WO2018152756A1 - 一种具有绝缘承载板结构的mov组件 - Google Patents

一种具有绝缘承载板结构的mov组件 Download PDF

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Publication number
WO2018152756A1
WO2018152756A1 PCT/CN2017/074661 CN2017074661W WO2018152756A1 WO 2018152756 A1 WO2018152756 A1 WO 2018152756A1 CN 2017074661 W CN2017074661 W CN 2017074661W WO 2018152756 A1 WO2018152756 A1 WO 2018152756A1
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Prior art keywords
mov
electrode
insulating carrier
insulating
carrier plate
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PCT/CN2017/074661
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English (en)
French (fr)
Inventor
陈泽同
曾清隆
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隆科电子(惠阳)有限公司
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Priority claimed from CN201710091467.5A external-priority patent/CN107424692A/zh
Priority claimed from CN201720152409.4U external-priority patent/CN206649959U/zh
Application filed by 隆科电子(惠阳)有限公司 filed Critical 隆科电子(惠阳)有限公司
Publication of WO2018152756A1 publication Critical patent/WO2018152756A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H01C7/108—Metal oxide
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage

Definitions

  • the present invention relates to the field of metal oxide varistor technology, and more particularly to an MOV assembly having an insulating load-bearing structure.
  • the zinc oxide varistor Metal Oxide Varistors
  • the applied environment is subject to lightning strikes, electromagnetic field interference, frequent power switch operation, and power system failure, causing a sudden increase in voltage on the line and exceeding the varistor.
  • the turn-on voltage of the device will enter the conduction region. Due to the nonlinear characteristics of the MOV, its impedance will become low, only a few ohms, causing the overvoltage to form a surge current to protect the connected electronic products or expensive. Electronic components.
  • the existing MOV device after the ceramic chip is made, needs to be soldered to lead the foot, and the high temperature processing process such as epoxy encapsulation and curing is performed, which not only brings inconvenience to the post process of the chip, but also high temperature process. Invisible damage to the chip is also not negligible.
  • the thermal detachment of the current MOV device relies on the copper lead-out pin. Since the copper lead-out foot has a small area and a thin thickness, it has a certain influence on the heat detachment, and the trip reliability needs to be improved.
  • the technical problem to be solved by the present invention is to provide a high temperature-free damage, strong over-voltage withstand capability, good heat dissipation conditions, low cost, easy processing, high insulation strength, and high trip reliability.
  • MOV assembly with insulated carrier plate structure is provided.
  • the technical solution adopted by the present invention is:
  • the invention provides an MOV assembly having an insulating load-bearing structure, comprising at least two electrode sheets and at least one MOV chip, wherein one MOV chip is sandwiched between two adjacent electrode sheets, and one electrode of the two outer electrode sheets An insulating carrier plate is disposed outside the sheet, and the other electrode sheet and the insulating carrier plate are fixed by fasteners, or an insulating carrier plate is disposed outside each of the two outer electrode sheets, and the two insulating carrier plates are fixed by fasteners.
  • the MOV assembly having an insulating carrier plate structure comprises two electrode sheets and one MOV chip, and the equivalent circuit is a one-piece two-electrode structure.
  • the electrode sheets fixed to the insulating carrier plate by the fasteners are shaped to be similar in shape to the insulating carrier plates, and are provided with corresponding through holes or threaded holes.
  • the MOV assembly having an insulating carrier plate structure comprises three electrode sheets and two MOV chips, and the equivalent circuit is a two-piece three-electrode common mode structure.
  • the two insulating carrier plates disposed outside the two outer electrode sheets have the same or different shape and are provided with corresponding through holes or threaded holes.
  • the insulating carrier plate is a flat structure or a recessed structure having a sinking hole on the inner side, the sinking hole is for accommodating the electrode sheet and the MOV chip, and the sinking hole is further There is a lead-out slot and a rectangular lead-out hole for extracting the lead of the electrode.
  • each of the electrode sheets is led out with at least one electrode lead-out leg, and the electrode lead-out leg is axially drawn or radially drawn.
  • the shape of the electrode lead-out leg is set according to requirements, and the insulating carrier board is provided.
  • the periphery is provided with at least one electrode take-out groove corresponding to the electrode lead.
  • the fastener is a metal or non-metallic rivet or screw.
  • the MOV component is installed in a surge protector SPD module cavity, wherein one lead electrode can be connected to the trip spring and the other electrode piece is connected to the terminal to form an SPD module, or the electrode lead pin attachment temperature of the MOV component A fuse element or a low temperature alloy fuse forms a thermally protected varistor TMOV device.
  • the present invention improves the dielectric strength of the MOV component by providing a single-piece insulating carrier plate or a two-piece insulating carrier plate outside the electrode sheet; and coating the insulating layer on the outside of the MOV component, which can be used as a conventional varistor;
  • the invention utilizes the electrode sheet holding the MOV chip as the chip heat sink, improves the pulse flow endurance capability of the MOV chip and the impact tolerance of the small current and multiple frequencies, and also improves the temporary overvoltage tolerance of the MOV.
  • the MOV assembly with the insulating carrier plate structure of the invention has simple processing steps, no welding, no cleaning, no environmental pollution, low cost, and convenient and quick processing;
  • the present invention fixes the MOV chip and the electrode sheet by fasteners, and does not require a high-temperature welding process to avoid Avoid high temperature invisible damage to the chip.
  • FIG. 1-1 is an exploded view of an MOV assembly having an insulating carrier plate structure in Embodiment 1;
  • FIG. 1-2 is an equivalent diagram of an MOV assembly having an insulating carrier plate structure in Embodiment 1;
  • Embodiment 2 is an equivalent diagram of an MOV assembly having an insulating carrier plate structure in Embodiment 2;
  • 3-1 is an exploded view of an MOV assembly having an insulating carrier plate structure in Embodiment 3;
  • 4-1 is an exploded view of an MOV assembly having an insulating carrier plate structure in Embodiment 4;
  • 4-2 is an equivalent diagram of an MOV assembly having an insulating carrier plate structure in Embodiment 4.
  • 5-1 is an exploded view of an MOV assembly having an insulating carrier plate structure in Embodiment 5;
  • Fig. 5-2 is an equivalent view of the MOV assembly having the structure of the insulating carrier plate in the embodiment 5.
  • Figure 6-1 is an exploded view of the MOV assembly having the structure of the insulating carrier plate in Embodiment 6;
  • Fig. 6-2 is an equivalent view of the MOV assembly having the structure of the insulating carrier plate in the embodiment 6.
  • the embodiment provides an MOV component with an insulating carrier structure, and is insulated.
  • the carrier board structure is a single-piece or two-piece insulating carrier board 1.
  • the MOV assembly having an insulating carrier board structure includes at least two electrode sheets and at least one MOV chip. In this embodiment, two electrode sheets 2, 4 are included. And a MOV chip 3, the two electrode sheets are the lower electrode sheet 2 and the upper electrode sheet 4;
  • the MOV chip 3 is sandwiched between the adjacent lower electrode sheets 2 and the upper electrode sheets 4, and the insulating carrier plate 1 is disposed outside the upper electrode sheets 4, and the lower electrode sheets 2 are insulated from the insulation.
  • the carrier plate 1 is fixed by a fastener.
  • the upper electrode sheet 4 and the MOV chip have the same shape and are all circular.
  • the fastener is a metal or non-metallic rivet or screw.
  • the fastener 5 is a metal screw.
  • the shape of the lower electrode sheet 2 fixed by the fastener with the insulating carrier plate 1 is set to be the same as that of the insulating carrier plate 1, and is rectangular, and is provided at four corners.
  • the insulating carrier plate 1 is a recessed structure provided with a sinking hole 1-2 for accommodating the electrode sheet 2 and the MOV chip 3.
  • the lower electrode sheet 2 is axially led out of the electrode lead-out leg 2-1, and the upper electrode sheet 4 is radially led out of the electrode lead-out leg 4-1.
  • the periphery of the insulating carrier plate 1 is provided with the electrode lead-out of the upper electrode tab 4.
  • the electrode corresponding to the foot 4-1 is taken out from the groove 1-3.
  • the lead-out electrode is a rectangular lead-out leg, and the electrode lead-out leg is convenient for guiding or connecting the trip device, and the electrode sheet is made of aluminum or copper or aluminum alloy or copper alloy, and has good thermal conductivity. Made of metal, it has a thickness of 0.3 to 1.5 mm.
  • the MOV chip 3 is set to have different shapes as needed, such as being arranged in a circle, a rectangle or a profile (irregular shape);
  • the equivalent circuit of the MOV assembly of this embodiment is a single-chip two-electrode structure.
  • the electrode lead 4-1 of the upper electrode sheet 4 is the positive electrode L end
  • the electrode lead leg 2-1 of the lower electrode sheet 2 is the negative electrode N end.
  • the L-terminal and N-terminal can be connected to a temperature protection mechanism, such as a thermal detachment mechanism or a thermal fuse.
  • an insulating carrier plate 1 is disposed outside the lower electrode sheet 2.
  • the lower electrode sheet 2 and the MOV chip 3 have the same shape and are all circular.
  • the shape of the upper electrode sheet 4 fixed by the fastener with the insulating carrier plate 1 is set to be the same as that of the insulating carrier plate 1, and is rectangular, and is provided at four corner positions.
  • the four corners of the upper electrode piece 4 are provided with four through holes 4-21,4-204, 4-23, 4-24; The four corner positions are provided with four threaded holes 1-41, 1-42, 1-43, 1-44.
  • the electrode lead-out leg 2-1 drawn in the axial direction of the lower electrode sheet 2 is taken out through the through-hole 1-21 in the set sink hole 1-2 through the insulating carrier plate 1.
  • the insulating carrier plate 1 is a flat plate structure.
  • an insulating carrier plate 1 is provided outside each of the lower electrode sheet 2 and the upper electrode sheet 4, and the two insulating carrier sheets 1 are fixed by fasteners.
  • the two insulating carrier plates 1 are recessed structures provided with the sinking holes 1-2, and the upper and lower two lower holes 1-2 are fastened to accommodate the electrode pads 2, 4 and MOV chip 3.
  • the upper electrode sheet 4, the lower electrode sheet 2, and the MOV chip 3 have the same shape and are all circular.
  • the electrode lead-out leg 2-1 drawn in the axial direction of the lower electrode sheet 2 is taken out through the through-hole 1-21 in the sinker hole 1-2 provided in the insulating carrier plate 1.
  • the MOV assembly having an insulating carrier structure includes three electrode sheets and two MOV chips 3, wherein the three electrode sheets include two upper electrode sheets 4 sandwiching one of the MOV chips. And a lower electrode sheet 2, the middle upper electrode sheet and the lower electrode sheet 2 sandwiching another MOV chip.
  • An insulating carrier plate 1 is disposed outside the upper upper electrode sheet 4, and the lower electrode sheet 2 and the insulating carrier plate 1 are fixed by fasteners.
  • the two upper electrode sheets 4 and the MOV chip 3 have the same shape and are all circular.
  • the lower electrode sheet 2 is axially led out of the electrode lead-out leg 2-1, and both of the upper electrode tabs 4 are radially led out of the electrode lead-out leg, and the periphery of the insulating carrier plate 1 is provided with the electrode lead-out of the upper electrode tab 4. Foot correspondence The electrode leads out of the slot.
  • the equivalent circuit of the MOV component of the embodiment is a two-electrode common-mode structure; the electrode lead-out leg of the middle upper electrode piece is a ground PE end, and the electrode lead-out leg of the upper upper electrode piece is as shown in FIG. 5-2.
  • the electrode lead pins of the lower electrode sheets are a positive electrode L end and a negative electrode N end, respectively.
  • Two three-legged legs form L-PE-N three electrodes, which form a single-mode common mode protection mode. If the two-side electrode lead-out legs are connected to the SPD trip device, a double-tripper three-electrode single-phase is formed.
  • the mode protection module can form a Y-connected single-phase full-mode protection mode by adding a GDT component to the PE end as required.
  • an insulating carrier plate 1 is disposed outside the lower electrode sheet 2 and the upper upper electrode sheet 4, and the two insulating carrier sheets 1 are fixed by fasteners.
  • the two insulating carrier plates 1 are each a recessed structure provided with a sinking hole 1-2, and the upper and lower two lower holes 1-2 are fastened to accommodate the two upper electrodes.
  • the two upper electrode sheets 4, the lower electrode sheets 2, and the MOV chip 3 have the same shape and are all circular.
  • the electrode lead-out leg 2-1 drawn in the axial direction of the lower electrode sheet 2 is taken out through the through-hole 1-21 in the sinker hole 1-2 provided in the insulating carrier plate 1.
  • the insulating layer is coated on the outside of the MOV assembly of the present invention, which can be used as a conventional pressure. Sensitive resistors are used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)

Abstract

一种具有绝缘承载板结构的MOV组件，包括至少两个电极片（2,4）和至少一个MOV芯片（3），相邻两个电极片（2,4）之间夹持有一个MOV芯片（3），在两个外侧电极片（2,4）中的一个电极片外设有绝缘承载板（1），另一个电极片与绝缘承载板（1）通过紧固件固定，或者在两个外侧电极片（2,4）外各设有绝缘承载板（1），两个绝缘承载板（1）通过紧固件固定。该MOV组件无高温损伤、过电压耐受能力强、成本低、易加工。通过在电极片（2,4）外设置单绝缘承载板（1）或双绝缘承载板（1），提高MOV组件的绝缘度和机械强度，在MOV组件外涂覆绝缘层，可作为常规压敏电阻使用。由于设置绝缘承载板（1），使得热量从中间导出，更加便于热脱离，提高了脱扣的可靠性。

Description

一种具有绝缘承载板结构的MOV组件 技术领域
本发明涉及金属氧化物压敏电阻技术领域，特别涉及一种具有绝缘承载结构的MOV组件。
背景技术
氧化锌压敏电阻器(Metal Oxide Varistors)具有特殊的非线性电流-电压特性，应用的环境遭遇雷击、电磁场干扰，电源开关频繁动作、电源系统故障，使得线路上电压突增，超过压敏电阻器的导通电压，就会进入导通区，由于MOV的非线性特性，其阻抗会变低，仅有几个欧姆，使过电压形成突波电流流出，藉以保护所连接的电子产品或昂贵电子组件。
异常工况的情况下，MOV持续导通会造成芯片发热过量，引起热崩溃，突然的热崩溃会使其来不及退出运行而引发事故。
现有的MOV器件，在其陶瓷芯片制成后，需经焊接铜引出脚，实施环氧包封固化等后段高温加工工序，这样不仅对芯片的后工序制作带来不便利，而且高温工艺对芯片造成隐形损伤也是不可忽视的。
当前MOV器件的热脱离是依靠铜引出脚引出，由于铜引出脚面积小，厚度薄，对热脱离造成一定影响，脱扣可靠性有待提高。
发明内容
针对上述现有技术存在的不足，本发明所要解决的技术问题是提供一种无高温损伤、过电压耐受能力强、散热条件好，成本低、易加工且绝缘强度高、脱扣可靠性高的具有绝缘承载板结构的MOV组件。
为了解决上述技术问题，本发明所采取的技术方案为：
本发明提供一种具有绝缘承载结构的MOV组件，包括至少两个电极片和至少一个MOV芯片，相邻两个电极片之间夹持有一个MOV芯片，在两个外侧电极片中的一个电极片外设有绝缘承载板，另一个电极片与所述绝缘承载板通过紧固件固定，或者在两个外侧电极片外各设有绝缘承载板，两个绝缘承载板通过紧固件固定。
在本发明的进一步实施方案中，所述具有绝缘承载板结构的MOV组件包括两个电极片和一个MOV芯片，等效电路为单片二电极结构。
在上述实施方案中，与所述绝缘承载板通过紧固件固定的电极片的形状设置为与绝缘承载板的形状相似，并设有相对应的通孔或螺纹孔。
或者，在本发明的进一步实施方案中，所述具有绝缘承载板结构的MOV组件包括三个电极片和两个MOV芯片，等效电路为二片三电极共模结构。
在上述实施方案中，在两个外侧电极片外设置的两个绝缘承载板的形状相同或不相同，并设有相对应的通孔或螺纹孔。
在本发明的更进一步实施方案中，所述绝缘承载板为平板结构或内侧设有下沉孔的凹进结构，所述下沉孔用于容纳所述电极片和MOV芯片，下沉孔还具有引出槽和矩形引出通孔，用于引出电极的引出。
在本发明的更进一步实施方案中，每个电极片均引出有至少一个电极引出脚，所述电极引出脚轴向引出或径向引出，所述电极引出脚形状根据需求设定，绝缘承载板的周边设有至少一个与电极引出脚对应的电极引出槽。
在本发明的又进一步实施方案中，所述紧固件为金属或非金属的铆钉或螺钉。
所述MOV组件装入浪涌保护器SPD模块腔中，其中一引出电极可联接脱扣弹片，另一电极片连接接线端，形成SPD模组，或所述MOV组件的电极引出脚贴接温度保险元件或低温合金熔丝，形成热保护型压敏电阻TMOV器件。
本发明有益效果在于：
(1)本发明通过在电极片外设置单片绝缘承载板或双片绝缘承载板，提高MOV组件的绝缘强度；在所述MOV组件外涂覆绝缘层，可作为常规压敏电阻使用；
(2)本发明利用夹持MOV芯片的电极片作为芯片散热片，提高了MOV芯片的脉冲通流耐受能力和小电流多频次的冲击耐受能力，还提高了MOV的暂时过电压耐受能力，为及时脱离退出运行赢了时间；使芯片性能得到最大化的利用，节约资源；并且由于设置了绝缘承载板，使得热量从中间导出，更加便于热脱离，提高脱扣的可靠性；
(3)本发明具有绝缘承载板结构的MOV组件加工工序简单、免焊接，免清洗，无环境污染、成本构成低、后续加工方便快捷；
(4)本发明通过紧固件固定MOV芯片、电极片，无需高温焊接工艺，避 免对芯片造成高温隐形损伤。
附图说明
图1-1是实施例1中具有绝缘承载板结构的MOV组件的爆炸图；
图1-2是实施例1中具有绝缘承载板结构的MOV组件的等效图；
图2-1是实施例2中具有绝缘承载板结构的MOV组件的爆炸图；
图2-2是实施例2中具有绝缘承载板结构的MOV组件的等效图；
图3-1是实施例3中具有绝缘承载板结构的MOV组件的爆炸图；
图3-2是实施例3中具有绝缘承载板结构的MOV组件的等效图；
图4-1是实施例4中具有绝缘承载板结构的MOV组件的爆炸图；
图4-2是实施例4中具有绝缘承载板结构的MOV组件的等效图；
图5-1是实施例5中具有绝缘承载板结构的MOV组件的爆炸图；
图5-2是实施例5中具有绝缘承载板结构的MOV组件的等效图。
图6-1是实施例6中具有绝缘承载板结构的MOV组件的爆炸图；
图6-2是实施例6中具有绝缘承载板结构的MOV组件的等效图。
具体实施方式
下面结合附图具体阐明本发明的实施方式，附图仅供参考和说明使用，不构成对本发明专利保护范围的限制。
实施例1
如图1-1所示，本实施例提供一种具有绝缘承载板结构的MOV组件，绝缘 承载板结构为单片或双片绝缘承载板1，所述具有绝缘承载板结构的MOV组件包括至少两个电极片和至少一个MOV芯片，在本实施例中，包括两个电极片2，4和一个MOV芯片3，两个电极片分别为下电极片2和上电极片4；
在本实施例中，相邻的下电极片2和上电极片4之间夹持有所述MOV芯片3，在上电极片4外设有绝缘承载板1，下电极片2与所述绝缘承载板1通过紧固件固定。上电极片4和MOV芯片的形状相同，均为圆形。
所述紧固件为金属或非金属的铆钉或螺钉。本实施例中，所述紧固件5为金属螺钉。
在本实施例中，与所述绝缘承载板1通过紧固件固定的下电极片2的形状设置为与绝缘承载板1的形状相同，均为矩形，并在四个角的位置设有相对应的通孔或螺纹孔，在本实施例中，下电极片2的四角位置设置有四个通孔2-31，2-32,2-33,2-34；所述绝缘承载板1的四角位置设置有四个螺纹孔1-41，1-42,1-43,1-44。
在本实施例中，所述绝缘承载板1为设有下沉孔1-2的凹进结构，所述下沉孔1-2用于容纳所述电极片2和MOV芯片3。
在本实施例中，下电极片2轴向引出电极引出脚2-1，上电极片4径向引出电极引出脚4-1，绝缘承载板1的周边设有与上电极片4的电极引出脚4-1对应的电极引出槽1-3。
在本实施例中，引出电极引出脚为矩型引出脚，电极片引出脚方便引出或连接脱扣装置，电极片材质为铝或铜或铝合金或铜合金等导电性，导热性好的 金属材质制成，其厚度为0.3～1.5mm。
所述MOV芯片3根据需要设置成不同的形状，如设置成圆形、矩形或异形(不规则形状)等；
如图1-2所示，本实施例的MOV组件的等效电路为单片二电极结构。上电极片4的电极引出脚4-1为正极L端，下电极片2的电极引出脚2-1为负极N端。L端、N端可接温度保护机构，如热脱离性机构或温度保险丝等。
实施例2
本实施例与实施例1的不同之处在于：
如图2-1,2-2所示，在下电极片2外设有绝缘承载板1，下电极片2和MOV芯片3的形状相同，均为圆形。
在本实施例中，与所述绝缘承载板1通过紧固件固定的上电极片4的形状设置为与绝缘承载板1的形状相同，均为矩形，并在四个角的位置设有相对应的通孔或螺纹孔，在本实施例中，上电极片4的四角位置设置有四个通孔4-21，4-22,4-23,4-24；所述绝缘承载板1的四角位置设置有四个螺纹孔1-41，1-42,1-43,1-44。
在本实施例中，下电极片2轴向引出的电极引出脚2-1通过所述绝缘承载板1为设置的下沉孔1-2中的通孔1-21引出。
实施例3
本实施例与实施例2的不同之处在于：
如图3-1,3-2所示，所述绝缘承载板1为平板结构。
实施例4
本实施例与实施例1的不同之处在于：
如图4-1,4-2所示，在下电极片2和上电极片4外各设有一个绝缘承载板1，两个绝缘承载板1通过紧固件固定。
在本实施例中，两个所述绝缘承载板1均为设有下沉孔1-2的凹进结构，上下两个所述下沉孔1-2扣合用于容纳所述电极片2,4和MOV芯片3。
在本实施例中，上电极片4、下电极板2和MOV芯片3的形状相同，均为圆形。
在本实施例中，下电极片2轴向引出的电极引出脚2-1通过所述绝缘承载板1设置的下沉孔1-2中的通孔1-21引出。
实施例5
本实施例与实施例1的不同之处在于：
如图5-1所示，所述具有绝缘承载板结构的MOV组件包括三个电极片和两个MOV芯片3，其中，三个电极片包括夹持其中一个MOV芯片的两个上电极片4和一个下电极片2，中间的上电极片与下电极片2夹持另一个MOV芯片。
在上部的上电极片4外设有绝缘承载板1，下电极片2与所述绝缘承载板1通过紧固件固定。两个上电极片4和MOV芯片3的形状相同，均为圆形。
在本实施例中，下电极片2轴向引出电极引出脚2-1，两个上电极片4均径向引出电极引出脚，绝缘承载板1的周边设有与上电极片4的电极引出脚对应 的电极引出槽。
如图5-2所示，本实施例的MOV组件的等效电路为二片三电极共模结构；中间的上电极片的电极引出脚为接地PE端，上部的上电极片的电极引出脚和下电极片的电极引出脚分别为正极L端和负极N端。双片三个引出脚形成L-PE-N三个电极，构成单相对地的共模保护方式，若将两边的电极引出脚接入SPD的脱扣装置，形成双脱扣三电极单相共模保护模块，若按需求在PE端加个GDT元件更可形成Y接法单相全模保护模式。
实施例6
本实施例与实施例5的不同之处在于：
如图6-1、6-2所示，在下电极片2和上部的上电极片4外各设有一个绝缘承载板1，两个绝缘承载板1通过紧固件固定。
在本实施例中，两个所述绝缘承载板1均为设有下沉孔1-2的凹进结构，上下两个所述下沉孔1-2扣合用于容纳所述两个上电极片4、下电极片2和MOV芯片3。
在本实施例中，两个上电极片4、下电极板2和MOV芯片3的形状相同，均为圆形。
在本实施例中，下电极片2轴向引出的电极引出脚2-1通过所述绝缘承载板1设置的下沉孔1-2中的通孔1-21引出。
在上述实施例中，在本发明的所述MOV组件外涂覆绝缘层，可作为常规压 敏电阻使用。
以上所揭露的仅为本发明的较佳实施例，不能以此来限定本发明的权利保护范围，因此依本发明申请专利范围所作的等同变化，仍属本发明所涵盖的范围。

Claims (8)

  1. 一种具有绝缘承载板结构的MOV组件，其特征在于：包括至少两个电极片和至少一个MOV芯片，相邻两个电极片之间夹持有一个MOV芯片，在两个外侧电极片中的一个电极片外设有绝缘承载板，另一个电极片与所述绝缘承载板通过紧固件固定，或者在两个外侧电极片外各设有绝缘承载板，两个绝缘承载板通过紧固件固定。
  2. 根据权利要求1所述的具有绝缘承载结构的MOV组件，其特征在于：包括两个电极片和一个MOV芯片，等效电路为单片二电极结构。
  3. 根据权利要求2所述的具有绝缘承载结构的MOV组件，其特征在于：与所述绝缘承载板通过紧固件固定的电极片的形状设置为与绝缘承载板的形状相似，并设有相对应的通孔或螺纹孔。
  4. 根据权利要求1所述的具有绝缘承载板结构的MOV组件，其特征在于：包括三个电极片和两个MOV芯片，等效电路为二片三电极共模结构。
  5. 根据权利要求4所述的具有绝缘承载板结构的MOV组件，其特征在于：在两个外侧电极片外设置的两个绝缘承载板的形状相同，并设有相对应的通孔或螺纹孔。
  6. 根据权利要求1、3或5所述的具有绝缘承载板结构的MOV组件，其特征在于：所述绝缘承载板为平板结构或内侧设有下沉孔的凹进结构，所述下沉孔用于容纳所述电极片和MOV芯片，还具有引出电极的引出槽与引出孔。
  7. 根据权利要求1、2或4所述的具有绝缘承载结构的MOV组件，其特征在于：每个电极片均引出有至少一个电极引出脚，所述电极引出脚轴向引出或径向引出。
  8. 根据权利要求1、3或5所述的具有绝缘承载结构的MOV组件，其特征在于：所述紧固件为金属或非金属的铆钉或螺钉。
PCT/CN2017/074661 2017-02-21 2017-02-24 一种具有绝缘承载板结构的mov组件 WO2018152756A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6304166B1 (en) * 1999-09-22 2001-10-16 Harris Ireland Development Company, Ltd. Low profile mount for metal oxide varistor package and method
CN203070854U (zh) * 2013-01-22 2013-07-17 隆科电子(惠阳)有限公司 具有安装保护功能窗口的压敏电阻
CN105610139A (zh) * 2016-01-15 2016-05-25 隆科电子(惠阳)有限公司 一种采用盒式紧固组装结构的浪涌保护器
CN205489503U (zh) * 2016-01-15 2016-08-17 隆科电子(惠阳)有限公司 一种采用盒式紧固组装结构的浪涌保护器
CN206194472U (zh) * 2016-11-21 2017-05-24 辰硕电子(九江)有限公司 一种适合大模块安装的mov组件
CN106782957A (zh) * 2017-01-17 2017-05-31 隆科电子(惠阳)有限公司 一种具有放电结构的复合型mov组件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6304166B1 (en) * 1999-09-22 2001-10-16 Harris Ireland Development Company, Ltd. Low profile mount for metal oxide varistor package and method
CN203070854U (zh) * 2013-01-22 2013-07-17 隆科电子(惠阳)有限公司 具有安装保护功能窗口的压敏电阻
CN105610139A (zh) * 2016-01-15 2016-05-25 隆科电子(惠阳)有限公司 一种采用盒式紧固组装结构的浪涌保护器
CN205489503U (zh) * 2016-01-15 2016-08-17 隆科电子(惠阳)有限公司 一种采用盒式紧固组装结构的浪涌保护器
CN206194472U (zh) * 2016-11-21 2017-05-24 辰硕电子(九江)有限公司 一种适合大模块安装的mov组件
CN106782957A (zh) * 2017-01-17 2017-05-31 隆科电子(惠阳)有限公司 一种具有放电结构的复合型mov组件

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