WO2018137706A1 - 镜头和摄像模组及其制造方法 - Google Patents
镜头和摄像模组及其制造方法 Download PDFInfo
- Publication number
- WO2018137706A1 WO2018137706A1 PCT/CN2018/074319 CN2018074319W WO2018137706A1 WO 2018137706 A1 WO2018137706 A1 WO 2018137706A1 CN 2018074319 W CN2018074319 W CN 2018074319W WO 2018137706 A1 WO2018137706 A1 WO 2018137706A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lens
- camera module
- chord
- edge
- base
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/004—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having four lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B2003/0093—Simple or compound lenses characterised by the shape
Definitions
- the invention relates to the field of camera modules, and further relates to a lens and a camera module and a manufacturing method thereof, in particular to an ultra-narrow lens and a camera module, which greatly reduces the size of the camera module, and is compact for the smart device. It is convenient to use the camera module.
- camera modules are already indispensable devices in smart devices. Moreover, the high performance of the camera module is the main direction for the improvement and development of smart devices, and is the key to the performance of smart devices.
- the traditional lens and camera module is shown in Figure 1.
- the conventional camera module includes at least one lens 10P, a lens barrel 20P, a lens holder 30P, and a circuit assembly 40P, wherein the lens 10P is a circular lens, and the lens barrel 20P is a cylindrical cylindrical structure.
- the lens holder 30P has a square structure, and the circuit assembly 40P has a square shape.
- the lens barrel 20P wraps and supports the lens 10P, so that the outer shape of the lens barrel 20P and the lens 10P correspond to each other, that is, the lens 22P and the
- the lens barrel 20P is a complete circular shape.
- the lens holder 30P and the circuit assembly 40P are both square, and the main photosensitive chip 41P in the circuit assembly 40P is also square.
- Each of the lenses 10P has a circular light-passing portion and a non-light-transmitting portion. Therefore, a lot of light is not received by the circuit assembly 40P, but falls on the gold wire of the circuit assembly 40P. Pads, lines, mirror mounts, moldings, glues, etc., which are relatively smooth on the surface, return to the imaged area after multiple reflections to form stray light. Then, if it can be modified from the lens 10P, unnecessary portions are reduced, so that the lens barrel 20P, the lens holder 30P, and the circuit assembly 40P are correspondingly reduced in unnecessary portions, and the whole portion can be The size of the camera module is reduced in size.
- the circuit assembly 40P is slightly larger than the photosensitive chip
- the lens barrel 20P is sized corresponding to the circuit assembly 40P
- the lens 10P and the circuit assembly 40P are sensitized.
- the corresponding size of the chip can ensure the complete function of the camera module.
- the conventional camera module leaves a lot of space for the circuit assembly 40P, especially for the photosensitive chip 41P to work stably and for a long time, and a lot of space is expanded in the circuit assembly 40P.
- the conventional lens 10P uses a spacer or a light blocking plate to block unwanted light. However, the light still has a portion of refraction and reflection on the lens, forming stray light.
- the number of lenses of the lens is increasing, for example, the number of lenses of 4p, 5p, 6p, 7p, etc.
- the volume of the lens is also increasing, so the lens to the camera module
- the influencing factors are also getting bigger and bigger, and the improvement of the lens is also more important.
- Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the lens includes at least one de-branching lens, wherein the de-branching lens has at least one chord, an imaging area, and a non- An imaging zone through which the shape of the de-branching lens will be reduced, but does not affect the imaged area of the de-branching lens.
- Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the camera module further includes a de-bounding lens barrel, a base, and a circuit component, wherein the de-striping lens barrel And the pedestal cooperates with the shape of the de-branching lens to effectively process light in the circuit assembly.
- Another object of the present invention is to provide a lens and camera module and method of fabricating the same, wherein the chord of the lens reduces the effects from the non-imaged area while not affecting the imaged area.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, the edged lens further comprising at least one rounded edge, the difference in shape of the chord and the rounded edge can be reduced in the assembly Describe the difficulty of edged lenses.
- Another object of the present invention is to provide a lens and a camera module, and a manufacturing method thereof, wherein the chord edge of the de-bound lens may be a straight line or an arc, and a circle with respect to the round side
- the chord edge reduces the time and cost spent in the machining design of the mold, and significantly reduces the use of materials.
- Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the corresponding processing yield of the chord of the demarcation lens is improved compared to the rounded edge.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, wherein the non-image area of the demarcation lens is much reduced compared to a conventional lens, and the light passing through the non-image area is also Correspondingly, the imaging effect and imaging efficiency are improved.
- Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, wherein the de-branching lens barrel, the base, and the circuit assembly are The body shape is also correspondingly reduced, so that the overall camera module body size is narrowed.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, because the design of the chord edge of the de-branching lens, the shape of the de-bounding lens barrel and the pedestal Has a corresponding chord edge.
- Another object of the present invention is to provide a lens and a camera module, and a manufacturing method thereof, wherein the corresponding position of the chord portion and the base of the de-bounding lens barrel may be linear or curved. Moreover, in order to manufacture the chord portion of the de-edged lens barrel, the apparatus and the mold used do not have to be round.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, in which the design and processing of the chord portion of the deframed lens barrel is time consuming compared to the conventional round type And the cost will be reduced, and the corresponding processing yield will be increased.
- Another object of the present invention is to provide a lens and a camera module and a manufacturing method thereof, wherein the chord portion of the de-edged lens barrel and the corresponding cooperation of the pedestal facilitate assembly of the camera module , you can quickly determine the installation direction.
- Another object of the present invention is to provide a lens and camera module and a method of fabricating the same that can be mounted more compactly by the reduction of the size of the deframed barrel and the base.
- Another object of the present invention is to provide a lens and camera module and a method of fabricating the same, the de-bounding lens being disposed corresponding to the photosensitive chip of the circuit component, and the non-imaging of the de-branching lens The size of the photosensitive chip of the circuit component is reduced, and the influence is correspondingly lowered.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, which are formed by injection molding once, and the string edges are formed correspondingly, so that the manufacturing cost is reduced and the production difficulty is reduced.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, the de-orientation lens barrel and other devices corresponding to the de-bounding lens are formed by injection molding, and the mold is also manufactured. There is a corresponding body shape with the lens.
- Another object of the present invention is to provide a lens and a camera module and a manufacturing method thereof, which can be assembled by the corresponding de-branching lens, the de-branching lens barrel, the base and the circuit component. Convenient correspondence to simplify the assembly process.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, through the corresponding de-branching lens, the de-branching lens barrel, the base and the circuit component, the camera module
- the size of the body is correspondingly reduced, achieving an ultra-narrow camera module compared to conventional techniques.
- Another object of the present invention is to provide a lens and a camera module and a method of manufacturing the same, wherein the lens is matched with a base design requirement, so that the size of the camera module can be miniaturized as a whole.
- an aspect of the present invention provides a lens comprising: at least one de-branching lens, wherein the de-branching lens comprises at least one chord and at least one round, the chord and The rounded edges are adjacent, wherein the chord edges and the rounded edges have different curvatures.
- the chord edge of the lens has a curvature of 0 and is a straight line segment.
- the curvature of the rounded edge in the lens is >0, which is a curved line segment.
- the chord is a straight line in the lens, and the rounded edge is an arc.
- the number of the chord and the rounded edge in the lens is 1, and the curvature of the chord is 0, which is a straight line segment.
- the number of the chord edges in the lens is 2, and each of the chord edges has a curvature of 0, which is a straight line segment.
- the number of the chord edges in the lens is 2, the number of the round sides is 2, and the chord sides are symmetrically distributed.
- the chord edge in the lens is a straight line segment.
- the lens in the lens comprises a plurality of lenses, at least one of which is the de-bounded lens and at least one of which is a circular lens.
- the dimension of the de-branching lens in the lens is larger than the circular lens.
- the lens in the lens comprises four lenses, wherein the lens size increases sequentially, and wherein the lens having the largest size is the de-branching lens.
- the lens of the lens includes a de-edged lens barrel, and the de-branching lens is mounted within the de-stained lens barrel.
- the de-edged barrel of the lens includes a chord portion and a rounded portion, wherein the chord portion and the rounded portion have different cross-sectional edge curvatures.
- the chord edge of the de-branching lens in the lens corresponds to the chord edge of the de-bounding lens barrel.
- the demarcation lens in the lens is manufactured by one injection molding.
- the lens includes at least one optical path component, wherein the optical path component is disposed adjacent to the lens to facilitate formation of a predetermined light path in the lens.
- the outer edge shape of the optical path element of the demarcation lens in the lens is consistent with the shape of the de-bounded lens.
- the optical path elements in the lens are a combination: one of a gasket, a gasket, and a coating.
- a camera module including: a lens, wherein the lens includes at least one de-branching lens, wherein the de-branching lens includes at least one chord and at least one round, A chord edge and the rounded edge are adjacent, wherein the chord edge and the rounded edge have different curvatures; and a photosensitive member, wherein the lens is located in a photosensitive path of the photosensitive member.
- the photosensitive module of the camera module includes at least one base, at least one photosensitive chip, and at least one circuit board, wherein the base is disposed on the circuit board to provide a mounting position.
- the photosensitive chip is electrically connected to the circuit board, and the lens is located in a photosensitive path of the photosensitive chip.
- the base of the camera module is integrally formed on the circuit board, and at least one light window is formed to provide a light path for the photosensitive chip.
- the base of the camera module includes a base body and a supplementary base, and the quick base body has a notch, and the supplementary base complements the notch to form a closed The window.
- the demarcation position of the lens in the camera module corresponds to the position of the supplementary base.
- the base of the camera module is adhesively fixed to the circuit board.
- the circuit board of the camera module includes a circuit board body and at least one electronic component, and the electronic component is disposed on the circuit board body, wherein the base is integrally formed on the circuit board a circuit board body and covering at least one of the electronic components.
- the circuit board of the camera module includes a circuit board body and at least one electronic component, wherein at least one of the electronic components is disposed at a bottom of the circuit board body, and the base is integrated Formed on top of the main body of the circuit board.
- the circuit board in the camera module has a sinking area, and the photosensitive chip is disposed in the sinking area.
- the sinking area of the camera module selects one of a groove and a through hole.
- the photosensitive chip in the camera module has a photosensitive area and a non-sensitive area, and the base integrally encapsulates at least a portion of the non-sensitive area.
- the camera module of the camera module includes at least one filter element, wherein the base integrally encapsulates the filter element.
- the camera module includes a shielding lens, and the shielding lens is located above the photosensitive chip and is integrally packaged by the base.
- the occlusion lens in the camera module is the de-branching lens.
- the camera module includes a lens carrying member, wherein the lens is mounted to the lens carrying member, and the lens carrying member is mounted to the base.
- the lens carrying component of the camera module is a driving component to form a dynamic focus camera module.
- the lens carrying component in the camera module is a lens fixing component to form a telephoto camera module.
- the lens carrying member is integrally connected to the base, and the lens is mounted to the lens carrying member to form a certain focus module.
- a plurality of the camera modules form an array camera module.
- a lens comprising: at least one de-branching lens and a de-bounding lens barrel, the de-branching lens being mounted in the de-bounding lens barrel, wherein the de-edge
- the lens includes at least one chord edge and at least one round edge, the chord edge and the round edge are adjacent to each other, wherein the chord edge and the round side have different curvatures
- the de-bounding lens barrel comprises a a chord portion corresponding to the chord edge of the demarcation lens to facilitate reducing the volume of the lens.
- a camera module including:
- the lens includes at least one de-branching lens and a de-branching lens barrel, the de-branching lens being mounted in the de-staining lens barrel, wherein the de-branching lens comprises at least one string An edge and at least one rounded edge, wherein the chord edge and the rounded edge are adjacent, wherein the chord edge and the rounded edge have different curvatures, and the de-bounding lens barrel comprises a chord edge portion, a chord portion corresponding to the chord edge of the demarcation lens to facilitate reducing a volume of the lens;
- a photosensitive member wherein the lens is located in a photosensitive path of the photosensitive member.
- the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the base is disposed on the first plate body, and the chord edge of the demarcation lens is located near a side of the second plate body.
- the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the pedestal is disposed on the first plate body, the chord edge of the demarcation lens and the chord edge portion of the de-bounding lens barrel are located adjacent to the second One side of the board.
- the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the base is disposed on the first plate body, and the chord edge of the demarcation lens is located on a side away from the second plate body.
- the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the pedestal is disposed on the first plate body, the chord edge of the demarcation lens and the chord edge portion of the de-stained lens barrel are located away from the second One side of the board.
- the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the base is disposed on the first plate body, the demarcation lens comprises two chord edges, and one of the chord edges is located on a side close to the first plate body The other chord is located on a side away from the second plate.
- the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for Electrically connecting the electronic device, the pedestal is disposed on the first plate body, the demarcation lens comprises two chord edges, and the edging lens barrel comprises two chord sides, one of The chord edge and the chord edge portion are located on a side close to the first plate body, and the other chord edge and the chord edge portion are located on a side away from the second plate body.
- the base includes four sides, a first side, a second side, a third side, and a fourth side, the first side, the second side
- the side edges, the third side edges and the fourth side edges are adjacent to each other to form a light window for providing light passage for the photosensitive chip, the first side is adjacent to the second plate body, the chord edge Located in the first side direction.
- the first side has a width dimension that is smaller than a width dimension of the second side and the fourth side.
- the base includes four sides, a first side, a second side, a third side, and a fourth side, the first side, the second side
- the side edges, the third side edges and the fourth side edges are adjacent to each other to form a light window for providing light passage for the photosensitive chip
- the first side is adjacent to the second plate body
- the third side The side edges are opposite the first side edges, and the chord sides are located in the third side direction.
- the width dimension of the second side is smaller than the width dimension of the second side and the four sides.
- the base includes four sides, a first side, a second side, a third side, and a fourth side, the first side, the second side
- the side, the third side, and the fourth side are sequentially adjacent to each other to form a light window, and provide light passage for the photosensitive chip
- the first side is adjacent to the second board
- the first side The three sides are opposite to the first side
- one of the chords is located in the first side direction
- the other chord is located in the third side direction.
- the circuit board includes a first board body and a second board body, the first board body and the second board body are electrically connected by a connection medium, and the second board body is used for The electronic device is electrically connected, and the base is disposed on the first plate.
- the circuit board includes at least one electronic component, the electronic component is disposed on the first board body, wherein the base body is integrally formed on the first board body, and covers at least one Electronic components.
- the electronic component is selectively disposed on one side, two sides, three sides, and four sides of the four sides of the base.
- the electronic component is disposed at the second side and the fourth side position.
- the electronic component is disposed at the first side and the third side position.
- the photosensitive chip is electrically connected to the first plate body through an electrical connection element
- the base is integrally formed on the first plate body to cover the electrical connection element
- the electrical connections are selectively disposed on two sides, three sides, or four sides of the four sides of the base.
- the electrical connection element is disposed at a position corresponding to the second side and the fourth side.
- the electrical connection element is disposed at a location corresponding to the first side and the third side.
- FIG. 1 is an overall perspective view of a conventional camera module.
- FIG. 2 is a perspective view of a camera module in accordance with a first preferred embodiment of the present invention.
- FIG 3 is an exploded perspective view of a camera module in accordance with a first preferred embodiment of the present invention.
- Figure 4 is a schematic exploded view of a lens in accordance with a first preferred embodiment of the present invention.
- Figure 5 is a schematic illustration of a lens design principle in accordance with a first preferred embodiment of the present invention.
- Figure 6 is a schematic illustration of comparison of imaging light and conventional lens in accordance with a preferred embodiment of the first preferred embodiment of the present invention.
- Figure 7 is a schematic view of a first modified embodiment of a lens in accordance with a first preferred embodiment of the present invention.
- Figure 8 is a schematic illustration of a second modified embodiment of a lens in accordance with a first preferred embodiment of the present invention.
- Figure 9 is a schematic view showing a third modified embodiment of the lens according to the first preferred embodiment of the present invention.
- Figure 10 is a schematic view showing a fourth modified embodiment of the lens according to the first preferred embodiment of the present invention.
- Figure 11 is a schematic view showing a fifth modified embodiment of the lens according to the first preferred embodiment of the present invention.
- Figure 12 is a schematic illustration of a partially modified embodiment of a first preferred embodiment of the present invention.
- Figure 13 is a schematic illustration of a camera module in accordance with a second preferred embodiment of the present invention.
- Figure 14 is a schematic diagram of a camera module in accordance with a third preferred embodiment of the present invention.
- Figure 15 is a schematic diagram of a camera module in accordance with a fourth preferred embodiment of the present invention.
- Figure 16 is a schematic diagram of a camera module in accordance with a fifth preferred embodiment of the present invention.
- Figure 17 is a schematic diagram of a camera module in accordance with a sixth preferred embodiment of the present invention.
- Figure 18 is a schematic diagram of a camera module in accordance with a seventh preferred embodiment of the present invention.
- Figure 19 is a schematic diagram of a camera module in accordance with an eighth preferred embodiment of the present invention.
- Figure 20 is a schematic diagram of a camera module in accordance with a ninth preferred embodiment of the present invention.
- Figure 21 is a camera module in accordance with a tenth preferred embodiment of the present invention.
- Figure 22 is a camera module in accordance with an eleventh preferred embodiment of the present invention.
- Figure 23 is a camera module in accordance with a twelfth preferred embodiment of the present invention.
- Figure 24 is a schematic diagram of a camera module in accordance with a thirteenth preferred embodiment of the present invention.
- 25A and 25B are schematic views of a camera module in accordance with a fourteenth preferred embodiment of the present invention.
- 26A and 26B are schematic views of a camera module and a photosensitive member in accordance with a fifteenth preferred embodiment of the present invention.
- FIGS. 27A and 27B are schematic views of a camera module and a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
- 28A and 28B are schematic views of a camera module and a photosensitive member according to a seventeenth preferred embodiment of the present invention.
- 29 is a schematic diagram of an array camera module in accordance with a fifteenth preferred embodiment of the present invention.
- Figure 30 is a schematic diagram of an array camera module in accordance with a sixteenth preferred embodiment of the present invention.
- Figure 31 is a schematic illustration of a lens manufacturing method in accordance with the above-described preferred embodiment of the present invention.
- FIG. 32 is a schematic diagram of an application of a camera module in accordance with the above-described preferred embodiment of the present invention.
- the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
- the requirements for camera modules are becoming higher and higher, such as the development of smart phones in the direction of ultra-thin, large screen, borderless, and high image quality.
- the camera module is composed of different components.
- the simplification of the components is almost the ultimate, and further development, in addition to studying the possible improvements of each component, also considering the components. The relationship between the improved relationship.
- a lens which can improve the lens of the camera module to reduce the body shape on the basis of ensuring the quality of the optical imaging; further, the lens and the remaining components, such as the photosensitive component
- the structure between the two can be matched, so that the overall size of the camera module can be reduced, and the external shape is more consistent, which is more suitable for being mounted on an electronic device.
- the camera module 100 includes a lens 10 and a photosensitive component 30, wherein the lens 10 is located in a photosensitive path of the photosensitive component 30, wherein the lens 10 is an ultra-narrow lens 10, which may also be referred to as a de-bounding lens. 10.
- the lens 10 and the shape are matched with the shape of the photosensitive member 30, so that the camera module 100 becomes an ultra-narrow camera module 100.
- the lens 10 includes at least one de-branching lens and a de-branching lens barrel 12, wherein the de-branching lens is mounted in the de-branching lens barrel 12.
- the de-branching lens is mounted in the de-branching lens barrel 12.
- the de-edged lens barrel 12 is removed from at least a portion of the circular edge of the circular lens barrel, so that the overall shape of the lens 10 is reduced, and the lens 10 and the de-branching shape are more suitable for other Component fit.
- the de-edgering of the de-branching lens is relative to the rounded edge of the circular lens, that is, the at least partially rounded edge of the circular lens is removed or replaced such that the edge of the circular lens is Not a complete circle.
- the lens 10 includes a plurality of lenses 11 including at least one of the de-branching lenses and at least one circular lens.
- the number of de-branching lenses and the position of the de-branching lens can be selected as desired.
- the circular lens and the de-branching lens are respectively mounted in the de-bounding lens barrel.
- the lens 10 composed of the four lenses 11 is schematically illustrated as an example, and in other embodiments of the present invention, the number of the lenses 11 may be other, such as 2 pieces, 3 pieces, 5 pieces, and 5 pieces or more.
- the shape of the corresponding lens 11 can also be designed according to specific needs, so that at least one of the lenses 11 is the de-branching lens.
- one of the lenses 11 is a de-bounded lens, the remaining three are circular lenses, and the de-branching lens is at the bottom.
- the number of the de-branching lenses may be other, such as 2, 3, and 4, and the position of the de-branching lens may also be 4 of the lenses.
- 11 is selected as needed, and it should be understood by those skilled in the art that the present invention is not limited in this respect.
- the four lenses 11 of the lens 10 are from the object side to the image side, respectively, a first lens 111, a second lens 112, and a third lens 113. And a fourth lens 114. And the body shape of the four lenses 11 is sequentially increased from the object side to the image side. That is, the closer the body shape of the lens 11 of the lens 10 is to the photosensitive member 30.
- the fourth lens 114 has the largest body shape. It is worth mentioning that each of the lenses 11 is mounted in the de-stained lens barrel 12, and in the case where the axial dimensions of the de-stained lens barrel 12 are the same, the lens 11 having the largest body shape is determined.
- the first lens 111, the second lens 112, the third lens 113 are circular lenses
- the fourth lens 114 is the de-edge lens.
- the other lenses 11 may be selected for de-edge design instead of the largest-sized lens 11 to be de-branching, and the present invention is not limited in this respect.
- each of the lenses 11 are sequentially increased in shape, but in other embodiments of the invention, each of the lenses 11 may be other
- the shape is arranged, such as a large arrangement, such as a lens in the middle, which is the smallest at the front end, and the largest at the bottom end, such as the smallest of the front end and the rear end all equal.
- the bottom lens is the largest.
- the photosensitive member 30 includes a photosensitive chip 31, wherein the lens 11 of the demarcation design is deburring according to the shape and size of the photosensitive chip 31. That is to say, the design of the de-branching lens is referenced by the photosensitive chip 31 to ensure the imaging quality of the camera module 100.
- the design of the demarcation lens is designed with the shape and size of the photosensitive region of the photosensitive chip 31.
- a de-marting design is performed.
- the largest lens 11 in the lens 10 that is, the shape of the fourth lens 114 closest to the image side, according to the photosensitive chip 31.
- the size is reduced.
- the fourth lens 114 is reduced to a size corresponding to the photosensitive chip 31.
- the demarcation lens of the lens 10 further includes at least one chord, that is, the fourth lens 114 includes a chord 1141.
- the chord edge 1141 of the fourth lens 114 closest to the image side causes a corresponding reduction in the size of the fourth lens 114 relative to the complete circular lens. That is, the fourth lens 114 with the chord 1141 is smaller than the body shape of the corresponding circular lens.
- the chord 1141 of the fourth lens 114 is an edge portion formed by a line segment of a non-original circle in a circular cross-sectional view of the fourth lens 114. .
- the fourth lens 114 of the lens 10 further includes at least one rounded edge 1142.
- the chord 1141 of the fourth lens 114 may be not only a straight segment but also a curved segment or any line segment of the photosensitive chip 31 of the photosensitive component 30. Depending on the complete circular lens, the chord 1141 can also be understood as the edge of the missing lens 11 relative to the complete circle. The chord edge 1141 then plays a key role in reducing the shape of the fourth lens 114 and the lens 10.
- the edge of the de-branching lens is composed of at least two line segments of different curvatures adjacent to each other such that the edge of the de-bounded lens 11 is not a complete circle. That is, the chord edge 1141 and the rounded edge 1142 are adjacent to each other to form an edge of the lens 11, and the chord edge 1141 and the rounded edge 1142 have different curvatures.
- the curvature of the chord edge 1141 is 0, that is, a straight line segment
- the curvature of the rounded edge 1142 is >0, that is, a circular arc segment.
- FIG. 11 A schematic view of the overall lens 11 is then shown in FIG.
- the fourth lens 114 closest to the image side has one of the chord 1141 and one of the rounded edges 1142.
- the lens 11, the second lens 112, and the third lens 113 each have one of the rounded edges 1142. That is, the first lens 11, the second lens 112, and the third lens 113 are circular lenses, and the fourth lens 114 is a de-sided lens that goes to one side.
- the fourth lens 114 composed of one of the chord sides 1141 and one of the round sides 1142 is taken as an example to illustrate the de-branching lens.
- Structural design, and in other embodiments of the present invention, the number and shape, layout, and the like of the chord 1141 and the rounded edge 1142 may be other ways, and the present invention is not limited in this regard.
- the size and position of the chord edge 1141 and the rounded edge 1142 can be set according to different requirements, such as symmetric setting, asymmetric setting, setting according to a predetermined proportion, and the like, and the invention is not limited in this respect.
- the lens 10 includes at least one optical path component 13 disposed between adjacent ones of the lenses 11 to form a predetermined light path between the lenses 11.
- the optical path component 13 can be a gasket, a gasket, a coating, or the like.
- the outer edge shape of the optical path element 13 coincides with the outer shape of the lens 11 to facilitate occlusion of the corresponding edge of the lens 11.
- Each of the lenses 11 and the optical path elements 13 are disposed at intervals in the interior of the de-intersecting barrel 12.
- the number of the lenses 11 is four, and correspondingly, the number of the optical path elements 13 is three, respectively a first optical path element 131, a second optical path element 132 and Three light path elements 133.
- the first optical path component 131 is disposed between the first lens 111 and the second lens 112, and the outer shape of the first optical path component 131 and the outer shape of the second lens 112 are identical.
- the second optical path element 13 is disposed between the second lens 112 and the third lens 113, and an outer shape of the second optical path element 13 coincides with an outer shape of the third lens 113.
- the third optical path component 13 is disposed between the third lens 113 and the fourth lens 114, and an outer shape of the third optical path component 13 is identical to an outer shape of the fourth lens 114. That is, in this embodiment, the first optical path component 131 and the second optical path component 132 are externally circular optical path components, and the third optical path component 133 is a de-edge optical path component, that is, With at least a straight edge and at least one curved edge.
- each of the lenses 11 is integrally formed during manufacture.
- the shape of the lens 11 can preferably be molded once by injection molding.
- the time and cost of the chord edge 1141 in the processing design of the mold is reduced, and the material used is remarkably reduced.
- the lens 11 of a desired shape can be obtained after injection molding by changing the shape of the mold injection space.
- the optical path component 13 and the demarcation lens barrel 12 used for assembly need to be obtained by custom molding a mold according to this shape.
- the chord 1141 has a certain guiding effect, and the lens 11 can be positioned according to the position of the chord 1141.
- the aperture of the lens 10 is determined by the smallest of the lens 11 and the optical path element 13. That is to say, a large portion of the lens 11 closest to the image side as in Fig. 5 is small for imaging.
- the chord 1141 is employed, as shown in Fig. 6, not only the shape of the lens 11 and the lens 10 but also the utilization ratio of the lens 11 closest to the image side is improved.
- the fourth lens 114 closest to the image side is taken as an example. Under the action of the optical path component 13, the fourth lens 114 correspondingly forms an imaging area 1143 and a non-image area 1144.
- the image forming area 1143 corresponding to the photosensitive chip 31 of the photosensitive member 30 is a main area where light is received, wherein the non-image forming area 1144 blocks light from passing through, and a small amount of light passing through does not perform photosensitivity. That is to say, the imaging area 1143 of the lens 11 provides the basis for the main imaging function of the camera module 100.
- the function of the optical path component 13 is to block the light of the edge of each of the lenses 11 to form a predetermined optical path, and to reduce the stray light in the periphery.
- the optical path component 13 is not It is completely opaque and the edge light is not completely blocked. That is, the non-imaged area 1144 has less light passing through the imaging area 1143 of the lens 11.
- the light passing through the non-imaged area 1144 is reflected at other portions of the photosensitive member 30, such as the base 33, the circuit board 32, the electrical connection element 313, etc., which are subsequently proposed, after reflection.
- the light is received by the photosensitive chip 31, that is, stray light that affects the image quality of the photosensitive chip 31.
- the fourth lens 114 of the chord 1141 is used, as shown in FIG. 6, the light intensity of the non-image area 1144 is weakened, and the formed stray light is also reduced.
- the imaging effect of the camera module 100 will be improved. From the viewpoint of the imaging effect, a gradually weakened edge is formed in the imaging circle of the lens 10. That is to say, the de-edge design of the lens 11 is such that the intensity of the partial region of the non-imaged area 1144 is weakened, the influence of stray light is reduced, and the imaging effect is not affected or less affected.
- the chord edge 1141 of the lens 11 does not affect the imaging area 1143, and the function of the camera module 100 will also be guaranteed to be complete.
- chord edge 1141 of the lens 11 causes the imaging area 1143 not to lose a portion correspondingly, but correspondingly an edge with gradually reduced brightness and imaging quality appears.
- the proportion of the non-imaged area 1144 domain is reduced, and the effective imaging area 1143 is concentrated to a smaller portion corresponding to the photosensitive chip 31, without changing or changing the image quality.
- the body shape of the lens 11 is reduced, while reducing the amount of light that is incident on the non-imaged area 1144, directly reducing the source of stray light.
- the chord 1141 of the lens 11 should be coincident with the periphery of the photosensitive chip 31 of the photosensitive member 30, which greatly reduces the The lens 11 and the body shape of the lens 10.
- the fourth lens 114 closest to the image side also requires a certain margin during assembly, so there is also a certain amount of the non-imaged area 1144.
- the optical path component 13 and the demarcation lens barrel 12 need to be designed and manufactured according to the shape according to the shape of the lens 11.
- the optical path component 13 and the de-bounding lens barrel 12 are obtained by post-molding of a custom mold.
- the de-edged barrel 12 further includes at least one chord portion 121 and at least one rounded portion 122 corresponding to the chord edge 1141 and the rounded edge 1142 of the de-branching lens, respectively.
- the chord edge 1141 is linear
- the chord portion 121 is correspondingly linear. Similar to the manufacture of the chord 1141 of the lens 11, the linear chord portion 121 is reduced in time and cost in processing the device and the mold relative to the circular curved edge.
- the lens 10, the de-branching lens barrel 12, the subsequently proposed lens-carrying element 20, and the photosensitive member 30 in the preferred embodiment are all in a straight or square shape, in the design and manufacturing process. The unity has been unified, which makes the production difficulty less, and the corresponding processing yield can be greatly improved.
- the number and position of the chord portion 121 of the de-edged lens barrel 12 and the chord edge 1141 of the demarcation lens correspond to the chord edge when the number of the chord sides 1141 is other
- the position, shape and number of the portions 121 also change accordingly.
- chord portion 121 of the de-bounding lens barrel 12 is a flat surface
- the rounded edge portion 122 of the demarcation lens barrel 12 is a curved surface. That is, it can be seen from the top view of the de-edged lens barrel 12 that the top view of the de-stained lens barrel 12 is a closed curve composed of a circular arc and a straight line, and the de-edge is performed at this time.
- the shape of the lens barrel 12 coincides with the shape of the top view of the fourth lens 114. It is worth mentioning that since the de-edged lens barrel 12 has a certain wall thickness, the consistency here is not the same size.
- the number, position, and layout of the chord portion 121 and the rounded portion 122 of the de-edged lens barrel 12 may be other, such as 2 the chord The rounded side portions 122 and 3, the rounded side portions 122 and 3, the rounded side portions 122, 4, the chord portion 121 and the rounded portion 122, and the like.
- the proportional size and position of the chord portion 121 and the rounded portion 122 may be set according to different requirements, such as symmetrically arranged, asymmetrically arranged, set in a predetermined proportion, and the like, and the present invention is not limited in this respect.
- chord edge 1141 of the de-branching lens corresponds to the chord portion 121 of the de-bounding lens barrel 12
- the rounded edge 1142 of the de-branching lens and The rounded edge portion 122 of the de-bounding lens barrel 12 corresponds to the relative position of the lens 11 and the de-stained lens barrel 12, thereby facilitating the installation of the lens 11 and facilitating the installation.
- the demarcation design of the lens 11 facilitates the positioning of the lens 11, while in conventional circular lenses and circular barrels, there is no defined relative position between the lens and the barrel.
- chord portion 121 of the de-edged lens barrel 12 can be matched with the photosensitive member 30, so that the overall edge of the camera module 100 is reduced, and subsequent This advantage will be explained in detail.
- the camera module 100 includes a filter element 40 for filtering light passing through the lens 10.
- the filter element 40 is exemplified by, but not limited to, an infrared cut filter, a blue glass filter, a wafer level infrared cut filter, a full transparency, and a visible light filter.
- the filter element 40 is mounted to a complementary support 332 (subsequently proposed) located in the light path of the photosensitive chip 31.
- the camera module 100 further includes a lens carrying member 20, the lens 10 is mounted on the lens carrying member 20, and the lens carrying member 20 is mounted on the base 33 such that the lens 10 is located
- the photosensitive path of the photosensitive chip 31 can be implemented as a lens fixing component or a driving component to form a fixed focus camera module 100 or a moving focus camera module 100, respectively.
- the drive components are by way of example and not limited to piezoelectric motors, voice coil motors.
- the lens carrying member 20 is implemented as a driving member, the lens carrying member 20 is electrically connected to the photosensitive member 30, such as by a pin, a lead, or the like, to be electrically connected to the photosensitive member 30.
- the photosensitive member 30 further includes a circuit board 32 and a base 33, the photosensitive chip 31 is electrically connected to the circuit board 32, and the base 33 is disposed on the The circuit board 32 is adapted to provide a mounting position to form a back focus required by the camera module 100.
- the base 33 is integrally connected to the circuit board 32.
- the base 33 includes a base body 331 and has a light window 333.
- the light window 333 provides a light path for the photosensitive chip 31.
- the photosensitive chip 31 is located inside the light window 333, and the photosensitive path of the photosensitive chip 31 is aligned with the light window 333.
- the circuit board 32 includes a circuit board main body 321 and at least one electronic component 322 electrically connected to the circuit board main body 321 to facilitate transmitting photosensitive information to the circuit board 32.
- the lens 10 is located
- the photosensitive path of the photosensitive chip 31 is sensitized so that the photosensitive chip 31 receives light.
- the photosensitive chip 31 may be disposed on the circuit board main body 321 through a surface mount technology (SMT), and electrically connected to the circuit through at least one electrical connection element 313.
- SMT surface mount technology
- the electrical connection element 313 is exemplified by, but not limited to, a gold wire, a silver wire, a copper wire, an aluminum wire, a solder, a conductive paste, or the like.
- the electronic component 322 is disposed on the circuit board main body 321 .
- the electronic component 322 is mounted on the circuit board main body 321 by an SMT process.
- the electronic component 322 includes, but is not limited to, a resistor, a capacitor, a driving device, and the like.
- the pedestal 33 is integrally packaged in the circuit board main body 321 and integrally wrapped around the electronic component 322, thereby preventing dust and debris from being similar to the conventional camera module 100.
- the photosensor chip 31 is contaminated on the electronic component 322 to affect the imaging effect.
- the electronic component 322 is buried in the circuit board main body 321 , that is, the electronic component 322 may not be exposed.
- the electronic component 322 is disposed around the photosensitive chip 31, and in different embodiments, the setting position of the electronic component 322 can be designed and arranged according to needs.
- the shape of the seat 332 is matched to more rationally utilize the spatial position on the circuit board main body 321 to minimize the size of the camera module 100.
- the circuit board main body 321 of the circuit board 32 may be a PCB hard board, a PCB soft board, a soft and hard bonding board, a ceramic circuit board main body 321 and the like. It should be noted that, in this preferred embodiment of the present invention, since the base body 331 can completely cover the electronic components 322, the electronic components 322 may not be buried in the circuit board main body 321, The board main body 321 is only used to form a conduction line, so that the finally obtained photosensitive member 30 can be made smaller in thickness.
- the base body 331 is disposed on the circuit board 32 by integral molding, such as molding, thereby stabilizing the base 33 and the circuit board 32.
- the ground is fixed and the additional mounting and fixing process is reduced. For example, the process of reducing the glue bonding, the connection is more stable, the height of the glue connection is omitted, and the height of the unit of the camera module 100 is lowered.
- the base 33 may be integrally formed on the circuit board 32 by mold molding, such as molding in a circuit board, which is different from the conventional COB (Chip On Board) method.
- mold molding such as molding in a circuit board, which is different from the conventional COB (Chip On Board) method.
- COB Chip On Board
- the shape of the molding and the flatness of the surface can be better controlled, for example, such that the base body 331 has a better flatness, thereby being a mounted component, such as the lens carrying member 20,
- the filter element 40 provides a flat mounting condition to help improve the optical axis uniformity of the camera module 100.
- Each of the electronic components 322 may be attached to an edge region of the circuit board 32, such as outside the photosensitive chip 31, by being spaced apart from each other by, for example, an SMT process.
- each of the electronic components 322 may be located on the same side or opposite sides of the circuit board 32.
- the photosensitive chip 31 and each of the electronic components 322 may be respectively Located on the same side of the circuit board 32, and the photosensitive chip 31 is mounted on the chip mounting area of the circuit board 32, and each of the electronic components 322 are respectively mounted on the circuit board at a distance from each other.
- the base body 331 covers each of the electronic components 322 after molding to isolate adjacent electronic components 322 and isolate the electronic components 322 from the photosensitive chip 31 by the base body 331.
- the manner in which the base member 331 covers each of the electronic components 322 after molding has many advantages.
- the base body 331 covers each of them.
- the electronic component 322 is configured to prevent mutual interference between the adjacent electronic components 322, and the camera module 100 can be ensured even when the distance between the adjacent electronic components 322 is relatively close.
- the image quality is such that a small number of the electronic components 322 can be mounted on the circuit board 32 of a small area, so that the structure of the camera module 100 is more compact, which is beneficial to the control station.
- the imaging quality of the camera module 100 is improved based on the size of the camera module 100.
- the base body 331 covers each of the electronic components 322 so as to be horizontally or in a height direction.
- the base body 331 covers each of the electronic components 322 such that no glue is used for connection and leveling between the base body 331 and the circuit board 32 to facilitate the reduction of the The height dimension of the camera module 100.
- the base body 331 covers each of the electronic components 322. During the subsequent transportation and assembly of the camera module 100 to form the camera module 100, the base body 331 can be prevented. The electronic component 322 is shaken and detached, thereby facilitating the structural stability of the camera module 100.
- the base body 331 covers each of the electronic components 322, and in the process of subsequently transporting and assembling the camera module 100 to form the camera module 100, it can prevent pollutants from contaminating each of the devices.
- the electronic component 322 is described to ensure the imaging quality of the camera module 100.
- the electronic component 322 can be insulated from the air. In this manner, the oxidation speed of the metal portion of the electronic component 322 can be slowed down, which is beneficial to improve. Environmental stability of the electronic component 322 and the camera module 100.
- the base body 331 is integrally formed on the circuit board main body 321 and covers the electronic component 322 of the circuit board 32 such that the base body 331 and the circuit board
- the main body 321 has a large connecting area, and the connection is more stable, and has a better structural strength by means of an integral molding. Therefore, the base body 331 can firmly and reliably support and fix components of the camera module 100. Thereby ensuring the yield of the product.
- the number of the lenses 11 of the lens 10 is increasing, for example, up to 4p, 5p, 6p, and 6p, etc., and when the lens of the camera module 100 lens 10 is When the number of 11 increases, it is necessary to meet the requirements of optical performance, such as providing sufficient back focus to prevent the filter element 40 from affecting the imaging quality of the camera module 100, such as black spots, edges, etc.
- the filter element 40 is mounted on the integrally formed base 33 so that the filter element 40 can be provided with flat mounting conditions and can pass through the base The height of 33 effectively controls the height position at which the filter element 40 is mounted.
- the photosensitive chip 31 has a photosensitive area 311 for performing photosensitivity, and a non-sensitive area 312312 for electrically connecting to the circuit board 32.
- the non-photosensitive region 312 is electrically connected to the circuit board 32 by the electrical connection element 313.
- the photosensitive chip 31 is located inside the base body 331, that is, not integrally encapsulated by the base body 331.
- the photosensitive chip 31 needs to be attached to the circuit board 32, such as glue bonding, so that the photosensitive chip 31 is stably fixed, and then the photosensitive chip 31 is passed.
- the electrical connection component 313 is electrically connected to the circuit board 32, such as by way of a gold wire, to the circuit board 32.
- the manner in which the photosensitive chip 31 is disposed on the circuit board 32 may be performed by other means, such as embedding, sinking, FC (Flip Chip, flip chip), and the like. It should be understood by those skilled in the art that the connection and mounting manner of the photosensitive chip 31 and the circuit board 32 are not limited by the present invention.
- the base 33 further includes a complementary support 332 that is supplemented to the base body 331 to form the closed light window 333.
- the base body 331 has a mounting groove 3311 communicating with the light window 333.
- the supplemental support 332 is mounted to the mounting slot 3311 to facilitate providing a mounting location for the filter element 40.
- the base body 331 has at least one notch 3312.
- the notch 3312 communicates with the optical window 333 and the outside, and the supplementary support 332 is supplemented by the notch 3312, thereby forming the light window 333 whose side is closed.
- the base body 331 is not a closed structure but an open structure, and the base body 331 is closed by supplementation of the complementary support 332.
- the base body 331 may also be a closed structure.
- the notch 3312 extends down to the circuit board body 321.
- the supplementary support 332 includes at least one seat body 3321 and an extending leg 3322 extending integrally from the seat body 3321 to the circuit board main body 321 so as to be the notch 3312. Closed.
- the extension legs 3322 are joined to the circuit board body 321 and/or the base body 331 by adhesive bonding.
- the holder body 3321 is mounted to the mounting groove 3311.
- chord portion 121 of the de-edged barrel 12 corresponds to the position of the extended leg 3322 of the complementary holder 332, thereby In the direction in which the extension legs 3322 are located, the edges may be narrower.
- the electronic component 322 can be disposed centrally on a side where the base body 331 is located, such as a side opposite the extended leg 3322, such that the side on which the extended leg 3322 is located There is no need to provide the electronic component 322, and it is not necessary to reserve the mounting position of the electronic component 322, that is, the photosensitive chip 31 is closer to the edge of the circuit board main body 321 , and the extended leg 3322 is
- the shape may be formed by other means, such as injection molding, so that the thickness of the extending leg 3322 may be smaller relative to the wall thickness of the base body 331, and the chord portion of the de-edged barrel 12 121 is also a narrowing direction, so that the two cooperate with each other, so that the overall size of the camera module 100 is smaller.
- the pedestal 33 can take many advantages in the integral molding manner, including the advantage of making the size of the pedestal 33 inwardly reduced, that is, in the absence of In the case of the supplementary support 332, the lens 10 cooperates with the reduced base 33, and the size of the camera module 100 can still be reduced.
- the size of the base 33 is reduced, and the lens 10 and/or the lens carrying member 20 need to be mounted to the base 33, so the base
- the seat 33 needs to provide a sufficient mounting area, so that the size of the base 33 cannot be too small compared to the conventional larger-sized lens 10, that is, the size of the base 33 is reduced by the conventional lens 10. Size limit.
- the de-edge design of the lens 10 is such that the overall size of the lens 10 is reduced, and the mounting requirement of the base 33 is reduced, so that the base 33 can be further Miniaturization, it can be seen that the design of the lens 10 and the susceptor 33 or the photosensitive member 30 cooperate with each other, so that the overall size of the camera module 100 can be further miniaturized, and a separate miniaturization
- the lens 10 or the miniaturization of the photosensitive member 30 achieves a similar effect.
- the base body 331 has an inner side wall having an inclined angle to facilitate mold manufacturing and reduce stray light reflection to the photosensitive chip 31.
- the incident angle of the light reaching the base body 331 is large, so that the reflection angle of the light is large, and it is relatively easy to reflect toward the inside, that is, to the position of the photosensitive chip 31. reflection.
- the inner side wall is inclined, the incident angle of the light is small, and the light incident in the same direction is offset from the position of the photosensitive chip 31 in the direction of the reflected light, so that the oblique arrangement helps to reduce the interference of stray light.
- the magnitude of the tilt angle can be set as desired.
- the inner side wall of the base body 331 may be vertically disposed, that is, the tilt angle is not present.
- FIG. 7 through 9 there are different variant embodiments of the lens 10 in accordance with a first preferred embodiment of the present invention.
- the chord edge 1141 and the rounded edge 1142 of the edge removing lens 11 are illustrated in these embodiments.
- the demarcation lens of the lens 10 that is, the fourth lens 114, includes two of the chord sides 1141 and the two round sides 1142. That is, the demarcation lens is narrowed at both edge positions relative to the circular lens.
- the two chord edges 1141 can be symmetrically distributed.
- the de-edged barrel 12 includes two chord portions 121 and two rounded portions 122.
- the chord portions 121 are symmetrically disposed.
- the de-edged lens barrel 12 is de-bounded in two directions, so that the two positions of the lens 10 are narrowed.
- the curvature of the two chord edges 1141 of the fourth lens 114 is zero, and the curvature of the two circular edges 1142 is >0. That is, the two chord sides 1141 are straight lines, and the two round sides 1142 are circular arc lines.
- chord portion 121 of the de-edged lens barrel 12 and the outer edge of the rounded edge portion 122 correspond to the chord edge 1141 and the rounded edge 1142, respectively.
- the demarcation lens of the lens 10 that is, the fourth lens 114, includes three of the chord sides 1141 and three of the round sides 1142. That is, the demarcation lens is narrowed at three edge positions relative to the circular lens.
- the three chord edges 1141 can be symmetrically distributed.
- the de-edged barrel 12 includes three of the chord portions 121 and three of the rounded portions 122.
- the three chord portions 121 are symmetrically disposed.
- the de-edged lens barrel 12 is deburring in three directions, thereby narrowing the three positions of the lens 10.
- the curvature of the three chord edges 1141 of the fourth lens 114 is zero, and the curvature of the three round edges 1142 is >0. That is to say, the three chord sides 1141 are straight lines, and the three round sides 1142 are circular arc lines.
- chord portion 121 of the de-edged lens barrel 12 and the outer edge of the rounded edge portion 122 correspond to the chord edge 1141 and the rounded edge 1142, respectively.
- the demarcation lens of the lens 10 that is, the fourth lens 114, includes four of the chord sides 1141 and four of the round sides 1142. That is, the demarcation lens is narrowed at four edge positions relative to the circular lens.
- the four chord edges 1141 may be symmetrically distributed.
- the de-edged barrel 12 includes four of the chord portions 121 and four of the rounded portions 122.
- the four chord portions 121 are symmetrically disposed.
- the de-edged lens barrel 12 is deburring in four directions, thereby narrowing the four positions of the lens 10.
- the curvature of the four chord edges 1141 of the fourth lens 114 is zero, and the curvature of the four round edges 1142 is >0. That is to say, the four chord sides 1141 are straight lines, and the four round sides 1142 are circular arc lines.
- chord portion 121 of the de-edged lens barrel 12 and the outer edge of the rounded edge portion 122 correspond to the chord edge 1141 and the rounded edge 1142, respectively.
- the lens 10 in accordance with a first preferred embodiment of the present invention.
- the number of the demarcation lenses in the lens 10 is illustrated as being variable.
- the two lenses 11 in the lens 10 are de-bordered.
- the third lens 113 and the fourth lens 114, respectively, and the third lens 113 and the fourth lens 114 respectively include a chord 1141 and a rounded edge 1142.
- the two deframed lenses 11 can also be any other two lenses 11.
- the number of the chord edges 1141 and the rounded edges 1142 may also be other, such as the numbers shown in Figures 7-9.
- the inner shape of the de-edgering barrel 12 changes according to the shape of the lens 11.
- the deframed lens 11 can also be any other three lenses 11.
- the number of the chord edges 1141 and the rounded edges 1142 may also be other, such as the numbers shown in Figures 7-9.
- the inner shape of the de-edged lens barrel 12 changes according to the shape of each of the lenses 11.
- the lens 10 can be attached to the lens carrying member 20 by adhesive bonding, and in particular, the de-stained lens barrel 12 is flat outside without a threaded structure.
- the deframed lens barrel 12 has a thread externally, that is, the lens 10
- the lens-carrying element 20 having a threaded structure can be applied after being de-bordered.
- FIG. 13 it is a camera module 100 according to a second preferred embodiment of the present invention.
- the electronic component 322 is disposed at the bottom of the circuit board body 321. Therefore, it is not necessary to reserve the installation space of the electronic component 322 on the top of the circuit board main body 321, so that the design of the base main body 331 and the supplementary support 332 can be more flexible, so that the circuit board The requirements of the main body 321 are continuously reduced, and the lens 10 can be de-bounded accordingly, so that the overall size of the camera module 100 is reduced.
- the illustrated base body 331 integrally encapsulates the electronic component 322 on the back side of the circuit board body 321 such that the illustrated electronic component 322 is wrapped.
- FIG. 14 it is a camera module 100 according to a third preferred embodiment of the present invention.
- the electronic component 322 is disposed on the back surface of the circuit board main body 321 .
- the pedestal 33 is attached to the circuit board main body 321 by bonding, that is, a conventional pedestal can be applied to such an embodiment, but since it is not necessary to reserve the spatial position of the electronic component 322, Therefore, the size of the susceptor 33 can be reduced, and the lens 10 can be de-edgered, so that the size of the camera module 100 is reduced.
- a molded base may be provided to cover the electronic component 322. That is, the electronic component located on the back surface of the circuit board main body 321 is packaged by integral molding, thereby making the assembly more stable.
- the base 33 includes a base body 331 and has a light window 333.
- the base body 331 is integrally formed on the circuit board 32 to form the light window 333.
- the base body 331 is a closed structure, that is, the base body 331 is not There is the gap 3312.
- the base body 331 has a mounting groove 3311, and the filter element 40 is mounted to the mounting groove 3311.
- the base 33 includes a base body 331 and a complementary support 332.
- the base body 331 is integrally formed on the circuit board 32 to form the light window 333.
- the base body 331 is a closed structure, that is, the base body 331 is not There is the gap 3312.
- the base body 331 has a mounting groove 3311 to which the complementary holder 332 is mounted, and the filter element 40 is mounted to the supplementary base 33.
- the supplemental mount 332 does not have the extension leg 3322, that is, the supplemental mount 332 is not directly coupled to the circuit board 32.
- the supplementary support 332 is sunk in the light window 333 such that the filter element 40 is closer to the photosensitive chip 31, and the back focus of the camera module 100 is reduced.
- the circuit board main body 321 has a sinking area 3211, and the photosensitive chip 31 is sunkenly disposed in the sinking area 3215, so as to reduce the photosensitive chip 31 and the The relative height of the board body 321 is described.
- the sinker region 3215 can be implemented as a groove or a through hole. That is to say, the spaces on both sides of the circuit board main body 321 can be made not to communicate or communicate.
- the photosensitive chip 31 is disposed at the bottom of the groove, and is electrically connected to the circuit board main body 321 through the electrical connection member 313.
- the outer end of the electrical connection element 313 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outside of the sinker zone 3215, and the invention is not limited in this respect.
- the top surface of the photosensitive chip 31 may coincide with the top surface of the circuit board main body 321 or be higher than the top surface of the circuit board main body 321 or lower than the top surface of the circuit board main body 321 That is, the present invention does not limit the sinking depth.
- the sinker region 3215 is a through hole, that is, both sides of the circuit board 32 are communicated through the through hole.
- the circuit board 32 of the camera module 100 includes a bottom plate 323 disposed on the bottom of the circuit board main body 321 so as to support the photosensitive chip 31 and enhance the structural strength of the circuit board main body 321 . That is, the photosensitive chip 31 is sunk and disposed in the sinker region 3215, and is supported by the bottom plate 323.
- the photosensitive chip 31 is electrically connected to the circuit board main body 321 through the electrical connection element 313.
- the bottom plate 323 may be a metal plate disposed on the bottom of the circuit board main body 321 by attaching.
- FIG. 18 it is a camera module 100 according to a seventh preferred embodiment of the present invention.
- the pedestal 33 of the photosensitive component 30 of the camera module 100 integrally encapsulates at least a portion of the non-photosensitive region 312 of the photosensitive chip 31.
- the susceptor 33 integrally encapsulates the circuit board 32 and the photosensitive chip 31 such that the photosensitive chip 31 is stably fixed and the moldable area of the susceptor 33 is increased.
- the base 33 encloses the electrical connection element 313.
- the manner in which the susceptor 33 can be integrally molded can be expanded in a manner of molding on the photosensitive chip.
- the holder 33 and the circuit board 32 and the photosensitive chip 31 are more stably connected, and the top portion may be other components such as the lens 10, the lens carrying member 20, etc., providing a larger mountable area.
- the electrical connection component 313 is covered by the base 33 to avoid external interference with the electrical connection component 313, and prevents the electrical connection component 313 from oxidizing or contaminating dust to affect the imaging quality of the camera module 100. .
- the base 33 includes a support member 334 for supporting the mold during manufacture to prevent damage to the circuit board or the photosensitive chip 31. That is, during the manufacturing process, the manufacturing mold can be abutted against the support member 334 such that the mold does not directly contact the circuit board or the photosensitive chip 31, and the molding material is prevented from overflowing to the inside. flow.
- the support member 334 may have an annular structure conforming to the shape of the base body 331.
- the support element 334 has elasticity, such as, but not limited to, a glue coating or a pad.
- FIG. 19 it is a camera module 100 according to an eighth preferred embodiment of the present invention.
- the circuit board main body 321 has a sinking region 3215, and the photosensitive chip 31 is sunkenly disposed in the sinker region 3215 to facilitate lowering the photosensitive chip 31 and the circuit board main body.
- the relative height of 321 is a part of the circuit board main body 321 .
- the sinker region 3215 can be implemented as a recess or a through hole. That is to say, both sides of the circuit board main body 321 may be disconnected or communicated.
- the sinker region 3215 is a groove
- the photosensitive chip 31 is disposed at the bottom of the groove, and is electrically connected to the circuit board main body 321 through the electrical connection member 313.
- the outer end of the electrical connection element 313 may be electrically connected to the groove bottom of the groove or may be electrically connected to the outside of the sinker zone 3215, and the invention is not limited in this respect.
- the top surface of the photosensitive chip 31 may coincide with the top surface of the circuit board main body 321 or be lower than the top surface of the circuit board main body 321 or higher than the top surface of the circuit board main body 321 That is, the present invention does not limit the sinking depth.
- the sinker region 3215 is a through hole, that is, the space on both sides of the circuit board 32 communicates through the through hole.
- the pedestal 33 of the photosensitive component 30 of the camera module 100 integrally encapsulates at least a portion of the non-photosensitive region 312 of the photosensitive chip 31.
- the susceptor 33 integrally encapsulates the circuit board and the photosensitive chip 31 such that the photosensitive chip 31 is stably fixed and the moldable region of the susceptor 33 is increased.
- the base 33 encloses the electrical connection element 313.
- the manner in which the susceptor 33 can be integrally molded can be expanded in a manner of molding on the photosensitive chip.
- the holder 33 and the circuit board 32 and the photosensitive chip 31 are more stably connected, and the top portion may be other components such as the lens 10, the lens carrying member 20, etc., providing a larger mountable area.
- the electrical connection component 313 is covered by the base 33 to avoid external interference with the electrical connection component 313, and prevents the electrical connection component 313 from oxidizing or contaminating dust to affect the imaging quality of the camera module 100. .
- the photosensitive chip 31 and the electrical connection member 313 are integrally packaged by the susceptor 33, so that the photosensitive chip 31 can be fixed by the susceptor 33.
- a bottom plate 323 may be disposed at the bottom of the circuit board 32, or the bottom plate 323 may not be disposed.
- FIG. 20 is a schematic diagram of a camera module 100 in accordance with a ninth preferred embodiment of the present invention.
- the filter element 40 is correspondingly disposed on the photosensitive member 30, and the susceptor 33 combines the photosensitive member 30 and the filter element 40 into one body after molding to form a unitary structure. That is to say, unlike the above embodiment, the filter element 40 is disposed on the base 33 by integral molding, and is disposed in the base 33 in a different manner, such as a bonding manner.
- the filter element 40 is correspondingly disposed on the photosensitive component 30 to form at least one sealed space between the filter element 40 and the photosensitive component 30, wherein the photosensitive chip of the photosensitive component 30
- the photosensitive regions of 31 are respectively located in the sealed space, so that the molding material for forming the susceptor 33 does not enter the sealed space during the molding process to form the susceptor 33, thereby
- the base 33 is formed only outside the sealed space, wherein the base 33 covers a portion of the circuit board 32 and a portion of the filter element 40 after molding, and the base 33
- the photosensitive area of the photosensitive chip 31 corresponds to the light window 333, so that the light window 333 provides a light path to the lens 10 and the photosensitive chip 31.
- Figure 21 is a camera module 100 in accordance with a tenth preferred embodiment of the present invention.
- the photosensitive member 30 includes a shielding lens 14 disposed above the photosensitive chip 31, and the shielding lens 14 is integrally packaged by the base 33.
- the light reflected by the object enters the inside of the camera module 100 from the lens 10 and the shielding lens 14 to be subsequently received and photoelectrically converted by the photosensitive chip 31, thereby obtaining an image associated with the object.
- the arrangement of the shielding lens 14 can reduce the optical TTL (the distance from the lens 10 plane of the lens 10 through the aperture to the photosensitive plane of the chip), thereby making the size of the camera module 100 without affecting the optical performance. Further reducing, the demand for the electronic device to mount the small-sized camera module 100 is satisfied.
- the arrangement of the occlusion lens 14 can also reduce stain sensitivity. For example, in one embodiment, stain sensitivity of 50% can be reduced.
- the occlusion lens 14 is embodied as a lens of thermosetting properties, ie the occlusion lens 14 is embodied as a thermally hardened lens such that the occlusion lens 14 is in progress
- the molding process is able to withstand the ambient temperature in the molding process. For example, it is possible to withstand a molding ambient temperature of 180 ° C in the molding process of an embodiment. That is, the opaque and thermally hardened occlusion lens 14 is attached to the support member 334 prior to the molding process and is placed with the circuit board 32 and the photosensitive chip 31.
- a solidified molding material of the fluid is molded integrally around the support member 334 and the outer surface of the shielding lens 14 so that the base 33 can be integrally molded to the circuit board. 32. That is, the base 33, the circuit board 32, and the shielding lens 14 form a unitary structure.
- the occlusion lens 14 of the present invention can be not only a heat-hardened lens, but also a lens 11 of other nature, and the present invention is not limited thereto.
- the shielding lens 14 includes a lens body 141 and a lens periphery 142 disposed around the lens body 141. Since the occlusion lens 14 is a precision optical element, the edge of the lens body 141 is thin.
- the lens periphery 142 disposed at the edge of the lens body 141 and integrally connected is a thickened bracket design capable of carrying the lens body 141 so as not to affect the optical performance of the lens body 141 while enabling The lens body 141 is integrally molded to the base 33 in a mold.
- the lens periphery 142 of the visor 14 is disposed in the non-photosensitive region 312 of the photographic lens 31, and the lens of the visor 14 is
- the main body 141 is disposed on the photosensitive path of the photosensitive chip 31 of the photosensitive member 30; after the base 33 is formed, the base 33 covers the circuit board 32 and at least a portion of the photosensitive chip 31
- the non-photosensitive region 312, at least a portion of the support member 334, and the lens perimeter 142 of the occlusion lens 14 form the photosensitive member 30.
- the shielding lens 14 can also be the de-branching lens, thereby reducing the edge portion of the lens 11, reducing the area of the shielding lens 14, so that the shielding lens 14 and the The shape of the lens 10 corresponds to each other.
- Figure 22 is a camera module 100 in accordance with an eleventh preferred embodiment of the present invention.
- the circuit board main body 321 includes a first board body 3211 and a second board body 3212.
- the first board body 3211 and the second board body 3212 are fixedly connected by a connecting medium 3213.
- the first board 3211 can be a hard board
- the second board 3212 can be a soft board
- the connecting medium 3213 can be an ACF conductive adhesive.
- the second board 3212 may further include an interface end, such as a connector, to facilitate electrical connection to an electronic device.
- the base body 331 is integrally formed on the first plate 3211, and the second plate 3212 is overlapped at one end of the first plate 3211.
- the circuit board main body 321 may be formed by the first board body 3211 and the second board body 3212, and then integrally formed, or may be performed on the first board body 3211.
- the second plate body 3212 is electrically connected to the first plate body 3211, and is fixed to the first plate body 3211 by, for example, the ACF conductive adhesive.
- the second board 3212 is connected to the upper portion of the first board 3211 through the connecting medium 3213.
- the second The plate body 3212 is coupled to the bottom of the first plate body 3211 through the connection medium 3213, and the present invention is not limited in this regard.
- Figure 23 is a camera module 100 in accordance with a twelfth preferred embodiment of the present invention.
- the circuit board main body 321 is provided with an inverted groove 3214, and the photosensitive chip 31 is mounted on the inverted groove 3214 in an inverted manner. That is, the photosensitive chip 31 is mounted on the board main body 321 by means of an FC (Flip Chip).
- FC Flexible Chip
- the inverted groove 3214 is opposite to the lens 10.
- the photosensitive chip 31 is mounted from the lower surface of the circuit board main body 321 toward the circuit board main body 321 during the mounting process, and the photosensitive area of the photosensitive chip 31 is exposed through the flip-chip 3214. effect.
- Figure 24 is a schematic diagram of a camera module in accordance with a fourteenth preferred embodiment of the present invention.
- the lens carrying member 20 is integrally coupled to the base 33, and the lens 10 is adapted to be mounted to the lens carrying member 20 to facilitate formation of a telephoto camera module.
- the lens carrying member 20 extends at least partially integrally upward from the base body 331 to form a closed lens limiting space. That is to say, in this manner, the base 33 includes the lens carried on the component 20 to provide a limit and installation space for the lens 10.
- the susceptor 33 with the lens carrying member 20 may be integrally formed on the circuit board 32 by a mold.
- the lens carrying member may also be formed on the base body after the base body is formed by means of secondary molding, and the present invention is not limited in this respect.
- 25A, 25B are schematic views of a camera module 100 in accordance with a fifteenth preferred embodiment of the present invention.
- the lens 10 includes at least two lens units, and the optical paths of the lens units are identical. Further, at least one of the lens units of each of the lens units is a de-edge lens unit. That is, at least one of the lens units includes at least one of the de-branching lenses.
- the lens 10 includes two lens units, which are a first lens unit 110 and a second lens unit 120, respectively, the first lens unit 110 and the second lens unit 120. Bottom-up stacking settings.
- the first lens unit 110 is a de-edge lens.
- the first lens unit 110 and the second lens unit 120 are independent of each other, that is, in the process of manufacturing, the first lens unit 110 and the second lens unit 120 may be respectively formed separately, and then Assemble two lens units, such as glue.
- the first lens unit 110 includes four lenses 11 , which are a first lens 111 , a second lens 112 , a third lens 113 , and a fourth lens 114 , wherein the fourth lens 114 is edged. Lens.
- the first lens unit 110 includes a de-bounding lens barrel 12, and each of the lenses 11 is mounted in the lens barrel 12, respectively.
- the consistency of the optical axis and the relative angular relationship between the lenses are some important factors affecting the image quality of the lens.
- the last lens is typically assembled by pre-assembling the lens and then adjusting the orientation of the lens, such as by a predetermined angle, to provide better imaging of the lens.
- the adjustment of the relative position of the lens can be achieved by adjusting the second lens unit 120. That is, when the mirror 10 is assembled, the first lens unit 110 and the second lens unit 120 are assembled first, and then the first lens unit 110 and the second lens unit 120 are pre-assembled.
- the first board body 321 includes a first board body 3211 and a second board body 3212, and the second board body 3212 is electrically connected to the first board.
- Plate body 3211 The first plate 3211 may be a hard plate, and the second plate 3212 may be a soft plate.
- the second board 3212 can be electrically connected to the first board 3211 in a press-fit manner, or can be electrically connected to the first board 3211 through a conductive medium.
- the second board 3212 may further include an interface end, such as a connector for electrically connecting to an electronic device, that is, the second board 3212 is an electrical connection terminal for electrical connection. Other devices, such as electronic devices.
- the base body 331 includes four sides, which are respectively a first side 33101, a second side 33102, a third side 33103, and a fourth side 33104.
- the second side 33102, the third side 33103, and the fourth side 33104 are sequentially adjacent to each other to form the light window 333.
- the second side 33102 and the fourth side 33104 are located on opposite sides of the first side 33101, and the third side 33103 is opposite to the first side 33101.
- a holder 3320 is mounted to the base body 331, and the filter element 40 is mounted to the holder 3320 such that the filter element 40 is located in the photosensitive path of the photosensitive chip 31.
- the first side 33101 is adjacent to the second plate 3212, and the chord 1141 of the demarcation lens of the lens 10 is located at the first side 33101. direction. That is, the chord edge 1141 of the de-branching lens and the chord portion 121 of the de-edgering lens barrel 12 are close to the interface end of the camera module 100.
- the electronic component 332 and the electrical connection component 313 are disposed on the second side 33102 and the fourth side 33104 of the base, making full use of the The position of the circuit board main body 321 corresponding to the second side 33102 and the fourth side 33104 is described. That is, the electronic component 332 and the electrical connection component 313 are disposed at positions of the first board corresponding to the second side 33102 and the fourth side 33104. In particular, the electronic component 332 and the electrical connection component 313 are disposed in a direction perpendicular to the chord edge 1141 of the demarcation lens such that the dimension of the chord edge 1141 is maximized. small.
- the electrical connection element 313 and the electronic component 332 are disposed on opposite sides, and in other embodiments of the invention, the electrical connection element 313 and the electronic component 332 may be disposed on any two sides, three sides or four sides of the photosensitive chip 31 as needed, that is, the electronic component 332 and/or the electrical connection component 313 may be selectively One side, two sides, and three sides of the first side 33101, the second side 33102, the third side 33103, and the fourth side 33104 of the base body 331
- the side or the four sides, the invention is not limited in this respect.
- the chord edge 1141 is located in a direction of the first side edge 33101, and the first side edge 33101 is not disposed at a position corresponding to the electronic component 332, so that the The width dimension of the first side 33101 is required to be reduced, thereby increasing the possibility that the size of the camera module is further reduced. That is, the arrangement positions of the electronic component 332 and the electrical connection component 313 can be adjusted according to the direction in which the chord 1141 is disposed.
- the width of the first side 33101 is small, which is adapted to the de-edge design of the lens 10, that is, to accommodate the chord 1141 of the de-branching lens. And the chord portion 121 of the lens barrel 12 is de-bounded.
- the width dimension W1 of the first side edge 33101 is smaller than the width dimensions W2, W4 of the second side edge 33102 and the fourth side edge 33104.
- FIGS. 27A and 27B are schematic views of a camera module and a photosensitive member in accordance with a sixteenth preferred embodiment of the present invention.
- the third side 33103 is away from the second plate 3212, the said deframed lens of the lens 10
- the chord edge 1141 and the chord portion 121 of the de-edged lens barrel 12 are located in the direction of the third side 33101. That is to say, the chord edge 1141 of the de-edged lens and the chord portion 121 of the de-bounding lens barrel 12 are away from the electrical connection end of the camera module 100. That is, the chord 1141 of the de-branching lens is located on the side opposite to the second plate 3212.
- the width of the third side 33103 is small, and is adapted to the de-edge design of the lens 10, that is, the chord 1141 of the de-branching lens is adapted. And the chord portion 121 of the lens barrel 12 is de-bounded.
- the third side 33101 has a width dimension W3 that is smaller than width dimensions W2, W4 of the second side 33102 and the fourth side 33104.
- the de-bounding lens includes two of the chord sides 1141
- the de-edgering barrel 12 includes two of the chord sides 121.
- One of the chord sides 1141 of the demarcation lens and one of the chord sides 121 of the de-stained lens barrel 12 are located on a side close to the second plate body 3212.
- the other of the chord sides 1141 of the de-branching lens and the other chord portion 121 of the de-stained lens barrel 12 are located on a side away from the second plate body 3212.
- one of the chord sides 1141 of the demarcation lens and each of the chord portions 121 of the de-stained lens barrel 12 are located at the first side 33101 of the base body 331.
- the other of the chord sides 1141 of the demarcation lens and the other chord portion 121 of the demarcation lens barrel 12 are located at the third side plate 33103 of the base body 331.
- 29 is a schematic diagram of an array camera module in accordance with a fifteenth preferred embodiment of the present invention.
- the array camera module includes a plurality of the camera modules 100 such that the modules cooperate with each other.
- each of the camera modules 100 is separately provided, that is, the circuit board 32 and the base 33 of each of the camera modules 100 may not be connected.
- each of the camera modules 100 can be assembled by an outer frame 50.
- the array camera module may be formed by the camera module 100 and the conventional camera module of the present invention, that is, the array camera module includes at least one of the camera modules. 100.
- Figure 30 is a schematic diagram of an array camera module in accordance with a sixteenth preferred embodiment of the present invention.
- the array camera module 100 includes a plurality of the camera modules 100 such that the modules cooperate with each other.
- each of the camera modules 100 is disposed integrally, that is, the circuit board 32 and the base 33 of each of the camera modules 100 can be connected to each other to form a unitary structure.
- the array camera module may be combined with the camera module 100 of the present invention and a conventional camera module, that is, the array camera module includes at least one of the camera modules. Group 100. At least one of the camera modules 100 can be combined with a conventional camera module to form the array camera module.
- Figure 31 is a schematic illustration of a method of manufacturing the lens 10 in accordance with the above-described preferred embodiment of the present invention.
- the present invention provides a method 1000 of manufacturing a lens 10, the method comprising the steps of:
- 1101 injection molding at least one de-edge lens
- the demarcation lens is mounted to the de-stained lens barrel 12 at a predetermined position.
- FIG. 32 is a schematic diagram of the application of the camera module 100 in accordance with the above-described preferred embodiment of the present invention.
- the present invention further provides an electronic device 300, wherein the electronic device includes an electronic device body 200 and at least one of the camera modules 100, wherein the camera module 100 is respectively disposed on the electronic device body 200 for use.
- the type of the electronic device body 200 is not limited.
- the electronic device body 200 may be a smart phone, a wearable device, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, and a monitor. Any device or the like that can be configured with the camera module 100.
- the electronic device body 200 is implemented as a smart phone in FIG. 32, it does not constitute a limitation on the content and scope of the present invention.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
Claims (145)
- 一镜头,其特征在于,包括:至少一去边化镜片,其中所述去边化镜片包括至少一弦边和至少一圆边,所述弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同。
- 根据权利要求1所述的镜头,其中所述弦边的曲率为0,是直线段。
- 根据权利要求1所述的镜头,其中所述圆边的曲率>0,是一弧形线段。
- 根据权利要求1所述的镜头,其中所述弦边为直线,所述圆边为圆弧。
- 根据权利要求1所述的镜头,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
- 根据权利要求1所述的镜头,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
- 根据权利要求1所述的镜头,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
- 根据权利要求7所述的镜头,其中所述弦边是直线段。
- 根据权利要求1至8任一所述的镜头,其中所述镜头包括多个镜片,其中至少一个为所述去边化镜片,至少一个为圆形镜片。
- 根据权利要求9所述的镜头,其中所述去边化镜片的尺寸大于所述圆形镜片。
- 根据权利要求9所述的镜头,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
- 根据权利要求9所述的镜头,其中所述镜头包括一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内。
- 根据权利要求12所述的镜头,其中所述去边化镜筒包括一弦边部和一圆边部,其中所述弦边部和所述圆边部的截面边缘曲率不同。
- 根据权利要求13所述的镜头,其中所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部相对应。
- 根据权要求13所述的镜头,其中所述去边化镜片通过注塑方式一次成型制造。
- 根据权利要求13所述的镜头,其中所述镜头包括至少一光路元件,其 中所述光路元件被设置于与所述镜片之间,以便于在所述镜片形成预定光线通路。
- 根据权利要求16所述的镜头,其中位于所述去边化镜片的所述光路元件的外边缘形状与所述去边化镜片形状一致。
- 根据权利要求16所述的镜头,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
- 一摄像模组,其特征在,包括:一镜头,其中所述镜头包括至少一去边化镜片,其中所述去边化镜片包括至少一弦边和至少一圆边,所述弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同;和一感光组件,其中所述镜头位于所述感光组件的感光路径。
- 根据权利要求19所述的摄像模组,其中所述弦边的曲率为0,是直线段。
- 根据权利要求19所述的摄像模组,其中所述圆边的曲率>0,是一弧形线段。
- 根据权利要求19所述的摄像模组,其中所述弦边为直线,所述圆边为圆弧。
- 根据权利要求19所述的摄像模组,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
- 根据权利要求19所述的摄像模组,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
- 根据权利要求19所述的摄像模组,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
- 根据权利要求25所述的摄像模组,其中所述弦边是直线段。
- 根据权利要求19所述的摄像模组,其中所述镜头包括多个镜片,其中至少一个为所述去边化镜片,至少一个为圆形镜片。
- 根据权利要求27所述的摄像模组,其中所述去边化镜片的尺寸大于所述圆形镜片。
- 根据权利要求27所述的摄像模组,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
- 根据权利要求27所述的摄像模组,其中所述镜头包括一去边化镜筒, 所述去边化镜片被安装于所述去边化镜筒内。
- 根据权利要求30所述的摄像模组,其中所述去边化镜筒包括一弦边部和一圆边部,其中所述弦边部和所述圆边部的截面边缘曲率不同。
- 根据权利要求31所述的摄像模组,其中所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部相对应。
- 根据权要求27所述的摄像模组,其中所述去边化镜片通过注塑方式一次成型制造。
- 根据权利要求27所述的摄像模组,其中所述镜头包括至少一光路元件,其中所述光路元件与所述镜片相邻设置,以便于在所述镜片形成预定光线通路。
- 根据权利要求34所述的摄像模组,其中位于所述去边化镜片的所述光路元件的外边缘形状与所述去边化镜片形状一致。
- 根据权利要求35所述的摄像模组,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
- 根据权利要求19至36任一所述的摄像模组,其中所述感光组件包括至少一基座、至少一感光芯片和至少一电路板,其中所述基座被设置于电路板,以便于提供一安装位置,所述感光芯片电连接于所述电路板,所述镜头位于所述感光芯片的感光路径。
- 根据权利要其37所述的摄像模组,其中所述基座一体成型于所述电路板,形成至少一光窗,为所述感光芯片提供光线通路。
- 根据权利要求38所述的摄像模组,其中所述基座包括一基座主体和补充基座,所述基座主体具有一缺口,所述补充基座补充一所述缺口,从而形成一封闭的所述光窗。
- 根据权利要求39所述的摄像模组,其中所述镜头的去边化位置和所述补充基座的位置相对应。
- 根据权利要求37所述的摄像模组,其中所述基座被粘接固定于所述电路板。
- 根据权利要求37所述的摄像模组,其中所述电路板包括一电路板主体和至少一电子元件,所述电子元件被设置于所述电路板主体,其中所述基座一体成型于所述电路板主体,并且包覆至少一所述电子元件。
- 根据权要求37所述的摄像模组,其中所述电路板包括一电路板主体和 至少一电子元件,其中至少一所述电子元件被设置于所述电路板主体的底部。
- 根据权利要求37所述的摄像模组,其中所述电路板具有一下沉区,所述感光芯片被下沉地设置于所述下沉区。
- 根据权利要求44所述的摄像模组,其中所述下沉区选择凹槽、通孔中的一种。
- 根据权利要求37所述的摄像模组,其中所述感光芯片具有一感光区和一非感光区,所述基座一体封装至少部分所述非感光区。
- 根据权利要求37所述的摄像模组,其中所述摄像模组包括至少一滤光元件,其中所述基座一体封装所述滤光元件。
- 根据权利要求37所述的摄像模组,其中所述摄像模组包括一遮挡镜片,所述遮挡镜片位于所述感光芯片上方,被所述基座一体封装。
- 根据权利要求48所述的摄像模组,其中所述遮挡镜片是所述去边化镜片。
- 根据权利要求37所述的摄像模组,其中所述摄像模组包括一镜头承载元件,其中所述镜头被安装于所述镜头承载元件,所述镜头承载元件被安装于所述基座。
- 根据权利要求50所述的摄像模组,其中所述镜头承载元件是一驱动部件,以形成一动焦摄像模组。
- 根据权利要求50所述的摄像模组,其中所述镜头承载元件是一镜头固定部件,以形成一定焦摄像模组。
- 根据权利要求50所述的摄像模组,其中所述镜头承载元件一体连接于所述基座,所述镜头被安装于所述镜头承载元件,以形成一定焦模组。
- 根据权利要求37所述的摄像模组,其中多个所述摄像模组构成一阵列摄像模组。
- 根据权利要求37所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于靠近所述第二板体一侧。
- 根据权利要求37所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板 体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于远离所述第二板体的一侧。
- 根据权利要求37所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,其中一所述弦边位于靠近所述第一板体的一侧,另一所述弦边位于远离所述第二板体的一侧。
- 根据权利要求55所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述弦边位于所述第一侧边方向。
- 根据权利要求58所述的摄像模组,其中所述第一侧边的宽度尺寸小于第二侧边和所述第四侧边的宽度尺寸。
- 根据权利要求56所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,所述弦边位于所述第三侧边方向。
- 根据权利要求60所述的摄像模组,其中所述第三侧边的宽度尺寸小于第二侧边和所述第四侧边的宽度尺寸。
- 根据权利要求57所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边依次相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,其中一所述弦边位于所述第一侧边方向,另一所述弦边位于所述第三侧边方向。
- 根据权利要求55所述的摄像模组,其中所述电路板包括至少一电子元件,所述电子元件被设置于所述第一板体,其中所述基座一体成型于所述第一板体,并且包覆至少一所述电子元件。
- 根据权利要求63所述的摄像模组,其中所述电子元件被选择性地设置 于所述基座的四侧边中的一侧边、两侧边、三侧边或四侧边。
- 根据权利要求63所述的摄像模组,其中所述电子元件被设置于所述第第二侧边和所述第四侧边位置。
- 根据权利要求63所述的摄像模组,其中所述电子元件被设置于所述第一侧边和所述第三侧边位置。
- 根据权利要求55所述的摄像模组,其中所述感光芯片通过一电连接元件电连接于所述第一板体,所述基座一体成型于所述第一板体,并且包覆所述电连接元件。
- 根据权利要求67所述的摄像模组,其中所述电连接被选择性地设置于所述基座四侧中的两侧、三侧或四侧。
- 根据权利要求67所述的摄像模组,其中所述电连接元件被设置于所述第二侧边和所述第四侧边对应的位置。
- 根据权利要求67所述的摄像模组,其中所述电连接元件被设置于所述第一侧边和所述第三侧边对应的位置。
- 一镜头,其特征在于,包括:至少一去边化镜片和一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内,其中所述去边化镜片包括至少一弦边和至少一圆边,所述的弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同,所述去边化镜筒包括一弦边部,所述弦边部和所述去边化镜片的所述弦边对应,以便于减小所述镜头的体积。
- 根据权利要求71所述的镜头,其中所述弦边的曲率为0,是直线段。
- 根据权利要求71所述的镜头,其中所述圆边的曲率>0,是一弧形线段。
- 根据权利要求71所述的镜头,其中所述弦边为直线,所述圆边为圆弧。
- 根据权利要求71所述的镜头,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
- 根据权利要求71所述的镜头,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
- 根据权利要求71所述的镜头,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
- 根据权利要求72所述的镜头,其中所述弦边是直线段。
- 根据权利要求71至78任一所述的镜头,其中所述镜头包括多个镜片, 其中至少一个为所述去边化镜片,至少一个为圆形镜片。
- 根据权利要求79所述的镜头,其中所述去边化镜片的尺寸大于所述圆形镜片。
- 根据权利要求79所述的镜头,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
- 根据权利要求79所述的镜头,其中所述去边化镜片是位于最底端的镜片。
- 根据权利要求79所述的镜头,其中所述去边化镜筒包括一圆边部,所述圆边部和弦边部相接形成所述镜筒,其中所述弦边部和所述圆边部的截面边缘曲率不同。
- 根据权要求79所述的镜头,其中所述去边化镜片通过注塑方式一次成型制造。
- 根据权利要求79所述的镜头,其中所述去边化镜筒通过注塑方式一次成型制造。
- 根据权利要求79所述的镜头,其中所述镜头包括至少一光路元件,其中所述光路元件被设置于与所述镜片之间,以便于在所述镜片形成预定光线通路。
- 根据权利要求86所述的镜头,其中位于所述去边化镜片的所述光路元件的外边缘形状与所述去边化镜片形状一致。
- 根据权利要求86所述的镜头,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
- 根据权利要求79所述的镜头,其中所述镜头包括至少两镜头单元,各所述镜头单元光轴一致地叠层设置,至少一所述镜头单元包括一所述去边化镜片和一所述去边化镜筒。
- 一摄像模组,其特征在,包括:一镜头,所述镜头包括至少一去边化镜片和一去边化镜筒,所述去边化镜片被安装于所述去边化镜筒内,其中所述去边化镜片包括至少一弦边和至少一圆边,所述弦边和所述圆边相邻接,其中所述弦边和所述圆边的曲率不同,所述去边化镜筒包括一弦边部,所述弦边部和所述去边化镜片的所述弦边对应,以便于减小所述镜头的体积;和一感光组件,其中所述镜头位于所述感光组件的感光路径。
- 根据权利要求90所述的摄像模组,其中所述弦边的曲率为0,是直线段。
- 根据权利要求90所述的摄像模组,其中所述圆边的曲率>0,是一弧形线段。
- 根据权利要求90所述的摄像模组,其中所述弦边为直线,所述圆边为圆弧。
- 根据权利要求90所述的摄像模组,其中所述弦边和所述圆边的数量为1,且所述弦边的曲率为0,是直线段。
- 根据权利要求90所述的摄像模组,其中所述弦边的数量为2,且各所述弦边的曲率为0,是直线段。
- 根据权利要求90所述的摄像模组,其中所述弦边的数量为2,所述圆边数量为2,各所述弦边对称分布。
- 根据权利要求96所述的摄像模组,其中所述弦边是直线段。
- 根据权利要求90所述的摄像模组,其中所述镜头包括多个镜片,其中至少一个为所述去边化镜片,至少一个为圆形镜片。
- 根据权利要求98所述的摄像模组,其中所述去边化镜片的尺寸大于所述圆形镜片。
- 根据权利要求98所述的摄像模组,其中所述镜头包括四个镜片,其中所述镜片尺寸依次增大,且其中尺寸最大的所述镜片为所述去边化镜片。
- 根据权利要求90所述的摄像模组,其中所述去边化镜筒一圆边部,所述圆边部和所述弦边部相接,其中所述弦边部和所述圆边部的截面边缘曲率不同。
- 根据权要求90所述的摄像模组,其中所述去边化镜片通过注塑方式一次成型制造。
- 根据权要求82所述的摄像模组,其中所述去边化镜筒通过注塑方式一次成型制造
- 根据权利要求90所述的摄像模组,其中所述镜头包括至少一光路元件,其中所述光路元件与所述镜片相邻设置,以便于在所述镜片形成预定光线通路。
- 根据权利要求104所述的摄像模组,其中位于所述去边化镜片的所述 光路元件的外边缘形状与所述去边化镜片形状一致。
- 根据权利要求105所述的摄像模组,其中所述光路元件为组合:垫圈、垫片、涂层中的一种。
- 根据权利要求90所述的摄像模组,其中所述镜头包括至少两镜头单元,各所述镜头单元光轴一致地叠层设置,至少一所述镜头单元包括一所述去边化镜片和一所述去边化镜筒。
- 根据权利要求90至107任一所述的摄像模组,其中所述感光组件包括至少一基座、至少一感光芯片和至少一电路板,其中所述基座被设置于电路板,以便于提供一安装位置,所述感光芯片电连接于所述电路板,所述镜头位于所述感光芯片的感光路径。
- 根据权利要其108所述的摄像模组,其中所述基座一体成型于所述电路板,形成至少一光窗,为所述感光芯片提供光线通路。
- 根据权利要求109所述的摄像模组,其中所述基座包括一基座主体和补充基座,所述基座主体具有一缺口,所述补充基座补充一所述缺口,从而形成一封闭的所述光窗。
- 根据权利要求108所述的摄像模组,其中所述镜头的去边化位置和所述补充基座的位置相对应。
- 根据权利要求108所述的摄像模组,其中所述基座被粘接固定于所述电路板。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一电路板主体和至少一电子元件,所述电子元件被设置于所述电路板主体,其中所述基座一体成型于所述电路板主体,并且包覆至少一所述电子元件。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一电路板主体和至少一电子元件,至少一所述电子元件被设置于所述电路板主体的底部。
- 根据权利要求108所述的摄像模组,其中所述电路板具有一下沉区,所述感光芯片被下沉地设置于所述下沉区。
- 根据权利要求115所述的摄像模组,其中所述下沉区选择凹槽、通孔中的一种。
- 根据权利要求108所述的摄像模组,其中所述感光芯片具有一感光区和一非感光区,所述基座一体封装至少部分所述非感光区。
- 根据权利要求108所述的摄像模组,其中所述摄像模组包括至少一滤光元件,所述基座一体封装所述滤光元件。
- 根据权利要求108所述的摄像模组,其中所述摄像模组包括一遮挡镜片,所述遮挡镜片位于所述感光芯片上方,被所述基座一体封装。
- 根据权利要求119所述的摄像模组,其中所述遮挡镜片是所述去边化镜片。
- 根据权利要求108所述的摄像模组,其中所述摄像模组包括一镜头承载元件,其中所述镜头被安装于所述镜头承载元件,所述镜头承载元件被安装于所述基座。
- 根据权利要求121所述的摄像模组,其中所述镜头承载元件是一驱动部件,以形成一动焦摄像模组。
- 根据权利要求121所述的摄像模组,其中所述镜头承载元件是一镜头固定部件,以形成一定焦摄像模组。
- 根据权利要求121所述的摄像模组,其中所述镜头承载元件一体连接于所述基座,所述镜头被安装于所述镜头承载元件,以形成一定焦模组。
- 根据权利要求108所述的摄像模组,其中多个所述摄像模组构成一阵列摄像模组。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于靠近所述第二板体一侧。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部位于靠近所述第二板体一侧。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边位于远离所述第二板体的一侧。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体 和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体,所述去边化镜片的所述弦边和所述去边化镜筒的所述弦边部位于远离所述第二板体的一侧。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,其中一所述弦边位于靠近所述第一板体的一侧,另一所述弦边位于远离所述第二板体的一侧。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体电连接所述第二板体,所述基座被设置于所述第一板体,所述去边化镜片的包括两所述弦边,所述去边化镜筒包括两所述弦边部,其中一所述弦边和一所述弦边部位于靠近所述第一板体的一侧,另一所述弦边和所述弦边部位于远离所述第二板体的一侧。
- 根据权利要求126所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述弦边位于所述第一侧边方向。
- 根据权利要求132所述的摄像模组,其中所述第一侧边的宽度尺寸小于所述第二侧边和所述第四侧边的宽度尺寸。
- 根据权利要求128所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,所述弦边位于所述第三侧边方向。
- 根据权利要求134所述的摄像模组,其中所述第二侧边的宽度尺寸小于第二侧边和所述四侧边的宽度尺寸。
- 根据权利要求130所述的摄像模组,其中所述基座包括四侧边,分别一第一侧边、一第二侧边、一第三侧边和一第四侧边,所述第一侧边、所述第二侧边、所述第三侧边和所述第四侧边依次相互邻接形成一光窗,为所述感光芯片提供光线通路,所述第一侧边靠近所述第二板体,所述第三侧边与所述第一侧边相对,其中一所述弦边位于所述第一侧边方向,另一所述弦边位于所述第三侧边 方向。
- 根据权利要求108所述的摄像模组,其中所述电路板包括一第一板体和一第二板体,所述第一板体和所述第二板体通过一连接介质电连接,所述第二板体用于电连接电子设备,所述基座被设置于所述第一板体。
- 根据权利要求137所述的摄像模组,其中所述电路板包括至少一电子元件,所述电子元件被设置于所述第一板体,其中所述基座一体成型于所述第一板体,并且包覆至少一所述电子元件。
- 根据权利要求137所述的摄像模组,其中所述电子元件被选择性地设置于所述基座的四侧边中的一侧边、两侧边、三侧边、四侧边。
- 根据权利要求137所述的摄像模组,其中所述电子元件被设置于所述第第二侧边和所述第四侧边位置。
- 根据权利要求137所述的摄像模组,其中所述电子元件被设置于所述第一侧边和所述第三侧边位置。
- 根据权利要求137所述的摄像模组,其中所述感光芯片通过一电连接元件电连接于所述第一板体,所述基座一体成型于所述第一板体,包覆所述电连接元件。
- 根据权利要求137所述的摄像模组,其中所述电连接被选择性地设置于所述基座四侧中的两侧、三侧或四侧。
- 根据权利要求137所述的摄像模组,其中所述电连接元件被设置于所述第二侧边和所述第四侧边对应的位置。
- 根据权利要求137所述的摄像模组,其中所述电连接元件被设置于所述第一侧边和所述第三侧边对应的位置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020197021981A KR20190107679A (ko) | 2017-01-26 | 2018-01-26 | 렌즈와 카메라모듈 및 그 제조방법 |
EP18744975.6A EP3575844A4 (en) | 2017-01-26 | 2018-01-26 | LENS, CAMERA MODULE AND MANUFACTURING METHOD FOR IT |
US16/479,403 US11579341B2 (en) | 2017-01-26 | 2018-01-26 | Lens, camera module and manufacturing method thereof |
JP2019539912A JP6876812B2 (ja) | 2017-01-26 | 2018-01-26 | レンズ群及びカメラモジュール並びにその製造方法 |
KR1020217043041A KR102509125B1 (ko) | 2017-01-26 | 2018-01-26 | 카메라모듈 |
US18/074,882 US12007583B2 (en) | 2017-01-26 | 2022-12-05 | Lens, camera module and manufacturing method thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720107077.8U CN206892433U (zh) | 2017-01-26 | 2017-01-26 | 镜头和摄像模组 |
CN201710057589.2 | 2017-01-26 | ||
CN201710057589.2A CN108363159B (zh) | 2017-01-26 | 2017-01-26 | 一镜头和摄像模组及其制造方法 |
CN201720107077.8 | 2017-01-26 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/479,403 A-371-Of-International US11579341B2 (en) | 2017-01-26 | 2018-01-26 | Lens, camera module and manufacturing method thereof |
US18/074,882 Division US12007583B2 (en) | 2017-01-26 | 2022-12-05 | Lens, camera module and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018137706A1 true WO2018137706A1 (zh) | 2018-08-02 |
Family
ID=62979043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/074319 WO2018137706A1 (zh) | 2017-01-26 | 2018-01-26 | 镜头和摄像模组及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US11579341B2 (zh) |
EP (1) | EP3575844A4 (zh) |
JP (2) | JP6876812B2 (zh) |
KR (2) | KR102509125B1 (zh) |
WO (1) | WO2018137706A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110320632A (zh) * | 2019-08-08 | 2019-10-11 | 浙江舜宇光学有限公司 | 镜头 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10317651B2 (en) | 2017-04-03 | 2019-06-11 | Denso Corporation | Camera module |
US10291830B2 (en) * | 2017-04-03 | 2019-05-14 | Denso Corporation | Vehicle windshield camera module |
USD891504S1 (en) * | 2018-01-12 | 2020-07-28 | Tdk Taiwan Corp. | Driving unit for a camera lens |
USD897405S1 (en) * | 2018-01-12 | 2020-09-29 | Tdk Taiwan Corp. | Driving unit for a camera lens |
TWI791962B (zh) * | 2019-04-24 | 2023-02-11 | 大陸商信泰光學(深圳)有限公司 | 鏡頭裝置 |
US10944915B1 (en) | 2020-01-05 | 2021-03-09 | Ningbo Sunny Opotech Co., Ltd. | Multi-aperture imaging system and application thereof |
US20210255427A1 (en) * | 2020-02-18 | 2021-08-19 | Facebook Technologies, Llc | Stop-in-front or stop-near-front lens assembly |
US11323599B1 (en) * | 2020-12-23 | 2022-05-03 | Waymo Llc | Flexure amplified piezo actuator for focus adjustment |
CN114500697B (zh) * | 2021-07-16 | 2023-01-03 | 荣耀终端有限公司 | 电子设备 |
WO2024039016A1 (ko) * | 2022-08-19 | 2024-02-22 | 삼성전자주식회사 | 렌즈들을 포함하는 카메라 및 이를 포함하는 전자 장치 |
CN115499570B (zh) * | 2022-09-14 | 2024-04-16 | 昆山丘钛微电子科技股份有限公司 | 一种摄像头模组的封装方法及装置 |
JP7403691B1 (ja) | 2023-01-04 | 2023-12-22 | 維沃移動通信有限公司 | レンズモジュール、撮像装置および電子機器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060158748A1 (en) * | 2005-01-19 | 2006-07-20 | Hitachi Maxell, Ltd. | Lens device |
CN101872051A (zh) * | 2009-04-23 | 2010-10-27 | 鸿富锦精密工业(深圳)有限公司 | 镜筒及其应用的镜头模组 |
CN204359995U (zh) * | 2014-11-19 | 2015-05-27 | 大立光电股份有限公司 | 成像镜头模块以及可携式电子装置 |
TWM521747U (zh) * | 2015-10-16 | 2016-05-11 | 大立光電股份有限公司 | 遮光片、遮光元件、光學元件、成像鏡頭與鏡頭模組 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4001986B2 (ja) * | 1997-10-02 | 2007-10-31 | フジノン株式会社 | プラスチック製光学レンズ |
JPH11352374A (ja) | 1998-06-08 | 1999-12-24 | Olympus Optical Co Ltd | レンズの保持構造 |
JP2000206312A (ja) * | 1998-11-12 | 2000-07-28 | Olympus Optical Co Ltd | 光学素子 |
JP4321078B2 (ja) * | 2003-02-28 | 2009-08-26 | コニカミノルタホールディングス株式会社 | 成形レンズ |
JP4691674B2 (ja) * | 2004-01-30 | 2011-06-01 | コニカミノルタオプト株式会社 | 光学ユニット及び撮像装置並びに携帯端末 |
TW200527881A (en) | 2004-01-30 | 2005-08-16 | Konica Minolta Opto Inc | Optical unit, imaging device with the optical unit and portable terminal with the imaging device |
WO2007069499A1 (ja) * | 2005-12-13 | 2007-06-21 | Matsushita Electric Industrial Co., Ltd. | レンズ、レンズユニット及びそれを用いた撮像装置 |
KR100810284B1 (ko) * | 2006-09-28 | 2008-03-06 | 삼성전자주식회사 | 카메라 모듈과 그 제조 방법 |
WO2008133946A1 (en) | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Auto focus/ zoom modules using wafer level optics |
US20100025793A1 (en) | 2008-08-01 | 2010-02-04 | Impac Technology Co., Ltd. | Assembly for image sensing chip and assembling method thereof |
WO2011040149A1 (ja) * | 2009-09-29 | 2011-04-07 | コニカミノルタオプト株式会社 | レンズ及びレンズの加工方法 |
CN102236150B (zh) | 2010-04-20 | 2013-03-27 | 大立光电股份有限公司 | 取像光学透镜系统 |
KR101204161B1 (ko) * | 2010-06-17 | 2012-11-22 | 삼성전기주식회사 | 렌즈구동장치 |
JP5836610B2 (ja) * | 2011-03-04 | 2015-12-24 | キヤノン株式会社 | プラスチック光学部材及びその製造方法 |
JP2013050554A (ja) | 2011-08-30 | 2013-03-14 | Sony Corp | レンズ鏡筒及び撮像装置 |
FR2997329B1 (fr) * | 2012-10-30 | 2014-12-26 | Essilor Int | Procede de fabrication de lentilles optiques et ensemble pour la fabrication de telles lentilles |
TWI650016B (zh) | 2013-08-22 | 2019-02-01 | 新力股份有限公司 | 成像裝置、製造方法及電子設備 |
JP6207955B2 (ja) | 2013-10-03 | 2017-10-04 | シャープ株式会社 | カメラモジュール、およびカメラモジュールの製造方法 |
KR102266735B1 (ko) | 2014-07-16 | 2021-06-18 | 엘지이노텍 주식회사 | 카메라 모듈 |
JPWO2016067731A1 (ja) | 2014-10-27 | 2017-07-27 | シャープ株式会社 | カメラモジュール |
TWI537628B (zh) * | 2014-11-12 | 2016-06-11 | 台灣東電化股份有限公司 | 薄型化鏡頭模組 |
CN105445889B (zh) | 2015-12-02 | 2019-01-01 | 宁波舜宇光电信息有限公司 | 采用分体式镜头的摄像模组及其组装方法 |
CN205792878U (zh) | 2016-04-21 | 2016-12-07 | 宁波舜宇光电信息有限公司 | 基于模塑工艺的摄像模组 |
-
2018
- 2018-01-26 US US16/479,403 patent/US11579341B2/en active Active
- 2018-01-26 WO PCT/CN2018/074319 patent/WO2018137706A1/zh unknown
- 2018-01-26 JP JP2019539912A patent/JP6876812B2/ja active Active
- 2018-01-26 KR KR1020217043041A patent/KR102509125B1/ko active IP Right Grant
- 2018-01-26 EP EP18744975.6A patent/EP3575844A4/en active Pending
- 2018-01-26 KR KR1020197021981A patent/KR20190107679A/ko not_active IP Right Cessation
-
2021
- 2021-04-23 JP JP2021073330A patent/JP2021119400A/ja active Pending
-
2022
- 2022-12-05 US US18/074,882 patent/US12007583B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060158748A1 (en) * | 2005-01-19 | 2006-07-20 | Hitachi Maxell, Ltd. | Lens device |
CN101872051A (zh) * | 2009-04-23 | 2010-10-27 | 鸿富锦精密工业(深圳)有限公司 | 镜筒及其应用的镜头模组 |
CN204359995U (zh) * | 2014-11-19 | 2015-05-27 | 大立光电股份有限公司 | 成像镜头模块以及可携式电子装置 |
TWM521747U (zh) * | 2015-10-16 | 2016-05-11 | 大立光電股份有限公司 | 遮光片、遮光元件、光學元件、成像鏡頭與鏡頭模組 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3575844A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110320632A (zh) * | 2019-08-08 | 2019-10-11 | 浙江舜宇光学有限公司 | 镜头 |
Also Published As
Publication number | Publication date |
---|---|
US20190361153A1 (en) | 2019-11-28 |
KR20190107679A (ko) | 2019-09-20 |
EP3575844A1 (en) | 2019-12-04 |
JP6876812B2 (ja) | 2021-05-26 |
US11579341B2 (en) | 2023-02-14 |
JP2020507804A (ja) | 2020-03-12 |
KR102509125B1 (ko) | 2023-03-10 |
JP2021119400A (ja) | 2021-08-12 |
EP3575844A4 (en) | 2021-01-13 |
KR20220003148A (ko) | 2022-01-07 |
US12007583B2 (en) | 2024-06-11 |
US20230161082A1 (en) | 2023-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018137706A1 (zh) | 镜头和摄像模组及其制造方法 | |
CN108363159B (zh) | 一镜头和摄像模组及其制造方法 | |
US11601576B2 (en) | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | |
US10979610B2 (en) | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | |
KR102320911B1 (ko) | 어레이 이미징 모듈 및 성형된 감광성 어셈블리, 회로 보드 어셈블리 및 전자 장치용 그 제조 방법 | |
TWM559422U (zh) | 陣列攝像模組及其模塑感光組件、線路板組件以及電子設備 | |
WO2022028248A1 (zh) | 摄像模组以及终端设备 | |
WO2022127735A1 (zh) | 摄像模组、制造方法以及移动终端 | |
KR101241503B1 (ko) | 카메라 모듈 | |
US12003838B2 (en) | Camera module and molded photosensitive assembly and electronic device | |
KR102645837B1 (ko) | 렌즈 어셈블리 및 이를 포함하는 카메라 모듈 | |
WO2020114143A1 (zh) | 感光组件、摄像模组、摄像模组的制造方法和电子设备 | |
WO2018121793A1 (zh) | 分体式阵列摄像模组及其制造方法 | |
TWI691752B (zh) | 擋光元件、擋光元件的製作方法及鏡頭模組 | |
JP2004179736A (ja) | カメラモジュールおよび該カメラモジュール搭載装置 | |
TW201907219A (zh) | 定焦攝像模組及其調焦裝置和調焦方法 | |
TWI685255B (zh) | 分體式陣列攝像模組及其製造方法 | |
KR20190036281A (ko) | 카메라 모듈 | |
JP2006013791A (ja) | 固体撮像装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18744975 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2019539912 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20197021981 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2018744975 Country of ref document: EP Effective date: 20190826 |