WO2018150529A1 - シンチレータモジュール、シンチレータセンサユニット及びシンチレータモジュールの製造方法 - Google Patents
シンチレータモジュール、シンチレータセンサユニット及びシンチレータモジュールの製造方法 Download PDFInfo
- Publication number
- WO2018150529A1 WO2018150529A1 PCT/JP2017/005831 JP2017005831W WO2018150529A1 WO 2018150529 A1 WO2018150529 A1 WO 2018150529A1 JP 2017005831 W JP2017005831 W JP 2017005831W WO 2018150529 A1 WO2018150529 A1 WO 2018150529A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- scintillator
- layer
- fiber optic
- moisture
- optic plate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000835 fiber Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 21
- 229920005549 butyl rubber Polymers 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 229920006038 crystalline resin Polymers 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 55
- 239000010408 film Substances 0.000 description 20
- 230000005855 radiation Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 4
- -1 thallium activated cesium iodide Chemical class 0.000 description 4
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2006—Measuring radiation intensity with scintillation detectors using a combination of a scintillator and photodetector which measures the means radiation intensity
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K4/00—Conversion screens for the conversion of the spatial distribution of X-rays or particle radiation into visible images, e.g. fluoroscopic screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K4/00—Conversion screens for the conversion of the spatial distribution of X-rays or particle radiation into visible images, e.g. fluoroscopic screens
- G21K2004/04—Conversion screens for the conversion of the spatial distribution of X-rays or particle radiation into visible images, e.g. fluoroscopic screens with an intermediate layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
Definitions
- the present invention relates to a scintillator module, a scintillator sensor unit, and a method for manufacturing the scintillator module.
- a scintillator module using a fiber optic plate As a scintillator module used in such a flat panel detector, a scintillator module using a fiber optic plate (FOP) is known.
- FOP fiber optic plate
- a reflective layer is formed by vacuum-depositing a metal such as aluminum to reflect visible light from the radiation incident side.
- a resin layer for example, parylene polymer
- the thickness of the moisture-proof coating layer is very thin as described above, it is weak against impact from the outside, scratches and peeling occur and the moisture-proof property is remarkably deteriorated, and consequently the performance of the flat panel detector is deteriorated. There was a fear.
- the present invention has been made in view of the above, and is a scintillator module, a scintillator sensor unit, and a scintillator module manufacturing method that can be easily manufactured, is resistant to mechanical impact, and can maintain high moisture resistance. Is to provide.
- the scintillator module according to the embodiment is formed of a material having weldability and moisture resistance, and the scintillator layer and the visible light reflection layer laminated on the fiber optic plate are made of fiber optic.
- a moisture-proof weld layer extending to the side surface of the plate and covering in a sealed state; and a resin case covering the moisture-proof weld layer.
- the resin case may have a peripheral wall surface along the shape of the surface facing the visible light reflecting film layer and the moisture-proof weld layer and the peripheral surface of the fiber optic plate.
- the resin case may be fitted so as to face the fiber optic plate through the peripheral wall surface and the moisture-proof weld layer.
- the resin case may be formed of a thermoplastic resin. Furthermore, the resin case may be made of a crystalline resin.
- the moisture-proof weld layer may be formed of a butyl rubber-based weld material.
- the scintillator sensor unit of the embodiment includes any one of the above scintillator modules and a photodiode array unit disposed at a position facing the fiber optic plate.
- the manufacturing method of the scintillator module of the embodiment includes a step of forming a scintillator layer and a visible light reflecting layer on a fiber optic plate, and a material having weldability and moisture resistance placed on the visible light reflecting layer.
- a process of bringing a resin case having a lid shape formed of a thermoplastic resin into contact with and covering the formed sheet, and a resin case toward the fiber optic plate side while heating the resin case and the sheet with a mold And a step of extending the sheet to the side surface of the fiber optic plate to form a moisture-proof weld layer, and a step of removing the mold and cooling.
- FIG. 1 is a schematic configuration diagram of a scintillator sensor unit according to an embodiment.
- FIG. 2 is a schematic cross-sectional view of the scintillator module.
- FIG. 3 is a flowchart of a procedure for manufacturing the scintillator module.
- FIG. 4 is an explanatory diagram (part 1) of a procedure for manufacturing a scintillator module.
- FIG. 5 is an explanatory diagram (part 2) of the procedure for manufacturing the scintillator module.
- FIG. 1 is a schematic configuration diagram of a scintillator sensor unit according to an embodiment.
- the scintillator sensor unit 10 is roughly classified by the scintillator module 11 that converts radiation (for example, X-rays) incident from the incident surface 11A side into visible light and outputs the visible light from the exit surface 11B side, and the scintillator module 11 converts the radiation.
- a photodiode array unit 12 that receives visible light and outputs it as image data.
- FIG. 2 is a schematic cross-sectional view of the scintillator module.
- the scintillator module 11 includes a scintillator layer 21 that converts incident radiation into visible light, a fiber optic plate 22 that guides visible light converted by the scintillator layer 21 to the photodiode array unit 12, and a scintillator layer 21. And a visible light reflecting film layer 23 that reflects visible light incident from the radiation incident surface 11A side to prevent incidence and reflects the visible light converted by the scintillator layer 21 to the fiber optic plate 22 side. ing.
- the scintillator module 11 covers the fiber optic plate 22 by covering the incident surface 11A side and side surface of the visible light reflecting film layer 23, the side surface (circumferential surface) of the scintillator layer 21, and part of the side surface of the fiber optic plate 22.
- the butyl rubber-based welding material layer (moisture-proof welding layer) 24 is mechanically protected by maintaining a pressure-bonded state facing all the surfaces facing the side surfaces of the scintillator layer 21 and the fiber optic plate 22.
- a resin case (resin cover member) 25 is provided.
- the scintillator layer 21 is formed by being formed on the fiber optic plate 22, and for example, CsI (Tl) [thallium activated cesium iodide], CsI (Na) [sodium activated cesium iodide], NaI (Tl) [thallium activated sodium iodide] or the like.
- the fiber optic plate 22 is formed in a plate shape by a large number of single-mode optical fibers and an absorber glass that is formed around the single-mode optical fibers and absorbs leakage light. Lead to the diode array unit 12.
- the visible light reflecting film layer 23 is configured as a film having a multilayer film structure using a metal thin film such as an aluminum thin film and a polyester resin, for example.
- the butyl rubber-based welding material layer 24 has low moisture permeability (for example, ⁇ 4 g / m 2 ⁇ 24 h), that is, has high moisture resistance and adhesion, and is in close contact with the fiber optic plate 22 and the resin case 25.
- a highly material is used.
- HX-779BT manufactured by Aika Industry Co., Ltd. is used.
- thermoplastic resin which is a resin material that is easy to process and hardly interferes with the incidence of radiation.
- a crystalline resin having a shrinkage ratio of 10/1000% or more is used.
- polyethylene resin shrinkage rate 20/1000 to 60/1000%
- polypropylene resin shrinkage rate 10/1000 to 25/1000%) are used.
- the thickness of the resin case 25 there are requirements from applications such as ease of processing, ease of handling and strength, cassettes on which the scintillator sensor unit 10 is mounted, and thickness restrictions depending on the shape of the device, etc. Therefore, a thickness of about 0.1 mm to 1.0 mm is used. However, it is basically arbitrary as long as the strength required for processing (further shape as required) is ensured.
- these resins are formed as a resin case 25 by die molding so that the shape thereof is, for example, a rectangular lid shape in plan view.
- the shape in plan view is not limited to this, and any shape is possible as long as the shape is required for the scintillator sensor unit 10 such as a circular shape or a polygonal shape.
- the above-mentioned butyl rubber-based welding material layer 24 is weak to physical contact and impact as it is because of its adhesiveness and softness, but since the resin case 25 covers it, the butyl rubber-based welding material layer 24 is moved to the butyl rubber-based welding material layer 24. Has reduced the impact.
- FIG. 3 is a flowchart of a procedure for manufacturing the scintillator module.
- FIG. 4 is an explanatory diagram (part 1) of a procedure for manufacturing a scintillator module.
- a scintillator layer 21 is formed on one surface of a fiber optic plate 22 having a rectangular shape in plan view (step S11).
- a visible light reflecting film is attached to the scintillator layer 21 to form a visible light reflecting film layer 23 (step S12).
- a butyl rubber-based welding material sheet 24S is placed on the upper surface of the visible light reflecting film layer 23 (step S13), and as shown in FIG. 25 (step S14).
- the butyl rubber-based welding material sheet 24S is only located on the upper surface of the visible light reflecting film layer 23, and does not reach the side surface of the fiber optic plate 22, The visible light reflecting film layer 23 and the scintillator layer 21 are not housed.
- FIG. 5 is an explanatory diagram (part 2) of the procedure for manufacturing the scintillator module.
- the upper mold 31U that can be heated and pressurized from the upper surface side (the side far from the fiber optic plate 22) of the resin case 25 is the upper surface and side surfaces of the resin case 25.
- a heat press process is performed in which the mold 31 is brought into contact with the lower mold 31L to support the fiber optic plate 22, and is pressurized and heated (step S15).
- the inner dimension of the mold 31 is preferably a size that takes into account the amount of expansion when the resin case 25 is heated. This is for suppressing the thickness of the butyl rubber-based welding material layer 24 after processing from being unnecessarily thin and reducing moisture resistance.
- the resin case 25 formed of a thermoplastic resin expands by heating, and the butyl rubber-based welding material sheet 24S decreases in hardness and increases in fluidity, as shown in FIG.
- the resin case 25 flows along the gap between the visible light reflecting film layer 23, the scintillator layer 21, and the side surfaces of the fiber optic plate 22, and enters the incident surface 11 A side and side surfaces of the visible light reflecting film layer 23.
- the side surface (peripheral surface) and part of the side surface of the fiber optic plate 22 are covered, and the scintillator layer 21 and the visible light reflecting film layer 23 are accommodated between the fiber optic plate 22.
- the butyl rubber-based welding material sheet 24S is welded to the incident surface 11A side and the side surface of the visible light reflecting film layer 23, the side surface (circumferential surface) of the scintillator layer 21 and a part of the side surface of the fiber optic plate 22, As shown in FIG. 5C, the scintillator layer 21 and the visible light reflecting film layer 23 are accommodated between the fiber optic plate 22 and the fiber optic plate 22 in a moisture-proof state.
- the butyl rubber welding material layer 24 is sandwiched between the fiber optic plate 22 whose dimensions hardly change during heating and cooling and the resin case 25 that expands during heating and contracts during cooling.
- the moisture-proof performance can be surely ensured and is physically protected by the resin case 25.
- moisture protection and packaging of the scintillator module can be performed at a low cost without using an advanced vacuum deposition apparatus.
- the butyl rubber-based welding material sheet 24S has been described as having a single sheet shape. However, when the size of the scintillator sensor unit 10 is large, a plurality of sheets are spread, or the tape shape is changed. It is also possible to lay a plurality of butyl rubber-based welding material tapes having a predetermined width so as to be used as a sheet as a whole.
- the butyl rubber-based welding material is used as the moisture-proof welding layer.
- the present invention is not limited to this, and any material that exhibits the same properties by heating and pressing can be similarly applied. is there.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measurement Of Radiation (AREA)
- Conversion Of X-Rays Into Visible Images (AREA)
Abstract
Description
また、防湿コーティング層の透湿性(WVTR:Water Vapor Transmission Rate)は、膜厚20μmの場合、4g/m2・24h(=4g/m2・day)程度であり、決して高いとは言えなかった。
さらに、樹脂製ケースは、結晶性樹脂で形成されているようにしてもよい。
図1は、実施形態のシンチレータセンサユニットの概要構成図である。
シンチレータセンサユニット10は、大別すると、入射面11A側から入射した放射線(例えば、X線)を可視光に変換して出射面11B側から出力するシンチレータモジュール11と、シンチレータモジュール11により変換された可視光を受光して画像データとして出力するフォトダイオードアレイユニット12と、を備えている。
シンチレータモジュール11は、入射した放射線を可視光に変換するシンチレータ層21と、シンチレータ層21により変換された可視光をフォトダイオードアレイユニット12まで導く導光部材としてのファイバーオプティックプレート22と、シンチレータ層21に積層され放射線の入射面11A側から入射する可視光を反射して入射を妨げるとともにシンチレータ層21により変換された可視光をファイバーオプティックプレート22側に反射する可視光反射フィルム層23と、を備えている。
図3は、シンチレータモジュールの作製手順のフローチャートである。
図4は、シンチレータモジュールの作製手順の説明図(その1)である。
次に図4(B)に示すように、シンチレータ層21に可視光反射用フィルムを貼り付けて、可視光反射フィルム層23を形成する(ステップS12)。
続いて、図5(A)に示すように、樹脂製ケース25の上面側(ファイバーオプティックプレート22から遠い側)から、加熱、加圧可能な上部金型31Uが樹脂製ケース25の上面及び側面を覆い、下部金型31Lがファイバーオプティックプレート22を支持するように金型31を当接させ、加圧及び加熱するヒートプレス処理を行う(ステップS15)。
また、以上の説明においては、防湿溶着層としてブチルゴム系溶着材を用いていたが、これに限られるものでは無く、加熱及び加圧して同様の性状をしめす材料であれば同様に適用が可能である。
Claims (8)
- 溶着性及び防湿性を有する材料で形成され、ファイバーオプティックプレートに積層されたシンチレータ層及び可視光反射層を前記ファイバーオプティックプレートの側面まで延在して密閉状態で覆う防湿溶着層と、
前記防湿溶着層を覆う樹脂製ケースと、
を備えたシンチレータモジュール。 - 前記樹脂製ケースは、前記可視光反射フィルム層と前記防湿溶着層を介して対向する面及び前記ファイバーオプティックプレートの周面の形状に沿った周壁面を有する、
請求項1記載のシンチレータモジュール。 - 前記樹脂製ケースは、前記周壁面及び前記防湿溶着層を介して前記ファイバーオプティックプレートに対向するように嵌め込まれている、
請求項2記載のシンチレータモジュール。 - 前記樹脂製ケースは、熱可塑性樹脂で形成されている、
請求項1乃至請求項3のいずれか一項記載のシンチレータモジュール。 - 前記樹脂製ケースは、結晶性樹脂で形成されている、
請求項4記載のシンチレータモジュール。 - 前記防湿溶着層は、ブチルゴム系溶着材により形成されている、
請求項1乃至請求項5のいずれか一項記載のシンチレータモジュール。 - 請求項1乃至請求項6記載のいずれか一項記載のシンチレータモジュールと、
前記ファイバーオプティックプレートに対向する位置に配置されたフォトダイオードアレイユニットと、
を備えたシンチレータセンサユニット。 - ファイバーオプティックプレートにシンチレータ層及び可視光反射層を積層して形成する工程と、
前記可視光反射層に載置された溶着性及び防湿性を有する材料で形成されたシートに熱可塑性樹脂で形成された蓋形状を有する樹脂製ケースを当接させて覆う工程と、
金型により前記樹脂製ケース及び前記シートを加熱しつつ前記ファイバーオプティックプレート側に向けて前記樹脂製ケースを加圧し、前記シートを前記ファイバーオプティックプレートの側面まで延在させて防湿溶着層を形成する工程と、
前記金型を外して冷却する工程と、
を備えたシンチレータモジュールの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/005831 WO2018150529A1 (ja) | 2017-02-17 | 2017-02-17 | シンチレータモジュール、シンチレータセンサユニット及びシンチレータモジュールの製造方法 |
KR1020197023917A KR20190099539A (ko) | 2017-02-17 | 2017-02-17 | 신틸레이터 모듈, 신틸레이터 센서 유닛 및 신틸레이터 모듈의 제조 방법 |
CN201780086351.0A CN110291594A (zh) | 2017-02-17 | 2017-02-17 | 闪烁体模块、闪烁体传感器单元和闪烁体模块的制造方法 |
US16/478,033 US10871581B2 (en) | 2017-02-17 | 2017-02-17 | Scintillator module, scintillator sensor unit, and scintillator module production method |
JP2018550000A JP6454451B1 (ja) | 2017-02-17 | 2017-02-17 | シンチレータモジュール、シンチレータセンサユニット及びシンチレータモジュールの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/005831 WO2018150529A1 (ja) | 2017-02-17 | 2017-02-17 | シンチレータモジュール、シンチレータセンサユニット及びシンチレータモジュールの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018150529A1 true WO2018150529A1 (ja) | 2018-08-23 |
Family
ID=63169177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/005831 WO2018150529A1 (ja) | 2017-02-17 | 2017-02-17 | シンチレータモジュール、シンチレータセンサユニット及びシンチレータモジュールの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10871581B2 (ja) |
JP (1) | JP6454451B1 (ja) |
KR (1) | KR20190099539A (ja) |
CN (1) | CN110291594A (ja) |
WO (1) | WO2018150529A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003098299A (ja) * | 2001-09-21 | 2003-04-03 | Fuji Photo Film Co Ltd | 放射線像変換パネル |
JP2004294137A (ja) * | 2003-03-26 | 2004-10-21 | Konica Minolta Holdings Inc | 放射線像変換パネル及びその製造方法 |
JP2005114397A (ja) * | 2003-10-03 | 2005-04-28 | Konica Minolta Medical & Graphic Inc | 放射線画像変換パネル及びその製造方法 |
CN101900824A (zh) * | 2010-06-24 | 2010-12-01 | 江苏康众数字医疗设备有限公司 | 闪烁体封装薄膜及封装方法 |
JP2014153074A (ja) * | 2013-02-05 | 2014-08-25 | Hamamatsu Photonics Kk | 放射線像変換パネルの製造方法、及び、放射線像変換パネル |
JP2015045615A (ja) * | 2013-08-29 | 2015-03-12 | 富士フイルム株式会社 | 放射線画像検出装置及び製造方法 |
JP2016095189A (ja) * | 2014-11-13 | 2016-05-26 | コニカミノルタ株式会社 | シンチレータパネル及び放射線検出器 |
JP2016136094A (ja) * | 2015-01-23 | 2016-07-28 | コニカミノルタ株式会社 | シンチレータパネル及び放射線検出器 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2310017C (en) | 1998-06-18 | 2005-10-25 | Hamamatsu Photonics K.K. | Scintillator panel and radiation image sensor |
JP4612815B2 (ja) | 2004-08-10 | 2011-01-12 | キヤノン株式会社 | 放射線検出装置、シンチレータパネル、これらの製造方法及び放射線検出システム |
US7514686B2 (en) | 2004-08-10 | 2009-04-07 | Canon Kabushiki Kaisha | Radiation detecting apparatus, scintillator panel, their manufacturing method and radiation detecting system |
JP2008215951A (ja) | 2007-03-01 | 2008-09-18 | Toshiba Corp | 放射線検出器 |
JP2011137665A (ja) | 2009-12-26 | 2011-07-14 | Canon Inc | シンチレータパネル及び放射線撮像装置とその製造方法、ならびに放射線撮像システム |
JP2012154696A (ja) | 2011-01-24 | 2012-08-16 | Canon Inc | シンチレータパネル、放射線検出装置およびそれらの製造方法 |
JP5677136B2 (ja) * | 2011-02-24 | 2015-02-25 | 富士フイルム株式会社 | 放射線画像検出装置及び放射線撮影用カセッテ |
JP5728250B2 (ja) | 2011-03-01 | 2015-06-03 | キヤノン株式会社 | 放射線検出装置、シンチレータパネル、それらの製造方法、および放射線検出システム |
JP5744570B2 (ja) * | 2011-03-02 | 2015-07-08 | キヤノン株式会社 | 放射線検出装置、放射線検出装置の製造方法及び放射線検出システム |
-
2017
- 2017-02-17 US US16/478,033 patent/US10871581B2/en active Active
- 2017-02-17 CN CN201780086351.0A patent/CN110291594A/zh active Pending
- 2017-02-17 JP JP2018550000A patent/JP6454451B1/ja active Active
- 2017-02-17 KR KR1020197023917A patent/KR20190099539A/ko not_active Application Discontinuation
- 2017-02-17 WO PCT/JP2017/005831 patent/WO2018150529A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003098299A (ja) * | 2001-09-21 | 2003-04-03 | Fuji Photo Film Co Ltd | 放射線像変換パネル |
JP2004294137A (ja) * | 2003-03-26 | 2004-10-21 | Konica Minolta Holdings Inc | 放射線像変換パネル及びその製造方法 |
JP2005114397A (ja) * | 2003-10-03 | 2005-04-28 | Konica Minolta Medical & Graphic Inc | 放射線画像変換パネル及びその製造方法 |
CN101900824A (zh) * | 2010-06-24 | 2010-12-01 | 江苏康众数字医疗设备有限公司 | 闪烁体封装薄膜及封装方法 |
JP2014153074A (ja) * | 2013-02-05 | 2014-08-25 | Hamamatsu Photonics Kk | 放射線像変換パネルの製造方法、及び、放射線像変換パネル |
JP2015045615A (ja) * | 2013-08-29 | 2015-03-12 | 富士フイルム株式会社 | 放射線画像検出装置及び製造方法 |
JP2016095189A (ja) * | 2014-11-13 | 2016-05-26 | コニカミノルタ株式会社 | シンチレータパネル及び放射線検出器 |
JP2016136094A (ja) * | 2015-01-23 | 2016-07-28 | コニカミノルタ株式会社 | シンチレータパネル及び放射線検出器 |
Also Published As
Publication number | Publication date |
---|---|
US10871581B2 (en) | 2020-12-22 |
JPWO2018150529A1 (ja) | 2019-02-21 |
JP6454451B1 (ja) | 2019-01-16 |
KR20190099539A (ko) | 2019-08-27 |
US20190369270A1 (en) | 2019-12-05 |
CN110291594A (zh) | 2019-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6172371B1 (en) | Robust cover plate for radiation imager | |
US10302773B2 (en) | Radiation detector | |
JP4670955B2 (ja) | フラットパネルディテクター | |
WO2012026187A1 (ja) | 放射線検出器 | |
US20140374608A1 (en) | Radiation detection apparatus and method of manufacturing the same | |
JP5239866B2 (ja) | 放射線フラットパネルディテクター | |
US20080011961A1 (en) | Scintillator panel | |
JP2008209195A (ja) | シンチレータパネル及び放射線フラットパネルディテクター | |
US8779373B2 (en) | Radiation detection apparatus, radiation detection system and method of manufacturing radiation detection apparatus | |
JPWO2008111379A1 (ja) | シンチレータパネル及び放射線フラットパネルディテクター | |
JP6454451B1 (ja) | シンチレータモジュール、シンチレータセンサユニット及びシンチレータモジュールの製造方法 | |
JP7029217B2 (ja) | 放射線検出器 | |
JP2009002776A (ja) | シンチレータパネル及び放射線フラットパネルディテクター | |
WO2019244610A1 (ja) | 放射線検出器及び放射線画像撮影装置 | |
JP7457640B2 (ja) | 放射線検出器、及び放射線検出器の製造方法 | |
WO2022137843A1 (ja) | 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット | |
US20240118437A1 (en) | Radiation detector, radiation detector manufacturing method, and scintillator panel unit | |
JP7287515B2 (ja) | 放射線検出器 | |
JP2009300213A (ja) | シンチレータパネル及び放射線フラットパネルディテクター | |
KR101168874B1 (ko) | 신틸레이터 패널, 이의 제조 방법 및 이를 포함하는 방사선 검출기 | |
EP4242695A1 (en) | Radiation detector, radiation detector manufacturing method, and scintillator panel unit | |
WO2020129428A1 (ja) | シンチレータプレート、放射線検出装置および放射線検出システム | |
JP2009002775A (ja) | シンチレータパネル及び放射線フラットパネルディテクター |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2018550000 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17896472 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20197023917 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17896472 Country of ref document: EP Kind code of ref document: A1 |