WO2018137706A1 - 镜头和摄像模组及其制造方法 - Google Patents

镜头和摄像模组及其制造方法 Download PDF

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Publication number
WO2018137706A1
WO2018137706A1 PCT/CN2018/074319 CN2018074319W WO2018137706A1 WO 2018137706 A1 WO2018137706 A1 WO 2018137706A1 CN 2018074319 W CN2018074319 W CN 2018074319W WO 2018137706 A1 WO2018137706 A1 WO 2018137706A1
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WO
WIPO (PCT)
Prior art keywords
lens
camera module
chord
edge
base
Prior art date
Application number
PCT/CN2018/074319
Other languages
English (en)
French (fr)
Inventor
王明珠
赵波杰
刘春梅
陈飞帆
陈振宇
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201720107077.8U external-priority patent/CN206892433U/zh
Priority claimed from CN201710057589.2A external-priority patent/CN108363159B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to KR1020197021981A priority Critical patent/KR20190107679A/ko
Priority to EP18744975.6A priority patent/EP3575844A4/en
Priority to US16/479,403 priority patent/US11579341B2/en
Priority to JP2019539912A priority patent/JP6876812B2/ja
Priority to KR1020217043041A priority patent/KR102509125B1/ko
Publication of WO2018137706A1 publication Critical patent/WO2018137706A1/zh
Priority to US18/074,882 priority patent/US12007583B2/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/004Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having four lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/026Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B2003/0093Simple or compound lenses characterised by the shape

Definitions

  • the invention relates to the field of camera modules, and further relates to a lens and a camera module and a manufacturing method thereof, in particular to an ultra-narrow lens and a camera module, which greatly reduces the size of the camera module, and is compact for the smart device. It is convenient to use the camera module.
  • camera modules are already indispensable devices in smart devices. Moreover, the high performance of the camera module is the main direction for the improvement and development of smart devices, and is the key to the performance of smart devices.
  • the traditional lens and camera module is shown in Figure 1.
  • the conventional camera module includes at least one lens 10P, a lens barrel 20P, a lens holder 30P, and a circuit assembly 40P, wherein the lens 10P is a circular lens, and the lens barrel 20P is a cylindrical cylindrical structure.
  • the lens holder 30P has a square structure, and the circuit assembly 40P has a square shape.
  • the lens barrel 20P wraps and supports the lens 10P, so that the outer shape of the lens barrel 20P and the lens 10P correspond to each other, that is, the lens 22P and the
  • the lens barrel 20P is a complete circular shape.
  • the lens holder 30P and the circuit assembly 40P are both square, and the main photosensitive chip 41P in the circuit assembly 40P is also square.
  • Each of the lenses 10P has a circular light-passing portion and a non-light-transmitting portion. Therefore, a lot of light is not received by the circuit assembly 40P, but falls on the gold wire of the circuit assembly 40P. Pads, lines, mirror mounts, moldings, glues, etc., which are relatively smooth on the surface, return to the imaged area after multiple reflections to form stray light. Then, if it can be modified from the lens 10P, unnecessary portions are reduced, so that the lens barrel 20P, the lens holder 30P, and the circuit assembly 40P are correspondingly reduced in unnecessary portions, and the whole portion can be The size of the camera module is reduced in size.
  • the circuit assembly 40P is slightly larger than the photosensitive chip
  • the lens barrel 20P is sized corresponding to the circuit assembly 40P
  • the lens 10P and the circuit assembly 40P are sensitized.
  • the corresponding size of the chip can ensure the complete function of the camera module.
  • the conventional camera module leaves a lot of space for the circuit assembly 40P, especially for the photosensitive chip 41P to work stably and for a long time, and a lot of space is expanded in the circuit assembly 40P.
  • the conventional lens 10P uses a spacer or a light blocking plate to block unwanted light. However, the light still has a portion of refraction and reflection on the lens, forming stray light.
  • the number of lenses of the lens is increasing, for example, the number of lenses of 4p, 5p, 6p, 7p, etc.
  • the volume of the lens is also increasing, so the lens to the camera module
  • the influencing factors are also getting bigger and bigger, and the improvement of the lens is also more important.
  • Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the lens includes at least one de-branching lens, wherein the de-branching lens has at least one chord, an imaging area, and a non- An imaging zone through which the shape of the de-branching lens will be reduced, but does not affect the imaged area of the de-branching lens.
  • Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the camera module further includes a de-bounding lens barrel, a base, and a circuit component, wherein the de-striping lens barrel And the pedestal cooperates with the shape of the de-branching lens to effectively process light in the circuit assembly.
  • Another object of the present invention is to provide a lens and camera module and method of fabricating the same, wherein the chord of the lens reduces the effects from the non-imaged area while not affecting the imaged area.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, the edged lens further comprising at least one rounded edge, the difference in shape of the chord and the rounded edge can be reduced in the assembly Describe the difficulty of edged lenses.
  • Another object of the present invention is to provide a lens and a camera module, and a manufacturing method thereof, wherein the chord edge of the de-bound lens may be a straight line or an arc, and a circle with respect to the round side
  • the chord edge reduces the time and cost spent in the machining design of the mold, and significantly reduces the use of materials.
  • Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the corresponding processing yield of the chord of the demarcation lens is improved compared to the rounded edge.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, wherein the non-image area of the demarcation lens is much reduced compared to a conventional lens, and the light passing through the non-image area is also Correspondingly, the imaging effect and imaging efficiency are improved.
  • Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the de-branching lens barrel, the base, and the circuit assembly are The body shape is also correspondingly reduced, so that the overall camera module body size is narrowed.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, because the design of the chord edge of the de-branching lens, the shape of the de-bounding lens barrel and the pedestal Has a corresponding chord edge.
  • Another object of the present invention is to provide a lens and a camera module, and a manufacturing method thereof, wherein the corresponding position of the chord portion and the base of the de-bounding lens barrel may be linear or curved. Moreover, in order to manufacture the chord portion of the de-edged lens barrel, the apparatus and the mold used do not have to be round.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, in which the design and processing of the chord portion of the deframed lens barrel is time consuming compared to the conventional round type And the cost will be reduced, and the corresponding processing yield will be increased.
  • Another object of the present invention is to provide a lens and a camera module and a manufacturing method thereof, wherein the chord portion of the de-edged lens barrel and the corresponding cooperation of the pedestal facilitate assembly of the camera module , you can quickly determine the installation direction.
  • Another object of the present invention is to provide a lens and camera module and a method of fabricating the same that can be mounted more compactly by the reduction of the size of the deframed barrel and the base.
  • Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, the de-bounding lens being disposed corresponding to the photosensitive chip of the circuit component, and the non-imaging of the de-branching lens The size of the photosensitive chip of the circuit component is reduced, and the influence is correspondingly lowered.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, which are formed by injection molding once, and the string edges are formed correspondingly, so that the manufacturing cost is reduced and the production difficulty is reduced.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, the de-orientation lens barrel and other devices corresponding to the de-bounding lens are formed by injection molding, and the mold is also manufactured. There is a corresponding body shape with the lens.
  • Another object of the present invention is to provide a lens and a camera module and a manufacturing method thereof, which can be assembled by the corresponding de-branching lens, the de-branching lens barrel, the base and the circuit component. Convenient correspondence to simplify the assembly process.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, through the corresponding de-branching lens, the de-branching lens barrel, the base and the circuit component, the camera module
  • the size of the body is correspondingly reduced, achieving an ultra-narrow camera module compared to conventional techniques.
  • Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, wherein the lens is matched with a base design requirement, so that the size of the camera module can be miniaturized as a whole.
  • an aspect of the present invention provides a lens comprising: at least one de-branching lens, wherein the de-branching lens comprises at least one chord and at least one round, the chord and The rounded edges are adjacent, wherein the chord edges and the rounded edges have different curvatures.
  • the chord edge of the lens has a curvature of 0 and is a straight line segment.
  • the curvature of the rounded edge in the lens is >0, which is a curved line segment.
  • the chord is a straight line in the lens, and the rounded edge is an arc.
  • the number of the chord and the rounded edge in the lens is 1, and the curvature of the chord is 0, which is a straight line segment.
  • the number of the chord edges in the lens is 2, and each of the chord edges has a curvature of 0, which is a straight line segment.
  • the number of the chord edges in the lens is 2, the number of the round sides is 2, and the chord sides are symmetrically distributed.
  • the chord edge in the lens is a straight line segment.
  • the lens in the lens comprises a plurality of lenses, at least one of which is the de-bounded lens and at least one of which is a circular lens.
  • the dimension of the de-branching lens in the lens is larger than the circular lens.
  • the lens in the lens comprises four lenses, wherein the lens size increases sequentially, and wherein the lens having the largest size is the de-branching lens.
  • the lens of the lens includes a de-edged lens barrel, and the de-branching lens is mounted within the de-stained lens barrel.
  • the de-edged barrel of the lens includes a chord portion and a rounded portion, wherein the chord portion and the rounded portion have different cross-sectional edge curvatures.
  • the chord edge of the de-branching lens in the lens corresponds to the chord edge of the de-bounding lens barrel.
  • the demarcation lens in the lens is manufactured by one injection molding.
  • the lens includes at least one optical path component, wherein the optical path component is disposed adjacent to the lens to facilitate formation of a predetermined light path in the lens.
  • the outer edge shape of the optical path element of the demarcation lens in the lens is consistent with the shape of the de-bounded lens.
  • the optical path elements in the lens are a combination: one of a gasket, a gasket, and a coating.
  • a camera module including: a lens, wherein the lens includes at least one de-branching lens, wherein the de-branching lens includes at least one chord and at least one round, A chord edge and the rounded edge are adjacent, wherein the chord edge and the rounded edge have different curvatures; and a photosensitive member, wherein the lens is located in a photosensitive path of the photosensitive member.
  • the photosensitive module of the camera module includes at least one base, at least one photosensitive chip, and at least one circuit board, wherein the base is disposed on the circuit board to provide a mounting position.
  • the photosensitive chip is electrically connected to the circuit board, and the lens is located in a photosensitive path of the photosensitive chip.
  • the base of the camera module is integrally formed on the circuit board, and at least one light window is formed to provide a light path for the photosensitive chip.
  • the base of the camera module includes a base body and a supplementary base, and the quick base body has a notch, and the supplementary base complements the notch to form a closed The window.
  • the demarcation position of the lens in the camera module corresponds to the position of the supplementary base.
  • the base of the camera module is adhesively fixed to the circuit board.
  • the circuit board of the camera module includes a circuit board body and at least one electronic component, and the electronic component is disposed on the circuit board body, wherein the base is integrally formed on the circuit board a circuit board body and covering at least one of the electronic components.
  • the circuit board of the camera module includes a circuit board body and at least one electronic component, wherein at least one of the electronic components is disposed at a bottom of the circuit board body, and the base is integrated Formed on top of the main body of the circuit board.
  • the circuit board in the camera module has a sinking area, and the photosensitive chip is disposed in the sinking area.
  • the sinking area of the camera module selects one of a groove and a through hole.
  • the photosensitive chip in the camera module has a photosensitive area and a non-sensitive area, and the base integrally encapsulates at least a portion of the non-sensitive area.
  • the camera module of the camera module includes at least one filter element, wherein the base integrally encapsulates the filter element.
  • the camera module includes a shielding lens, and the shielding lens is located above the photosensitive chip and is integrally packaged by the base.
  • the occlusion lens in the camera module is the de-branching lens.
  • the camera module includes a lens carrying member, wherein the lens is mounted to the lens carrying member, and the lens carrying member is mounted to the base.
  • the lens carrying component of the camera module is a driving component to form a dynamic focus camera module.
  • the lens carrying component in the camera module is a lens fixing component to form a telephoto camera module.
  • the lens carrying member is integrally connected to the base, and the lens is mounted to the lens carrying member to form a certain focus module.
  • a plurality of the camera modules form an array camera module.
  • a lens comprising: at least one de-branching lens and a de-bounding lens barrel, the de-branching lens being mounted in the de-bounding lens barrel, wherein the de-edge
  • the lens includes at least one chord edge and at least one round edge, the chord edge and the round edge are adjacent to each other, wherein the chord edge and the round side have different curvatures
  • the de-bounding lens barrel comprises a a chord portion corresponding to the chord edge of the demarcation lens to facilitate reducing the volume of the lens.
  • a camera module including:
  • the lens includes at least one de-branching lens and a de-branching lens barrel, the de-branching lens being mounted in the de-staining lens barrel, wherein the de-branching lens comprises at least one string An edge and at least one rounded edge, wherein the chord edge and the rounded edge are adjacent, wherein the chord edge and the rounded edge have different curvatures, and the de-bounding lens barrel comprises a chord edge portion, a chord portion corresponding to the chord edge of the demarcation lens to facilitate reducing a volume of the lens;
  • a photosensitive member wherein the lens is located in a photosensitive path of the photosensitive member.
  • the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the base is disposed on the first plate body, and the chord edge of the demarcation lens is located near a side of the second plate body.
  • the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the pedestal is disposed on the first plate body, the chord edge of the demarcation lens and the chord edge portion of the de-bounding lens barrel are located adjacent to the second One side of the board.
  • the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the base is disposed on the first plate body, and the chord edge of the demarcation lens is located on a side away from the second plate body.
  • the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the pedestal is disposed on the first plate body, the chord edge of the demarcation lens and the chord edge portion of the de-stained lens barrel are located away from the second One side of the board.
  • the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the base is disposed on the first plate body, the demarcation lens comprises two chord edges, and one of the chord edges is located on a side close to the first plate body The other chord is located on a side away from the second plate.
  • the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the pedestal is disposed on the first plate body, the demarcation lens comprises two chord edges, and the edging lens barrel comprises two chord sides, one of The chord edge and the chord edge portion are located on a side close to the first plate body, and the other chord edge and the chord edge portion are located on a side away from the second plate body.
  • the base includes four sides, a first side, a second side, a third side, and a fourth side, the first side, the second side
  • the side edges, the third side edges and the fourth side edges are adjacent to each other to form a light window for providing light passage for the photosensitive chip, the first side is adjacent to the second plate body, the chord edge Located in the first side direction.
  • the first side has a width dimension that is smaller than a width dimension of the second side and the fourth side.
  • the base includes four sides, a first side, a second side, a third side, and a fourth side, the first side, the second side
  • the side edges, the third side edges and the fourth side edges are adjacent to each other to form a light window for providing light passage for the photosensitive chip
  • the first side is adjacent to the second plate body
  • the third side The side edges are opposite the first side edges, and the chord sides are located in the third side direction.
  • the width dimension of the second side is smaller than the width dimension of the second side and the four sides.
  • the base includes four sides, a first side, a second side, a third side, and a fourth side, the first side, the second side
  • the side, the third side, and the fourth side are sequentially adjacent to each other to form a light window, and provide light passage for the photosensitive chip
  • the first side is adjacent to the second board
  • the first side The three sides are opposite to the first side
  • one of the chords is located in the first side direction
  • the other chord is located in the third side direction.
  • the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for The electronic device is electrically connected, and the base is disposed on the first plate.
  • the circuit board includes at least one electronic component, the electronic component is disposed on the first board body, wherein the base body is integrally formed on the first board body, and covers at least one Electronic components.
  • the electronic component is selectively disposed on one side, two sides, three sides, and four sides of the four sides of the base.
  • the electronic component is disposed at the second side and the fourth side position.
  • the electronic component is disposed at the first side and the third side position.
  • the photosensitive chip is electrically connected to the first plate body through an electrical connection element
  • the base is integrally formed on the first plate body to cover the electrical connection element
  • the electrical connections are selectively disposed on two sides, three sides, or four sides of the four sides of the base.
  • the electrical connection element is disposed at a position corresponding to the second side and the fourth side.
  • the electrical connection element is disposed at a location corresponding to the first side and the third side.
  • FIG. 1 is an overall perspective view of a conventional camera module.
  • FIG. 2 is a perspective view of a camera module in accordance with a first preferred embodiment of the present invention.
  • FIG 3 is an exploded perspective view of a camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 4 is a schematic exploded view of a lens in accordance with a first preferred embodiment of the present invention.
  • Figure 5 is a schematic illustration of a lens design principle in accordance with a first preferred embodiment of the present invention.
  • Figure 6 is a schematic illustration of comparison of imaging light and conventional lens in accordance with a preferred embodiment of the first preferred embodiment of the present invention.
  • Figure 7 is a schematic view of a first modified embodiment of a lens in accordance with a first preferred embodiment of the present invention.
  • Figure 8 is a schematic illustration of a second modified embodiment of a lens in accordance with a first preferred embodiment of the present invention.
  • Figure 9 is a schematic view showing a third modified embodiment of the lens according to the first preferred embodiment of the present invention.
  • Figure 10 is a schematic view showing a fourth modified embodiment of the lens according to the first preferred embodiment of the present invention.
  • Figure 11 is a schematic view showing a fifth modified embodiment of the lens according to the first preferred embodiment of the present invention.
  • Figure 12 is a schematic illustration of a partially modified embodiment of a first preferred embodiment of the present invention.
  • Figure 13 is a schematic illustration of a camera module in accordance with a second preferred embodiment of the present invention.
  • Figure 14 is a schematic diagram of a camera module in accordance with a third preferred embodiment of the present invention.
  • Figure 15 is a schematic diagram of a camera module in accordance with a fourth preferred embodiment of the present invention.
  • Figure 16 is a schematic diagram of a camera module in accordance with a fifth preferred embodiment of the present invention.
  • Figure 17 is a schematic diagram of a camera module in accordance with a sixth preferred embodiment of the present invention.
  • Figure 18 is a schematic diagram of a camera module in accordance with a seventh preferred embodiment of the present invention.
  • Figure 19 is a schematic diagram of a camera module in accordance with an eighth preferred embodiment of the present invention.
  • Figure 20 is a schematic diagram of a camera module in accordance with a ninth preferred embodiment of the present invention.
  • Figure 21 is a camera module in accordance with a tenth preferred embodiment of the present invention.
  • Figure 22 is a camera module in accordance with an eleventh preferred embodiment of the present invention.
  • Figure 23 is a camera module in accordance with a twelfth preferred embodiment of the present invention.
  • Figure 24 is a schematic diagram of a camera module in accordance with a thirteenth preferred embodiment of the present invention.
  • 25A and 25B are schematic views of a camera module in accordance with a fourteenth preferred embodiment of the present invention.
  • 26A and 26B are schematic views of a camera module and a photosensitive member in accordance with a fifteenth preferred embodiment of the present invention.
  • FIGS. 27A and 27B are schematic views of a camera module and a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
  • 28A and 28B are schematic views of a camera module and a photosensitive member according to a seventeenth preferred embodiment of the present invention.
  • 29 is a schematic diagram of an array camera module in accordance with a fifteenth preferred embodiment of the present invention.
  • Figure 30 is a schematic diagram of an array camera module in accordance with a sixteenth preferred embodiment of the present invention.
  • Figure 31 is a schematic illustration of a lens manufacturing method in accordance with the above-described preferred embodiment of the present invention.
  • FIG. 32 is a schematic diagram of an application of a camera module in accordance with the above-described preferred embodiment of the present invention.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • the requirements for camera modules are becoming higher and higher, such as the development of smart phones in the direction of ultra-thin, large screen, borderless, and high image quality.
  • the camera module is composed of different components.
  • the simplification of the components is almost the ultimate, and further development, in addition to studying the possible improvements of each component, also considering the components. The relationship between the improved relationship.
  • a lens which can improve the lens of the camera module to reduce the body shape on the basis of ensuring the quality of the optical imaging; further, the lens and the remaining components, such as the photosensitive component
  • the structure between the two can be matched, so that the overall size of the camera module can be reduced, and the external shape is more consistent, which is more suitable for being mounted on an electronic device.
  • the camera module 100 includes a lens 10 and a photosensitive component 30, wherein the lens 10 is located in a photosensitive path of the photosensitive component 30, wherein the lens 10 is an ultra-narrow lens 10, which may also be referred to as a de-bounding lens. 10.
  • the lens 10 and the shape are matched with the shape of the photosensitive member 30, so that the camera module 100 becomes an ultra-narrow camera module 100.
  • the lens 10 includes at least one de-branching lens and a de-branching lens barrel 12, wherein the de-branching lens is mounted in the de-branching lens barrel 12.
  • the de-branching lens is mounted in the de-branching lens barrel 12.
  • the de-edged lens barrel 12 is removed from at least a portion of the circular edge of the circular lens barrel, so that the overall shape of the lens 10 is reduced, and the lens 10 and the de-branching shape are more suitable for other Component fit.
  • the de-edgering of the de-branching lens is relative to the rounded edge of the circular lens, that is, the at least partially rounded edge of the circular lens is removed or replaced such that the edge of the circular lens is Not a complete circle.
  • the lens 10 includes a plurality of lenses 11 including at least one of the de-branching lenses and at least one circular lens.
  • the number of de-branching lenses and the position of the de-branching lens can be selected as desired.
  • the circular lens and the de-branching lens are respectively mounted in the de-bounding lens barrel.
  • the lens 10 composed of the four lenses 11 is schematically illustrated as an example, and in other embodiments of the present invention, the number of the lenses 11 may be other, such as 2 pieces, 3 pieces, 5 pieces, and 5 pieces or more.
  • the shape of the corresponding lens 11 can also be designed according to specific needs, so that at least one of the lenses 11 is the de-branching lens.
  • one of the lenses 11 is a de-bounded lens, the remaining three are circular lenses, and the de-branching lens is at the bottom.
  • the number of the de-branching lenses may be other, such as 2, 3, and 4, and the position of the de-branching lens may also be 4 of the lenses.
  • 11 is selected as needed, and it should be understood by those skilled in the art that the present invention is not limited in this respect.
  • the four lenses 11 of the lens 10 are from the object side to the image side, respectively, a first lens 111, a second lens 112, and a third lens 113. And a fourth lens 114. And the body shape of the four lenses 11 is sequentially increased from the object side to the image side. That is, the closer the body shape of the lens 11 of the lens 10 is to the photosensitive member 30.
  • the fourth lens 114 has the largest body shape. It is worth mentioning that each of the lenses 11 is mounted in the de-stained lens barrel 12, and in the case where the axial dimensions of the de-stained lens barrel 12 are the same, the lens 11 having the largest body shape is determined.
  • the first lens 111, the second lens 112, the third lens 113 are circular lenses
  • the fourth lens 114 is the de-edge lens.
  • the other lenses 11 may be selected for de-edge design instead of the largest-sized lens 11 to be de-branching, and the present invention is not limited in this respect.
  • each of the lenses 11 are sequentially increased in shape, but in other embodiments of the invention, each of the lenses 11 may be other
  • the shape is arranged, such as a large arrangement, such as a lens in the middle, which is the smallest at the front end, and the largest at the bottom end, such as the smallest of the front end and the rear end all equal.
  • the bottom lens is the largest.
  • the photosensitive member 30 includes a photosensitive chip 31, wherein the lens 11 of the demarcation design is deburring according to the shape and size of the photosensitive chip 31. That is to say, the design of the de-branching lens is referenced by the photosensitive chip 31 to ensure the imaging quality of the camera module 100.
  • the design of the demarcation lens is designed with the shape and size of the photosensitive region of the photosensitive chip 31.
  • a de-marting design is performed.
  • the largest lens 11 in the lens 10 that is, the shape of the fourth lens 114 closest to the image side, according to the photosensitive chip 31.
  • the size is reduced.
  • the fourth lens 114 is reduced to a size corresponding to the photosensitive chip 31.
  • the demarcation lens of the lens 10 further includes at least one chord, that is, the fourth lens 114 includes a chord 1141.
  • the chord edge 1141 of the fourth lens 114 closest to the image side causes a corresponding reduction in the size of the fourth lens 114 relative to the complete circular lens. That is, the fourth lens 114 with the chord 1141 is smaller than the body shape of the corresponding circular lens.
  • the chord 1141 of the fourth lens 114 is an edge portion formed by a line segment of a non-original circle in a circular cross-sectional view of the fourth lens 114. .
  • the fourth lens 114 of the lens 10 further includes at least one rounded edge 1142.
  • the chord 1141 of the fourth lens 114 may be not only a straight segment but also a curved segment or any line segment of the photosensitive chip 31 of the photosensitive component 30. Depending on the complete circular lens, the chord 1141 can also be understood as the edge of the missing lens 11 relative to the complete circle. The chord edge 1141 then plays a key role in reducing the shape of the fourth lens 114 and the lens 10.
  • the edge of the de-branching lens is composed of at least two line segments of different curvatures adjacent to each other such that the edge of the de-bounded lens 11 is not a complete circle. That is, the chord edge 1141 and the rounded edge 1142 are adjacent to each other to form an edge of the lens 11, and the chord edge 1141 and the rounded edge 1142 have different curvatures.
  • the curvature of the chord edge 1141 is 0, that is, a straight line segment
  • the curvature of the rounded edge 1142 is >0, that is, a circular arc segment.
  • FIG. 11 A schematic view of the overall lens 11 is then shown in FIG.
  • the fourth lens 114 closest to the image side has one of the chord 1141 and one of the rounded edges 1142.
  • the lens 11, the second lens 112, and the third lens 113 each have one of the rounded edges 1142. That is, the first lens 11, the second lens 112, and the third lens 113 are circular lenses, and the fourth lens 114 is a de-sided lens that goes to one side.
  • the fourth lens 114 composed of one of the chord sides 1141 and one of the round sides 1142 is taken as an example to illustrate the de-branching lens.
  • Structural design, and in other embodiments of the present invention, the number and shape, layout, and the like of the chord 1141 and the rounded edge 1142 may be other ways, and the present invention is not limited in this regard.
  • the size and position of the chord edge 1141 and the rounded edge 1142 can be set according to different requirements, such as symmetric setting, asymmetric setting, setting according to a predetermined proportion, and the like, and the invention is not limited in this respect.
  • the lens 10 includes at least one optical path component 13 disposed between adjacent ones of the lenses 11 to form a predetermined light path between the lenses 11.
  • the optical path component 13 can be a gasket, a gasket, a coating, or the like.
  • the outer edge shape of the optical path element 13 coincides with the outer shape of the lens 11 to facilitate occlusion of the corresponding edge of the lens 11.
  • Each of the lenses 11 and the optical path elements 13 are disposed at intervals in the interior of the de-intersecting barrel 12.
  • the number of the lenses 11 is four, and correspondingly, the number of the optical path elements 13 is three, respectively a first optical path element 131, a second optical path element 132 and Three light path elements 133.
  • the first optical path component 131 is disposed between the first lens 111 and the second lens 112, and the outer shape of the first optical path component 131 and the outer shape of the second lens 112 are identical.
  • the second optical path element 13 is disposed between the second lens 112 and the third lens 113, and an outer shape of the second optical path element 13 coincides with an outer shape of the third lens 113.
  • the third optical path component 13 is disposed between the third lens 113 and the fourth lens 114, and an outer shape of the third optical path component 13 is identical to an outer shape of the fourth lens 114. That is, in this embodiment, the first optical path component 131 and the second optical path component 132 are externally circular optical path components, and the third optical path component 133 is a de-edge optical path component, that is, With at least a straight edge and at least one curved edge.
  • each of the lenses 11 is integrally formed during manufacture.
  • the shape of the lens 11 can preferably be molded once by injection molding.
  • the time and cost of the chord edge 1141 in the processing design of the mold is reduced, and the material used is remarkably reduced.
  • the lens 11 of a desired shape can be obtained after injection molding by changing the shape of the mold injection space.
  • the optical path component 13 and the demarcation lens barrel 12 used for assembly need to be obtained by custom molding a mold according to this shape.
  • the chord 1141 has a certain guiding effect, and the lens 11 can be positioned according to the position of the chord 1141.
  • the aperture of the lens 10 is determined by the smallest of the lens 11 and the optical path element 13. That is to say, a large portion of the lens 11 closest to the image side as in Fig. 5 is small for imaging.
  • the chord 1141 is employed, as shown in Fig. 6, not only the shape of the lens 11 and the lens 10 but also the utilization ratio of the lens 11 closest to the image side is improved.
  • the fourth lens 114 closest to the image side is taken as an example. Under the action of the optical path component 13, the fourth lens 114 correspondingly forms an imaging area 1143 and a non-image area 1144.
  • the image forming area 1143 corresponding to the photosensitive chip 31 of the photosensitive member 30 is a main area where light is received, wherein the non-image forming area 1144 blocks light from passing through, and a small amount of light passing through does not perform photosensitivity. That is to say, the imaging area 1143 of the lens 11 provides the basis for the main imaging function of the camera module 100.
  • the function of the optical path component 13 is to block the light of the edge of each of the lenses 11 to form a predetermined optical path, and to reduce the stray light in the periphery.
  • the optical path component 13 is not It is completely opaque and the edge light is not completely blocked. That is, the non-imaged area 1144 has less light passing through the imaging area 1143 of the lens 11.
  • the light passing through the non-imaged area 1144 is reflected at other portions of the photosensitive member 30, such as the base 33, the circuit board 32, the electrical connection element 313, etc., which are subsequently proposed, after reflection.
  • the light is received by the photosensitive chip 31, that is, stray light that affects the image quality of the photosensitive chip 31.
  • the fourth lens 114 of the chord 1141 is used, as shown in FIG. 6, the light intensity of the non-image area 1144 is weakened, and the formed stray light is also reduced.
  • the imaging effect of the camera module 100 will be improved. From the viewpoint of the imaging effect, a gradually weakened edge is formed in the imaging circle of the lens 10. That is to say, the de-edge design of the lens 11 is such that the intensity of the partial region of the non-imaged area 1144 is weakened, the influence of stray light is reduced, and the imaging effect is not affected or less affected.
  • the chord edge 1141 of the lens 11 does not affect the imaging area 1143, and the function of the camera module 100 will also be guaranteed to be complete.
  • chord edge 1141 of the lens 11 causes the imaging area 1143 not to lose a portion correspondingly, but correspondingly an edge with gradually reduced brightness and imaging quality appears.
  • the proportion of the non-imaged area 1144 domain is reduced, and the effective imaging area 1143 is concentrated to a smaller portion corresponding to the photosensitive chip 31, without changing or changing the image quality.
  • the body shape of the lens 11 is reduced, while reducing the amount of light that is incident on the non-imaged area 1144, directly reducing the source of stray light.
  • the chord 1141 of the lens 11 should be coincident with the periphery of the photosensitive chip 31 of the photosensitive member 30, which greatly reduces the The lens 11 and the body shape of the lens 10.
  • the fourth lens 114 closest to the image side also requires a certain margin during assembly, so there is also a certain amount of the non-imaged area 1144.
  • the optical path component 13 and the demarcation lens barrel 12 need to be designed and manufactured according to the shape according to the shape of the lens 11.
  • the optical path component 13 and the de-bounding lens barrel 12 are obtained by post-molding of a custom mold.
  • the de-edged barrel 12 further includes at least one chord portion 121 and at least one rounded portion 122 corresponding to the chord edge 1141 and the rounded edge 1142 of the de-branching lens, respectively.
  • the chord edge 1141 is linear
  • the chord portion 121 is correspondingly linear. Similar to the manufacture of the chord 1141 of the lens 11, the linear chord portion 121 is reduced in time and cost in processing the device and the mold relative to the circular curved edge.
  • the lens 10, the de-branching lens barrel 12, the subsequently proposed lens-carrying element 20, and the photosensitive member 30 in the preferred embodiment are all in a straight or square shape, in the design and manufacturing process. The unity has been unified, which makes the production difficulty less, and the corresponding processing yield can be greatly improved.
  • the number and position of the chord portion 121 of the de-edged lens barrel 12 and the chord edge 1141 of the demarcation lens correspond to the chord edge when the number of the chord sides 1141 is other
  • the position, shape and number of the portions 121 also change accordingly.
  • chord portion 121 of the de-bounding lens barrel 12 is a flat surface
  • the rounded edge portion 122 of the demarcation lens barrel 12 is a curved surface. That is, it can be seen from the top view of the de-edged lens barrel 12 that the top view of the de-stained lens barrel 12 is a closed curve composed of a circular arc and a straight line, and the de-edge is performed at this time.
  • the shape of the lens barrel 12 coincides with the shape of the top view of the fourth lens 114. It is worth mentioning that since the de-edged lens barrel 12 has a certain wall thickness, the consistency here is not the same size.
  • the number, position, and layout of the chord portion 121 and the rounded portion 122 of the de-edged lens barrel 12 may be other, such as 2 the chord The rounded side portions 122 and 3, the rounded side portions 122 and 3, the rounded side portions 122, 4, the chord portion 121 and the rounded portion 122, and the like.
  • the proportional size and position of the chord portion 121 and the rounded portion 122 may be set according to different requirements, such as symmetrically arranged, asymmetrically arranged, set in a predetermined proportion, and the like, and the present invention is not limited in this respect.
  • chord edge 1141 of the de-branching lens corresponds to the chord portion 121 of the de-bounding lens barrel 12
  • the rounded edge 1142 of the de-branching lens and The rounded edge portion 122 of the de-bounding lens barrel 12 corresponds to the relative position of the lens 11 and the de-stained lens barrel 12, thereby facilitating the installation of the lens 11 and facilitating the installation.
  • the demarcation design of the lens 11 facilitates the positioning of the lens 11, while in conventional circular lenses and circular barrels, there is no defined relative position between the lens and the barrel.
  • chord portion 121 of the de-edged lens barrel 12 can be matched with the photosensitive member 30, so that the overall edge of the camera module 100 is reduced, and subsequent This advantage will be explained in detail.
  • the camera module 100 includes a filter element 40 for filtering light passing through the lens 10.
  • the filter element 40 is exemplified by, but not limited to, an infrared cut filter, a blue glass filter, a wafer level infrared cut filter, a full transparency, and a visible light filter.
  • the filter element 40 is mounted to a complementary support 332 (subsequently proposed) located in the light path of the photosensitive chip 31.
  • the camera module 100 further includes a lens carrying member 20, the lens 10 is mounted on the lens carrying member 20, and the lens carrying member 20 is mounted on the base 33 such that the lens 10 is located
  • the photosensitive path of the photosensitive chip 31 can be implemented as a lens fixing component or a driving component to form a fixed focus camera module 100 or a moving focus camera module 100, respectively.
  • the drive components are by way of example and not limited to piezoelectric motors, voice coil motors.
  • the lens carrying member 20 is implemented as a driving member, the lens carrying member 20 is electrically connected to the photosensitive member 30, such as by a pin, a lead, or the like, to be electrically connected to the photosensitive member 30.
  • the photosensitive member 30 further includes a circuit board 32 and a base 33, the photosensitive chip 31 is electrically connected to the circuit board 32, and the base 33 is disposed on the The circuit board 32 is adapted to provide a mounting position to form a back focus required by the camera module 100.
  • the base 33 is integrally connected to the circuit board 32.
  • the base 33 includes a base body 331 and has a light window 333.
  • the light window 333 provides a light path for the photosensitive chip 31.
  • the photosensitive chip 31 is located inside the light window 333, and the photosensitive path of the photosensitive chip 31 is aligned with the light window 333.
  • the circuit board 32 includes a circuit board main body 321 and at least one electronic component 322 electrically connected to the circuit board main body 321 to facilitate transmitting photosensitive information to the circuit board 32.
  • the lens 10 is located
  • the photosensitive path of the photosensitive chip 31 is sensitized so that the photosensitive chip 31 receives light.
  • the photosensitive chip 31 may be disposed on the circuit board main body 321 through a surface mount technology (SMT), and electrically connected to the circuit through at least one electrical connection element 313.
  • SMT surface mount technology
  • the electrical connection element 313 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a solder, a conductive paste, or the like.
  • the electronic component 322 is disposed on the circuit board main body 321 .
  • the electronic component 322 is mounted on the circuit board main body 321 by an SMT process.
  • the electronic component 322 includes, but is not limited to, a resistor, a capacitor, a driving device, and the like.
  • the pedestal 33 is integrally packaged in the circuit board main body 321 and integrally wrapped around the electronic component 322, thereby preventing dust and debris from being similar to the conventional camera module 100.
  • the photosensor chip 31 is contaminated on the electronic component 322 to affect the imaging effect.
  • the electronic component 322 is buried in the circuit board main body 321 , that is, the electronic component 322 may not be exposed.
  • the electronic component 322 is disposed around the photosensitive chip 31, and in different embodiments, the setting position of the electronic component 322 can be designed and arranged according to needs.
  • the shape of the seat 332 is matched to more rationally utilize the spatial position on the circuit board main body 321 to minimize the size of the camera module 100.
  • the circuit board main body 321 of the circuit board 32 may be a PCB hard board, a PCB soft board, a soft and hard bonding board, a ceramic circuit board main body 321 and the like. It should be noted that, in this preferred embodiment of the present invention, since the base body 331 can completely cover the electronic components 322, the electronic components 322 may not be buried in the circuit board main body 321, The board main body 321 is only used to form a conduction line, so that the finally obtained photosensitive member 30 can be made smaller in thickness.
  • the base body 331 is disposed on the circuit board 32 by integral molding, such as molding, thereby stabilizing the base 33 and the circuit board 32.
  • the ground is fixed and the additional mounting and fixing process is reduced. For example, the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the unit of the camera module 100 is lowered.
  • the base 33 may be integrally formed on the circuit board 32 by mold molding, such as molding in a circuit board, which is different from the conventional COB (Chip On Board) method.
  • mold molding such as molding in a circuit board, which is different from the conventional COB (Chip On Board) method.
  • COB Chip On Board
  • the shape of the molding and the flatness of the surface can be better controlled, for example, such that the base body 331 has a better flatness, thereby being a mounted component, such as the lens carrying member 20,
  • the filter element 40 provides a flat mounting condition to help improve the optical axis uniformity of the camera module 100.
  • Each of the electronic components 322 may be attached to an edge region of the circuit board 32, such as outside the photosensitive chip 31, by being spaced apart from each other by, for example, an SMT process.
  • each of the electronic components 322 may be located on the same side or opposite sides of the circuit board 32.
  • the photosensitive chip 31 and each of the electronic components 322 may be respectively Located on the same side of the circuit board 32, and the photosensitive chip 31 is mounted on the chip mounting area of the circuit board 32, and each of the electronic components 322 are respectively mounted on the circuit board at a distance from each other.
  • the base body 331 covers each of the electronic components 322 after molding to isolate adjacent electronic components 322 and isolate the electronic components 322 from the photosensitive chip 31 by the base body 331.
  • the manner in which the base member 331 covers each of the electronic components 322 after molding has many advantages.
  • the base body 331 covers each of them.
  • the electronic component 322 is configured to prevent mutual interference between the adjacent electronic components 322, and the camera module 100 can be ensured even when the distance between the adjacent electronic components 322 is relatively close.
  • the image quality is such that a small number of the electronic components 322 can be mounted on the circuit board 32 of a small area, so that the structure of the camera module 100 is more compact, which is beneficial to the control station.
  • the imaging quality of the camera module 100 is improved based on the size of the camera module 100.
  • the base body 331 covers each of the electronic components 322 so as to be horizontally or in a height direction.
  • the base body 331 covers each of the electronic components 322 such that no glue is used for connection and leveling between the base body 331 and the circuit board 32 to facilitate the reduction of the The height dimension of the camera module 100.
  • the base body 331 covers each of the electronic components 322. During the subsequent transportation and assembly of the camera module 100 to form the camera module 100, the base body 331 can be prevented. The electronic component 322 is shaken and detached, thereby facilitating the structural stability of the camera module 100.
  • the base body 331 covers each of the electronic components 322, and in the process of subsequently transporting and assembling the camera module 100 to form the camera module 100, it can prevent pollutants from contaminating each of the devices.
  • the electronic component 322 is described to ensure the imaging quality of the camera module 100.
  • the electronic component 322 can be insulated from the air. In this manner, the oxidation speed of the metal portion of the electronic component 322 can be slowed down, which is beneficial to improve. Environmental stability of the electronic component 322 and the camera module 100.
  • the base body 331 is integrally formed on the circuit board main body 321 and covers the electronic component 322 of the circuit board 32 such that the base body 331 and the circuit board
  • the main body 321 has a large connecting area, and the connection is more stable, and has a better structural strength by means of an integral molding. Therefore, the base body 331 can firmly and reliably support and fix components of the camera module 100. Thereby ensuring the yield of the product.
  • the number of the lenses 11 of the lens 10 is increasing, for example, up to 4p, 5p, 6p, and 6p, etc., and when the lens of the camera module 100 lens 10 is When the number of 11 increases, it is necessary to meet the requirements of optical performance, such as providing sufficient back focus to prevent the filter element 40 from affecting the imaging quality of the camera module 100, such as black spots, edges, etc.
  • the filter element 40 is mounted on the integrally formed base 33 so that the filter element 40 can be provided with flat mounting conditions and can pass through the base The height of 33 effectively controls the height position at which the filter element 40 is mounted.
  • the photosensitive chip 31 has a photosensitive area 311 for performing photosensitivity, and a non-sensitive area 312312 for electrically connecting to the circuit board 32.
  • the non-photosensitive region 312 is electrically connected to the circuit board 32 by the electrical connection element 313.
  • the photosensitive chip 31 is located inside the base body 331, that is, not integrally encapsulated by the base body 331.
  • the photosensitive chip 31 needs to be attached to the circuit board 32, such as glue bonding, so that the photosensitive chip 31 is stably fixed, and then the photosensitive chip 31 is passed.
  • the electrical connection component 313 is electrically connected to the circuit board 32, such as by way of a gold wire, to the circuit board 32.
  • the manner in which the photosensitive chip 31 is disposed on the circuit board 32 may be performed by other means, such as embedding, sinking, FC (Flip Chip, flip chip), and the like. It should be understood by those skilled in the art that the connection and mounting manner of the photosensitive chip 31 and the circuit board 32 are not limited by the present invention.
  • the base 33 further includes a complementary support 332 that is supplemented to the base body 331 to form the closed light window 333.
  • the base body 331 has a mounting groove 3311 communicating with the light window 333.
  • the supplemental support 332 is mounted to the mounting slot 3311 to facilitate providing a mounting location for the filter element 40.
  • the base body 331 has at least one notch 3312.
  • the notch 3312 communicates with the optical window 333 and the outside, and the supplementary support 332 is supplemented by the notch 3312, thereby forming the light window 333 whose side is closed.
  • the base body 331 is not a closed structure but an open structure, and the base body 331 is closed by supplementation of the complementary support 332.
  • the base body 331 may also be a closed structure.
  • the notch 3312 extends down to the circuit board body 321.
  • the supplementary support 332 includes at least one seat body 3321 and an extending leg 3322 extending integrally from the seat body 3321 to the circuit board main body 321 so as to be the notch 3312. Closed.
  • the extension legs 3322 are joined to the circuit board body 321 and/or the base body 331 by adhesive bonding.
  • the holder body 3321 is mounted to the mounting groove 3311.
  • chord portion 121 of the de-edged barrel 12 corresponds to the position of the extended leg 3322 of the complementary holder 332, thereby In the direction in which the extension legs 3322 are located, the edges may be narrower.
  • the electronic component 322 can be disposed centrally on a side where the base body 331 is located, such as a side opposite the extended leg 3322, such that the side on which the extended leg 3322 is located There is no need to provide the electronic component 322, and it is not necessary to reserve the mounting position of the electronic component 322, that is, the photosensitive chip 31 is closer to the edge of the circuit board main body 321 , and the extended leg 3322 is
  • the shape may be formed by other means, such as injection molding, so that the thickness of the extending leg 3322 may be smaller relative to the wall thickness of the base body 331, and the chord portion of the de-edged barrel 12 121 is also a narrowing direction, so that the two cooperate with each other, so that the overall size of the camera module 100 is smaller.
  • the pedestal 33 can take many advantages in the integral molding manner, including the advantage of making the size of the pedestal 33 inwardly reduced, that is, in the absence of In the case of the supplementary support 332, the lens 10 cooperates with the reduced base 33, and the size of the camera module 100 can still be reduced.
  • the size of the base 33 is reduced, and the lens 10 and/or the lens carrying member 20 need to be mounted to the base 33, so the base
  • the seat 33 needs to provide a sufficient mounting area, so that the size of the base 33 cannot be too small compared to the conventional larger-sized lens 10, that is, the size of the base 33 is reduced by the conventional lens 10. Size limit.
  • the de-edge design of the lens 10 is such that the overall size of the lens 10 is reduced, and the mounting requirement of the base 33 is reduced, so that the base 33 can be further Miniaturization, it can be seen that the design of the lens 10 and the susceptor 33 or the photosensitive member 30 cooperate with each other, so that the overall size of the camera module 100 can be further miniaturized, and a separate miniaturization
  • the lens 10 or the miniaturization of the photosensitive member 30 achieves a similar effect.
  • the base body 331 has an inner side wall having an inclined angle to facilitate mold manufacturing and reduce stray light reflection to the photosensitive chip 31.
  • the incident angle of the light reaching the base body 331 is large, so that the reflection angle of the light is large, and it is relatively easy to reflect toward the inside, that is, to the position of the photosensitive chip 31. reflection.
  • the inner side wall is inclined, the incident angle of the light is small, and the light incident in the same direction is offset from the position of the photosensitive chip 31 in the direction of the reflected light, so that the oblique arrangement helps to reduce the interference of stray light.
  • the magnitude of the tilt angle can be set as desired.
  • the inner side wall of the base body 331 may be vertically disposed, that is, the tilt angle is not present.
  • FIG. 7 through 9 there are different variant embodiments of the lens 10 in accordance with a first preferred embodiment of the present invention.
  • the chord edge 1141 and the rounded edge 1142 of the edge removing lens 11 are illustrated in these embodiments.
  • the demarcation lens of the lens 10 that is, the fourth lens 114, includes two of the chord sides 1141 and the two round sides 1142. That is, the demarcation lens is narrowed at both edge positions relative to the circular lens.
  • the two chord edges 1141 can be symmetrically distributed.
  • the de-edged barrel 12 includes two chord portions 121 and two rounded portions 122.
  • the chord portions 121 are symmetrically disposed.
  • the de-edged lens barrel 12 is de-bounded in two directions, so that the two positions of the lens 10 are narrowed.
  • the curvature of the two chord edges 1141 of the fourth lens 114 is zero, and the curvature of the two circular edges 1142 is >0. That is, the two chord sides 1141 are straight lines, and the two round sides 1142 are circular arc lines.
  • chord portion 121 of the de-edged lens barrel 12 and the outer edge of the rounded edge portion 122 correspond to the chord edge 1141 and the rounded edge 1142, respectively.
  • the demarcation lens of the lens 10 that is, the fourth lens 114, includes three of the chord sides 1141 and three of the round sides 1142. That is, the demarcation lens is narrowed at three edge positions relative to the circular lens.
  • the three chord edges 1141 can be symmetrically distributed.
  • the de-edged barrel 12 includes three of the chord portions 121 and three of the rounded portions 122.
  • the three chord portions 121 are symmetrically disposed.
  • the de-edged lens barrel 12 is deburring in three directions, thereby narrowing the three positions of the lens 10.
  • the curvature of the three chord edges 1141 of the fourth lens 114 is zero, and the curvature of the three round edges 1142 is >0. That is to say, the three chord sides 1141 are straight lines, and the three round sides 1142 are circular arc lines.
  • chord portion 121 of the de-edged lens barrel 12 and the outer edge of the rounded edge portion 122 correspond to the chord edge 1141 and the rounded edge 1142, respectively.
  • the demarcation lens of the lens 10 that is, the fourth lens 114, includes four of the chord sides 1141 and four of the round sides 1142. That is, the demarcation lens is narrowed at four edge positions relative to the circular lens.
  • the four chord edges 1141 may be symmetrically distributed.
  • the de-edged barrel 12 includes four of the chord portions 121 and four of the rounded portions 122.
  • the four chord portions 121 are symmetrically disposed.
  • the de-edged lens barrel 12 is deburring in four directions, thereby narrowing the four positions of the lens 10.
  • the curvature of the four chord edges 1141 of the fourth lens 114 is zero, and the curvature of the four round edges 1142 is >0. That is to say, the four chord sides 1141 are straight lines, and the four round sides 1142 are circular arc lines.
  • chord portion 121 of the de-edged lens barrel 12 and the outer edge of the rounded edge portion 122 correspond to the chord edge 1141 and the rounded edge 1142, respectively.
  • the lens 10 in accordance with a first preferred embodiment of the present invention.
  • the number of the demarcation lenses in the lens 10 is illustrated as being variable.
  • the two lenses 11 in the lens 10 are de-bordered.
  • the third lens 113 and the fourth lens 114, respectively, and the third lens 113 and the fourth lens 114 respectively include a chord 1141 and a rounded edge 1142.
  • the two deframed lenses 11 can also be any other two lenses 11.
  • the number of the chord edges 1141 and the rounded edges 1142 may also be other, such as the numbers shown in Figures 7-9.
  • the inner shape of the de-edgering barrel 12 changes according to the shape of the lens 11.
  • the deframed lens 11 can also be any other three lenses 11.
  • the number of the chord edges 1141 and the rounded edges 1142 may also be other, such as the numbers shown in Figures 7-9.
  • the inner shape of the de-edged lens barrel 12 changes according to the shape of each of the lenses 11.
  • the lens 10 can be attached to the lens carrying member 20 by adhesive bonding, and in particular, the de-stained lens barrel 12 is flat outside without a threaded structure.
  • the deframed lens barrel 12 has a thread externally, that is, the lens 10
  • the lens-carrying element 20 having a threaded structure can be applied after being de-bordered.
  • FIG. 13 it is a camera module 100 according to a second preferred embodiment of the present invention.
  • the electronic component 322 is disposed at the bottom of the circuit board body 321. Therefore, it is not necessary to reserve the installation space of the electronic component 322 on the top of the circuit board main body 321, so that the design of the base main body 331 and the supplementary support 332 can be more flexible, so that the circuit board The requirements of the main body 321 are continuously reduced, and the lens 10 can be de-bounded accordingly, so that the overall size of the camera module 100 is reduced.
  • the illustrated base body 331 integrally encapsulates the electronic component 322 on the back side of the circuit board body 321 such that the illustrated electronic component 322 is wrapped.
  • FIG. 14 it is a camera module 100 according to a third preferred embodiment of the present invention.
  • the electronic component 322 is disposed on the back surface of the circuit board main body 321 .
  • the pedestal 33 is attached to the circuit board main body 321 by bonding, that is, a conventional pedestal can be applied to such an embodiment, but since it is not necessary to reserve the spatial position of the electronic component 322, Therefore, the size of the susceptor 33 can be reduced, and the lens 10 can be de-edgered, so that the size of the camera module 100 is reduced.
  • a molded base may be provided to cover the electronic component 322. That is, the electronic component located on the back surface of the circuit board main body 321 is packaged by integral molding, thereby making the assembly more stable.
  • the base 33 includes a base body 331 and has a light window 333.
  • the base body 331 is integrally formed on the circuit board 32 to form the light window 333.
  • the base body 331 is a closed structure, that is, the base body 331 is not There is the gap 3312.
  • the base body 331 has a mounting groove 3311, and the filter element 40 is mounted to the mounting groove 3311.
  • the base 33 includes a base body 331 and a complementary support 332.
  • the base body 331 is integrally formed on the circuit board 32 to form the light window 333.
  • the base body 331 is a closed structure, that is, the base body 331 is not There is the gap 3312.
  • the base body 331 has a mounting groove 3311 to which the complementary holder 332 is mounted, and the filter element 40 is mounted to the supplementary base 33.
  • the supplemental mount 332 does not have the extension leg 3322, that is, the supplemental mount 332 is not directly coupled to the circuit board 32.
  • the supplementary support 332 is sunk in the light window 333 such that the filter element 40 is closer to the photosensitive chip 31, and the back focus of the camera module 100 is reduced.
  • the circuit board main body 321 has a sinking area 3211, and the photosensitive chip 31 is sunkenly disposed in the sinking area 3215, so as to reduce the photosensitive chip 31 and the The relative height of the board body 321 is described.
  • the sinker region 3215 can be implemented as a groove or a through hole. That is to say, the spaces on both sides of the circuit board main body 321 can be made not to communicate or communicate.
  • the photosensitive chip 31 is disposed at the bottom of the groove, and is electrically connected to the circuit board main body 321 through the electrical connection member 313.
  • the outer end of the electrical connection element 313 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outside of the sinker zone 3215, and the invention is not limited in this respect.
  • the top surface of the photosensitive chip 31 may coincide with the top surface of the circuit board main body 321 or be higher than the top surface of the circuit board main body 321 or lower than the top surface of the circuit board main body 321 That is, the present invention does not limit the sinking depth.
  • the sinker region 3215 is a through hole, that is, both sides of the circuit board 32 are communicated through the through hole.
  • the circuit board 32 of the camera module 100 includes a bottom plate 323 disposed on the bottom of the circuit board main body 321 so as to support the photosensitive chip 31 and enhance the structural strength of the circuit board main body 321 . That is, the photosensitive chip 31 is sunk and disposed in the sinker region 3215, and is supported by the bottom plate 323.
  • the photosensitive chip 31 is electrically connected to the circuit board main body 321 through the electrical connection element 313.
  • the bottom plate 323 may be a metal plate disposed on the bottom of the circuit board main body 321 by attaching.
  • FIG. 18 it is a camera module 100 according to a seventh preferred embodiment of the present invention.
  • the pedestal 33 of the photosensitive component 30 of the camera module 100 integrally encapsulates at least a portion of the non-photosensitive region 312 of the photosensitive chip 31.
  • the susceptor 33 integrally encapsulates the circuit board 32 and the photosensitive chip 31 such that the photosensitive chip 31 is stably fixed and the moldable area of the susceptor 33 is increased.
  • the base 33 encloses the electrical connection element 313.
  • the manner in which the susceptor 33 can be integrally molded can be expanded in a manner of molding on the photosensitive chip.
  • the holder 33 and the circuit board 32 and the photosensitive chip 31 are more stably connected, and the top portion may be other components such as the lens 10, the lens carrying member 20, etc., providing a larger mountable area.
  • the electrical connection component 313 is covered by the base 33 to avoid external interference with the electrical connection component 313, and prevents the electrical connection component 313 from oxidizing or contaminating dust to affect the imaging quality of the camera module 100. .
  • the base 33 includes a support member 334 for supporting the mold during manufacture to prevent damage to the circuit board or the photosensitive chip 31. That is, during the manufacturing process, the manufacturing mold can be abutted against the support member 334 such that the mold does not directly contact the circuit board or the photosensitive chip 31, and the molding material is prevented from overflowing to the inside. flow.
  • the support member 334 may have an annular structure conforming to the shape of the base body 331.
  • the support element 334 has elasticity, such as, but not limited to, a glue coating or a pad.
  • FIG. 19 it is a camera module 100 according to an eighth preferred embodiment of the present invention.
  • the circuit board main body 321 has a sinking region 3215, and the photosensitive chip 31 is sunkenly disposed in the sinker region 3215 to facilitate lowering the photosensitive chip 31 and the circuit board main body.
  • the relative height of 321 is a part of the circuit board main body 321 .
  • the sinker region 3215 can be implemented as a recess or a through hole. That is to say, both sides of the circuit board main body 321 may be disconnected or communicated.
  • the sinker region 3215 is a groove
  • the photosensitive chip 31 is disposed at the bottom of the groove, and is electrically connected to the circuit board main body 321 through the electrical connection member 313.
  • the outer end of the electrical connection element 313 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outside of the sinker zone 3215, and the invention is not limited in this respect.
  • the top surface of the photosensitive chip 31 may coincide with the top surface of the circuit board main body 321 or be lower than the top surface of the circuit board main body 321 or higher than the top surface of the circuit board main body 321 That is, the present invention does not limit the sinking depth.
  • the sinker region 3215 is a through hole, that is, the space on both sides of the circuit board 32 communicates through the through hole.
  • the pedestal 33 of the photosensitive component 30 of the camera module 100 integrally encapsulates at least a portion of the non-photosensitive region 312 of the photosensitive chip 31.
  • the susceptor 33 integrally encapsulates the circuit board and the photosensitive chip 31 such that the photosensitive chip 31 is stably fixed and the moldable region of the susceptor 33 is increased.
  • the base 33 encloses the electrical connection element 313.
  • the manner in which the susceptor 33 can be integrally molded can be expanded in a manner of molding on the photosensitive chip.
  • the holder 33 and the circuit board 32 and the photosensitive chip 31 are more stably connected, and the top portion may be other components such as the lens 10, the lens carrying member 20, etc., providing a larger mountable area.
  • the electrical connection component 313 is covered by the base 33 to avoid external interference with the electrical connection component 313, and prevents the electrical connection component 313 from oxidizing or contaminating dust to affect the imaging quality of the camera module 100. .
  • the photosensitive chip 31 and the electrical connection member 313 are integrally packaged by the susceptor 33, so that the photosensitive chip 31 can be fixed by the susceptor 33.
  • a bottom plate 323 may be disposed at the bottom of the circuit board 32, or the bottom plate 323 may not be disposed.
  • FIG. 20 is a schematic diagram of a camera module 100 in accordance with a ninth preferred embodiment of the present invention.
  • the filter element 40 is correspondingly disposed on the photosensitive member 30, and the susceptor 33 combines the photosensitive member 30 and the filter element 40 into one body after molding to form a unitary structure. That is to say, unlike the above embodiment, the filter element 40 is disposed on the base 33 by integral molding, and is disposed in the base 33 in a different manner, such as a bonding manner.
  • the filter element 40 is correspondingly disposed on the photosensitive component 30 to form at least one sealed space between the filter element 40 and the photosensitive component 30, wherein the photosensitive chip of the photosensitive component 30
  • the photosensitive regions of 31 are respectively located in the sealed space, so that the molding material for forming the susceptor 33 does not enter the sealed space during the molding process to form the susceptor 33, thereby
  • the base 33 is formed only outside the sealed space, wherein the base 33 covers a portion of the circuit board 32 and a portion of the filter element 40 after molding, and the base 33
  • the photosensitive area of the photosensitive chip 31 corresponds to the light window 333, so that the light window 333 provides a light path to the lens 10 and the photosensitive chip 31.
  • Figure 21 is a camera module 100 in accordance with a tenth preferred embodiment of the present invention.
  • the photosensitive member 30 includes a shielding lens 14 disposed above the photosensitive chip 31, and the shielding lens 14 is integrally packaged by the base 33.
  • the light reflected by the object enters the inside of the camera module 100 from the lens 10 and the shielding lens 14 to be subsequently received and photoelectrically converted by the photosensitive chip 31, thereby obtaining an image associated with the object.
  • the arrangement of the shielding lens 14 can reduce the optical TTL (the distance from the lens 10 plane of the lens 10 through the aperture to the photosensitive plane of the chip), thereby making the size of the camera module 100 without affecting the optical performance. Further reducing, the demand for the electronic device to mount the small-sized camera module 100 is satisfied.
  • the arrangement of the occlusion lens 14 can also reduce stain sensitivity. For example, in one embodiment, stain sensitivity of 50% can be reduced.
  • the occlusion lens 14 is embodied as a lens of thermosetting properties, ie the occlusion lens 14 is embodied as a thermally hardened lens such that the occlusion lens 14 is in progress
  • the molding process is able to withstand the ambient temperature in the molding process. For example, it is possible to withstand a molding ambient temperature of 180 ° C in the molding process of an embodiment. That is, the opaque and thermally hardened occlusion lens 14 is attached to the support member 334 prior to the molding process and is placed with the circuit board 32 and the photosensitive chip 31.
  • a solidified molding material of the fluid is molded integrally around the support member 334 and the outer surface of the shielding lens 14 so that the base 33 can be integrally molded to the circuit board. 32. That is, the base 33, the circuit board 32, and the shielding lens 14 form a unitary structure.
  • the occlusion lens 14 of the present invention can be not only a heat-hardened lens, but also a lens 11 of other nature, and the present invention is not limited thereto.
  • the shielding lens 14 includes a lens body 141 and a lens periphery 142 disposed around the lens body 141. Since the occlusion lens 14 is a precision optical element, the edge of the lens body 141 is thin.
  • the lens periphery 142 disposed at the edge of the lens body 141 and integrally connected is a thickened bracket design capable of carrying the lens body 141 so as not to affect the optical performance of the lens body 141 while enabling The lens body 141 is integrally molded to the base 33 in a mold.
  • the lens periphery 142 of the visor 14 is disposed in the non-photosensitive region 312 of the photographic lens 31, and the lens of the visor 14 is
  • the main body 141 is disposed on the photosensitive path of the photosensitive chip 31 of the photosensitive member 30; after the base 33 is formed, the base 33 covers the circuit board 32 and at least a portion of the photosensitive chip 31
  • the non-photosensitive region 312, at least a portion of the support member 334, and the lens perimeter 142 of the occlusion lens 14 form the photosensitive member 30.
  • the shielding lens 14 can also be the de-branching lens, thereby reducing the edge portion of the lens 11, reducing the area of the shielding lens 14, so that the shielding lens 14 and the The shape of the lens 10 corresponds to each other.
  • Figure 22 is a camera module 100 in accordance with an eleventh preferred embodiment of the present invention.
  • the circuit board main body 321 includes a first board body 3211 and a second board body 3212.
  • the first board body 3211 and the second board body 3212 are fixedly connected by a connecting medium 3213.
  • the first board 3211 can be a hard board
  • the second board 3212 can be a soft board
  • the connecting medium 3213 can be an ACF conductive adhesive.
  • the second board 3212 may further include an interface end, such as a connector, to facilitate electrical connection to an electronic device.
  • the base body 331 is integrally formed on the first plate 3211, and the second plate 3212 is overlapped at one end of the first plate 3211.
  • the circuit board main body 321 may be formed by the first board body 3211 and the second board body 3212, and then integrally formed, or may be performed on the first board body 3211.
  • the second plate body 3212 is electrically connected to the first plate body 3211, and is fixed to the first plate body 3211 by, for example, the ACF conductive adhesive.
  • the second board 3212 is connected to the upper portion of the first board 3211 through the connecting medium 3213.
  • the second The plate body 3212 is coupled to the bottom of the first plate body 3211 through the connection medium 3213, and the present invention is not limited in this regard.
  • Figure 23 is a camera module 100 in accordance with a twelfth preferred embodiment of the present invention.
  • the circuit board main body 321 is provided with an inverted groove 3214, and the photosensitive chip 31 is mounted on the inverted groove 3214 in an inverted manner. That is, the photosensitive chip 31 is mounted on the board main body 321 by means of an FC (Flip Chip).
  • FC Flexible Chip
  • the inverted groove 3214 is opposite to the lens 10.
  • the photosensitive chip 31 is mounted from the lower surface of the circuit board main body 321 toward the circuit board main body 321 during the mounting process, and the photosensitive area of the photosensitive chip 31 is exposed through the flip-chip 3214. effect.
  • Figure 24 is a schematic diagram of a camera module in accordance with a fourteenth preferred embodiment of the present invention.
  • the lens carrying member 20 is integrally coupled to the base 33, and the lens 10 is adapted to be mounted to the lens carrying member 20 to facilitate formation of a telephoto camera module.
  • the lens carrying member 20 extends at least partially integrally upward from the base body 331 to form a closed lens limiting space. That is to say, in this manner, the base 33 includes the lens carried on the component 20 to provide a limit and installation space for the lens 10.
  • the susceptor 33 with the lens carrying member 20 may be integrally formed on the circuit board 32 by a mold.
  • the lens carrying member may also be formed on the base body after the base body is formed by means of secondary molding, and the present invention is not limited in this respect.
  • 25A, 25B are schematic views of a camera module 100 in accordance with a fifteenth preferred embodiment of the present invention.
  • the lens 10 includes at least two lens units, and the optical paths of the lens units are identical. Further, at least one of the lens units of each of the lens units is a de-edge lens unit. That is, at least one of the lens units includes at least one of the de-branching lenses.
  • the lens 10 includes two lens units, which are a first lens unit 110 and a second lens unit 120, respectively, the first lens unit 110 and the second lens unit 120. Bottom-up stacking settings.
  • the first lens unit 110 is a de-edge lens.
  • the first lens unit 110 and the second lens unit 120 are independent of each other, that is, in the process of manufacturing, the first lens unit 110 and the second lens unit 120 may be respectively formed separately, and then Assemble two lens units, such as glue.
  • the first lens unit 110 includes four lenses 11 , which are a first lens 111 , a second lens 112 , a third lens 113 , and a fourth lens 114 , wherein the fourth lens 114 is edged. Lens.
  • the first lens unit 110 includes a de-bounding lens barrel 12, and each of the lenses 11 is mounted in the lens barrel 12, respectively.
  • the consistency of the optical axis and the relative angular relationship between the lenses are some important factors affecting the image quality of the lens.
  • the last lens is typically assembled by pre-assembling the lens and then adjusting the orientation of the lens, such as by a predetermined angle, to provide better imaging of the lens.
  • the adjustment of the relative position of the lens can be achieved by adjusting the second lens unit 120. That is, when the mirror 10 is assembled, the first lens unit 110 and the second lens unit 120 are assembled first, and then the first lens unit 110 and the second lens unit 120 are pre-assembled.
  • the first board body 321 includes a first board body 3211 and a second board body 3212, and the second board body 3212 is electrically connected to the first board.
  • Plate body 3211 The first plate 3211 may be a hard plate, and the second plate 3212 may be a soft plate.
  • the second board 3212 can be electrically connected to the first board 3211 in a press-fit manner, or can be electrically connected to the first board 3211 through a conductive medium.
  • the second board 3212 may further include an interface end, such as a connector for electrically connecting to an electronic device, that is, the second board 3212 is an electrical connection terminal for electrical connection. Other devices, such as electronic devices.
  • the base body 331 includes four sides, which are respectively a first side 33101, a second side 33102, a third side 33103, and a fourth side 33104.
  • the second side 33102, the third side 33103, and the fourth side 33104 are sequentially adjacent to each other to form the light window 333.
  • the second side 33102 and the fourth side 33104 are located on opposite sides of the first side 33101, and the third side 33103 is opposite to the first side 33101.
  • a holder 3320 is mounted to the base body 331, and the filter element 40 is mounted to the holder 3320 such that the filter element 40 is located in the photosensitive path of the photosensitive chip 31.
  • the first side 33101 is adjacent to the second plate 3212, and the chord 1141 of the demarcation lens of the lens 10 is located at the first side 33101. direction. That is, the chord edge 1141 of the de-branching lens and the chord portion 121 of the de-edgering lens barrel 12 are close to the interface end of the camera module 100.
  • the electronic component 332 and the electrical connection component 313 are disposed on the second side 33102 and the fourth side 33104 of the base, making full use of the The position of the circuit board main body 321 corresponding to the second side 33102 and the fourth side 33104 is described. That is, the electronic component 332 and the electrical connection component 313 are disposed at positions of the first board corresponding to the second side 33102 and the fourth side 33104. In particular, the electronic component 332 and the electrical connection component 313 are disposed in a direction perpendicular to the chord edge 1141 of the demarcation lens such that the dimension of the chord edge 1141 is maximized. small.
  • the electrical connection element 313 and the electronic component 332 are disposed on opposite sides, and in other embodiments of the invention, the electrical connection element 313 and the electronic component 332 may be disposed on any two sides, three sides or four sides of the photosensitive chip 31 as needed, that is, the electronic component 332 and/or the electrical connection component 313 may be selectively One side, two sides, and three sides of the first side 33101, the second side 33102, the third side 33103, and the fourth side 33104 of the base body 331
  • the side or the four sides, the invention is not limited in this respect.
  • the chord edge 1141 is located in a direction of the first side edge 33101, and the first side edge 33101 is not disposed at a position corresponding to the electronic component 332, so that the The width dimension of the first side 33101 is required to be reduced, thereby increasing the possibility that the size of the camera module is further reduced. That is, the arrangement positions of the electronic component 332 and the electrical connection component 313 can be adjusted according to the direction in which the chord 1141 is disposed.
  • the width of the first side 33101 is small, which is adapted to the de-edge design of the lens 10, that is, to accommodate the chord 1141 of the de-branching lens. And the chord portion 121 of the lens barrel 12 is de-bounded.
  • the width dimension W1 of the first side edge 33101 is smaller than the width dimensions W2, W4 of the second side edge 33102 and the fourth side edge 33104.
  • FIGS. 27A and 27B are schematic views of a camera module and a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
  • the third side 33103 is away from the second plate 3212, the said deframed lens of the lens 10
  • the chord edge 1141 and the chord portion 121 of the de-edged lens barrel 12 are located in the direction of the third side 33101. That is to say, the chord edge 1141 of the de-edged lens and the chord portion 121 of the de-bounding lens barrel 12 are away from the electrical connection end of the camera module 100. That is, the chord 1141 of the de-branching lens is located on the side opposite to the second plate 3212.
  • the width of the third side 33103 is small, and is adapted to the de-edge design of the lens 10, that is, the chord 1141 of the de-branching lens is adapted. And the chord portion 121 of the lens barrel 12 is de-bounded.
  • the third side 33101 has a width dimension W3 that is smaller than width dimensions W2, W4 of the second side 33102 and the fourth side 33104.
  • the de-bounding lens includes two of the chord sides 1141
  • the de-edgering barrel 12 includes two of the chord sides 121.
  • One of the chord sides 1141 of the demarcation lens and one of the chord sides 121 of the de-stained lens barrel 12 are located on a side close to the second plate body 3212.
  • the other of the chord sides 1141 of the de-branching lens and the other chord portion 121 of the de-stained lens barrel 12 are located on a side away from the second plate body 3212.
  • one of the chord sides 1141 of the demarcation lens and each of the chord portions 121 of the de-stained lens barrel 12 are located at the first side 33101 of the base body 331.
  • the other of the chord sides 1141 of the demarcation lens and the other chord portion 121 of the demarcation lens barrel 12 are located at the third side plate 33103 of the base body 331.
  • 29 is a schematic diagram of an array camera module in accordance with a fifteenth preferred embodiment of the present invention.
  • the array camera module includes a plurality of the camera modules 100 such that the modules cooperate with each other.
  • each of the camera modules 100 is separately provided, that is, the circuit board 32 and the base 33 of each of the camera modules 100 may not be connected.
  • each of the camera modules 100 can be assembled by an outer frame 50.
  • the array camera module may be formed by the camera module 100 and the conventional camera module of the present invention, that is, the array camera module includes at least one of the camera modules. 100.
  • Figure 30 is a schematic diagram of an array camera module in accordance with a sixteenth preferred embodiment of the present invention.
  • the array camera module 100 includes a plurality of the camera modules 100 such that the modules cooperate with each other.
  • each of the camera modules 100 is disposed integrally, that is, the circuit board 32 and the base 33 of each of the camera modules 100 can be connected to each other to form a unitary structure.
  • the array camera module may be combined with the camera module 100 of the present invention and a conventional camera module, that is, the array camera module includes at least one of the camera modules. Group 100. At least one of the camera modules 100 can be combined with a conventional camera module to form the array camera module.
  • Figure 31 is a schematic illustration of a method of manufacturing the lens 10 in accordance with the above-described preferred embodiment of the present invention.
  • the present invention provides a method 1000 of manufacturing a lens 10, the method comprising the steps of:
  • 1101 injection molding at least one de-edge lens
  • the demarcation lens is mounted to the de-stained lens barrel 12 at a predetermined position.
  • FIG. 32 is a schematic diagram of the application of the camera module 100 in accordance with the above-described preferred embodiment of the present invention.
  • the present invention further provides an electronic device 300, wherein the electronic device includes an electronic device body 200 and at least one of the camera modules 100, wherein the camera module 100 is respectively disposed on the electronic device body 200 for use.
  • the type of the electronic device body 200 is not limited.
  • the electronic device body 200 may be a smart phone, a wearable device, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, and a monitor. Any device or the like that can be configured with the camera module 100.
  • the electronic device body 200 is implemented as a smart phone in FIG. 32, it does not constitute a limitation on the content and scope of the present invention.

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Abstract

镜头(10)和摄像模组(100)及其制造方法,其中镜头(10)包括至少一去边化镜片(114),其中去边化镜片(114)包括至少一弦边(1141)和至少一圆边(1142),弦边(1141)和圆边(1142)相邻接,其中弦边(1141)和圆边(1142)的曲率不同,从而使得镜片(114)变窄,使得镜头(10)的宽度变窄,以便于形成超窄摄像模组(100)。

Description

镜头和摄像模组及其制造方法 技术领域
本发明涉及摄像模组领域,更进一步,涉及一镜头和摄像模组及其制造方法,特别涉及一超窄镜头和摄像模组,将摄像模组的体型极大地缩小,为智能设备中紧凑地使用摄像模组提供方便。
背景技术
随着智能设备的发展,摄像模组已经是智能设备中不可缺少的器件。而且,摄像模组的高性能化更是智能设备改进和研发的主要方向,是体现智能设备性能的关键。
目前,传统的智能设备,例如智能手机、智能电脑、智能家居等等设备中,需要特别的为摄像模组留出很大的空间,尤其是在边框设计时需要为摄像模组准备好很宽的边缘。但是,在随着智能设备追求小体积、窄边框的趋势,摄像模组也必须要进行体积上的缩减。如何在减少体积的同时,还要保证镜头的正常工作和摄像模组的功能完好,这是需要解决的问题。
传统的镜头与摄像模组如图1所示。传统的摄像模组包括至少一镜片10P、一镜筒20P、一镜座30P以及一电路组件40P,其中所述镜片10P为圆形镜片,所述镜筒20P为圆柱形筒状结构,所述镜座30P为方形结构,所述电路组件40P为方形。这里,所述镜筒20P包裹和支撑所述镜片10P,所以所述镜筒20P与所述镜片10P的外形是相互对应的,也就是说从轴向的方向看,所述镜片22P与所述镜筒20P都是完整的圆形。但是镜座30P和所述电路组件40P都是方形的,而且所述电路组件40P中主要的感光芯片41P也是方形。每一所述镜片10P有圆形通光的部分和不通光的部分,因此,光线还是有很多的光线没有被所述电路组件40P接收,而是落在了所述电路组件40P的金线、pad、线路、镜座、模塑、胶水等表面相对光滑的部件上,在经过多次反射后回到成像区域,形成杂光。那么如果能从所述镜片10P进行改造,减少不必要的部分,从而使得所述镜筒20P、所述镜座30P以及所述电路组件40P都相应的减少不必要的部分,便可以从整体 的体型上减少摄像模组的体积。而实际上,在极限的情况下,所述电路组件40P只要比感光芯片稍大,所述镜筒20P与所述电路组件40P相对应的大小,所述镜片10P与所述电路组件40P的感光芯片相对应的大小,便可以保证摄像模组的功能完整。
传统的摄像模组为所述电路组件40P留出了很多安全空间,特别是为了感光芯片41P能稳定、长久地工作,在所述电路组件40P中扩展了很多空间。而且,传统的所述镜片10P为了能保证有效的通光口径,采用隔圈或者挡光片将不要的光线挡掉。但是光线在镜片上还是会有折射和反射的部分,形成了杂光。
以上因素不仅使得成像效果下降,而且摄像模组的整体体型中有很多冗余部分。这对于紧凑型的使用环境,还有高集成度系统的应用都是不利的。
另一方面,随着摄像模组高像素的发展,镜头的镜片数量不断增多,比如达到4p、5p、6p、7p等以上数量,镜头的体积也在不断增大,因此镜头对摄像模组的影响因素也越来越大,对镜头的改进也显得更加重要。
发明内容
本发明的一个目的在于提供一镜头和摄像模组及其制造方法,其利用紧凑的体型,减少不必要的体积,在保证功能完整的情况下有效地在智能设备中应用。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,其中所述镜头包括至少一去边化镜片,其中所述去边化镜片具有至少一弦边,一成像区以及一非成像区,通过所述弦边将减少所述去边化镜片的体型,但是不影响所述去边化镜片所述成像区。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,其中所述摄像模组进一步包括一去边化镜筒、一基座以及一电路组件,其中所述去边化镜筒和所述基座都相应地配合所述去边化镜片的体型,以在所述电路组件中有效的处理光线。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,其中所述镜片的所述弦边在不影响所述成像区的同时,减少了来自所述非成像区的影响。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜片进一步包括至少一圆边,所述弦边和所述圆边的形状的不同可以降低在组装所述去边化镜片时的难度。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜片的所述弦边可以为直线形,也可以为弧形,相对于所述圆边的圆形,所述弦边在在模具的加工设计中耗费的时间和成本都会降低,而且明显地减少了使用材料。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜片的所述弦边的相应的加工良率相较于所述圆边是提高的。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜片的所述非成像区相较于传统镜片减少了很多,那么通过所述非成像区的光线也相应地减少,在成像效果上和成像效率上进行提升。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,因为所述去边化镜片的体型的减小,所述去边化镜筒、所述基座以及所述电路组件的体型也相应的减小,从而整体摄像模组的体型变窄。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,因为所述去边化镜片的所述弦边的设计,所述去边化镜筒和所述基座的形状中也具有相应的弦边部。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜筒的所述弦边部和所述基座的对应位置可以为直线型,也可以为弧型,而且为了制造所述去边化镜筒的所述弦边部,所用的设备和模具也不必采用圆型。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜筒的所述弦边部的设计和加工中,相较于传统的圆型而言耗费的时间和成本都会降低,相应的加工良率却是升高的。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜筒的所述弦边部和所述基座的对应配合给摄像模组的组装中来了方便,可以快速地确定安装方向。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,通过所述去边化镜筒和所述基座的体型的缩小,所述电路组件可以更紧凑地被安装。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜片与所述电路组件的感光芯片相对应的设置,而且所述去边化镜片的所述非成像区对所述电路组件的感光芯片的体型减少,影响也相应地下降。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化 镜片通过注塑一次成型,相应地形成所述弦边,使得降低制造成本的同时,降低生产难度。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,所述去边化镜筒和其他与所述去边化镜片相对应的器件通过注塑一次成型的形成,其制造模具也与所述镜片有相应的体型。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,通过相应的所述去边化镜片、所述去边化镜筒、所述基座以及所述电路组件,组装时可以方便的对应从而简化组装过程。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,通过相应的所述去边化镜片、所述去边化镜筒、所述基座以及所述电路组件,摄像模组的体型相应地减少,实现较传统技术而言的超窄摄像模组。
本发明的另一个目的在于提供一镜头和摄像模组及其制造方法,其中所述镜头配合基座设计需求,使得摄像模组的尺寸得以整体小型化。
为了实现以上至少一目的,本发明的一方面提供一镜头,其包括:至少一去边化镜片,其中所述去边化镜片包括至少一弦边和至少一圆边,所述的弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同。
根据一些实施例,所述的镜头中所述弦边的曲率为0,是直线段。
根据一些实施例,所述的镜头中所述圆边的曲率>0,是一弧形线段。
根据一些实施例,所述的镜头中所述弦边为直线,所述圆边为圆弧。
根据一些实施例,所述的镜头中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
根据一些实施例,所述的镜头中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
根据一些实施例,所述的镜头中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
根据一些实施例,所述的镜头中所述弦边是直线段。
根据一些实施例,所述的镜头中所述镜头包括多个镜片,其中至少一个为所述去边化镜片,至少一个为圆形镜片。
根据一些实施例,所述的镜头中所述去边化镜片的尺寸大于所述圆形镜片。
根据一些实施例,所述的镜头中所述镜头包括四个镜片,其中所述镜片尺寸 依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
根据一些实施例,所述的镜头中所述镜头包括一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内。
根据一些实施例,所述的镜头中所述去边化镜筒包括一弦边部和一圆边部,其中所述弦边部和所述圆边部的截面边缘曲率不同。
根据一些实施例,所述的镜头中所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部相对应。
根据一些实施例,所述的镜头中所述去边化镜片通过注塑方式一次成型制造。
根据一些实施例,所述的镜头包括至少一光路元件,其中所述光路元件被设置于与所述镜片相邻,以便于在所述镜片形成预定光线通路。
根据一些实施例,所述的镜头中位于所述去边化镜片的所述光路元件的外边缘形状与所述去边化镜片形状一致。
根据一些实施例,所述的镜头中所述光路元件为组合:垫圈、垫片、涂层中的一种。
本发明的另一方面提供一摄像模组,其包括:一镜头,其中所述镜头包括至少一去边化镜片,其中所述去边化镜片包括至少一弦边和至少一圆边,所述弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同;和一感光组件,其中所述镜头位于所述感光组件的感光路径。
根据一些实施例,所述的摄像模组中所述感光组件包括至少一基座、至少一感光芯片和至少一电路板,其中所述基座被设置于电路板,以便于提供一安装位置,所述感光芯片电连接于所述电路板,所述镜头位于所述感光芯片的感光路径。
根据一些实施例,所述的摄像模组中所述基座一体成型于所述电路板,形成至少一光窗,为所述感光芯片提供光线通路。
根据一些实施例,所述的摄像模组中所述基座包括一基座主体和补充基座,速搜基座主体具有一缺口,所述补充基座补充一所述缺口,从而形成一封闭的所述窗口。
根据一些实施例,所述的摄像模组中所述镜头的去边化位置和所述补充基座的位置相对应。
根据一些实施例,所述的摄像模组中所述基座被粘接固定于所述电路板。
根据一些实施例,所述的摄像模组中所述电路板包括一电路板主体和至少一 电子元件,所述电子元件被设置于所述电路板主体,其中所述基座一体成型于所述电路板主体,并且包覆至少一所述电子元件。
根据一些实施例,所述的摄像模组中所述电路板包括一电路板主体和至少一电子元件,其中至少一所述电子元件被设置于所述电路板主体的底部,所述基座一体成型于所述电路板主体顶部。
根据一些实施例,所述的摄像模组中所述电路板具有一下沉区,所述感光芯片下沉地设置于所述下沉区。
根据一些实施例,所述的摄像模组中所述下沉区选择凹槽、通孔中的一种。
根据一些实施例,所述的摄像模组中所述感光芯片具有一感光区和一非感光区,所述基座一体封装至少部分所述非感光区。
根据一些实施例,所述的摄像模组中所述摄像模组包括至少一滤光元件,其中所述基座一体封装所述滤光元件。
根据一些实施例,所述的摄像模组中所述摄像模组包括一遮挡镜片,所述遮挡镜片位于所述感光芯片上方,被所述基座一体封装。
根据一些实施例,所述的摄像模组中所述遮挡镜片是所述去边化镜片。
根据一些实施例,所述的摄像模组包括一镜头承载元件,其中所述镜头被安装于所述镜头承载元件,所述镜头承载元件被安装于所述基座。
根据一些实施例,所述的摄像模组中所述镜头承载元件是一驱动部件,以形成一动焦摄像模组。
根据一些实施例,所述的摄像模组中所述镜头承载元件是一镜头固定部件,以形成一定焦摄像模组。
根据一些实施例,所述镜头承载元件一体连接于所述基座,所述镜头被安装于所述镜头承载元件,以形成一定焦模组。
根据一些实施例,多个所述摄像模组构成一阵列摄像模组。
本发明的另一方面提供一镜头,其包括:至少一去边化镜片和一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内,其中所述去边化镜片包括至少一弦边和至少一圆边,所述的弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同,所述去边化镜筒包括一弦边部,所述弦边部和所述去边化镜片的所述弦边对应,以便于减小所述镜头的体积。
本发明的另一方面提供一摄像模组,其包括:
一镜头,所述镜头包括至少一去边化镜片和一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内,其中所述去边化镜片包括至少一弦边和至少一圆边,所述的弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同,所述去边化镜筒包括一弦边部,所述弦边部和所述去边化镜片的所述弦边对应,以便于减小所述镜头的体积;和
一感光组件,其中所述镜头位于所述感光组件的感光路径。
根据一些实施例,所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于靠近所述第二板体一侧。
根据一些实施例,所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部位于靠近所述第二板体一侧。
根据一些实施例,所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于远离所述第二板体的一侧。
根据一些实施例,所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部位于远离所述第二板体的一侧。
根据一些实施例,所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,其中一所述弦边位于靠近所述第一板体的一侧,另一所述弦边位于远离所述第二板体的一侧。
根据一些实施例,所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,所述去边化镜筒包括两所述弦边部,其中一所述弦边和一所述弦边部位于靠近所述第一板体 的一侧,另一所述弦边和所述弦边部位于远离所述第二板体的一侧。
根据一些实施例,所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述弦边位于所述第一侧边方向。
根据一些实施例,所述第一侧边的宽度尺寸小于所述第二侧边和所述第四侧边的宽度尺寸。
根据一些实施例,所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,所述弦边位于所述第三侧边方向。
根据一些实施例,所述第二侧边的宽度尺寸小于第二侧边和所述四侧边的宽度尺寸。
根据一些实施例,所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边依次相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,其中一所述弦边位于所述第一侧边方向,另一所述弦边位于所述第三侧边方向。
根据一些实施例,所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体。
根据一些实施例,所述电路板包括至少一电子元件,所述电子元件被设置于所述第一板体,其中所述基座一体成型于所述第一板体,并且包覆至少一所述电子元件。
根据一些实施例,所述电子元件被选择性地设置于所述基座的四侧边中的一侧边、两侧边、三侧边、四侧边。
根据一些实施例,所述电子元件被设置于所述第第二侧边和所述第四侧边位置。
根据一些实施例,所述电子元件被设置于所述第一侧边和所述第三侧边位置。
根据一些实施例,所述感光芯片通过一电连接元件电连接于所述第一板体,所述基座一体成型于所述第一板体,包覆所述电连接元件。
根据一些实施例,所述电连接被选择性地设置于所述基座四侧中的两侧、三侧或四侧。
根据一些实施例,所述电连接元件被设置于所述第二侧边和所述第四侧边对应的位置。
根据一些实施例,所述电连接元件被设置于所述第一侧边和所述第三侧边对应的位置。
附图说明
图1是传统摄像模组的整体透视示意图。
图2是根据本发明的第一个优选实施例的摄像模组立体示意图。
图3是根据本发明的第一个优选实施例的摄像模组分解示意图。
图4是根据本发明的第一个优选实施例的镜头分解示意图。
图5是根据本发明的第一个优选实施例的镜头设计原理示意图。
图6是根据本发明的第一个优选实施例的优选实施例的成像光和传统镜头比较示意图。
图7是根据本发明的第一个优选实施例的镜头的第一个变形实施例示意图。
图8是根据本发明的第一个优选实施例的镜头的第二个变形实施例示意图。
图9是根据本发明的第一个优选实施例的镜头的第三个变形实施例示意图。
图10是根据本发明的第一个优选实施例的镜头的第四个变形实施例示意图。
图11是根据本发明第一个优选实施例的镜头的第五个变形实施例示意图。
图12是根据本发明的第一个优选实施例的部分变形实施例示意图。
图13是根据本发明的第二个优选实施例的摄像模组示意图。
图14是根据本发明的第三个优选实施例的摄像模组示意图。
图15是根据本发明的第四个优选实施例的摄像模组示意图。
图16是根据本发明的第五个优选实施例的摄像模组示意图。
图17是根据本发明的第六个优选实施例的摄像模组示意图。
图18是根据本发明的第七个优选实施例的摄像模组示意图。
图19是根据本发明的第八个优选实施例的摄像模组示意图。
图20是根据本发明的第九个优选实施例的摄像模组示意图。
图21是根据本发明的第十个优选实施例的摄像模组。
图22是根据本发明的第十一个优选实施例的摄像模组。
图23是根据本发明的第十二个优选实施例的摄像模组。
图24是根据本发明的第十三个优选实施例的摄像模组示意图。
图25A,25B是根据本发明的第十四个优选实施例的摄像模组示意图。
图26A、26B是根据本发明的第十五个优选实施例的摄像模组和感光组件示意图。
图27A、27B是根据本发明的第十六个优选实施例的摄像模组和感光组件示意图。
图28A、28B是根据本发明的第十七个优选实施例的摄像模组和感光组件示意图。
图29是根据本发明的第十五个优选实施例的阵列摄像模组示意图。
图30是根据本发明的第十六个优选实例的阵列摄像模组示意图。
图31是根据本发明的上述优选实施例的镜头制造方法示意图。
图32是根据本发明的上述优选实施例的摄像模组应用示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此上述术语不能理解为对本发明的限制。
可以理解的是,术语“一”应理解为“至少一”或“一个或多个”,即在一个实施例中,一个元件的数量可以为一个,而在另外的实施例中,该元件的数量可 以为多个,术语“一”不能理解为对数量的限制。
随着智能电子设备的发展,对摄像模组的要求越来越高,比如智能手机向超薄、大屏幕、无边化、高成像质量的方向发展。而由前述可知,摄像模组是由不同的部件组成的,随着高速的发展,部件的精简几乎做到了极致,而进一步的发展,除了研究每个部件可能的改进,还要考虑各部件的之间的配合改进关系。而根据本发明,提供一镜头,其可以在保证光学成像质量的基础上,对摄像模组的镜头进行改进,使其体形得以减小;更进一步,所述镜头和其余部件,比如和感光组件之间的结构可以配合,使得摄像模组的整体尺寸得以减小,且外部形状更加一致,更加适于被安装于电子设备。
如图2至图6所示,是根据本发明的这个优选实施例的摄像模组100。所述摄像模组100包括一镜头10和一感光组件30,其中所述镜头10位于所述感光组件30的感光路径,其中所述镜头10为超窄镜头10,也可以称为去边化镜头10。
进一步,在本发明的这个实施例中,所述镜头10和形状和所述感光组件30的形状相配合,使得所述摄像模组100成为一超窄摄像模组100。
具体地,所述镜头10包括至少一去边化镜片和一去边化镜筒12,其中所述去边化镜片被安装于所述去边化镜筒12内。其中所述去边化镜片的至少部分圆形边缘被去掉,从而使得所述去边化镜片的体形相对于圆形减小且带来减少杂光的优势。进一步地,所述去边化镜筒12相对圆形镜筒至少部分圆形边缘被去掉,从而使得所述镜头10的整体体形减小,且所述镜头10和去边化形状更适宜于其他部件配合。其中所述去边化镜片的去边化是相对于圆形镜片的圆形边而言,也就是说,将圆形镜片至少部分圆形边缘去掉或替换,使得所述圆形镜片的边缘并不是一个完整圆。
进一步,所述镜头10包括多个镜片11,其中至少一个所述去边化镜片,至少一圆形镜片。所述去边化镜片的数量以及所述去边化镜片的位置可以根据需要选择。所述圆形镜片和去边化镜片分别被安装于所述去边化镜筒内。
在本发明的这个实施例中,以4片所述镜片11构成的所述镜头10为例进行示意说明,而在本发明的其他实施例中,所述镜片11的数量还可以是其它,比如2片、3片、5片以及5片以上等。而在不同镜片数量的所述镜头10中,也可以根据具体需要设计相应的镜片11形状,使得其中的至少一片所述镜片11为所 述去边化镜片。
更具体地,在本发明的这个实施例以及附图中所示,其中1片所述镜片11为去边化镜片,其余3片为圆形镜片,且所述去边化镜片位于最底部。当然,在本发明的其他实施例中,所述去边化镜片的数量还可以是其他,比如2片、3片、4片,所述去边化镜片的位置也可以在4片所述镜片11中根据需要选择,本领域的技术人员应当理解的是,本发明在这方面并不限制。
在本发明的这个实施例以及附图中,所述镜头10的4片所述镜片11,由物侧至像侧分别为,一第一镜片111、一第二镜片112、一第三镜片113和一第四镜片114。且4片所述镜片11的体形由物侧至像侧依次增大。也就是说,所述镜头10的所述镜片11的体形越靠近所述感光组件30越大。如,在这个实施例中,所述第四镜片114的体形最大。值得一提的是,各所述镜片11被安装于所述去边化镜筒12内,在所述去边化镜筒12的轴向尺寸一致的情况下,体形最大的所述镜片11决定了所述镜头10的整体体积,而在本发明的这个实施例中,其中最大的所述镜片11,即所述第四镜片114为去边化镜片,因此所述去边化镜筒12的形状随之改变,所述镜头10的整体体形减小。即,在这个实施例中,所述第一镜片111,所述第二镜片112,所述第三镜片113为圆形镜片,所述第四镜片114为所述去边化镜片。当然,在本发明的其他实施例中,也可以选择其他所述镜片11进行去边化设计,而不是体型最大的所述镜片11进行去边化,本发明在这方面并不限制。
值得一提的是,在本发明的这个实施例中,以4片所述镜片11依次增大的形状来举例说明,但是在本发明的其他实施例中,各所述镜片11还可以是其他形状排布,比如等大排布,比如位于中间的镜片等大,位于前端的最小,而位于底端的最大,比如前段的最小,后端全部等大。本发明中,优选的为底端镜片最大。
所述感光组件30包括一感光芯片31,其中去边化设计的所述镜片11根据所述感光芯片31的形状和尺寸进行去边化设计。也就是说,所述去边化镜片的设计以所述感光芯片31为参考,以保证所述摄像模组100的成像质量。特别地,在一些实施例中,所述去边化镜片的设计以所述感光芯片31的感光区的形状和尺寸进行设计。
为了减少所述镜头10的体型,进行去边化设计,优选地所述镜头10中最大 的所述镜片11,也就是最靠近像侧的所述第四镜片114的体型根据所述感光芯片31的尺寸进行缩减。特别地,在一些实施例中,所述第四镜片114缩减到与所述感光芯片31相应的大小。
如图5和图6,值得一提的是,所述镜头10的所述去边化镜片进一步包括至少一弦边,即,所述第四镜片114包括一弦边1141。相对于完整的圆形镜片而言,最靠近像侧的所述第四镜片114的所述弦边1141使得所述第四镜片114的体型的相应缩减。也就是说,带所述弦边1141的所述第四镜片114比相应的圆形镜片的体形减小。需要说明的是,本发明中的优选实施例中,所述第四镜片114的所述弦边1141为在所述第四镜片114的圆截面图中非原圆边的线段所构成的边缘部分。也就是说,对于所述镜头10的所述第四镜片114还进一步包括至少一圆边1142。这里需要说明的是,所述第四镜片114的所述弦边1141不仅可以为直线段,还可以为弧形线段,或者为了配合所述感光组件30的所述感光芯片31的任一线段。根据完整的圆形镜片而言,所述弦边1141也可以理解为相对于完整圆形而缺少部分的镜片11的边缘。那么对于减少所述第四镜片114以及所述镜头10的体型来说,所述弦边1141有着关键的作用。
换句话说,所述去边化镜片的边缘由至少两部分曲率不同的线段相邻接组成,从而使得所述去边化的镜片11的边缘并不是一个完整圆。即,所述弦边1141和所述圆边1142相邻接形成所述镜片11的边缘,所述弦边1141和所述圆边1142的曲率不同。优选地,所述弦边1141的曲率是0,即是一直线段,所述圆边1142的曲率>0,即是一圆弧线段。
那么整体的所述镜片11的示意图如图5所示。本优选实施例中,在四片所述镜片11构成的所述镜头10中,最靠近像侧的所述第四镜片114具有一个所述弦边1141和一个所述圆边1142。所述镜片11、所述第二镜片112和所述第三镜片113各具有一个所述圆边1142。也就是说,所述第一镜片11、所述第二镜片112和所述第三镜片113为圆形镜片,所述第四镜片114为去一边的去边化镜片。
值得一提的是,在本发明的这个实施例中,以1个所述弦边1141和1个所述圆边1142构成的所述第四镜片114为例来说明所述去边化镜片的结构设计,而在本发明的其他实施例中,所述弦边1141和所述圆边1142的数量以及形状、布局等还可以是其他方式,本发明在这方面并不限制。比如,2所述弦边1141和2所述圆边1142、3所述弦边1141和3所述圆边1142、4所述弦边1141和4 所述圆边1142等。所述弦边1141和所述圆边1142的比例大小和位置可以根据不同需求设置,比如对称地设置,非对称设置、按预定比例大小进行设置等,本发明在这方面并不限制。
进一步,所述镜头10包括至少一光路元件13,所述光路元件13被设置于相邻的两所述镜片11之间,以便于在各所述镜片11之间形成一预定的光线通路。举例地但不限于,所述光路元件13可以为垫圈、垫片、涂层等。所述光路元件13外部边缘形状与所述镜片11的外部形状一致,以便于遮挡对应的所述镜片11的边缘。各所述镜片11和所述光路元件13依次间隔地被设置于所述去边化镜筒12的内部。
在本发明的这个实施例中,所述镜片11的数量为4片,相应地,所述光路元件13的数量为3个,分别为一第一光路元件131,一第二光路元件132和第三光路元件133。其中所述第一光路元件131被设置于所述第一镜片111和所述第二镜片112之间,所述第一光路元件131的外部形状和所述第二镜片112的外部形状一致,所述第二光路元件13被设置于所述第二镜片112和所述第三镜片113之间,所述第二光路元件13的外部形状和所述第三镜片113的外部形状一致。所述第三光路元件13被设置于所述第三镜片113和所述第四镜片114之间,所述第三光路元件13的外部形状和所述第四镜片114的外部形状一致。也就是说,在这个实施例中,所述第一光路元件131、所述第二光路元件132外部为圆形的光路元件,而所述第三光路元件133为去边化光路元件,也就是带有至少一直边和至少一弧形边。
优选地,在制造的过程中,每个所述镜片11为一体成型的。本领域的技术人员可以理解的是,所述镜片11的体型优选地可以通过模具注塑一次成型。而且相对于所述圆边1142的圆形,所述弦边1141在模具的加工设计中耗费的时间和成本都会降低,而且明显的减少了使用材料。按照设计,通过改变模具注塑空间的形状就可以在注塑后获得所需要形状的所述镜片11。另外组装所用到的所述光路元件13和所述去边化镜筒12都需要根据此形状定制模具后注塑获得。在组装时,所述弦边1141具有一定的引导作用,可以按照所述弦边1141的位置对所述镜片11进行定位。
更具体地,所述镜头10的通光口径由最小的所述镜片11和所述光路元件13决定。也就是说,如图5中的最靠近像侧的所述镜片11有很大部分是对成像作 用较小的。当采用所述弦边1141之后,如图6,不仅缩小了所述镜片11和所述镜头10的体形,而且最靠近像侧的所述镜片11的利用率也提高了。本优选实施例中,以最靠近像侧的所述第四镜片114为例,在所述光路元件13的作用下,对应地所述第四镜片114形成一成像区1143和一非成像区1144,其中所述成像区1143对应所述感光组件30的所述感光芯片31,是光线被接收的主要区域,其中所述非成像区1144阻挡光线通过,且通过的少量光线不进行感光作用。也就是说,所述镜片11的所述成像区1143为所述摄像模组100提供了主要的成像功能的基础。
值得一提的是,所述光路元件13的作用是阻挡各所述镜片11的边缘的光线,形成预定光路,减少周边的杂散光,可在实际的生产过程中,所述光路元件13并不是完全不透光,且边缘光线并不是能够被全部遮挡。也就是说,相对应所述镜片11的所述成像区1143,所述非成像区1144具有较少光线通过。而所述非成像区1144被通过的光线,在所述感光组件30的其他部分反射,如后续提出的所述基座33,所述电路板32、所述电连接元件313等,反射后的光线被所述感光芯片31接收,即成为影响所述感光芯片31成像质量的杂散光。而在本发明中,采用所述弦边1141的所述第四镜片114,如图6所示,其所述非成像区1144的光强会减弱,那么形成的杂光也会减少,所述摄像模组100的成像效果将得到提升。从成像效果来看,所述镜头10的成像圆中会形成一个逐渐减弱的边缘。也就是说,所述镜片11的去边化设计,使得非成像区1144的部分区域的光强会减弱,杂光的影响减小,而对成像效果不会影响或者影响较小。所述镜片11的所述弦边1141并不会对所述成像区1143造成影响,那么所述摄像模组100的功能也将保证完整。
值得一提的是,所述镜片11的所述弦边1141使得所述成像区1143并不会相应的失去一部分,而是相应地出现一个亮度和成像质量都逐渐减弱的边缘。这样,所述非成像区1144域的占比缩小,将有效的所述成像区1143集中到所述感光芯片31对应的更小的局部,在不对成像质量做出改变或变化较小的前提下,缩小了所述镜片11的体型,同时减少了照射到所述非成像区1144的光通量,直接减少了杂光的来源。另外,可以想到的是,在一些实施例中,所述镜片11的所述弦边1141应该是与所述感光组件30的所述感光芯片31的外围相一致的,那样会极大地减少所述镜片11和所述镜头10的体型。本优选实施例中,考虑到 最靠近像侧的所述第四镜片114在组装时还有需要有一定的余量,所以还有一定的所述非成像区1144。
本优选实施例中,根据所述镜片11的体型,所述光路元件13和所述去边化镜筒12都需要根据此形状来设计和制造。优选地,所述光路元件13和所述去边化镜筒12通过定制模具后注塑获得。
具体地,所述去边化镜筒12进一步包括至少一弦边部121和至少一圆边部122,分别对应所述去边化镜片的所述弦边1141和圆边1142。本优选实施例中,所述弦边1141采用直线型,那么所述弦边部121也相应地采用直线状。与所述镜片11的所述弦边1141制造中类似的是,直线状的所述弦边部121相对于圆形的弧形边在设备和模具的加工设计中耗费的时间和成本都得到降低。这样,本优选实施例中的所述镜头10、所述去边化镜筒12、后续提出的所述镜头承载元件20及所述感光组件30都采用直线或者方形的体型,在设计和制造工艺上得到了统一,进而使得生产难度降低,而且相应的加工良率能获得极大的提升。
所述去边化镜筒12的所述弦边部121和所述去边化镜片的所述弦边1141数量和位置相对应,当所述弦边1141的数量为其他时,所述弦边部121的位置、形状和数量也相应地改变。
更具体地,所述去边化镜筒12的弦边部121是一平面,所述去边化镜筒12的所述圆边部122为一曲面。也就是说,从所述去边化镜筒12的俯视图中可以看到,所述去边化镜筒12的俯视图由一圆弧和一直线构成的闭合曲线,而此时所述去边化镜筒12的形状和所述第四镜片114的俯视图形状一致。值得一提的是,由于所述去边化镜筒12具有一定的壁厚,因此此处的一致,并不是大小完全相同。当然,在本发明的其他实施例中,所述去边化镜筒12的所述弦边部121和所述圆边部122的数量、位置和布局还可以是其他,比如2所述弦边部121和2所述圆边部122、3所述弦边部121和3所述圆边部122、4所述弦边部121和4所述圆边部122等。所述弦边部121和所述圆边部122的比例大小和位置可以根据不同需求设置,比如对称地设置,非对称设置、按预定比例大小进行设置等,本发明在这方面并不限制。值得一提的是,所述去边化镜片的所述弦边1141和所述去边化镜筒12的所述弦边部121相对应,所述去边化镜片的所述圆边1142和所述去边化镜筒12的所述圆边部122相对应,因此使得所述镜片11和所述去边化镜筒12的相对位置确定,因此更方便所述镜片11的安装,有助于保证光路 的一致性。也就是说,所述镜片11的去边化设计有助于所述镜片11的定位,而在传统的圆形镜片和圆形镜筒中,镜片和镜筒之间并没有确定的相对位置。
还需要特别指出的是,所述去边化镜筒12的所述弦边部121的设置位置可以和所述感光组件30相配合,从而使得所述摄像模组100的整体边缘减小,后续将详细说明此优势。
所述摄像模组100包括一滤光元件40,用于过滤穿过所述镜头10的光线。所述滤光元件40举例地但不限于红外截止滤光片、蓝玻璃滤光片、晶圆级红外截止滤光片、全透片、可见光过滤片。所述滤光元件40被安装于一补充支座332(后续提出),位于所述感光芯片31的光线通路。
所述摄像模组100进一步包括一镜头承载元件20,所述镜头10被安装于所述镜头承载元件20,所述镜头承载元件20被安装于所述基座33,以使得所述镜头10位于所述感光芯片31的感光路径。举例地,所述镜头承载元件20可以被实施为一镜头固定部件或一驱动部件,以便于分别形成一定焦摄像模组100或一动焦摄像模组100。所述驱动部件举例地但不限于压电马达、音圈马达。当所述镜头承载元件20被实施为驱动部件时,所述镜头承载元件20电连接于所述感光组件30,比如通过引脚、引线等方式电连接于感光组件30。
进一步,根据本发明这个实施例,所述感光组件30还包括一电路板32和一基座33,所述感光芯片31电连接于所述电路板32,所述基座33被设置于所述电路板32,以便于提供安装位置,形成所述摄像模组100需要的后焦距。
进一步,所述基座33一体连接于所述电路板32。所述基座33包括一基座主体331以及具有一光窗333。所述光窗333为所述感光芯片31提供光线通路。换句话说,所述感光芯片31位于所述光窗333内侧,所述感光芯片31的感光路径与所述光窗333方向一致。
所述电路板32包括一电路板主体321和至少一电子元件322,所述感光芯片31电连接于所述电路板主体321,以便于向所述电路板32传递感光信息,所述镜头10位于所述感光芯片31的感光路径,以便于所述感光芯片31接收光线而进行感光。特别地,在一些实施方式中,所述感光芯片31可以通过表面贴装工艺SMT(Surface Mount Technology)被设置于所述电路板主体321,且通过至少一电连接元件313电连接于所述电路板主体321。所述电连接元件313举例地但不限于,金线、银线、铜线、铝线、焊锡、导电胶等。
所述电子元件322被设置于所述电路板主体321,举例地但不限于,所述电子元件322通过SMT工艺贴装于所述电路板主体321。所述电子元件322包括但不限于电阻、电容、驱动器件等。
在本发明的这个实施例中,所述基座33一体封装于所述电路板主体321,并且一体地包覆于所述电子元件322,从而防止类似传统摄像模组100中灰尘、杂物粘附在所述电子元件322上污染所述感光芯片31而影响成像效果。可以理解的是,在另外的变形实施例中,也有可能所述电子元件322内埋于所述电路板主体321,即所述电子元件322可以不暴露在外。值得一提的是,在一些实施例中,所述电子元件322被设置于所述感光芯片31的周围,而在不同的实施方式中,所述电子元件322的设置位置可以根据需要进行设计布局,比如集中于一侧或者两侧,或者设置于所述电路板主体321的背面等,可以和所述感光芯片31的设置位置以及所述电连接元件313设置位置以及后续提出的所述补充支座332的形状相配合,从而更加合理地利用所述电路板主体321上的空间位置,尽可能减小所述摄像模组100的尺寸,
所述电路板32的所述电路板主体321可以是PCB硬板、PCB软板、软硬结合板、陶瓷电路板主体321等。值得一提的是,在本发明的这个优选实施例中,因为所述基座主体331可以完全包覆这些电子元件322,所以电子元件322可以不内埋于所述电路板主体321,所述电路板主体321只用于形成导通线路,从而使得最终制得的所述感光组件30得以厚度更小。
进一步地,根据本发明的实施例,所述基座主体331通过一体成型的方式设置于所述电路板32,比如模塑成型的方式,从而将所述基座33和所述电路板32稳定地固定,且减少额外的安装固定过程。比如减少胶水粘接的过程,连接更加稳定,省去胶水连接的高度,降低摄像模组100单元的高度。
举例地,所述基座33可以通过模具模塑一体成型的方式设置于所述电路板32,如模塑于电路板的方式,区别于传统的COB(Chip On Board)方式。通过模具一体成型的方式,可以较好地控制成型形状以及表面平整度,比如,使得基座主体331具有较好的平整度,从而为被安装的部件,比如所述镜头承载元件20、所述滤光元件40,提供平整的安装条件,从而有助于提高所述摄像模组100的光轴一致性。每个所述电子元件322可以通过诸如SMT工艺被相互间隔地贴装于所述电路板32的边缘区域,比如所述感光芯片31外侧。值得一提的是,每 个所述电子元件322可以分别位于所述电路板32的同侧或者相反侧,例如在一个具体示例中,所述感光芯片31和每个所述电子元件322可以分别位于所述电路板32的同一侧,并且所述感光芯片31被贴装于所述电路板32的芯片贴装区域,每个所述电子元件322分别被相互间隔地贴装于所述电路板32的边缘区域。所述基座主体331在成型后包覆每个所述电子元件322,以藉由所述基座主体331隔离相邻所述电子元件322和隔离所述电子元件322与所述感光芯片31。
在本发明的所述摄像模组100中,通过所述基座主体331在成型后包覆每个所述电子元件322的方式具有很多的优势,首先,所述基座主体331包覆每个所述电子元件322,以使相邻所述电子元件322之间不会出现相互干扰的不良现象,即便是相邻所述电子元件322的距离较近时也能够保证所述摄像模组100的成像品质,这样,可以使小面积的所述电路板32上能够被贴装更多数量的所述电子元件322,从而使所述摄像模组100的结构更加的紧凑,以有利于在控制所述摄像模组100的尺寸的基础上提高所述摄像模组100的成像品质;其次,所述基座主体331包覆每个所述电子元件322,从而无论是在水平方向还是在高度方向,在所述基座主体331和每个所述电子元件322之间都不需要预留安全距离,以能够减小所述摄像模组100的尺寸。第三,所述基座主体331包覆每个所述电子元件322,从而在所述基座主体331和所述电路板32间不需要使用胶水进行连接和调平,以有利于降低所述摄像模组100的高度尺寸。第四,所述基座主体331包覆每个所述电子元件322,在后续运输和组装所述摄像模组100以形成所述摄像模组100的过程中,所述基座主体331可以防止所述电子元件322晃动和脱落,从而有利于保证所述摄像模组100的结构稳定性。第五,所述基座主体331包覆每个所述电子元件322,在后续运输和组装所述摄像模组100以形成所述摄像模组100的过程中,能够防止污染物污染每个所述电子元件322,从而保证所述摄像模组100的成像品质。第六,所述基座主体331包覆所述电子元件322后能够将所述电子元件322与空气隔绝,通过这样的方式,能够减缓所述电子元件322的金属部分的氧化速度,有利于提高所述电子元件322和所述摄像模组100的环境稳定性。
值得一提的是,所述基座主体331一体成型于所述电路板主体321,并且包覆所述电路板32的所述电子元件322,从而使得所述基座主体331和所述电路板主体321具有较大的连接面积,连接更加稳定,且通过一体成型的方式具有较 好的结构强度,因此所述基座主体331可以牢固、可靠地支撑、固定所述摄像模组100的部件,从而保证了产品的良率。
还值得一提的是,对于高像素的摄像模组100单元,所述镜头10的镜片11数量不断增多,比如达到4p,5p,6p以及6p以上等,而当摄像模组100镜头10的镜片11数量增多时,同时需要满足光学性能的需求,比如提供充足的后焦距,以防止所述滤光元件40影响所述摄像模组100的成像质量,比如使得成像出现黑点,边缘像糊等,而根据本发明的实施例中,所述滤光元件40被安装于一体成型的所述基座33,从而可以为所述滤光元件40提供平整的安装条件,且可以通过所述基座33的高度有效地控制所述滤光元件40被安装的高度位置。
所述感光芯片31具有一感光区311和一非感光区312,所述感光区311用于进行感光作用,所述非感光区312312用于电连接于所述电路板32。在本发明的这个实施例中,所述非感光区312通过所述电连接元件313电连接于所述电路板32。
在发明的这个实施例中,所述感光芯片31位于所述基座主体331的内侧,也就是说,并没有被所述基座主体331一体封装。在本发明的这种实施例中,所述感光芯片31需要贴装于所述电路板32,比如胶水粘接,从而使得所述感光芯片31被稳定地固定,而后将所述感光芯片31通过所述电连接元件313电连接于所述电路板32,比如通过打金线的方式电连接于所述电路板32。当然,在本发明的其他实施例中,所述感光芯片31被设置于所述电路板32的方式开可以通过其他方式,比如内嵌、下沉、FC(Flip Chip,芯片倒装)等,本领域的技术人员应当理解的是,所述感光芯片31和所述电路板32的连接、安装方式并不是本发明的限制。
更具体地,在本发明的这个实施例中,所述基座33还包括一补充支座332,所述支座补充于所述基座主体331,形成封闭的所述光窗333。
所述基座主体331具有一安装槽3311,连通于所述光窗333。所述补充支座332被安装于所述安装槽3311,以便于为所述滤光元件40提供安装位置。
进一步,所述基座主体331具有至少一缺口3312,所述缺口3312连通所述光窗333和外部,补充支座332补充于所述缺口3312,从而形成侧面封闭的所述光窗333。
换句话说,在这种实施例中,所述基座主体331并不是闭合结构,而是开放 结构,而通过补充支座332的补充,使得所述基座主体331封闭。当然,在本发明的其他实施例中,所述基座主体331也可以是一闭合结构。
在本发明的这个实施例中,所述缺口3312向下延伸至所述电路板主体321。所述补充支座332包括至少一支座主体3321和一延伸腿3322,所述延伸腿3322自所述支座主体3321一体地向下延伸至所述电路板主体321,以便将所述缺口3312封闭。举例地但不限于,所述延伸腿3322通过粘接的方式连接于所述电路板主体321和/或所述基座主体331。所述支座主体3321被安装于所述安装槽3311。
值得一体的是,在本发明的这个实施例中,所述去边化镜筒12的所述弦边部121与所述补充支座332的所述延伸腿3322的位置相对应,从而使得所述延伸腿3322所在方向上,边缘可以更窄。在这个实施例中,所述电子元件322可以被集中设置于所述基座主体331所在的一侧,比如与所述延伸腿3322相对的一侧,从而使得所述延伸腿3322所在的一侧不需要设置所述电子元件322,不需要预留所述电子元件322的安装位置,也就是说,所述感光芯片31更靠近所述电路板主体321的边缘,而所述延伸腿3322由于其可以通过其他方式,比如注塑成型的方式形成,因此所述延伸腿3322的厚度可以相对于所述基座主体331的壁厚更小,而所述去边化镜筒12的所述弦边部121也是窄边化的方向,因此使得两者相互配合,使得摄像模组100的整体尺寸更加小。
当然,由上述可知,相对应传统的COB工艺的方式,所述基座33一体成型方式可以取的众多优势,其中包括使得基座33的尺寸向内缩减的优势,也就是说,在没有所述补充支座332的情况下,所述镜头10配合体积减小的所述基座33,仍旧可以使得所述摄像模组100的尺寸减小。
另一方面,对于一体成型的方式,使得所述基座33的尺寸得以减小,而所述镜头10和/或所述镜头承载元件20需要被安装于所述基座33,因此所述基座33需要提供充足的安装面积,因此相对于传统的尺寸较大的镜头10,所述基座33的尺寸也不能太小,也就是说,所述基座33的小型化尺寸受到传统镜头10的大小限制。而在本发明中,所述镜头10的去边化设计,使得所述镜头10的整体尺寸得以减小,对所述基座33的安装需求尺寸减小,从而使得所述基座33可以进一步小型化,由此可以看到,所述镜头10和所述基座33或者所述感光组件30的设计相互配合,可以使得所述摄像模组100的整体更加小型化,而单独的小型化所述镜头10或小型化所述感光组件30达到的效果都要差一点。
在本发明的这个实施例中,所述基座主体331具有一内侧壁,所述内侧壁具有倾斜角,从而方便模具制造,且减少杂散光反射至所述感光芯片31。比如,当所述侧壁为垂直角度时,到达所述基座主体331的光线的入射角较大,因此光线的反射角较大,比较容易向内侧反射,即向所述感光芯片31所在位置反射。而当所述内侧壁倾斜时,光线的入射角较小,同方向入射的光线,反射光线方向远离所述感光芯片31的位置偏移,从而倾斜的设置方式有助于减少杂散光的干扰。所述倾斜角的大小可以根据需求设置。当然,在一些实施例中,所基座主体331的所述内侧壁可以为竖直设置,也就是说,不存在所述倾斜角。
如图7至图9所示,是根据本发明的第一个优选实施例的所述镜头10不同变形实施方式。在这几个实施方式中示意所述去边镜片11的所述弦边1141和所述圆边1142被改变。
比如,在图7中所示的方式中,所述镜头10的所述去边化镜片,即所述第四镜片114包括两所述弦边1141和两所述圆边1142。也就是说,相对于圆形镜片,所述去边化镜片在两个边缘位置变窄。特别地,两所述弦边1141可以对称分布。
相应地,所述去边化镜筒12包括两所述弦边部121和两所述圆边部122,特别地,两所述弦边部121对称的设置。相对应传统圆形镜筒,所述去边化镜筒12在两个方向去边化设计,从而使得所述镜头10两个位置变窄。
特别地,所述第四镜片114的两所述弦边1141的曲率为0,两所述圆边1142的曲率>0。也就是说,两所述弦边1141是直线,两所述圆边1142是圆弧线。
进一步,所述去边化镜筒12的所述弦边部121和所述圆边部122的外边缘分别与所述弦边1141以及所述圆边1142相对应。
图8所示的方式中,所述镜头10的所述去边化镜片,即所述第四镜片114包括三所述弦边1141和三所述圆边1142。也就是说,相对于圆形镜片,所述去边化镜片在三个边缘位置变窄。特别地,三所述弦边1141可以对称分布。
相应地,所述去边化镜筒12包括三所述弦边部121和三所述圆边部122,特别地,三所述弦边部121对称的设置。相对应传统圆形镜筒,所述去边化镜筒12在三个方向去边化设计,从而使得所述镜头10三个位置变窄。
特别地,所述第四镜片114的三所述弦边1141的曲率为0,三所述圆边1142的曲率>0。也就是说,三所述弦边1141是直线,三所述圆边1142是圆弧线。
进一步,所述去边化镜筒12的所述弦边部121和所述圆边部122的外边缘分别与所述弦边1141以及所述圆边1142相对应。
图9所示的方式中,所述镜头10的所述去边化镜片,即所述第四镜片114包括四所述弦边1141和四所述圆边1142。也就是说,相对于圆形镜片,所述去边化镜片在四个边缘位置变窄。特别地,四所述弦边1141可以对称分布。
相应地,所述去边化镜筒12包括四所述弦边部121和四所述圆边部122,特别地,四所述弦边部121对称的设置。相对应传统圆形镜筒,所述去边化镜筒12在四个方向去边化设计,从而使得镜头10四个位置变窄。
特别地,所述第四镜片114的四所述弦边1141的曲率为0,四所述圆边1142的曲率>0。也就是说,四所述弦边1141是直线,四所述圆边1142是圆弧线。
进一步,所述去边化镜筒12的所述弦边部121和所述圆边部122的外边缘分别与所述弦边1141以及所述圆边1142相对应。
如图10和图11所示,是根据本发明的第一个优选实施例的所述镜头10的不同的变形实施方式。在这些实施例中,示意所述镜头10中的所述去边化镜片的数量可以被改变。
在图10所示的方式中,所述镜头10中的两所述镜片11被去边化。在图中所示,分别为第三镜片113和所述第四镜片114,且所述第三镜片113和所述第四镜片114分别包括一弦边1141和一圆边1142。当然,在本发明的其他实施例中。两所述去边化的镜片11还可以是其他任意两个镜片11。所述弦边1141和所述圆边1142的数量也可以为其他,比如如图7至9所示的数量。相应的,所述去边化镜筒12的内侧形状根据所述镜片11的形状改变。
图11所示的方式中,所述镜头10中的三所述镜片11被去边化。在图中所示,分别为第二镜片112、第三镜片113和所述第四镜片114,且第二镜片112、所述第三镜片113和所述第四镜片114分别包括一弦边1141和一圆边1142。当然,在本发明的其他实施例中。三所述去边化的镜片11还可以是其他任意三个镜片11。所述弦边1141和所述圆边1142的数量也可以为其他,比如如图7至9所示的数量。相应的,所述去边化镜筒12的内侧形状根据各所述镜片11的形状改变。
在上述的第一个优选实施例中,所述镜头10可以通过粘接固定的方式安装于所述镜头承载元件20,特别地,所述去边化镜筒12外部平整,不具有螺纹结 构。如图12所示,是根据本发明的第一个优选实施例的摄像模组100的另一变形实施方式中,所述去边化镜筒12外部具有螺纹,也就是说,所述镜头10被去边化后可以被应用具有螺纹结构所述镜头承载元件20。
如图13所示,是根据本发明的第二个优选实施例的摄像模组100。在这个实施例中,所述电子元件322被设置于所述电路板主体321的底部。因此,不需要在所述电路板主体321的顶部预留所述电子元件322的安装空间,从而使得所述基座主体331以及所述补充支座332的设计可以更加灵活,使得所述电路板主体321的需求不断减小,且所述镜头10可以相应地进行去边化设计,使得所述摄像模组100的整体尺寸减小。
进一步,在一些实施方式中,所示基座主体331一体地封装位于所述电路板主体321背面的所述电子元件322,以使得所示电子元件322被包覆。
如图14所示,是根据本发明第三个优选实施例的摄像模组100。在这种方式中,所述电子元件322被设置于所述电路板主体321的背面。所述基座33通过粘接方式安装于所述电路板主体321,也就是说,传统基座可以被应用于这种实施例中,但是由于不需要预留所述电子元件322的空间位置,因此可以使得基座33的尺寸减小,且所述镜头10去边化设计,使得所述摄像模组100的尺寸减小。
进一步,在一些实施例中,可以设置一模塑底座包覆所述电子元件322。也就是说,通过一体成型的方式将位于所述电路板主体321背面的所述电子元件封装,从而使其组装更加稳定。
如图15所示,是根据本发明的第四个优选实施例的摄像模组100。在这种方式中,所述基座33包括一基座主体331以及具有一光窗333。所述基座主体331一体成型于所述电路板32,形成所述光窗333,在这个实施例中,所述基座主体331是一闭合结构,也就是说,所述基座主体331不具有所述缺口3312。所述基座主体331具有一安装槽3311,所述滤光元件40被安装于所述安装槽3311。
如图16所示,是根据本发明的第五个优选实施例的摄像模组100。在这种方式中,所述基座33包括一基座主体331和一补充支座332。所述基座主体331一体成型于所述电路板32,形成所述光窗333,在这个实施例中,所述基座主体331是一闭合结构,也就是说,所述基座主体331不具有所述缺口3312。所述基座主体331具有一安装槽3311,所述补充支座332被安装于所述安装槽3311,所述滤光元件40被安装于所述补充基座33。不同于第一个优选实施例的是,在 这个方式中,所述补充支座332不具有所述延伸腿3322,也就是说,所述补充支座332并不直接连接于电路板32。
进一步,所述补充支座332下沉于所述光窗333内,以使得所述滤光元件40更加靠近所述感光芯片31,减小所述摄像模组100的后焦距。
如图17所示,是根据本发明的第六个优选实施例的摄像模组100示意图。与第一个实施例不同的是,所述电路板主体321具有一下沉区3211,所述感光芯片31被下沉地设置于所述下沉区3215,以便于降低所述感光芯片31和所述电路板主体321的相对高度。
所述下沉区3215可以被实施为一凹槽或通孔。也就是说,可以使得所述电路板主体321的两侧空间不连通或者连通。当所述下沉区3215为凹槽时,所述感光芯片31被设置于槽底,并且通过所述电连接元件313电连接于所述电路板主体321。所述电连接元件313的外端可以被电连接于所述凹槽的槽底,也可以被电连接于所述下沉区3215的外侧,本发明在这方面并不限制。更进一步,所述感光芯片31的顶面可以与所述电路板主体321顶面一致,或者高于所述电路板主体321的顶面,或者低于所述电路板主体321的顶面,也就是说,本发明并不限制下沉深度。
进一步,在本发明的这个实施例附图中,所述下沉区3215为一通孔,也就是说,所述电路板32两侧通过所述通孔连通。所述摄像模组100的所述电路板32包括一底板323,叠层设置于电路板主体321的底部,以便于支撑所述感光芯片31,且增强所述电路板主体321的结构强度。也就是说,所述感光芯片31,被下沉设置于所述下沉区3215,且被所述底板323支撑。所述感光芯片31通过所述电连接元件313电连接于所述电路板主体321。
在一些实施例中,所述底板323可以为一金属板,通过贴附的方式设置于所述电路板主体321底部。
如图18所示,是根据本发明的第七个优选实施例的摄像模组100。
所述摄像模组100的所述感光组件30的所述基座33一体封装所述感光芯片31的至少部分所述非感光区312。换句话说,所述基座33一体成型地封装所述电路板32、所述感光芯片31,从而使得所述感光芯片31被稳定地固定,且增大了所述基座33的可成型区域。所述基座33包覆所述电连接元件313。
值得一提的是说,相对于上述第一个实施例中基座33只成型于所述电路板 的方式,模塑成型于感光芯片的方式将所述基座33可以进行一体成型的范围扩展至所述感光芯片31的所述非感光区312,从而在不影响所述感光芯片31的正常感光工作的情况下,增大了所述基座33底部的连接面积,从而可以使得所述基座33和所述电路板32以及所述感光芯片31更加稳定地连接,且顶部可以为其他部件,如所述镜头10、所述镜头承载元件20等,提供更大的可安装面积。且所述电连接元件313被所述基座33包覆,从而避免外部干扰所述电连接元件313,且防止所述电连接元件313氧化或沾染灰尘而影响所述摄像模组100的成像质量。
在这种实施方式中,所述基座33包括一支承元件334,用于在制造的过程中支撑模具,防止对所述电路板或所述感光芯片31的损伤。也就是说,在制造的过程中,可以将所述制造模具抵靠于所述支承元件334,从而使得模具不会直接接触所述电路板或所述感光芯片31,且防止成型材料向内侧溢流。
进一步,所述支承元件334可以为环形结构,与所述基座主体331的形状一致。所述支承元件334具有弹性,举例地但不限于,胶水涂层或胶垫。
如图19所示,是根据本发明的第八个优选实施例的摄像模组100。
在这个实施例中,所述电路板主体321具有一下沉区3215,所述感光芯片31被下沉地设置于所述下沉区3215,以便于降低所述感光芯片31和所述电路板主体321的相对高度。
下沉区3215可以被实施为一凹槽或通孔。也就是说,可以使得所述电路板主体321两侧不连通或者连通。当所述下沉区3215为凹槽时,所述感光芯片31被设置于槽底,并且通过所述电连接元件313电连接于所述电路板主体321。所述电连接元件313的外端可以被电连接于所述凹槽的槽底,也可以被电连接于所述下沉区3215的外侧,本发明在这方面并不限制。更进一步,所述感光芯片31的顶面可以与所述电路板主体321顶面一致,或者低于所述电路板主体321的顶面,或者高于所述电路板主体321的顶面,也就是说,本发明并不限制下沉深度。
进一步,在本发明的这个实施例附图中,所述下沉区3215为一通孔,也就是说,所述电路板32两侧空间通过所述通孔连通。
所述摄像模组100的所述感光组件30的所述基座33一体封装所述感光芯片31的至少部分所述非感光区312。换句话说,所述基座33一体成型地封装所述电路板、所述感光芯片31,从而使得所述感光芯片31被稳定地固定,且增大了 所述基座33的可成型区域。所述基座33包覆所述电连接元件313。
值得一提的是说,相对于上述第一个实施例中基座33只成型于所述电路板的方式,模塑成型于感光芯片的方式将所述基座33可以进行一体成型的范围扩展至所述感光芯片31的所述非感光区312,从而在不影响所述感光芯片31的正常感光工作的情况下,增大了所述基座33底部的连接面积,从而可以使得所述基座33和所述电路板32以及所述感光芯片31更加稳定地连接,且顶部可以为其他部件,如所述镜头10、所述镜头承载元件20等,提供更大的可安装面积。且所述电连接元件313被所述基座33包覆,从而避免外部干扰所述电连接元件313,且防止所述电连接元件313氧化或沾染灰尘而影响所述摄像模组100的成像质量。
在这个实施例中,所述感光芯片31以及所述电连接元件313被所述基座33一体封装,因此通过所述基座33可以固定所述感光芯片31。在所述电路板32底部可以设置一底板323,也可以不设置所述底板323。
如图20所示,是根据本发明的第九个优选实施例的摄像模组100示意图。
所述滤光元件40被对应地设置于所述感光组件30,所述基座33在成型后将所述感光组件30和所述滤光元件40结合为一体,以使其形成一体式结构。也就是说,不同于上述实施例的是,所述滤光元件40通过一体成型的方式被设置于所述基座33,而不同单独的方式设置于所述基座33,比如粘接方式。
所述滤光元件40被对应地设置于所述感光组件30,以在所述滤光元件40和所述感光组件30之间形成至少一密封空间,其中所述感光组件30的所述感光芯片31的所述感光区分别位于所述密封空间,以在进行模塑工艺而形成所述基座33的过程中,用于形成所述基座33的成型材料不会进入所述密封空间,从而使所述基座33仅形成在所述密封空间的外部,其中所述基座33在成型后包覆所述电路板32的一部分和所述滤光元件40的一部分,并且所述基座33具有所述光窗333,所述感光芯片31的所述感光区对应于所述光窗333,以使所述光窗333给所述镜头10和所述感光芯片31提供一光线通路。
图21是根据本发明的第十个优选实施例的摄像模组100。
在本发明的这个实施例中,所述感光组件30包括一遮挡镜片14,所述遮挡镜片14被设置于所述感光芯片31上方,所述遮挡镜片14被所述基座33一体封装。被物体反射的光线自所述镜头10以及所述遮挡镜片14进入所述摄像模组 100的内部,以在后续被所述感光芯片31接收和进行光电转化,从而得到与物体相关联的影像。所述遮挡镜片14的设置能够降低光学的TTL(镜头10通光孔上面的镜头10平面到芯片的感光平面的距离),从而在不影响光学性能的前提下使所述摄像模组100的尺寸进一步减小,满足电子设备对搭载小尺寸的摄像模组100的需求。同时,所述遮挡镜片14的设置也能够降低污点敏感度。例如在一实施例中,可以降低50%的污点敏感度。
在本发明的这个优选实施例中,优选地,所述遮挡镜片14被实施为一热硬化性质的镜片,即所述遮挡镜片14被实施为一热硬化镜片,从而所述遮挡镜片14在进行模塑工艺能够承受住模塑工艺中的环境温度。例如,在一实施例的模塑工艺中能够承受180℃的模塑环境温度。也就是说,在模塑工艺之前,耐高温的且经过了热硬化处理的所述遮挡镜片14被连接于所述支承元件334,且和所述电路板32以及所述感光芯片31一起被放置于模具中,流体的固化模塑材料围绕所述支承元件334以及所述遮挡镜片14的外表面模塑一体成型所述基座33,从而所述基座33能够一体地成型于所述电路板32,也就是说,所述基座33、所述电路板32以及所述遮挡镜片14形成一体式结构。本领域的技术人员可以理解的是,本发明的所述遮挡镜片14不仅仅可以是热硬化镜片,还可以是其他性质的镜片11,本发明并不受此限制。
进一步地,所述遮挡镜片14包括一镜片主体141和设置在所述镜片主体141周围的一镜片周缘142。由于所述遮挡镜片14为精密的光学元件,所述镜片主体141的边缘较薄。而设置于所述镜片主体141边缘的且为一体连接的所述镜片周缘142为增厚式支架设计,能够承载所述镜片主体141,从而不影响所述镜片主体141的光学性能的同时能够使所述镜片主体141在模具中被一体模塑连接于所述基座33。也就是说,在所述基座33被成型之前,所述遮挡镜片14的所述镜片周缘142被设置于所述感光芯片31的所述非感光区312,所述遮挡镜片14的所述镜片主体141被设置于所述感光组件30的所述感光芯片31的感光路径;在所述基座33成型之后,所述基座33包覆所述电路板32、所述感光芯片31的至少部分所述非感光区312、所述支承元件334的至少部分以及所述遮挡镜片14的所述镜片周缘142,以形成所述感光组件30。
值得一提的是,所述遮挡镜片14也可以为所述去边化镜片,从而减小所述镜片11的边缘部分,减小所述遮挡镜片14的面积,使得所述遮挡镜片14和所 述镜头10的形状相对应。
图22是根据本发明的第十一个优选实施例的摄像模组100。
所述电路板主体321包括一第一板体3211和一第二板体3212,所述第一板体3211和所述第二板体3212通过一连接介质3213固定连接。所述第一板体3211可以为一硬板,所述第二板体3212可以为一软板,所述连接介质3213可以为ACF导电胶。所述第二板体3212还可以包括一接口端,比如设置一连接器,以便于电连接于一电子设备。
在一些实施例中,所述基座主体331一体成型于所述第一板体3211,所述第二板体3212搭接于所述第一板体3211的一端部。在制造的过程中,可以先通过所述第一板体3211和所述第二板体3212形成所述电路板主体321,再进行一体成型,也可以先在所述第一板体3211上进行一体成型,而后将所述第二板体3212电连接于所述第一板体3211,比如通过所述ACF导电胶固定于所述第一板体3211。
值得一提的是,在图22中所示,所述第二板体3212通过所述连接介质3213连接于所述第一板体3211的上部,本发明的其他实施例中,所述第二板体3212通过所述连接介质3213连接于所述第一板体3211的底部,本发明在这方面并不限制。
图23是根据本发明的第十二个优选实施例的摄像模组100。
在这个实施例中,所述电路板主体321设有一倒贴槽3214,所述感光芯片31以倒贴的方式被安装于所述倒贴槽3214。也就是说,将所述感光芯片31通过FC(Flip Chip,倒装芯片)方式被安装于所述电路板主体321。所述倒贴槽3214与所述镜头10方向相对。
也就是说,在安装的过程中,所述感光芯片31从所述电路板主体321下方向所述电路板主体321安装,所述感光芯片31的所述感光区通过所述倒贴槽3214进行感光作用。
图24是根据本发明第十四个优选实施例的摄像模组示意图。
在这个实施例中,所述镜头承载元件20一体地连接于所述基座33,所述镜头10适于被安装于所述镜头承载元件20,以便于形成一定焦摄像模组。
进一步,所述镜头承载元件20自所述基座主体331至少部分地一体向上延伸,以便于形成封闭的镜头限位空间。也就是说,在这种方式中,所述基座33 包括所述镜头承载于元件20,为所述镜头10提供限位、安装空间。
在制造的过程中,可以采用模具在所述电路板32上一体成型带有所述镜头承载元件20的所述基座33。也可以通过二次模塑的方式,在形成所述基座主体之后,再在所述基座主体上形成所述镜头承载元件,本发明在这方面并不限制。
图25A,25B是根据本发明的第十五个优选实施例的摄像模组100示意图。
在这个实施例中,所述镜头10包括至少两镜头单元,各所述镜头单元的光路一致。进一步,各所述镜头单元中至少一所述镜头单元为去边化镜头单元。也就是说,其中至少一所述镜头单元包括至少一所述去边化镜片。
具体地,在这个实施方式中,所述镜头10包括两所述镜头单元,分别为第一镜头单元110和一第二镜头单元120,所述第一镜头单元110和所述第二镜头120单元自下而上叠层设置。其中所述第一镜头单元110为去边化镜头。所述第一镜头单元110和所述第二镜头单元120各自独立,也就是说,在制造的过程中,可以分别各自形成所述第一镜头单元110和所述第二镜头单元120后,再将两个镜头单元组装,比如胶水粘接。
进一步,所述第一镜头单元110包括四镜片11,分别为一第一镜片111,一第二镜片112,一第三镜片113和一第四镜片114,其中所述第四镜片114为去边化镜片。所述第一镜头单元110包括一去边化镜筒12,各所述镜片11分别被安装于所述镜筒12内。
值得一提的是,在镜头的制造过程中,光轴的一致性以及镜片之间的相对角度关系是影响镜头成像质量的一些重要因素。在组装各所述镜片和所述镜头时,需要调整相对位置,尤其是最后一枚镜片的位置。最后一枚镜片被组装的方式通常是先预组装于所述镜片,而后调整所述镜片的方位,比如转动预定角度,从而使得镜头具有较好的成像。而在这个实施例中,所述镜片的相对位置的调整,可以通过调整所述第二镜头单元120来实现。也就是说,在组装所述镜10时,先组装得到所述第一镜头单元110和所述第二镜头单元120,而后预组装所述第一镜头单元110和所述第二镜头单元120,而后转动所述第二镜头单元120或所述第一镜头单元110,调整所述第一镜头单元110和所述第二镜头单元120的相对位置,使得所述镜头10的成像质量达到成像质量要求范围或者取得更好的成像效果,即达到了调整镜片之间相对位置关系的目的。
图26A、26B是根据本发明的第十五个优选实施例的摄像模组和感光组件示 意图。在本发明的这个实施例中,所述第一板体所述电路板主体321包括一第一板体3211和一第二板体3212,所述第二板体3212电连接于所述第一板体3211。所述第一板体3211可以为一硬板,所述第二板体3212可以为一软板。举例地,所述第二板体3212可以压合的方式电连接于所述第一板体3211,也可以通过一导电介质电连接于所述第一板体3211。所述第二板体3212还可以包括一接口端,比如设置一连接器,以便于电连接于一电子设备,也就是说,所述第二板体3212是一电连接端,用于电连接其他设备,比如电子设备。
进一步,所述镜头10的所述去边化镜片的所述弦边1141和所述去边化镜筒12的所述弦边部121靠近所述第二板体3212的一侧。具体地,所述基座主体331包括四侧边,分别为一第一侧边33101,一第二侧边33102、一第三侧边33103、一第四侧边33104,所述第一侧边33101、所述第二侧边33102、所述第三侧边33103、所述第四侧边33104依次相互邻接闭合形成所述光窗333。所述第二侧边33102和所述第四侧边33104位于所述第一侧边33101的两侧,所述第三侧边33103和所述第一侧边33101相对。
一支座3320被安装于所述基座主体331,所述滤光元件40被安装于所述支座3320,以使得所述滤光元件40位于所述感光芯片31的感光路径。
在本发明的这个实施例中,所述第一侧边33101邻近所述第二板体3212,所述镜头10的所述去边化镜片的所述弦边1141位于所述第一侧边33101方向。也就是说,所述去边化镜片的所述弦边1141和所述去边化镜筒12的所述弦边部121靠近所述摄像模组100的接口端。
进一步,在本发明的这个实施例中,所述电子元件332和所述电连接元件313被设置于所述基座的所述第二侧边33102和所述第四侧边33104,充分利用所述第二侧边33102和所述第四侧边33104对应的所述电路板主体321的位置。即,所述电子元件332和所述电连接元件313被设置于所述第二侧边33102和所述第四侧边33104对应的所述第一板体的位置。特别地,所述电子元件332和所述电连接元件313被设置于与所述去边化镜片的所述弦边1141垂直的方向,从而使得所述弦边1141所在方向的尺寸最大化的减小。值得一提的是,在本发明的这个实施例中,所述电连接元件313和所述电子元件332被设置于相对的两侧,而在本发明的其他实施例中,所述电连接元件313和所述电子元件332可以根据需要设置于所述感光芯片31的任意两侧、三侧或者四侧,也就是说,所述电子 元件332和/或所述电连接元件313可以选择性地设置于所述基座主体331的所述第一侧边33101、所述第二侧边33102、所述第三侧边33103和所述第四侧边33104中一侧边、两侧边、三侧边或四侧边,本发明在这方面并不限制。
值得一提的是,在一些实施例中,所述弦边1141位于所述第一侧边33101的方向,所述第一侧边33101对应的位置不设置所述电子元件332,从而使得所述第一侧边33101的宽度尺寸要求降低,从而提高所述摄像模组体积进一步缩小的可能性。也就是说,所述电子元件332和所述电连接元件313的设置位置可以根据所述弦边1141的设置方向而调整。
更进一步,在本发明的这个实施例中,所述第一侧边33101的宽度尺寸较小,适应所述镜头10的去边化设计,即适应所述去边化镜片的所述弦边1141和所述去边化镜筒12的所述弦边部121。特别地,所述第一侧边33101宽度尺寸W1小于所述第二侧边33102和所述第四侧边33104的宽度尺寸W2、W4。
图27A、27B是根据本发明的第十六个优选实施例的摄像模组和感光组件示意图。不同于第十五个实施例的是,在本发明的这个实施例中,所述第三侧边33103远离所述第二板体3212,所述镜头10的所述去边化镜片的所述弦边1141和所述去边化镜筒12的所述弦边部121位于所述第三侧边33101方向。也就是说,所述去边化镜片的所述弦边1141和所述去边化镜筒12的所述弦边部121远离所述摄像模组100的电连接端。即所述去边化镜片的所述弦边1141位于与所述第二板体3212相对的一侧。
更进一步,在本发明的这个实施例中,所述第三侧边33103的宽度尺寸较小,适应所述镜头10的去边化设计,即适应所述去边化镜片的所述弦边1141和所述去边化镜筒12的所述弦边部121。特别地,所述第三侧边33101宽度尺寸W3小于所述第二侧边33102和所述第四侧边33104的宽度尺寸W2、W4。
图28A、28B是根据本发明的第十七个优选实施例的摄像模组和感光组件示意图。在本发明的这个实施例中,所述去边化镜片包括两所述弦边1141,所述去边化镜筒12包括两所述弦边部121。所述去边化镜片的一个所述弦边1141和所述去边化镜筒12的一各所述弦边部121位于靠近所述第二板体3212的一侧。一所述去边化镜片的另一个所述弦边1141和所述去边化镜筒12的另一个所述弦边部121位于远离所述第二板体3212的一侧。
进一步,所述去边化镜片的一个所述弦边1141和所述去边化镜筒12的一各 所述弦边部121位于所述基座主体331的所述第一侧边33101。所述去边化镜片的另一个所述弦边1141和所述去边化镜筒12的另一个所述弦边部121位于所述基座主体331的所述第三侧板33103。
图29是根据本发明的第十五个优选实施例的阵列摄像模组示意图。
在这种实施方式中,所述阵列摄像模组包括多个所述摄像模组100,从而使得各所述模组相互配合工作。特别地,各所述摄像模组100分体地设置,也就是说,各所述摄像模组100的所述电路板32以及所述基座33可以不连接。
进一步,各所述摄像模组100可以通过一外框体50组装。
进一步,在一些实施例中,所述阵列摄像模组可以由本发明的所述摄像模组100与传统摄像模组而成,也就是说,所述阵列摄像模组包括至少一所述摄像模组100。
图30是根据本发明的第十六个优选实例的阵列摄像模组示意图。
在这种实施方式中,所述阵列摄像模组100包括多个所述摄像模组100,从而使得各所述模组相互配合工作。特别地,各所述摄像模组100连体地设置,也就是说,各所述摄像模组100的所述电路板32以及所述基座33可以相互连接,从而形成一整体结构。
进一步,在一些实施例中,所述阵列摄像模组可以由本发明的所述摄像模组100与传统摄像模组组合而成,也就是说,所述阵列摄像模组包括至少一所述摄像模组100。至少一所述摄像模组100可以和传统的摄像模组连体构成所述阵列摄像模组。
图31是根据本发明的上述优选实施例的镜头10制造方法示意图。本发明提供一镜头10的制造方法1000,所述方法包括步骤:
1101:注塑成型至少一去边化镜片;
1102:注塑成型一去边化镜筒12;和
1103:将所述去边化镜片按预定位置安装于所述去边化镜筒12。
图32是根据本发明的上述优选实施例的摄像模组100应用示意图。
本发明进一步提供一电子设备300,其中所述电子设备包括一电子设备本体200和至少一所述摄像模组100,其中所述摄像模组100分别被设置于所述电子设备本体200,以用于获取图像。值得一提的是,所述电子设备本体200的类型不受限制,例如所述电子设备本体200可以是智能手机、可穿戴设备、平板电脑、 笔记本电脑、电子书、个人数字助理、相机、监控装置等任何能够被配置所述摄像模组100的电子设备。本领域的技术人员可以理解的是,尽管附图32中以所述电子设备本体200被实施为智能手机为例,但其并不构成对本发明的内容和范围的限制。
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。

Claims (145)

  1. 一镜头,其特征在于,包括:至少一去边化镜片,其中所述去边化镜片包括至少一弦边和至少一圆边,所述弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同。
  2. 根据权利要求1所述的镜头,其中所述弦边的曲率为0,是直线段。
  3. 根据权利要求1所述的镜头,其中所述圆边的曲率>0,是一弧形线段。
  4. 根据权利要求1所述的镜头,其中所述弦边为直线,所述圆边为圆弧。
  5. 根据权利要求1所述的镜头,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
  6. 根据权利要求1所述的镜头,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
  7. 根据权利要求1所述的镜头,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
  8. 根据权利要求7所述的镜头,其中所述弦边是直线段。
  9. 根据权利要求1至8任一所述的镜头,其中所述镜头包括多个镜片,其中至少一个为所述去边化镜片,至少一个为圆形镜片。
  10. 根据权利要求9所述的镜头,其中所述去边化镜片的尺寸大于所述圆形镜片。
  11. 根据权利要求9所述的镜头,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
  12. 根据权利要求9所述的镜头,其中所述镜头包括一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内。
  13. 根据权利要求12所述的镜头,其中所述去边化镜筒包括一弦边部和一圆边部,其中所述弦边部和所述圆边部的截面边缘曲率不同。
  14. 根据权利要求13所述的镜头,其中所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部相对应。
  15. 根据权要求13所述的镜头,其中所述去边化镜片通过注塑方式一次成型制造。
  16. 根据权利要求13所述的镜头,其中所述镜头包括至少一光路元件,其 中所述光路元件被设置于与所述镜片之间,以便于在所述镜片形成预定光线通路。
  17. 根据权利要求16所述的镜头,其中位于所述去边化镜片的所述光路元件的外边缘形状与所述去边化镜片形状一致。
  18. 根据权利要求16所述的镜头,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
  19. 一摄像模组,其特征在,包括:
    一镜头,其中所述镜头包括至少一去边化镜片,其中所述去边化镜片包括至少一弦边和至少一圆边,所述弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同;和
    一感光组件,其中所述镜头位于所述感光组件的感光路径。
  20. 根据权利要求19所述的摄像模组,其中所述弦边的曲率为0,是直线段。
  21. 根据权利要求19所述的摄像模组,其中所述圆边的曲率>0,是一弧形线段。
  22. 根据权利要求19所述的摄像模组,其中所述弦边为直线,所述圆边为圆弧。
  23. 根据权利要求19所述的摄像模组,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
  24. 根据权利要求19所述的摄像模组,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
  25. 根据权利要求19所述的摄像模组,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
  26. 根据权利要求25所述的摄像模组,其中所述弦边是直线段。
  27. 根据权利要求19所述的摄像模组,其中所述镜头包括多个镜片,其中至少一个为所述去边化镜片,至少一个为圆形镜片。
  28. 根据权利要求27所述的摄像模组,其中所述去边化镜片的尺寸大于所述圆形镜片。
  29. 根据权利要求27所述的摄像模组,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
  30. 根据权利要求27所述的摄像模组,其中所述镜头包括一去边化镜筒, 所述去边化镜片被安装于所述去边化镜筒内。
  31. 根据权利要求30所述的摄像模组,其中所述去边化镜筒包括一弦边部和一圆边部,其中所述弦边部和所述圆边部的截面边缘曲率不同。
  32. 根据权利要求31所述的摄像模组,其中所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部相对应。
  33. 根据权要求27所述的摄像模组,其中所述去边化镜片通过注塑方式一次成型制造。
  34. 根据权利要求27所述的摄像模组,其中所述镜头包括至少一光路元件,其中所述光路元件与所述镜片相邻设置,以便于在所述镜片形成预定光线通路。
  35. 根据权利要求34所述的摄像模组,其中位于所述去边化镜片的所述光路元件的外边缘形状与所述去边化镜片形状一致。
  36. 根据权利要求35所述的摄像模组,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
  37. 根据权利要求19至36任一所述的摄像模组,其中所述感光组件包括至少一基座、至少一感光芯片和至少一电路板,其中所述基座被设置于电路板,以便于提供一安装位置,所述感光芯片电连接于所述电路板,所述镜头位于所述感光芯片的感光路径。
  38. 根据权利要其37所述的摄像模组,其中所述基座一体成型于所述电路板,形成至少一光窗,为所述感光芯片提供光线通路。
  39. 根据权利要求38所述的摄像模组,其中所述基座包括一基座主体和补充基座,所述基座主体具有一缺口,所述补充基座补充一所述缺口,从而形成一封闭的所述光窗。
  40. 根据权利要求39所述的摄像模组,其中所述镜头的去边化位置和所述补充基座的位置相对应。
  41. 根据权利要求37所述的摄像模组,其中所述基座被粘接固定于所述电路板。
  42. 根据权利要求37所述的摄像模组,其中所述电路板包括一电路板主体和至少一电子元件,所述电子元件被设置于所述电路板主体,其中所述基座一体成型于所述电路板主体,并且包覆至少一所述电子元件。
  43. 根据权要求37所述的摄像模组,其中所述电路板包括一电路板主体和 至少一电子元件,其中至少一所述电子元件被设置于所述电路板主体的底部。
  44. 根据权利要求37所述的摄像模组,其中所述电路板具有一下沉区,所述感光芯片被下沉地设置于所述下沉区。
  45. 根据权利要求44所述的摄像模组,其中所述下沉区选择凹槽、通孔中的一种。
  46. 根据权利要求37所述的摄像模组,其中所述感光芯片具有一感光区和一非感光区,所述基座一体封装至少部分所述非感光区。
  47. 根据权利要求37所述的摄像模组,其中所述摄像模组包括至少一滤光元件,其中所述基座一体封装所述滤光元件。
  48. 根据权利要求37所述的摄像模组,其中所述摄像模组包括一遮挡镜片,所述遮挡镜片位于所述感光芯片上方,被所述基座一体封装。
  49. 根据权利要求48所述的摄像模组,其中所述遮挡镜片是所述去边化镜片。
  50. 根据权利要求37所述的摄像模组,其中所述摄像模组包括一镜头承载元件,其中所述镜头被安装于所述镜头承载元件,所述镜头承载元件被安装于所述基座。
  51. 根据权利要求50所述的摄像模组,其中所述镜头承载元件是一驱动部件,以形成一动焦摄像模组。
  52. 根据权利要求50所述的摄像模组,其中所述镜头承载元件是一镜头固定部件,以形成一定焦摄像模组。
  53. 根据权利要求50所述的摄像模组,其中所述镜头承载元件一体连接于所述基座,所述镜头被安装于所述镜头承载元件,以形成一定焦模组。
  54. 根据权利要求37所述的摄像模组,其中多个所述摄像模组构成一阵列摄像模组。
  55. 根据权利要求37所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于靠近所述第二板体一侧。
  56. 根据权利要求37所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板 体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于远离所述第二板体的一侧。
  57. 根据权利要求37所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,其中一所述弦边位于靠近所述第一板体的一侧,另一所述弦边位于远离所述第二板体的一侧。
  58. 根据权利要求55所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述弦边位于所述第一侧边方向。
  59. 根据权利要求58所述的摄像模组,其中所述第一侧边的宽度尺寸小于第二侧边和所述第四侧边的宽度尺寸。
  60. 根据权利要求56所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,所述弦边位于所述第三侧边方向。
  61. 根据权利要求60所述的摄像模组,其中所述第三侧边的宽度尺寸小于第二侧边和所述第四侧边的宽度尺寸。
  62. 根据权利要求57所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边依次相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,其中一所述弦边位于所述第一侧边方向,另一所述弦边位于所述第三侧边方向。
  63. 根据权利要求55所述的摄像模组,其中所述电路板包括至少一电子元件,所述电子元件被设置于所述第一板体,其中所述基座一体成型于所述第一板体,并且包覆至少一所述电子元件。
  64. 根据权利要求63所述的摄像模组,其中所述电子元件被选择性地设置 于所述基座的四侧边中的一侧边、两侧边、三侧边或四侧边。
  65. 根据权利要求63所述的摄像模组,其中所述电子元件被设置于所述第第二侧边和所述第四侧边位置。
  66. 根据权利要求63所述的摄像模组,其中所述电子元件被设置于所述第一侧边和所述第三侧边位置。
  67. 根据权利要求55所述的摄像模组,其中所述感光芯片通过一电连接元件电连接于所述第一板体,所述基座一体成型于所述第一板体,并且包覆所述电连接元件。
  68. 根据权利要求67所述的摄像模组,其中所述电连接被选择性地设置于所述基座四侧中的两侧、三侧或四侧。
  69. 根据权利要求67所述的摄像模组,其中所述电连接元件被设置于所述第二侧边和所述第四侧边对应的位置。
  70. 根据权利要求67所述的摄像模组,其中所述电连接元件被设置于所述第一侧边和所述第三侧边对应的位置。
  71. 一镜头,其特征在于,包括:至少一去边化镜片和一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内,其中所述去边化镜片包括至少一弦边和至少一圆边,所述的弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同,所述去边化镜筒包括一弦边部,所述弦边部和所述去边化镜片的所述弦边对应,以便于减小所述镜头的体积。
  72. 根据权利要求71所述的镜头,其中所述弦边的曲率为0,是直线段。
  73. 根据权利要求71所述的镜头,其中所述圆边的曲率>0,是一弧形线段。
  74. 根据权利要求71所述的镜头,其中所述弦边为直线,所述圆边为圆弧。
  75. 根据权利要求71所述的镜头,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
  76. 根据权利要求71所述的镜头,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
  77. 根据权利要求71所述的镜头,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
  78. 根据权利要求72所述的镜头,其中所述弦边是直线段。
  79. 根据权利要求71至78任一所述的镜头,其中所述镜头包括多个镜片, 其中至少一个为所述去边化镜片,至少一个为圆形镜片。
  80. 根据权利要求79所述的镜头,其中所述去边化镜片的尺寸大于所述圆形镜片。
  81. 根据权利要求79所述的镜头,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
  82. 根据权利要求79所述的镜头,其中所述去边化镜片是位于最底端的镜片。
  83. 根据权利要求79所述的镜头,其中所述去边化镜筒包括一圆边部,所述圆边部和弦边部相接形成所述镜筒,其中所述弦边部和所述圆边部的截面边缘曲率不同。
  84. 根据权要求79所述的镜头,其中所述去边化镜片通过注塑方式一次成型制造。
  85. 根据权利要求79所述的镜头,其中所述去边化镜筒通过注塑方式一次成型制造。
  86. 根据权利要求79所述的镜头,其中所述镜头包括至少一光路元件,其中所述光路元件被设置于与所述镜片之间,以便于在所述镜片形成预定光线通路。
  87. 根据权利要求86所述的镜头,其中位于所述去边化镜片的所述光路元件的外边缘形状与所述去边化镜片形状一致。
  88. 根据权利要求86所述的镜头,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
  89. 根据权利要求79所述的镜头,其中所述镜头包括至少两镜头单元,各所述镜头单元光轴一致地叠层设置,至少一所述镜头单元包括一所述去边化镜片和一所述去边化镜筒。
  90. 一摄像模组,其特征在,包括:
    一镜头,所述镜头包括至少一去边化镜片和一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内,其中所述去边化镜片包括至少一弦边和至少一圆边,所述弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同,所述去边化镜筒包括一弦边部,所述弦边部和所述去边化镜片的所述弦边对应,以便于减小所述镜头的体积;和
    一感光组件,其中所述镜头位于所述感光组件的感光路径。
  91. 根据权利要求90所述的摄像模组,其中所述弦边的曲率为0,是直线段。
  92. 根据权利要求90所述的摄像模组,其中所述圆边的曲率>0,是一弧形线段。
  93. 根据权利要求90所述的摄像模组,其中所述弦边为直线,所述圆边为圆弧。
  94. 根据权利要求90所述的摄像模组,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
  95. 根据权利要求90所述的摄像模组,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
  96. 根据权利要求90所述的摄像模组,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
  97. 根据权利要求96所述的摄像模组,其中所述弦边是直线段。
  98. 根据权利要求90所述的摄像模组,其中所述镜头包括多个镜片,其中至少一个为所述去边化镜片,至少一个为圆形镜片。
  99. 根据权利要求98所述的摄像模组,其中所述去边化镜片的尺寸大于所述圆形镜片。
  100. 根据权利要求98所述的摄像模组,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
  101. 根据权利要求90所述的摄像模组,其中所述去边化镜筒一圆边部,所述圆边部和所述弦边部相接,其中所述弦边部和所述圆边部的截面边缘曲率不同。
  102. 根据权要求90所述的摄像模组,其中所述去边化镜片通过注塑方式一次成型制造。
  103. 根据权要求82所述的摄像模组,其中所述去边化镜筒通过注塑方式一次成型制造
  104. 根据权利要求90所述的摄像模组,其中所述镜头包括至少一光路元件,其中所述光路元件与所述镜片相邻设置,以便于在所述镜片形成预定光线通路。
  105. 根据权利要求104所述的摄像模组,其中位于所述去边化镜片的所述 光路元件的外边缘形状与所述去边化镜片形状一致。
  106. 根据权利要求105所述的摄像模组,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
  107. 根据权利要求90所述的摄像模组,其中所述镜头包括至少两镜头单元,各所述镜头单元光轴一致地叠层设置,至少一所述镜头单元包括一所述去边化镜片和一所述去边化镜筒。
  108. 根据权利要求90至107任一所述的摄像模组,其中所述感光组件包括至少一基座、至少一感光芯片和至少一电路板,其中所述基座被设置于电路板,以便于提供一安装位置,所述感光芯片电连接于所述电路板,所述镜头位于所述感光芯片的感光路径。
  109. 根据权利要其108所述的摄像模组,其中所述基座一体成型于所述电路板,形成至少一光窗,为所述感光芯片提供光线通路。
  110. 根据权利要求109所述的摄像模组,其中所述基座包括一基座主体和补充基座,所述基座主体具有一缺口,所述补充基座补充一所述缺口,从而形成一封闭的所述光窗。
  111. 根据权利要求108所述的摄像模组,其中所述镜头的去边化位置和所述补充基座的位置相对应。
  112. 根据权利要求108所述的摄像模组,其中所述基座被粘接固定于所述电路板。
  113. 根据权利要求108所述的摄像模组,其中所述电路板包括一电路板主体和至少一电子元件,所述电子元件被设置于所述电路板主体,其中所述基座一体成型于所述电路板主体,并且包覆至少一所述电子元件。
  114. 根据权利要求108所述的摄像模组,其中所述电路板包括一电路板主体和至少一电子元件,至少一所述电子元件被设置于所述电路板主体的底部。
  115. 根据权利要求108所述的摄像模组,其中所述电路板具有一下沉区,所述感光芯片被下沉地设置于所述下沉区。
  116. 根据权利要求115所述的摄像模组,其中所述下沉区选择凹槽、通孔中的一种。
  117. 根据权利要求108所述的摄像模组,其中所述感光芯片具有一感光区和一非感光区,所述基座一体封装至少部分所述非感光区。
  118. 根据权利要求108所述的摄像模组,其中所述摄像模组包括至少一滤光元件,所述基座一体封装所述滤光元件。
  119. 根据权利要求108所述的摄像模组,其中所述摄像模组包括一遮挡镜片,所述遮挡镜片位于所述感光芯片上方,被所述基座一体封装。
  120. 根据权利要求119所述的摄像模组,其中所述遮挡镜片是所述去边化镜片。
  121. 根据权利要求108所述的摄像模组,其中所述摄像模组包括一镜头承载元件,其中所述镜头被安装于所述镜头承载元件,所述镜头承载元件被安装于所述基座。
  122. 根据权利要求121所述的摄像模组,其中所述镜头承载元件是一驱动部件,以形成一动焦摄像模组。
  123. 根据权利要求121所述的摄像模组,其中所述镜头承载元件是一镜头固定部件,以形成一定焦摄像模组。
  124. 根据权利要求121所述的摄像模组,其中所述镜头承载元件一体连接于所述基座,所述镜头被安装于所述镜头承载元件,以形成一定焦模组。
  125. 根据权利要求108所述的摄像模组,其中多个所述摄像模组构成一阵列摄像模组。
  126. 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于靠近所述第二板体一侧。
  127. 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部位于靠近所述第二板体一侧。
  128. 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于远离所述第二板体的一侧。
  129. 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体 和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部位于远离所述第二板体的一侧。
  130. 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,其中一所述弦边位于靠近所述第一板体的一侧,另一所述弦边位于远离所述第二板体的一侧。
  131. 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,所述去边化镜筒包括两所述弦边部,其中一所述弦边和一所述弦边部位于靠近所述第一板体的一侧,另一所述弦边和所述弦边部位于远离所述第二板体的一侧。
  132. 根据权利要求126所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述弦边位于所述第一侧边方向。
  133. 根据权利要求132所述的摄像模组,其中所述第一侧边的宽度尺寸小于所述第二侧边和所述第四侧边的宽度尺寸。
  134. 根据权利要求128所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,所述弦边位于所述第三侧边方向。
  135. 根据权利要求134所述的摄像模组,其中所述第二侧边的宽度尺寸小于第二侧边和所述四侧边的宽度尺寸。
  136. 根据权利要求130所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边依次相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,其中一所述弦边位于所述第一侧边方向,另一所述弦边位于所述第三侧边 方向。
  137. 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体。
  138. 根据权利要求137所述的摄像模组,其中所述电路板包括至少一电子元件,所述电子元件被设置于所述第一板体,其中所述基座一体成型于所述第一板体,并且包覆至少一所述电子元件。
  139. 根据权利要求137所述的摄像模组,其中所述电子元件被选择性地设置于所述基座的四侧边中的一侧边、两侧边、三侧边、四侧边。
  140. 根据权利要求137所述的摄像模组,其中所述电子元件被设置于所述第第二侧边和所述第四侧边位置。
  141. 根据权利要求137所述的摄像模组,其中所述电子元件被设置于所述第一侧边和所述第三侧边位置。
  142. 根据权利要求137所述的摄像模组,其中所述感光芯片通过一电连接元件电连接于所述第一板体,所述基座一体成型于所述第一板体,包覆所述电连接元件。
  143. 根据权利要求137所述的摄像模组,其中所述电连接被选择性地设置于所述基座四侧中的两侧、三侧或四侧。
  144. 根据权利要求137所述的摄像模组,其中所述电连接元件被设置于所述第二侧边和所述第四侧边对应的位置。
  145. 根据权利要求137所述的摄像模组,其中所述电连接元件被设置于所述第一侧边和所述第三侧边对应的位置。
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