WO2018179408A1 - Dispositif de mesure de température - Google Patents

Dispositif de mesure de température Download PDF

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Publication number
WO2018179408A1
WO2018179408A1 PCT/JP2017/013785 JP2017013785W WO2018179408A1 WO 2018179408 A1 WO2018179408 A1 WO 2018179408A1 JP 2017013785 W JP2017013785 W JP 2017013785W WO 2018179408 A1 WO2018179408 A1 WO 2018179408A1
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WIPO (PCT)
Prior art keywords
temperature measuring
multilayer printed
region
temperature
circuit board
Prior art date
Application number
PCT/JP2017/013785
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English (en)
Japanese (ja)
Inventor
太 下薗
健太 渡邉
吉英 豊嶋
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to CN201780079947.8A priority Critical patent/CN110121635B/zh
Priority to JP2018513043A priority patent/JP6351914B1/ja
Priority to PCT/JP2017/013785 priority patent/WO2018179408A1/fr
Publication of WO2018179408A1 publication Critical patent/WO2018179408A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/10—Arrangements for compensating for auxiliary variables, e.g. length of lead
    • G01K7/12—Arrangements with respect to the cold junction, e.g. preventing influence of temperature of surrounding air

Definitions

  • the present invention relates to a temperature measurement device that performs temperature measurement using a thermocouple.
  • a temperature measurement device that measures temperature using a thermocouple measures the target temperature using cold junction compensation technology. That is, in a temperature measuring device that measures temperature using a thermocouple, the temperature obtained from the thermoelectromotive force generated in the thermocouple is detected using a temperature measuring element such as a thermistor or a diode at the reference junction temperature of the thermocouple. That is, it compensates using the temperature of the cold junction.
  • the reference contact in such a temperature measuring device is a terminal block that electrically and thermally connects the main body housing the printed circuit board and the thermocouple, and the temperature measuring element is in a region near the terminal block on the printed circuit board. Be placed.
  • the temperature measuring element and the terminal block cannot be placed as close as possible to each other, and the distance between the two is increased. For this reason, the thermal resistance between the two is large, and a temperature difference caused by the thermal resistance becomes a temperature measurement error.
  • Patent Document 1 a heat dissipating sheet, which is a heat conductive material having high heat conductivity, is provided between an input terminal serving as a reference contact and a temperature sensing element constituting a cold junction compensation circuit.
  • a temperature measuring device is disclosed.
  • Patent Document 1 it is necessary to add a special part such as a heat radiating sheet, and there is a problem that the structure is complicated and it is difficult to reduce the size.
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a temperature measuring device that can be miniaturized with a simple structure and can perform temperature measurement with high accuracy.
  • a temperature measurement device is a cold junction compensation type temperature measurement device that performs temperature measurement using a thermocouple, and includes a multilayer printed board, To detect the temperature of the terminal block that is mounted on one side of the multilayer printed circuit board and connected to the thermocouple and serves as the reference junction for the thermocouple, and the reference junction of the thermocouple mounted on one side of the multilayer printed circuit board And a temperature measuring element.
  • the terminal block and the temperature measuring element are formed in a soaking area having higher soaking properties than other areas in the multilayer printed board in the plane of the multilayer printed board.
  • the temperature measuring device according to the present invention can be miniaturized with a simple structure, and has the effect of obtaining a temperature measuring device capable of measuring temperature with high accuracy.
  • FIG. 1 is an internal perspective view of the temperature measuring apparatus 100 according to the first embodiment of the present invention as seen from the left side, and shows a state seen through the left side.
  • FIG. 2 is a perspective view of the temperature measuring apparatus 100 according to the first embodiment of the present invention as viewed from the left front, and shows a state in which a part is cut away. In FIG. 2, illustration of a part of the configuration is omitted for convenience.
  • the temperature measurement apparatus 100 is a cold junction compensation type temperature measurement apparatus that performs temperature measurement using a thermocouple.
  • a temperature measuring apparatus 100 according to the first embodiment includes a multilayer printed circuit board 3, a terminal block 2 that is mounted on one surface of the multilayer printed circuit board 3 and serves as a reference contact of the thermocouple 1, and a multilayer printed circuit board 3. And a temperature measuring element 4 mounted on one surface of the printed circuit board 3 for detecting the temperature of the reference junction of the thermocouple 1.
  • a thermocouple 1 is connected to the terminal block 2.
  • the terminal block 2 and the temperature measuring element 4 are formed in the first region 5 which is a heat equalizing region having higher heat uniformity than the other regions in the multilayer printed circuit board 3 in the plane of the multilayer printed circuit board 3.
  • the temperature measuring apparatus 100 has a thermal conductivity between the temperature measuring element 4 and the heat generating component 19 in the plane of the multilayer printed circuit board 3 than in a region adjacent to the heat generating component 19 in the plane of the multilayer printed circuit board 3. Provide a low thermal insulation area.
  • the thermocouple 1 is composed of two conductor wires 1a and 1b made of different metals. One end of the conductor wire 1a and one end of the conductor wire 1b are connected to form a temperature measuring contact 1c for the measurement object.
  • the thermocouple 1 has various types such as a J-type thermocouple in which iron and constantan are used as dissimilar metals and a K-type thermocouple in which chromel and alumel are used as dissimilar metals depending on the use temperature range and the use limit temperature. A thermocouple of a combination of different kinds of metals has been proposed. In the temperature measuring apparatus 100 according to the first embodiment, the type of the thermocouple 1 is not particularly defined.
  • the terminal block 2 is made of resin and has a box shape.
  • the terminal block 2 includes a terminal 9 which is a connection portion with the thermocouple 1 and two screws (not shown) screwed into the terminal 9 on the side surface 2a.
  • the terminal 9 is composed of two terminals of a terminal 9 a and a terminal 9 b connected to the multilayer printed board 3 which is made of a conductive sheet metal and is accommodated in the housing 8. The screw is screwed into the terminal 9a and the terminal 9b, and the thermocouple 1 is sandwiched between the terminal 9a and the terminal 9b.
  • the terminal block 2 is accommodated in the housing 8.
  • the terminal block 2 exposes the side surface 2a provided with the terminals 9 to the outside of the housing 8 in order to facilitate attachment of the thermocouple 1 to the terminal block 2 and removal of the thermocouple 1 from the terminal block 2.
  • the terminal block 2 is fixed on one surface of the multilayer printed board 3 at a part inside the housing 8.
  • the temperature measuring element 4 an element having a temperature-dependent characteristic such as a resistance between terminals such as a thermistor or a diode or a voltage is used as a temperature detecting element, and an area near the terminal block 2 on the one surface 3 a of the multilayer printed board 3. Is arranged.
  • the temperature measuring element 4 is arranged as close to the terminal block 2 as possible on the one surface 3 a of the multilayer printed board 3.
  • the multilayer printed circuit board 3 has a processing circuit including the terminal block 2, the temperature measuring element 4, and the heat generating component 19 mounted on one surface 3a.
  • the outer shape of the one surface 3a is a square shape.
  • a first measurement circuit 10 that measures the thermoelectromotive force of the thermocouple 1
  • a second measurement circuit 11 that measures the temperature of the temperature measuring element 4, and a measurement by the first measurement circuit 10
  • a control unit 12 that calculates the temperature of the measurement object based on the result and the measurement result of the second measurement circuit 11 is mounted.
  • a power supply circuit 13 for supplying power supplied from an external power source or an internal power source (not shown) to each electronic component on the multilayer printed circuit board 3 is mounted on the one surface 3 a of the multilayer printed circuit board 3.
  • the multilayer printed circuit board 3 includes a first region 5 in which the terminal block 2 and the temperature measuring element 4 are arranged, a first measurement circuit 10, a second measurement circuit 11, a control unit 12, and a power source in the plane of the multilayer printed circuit board 3. And a second region 6 in which a plurality of circuits such as the circuit 13 are arranged.
  • the first region 5 and the second region 6 are partitioned by a third region 7 located between the first region 5 and the second region 6. In other words, the first region 5 is located on the opposite side of the second region 6 across the third region 7 in the plane of the multilayer printed board 3.
  • the first region 5 in which the terminal block 2 and the temperature measuring element 4 are arranged is a metal constituting the wiring pattern of the multilayer printed circuit board 3 in order to reduce the thermal resistance between the terminal block 2 and the temperature measuring element 4.
  • the wiring density of the layers is higher than that of other regions in the multilayer printed circuit board 3.
  • the metal layer constituting the wiring pattern of the multilayer printed circuit board 3 is formed of a metal material such as copper or aluminum having a relatively high thermal conductivity among metal materials.
  • a metal foil pattern constituting a large area wiring such as a power supply line and a ground wiring formed in the inner layer of the multilayer printed circuit board 3, that is, a solid pattern in the first region 5
  • the thermal conductivity of the first region 5 is increased.
  • the average of the thermal conductivity in the entire first region 5 is higher in the first region 5 than in the other regions in the multilayer printed circuit board 3, and the temperature is uniformed in the entire first region 5.
  • it is set as the soaking
  • the average of the thermal conductivity in the entire first region 5 is higher than the average of the thermal conductivity in each of the other regions in the multilayer printed circuit board 3, and the average of the thermal conductivity in the entire second region 6 and the entire third region 7. Higher than average thermal conductivity.
  • high thermal uniformity means that the average thermal conductivity of a plurality of regions partitioned in the plane of the surface 3a is compared with the other when the average thermal conductivity of the entire region is compared with the other. Means higher than the area. That is, “thermal uniformity” can be evaluated by the average size of the thermal conductivity of one entire region.
  • the first region 5 has a higher thermal conductivity per unit length in the plane of the multilayer printed circuit board 3 than the second region 6 and the entire multilayer printed circuit board 3 by increasing the thermal conductivity of the entire first region 5. Has been made smaller.
  • the terminal When the thermal resistance of the first region 5 where the terminal block 2 and the temperature measuring element 4 are arranged in the multilayer printed circuit board 3 is large, the terminal is caused by the thermal resistance between the terminal block 2 and the temperature measuring element 4. The temperature difference between the base 2 and the temperature measuring element 4 becomes large. This temperature difference causes a temperature measurement error in the temperature measurement device 100.
  • the temperature of the terminal block 2 and the thermal conductivity of the entire first region 5 on which the temperature measuring element 4 is mounted are increased so that the entire first region 5 is soaked.
  • the temperature difference between the temperature of the terminal block 2 and the temperature of the temperature measuring element 4 caused by the thermal resistance between the terminal block 2 and the temperature measuring element 4 can be reduced.
  • the temperature measurement error due to the thermal resistance between 2 and the temperature measuring element 4 can be reduced.
  • the substantial reference junction of the thermocouple 1 in the temperature measuring device 100 is a terminal 9 that is a connection point between the thermocouple 1 and the terminal block 2.
  • the terminal 9, which is a substantial reference contact is disposed inside the terminal block 2, and is connected to the multilayer printed board by the inter-terminal board wiring 15 that enables electrical connection and thermal connection between the terminal 9 and the multilayer printed board 3.
  • 3 is connected to the multilayer printed circuit board 3 at a connecting portion 16 on one surface 3a.
  • the connection portion 16 is a connection portion between the inter-terminal board wiring 15 and the multilayer printed board 3, and can be restated as a connection portion between the terminal block 2 and the multilayer printed board 3.
  • the inter-terminal board wiring 15 is composed of the inter-terminal board wiring 15a and the inter-terminal board wiring 15b. One end of the inter-terminal board wiring 15a is connected to the terminal 9a. The other end side of the inter-terminal-substrate wiring 15a is connected to the multilayer printed board 3 at the connection portion 16a. One end side of the inter-terminal board wiring 15b is connected to the terminal 9b. The other end side of the inter-terminal board wiring 15b is connected to the multilayer printed board 3 at the connection portion 16b.
  • the inter-terminal board wiring 15 is electrically connected to the first measurement circuit connection wiring 17 provided by being connected to the first measurement circuit 10 in the multilayer printed board 3 via the multilayer printed board 3. That is, the other end side of the inter-terminal board wiring 15 a is electrically connected to the first measurement circuit connection wiring 17 a provided by being connected to the first measurement circuit 10 via the multilayer printed board 3. The other end side of the inter-terminal board wiring 15 b is electrically connected to the first measurement circuit connection wiring 17 b provided by being connected to the first measurement circuit 10 via the multilayer printed board 3.
  • the first measurement circuit connection wiring 17 is provided in the inner layer of the multilayer printed circuit board 3 from the first region 5 to the third region 7.
  • the inter-terminal board wiring 15a and the inter-terminal board wiring 15b are made of a metal material having a relatively high thermal conductivity among metal materials. For this reason, a temperature difference hardly arises between the connection part of the terminal 9 and the multilayer printed circuit board 3, and the terminal 9. FIG. Therefore, the connection part 16 between the terminal block 2 and the multilayer printed board 3 is handled as a reference contact of the thermocouple 1.
  • the metal material used for the inter-terminal-substrate wiring 15 is preferably a material such as copper or aluminum from the viewpoint of cost.
  • the multilayer printed board 3 is configured with a resin having a relatively low thermal conductivity, such as epoxy or polyimide, having a relatively low thermal conductivity among the resins used for the multilayer printed board.
  • a heating component 19 that constitutes a circuit such as a first measurement circuit 10, a second measurement circuit 11, a control unit 12, and a power supply circuit 13 mounted on one surface 3 a of the multilayer printed circuit board 3, and a measurement circuit.
  • region 7 which is a heat insulation area
  • the third region 7 is a region having a lower thermal conductivity than the region adjacent to the heat generating component 19 in the plane of the multilayer printed circuit board 3 between the temperature measuring element 4 and the heat generating component 19 in the plane of the multilayer printed circuit board 3. It is.
  • the third region 7 has a relatively higher resin arrangement density such as epoxy or polyimide in the third region 7 than the arrangement density of the metal layer, and is configured based on the resin base material. . That is, the third region 7 is a region where the wiring density of the wirings constituting the wiring pattern of the multilayer printed circuit board 3 is lower than that of the first region 5 and the second region 6. Accordingly, the third region 7 has a resin arrangement density such as epoxy or polyimide higher than that of the first region 5 and the second region 6.
  • the third region 7 is formed by removing, from the target region, a solid pattern that configures a large area wiring (not shown) such as a power supply line and a ground wiring configured in the inner layer of the multilayer printed board 3. Yes.
  • Resin materials such as epoxy and polyimide have a heat conductivity as low as about 0.3 W / (m ⁇ K), and thus have a heat insulating effect, and are widely used as heat insulating materials for buildings. Therefore, since the third region 7 is mainly composed of a base material having a low thermal conductivity, the third region 7 has a lower thermal conductivity than the first region 5 and the second region 6 and has a heat insulating effect. For this reason, the third region 7 is mounted on the second region 6 by suppressing or blocking the heat of the heat generating component 19 mounted on the second region 6 from being transmitted to the temperature measuring element 4 via the multilayer printed circuit board 3. The thermal resistance between the heat generating component 19 and the temperature measuring element 4 is increased.
  • the third region 7 can suppress or prevent the temperature of the temperature measuring element 4 from changing due to the heat of the heat generating component 19 mounted in the second region 6 being transmitted to the temperature measuring element 4. That is, since the heat of the heat generating component 19 mounted in the second region 6 is hardly transmitted to the temperature measuring element 4, a temperature change of the temperature measuring element 4 can be suppressed. And when the 3rd field 7 does not contain the metal layer of a wiring layer and is constituted only by a resin material, the above-mentioned effect becomes the largest.
  • the first measurement circuit 10 is mounted on the second region 6 on the one surface 3a of the multilayer printed board 3 and measures the thermoelectromotive force of the thermocouple 1.
  • the electronic components constituting the first measurement circuit 10 include a heat generating component 19 that generates heat during operation. Between the terminal 9a and the terminal 9b in the terminal 9, the temperature difference between the temperature measuring contact 1c and the terminal 9a of the thermocouple 1 and the temperature difference between the temperature measuring contact 1c and the terminal 9b are dependent. A voltage that is a thermoelectromotive force is generated.
  • the first measurement circuit 10 measures the voltage between the terminal 9a and the terminal 9b via the terminal-to-substrate wiring 15, the connection portion 16, and the first measurement circuit connection wiring 17, and uses the measured voltage to perform thermoelectricity according to a standard method. A temperature difference between the temperature measuring contact 1c and the terminal 9 corresponding to the thermoelectric power of the pair 1 is detected.
  • the second measurement circuit 11 is mounted on the second region 6 on the one surface 3a of the multilayer printed board 3, and constitutes a reference junction temperature compensation circuit together with the temperature measuring element 4.
  • the electronic components constituting the second measurement circuit 11 include a heat generating component 19 that generates heat during operation.
  • the second measurement circuit 11 is electrically connected to the temperature measuring element 4 by a second measurement circuit connection wiring 18 provided on the surface layer of the multilayer printed board 3 from the first region 5 to the third region 7.
  • the second measurement circuit connection wiring 18 includes a second measurement circuit connection wiring 18a and a second measurement circuit connection wiring 18b.
  • One end side of the second measurement circuit connection wiring 18 a is electrically connected to one end of the temperature measuring element 4, and the other end side is electrically connected to the second measurement circuit 11.
  • One end side of the second measurement circuit connection wiring 18 b is electrically connected to the other end of the temperature measuring element 4, and the other end side is electrically connected to the second measurement circuit 11.
  • the second measurement circuit 11 measures the voltage at both ends of the temperature measuring element 4 when a constant current is passed from the power supply circuit to the temperature measuring element 4 via the second measurement circuit connection wiring 18. And the 2nd measurement circuit 11 measures the temperature of the temperature measuring element 4 which is a reference
  • the control unit 12 includes a temperature difference between the temperature measuring contact 1 c corresponding to the thermoelectromotive force of the thermocouple 1 that is the output of the first measurement circuit 10 and the terminal 9, and a temperature measurement that is the output of the second measurement circuit 11.
  • the temperature of the measurement object is calculated from the temperature of the element 4.
  • the electronic components constituting the control unit 12 include a heat generating component 19 that generates heat during operation.
  • the control unit 12 is realized, for example, as a processing circuit having the hardware configuration shown in FIG.
  • FIG. 3 is a diagram illustrating an example of a hardware configuration of the processing circuit according to the first embodiment of the present invention.
  • the control unit 12 executes a program stored in the memory 102 by the processor 101 illustrated in FIG. 3. Realized.
  • a plurality of processors and a plurality of memories may cooperate to realize the above function.
  • a part of the function of the control unit 12 may be mounted as an electronic circuit, and the other part may be realized using the processor 101 and the memory 102.
  • the power supply circuit 13 is mounted on the second area 6 on the one surface 3 a of the multilayer printed circuit board 3, and supplies electric power supplied from an external power source or an internal power supply (not shown) to each electronic component mounted on the second area 6. .
  • the electronic components constituting the power supply circuit 13 include a heat generating component 19 that generates heat during operation.
  • the power supply circuit 14 is mounted on the first region 5 on the one surface 3 a of the multilayer printed circuit board 3, and supplies power supplied from an external power source or an internal power source (not shown) to the temperature measuring element 4 mounted on the first region 5.
  • the electronic components constituting the power supply circuit 13 include a heat generating component 19 that generates heat during operation.
  • the power supply circuit 14 only needs to be able to supply power for temperature measurement of the temperature measuring element 4. For this reason, the heat generation amount of the heat generating component 19 included in the power supply circuit 14 is smaller than the heat generation amount of the heat generating component 19 included in the power supply circuit 13.
  • the power supply circuit 14 is preferably arranged at a position as far as possible from the temperature measuring element 4 in the first region 5.
  • thermocouple 1 When measuring the temperature at the measurement point of the measurement object, first, the thermocouple 1 is connected to the terminal block 2, the measurement start button (not shown) is turned on, and the temperature measuring contact 1c is brought into contact with the measurement point of the measurement object. .
  • the control unit 12 operates the first measurement circuit 10 to acquire the temperature difference between the temperature measuring contact 1 c and the terminal 9 corresponding to the thermoelectromotive force of the thermocouple 1 from the first measurement circuit 10.
  • the control unit 12 operates the second measurement circuit 11 to acquire the temperature of the temperature measuring element 4 that is the reference contact temperature from the second measurement circuit 11.
  • control part 12 calculates the temperature of the measuring point of a measuring object by the temperature difference between the temperature measuring contact 1c and the terminal 9, and the temperature of the temperature measuring element 4. That is, the control unit 12 measures the temperature at the measurement point of the measurement object by compensating the temperature difference between the temperature measuring contact 1 c and the terminal 9 with the temperature of the temperature measuring element 4.
  • the temperature at the measurement point of the measurement object is 100 ° C.
  • the temperature of the terminal 9 is 55 ° C.
  • the temperature of the temperature measuring element 4 is 56 ° C.
  • Compensated at a reference junction temperature of 56 ° C. That is, the control unit 12 calculates “56 ° C. + 45 ° C. 101 ° C.” and measures the temperature at the measurement point of the measurement object.
  • the terminal 9 is made of a metal material having a relatively high thermal conductivity among the metal materials, and the electrical connection between the terminal 9 and the multilayer printed board 3.
  • the multi-layer printed circuit board 3 is connected by inter-terminal board wiring 15 that enables connection and thermal connection. For this reason, the temperature difference between the connection part 16 which is a connection point of the wiring 15 between terminal boards and the multilayer printed circuit board 3, and the terminal 9 hardly arises.
  • connection portion 16 which is a connection point between the terminal board wiring 15 and the multilayer printed board 3, is provided inside the terminal block 2, and the temperature measuring element 4 mounted on the multilayer printed board 3 and the connection portion.
  • No. 16 can not be mounted as close to the limit as possible due to physical restrictions on the mounting of components on the multilayer printed circuit board 3. For this reason, thermal resistance is large between the temperature measuring element 4 and the connection part 16, and a temperature difference arises between both. That is, a temperature difference is generated between the temperature of the temperature measuring element 4 and the temperature of the terminal block 2, and a temperature difference is generated between the temperature measuring device 100 and the terminal 9 that is a substantial reference contact of the thermocouple 1.
  • a solid pattern that configures a large-area wiring such as a power supply line and a ground wiring on the inner layer of the first region 5 in which the terminal block 2 and the temperature measuring element 4 are arranged in the plane of the multilayer printed circuit board 3. are intentionally laid.
  • region 5 in the multilayer printed circuit board 3 is raised, and temperature measurement precision can be improved by making it hard to produce a temperature difference in the surface of the 1st area
  • region 5 is equalized by raising the heat conductivity of the 1st area
  • the temperature difference between the temperature of the terminal block 2 and the temperature of the temperature measuring element 4 caused by the thermal resistance between the terminal block 2 and the temperature measuring element 4 can be reduced.
  • the temperature measurement error due to the thermal resistance between 2 and the temperature measuring element 4 can be reduced, and the effect of improving the temperature measurement accuracy can be obtained.
  • the temperature measuring element 4 for measuring the reference contact temperature when arranged on the same multilayer printed circuit board 3 as the heat generating component 19, the heat conduction path through the multilayer printed circuit board 3 is used as a main path of the heat generating component 19. Heat is transmitted to the temperature measuring element 4, and the temperature of the temperature measuring element 4 changes. As described above, during the operation of the temperature measuring device 100, the temperature difference between the terminal 9 and the temperature measuring element 4 also changes due to the temperature of the temperature measuring element 4 changing due to the influence of the heat generating component 19, and the temperature measurement. A temperature measurement error of the apparatus 100 is generated.
  • the second region 6 in which the heat generating components 19 of many circuits such as the first measuring circuit 10, the second measuring circuit 11, the control unit 12, and the power supply circuit 13 are mounted, and the temperature measuring element 4 are provided.
  • a third region 7 is provided between the first region 5 and the mounted first region 5.
  • the third region 7 is configured on the basis of a resin base material by reducing the wiring density of the metal wiring, and the heat of the heat generating component 19 mounted in the second region 6 is transmitted to the temperature measuring element 4 and the temperature measuring element 4. The temperature can be suppressed from changing, and the effect of improving the temperature measurement accuracy can be obtained.
  • the power supply line and the ground wiring pattern formed in the inner layer of the multilayer printed circuit board 3 are completely separated into the first region 5 and the second region 6 by the third region 7, thereby being mounted in the second region 6.
  • the effect of suppressing and preventing heat transfer from the heat generating component 19 to the temperature measuring element 4 is increased.
  • the terminal block 2 which is a reference contact of the thermocouple 1, the temperature measuring element 4, the first region 5 which is a soaking region, and the third region 7 which is a heat insulating region are configured on the same substrate.
  • heat equalization between the reference contact and the temperature measuring element 4, heat insulation between the heat generating component 19 mounted on the second region 6 and the temperature measuring element 4, or the heat generating component 19 mounted on the second region 6 is achieved.
  • Suppression of heat transfer to the temperature measuring element 4 can be configured by the density of the wiring pattern in the same multilayer printed circuit board 3 on which the component group is mounted. This eliminates the need for special members and processing other than the multilayer printed circuit board 3, and improves the temperature measurement accuracy of the temperature measurement device 100 and provides the effect of downsizing.
  • the temperature measuring device 100 in order to reduce the thermal resistance between the reference junction and the temperature measuring element 4, another component having good thermal conductivity is inserted between them, or the temperature measuring element 4 is heated. In order to insulate from the component 19, there is no need for special components and processing such as providing a heat insulating portion such as a notch or opening in the substrate between the two components or physically separating the reference contact and the temperature measuring element 4. . That is, in the temperature measuring device 100, the above-described effects can be obtained only by changing the density of the wiring pattern on the multilayer printed board 3, the structure is simple, and the size can be reduced.
  • thermocouples 1 only one pair of thermocouples 1 is connected to the temperature measuring device 100.
  • the same effect as described above can be obtained when a plurality of pairs of thermocouples 1 are connected to the temperature measuring device 100. Is obtained.
  • thermocouples 1 In order to further improve the temperature measurement accuracy when a plurality of pairs of thermocouples 1 are connected to the temperature measuring device 100, a configuration in which the temperature measuring elements 4 are arranged for each of the plurality of pairs of thermocouples 1 is also effective. is there.
  • the cold junction compensation type temperature measuring apparatus that performs temperature measurement using a thermocouple does not require special parts and processing, and is inexpensive.
  • a highly accurate and small temperature measuring device can be provided.
  • FIG. FIG. 4 is an internal perspective view of the temperature measuring device 200 according to the second embodiment of the present invention as seen from the left side, and shows a state seen through the left side.
  • the heat insulating region is provided between the first region 5 in which the temperature measuring element 4 is mounted and the second region 6 in which the heat generating component 19 is mounted.
  • a third region 7 is formed.
  • the third region 7 of the temperature measuring device 100 is configured by removing the solid pattern constituting the large area wiring such as the power supply line and the ground wiring formed in the inner layer of the multilayer printed board 3 from the target region of the third region 7. Is formed.
  • the first region 5 and the second region 6 are completely divided by the third region 7 to measure the heat of the heat generating component 19 mounted in the second region 6. The effect of suppressing transmission to the temperature element 4 is increased.
  • the arrangement of the third region 7 is made a heat insulating structure only in the main heat path between the heat generating component 19 and the temperature measuring element 4 as shown in FIG.
  • the main heat path between the heat generating component 19 and the temperature measuring element 4 is a region between the heat generating component 19 and the temperature measuring element 4 facing each other in the plane of the multilayer printed circuit board 3. Therefore, in the plane of the multilayer printed circuit board 3 as shown in FIG. 4, the outer peripheral edge region of the multilayer printed circuit board 3 excluding the region between the opposing heat generating component 19 and the temperature measuring element 4 is used.
  • the first region 5 and the second region 6 connect the power supply line and ground wiring patterns. Thereby, it is possible to prevent the malfunction of the circuit described above.
  • FIG. FIG. 5 is an internal perspective view of the temperature measuring device 300 according to the third embodiment of the present invention as seen from the left side, and shows a state seen through the left side.
  • the temperature measuring element 4 mounted in the first region 5 and various circuits mounted in the second region 6. are mounted on the same surface of the multilayer printed circuit board 3, that is, on one surface 3a.
  • the installation direction during use is not particularly specified.
  • the temperature measuring element 4 mounted in the first region 5 and the heat generating component 19 constituting various circuits mounted in the second region 6 are mounted on the same surface, so that the heat generating component 19 Heat is transmitted to the temperature measuring element 4 not only by heat conduction through the multilayer printed circuit board 3 but also by convection due to movement of air around the heat generating part 19 heated by the heat of the heat generating part 19. Temperature changes.
  • the temperature measuring element 4 mounted in the first region 5 and the heat generating component constituting the various circuits mounted in the second region 6. 19 are mounted on different surfaces of the multilayer printed circuit board 3. That is, the temperature measuring element 4 mounted in the first region 5 is mounted on the one surface 3 a of the multilayer printed board 3.
  • the heat generating components 19 constituting the various circuits mounted in the second region 6 are mounted on the other surface of the multilayer printed circuit board 3 that faces in the opposite direction to the one surface 3a.
  • the temperature measuring apparatus 300 concerning this Embodiment 3, it suppresses that the heat
  • the influence of 19 on the temperature measuring element 4 can be reduced, and the temperature measuring accuracy can be improved.
  • the configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.
  • thermocouple 1a, 1b conductor wire, 1c temperature measuring contact, 2 terminal block, 2a side surface, 3 multilayer printed board, 3a one surface, 4 temperature measuring element, 5 first region, 6 second region, 7 third region, 8 housing, 9, 9a, 9b terminal, 10 first measurement circuit, 11 second measurement circuit, 12 control unit, 13, 14 power supply circuit, 15, 15a, 15b terminal board wiring, 16, 16a, 16b connection unit , 17, 17a, 17b, first measurement circuit connection wiring, 18, 18a, 18b, second measurement circuit connection wiring, 19 heat generating parts, 100, 200, 300 temperature measurement device, 101 processor, 102 memory.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

L'invention concerne un dispositif de mesure de température de type à compensation de jonction froide (100) mesurant des températures à l'aide d'un thermocouple (1) et comprenant : une carte de circuit imprimé multicouche (3) ; un bloc de borne (2) qui est monté sur une surface (3a) de la carte de circuit imprimé multicouche (3), est connecté au thermocouple (1) et sert de jonction de référence du thermocouple (1) ; et un élément de mesure de température (4) qui est monté sur la première surface (3a) de la carte de circuit imprimé multicouche (3) et est destiné à détecter la température de la jonction de référence du thermocouple (1). Le bloc de borne (2) et l'élément de mesure de température (4) sont formés sur une zone d'uniformité de chaleur à l'intérieur de la surface de la carte de circuit imprimé multicouche (3) présentant une plus grande uniformité de chaleur que d'autres zones de la carte de circuit imprimé multicouche (3).
PCT/JP2017/013785 2017-03-31 2017-03-31 Dispositif de mesure de température WO2018179408A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201780079947.8A CN110121635B (zh) 2017-03-31 2017-03-31 温度测定装置
JP2018513043A JP6351914B1 (ja) 2017-03-31 2017-03-31 温度測定装置
PCT/JP2017/013785 WO2018179408A1 (fr) 2017-03-31 2017-03-31 Dispositif de mesure de température

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/013785 WO2018179408A1 (fr) 2017-03-31 2017-03-31 Dispositif de mesure de température

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WO2018179408A1 true WO2018179408A1 (fr) 2018-10-04

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Publication number Priority date Publication date Assignee Title
CN112577621B (zh) * 2020-12-28 2024-08-20 中国航天空气动力技术研究院 同轴热电偶冷端温度测量装置及系统
CN113267265B (zh) * 2021-05-21 2024-08-09 中国联合重型燃气轮机技术有限公司 燃气轮机的燃气温度测量系统、燃气轮机和温度测量方法

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JPH0961256A (ja) * 1995-08-28 1997-03-07 Matsushita Electric Works Ltd 温度計測器の温度補償回路
JP2002286556A (ja) * 2001-03-27 2002-10-03 Yamatake Corp 測温装置
JP2011191139A (ja) * 2010-03-12 2011-09-29 Omron Corp 温度制御装置
JP2012186421A (ja) * 2011-03-08 2012-09-27 Denso Corp 電子制御装置
JP2013197404A (ja) * 2012-03-21 2013-09-30 Hitachi Automotive Systems Ltd 電子制御装置

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JPH09113374A (ja) * 1995-10-14 1997-05-02 Horiba Ltd 熱電対用端子台
JP2011033479A (ja) * 2009-07-31 2011-02-17 Mitsubishi Materials Corp 温度センサ
SG182864A1 (en) * 2011-01-12 2012-08-30 Rockwell Automation Asia Pacific Business Ctr Pte Ltd Enhancing thermocouple temperature measurement accuracy with local rtds to compensate terminal temperature difference
US9279731B2 (en) * 2013-03-12 2016-03-08 Lam Research Corporation Multichannel thermocouple compensation for three dimensional temperature gradient

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JPH0961256A (ja) * 1995-08-28 1997-03-07 Matsushita Electric Works Ltd 温度計測器の温度補償回路
JP2002286556A (ja) * 2001-03-27 2002-10-03 Yamatake Corp 測温装置
JP2011191139A (ja) * 2010-03-12 2011-09-29 Omron Corp 温度制御装置
JP2012186421A (ja) * 2011-03-08 2012-09-27 Denso Corp 電子制御装置
JP2013197404A (ja) * 2012-03-21 2013-09-30 Hitachi Automotive Systems Ltd 電子制御装置

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JP6351914B1 (ja) 2018-07-04
CN110121635A (zh) 2019-08-13
JPWO2018179408A1 (ja) 2019-04-04
CN110121635B (zh) 2020-09-08

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