WO2018153120A1 - 显示面板的检测方法及检测装置 - Google Patents

显示面板的检测方法及检测装置 Download PDF

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Publication number
WO2018153120A1
WO2018153120A1 PCT/CN2017/107211 CN2017107211W WO2018153120A1 WO 2018153120 A1 WO2018153120 A1 WO 2018153120A1 CN 2017107211 W CN2017107211 W CN 2017107211W WO 2018153120 A1 WO2018153120 A1 WO 2018153120A1
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WIPO (PCT)
Prior art keywords
sampling
control module
display panel
pipeline control
substrate
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PCT/CN2017/107211
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English (en)
French (fr)
Inventor
潘柏松
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惠科股份有限公司
重庆惠科金渝光电科技有限公司
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Application filed by 惠科股份有限公司, 重庆惠科金渝光电科技有限公司 filed Critical 惠科股份有限公司
Priority to US16/341,789 priority Critical patent/US11294361B2/en
Publication of WO2018153120A1 publication Critical patent/WO2018153120A1/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31359—Object oriented model for fault, quality control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32225—Randomize workpiece treatment order within lot to improve lot-to-lot comparisons
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32368—Quality control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present application relates to the field of control technologies, and in particular, to a display panel detection method and a detection device.
  • the substrate is an important component of a display panel such as a liquid crystal, an organic light emitting diode (OLED), or a quantum dot light emitting diode (QLED), and its quality is critical to the display effect of the display panel.
  • the substrate needs to be strictly quality controlled at all stages in the coating process. According to the products on the assembly line, the corresponding sampling rate detection needs to be set. However, most of the existing detection methods are sampling inspection of finished products at the end of the production line, and it is impossible to accurately perform sampling inspection on semi-finished products in each step of the process, which affects product quality and detection efficiency.
  • the present application provides a method for detecting a display panel executed by a computer device, which can perform accurate sampling on each link of a production process through centralized setting of a manufacturing execution module, thereby improving a yield rate and a detection efficiency of the substrate.
  • a method for detecting a display panel according to the present application includes the following steps:
  • the pipeline control module receives and stores the sampling parameters
  • the pipeline control module generates a sampling control signal to be sent to the machine according to the sampling parameter
  • the machine performs a sampling operation on the substrate according to the sampling control signal.
  • the method further includes the following steps:
  • the pipeline control module acquires product information of the substrate detected by the machine.
  • the pipeline control module generates, according to the sampling parameter, a step of sending a sampling control signal to the machine, specifically:
  • the pipeline control module compares the product information with the stored sampling parameters to generate a sampling control signal corresponding to the substrate.
  • the manufacturing execution module remotely transmits the sampling parameter to the pipeline control module by wireless transmission.
  • the pipeline control module sends a sampling control signal to the machine through a control module.
  • control module is a programmable logic controller.
  • the display panel is a liquid crystal display panel, an organic light emitting diode display panel, a quantum dot light emitting diode display panel, or a curved display panel.
  • the present application also provides a quality detecting device for a display panel, wherein the quality detecting device comprises:
  • a manufacturing execution module configured to set a substrate sampling parameter of each link in the process, and transmit the sampling parameter to the pipeline control module;
  • the pipeline control module is configured to receive and store the sampling parameter, and generate a sampling control signal to send to the machine;
  • the machine is configured to perform a sampling operation on the substrate according to the sampling control signal.
  • the pipeline control module further includes:
  • the information acquisition module is configured to send the product information of the substrate to the pipeline control module after the machine detects that the substrate is loaded.
  • the pipeline control module further includes:
  • the parsing comparison module is configured to compare the product information to the stored sampling parameters to generate a sampling control signal corresponding to the substrate.
  • the manufacturing execution module further includes:
  • a wireless transmission module configured to remotely transmit the sampling parameter to the pipeline control module.
  • the pipeline control module further includes:
  • a control module configured to send a sampling control signal to the machine.
  • control module is a programmable logic controller.
  • the display panel is a liquid crystal display panel, an organic light emitting diode display panel, a quantum dot light emitting diode display panel, or a curved display panel.
  • the present application further provides a detecting device for performing sampling inspection on a substrate of a display panel, wherein the quality detecting device comprises:
  • a manufacturing execution module configured to set a substrate sampling rate of each link in the process, and transmit the sampling rate to the pipeline control module;
  • the pipeline control module is configured to receive and store the sampling rate, and generate a sampling control signal to send to the machine;
  • the machine is configured to perform a sampling operation on the substrate according to the sampling control signal.
  • the pipeline control module further includes:
  • an information acquiring module configured to acquire, by the pipeline control module, product information of the substrate detected by the machine.
  • the pipeline control module further includes:
  • the parsing comparison module is configured to compare the product information to the stored sampling rate to generate a sampling control signal corresponding to the substrate.
  • the manufacturing execution module further includes:
  • a wireless transmission module configured to remotely transmit the sampling rate to the pipeline control module.
  • the pipeline control module further includes:
  • a control module configured to send a sampling control signal to the machine.
  • control module is a programmable logic controller.
  • the display panel is a liquid crystal display panel, an organic light emitting diode display panel, a quantum dot light emitting diode display panel, or a curved display panel.
  • a method for detecting a display panel includes the steps of: setting a substrate sampling parameter of each link in a process on a manufacturing execution module, and transmitting the sampling parameter to a pipeline control module; the pipeline control module receiving And storing the sampling parameter; the pipeline control module generates a sampling control signal according to the sampling parameter, and sends the sampling control signal to the machine, so that the machine performs the sampling operation according to the sampling control signal.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for detecting a display panel of the present application
  • FIG. 2 is a schematic flow chart of another embodiment of a method for detecting a display panel of the present application
  • FIG. 3 is a schematic flow chart of still another embodiment of a method for detecting a display panel of the present application
  • FIG. 4 is a schematic diagram of functional modules of a quality detecting device for a display panel of the present application.
  • first”, “second”, and the like in this application are used for descriptive purposes only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, such as two, three, etc., unless specifically defined otherwise.
  • fixed may be a fixed connection, or may be a detachable connection, or may be integrated; It may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship of two elements unless explicitly defined otherwise.
  • fix may be a fixed connection, or may be a detachable connection, or may be integrated; It may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship of two elements unless explicitly defined otherwise.
  • specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the present application provides a method for detecting a display panel.
  • the method may be specifically an online detection method for a display panel, including the following steps:
  • the display panel can be, for example, a liquid crystal display (Liquid Crystal Display, LCD) display panel, Organic Light-Emitting Diode (OLED) display panel, quantum dot light-emitting diode (Quantum Dot) Light Emitting Diodes, QLED) display panels, curved display panels or other display panels, etc., are not specifically limited herein.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • QLED quantum dot light-emitting diode
  • curved display panels or other display panels, etc. are not specifically limited herein.
  • step S10 the substrate sampling parameters of each step in the process are set on the manufacturing execution module, and the sampling parameters are transmitted to the pipeline control module.
  • the sampling parameters are determined according to the manufacturing process of the substrate, and mainly include the sampling rate.
  • the steps of cleaning, film formation, yellow plate making, etching, stripping, etc. are generally performed.
  • the washed substrate is first sent to the sputtering machine and a layer of ITO is plated.
  • the indium tin oxide semiconductor transparent conductive film is further patterned with yellow light and etching, and then the substrate is washed by photoresist stripping to complete the fabrication process.
  • the quality of the film layer of the substrate on the assembly line needs to be sampled to ensure the yield of subsequent or even finished products.
  • the user can pre-set the sampling parameters (sampling rate) of the substrate in the manipulation interface of the manufacturing execution module to facilitate unified management and centralized control.
  • the pipeline control module receives and stores the sampling parameter. In this step, the pipeline control can store the set sampling parameters to facilitate subsequent control of the machine.
  • the pipeline control module generates a sampling control signal to be sent to the machine according to the sampling parameter.
  • the machine performs a sampling operation on the substrate according to the sampling control signal.
  • the pipeline control module generates corresponding control signals in different process steps according to the set sampling parameters, so as to drive the machine to perform sampling inspection on the selected substrate, and after receiving the sampling control signal, the machine performs a sampling operation.
  • the machine receives the control signal, and performs sampling inspection on the substrate according to the corresponding sampling rate corresponding to different processes.
  • the centralized setting of the manufacturing execution module is performed to accurately perform sampling inspection on each link of the production process, thereby improving the yield rate and the detection efficiency of the substrate.
  • the method further includes:
  • the pipeline control module acquires product information of the substrate detected by the machine.
  • the pipeline control module of S21 acquires product information of the substrate detected by the machine.
  • the machine can monitor the product information of the substrate in real time, that is, what process has passed the substrate, and what kind of process needs to be entered in the next step, and the product information is sent to the pipeline control module.
  • step S30 specifically includes:
  • the pipeline control module compares the product information with the stored sampling parameters to generate a sampling control signal corresponding to the substrate.
  • step S30 the pipeline control module compares the product information with the stored sampling parameters to generate a sampling control signal corresponding to the substrate.
  • the product information of the substrate is sent to the pipeline control module, and the pipeline control module compares with the pre-stored sampling parameters, and selects the corresponding sampling parameters to generate a control signal to drive the machine to execute. Sampling operation.
  • the manufacturing execution module remotely transmits the sampling parameter to the pipeline control module by wireless transmission.
  • the manufacturing execution module remotely transmits the sampling parameter to the pipeline control module by using a wireless transmission manner. Since the array process of the substrate needs to be performed in an ultra-clean factory, the cleanliness of the environment is extremely The high requirement, therefore, imposes a great limitation on the action of the operator.
  • the operator can set the sampling parameter in the manufacturing execution module and send it to the pipeline control module through wireless transmission mode without entering the super stage of the production line. In the net factory, the work efficiency has been greatly improved.
  • the pipeline control module sends a sampling control signal to the machine through a control module.
  • the pipeline control module sends a sampling control signal to the machine through a control module.
  • This embodiment can adopt a programmable logic controller (Programmable) widely used in the industry.
  • the Logic Controller (referred to as "PLC Controller”) implements the pipeline control module to control the machine, which is cost-effective and reliable.
  • the present application also provides a quality detecting device for a display panel.
  • the device includes:
  • Manufacturing execution module 10 for setting the substrate sampling parameters of each step in the process, and transmitting the sampling parameters to the pipeline control module 20;
  • the pipeline control module 20 is configured to receive and store the sampling parameters, and generate a sampling control signal to be sent to the machine 30;
  • the machine 30 is configured to perform a sampling operation on the substrate according to the sampling control signal.
  • the substrate sampling parameters of each step in the setting process on the execution module 10 are manufactured, and the sampling parameters are transmitted to the pipeline control module 20.
  • the sampling parameters are determined according to the manufacturing process of the substrate, and mainly include the sampling rate.
  • the steps of cleaning, film formation, yellow plate making, etching, stripping, etc. are generally performed.
  • the film quality of the substrate on the assembly line needs to be sampled to ensure subsequent or even finished products.
  • the yield rate the user can pre-set the sampling parameters (sampling rate) of the substrate in the manipulation interface of the manufacturing execution module 10 to facilitate unified management and centralized control.
  • the pipeline control is used to store the set sampling parameters, and can generate a sampling control signal to be sent to the machine 30 according to the sampling parameters, and the pipeline control module 20 produces corresponding corresponding processes in different process steps according to the set sampling parameters.
  • the control signal is used to drive the machine 30 to perform sampling inspection on the selected substrate.
  • the machine 30 After receiving the sampling control signal, the machine 30 performs a sampling operation, and the machine 30 receives the control signal, and performs a sampling operation on the substrate according to a corresponding sampling rate according to different processes.
  • the centralized setting of the manufacturing execution module 10 is performed to accurately perform sampling inspection on each link of the production process, thereby improving the yield of the substrate and the detection efficiency.
  • the pipeline control module 20 further includes:
  • the information acquisition module 23 is configured to acquire the product information of the substrate detected by the machine 30 by the pipeline control module 20.
  • the pipeline control module 20 further includes an information acquisition module 23, configured to send the product information of the substrate to the pipeline control module 20 after the device 30 detects that the substrate is loaded.
  • the machine 30 can monitor the product information of the substrate in real time, that is, what process has passed the substrate, and what kind of process needs to be entered next, and the product information is sent to the pipeline control module 20.
  • the pipeline control module 20 further includes:
  • the parsing comparison module 21 is configured to compare the product information with the stored sampling parameters to generate a sampling control signal corresponding to the substrate.
  • the pipeline control module 20 further includes a parsing and comparing module 21, configured to compare the product information to the stored sampling parameters, generate a sampling control signal corresponding to the substrate, and crash After detecting the loading of the substrate, the station 30 sends the product information of the substrate to the pipeline control module 20, and the pipeline control module 20 compares with the pre-stored sampling parameters, and selects corresponding sampling parameters to generate a control signal to drive the machine. 30 performs a sampling operation.
  • the manufacturing execution module 10 further includes:
  • the wireless transmission module 11 is configured to remotely transmit the sampling parameter to the pipeline control module 20.
  • the manufacturing execution module 10 further includes a wireless transmission module 11 for remotely transmitting the sampling parameters to the pipeline control module 20, because the array process of the substrate needs to be performed in an ultra-clean factory. There is a very high requirement for the cleanliness of the environment, so the action of the operator is greatly restricted.
  • the operator can set the sampling parameter in the manufacturing execution module 10 and send it to the pipeline control module through wireless transmission. 20, without entering the ultra-clean plant where the production line is located, greatly improving work efficiency.
  • the pipeline control module 20 further includes:
  • the control module 22 is configured to send a sampling control signal to the machine 30.
  • the pipeline control module 20 further includes a control module 22 for transmitting a sampling control signal to the machine 30.
  • the embodiment implements the pipeline control module 20 by using a PLC controller widely used in the industry.
  • the control of the machine table 30 is economical and reliable.
  • the present application also provides a display panel online quality detecting apparatus, including a processor and a nonvolatile memory, the nonvolatile memory storing executable instructions, the processor executing executable instructions to implement each of the above The method described in the examples.
  • a display panel online quality detecting apparatus including a processor and a nonvolatile memory, the nonvolatile memory storing executable instructions, the processor executing executable instructions to implement each of the above The method described in the examples.
  • the modules/units 10, 20, 23, 21 shown in Figure 4 of the present application may be software modules or software units.
  • various software modules or software units may be inherently stored in a non-volatile memory and executed by a processor.
  • the above embodiment method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be through hardware, but in many cases, the former is a better implementation.
  • the technical solution of the present invention which is essential or contributes to the prior art, may be embodied in the form of a software product stored in a storage medium (such as ROM/RAM, disk,
  • the optical disc includes a number of instructions for causing a terminal (which may be a cell phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the methods described in various embodiments of the present invention.

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Abstract

一种显示面板的检测方法及检测装置。其中显示面板的检测方法，包括如下步骤：在制造执行模块(10)上设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块(20)；所述流水线控制模块(20)接收并存储抽检参数；流水线控制模块(20)根据抽检参数，生成抽检控制信号发送给机台(30)；控制机台(30)根据抽检控制信号对基板执行抽检操作。

Description

显示面板的检测方法及检测装置
技术领域
本申请涉及控制技术领域，特别涉及一种显示面板的检测方法及检测装置。
背景技术
基板作为液晶、有机发光二极管（OLED），量子点发光二极管（QLED）等显示面板的重要部件，其品质对于显示面板的显示效果至关重要。基板在镀膜工序中的各个阶段都需要进行严格的质量控制，根据流水线上的产品不同，需要设置相应的抽检率检测。然而，现有的检测方法大多是对产线末端的完成品抽检，无法对工序中每一个环节的半成品进行精确的抽样检测，影响了产品质量和检测效率。
申请内容
本申请提供一种计算机设备执行的显示面板的检测方法，其可通过制造执行模块的集中设定，对生产工序的各个环节进行精确抽检，提高基板的良品率和检测效率。
为实现上述目的，本申请提出的一种显示面板的检测方法，包括如下步骤：
在制造执行模块上设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块；
所述流水线控制模块接收并存储所述抽检参数；
所述流水线控制模块根据所述抽检参数，生成抽检控制信号发送给机台；
所述机台根据所述抽检控制信号对所述基板执行抽检操作。
可选地，所述流水线控制模块接收并存储所述抽检参数之后，还包括如下步骤：
所述流水线控制模块获取所述机台检测的基板的产品信息。
可选地，所述流水线控制模块根据所述抽检参数，生成抽检控制信号发送给机台的步骤，具体包括：
所述流水线控制模块将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号。
可选地，所述制造执行模块通过无线传输方式向所述流水线控制模块远程传输所述抽检参数。
可选地，所述流水线控制模块通过一控制模块向所述机台发送抽检控制信号。
可选地，所述控制模块为可编程逻辑控制器。
可选地，所述显示面板为液晶显示面板、有机发光二极管显示面板、量子点发光二极管显示面板或曲面显示面板。
本申请还提出一种显示面板的质量检测装置其中，所述质量检测装置包括：
制造执行模块，用于设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块；
所述流水线控制模块，用于接收并存储所述抽检参数，生成抽检控制信号发送给机台；
所述机台，用于根据所述抽检控制信号对所述基板执行抽检操作。
可选地，所述流水线控制模块还包括：
信息获取模块，用于机台检测到基板载入后，获取该基板的产品信息发送给所述流水线控制模块。
可选地，所述流水线控制模块还包括：
解析比较模块，用于将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号。
可选地，所述制造执行模块还包括：
无线传输模块，用于向所述流水线控制模块远程传输所述抽检参数。
可选地，所述流水线控制模块还包括：
控制模块，用于向所述机台发送抽检控制信号。
可选地，所述控制模块为可编程逻辑控制器。
可选地，所述显示面板为液晶显示面板、有机发光二极管显示面板、量子点发光二极管显示面板或曲面显示面板。
本申请还提出一种检测装置，用于对显示面板的基板进行抽检，其中，所述质量检测装置包括：
制造执行模块，用于设定工序中每个环节的基板抽检率，并将该抽检率传输到流水线控制模块；
所述流水线控制模块，用于接收并存储所述抽检率，生成抽检控制信号发送给机台；
所述机台，用于根据所述抽检控制信号对所述基板执行抽检操作。
可选地，所述流水线控制模块还包括：
信息获取模块，用于所述流水线控制模块获取所述机台检测的基板的产品信息。
可选地，所述流水线控制模块还包括：
解析比较模块，用于将所述产品信息比对已存储的所述抽检率，生成与该基板对应的抽检控制信号。
可选地，所述制造执行模块还包括：
无线传输模块，用于向所述流水线控制模块远程传输所述抽检率。
可选地，所述流水线控制模块还包括：
控制模块，用于向所述机台发送抽检控制信号。
可选地，所述控制模块为可编程逻辑控制器。
可选地，所述显示面板为液晶显示面板、有机发光二极管显示面板、量子点发光二极管显示面板或曲面显示面板。
本申请技术方案中，显示面板的检测方法，包括如下步骤：在制造执行模块上设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块；所述流水线控制模块接收并存储所述抽检参数；所述流水线控制模块根据所述抽检参数，生成抽检控制信号发送给机台，以便于所述机台根据所述抽检控制信号执行抽检操作。通过制造执行模块的集中设定，对生产工序的各个环节进行精确抽检，提高基板的良品率和检测效率。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请显示面板的检测方法一实施例的流程示意图；
图2为本申请显示面板的检测方法另一实施例的流程示意图；
图3为本申请显示面板的检测方法又一实施例的流程示意图；
图4为本申请显示面板的质量检测装置的功能模块示意图。
本申请目的的实现、功能特点及优点将结合实施例，参照附图做可选说明。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本申请中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
另外，本申请各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种显示面板的检测方法，请参照图1，在本申请的一实施例中，该方法可以具体为一种显示面板的在线检测方法，包括如下步骤：
S10、在制造执行模块上设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块；
其中，显示面板可例如为液晶(Liquid Crystal Display， LCD)显示面板、有机发光二极管(Organic Light-Emitting Diode，OLED)显示面板、量子点发光二极管（Quantum Dot Light Emitting Diodes，QLED）显示面板、曲面显示面板或其他显示面板等，在此并不作具体限制。
具体来说，步骤S10在制造执行模块上设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块。该抽检参数是根据基板的制成环节而定的，主要包括抽检率。在基板的阵列（array）制程中要大致经过清洗、成膜、黄光制板、蚀刻、剥膜等步骤，在制程中要先将洗净的基板送进溅镀机台镀上一层ITO铟锡氧化物半导体透明导电膜，再用黄光及蚀刻制成区域图样，随后基板经光阻剥离洗净，完成制成工序。在每个步骤中，需要对流水线上基板的膜层质量进行抽检，以保证后续乃至完成品的良品率。本实施例中，用户可以在制造执行模块的操控界面中预先对基板的抽检参数（抽检率）进行设定，便于统一管理，集中控制。
S20、所述流水线控制模块接收并存储所述抽检参数。该步骤中，流水线控制能够将设定好的抽检参数存储起来，便于后续对机台的控制。
S30、所述流水线控制模块根据所述抽检参数，生成抽检控制信号发送给机台；
S32、所述机台根据所述抽检控制信号对所述基板执行抽检操作。
具体地，流水线控制模块根据设定的抽检参数在不同工艺步骤中生产对应的控制信号，以驱动机台对选定的基板进行抽检，所述机台接收到抽检控制信号后，执行抽检操作，机台接收控制信号，对应不同的工序，按相应的抽检率对基板执行抽检工作。
本实施例通过制造执行模块的集中设定，对生产工序的各个环节进行精确抽检，提高基板的良品率和检测效率。
参见图2，基于本申请显示面板的检测方法的一实施例提出本申请移显示面板的检测方法的另一实施例，在本实施例中所述步骤S20之后还包括：
S21、所述流水线控制模块获取所述机台检测的基板的产品信息。
作为一种可选实施例，在步骤S20之后还包括，S21所述流水线控制模块获取所述机台检测的基板的产品信息。机台能实时监控基板的产品信息，即该基板的经过了何种制程，下一步需要进入何种制程，将该产品信息发送给流水线控制模块。
参见图3，基于本申请显示面板的检测方法的一实施例提出本申请移显示面板的检测方法的又一实施例，在本实施例中所述步骤S30具体包括：
S31、所述流水线控制模块将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号。
作为一种可选实施例，在步骤S30中包括：所述流水线控制模块将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号。当机台检测到基板载入后，将该基板的产品信息发送给流水线控制模块，供流水线控制模块与预存的抽检参数进行比对，选择对应的抽检参数后生成控制信号，以驱动机台执行抽检操作。
可选地，所述制造执行模块通过无线传输方式向所述流水线控制模块远程传输所述抽检参数。
作为一种可选实施例，所述制造执行模块通过无线传输方式向所述流水线控制模块远程传输所述抽检参数，由于基板的array制程需要在超净厂房中进行，对环境的洁净度有极高的要求，因此对操作人员的行动造成很大的限制，本实施例中，操作人员可以在制造执行模块中设置抽检参数，通过无线传输方式发送给流水线控制模块，不用进入生产线所处的超净厂房中，大大提高了工作效率。
可选地，所述流水线控制模块通过一控制模块向所述机台发送抽检控制信号。
作为一种可选实施例，所述流水线控制模块通过一控制模块向所述机台发送抽检控制信号。本实施例可以采用工业中广泛采用的可编程逻辑控制器(Programmable Logic Controller，简称“PLC控制器”)实现流水线控制模块对机台控制，成本经济且工作可靠。
本申请还提出一种显示面板的质量检测装置，参照图4，该装置包括：
制造执行模块10，用于设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块20；
所述流水线控制模块20，用于接收并存储所述抽检参数，生成抽检控制信号发送给机台30，；
所述机台30，用于根据所述抽检控制信号对所述基板执行抽检操作。
本实施例中，制造执行模块10上设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块20。该抽检参数是根据基板的制成环节而定的，主要包括抽检率。在基板的array制程中要大致经过清洗、成膜、黄光制板、蚀刻、剥膜等步骤，在每个步骤中，需要对流水线上基板的膜层质量进行抽检，以保证后续乃至完成品的良品率。本实施例中，用户可以在制造执行模块10的操控界面中预先对基板的抽检参数（抽检率）进行设定，便于统一管理，集中控制。
流水线控制用于将设定好的抽检参数存储起来，且能根据所述抽检参数，生成抽检控制信号发送给机台30，流水线控制模块20根据设定的抽检参数在不同工艺步骤中生产对应的控制信号，以驱动机台30对选定的基板进行抽检。
机台30用于接收到抽检控制信号后，执行抽检操作，机台30接收控制信号，对应不同的工序，按相应的抽检率对基板执行抽检工作。
本实施例通过制造执行模块10的集中设定，对生产工序的各个环节进行精确抽检，提高基板的良品率和检测效率。
可选地，所述流水线控制模块20还包括：
信息获取模块23，用于所述流水线控制模块20获取所述机台30检测的基板的产品信息。
作为一种可选实施例，所述流水线控制模块20还包括信息获取模块23，用于获取机台30检测到基板载入后，该基板的产品信息发送给所述流水线控制模块20。机台30能实时监控基板的产品信息，即该基板的经过了何种制程，下一步需要进入何种制程，将该产品信息发送给流水线控制模块20。
可选地，所述流水线控制模块20还包括：
解析比较模块21，用于将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号。
作为一种可选实施例，所述流水线控制模块20还包括解析比较模块21，用于将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号，当机台30检测到基板载入后，将该基板的产品信息发送给流水线控制模块20，供流水线控制模块20与预存的抽检参数进行比对，选择对应的抽检参数后生成控制信号，以驱动机台30执行抽检操作。
可选地，所述制造执行模块10还包括：
无线传输模块11，用于向所述流水线控制模块20远程传输所述抽检参数。
作为一种可选实施例，所述制造执行模块10还包括无线传输模块11，用于向所述流水线控制模块20远程传输所述抽检参数，由于基板的array制程需要在超净厂房中进行，对环境的洁净度有极高的要求，因此对操作人员的行动造成很大的限制，本实施例中，操作人员可以在制造执行模块10中设置抽检参数，通过无线传输方式发送给流水线控制模块20，不用进入生产线所处的超净厂房中，大大提高了工作效率。
可选地，所述流水线控制模块20还包括：
控制模块22，用于向所述机台30发送抽检控制信号。
作为一种可选实施例，所述流水线控制模块20还包括控制模块22，用于向所述机台30发送抽检控制信号，本实施例采用工业中广泛采用的PLC控制器实现流水线控制模块20对机台30控制，成本经济且工作可靠。
本申请还提供一种显示面板在线质量检测装置，包括处理器和非易失性存储器，该非易失性存储器上存储可执行指令，该处理器执行可执行指令用以实现以上所述的各实施例所记载的方法。本领域技术人员应当可选理解，本申请附图4中所显示的模块/单元10、20、23、21可为软件模块或者软件单元。此外，各种软件模块或软件单元可以固有地存储在非易失性存储器中并通过处理器进行执行。
本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质（如ROM/RAM、磁碟、光盘）中，包括若干指令用以使得一台终端（可以是手机，计算机，服务器，空调器，或者网络设备等）执行本发明各个实施例所述的方法。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (20)

  1. 一种显示面板的检测方法，所述检测方法包括如下步骤：
    在制造执行模块上设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块；
    所述流水线控制模块接收并存储所述抽检参数；
    所述流水线控制模块根据所述抽检参数，生成抽检控制信号发送给机台；
    所述机台根据所述抽检控制信号对所述基板执行抽检操作。
  2. 如权利要求1所述的显示面板的检测方法，其中，所述流水线控制模块接收并存储所述抽检参数之后，还包括如下步骤：
    所述流水线控制模块获取所述机台检测的基板的产品信息。
  3. 如权利要求2所述的显示面板的检测方法，其中，所述流水线控制模块根据所述抽检参数，生成抽检控制信号发送给机台的步骤，具体包括：
    所述流水线控制模块将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号。
  4. 如权利要求1所述的显示面板的检测方法，其中，所述制造执行模块通过无线传输方式向所述流水线控制模块远程传输所述抽检参数。
  5. 如权利要求1所述的显示面板的检测方法，其中，所述流水线控制模块通过一控制模块向所述机台发送抽检控制信号。
  6. 如权利要求5所述的显示面板的检测方法，其中，所述控制模块为可编程逻辑控制器。
  7. 如权利要求1所述的显示面板的检测方法，其中，所述显示面板为液晶显示面板、有机发光二极管显示面板、量子点发光二极管显示面板或曲面显示面板。
  8. 一种显示面板的检测装置，包括：
    制造执行模块，用于设定工序中每个环节的基板抽检参数，并将该抽检参数传输到流水线控制模块；
    所述流水线控制模块，用于接收并存储所述抽检参数，生成抽检控制信号发送给机台；
    所述机台，用于根据所述抽检控制信号对所述基板执行抽检操作。
  9. 如权利要求8所述的显示面板的质量检测装置，其中，所述流水线控制模块还包括：
    信息获取模块，用于所述流水线控制模块获取所述机台检测的基板的产品信息。
  10. 如权利要求8所述的显示面板的质量检测装置，其中，所述流水线控制模块还包括：
    解析比较模块，用于将所述产品信息比对已存储的所述抽检参数，生成与该基板对应的抽检控制信号。
  11. 如权利要求8所述的显示面板的质量检测装置，其中，所述制造执行模块还包括：
    无线传输模块，用于向所述流水线控制模块远程传输所述抽检参数。
  12. 如权利要求8所述的显示面板的质量检测装置，其中，所述流水线控制模块还包括：
    控制模块，用于向所述机台发送抽检控制信号。
  13. 如权利要求12所述的显示面板的质量检测装置，其中，所述控制模块为可编程逻辑控制器。
  14. 如权利要求8所述的显示面板的检测方法，其中，所述显示面板为液晶显示面板、有机发光二极管显示面板、量子点发光二极管显示面板或曲面显示面板。
  15. 一种检测装置，用于对显示面板的基板进行抽检，其中，所述检测装置包括：
    制造执行模块，用于设定工序中每个环节的基板抽检率，并将该抽检率传输到流水线控制模块；
    所述流水线控制模块，用于接收并存储所述抽检率，生成抽检控制信号发送给机台；
    所述机台，用于根据所述抽检控制信号对所述基板执行抽检操作。
  16. 如权利要求15所述的检测装置，其中，所述流水线控制模块还包括：
    信息获取模块，用于所述流水线控制模块获取所述机台检测的基板的产品信息。
  17. 如权利要求15所述的检测装置，其中，所述流水线控制模块还包括：
    解析比较模块，用于将所述产品信息比对已存储的所述抽检率，生成与该基板对应的抽检控制信号。
  18. 如权利要求15所述的检测装置，其中，所述制造执行模块还包括：
    无线传输模块，用于向所述流水线控制模块远程传输所述抽检率。
  19. 如权利要求15所述的检测装置，其中，所述流水线控制模块还包括：
    控制模块，用于向所述机台发送抽检控制信号。
  20. 如权利要求19所述的检测装置，其中，所述控制模块为可编程逻辑控制器。
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