WO2018142758A1 - Condensateur électrolytique - Google Patents

Condensateur électrolytique Download PDF

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Publication number
WO2018142758A1
WO2018142758A1 PCT/JP2017/043904 JP2017043904W WO2018142758A1 WO 2018142758 A1 WO2018142758 A1 WO 2018142758A1 JP 2017043904 W JP2017043904 W JP 2017043904W WO 2018142758 A1 WO2018142758 A1 WO 2018142758A1
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WO
WIPO (PCT)
Prior art keywords
electrolytic capacitor
layer
capacitor element
resin layer
exterior
Prior art date
Application number
PCT/JP2017/043904
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English (en)
Japanese (ja)
Inventor
康太 宗安
佐藤　昌宏
直美 栗原
敬太 上中
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN201780084311.2A priority Critical patent/CN110199368B/zh
Priority to JP2018565969A priority patent/JP7223968B2/ja
Publication of WO2018142758A1 publication Critical patent/WO2018142758A1/fr
Priority to US16/503,657 priority patent/US11049663B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0003—Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/022—Electrolytes; Absorbents
    • H01G9/025—Solid electrolytes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/07—Dielectric layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Definitions

  • the present invention relates to an electrolytic capacitor including a capacitor element.
  • the electrolytic capacitor includes a capacitor element, a lead member electrically connected to the capacitor element, and an exterior member that seals part of the capacitor element and the lead member.
  • an electrolytic capacitor When an electrolytic capacitor is exposed to a high temperature environment (for example, 250 ° C. or more) by reflow treatment or the like, heat is transferred to the capacitor element inside the electrolytic capacitor, and the electrical characteristics of the capacitor element may be deteriorated. Further, when the capacitor element includes a conductive polymer as a solid electrolyte, gas is generated by thermal decomposition of the conductive polymer. As a result, the internal pressure of the electrolytic capacitor increases, and the sealing performance of the electrolytic capacitor may be reduced.
  • a high temperature environment for example, 250 ° C. or more
  • Patent Document 1 proposes providing an infrared reflective layer on the surface of a film in an electrochemical device including an electrochemical element and a film for sealing the electrochemical element. Thereby, deterioration of the electrochemical element due to heat conduction to the electrochemical element inside the electrochemical device is suppressed.
  • a metal such as aluminum or an alloy containing aluminum is used.
  • the infrared reflective layer and the lead member of the electrolytic capacitor may come into contact with each other, resulting in a short circuit, reducing the reliability of the electrolytic capacitor. To do.
  • One aspect of the present invention includes a capacitor element, a lead member electrically connected to the capacitor element, an exterior member that seals part of the capacitor element and the lead member, and at least a surface of the exterior member
  • a heat shielding layer that covers a part and has electrical insulation, and the heat shielding layer relates to an electrolytic capacitor including at least one of a metal oxide and a metal hydroxide.
  • Another aspect of the present invention includes a capacitor element, a lead member electrically connected to the capacitor element, and an exterior resin layer that covers the capacitor element and covers a part of the lead member, An exterior resin layer is related with the electrolytic capacitor containing the porous particle which has electrical insulation.
  • An electrolytic capacitor according to a first embodiment of the present invention includes a capacitor element, a lead member electrically connected to the capacitor element, an exterior member that seals part of the capacitor element and the lead member, and a surface of the exterior member A heat shielding layer covering at least a part of the heat shielding layer.
  • the heat shielding layer contains a metal compound that exhibits a heat shielding effect.
  • the metal compound having a heat shielding effect at least one of a metal oxide and a metal hydroxide can be used.
  • the heat shield layer has electrical insulation. Therefore, even if the lead member and the heat shield layer are in contact with each other, a short circuit does not occur, and an electrolytic capacitor excellent in reliability can be obtained. It is preferable that the oxide or hydroxide contained in the heat-shielding layer as the metal compound also has electrical insulation.
  • the exterior member is an exterior resin layer L1 that covers the capacitor element and covers a part of the lead member.
  • the exterior member may include a bottomed case that houses the capacitor element and a sealing member that closes the opening of the case. Resin, metal, ceramics, etc. are mentioned as a material of a bottomed case.
  • the sealing member includes, for example, a resin or a rubber component. You may provide the through-hole which lets a lead member pass to a sealing member.
  • Examples of the metal oxide and / or metal hydroxide used for the heat shielding layer include aluminum, magnesium, silicon, zinc, nickel, titanium, zirconium, indium, tin, iron, copper, rhodium, niobium, tantalum, tungsten, Including molybdenum. These may be used alone or in combination of two or more.
  • the heat shielding layer containing a metal oxide is used as an infrared reflecting layer. Since the heat shielding effect is high, the metal oxide used for the heat shielding layer is preferably at least one selected from the group consisting of aluminum oxide, magnesium oxide, silicon oxide, titanium oxide, and zirconium oxide. When the metal oxide is a hydrate, the heat shield layer containing the metal oxide also serves as an endothermic layer. Examples of metal oxide hydrates include zeolite.
  • the thermal barrier layer containing a metal hydroxide is used as an endothermic layer because the metal hydroxide generates water by thermal decomposition. Since the heat shielding effect by heat absorption is high, the metal hydroxide used for the heat shielding layer is preferably at least one of aluminum hydroxide and magnesium hydroxide.
  • the heat shield layer preferably contains a metal compound and a resin.
  • the metal compound can be included in the heat shielding layer in the form of powder (particles).
  • a heat shield layer includes, for example, a resin layer and a particulate metal compound dispersed in the resin layer. The shape of the particles may be porous or may not be porous.
  • the heat shielding layer (resin layer) preferably contains a cured product of the curable resin composition, and may contain a thermoplastic resin or a composition containing the same. About a curable resin composition and a thermoplastic resin (composition), what is illustrated by the below-mentioned exterior resin layer can be used.
  • the heat shielding layer can be formed by, for example, applying a curable resin composition or a thermoplastic resin (composition) to which a metal compound is added to the surface of the exterior member (exterior resin layer).
  • the heat shield layer covers at least a part of the surface of the exterior member.
  • the heat shielding layer may cover the outer surface (the surface opposite to the capacitor element) of the exterior member, or may cover the inner surface (the surface on the capacitor element side).
  • the thermal barrier layer contains a metal hydroxide or metal oxide hydrate that generates water by thermal decomposition
  • the thermal barrier layer covers the outer surface of the exterior member from the viewpoint of the reliability of the electrolytic capacitor. It is preferable.
  • the content of the metal compound in the heat shield layer is, for example, 20% by mass or more.
  • the thickness of the heat shield layer is preferably 1 ⁇ m or more and 100 ⁇ m or less. In this case, the electrolytic capacitor can be reduced in size, and heat conduction into the electrolytic capacitor is sufficiently suppressed.
  • the above metal compound forms porous particles.
  • the porous particles referred to here include hollow particles.
  • porous particles By using porous particles, a large number of voids are formed in the heat shielding layer.
  • the heat shielding effect is enhanced by a large number of voids formed in the heat shielding layer.
  • the heat shielding layer can have more voids than the exterior resin layer L1.
  • the porosity of the heat shield layer is, for example, 20% or more and 80% or less.
  • the porosity of the exterior resin layer L1 is, for example, less than 5%.
  • the porosity of the heat shield layer or exterior resin layer L1 is calculated, for example, by using a cross-sectional image of the heat shield layer or exterior resin layer L1 by a scanning electron microscope to calculate the ratio of the area of the void portion to the area of the cross section. Can be obtained.
  • the porous particles are made of, for example, aluminum oxide, silicon oxide, zeolite, or the like.
  • the average particle diameter of the porous particles is, for example, 1 ⁇ m or more and 100 ⁇ m or less.
  • the BET specific surface area of the porous particles is, for example, 10 m 2 / g or more and 1000 m 2 / g or less.
  • the content of the porous particles in the heat shielding layer is, for example, 20% by mass or more.
  • the heat shield layer is preferably formed so as to fill the gap. In this case, heat conduction to the capacitor element inside the electrolytic capacitor through the gap can be suppressed. Moreover, the sealing performance of the electrolytic capacitor can be further improved.
  • the exterior resin layer L1 preferably contains a filler.
  • the filler is preferably not porous, and for example, spherical particles are used.
  • the porous particles are preferably more porous than the filler.
  • the porous particles preferably have a BET specific surface area larger than that of the filler.
  • the porous particles and the filler are formed of the same material (for example, silicon oxide), it is preferable that the porous particles have an apparent density smaller than that of the filler.
  • the filler is preferably spherical silicon oxide particles.
  • the exterior resin layer L1 is deteriorated, and the adhesion between the exterior resin layer L1 and the lead member is suppressed from being lowered.
  • the electrolytic capacitor according to the second embodiment of the present invention includes a capacitor element, a lead member electrically connected to the capacitor element, and an exterior resin layer L2 that covers the capacitor element and covers a part of the lead member. .
  • the exterior resin layer L2 includes porous particles.
  • the porous particles referred to here include hollow particles. Since many voids are formed in the exterior resin layer L2 by the porous particles, a high heat shielding effect is obtained. That is, the exterior resin layer L2 also serves as a heat shield layer. Therefore, even when the electrolytic capacitor is exposed to a high temperature environment (for example, 250 ° C. or higher) by reflow processing or the like, heat conduction to the capacitor element inside the electrolytic capacitor is suppressed.
  • a high temperature environment for example, 250 ° C. or higher
  • the porous particles contained in the exterior resin layer L2 have electrical insulation. Therefore, even if the lead member and the porous particles contained in the exterior resin layer L2 come into contact with each other, a short circuit does not occur, and an electrolytic capacitor excellent in reliability can be obtained.
  • the porous particles contained in the exterior resin layer L2 can be used.
  • the porous particles contained in the exterior resin layer L2 are preferably formed of a metal oxide. In this case, a high heat shielding effect can be obtained without impairing the sealing performance.
  • a metal oxide what is illustrated by the metal compound as described in 1st Embodiment can be used.
  • the metal oxide contained in the exterior resin layer L2 is preferably not a hydrate.
  • the exterior resin layer L2 preferably contains a filler.
  • the filler is preferably not porous, and for example, spherical particles are used.
  • the porous particles are preferably more porous than the filler.
  • the porous particles preferably have a BET specific surface area larger than that of the filler.
  • the filler is preferably spherical silicon oxide particles.
  • the exterior resin layer L2 is deteriorated, and the adhesion between the exterior resin layer L2 and the lead member is suppressed from being lowered.
  • the exterior resin layer L2 preferably contains a filler, and the exterior resin layer L2 preferably contains 20 parts by mass or more and 80 parts by mass or less of porous particles with respect to a total of 100 parts by mass of the porous particles and the filler.
  • the sealing effect by the filler and the heat shielding effect by the porous particles are obtained with a good balance.
  • the porosity of the exterior resin layer L2 containing porous particles is preferably 20% or more and 80% or less.
  • the content of the porous particles in the exterior resin layer L2 is, for example, 50% by mass or more and 95% by mass or less.
  • the exterior resin layer preferably includes a cured product of the curable resin composition, and may include a thermoplastic resin or a composition including the same.
  • a thermoplastic resin or a composition including the same.
  • the curable resin composition and the thermoplastic resin (composition) those exemplified below can be used.
  • the exterior resin layer can be formed using a molding technique such as injection molding, insert molding, or compression molding.
  • the exterior resin layer is formed, for example, by using a predetermined mold and filling a predetermined portion with a curable resin composition or a thermoplastic resin (composition) so as to cover a part of the lead together with the outer surface of the capacitor element. can do.
  • the porous particles may be added to the curable resin composition or the thermoplastic resin (composition).
  • the curable resin composition may contain a filler, a curing agent, a polymerization initiator, and / or a catalyst in addition to the curable resin.
  • the curable resin include a photocurable resin and a thermosetting resin.
  • a curing agent, a polymerization initiator, a catalyst, etc. are suitably selected according to the kind of curable resin.
  • the curable resin for example, a compound that is cured or polymerized by the action of heat (for example, a monomer, an oligomer, a prepolymer, or the like) is used.
  • a compound (or curable resin) include epoxy resin, phenol resin, urea resin, polyimide, polyamideimide, polyurethane, diallyl phthalate, and unsaturated polyester.
  • the curable resin composition may include a plurality of curable resins.
  • the filler for example, insulating particles (inorganic or organic) and / or fibers are preferable.
  • the insulating material constituting the filler include insulating compounds such as silicon oxide and aluminum oxide, glass, and mineral materials (talc, mica, clay, etc.).
  • the exterior resin layer may contain one kind of these fillers, or may contain two or more kinds in combination. Content of the filler in an exterior resin layer is 10 mass% or more and 90 mass% or less, for example.
  • thermoplastic resin for example, polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), or the like can be used.
  • the composition containing a thermoplastic resin may contain the above-described filler in addition to the thermoplastic resin.
  • a multilayer capacitor element is used as the electrolytic capacitor.
  • the multilayer capacitor element includes, for example, an anode body, a dielectric layer that covers the anode body, and a cathode portion that covers the dielectric layer.
  • the cathode part includes a solid electrolyte layer covering the dielectric layer and a cathode lead layer covering the solid electrolyte layer.
  • the electrolytic capacitor includes, for example, an anode body (aluminum foil) having a dielectric layer on the surface, and a cathode body (aluminum).
  • a capacitor element is used in which a foil is wound with a separator interposed between an anode body and a cathode body.
  • the wound capacitor element includes an electrolytic solution and / or a solid electrolyte.
  • the wound electrolytic capacitor may further include a mold resin layer that covers the sealing member in order to improve sealing performance.
  • the lead member When a multilayer capacitor element is used, for example, a lead frame is used as the lead member. When a wound capacitor element is used, the lead member includes a lead tab connected to the capacitor element and a lead wire connected to an end of the lead tab. The lead wire penetrates the sealing member.
  • FIG. 1 is a cross-sectional view schematically showing an example of an electrolytic capacitor according to the present invention.
  • an electrolytic capacitor 1 includes a capacitor element 2, an anode terminal 4 (anode-side lead member) and a cathode terminal 5 (cathode-side lead member) electrically connected to the capacitor element 2, And an exterior resin layer 3 that covers the capacitor element 2 and part of the anode terminal 4 and the cathode terminal 5. Part of the anode terminal 4 and the cathode terminal 5 is exposed to the outside of the exterior resin layer 3.
  • the exterior resin layer 3 has a substantially rectangular parallelepiped outer shape, and the electrolytic capacitor 1 also has a substantially rectangular parallelepiped outer shape.
  • a lead frame is used for the anode terminal 4 and the cathode terminal 5. For example, copper or a copper alloy is used as the material of the lead frame.
  • the electrolytic capacitor 1 includes a heat shield layer 15 that covers the surface of the exterior resin layer 3 and has electrical insulation.
  • the heat shield layer 15 includes the metal compound described in the first embodiment.
  • the metal compound preferably forms porous particles.
  • the heat shielding layer (not shown) may be formed so as to fill the gap when a gap exists at a part of the interface between the exterior resin layer 3 and the anode terminal 4 and / or the cathode terminal 5. preferable.
  • the exterior resin layer 3 may also serve as the heat shield layer as described in the second embodiment.
  • the main surfaces 4S and 5S of the anode terminal 4 and the cathode terminal 5 are exposed from the same surface of the exterior resin layer 3. This exposed surface is used for solder connection with a substrate (not shown) on which the electrolytic capacitor 1 is to be mounted.
  • the capacitor element 2 includes an anode body 6, a dielectric layer 7 that covers the anode body 6, and a cathode portion 8 that covers the dielectric layer 7.
  • the cathode portion 8 includes a solid electrolyte layer 9 that covers the dielectric layer 7 and a cathode lead layer 10 that covers the solid electrolyte layer 9.
  • the cathode lead layer 10 has a carbon layer 11 and a silver paste layer 12.
  • the anode body 6 includes a region facing the cathode part 8 and a region not facing. Of the region of the anode body 6 that does not face the cathode portion 8, an insulating separation layer 13 is formed in a portion adjacent to the cathode portion 8 so as to cover the surface of the anode body 6 in a band shape. Contact with the body 6 is restricted. The other part of the region of the anode body 6 that does not face the cathode portion 8 is electrically connected to the anode terminal 4 by welding.
  • the cathode terminal 5 is electrically connected to the cathode portion 8 via an adhesive layer 14 formed of a conductive adhesive.
  • the anode body 6 can contain a valve action metal, an alloy containing the valve action metal, a compound containing the valve action metal, and the like. These may be used alone or in combination of two or more.
  • a valve action metal for example, aluminum, tantalum, niobium and titanium are preferably used.
  • the surface of the anode body 6 is porous. Such an anode body 6 can be obtained, for example, by roughening the surface of a base material (such as a foil-like or plate-like base material) containing a valve metal by etching or the like.
  • a sintered body (porous body) containing a valve action metal may be used as the anode body.
  • a sintered body for example, a powder containing a valve action metal is pressed in a state where one end in the longitudinal direction of the anode lead of the rod-like body is embedded in the powder, and a desired shape (for example, a block shape) After obtaining a molded body, it is obtained by sintering the molded body.
  • the dielectric layer 7 contains an oxide (for example, aluminum oxide) of a valve action metal.
  • the dielectric layer 7 is formed along the porous surface (including the inner wall surface of the hole) of the anode body 6.
  • the surface of the dielectric layer 7 has a concavo-convex shape corresponding to the shape of the surface of the anode body 6.
  • the solid electrolyte layer 9 is preferably formed so as to fill the unevenness of the dielectric layer 7.
  • the dielectric layer 7 is formed, for example, by anodizing the surface of the anode body by chemical conversion treatment or the like.
  • Anodization can be performed by a known method such as chemical conversion treatment.
  • the chemical conversion treatment for example, by immersing the anode body in the chemical conversion liquid, the surface of the anode body is impregnated with the chemical conversion liquid, and a voltage is applied between the anode body and the cathode immersed in the chemical conversion liquid. Can be done.
  • an aqueous phosphoric acid solution is preferably used as the chemical conversion solution.
  • the solid electrolyte layer 9 includes, for example, a manganese compound and a conductive polymer.
  • a conductive polymer for example, polypyrrole, polythiophene, polyaniline, and derivatives thereof can be used.
  • the solid electrolyte layer 9 may contain a dopant. More specifically, the solid electrolyte layer 9 can include poly (3,4-ethylenedioxythiophene) (PEDOT) as a conductive polymer and polystyrene sulfonic acid (PSS) as a dopant.
  • PEDOT poly (3,4-ethylenedioxythiophene)
  • PSS polystyrene sulfonic acid
  • the solid electrolyte layer 9 is formed by, for example, chemical polymerization and / or electrolytic polymerization of a raw material monomer on a dielectric layer.
  • the solid electrolyte layer 9 may be formed by attaching a treatment liquid containing a conductive polymer to the dielectric layer 7 and then drying it.
  • the treatment liquid may further contain other components such as a dopant.
  • the treatment liquid is a conductive polymer dispersion or solution. Examples of the dispersion medium (solvent) include water, an organic solvent, or a mixture thereof.
  • the carbon layer 11 only needs to have conductivity, and for example, is formed using a conductive carbon material such as graphite.
  • the silver paste layer 12 is formed using, for example, a composition containing silver powder and a binder resin (such as an epoxy resin).
  • the cathode lead layer 10 is obtained by sequentially forming the carbon layer 11 and the silver paste layer 12.
  • the electrolytic capacitor of the present invention is not limited to the electrolytic capacitor having the structure shown in FIG. 1, and can be applied to electrolytic capacitors having various structures.
  • the present invention can also be applied to an electrolytic capacitor using a sintered body (porous body) containing a valve metal as an anode body.
  • the electrolytic capacitor according to the present invention can be used in various applications that require high reliability even when exposed to a high temperature atmosphere.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)

Abstract

L'invention concerne un condensateur électrolytique comprenant : un élément condensateur ; un élément conducteur connecté électriquement à l'élément condensateur ; un élément boîtier pour étanchéifier une partie de l'élément condensateur et de l'élément conducteur ; et une couche d'isolation thermique ayant une performance d'isolation électrique et recouvrant au moins une partie de la surface de l'élément boîtier. La couche d'isolation thermique contient un oxyde métallique et/ou un hydroxyde métallique.
PCT/JP2017/043904 2017-01-31 2017-12-07 Condensateur électrolytique WO2018142758A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201780084311.2A CN110199368B (zh) 2017-01-31 2017-12-07 电解电容器
JP2018565969A JP7223968B2 (ja) 2017-01-31 2017-12-07 電解コンデンサ
US16/503,657 US11049663B2 (en) 2017-01-31 2019-07-05 Electrolytic capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017016300 2017-01-31
JP2017-016300 2017-01-31

Related Child Applications (1)

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US16/503,657 Continuation US11049663B2 (en) 2017-01-31 2019-07-05 Electrolytic capacitor

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WO2018142758A1 true WO2018142758A1 (fr) 2018-08-09

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JP (1) JP7223968B2 (fr)
CN (1) CN110199368B (fr)
WO (1) WO2018142758A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024058159A1 (fr) * 2022-09-13 2024-03-21 パナソニックＩｐマネジメント株式会社 Condensateur à électrolyte solide

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JPWO2018142758A1 (ja) 2019-11-21
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