ratio ranges from 10 to 90%. You can choose.
- ⁇ Irradiation with a dotted line can be performed by adjusting the duty ratio and irradiating laser light.
- the duty ratio is large, the efficiency of the roughening process is improved, but the cooling effect is low.
- the duty ratio is small, the cooling effect is improved, but the roughening efficiency is deteriorated. It is preferable to adjust the duty ratio according to the purpose.
- the length (L1) of the laser light irradiation portion is preferably 0.05 mm or more, and preferably 0.1 to 1 mm in order to roughen the surface into a complex porous structure while exhibiting a cooling effect.
- Known lasers can be used for laser light irradiation, such as YVO 4 laser, fiber laser (single mode fiber laser, multimode fiber laser), excimer laser, carbon dioxide laser, ultraviolet laser, YAG laser, semiconductor laser, glass laser, ruby laser, He—Ne laser, nitrogen laser, chelate laser, and dye laser can be used.
- the roughened portion 22 of the tweezers 20 roughened in the step shown in FIG. 4A is in a state in which a large number of holes are formed (porous structure).
- the depth from the surface 21 of the hole tweezers 20 (the surface of the unroughened tweezers 20) to the bottom of the hole is preferably in the range of 10 to 900 ⁇ m.
- the depth of the hole is more preferably in the range of 20 to 500 ⁇ m, still more preferably in the range of 30 to 300 ⁇ m.
- the base portion 31 of the synthetic resin portion 30 is formed by attaching a synthetic resin in a molten state or a solution state to the portion of the tweezers 20 including the roughened portion 22.
- the base portion 31 is for placing the IC tag 40 on the base portion 31 in the step shown in FIG. 4C, which is the next step. Therefore, the base portion 31 is formed to have a larger area than the area occupied by the IC tag 40. It is preferable to do this.
- the synthetic resin may be in any form that allows a small amount of synthetic resin to adhere to the roughened portion 22, and may be in a heated and melted state or in a solution state dissolved in a solvent.
- a method of attaching a method that can apply (hang) a small amount of synthetic resin to the roughened portion 22 may be applied, and potting or the like can be applied.
- the synthetic resin used in this step includes thermoplastic elastomers as well as thermoplastic resins and thermosetting resins, and energy beam curable resins can also be used.
- thermoplastic elastomers as well as thermoplastic resins and thermosetting resins, and energy beam curable resins can also be used.
- synthetic resin a synthetic resin adhesive and a rubber adhesive can also be used.
- drying, heating, energy ray irradiation, etc. are performed according to the type of synthetic resin forming the base portion 31, and the IC tag is placed on the base portion 31 in the next step. It can be cured within a range that can be stabilized when 40 is placed (to the extent that it can be lightly recessed and stabilized when the IC tag 40 is placed).
- the process shown in FIG. 4B can be omitted in relation to the type, size, and shape of the medical device to be applied, and the size of the IC tag 40, etc.
- the area 31 may be smaller than the area (occupied region) of the IC tag 40.
- the thermoplastic resin can be appropriately selected from known thermoplastic resins depending on the application.
- polyamide-based resins aliphatic polyamides such as PA6 and PA66, aromatic polyamides
- polystyrene polystyrene
- copolymers containing styrene units such as ABS resin and AS resin
- polyethylene copolymers containing ethylene units
- polypropylene propylene Copolymers containing units
- other polyolefins polyvinyl chloride, polyvinylidene chloride
- polycarbonate resins acrylic resins, methacrylic resins, polyester resins, polyacetal resins, polyphenylene sulfide resins, It is not limited to these.
- thermosetting resin can be appropriately selected from known thermosetting resins depending on the application.
- urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, polyurethane, and vinyl urethane can be mentioned, but are not limited thereto.
- thermoplastic elastomer can be appropriately selected from known thermoplastic elastomers according to the application. Examples thereof include, but are not limited to, styrene elastomers, vinyl chloride elastomers, olefin elastomers, urethane elastomers, polyester elastomers, nitrile elastomers, and polyamide elastomers.
- the energy beam curable resin is preferably selected from an ultraviolet curable resin and an electron beam curable resin.
- the energy ray curable resin is preferably selected from a radical polymerizable monomer, an oligomer of a radical polymerizable monomer, a cationic polymerizable monomer, and an oligomer of a cationic polymerizable monomer.
- the monomer or oligomer can be used as it is at room temperature (including low-viscosity gel) or in solution form dissolved in a solvent, and solid (powder) can be melted by heating, It can be used after being dissolved in a solvent.
- radical polymerizable compound a radical polymerizable group such as a (meth) acryloyl group, a (meth) acryloyloxy group, a (meth) acryloylamino group, a vinyl ether group, a vinylaryl group, or a vinyloxycarbonyl group is contained in one molecule.
- a radical polymerizable group such as a (meth) acryloyl group, a (meth) acryloyloxy group, a (meth) acryloylamino group, a vinyl ether group, a vinylaryl group, or a vinyloxycarbonyl group is contained in one molecule.
- Compounds having one or more (meth) acryloyl groups in one molecule include 1-buten-3-one, 1-penten-3-one, 1-hexen-3-one, 4-phenyl-1-butene- Examples include, but are not limited to, 3-one, 5-phenyl-1-penten-3-one, and derivatives thereof.
- Compounds having one or more (meth) acryloyloxy groups in one molecule include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) ) Acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n-lauryl (meth) acrylate, n-stearyl (meth) acrylate, n-butoxyethyl (meth) acrylate, Butoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, cyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth
- Examples of compounds having one or more (meth) acryloylamino groups in one molecule include 4- (meth) acryloylmorpholine, N, N-dimethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, and N-methyl.
- Examples of the compound having one or more vinyl ether groups in one molecule include 3,3-bis (vinyloxymethyl) oxetane, 2-hydroxyethyl vinyl ether, 3-hydroxypropyl vinyl ether, 2-hydroxypropyl vinyl ether, 2-hydroxy Isopropyl vinyl ether, 4-hydroxybutyl vinyl ether, 3-hydroxybutyl vinyl ether, 2-hydroxybutyl vinyl ether, 3-hydroxyisobutyl vinyl ether, 2-hydroxyisobutyl vinyl ether, 1-methyl-3-hydroxypropyl vinyl ether, 1-methyl-2-hydroxy Propyl vinyl ether, 1-hydroxymethylpropyl vinyl ether, 4-hydroxycyclohexyl vinyl ether, 1,6-hexanediol Monovinyl ether, 1,4-cyclohexanedimethanol monovinyl ether, 1,3-cyclohexanedimethanol monovinyl ether, 1,2-cyclohexanedimethanol monovinyl ether, p-xylene glycol mono
- Examples of the compound having one or more vinylaryl groups in one molecule include styrene, divinylbenzene, methoxystyrene, ethoxystyrene, hydroxystyrene, vinylnaphthalene, vinylanthracene, 4-vinylphenyl acetate, (4-vinylphenyl) dihydroxyborane. , N- (4-vinylphenyl) maleimide, and derivatives thereof, but are not limited thereto.
- Compounds having one or more vinyloxycarbonyl groups in one molecule include isopropenyl formate, isopropenyl acetate, isopropenyl propionate, isopropenyl butyrate, isopropenyl isobutyrate, isopropenyl caproate, isopropenyl valerate, isopropenyl Isopropenyl valerate, isopropenyl lactate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl caproate, vinyl caprylate, vinyl laurate, vinyl myristate, vinyl palmitate, vinyl stearate, vinyl cyclohexanecarboxylate, pivalic acid Vinyl, vinyl octylate, vinyl monochloroacetate, divinyl adipate, vinyl acrylate, vinyl methacrylate, vinyl crotonate, vinyl sorbate, vinyl benzoate, vinyl cinnamate, etc. Body like, but not limited thereto.
- cationic polymerizable monomer examples include compounds having one or more cationic polymerizable groups such as an epoxy ring (oxiranyl group), a vinyl ether group, a vinyl aryl group, and an oxetanyl group in one molecule.
- Compounds having one or more epoxy rings in one molecule include glycidyl methyl ether, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F di Glycidyl ether, brominated bisphenol S diglycidyl ether, epoxy novolac resin, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, 3,4-epoxycyclohexylmethyl (3,4 -Epoxy) cyclohexanecarboxylate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-meta-dioxa Bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxy
- Examples of the compound having one or more vinyl ether groups in one molecule and the compound having one or more vinyl aryl groups in one molecule include the same compounds as those exemplified as the radical polymerizable compound (a-2).
- Compounds having one or more oxetanyl groups in one molecule include trimethylene oxide, 3,3-bis (vinyloxymethyl) oxetane, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3- (2- Ethylhexyloxymethyl) oxetane, 3-ethyl-3- (hydroxymethyl) oxetane, 3-ethyl-3-[(phenoxy) methyl] oxetane, 3-ethyl-3- (hexyloxymethyl) oxetane, 3-ethyl-3 -(Chloromethyl) oxetane, 3,3-bis (chloromethyl) oxetane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, bis ⁇ [1-ethyl (3-oxetanyl)] Methyl ⁇ ether, 4,4
- oligomer of the radical polymerizable monomer and the cationic polymerizable monomer examples include monofunctional or polyfunctional (meth) acrylic oligomers. One or a combination of two or more can be used.
- Examples of monofunctional or polyfunctional (meth) acrylic oligomers include urethane (meth) acrylate oligomers, epoxy (meth) acrylate oligomers, polyether (meth) acrylate oligomers, and polyester (meth) acrylate oligomers.
- urethane (meth) acrylate oligomer examples include polycarbonate-based urethane (meth) acrylate, polyester-based urethane (meth) acrylate, polyether-based urethane (meth) acrylate, and caprolactone-based urethane (meth) acrylate.
- the urethane (meth) acrylate oligomer can be obtained by a reaction between an isocyanate compound obtained by reacting a polyol and diisocyanate and a (meth) acrylate monomer having a hydroxyl group.
- the polyol include polycarbonate diol, polyester polyol, polyether polyol, and polycaprolactone polyol.
- the epoxy (meth) acrylate oligomer can be obtained by, for example, an esterification reaction between an oxirane ring of a low molecular weight bisphenol type epoxy resin or a novolac epoxy resin and acrylic acid.
- the polyether (meth) acrylate oligomer is obtained by obtaining a polyether oligomer having hydroxyl groups at both ends by dehydration condensation reaction of polyol, and then esterifying the hydroxyl groups at both ends with acrylic acid.
- the polyester (meth) acrylate oligomer is obtained, for example, by obtaining a polyester oligomer having hydroxyl groups at both ends by condensation of polycarboxylic acid and polyol, and then esterifying the hydroxyl groups at both ends with acrylic acid.
- the weight average molecular weight of the monofunctional or polyfunctional (meth) acrylic oligomer is preferably 100,000 or less, particularly preferably 500 to 50,000.
- Synthetic resin adhesives and rubber adhesives are not particularly limited, and known adhesives such as the following thermoplastic adhesives and thermosetting adhesives can be used.
- thermoplastic adhesives polyvinyl acetate, polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, acrylic adhesive, polyethylene, chlorinated polyethylene, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, ethylene-ethyl Acrylate copolymer, ethylene-acrylic acid copolymer, ionomer, chlorinated polypropylene, polystyrene, polyvinyl chloride, plastisol, vinyl chloride-vinyl acetate copolymer, polyvinyl ether, polyvinyl pyrrolidone, polyamide, nylon, saturated amorphous polyester A cellulose derivative can be mentioned, but is not limited thereto.
- thermosetting adhesive examples include, but are not limited to, urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, polyurethane, and vinyl urethane.
- Rubber adhesives include natural rubber, synthetic polyisoprene, polychloroprene, nitrile rubber, styrene-butadiene rubber, styrene-butadiene-vinylpyridine terpolymer, polyisobutylene-butyl rubber, polysulfide rubber, silicone RTV, and chlorinated rubber. Examples thereof include, but are not limited to, brominated rubber, kraft rubber, block copolymer, and liquid rubber.
- the planar area (occupied region) of the IC tag 40 is preferably smaller than the planar area of the base portion 31. As a result, the base portion 31 extends around the IC tag 40.
- the IC tag 40 is known and has an integrated circuit, can read and write information wirelessly with a reader (R / W), has information processing and storage functions, and has radio waves It is one of the small electronic devices that work in response. If the IC tag 40 is attached to the tweezers 20, the tweezers 20 can be identified without contacting the tweezers 20, so that it is easy to manage usage history and loss prevention.
- a synthetic resin in a molten or solution state is adhered on the base portion 31 and the IC tag 40 to form a synthetic resin covering portion 32 that covers the base portion 31 of the synthetic resin and the IC tag 40.
- the IC tag 40 is sealed in the synthetic resin portion 30.
- the step shown in FIG. 4B even when the base portion 31 is not formed, or when the area of the base portion 31 is smaller than the area of the IC tag 40, the surface of the roughened portion 22 is also formed.
- a synthetic resin in a molten state or a solution state is attached to the IC tag 40 placed thereon to form a synthetic resin covering portion 32, whereby the IC tag 40 is sealed in the synthetic resin portion 30 including the covering portion 32. Stop.
- the amount of the synthetic resin that forms the covering portion 32 is larger than the amount of the synthetic resin that forms the base portion 31.
- the amount of the synthetic resin that forms the covering portion 32 is the amount of the synthetic resin that forms the base portion 31.
- the amount can be about 5 to 15 times the amount.
- the height of the synthetic resin portion 30 from the surface 21 of the tweezers 20 is preferably 2 to 20 mm, and more preferably 3 to 10 mm.
- the synthetic resin portion 30 composed of the base portion 31 and the covering portion 32 formed by attaching a synthetic resin can be left to solidify or be heat-cured depending on the type of the synthetic resin used.
- the base portion 31 and the covering portion 32 are cured by irradiating energy rays (ultraviolet rays, electron beams, etc.).
- energy rays ultraviolet rays, electron beams, etc.
- the irradiation method of energy rays is not particularly limited, and may be performed until the uncured monomer or oligomer is cured. Depending on the type of energy beam, it can also be carried out in a sealed atmosphere.
- the metallic medical instrument (tweezers) 20 having the IC tag 40 sealed in the synthetic resin portion 30 shown in FIGS. 3 and 4 (d) is rough formed on a part of the surface 21 of the tweezers 20.
- the surface portion 22 and the base portion 31 are in close contact with each other with high strength, and the base portion 31 and the covering portion 32 are integrated.
- the IC tag 40 is sealed in the synthetic resin part 30 including the base part 31 and the covering part 32, and the synthetic resin part 30 is closely attached to the medical instrument with high strength. Therefore, even when the medical instrument is repeatedly used in surgery or the like and repeatedly cleaned and sterilized after use, the IC tag 40 does not fall off the medical instrument.
- the covering portion 32 and the roughened portion are formed. Since 12 is closely attached with high strength, the IC tag 40 is not dropped from the medical device.
- the medical instrument equipped with the IC tag of the present invention can easily identify each of surgical instruments such as a scalpel, scissors, forceps, and tweezers used in surgery, etc. In addition to being easy, it is possible to completely prevent the occurrence of a loss during surgery and a situation in which the loss itself is difficult to detect.
- surgical instruments such as a scalpel, scissors, forceps, and tweezers used in surgery, etc.
- Example 1 In Example 1, a predetermined portion of tweezers 20 as shown in FIG. 2 was roughened by laser irradiation under the following conditions (FIG. 4A).
- the tweezers 20 are made of stainless steel.
- the depth of the hole of the roughened part 22 of the surface 21 of the tweezers 20 after roughening used in Example 1 was 170 ⁇ m.
- an ultraviolet curable resin (liquid at room temperature) is collected with a small dropper and dropped on the roughened portion 22 by one drop (about 0.005 ml), covering the entire roughened portion 22 and the base portion 31. Was formed (FIG. 4B).
- UV curable resin 100 parts by mass of urethane acrylate (product name EBECRYL8402, Daicel Ornex Co., Ltd.) and 5 parts by mass of a photoinitiator (Irgacure 1173, manufactured by BASF) were used.
- the IC tag 40 (length 8 mm, width 3 mm, thickness 2 mm) was picked with work tweezers and placed on the foundation 31 (FIG. 4C). At this time, the base 31 was slightly recessed.
- the same UV curable resin as that used for the base 31 is collected with a dropper and dropped by 3 drops (about 0.06 ml). A covering portion 32 was formed to cover both of them (FIG. 4D).
- the tweezers 20 was placed with the surface 21 facing upward, and ultraviolet rays were irradiated from above with a high-pressure mercury lamp. It adjusted so that the energy of 3 J / cm ⁇ 2 > might be provided to the ultraviolet curable resin of the synthetic resin part 30 on the tweezers 20 in total.
- the tweezers 20 in which the IC tag 40 was sealed in the synthetic resin portion 30 was obtained.
- the synthetic resin portion 30 was strongly adhered to the surface of the tweezers 20 and was not peeled off or damaged even when pressed strongly with a metal spatula (made of stainless steel) having a width of 10 mm.
- Examples 2-5 The tweezers 20 having the synthetic resin portion 30 (IC tag 40) was produced in the same manner as in Example 1 by using a combination of 100 parts by mass of each energy curable resin described below and 5 parts by mass of the photoinitiator.
- Example 2 Epoxy acrylate (product name EBECRYL3708, Daicel Ornex Co., Ltd.), photoinitiator (Irgacure 1173, manufactured by BASF)
- Example 3 Acrylic monomer (product name IRR214-K, Daicel Ornex Co., Ltd.), photoinitiator (Irgacure 1173, manufactured by BASF)
- Example 4 Alicyclic epoxy resin (product name Celoxide 2021P, Daicel Corp.), photoinitiator (CPI-101A, San Apro Corp.)
- Example 5 Bisphenol A type epoxy resin (product name jER828, Mitsubishi Chemical Corporation), photoinitiator (CPI-101A, San Apro Corporation)
- the synthetic resin portions 30 of Examples 2 to 5 are all in close contact with the surface of the tweezers 20 and may be peeled off or damaged even if pressed strongly with a 10 mm wide metal spatula (made of stainless steel). There wasn't.
- Examples 6-8 A predetermined portion of the tweezers 20 as shown in FIG. 2 was irradiated with pulsed laser light so as to satisfy the requirements (a) to (f) shown in Table 1.
- the tweezers 20 are made of 64Ti.
- Meander (Fig. 6): After irradiating the pulsed laser beam in one direction in a straight line, it is folded back at an interval of 0.06 mm, and the pulse wave laser beam is irradiated in a straight line in the opposite direction in a straight line. This operation was repeated twice to form one groove, and then the operation to form the next groove with an interval of 0.105 mm was performed once, and the same operation was further repeated 60 times.
- Circle (FIG. 7): A pulsed laser beam was scanned 10 times in a circle shape having a diameter of 200 ⁇ m at the spot diameter and irradiation speed shown in Table 1 to form a circle having a diameter of slightly over 200 ⁇ m. The same operation was repeated to form a plurality of circles. The center-to-center distance between adjacent circles was 0.4 mm.
- FIGS. 5 to 7 Surface photographs (SEM photographs) of titanium tweezers after laser light irradiation are shown in FIGS. As shown in FIGS. 5 to 7, it was confirmed that the surface of the titanium tweezers had a porous structure. The maximum depth was measured using a digital microscope VHX-6000 (manufactured by Keyence Corporation).
- the medical instrument of the present invention and the manufacturing method thereof can be applied to various metal medical instruments such as a scalpel, scissors, forceps, and tweezers used in surgery, etc. Can be used. Explanation of symbols
Abstract
Description
背景技術
発明の概要
前記基礎部の上にICタグを置く工程、前記基礎部と前記ICタグの上に溶融状態または溶液状態の合成樹脂を付着させて、前記合成樹脂の基礎部および前記ICタグを覆う合成樹脂の被覆部を形成することで、前記ICタグを前記基礎部と前記被覆部からなる合成樹脂部内に封止する工程を有している、医療器具の製造方法を提供する。
図1に示す金属製の医療器具は鉗子10であり、これは図3に示すとおり、鉗子10の表面11の一部に形成された、深さ10~900μmの多数の孔を有する多孔構造の粗面化部12と、粗面化部12に固着された合成樹脂部30と、合成樹脂部30の内部に封止されたICタグ40を有しているものである。なおここで「孔」は溝を含む概念である。
図4により本発明の医療用具の製造方法を工程ごとに説明する。医療器具は、図2に示すピンセット20の場合について説明する。
最初の工程にて、図4(a)に示すようにピンセット20の表面21の一部に対してレーザー光を照射して粗面化し、多数の孔を有する多孔構造の粗面化部22を形成する(粗面化工程)。
レーザー光の照射方向を特定方向および特定角度に固定することで、形成される孔に配向性を生じさせることができる。
レーザー光の照射速度は1~10,000mm/secが好ましく、10~1,000mm/secがより好ましい。
エネルギー密度は0.3GW/cm2以上が好ましい。レーザー光の照射時のエネルギー密度は、レーザー光の出力(W)と、レーザー光のスポット面積(cm2)(π・〔スポット径/2〕2)から求められる。レーザー光の照射時のエネルギー密度は、0.3~1000GW/cm2がより好ましく、1~800GW/cm2がさらに好ましく、1~500GW/cm2がさらに好ましい。エネルギー密度が大きくなるほど、孔は深くかつ大きくなる。
繰り返し回数(一つの孔を形成するための合計のレーザー光の照射回数)は、1~200回が好ましく、3~100回がより好ましい。同一のレーザー照射条件であれば、繰り返し回数が多いほど孔が深くかつ大きくなり、繰り返し回数が少ないほど孔が浅くかつ小さくなる。
この照射形態は、(e-1)前記金属製の医療器具を構成する金属と異なる熱伝導率を有する成形体と前記金属製の医療器具を接触させた状態でレーザー光を照射する形態、または
(e-2)前記金属製の医療器具を中空に保持した状態でレーザー光を照射する形態である。
(i)金属製の医療器具のレーザー光の非照射面と、金属製の医療器具を構成する金属よりも熱伝導率の大きい材料(例えば熱伝導率が100W/m・k以上である材料)からなる基板(例えば、銅板、アルミニウム板)と接触させた状態でレーザー光を照射する方法。(i)の方法としては、特開2016-78090号公報に記載の方法を適用することができる。
前記金属製の医療器具に対してレーザー光をライン状に照射するとき、隣接するライン同士の間隔を広くしたり、狭くしたりすることで、孔の大きさ、孔の形状、孔の深さを調整することができる。
デューティ比(%)=ON時間/(ON時間+OFF時間)×100
次の工程にて、粗面化部22を含むピンセット20の部分に対して、溶融状態または溶液状態の合成樹脂を付着させて合成樹脂部30の基礎部31を形成する。
ラジカル重合性化合物としては、(メタ)アクリロイル基、(メタ)アクリロイルオキシ基、(メタ)アクリロイルアミノ基、ビニルエーテル基、ビニルアリール基、ビニルオキシカルボニル基などのラジカル重合性基を一分子内に1つ以上有する化合物などが挙げられる。
カチオン重合性モノマーとしては、エポキシ環(オキシラニル基)、ビニルエーテル基、ビニルアリール基、オキセタニル基等のカチオン重合性基を一分子内に1つ以上有する化合物などが挙げられる。
ラジカル重合性モノマーとカチオン重合性モノマーのオリゴマーとしては、単官能または多官能(メタ)アクリル系オリゴマーが挙げられ。1種または2種以上を組み合わせて使用できる。
次の工程にて、基礎部31の上にICタグ40を置く。ICタグ40の平面の面積(占有領域)は、基礎部31の平面の面積よりも小さなものであることが好ましい。その結果、基礎部31はICタグ40の周囲に延在する。
次の工程にて、基礎部31とICタグ40の上に溶融状態または溶液状態の合成樹脂を付着させて、合成樹脂の基礎部31およびICタグ40を覆う合成樹脂の被覆部32を形成することで、ICタグ40を合成樹脂部30内に封止する。図4(b)に示す工程において、基礎部31を形成しなかったり、基礎部31の面積がICタグ40の面積よりも小さくなるように形成したりしたときも、粗面化部22上に置かれたICタグ40の上に溶融状態または溶液状態の合成樹脂を付着させて、合成樹脂の被覆部32を形成することで、ICタグ40を被覆部32からなる合成樹脂部30内に封止する。
実施例
実施例1は、図2に示すようなピンセット20の所定部分に対して、次の条件でレーザー照射して粗面化した(図4(a))。ピンセット20はステンレス製である。
発振機:YLR-300-AC(シングルモードファイバーレーザ)IPG社製
集光系:fc=80mm/fθ=100mm
焦点はずし距離:±0mm(一定)
出力(W):300
波長(nm):1070
スポット径(μm):16
エネルギー密度(MW/cm2):300/(π×〔0.0016cm/2〕2)=約150 MW/cm2
レーザー照射速度(mm/sec):10000
照射パターン:双方向
繰り返し数:15回
ライン本数:120
ライン間隔(mm):0.05
加工時間(s):3.37
孔の深さは、レーザー光照射後の表面(6×10=60mm2の広さ範囲)の一部(1mm×1mm=1mm2の面積)を選び、デジタルマイクロスコープM205C(ライカ・マイクロシステムズ(株))で測定した。具体的には、1mm×1mmの正方形に100μm間隔で平行に5本の直線を引き、その直線部分の断面観察から深さを測定した。5箇所の部分で測定した、最大の深さの平均を孔(溝)の深さとした。
下記の各エネルギー硬化性樹脂100質量部と光開始剤5質量部の組み合わせを使用して、実施例1と同様にして合成樹脂部30(ICタグ40)を有するピンセット20を製造した。
実施例3:アクリルモノマー(品名IRR214-K,ダイセル・オルネクス(株))、光開始剤(Irgacure1173,BASF社製)
実施例4:脂環式エポキシ樹脂(品名セロキサイド2021P,(株)ダイセル)、光開始剤(CPI-101A,サンアプロ(株))
実施例5:ビスフェノールA型エポキシ樹脂(品名jER828,三菱化学(株))、光開始剤(CPI-101A,サンアプロ(株))
図2に示すようなピンセット20の所定部分に対して、表1に示す要件(a)~(f)を満たすようにしてパルス波レーザー光を照射した。ピンセット20は64Ti製である。
四角穴(図5):パルス波レーザー光を表1記載のスポット径で、直線状に150μm照射した後、0.028mmの間隔(隣接する溝の中心間距離)で反対方向に同様にして照射し、これを5回繰り返した操作を1回として、さらに同様の操作を5回繰り返して、最大深さ180μmの四角穴を形成した。さらに同様の操作を繰り返して、隣接する四角穴同士の間隔150μmである複数の四角穴を形成した。
符号の説明
11(21) 医療器具の表面
12(22) 粗面化部
20 医療器具(ピンセット)
30 合成樹脂部
31 基礎部(下層部)
32 被覆部(上層部)
40 ICタグ
Claims (11)
- 封止されたICタグを有する金属製の医療器具であって、
前記金属製の医療器具の深さ10~900μmの孔を有する多孔構造の粗面化部に固着された合成樹脂部と、前記合成樹脂部の内部に封止された前記ICタグを有している、医療器具。 - 医療器具がメス、剪刀、鉗子、またはピンセットである、請求項1記載の医療器具。
- ICタグの全部または一部が医療器具の粗面化部と接触した状態である、請求項1記載の医療器具。
- 医療器具の製造方法であって、
金属製の医療器具の表面の一部に対してレーザー光を照射して粗面化し粗面化部を形成する工程、
前記粗面化部を含む医療器具の部分に対して、溶融状態または溶液状態の合成樹脂を付着させて合成樹脂の基礎部を形成する工程、
前記基礎部の上にICタグを置く工程、
前記基礎部と前記ICタグの上に溶融状態または溶液状態の合成樹脂を付着させて、前記合成樹脂の基礎部および前記ICタグを覆う合成樹脂の被覆部を形成することで、前記ICタグを前記基礎部と前記被覆部からなる合成樹脂部内に封止する工程を有している、医療器具の製造方法。 - ICタグの平面の面積が、基礎部の平面の面積よりも小さなものである、請求項4記載の医療器具の製造方法。
- 医療器具の製造方法であって、
金属製の医療器具の表面の一部に対してレーザー光を照射して粗面化し粗面化部を形成する工程、
前記粗面化部の上にICタグを置く工程、
前記粗面化部と前記ICタグの上に溶融状態または溶液状態の合成樹脂を付着させて、前記粗面化部および前記ICタグを覆う合成樹脂の被覆部を形成することで、前記ICタグを前記被覆部からなる合成樹脂部内に封止する工程を有している、医療器具の製造方法。 - 前記粗面化部を形成する工程が、深さ10~900μmの孔を有する多孔構造を形成する工程である、請求項4または6記載の医療器具の製造方法。
- 医療器具がメス、剪刀、鉗子、またはピンセットである、請求項4または6記載の医療器具の製造方法。
- 前記レーザー光を照射して粗面化する工程が、連続波レーザー光またはパルス波レーザー光を照射する工程である、請求項4または6記載の医療器具の製造方法。
- 前記レーザー光を照射して粗面化する工程が、レーザー装置を使用してエネルギー密度が1MW/cm2以上で、2000mm/sec以上の照射速度でレーザー光を連続照射する工程である、請求項4または6記載の医療器具の製造方法。
- 前記レーザー光を照射して粗面化する工程が、下記の要件(a)~(f)から選ばれる1または2以上を調整してパルス波レーザー光を照射する工程である、請求項4または6記載の医療器具の製造方法。
(a)前記金属製の医療器具に対してレーザー光を照射するときの照射方向と照射角度
(b)前記金属製の医療器具に対してレーザー光を照射するときの照射速度
(c)前記金属製の医療器具に対してレーザー光を照射するときのエネルギー密度
(d)前記金属製の医療器具に対してレーザー光を照射するときの繰り返し回数
(e)前記金属製の医療器具に対してレーザー光を照射するときの照射形態
(f)前記金属製の医療器具に対してレーザー光を照射するときのラインまたはドット間隔
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WO2021075159A1 (ja) * | 2019-10-18 | 2021-04-22 | 株式会社村田製作所 | 無線icタグ付き医療用金属製器具 |
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JP6912022B1 (ja) * | 2019-09-05 | 2021-07-28 | 株式会社村田製作所 | 無線icタグ付き医療用金属製器具 |
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WO2021075159A1 (ja) * | 2019-10-18 | 2021-04-22 | 株式会社村田製作所 | 無線icタグ付き医療用金属製器具 |
JP6912023B1 (ja) * | 2019-10-18 | 2021-07-28 | 株式会社村田製作所 | 無線icタグ付き医療用金属製器具 |
US11701200B2 (en) | 2019-10-18 | 2023-07-18 | Murata Manufacturing Co., Ltd. | Wireless IC tag-attached metal medical instrument |
Also Published As
Publication number | Publication date |
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EP3603563A4 (en) | 2020-12-30 |
JPWO2018181526A1 (ja) | 2020-02-06 |
TW201841591A (zh) | 2018-12-01 |
US20200031067A1 (en) | 2020-01-30 |
EP3603563A1 (en) | 2020-02-05 |
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