WO2018137322A1 - 一种坩埚 - Google Patents
一种坩埚 Download PDFInfo
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- WO2018137322A1 WO2018137322A1 PCT/CN2017/094658 CN2017094658W WO2018137322A1 WO 2018137322 A1 WO2018137322 A1 WO 2018137322A1 CN 2017094658 W CN2017094658 W CN 2017094658W WO 2018137322 A1 WO2018137322 A1 WO 2018137322A1
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- pot body
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- crucible
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Definitions
- the present disclosure relates to a crucible.
- the OLED display device has the advantages of self-illumination, simple structure, light weight, fast response, wide viewing angle, flexible display, etc., and has been widely used in terminal products such as mobile phones.
- the OLED display device is mainly prepared by vacuum evaporation, and the principle is that the evaporation material is heated to a certain temperature, and after being sublimated, it is deposited on the substrate through an opening on the mask to form a film layer of the OLED display device.
- the vapor deposition material is usually heated by ruthenium.
- the vapor deposition material is placed inside the crucible, and the crucible is heated by a heating device disposed outside the crucible to heat the vapor deposition material in the crucible.
- the evaporation material located at the outermost layer is first heated, and then the heat is transferred to the internal evaporation material.
- the heat conduction process is slow.
- At least one embodiment of the present disclosure provides a crucible including a crucible body, wherein: the crucible body includes a first pot body and at least one second pot body, the second pot body having a smaller volume than the first pot body
- the first pot body has a first opening and a bottom surface opposite to the first opening, one end of the second pot body is connected to a bottom surface of the first pot body, and an inner portion of the second pot body Communicating with the interior of the first pot body.
- the body of the crucible includes a plurality of the second pots.
- each of the second pot bodies includes a second opening
- the bottom surface of the first pot body includes a plurality of through holes
- the second opening of each of the second pot bodies and the plurality of through holes One of the holes is connected such that the inside of each of the second pots communicates with the inside of the first pot.
- the crucible further includes a heating device disposed outside of each of the second pots.
- the heating device includes an electric heating sleeve disposed outside each of the second pot bodies.
- the heating device includes a heating wire disposed outside each of the second pots.
- the crucible further includes a refrigeration device disposed external to each of the second pots.
- the refrigeration unit includes a refrigerant line disposed external to each of the second pots.
- the plurality of second pots are spaced apart on the bottom surface, and the heating device is configured to surround each of the second pots.
- the area of the cross section of the first pot body parallel to the bottom surface gradually increases along the direction from the bottom surface of the first pot body to the first opening.
- the first pot body has a truncated cone shape, and a diameter of one end of the first opening of the first pot body is larger than a diameter of an end of the bottom surface of the first pot body.
- the crucible body further has a cover that covers the first opening of the first pot body, and the cover plate is provided with a plurality of vapor deposition holes.
- the plurality of vapor deposition holes are distributed in an array on the cover plate.
- the crucible according to an embodiment of the present disclosure can prevent the problem that the vapor deposition material is unevenly heated when the crucible is large.
- FIG. 1 is a schematic structural view of a cymbal body of a cymbal according to an embodiment of the present disclosure
- FIG. 2 is a schematic diagram of a ⁇ decomposition structure provided by an embodiment of the present disclosure
- FIG. 3 is a schematic view of a cymbal assembly structure provided by an embodiment of the present disclosure.
- the embodiment provides a crucible including a crucible body 10.
- the crucible body 10 includes a first pot body 11 and a plurality of second pot bodies 12.
- the first pot body 11 shown in Fig. 1 has a truncated cone-like structure
- each of the second pot bodies 12 has a cylindrical structure.
- the first pot body 11 and the second pot body 12 may each adopt a truncated cone or a cylindrical structure, and each of the second pot bodies 12 has a smaller volume than the first pot body 11.
- the volume of the second pot body 12 is small, since the vapor deposition material inside is small, the heat conduction rate is fast, and the heating rate of the vapor deposition material in the second pot body 12 is increased.
- the volume of the second pot 12 should be set according to the amount of evaporation material desired to be heated and the rate of acceleration required.
- the first pot body 11 and the second pot body 12 are not limited to the shape of a truncated cone or a cylinder.
- the cross section of the first pot body 11 and the second pot body 12 may be triangular, quadrangular or polygonal.
- the size relationship between the first pot body and the second pot body in the embodiment of the present disclosure also reflects the first pot body and the second pot body.
- the size relationship of the volume of the pot For example, the volume of the first pot body is larger than the volume of the second pot body, and the volume of the first pot body is also larger than that of the second pot body.
- the first pot body 11 has an opening 111 and a bottom surface 112 opposite to the opening 111.
- One end of each second pot body 12 is connected to the bottom surface 112 of the first pot body 11, and the interior of each second pot body 12 is first
- the pot body 11 is internally connected.
- the first pot body 11 and each of the second pot bodies 12 may be joined by welding or casting.
- each of the second pot bodies 12 includes a second opening 121.
- the bottom surface 112 of the first pot body 11 includes a plurality of through holes 1121, and the second opening 121 of each second pot body 12 is One of the through holes 1121 is connected such that the inside of each of the second pot bodies 12 communicates with the inside of the first pot body 11.
- the cymbal provided by the present disclosure includes a cymbal body 10 including a first pot body 11 and a plurality of second pot bodies 12 having a smaller volume than the first pot body 11, one end of each second pot body 12 being disposed in the first pot
- the bottom surface 112 of the body 11 is internally connected to the first pot body 11; when the vapor deposition material is heated, the vapor deposition materials are respectively placed in the plurality of second pot bodies 12, and for each of the second pot bodies 12 Each part of the vapor deposition material is heated. Since the evaporation material is divided into multiple parts and heated separately, the heat is transferred in each part of the evaporation material at a faster rate than that in the entire evaporation material, which is beneficial to each part.
- the vapor deposition material is uniformly heated inside and outside, which improves the problem of uneven heating of the vapor deposition material, thereby improving the denaturation of the partially overheated vapor deposition material, and easily causing clogging of the opening and reducing the utilization rate of the vapor deposition material.
- the crucible provided in the embodiment further includes a heating device disposed outside the second pot body 12.
- the heating means comprises a second pot.
- the electric heating sleeve 20 outside the body 12.
- the electric heating sleeve 20 is provided with four accommodating holes 21, and each accommodating hole 21 is correspondingly disposed with a second pot body 12, and is respectively sleeved outside the corresponding second pot body 12; the temperature of the electric heating sleeve 20
- the control precision is high, and the heating area is large, which is advantageous for improving the control precision of the heating temperature of the second pot body 12 and improving the heat uniformity of the second pot body 12.
- the plurality of second pots are spaced apart on the bottom surface, and the electric heating sleeve is configured to surround each of the second pots.
- each of the second pot bodies 12 may be heated by a heating wire, and in other examples, the heating means is provided in each of the first The electric heating wire outside the second pot body 12.
- the heating wire is disposed outside the second pot body in a manner similar to that of the electric heating sleeve. Therefore, the arrangement of the heating wire can also be referred to the structure shown in FIGS. 2 and 3.
- the crucible provided in the embodiment further includes a refrigerating device disposed outside each of the second pot bodies 12, and the refrigerating device can accelerate the first
- the cooling rate of the evaporation material in the two-pot body 12 is to improve the efficiency of vapor deposition material replacement and equipment maintenance.
- the refrigerating apparatus may be implemented using a refrigerant line, and in some examples, the refrigerating apparatus includes a refrigerant line wound around each of the second pot bodies 12, and the refrigerant line may be realized, for example, by a copper tube filled with a refrigerant.
- the first pot body 11 In order to increase the evaporation angle of the crucible and to facilitate the uniform mixing of the vapor deposition gas formed by the evaporation of the vapor deposition material, along the direction from the bottom surface 112 of the first pot body 11 to the opening 111, the first pot body 11 is parallel to the bottom surface 112. The area of the section gradually increases. In some examples, as shown in FIG.
- the first pot body 11 has a truncated cone shape, and the diameter of one end of the opening 111 of the first pot body 11 is larger than the diameter of the end of the bottom surface 112 of the first pot body 11 , and the truncated cone shape
- the first pot body 11 of the structure is favorable for uniform mixing of the vapor deposition gas, improves the uniformity of evaporation of the vapor deposition gas, and can improve the vapor deposition angle of the crucible, and improve the shadow effect caused by the evaporation angle being too small.
- the crucible body 10 further has a cover plate 30 covering the opening 111 of the first pot body 11, and the cover plate 30 is provided with a plurality of In the vapor deposition holes 31, the vapor deposition gas escapes from the vapor deposition holes 31, and the uniformity thereof can be further improved, thereby improving the uniformity of the film layer formed on the substrate by the vapor deposition gas.
- a plurality of vapor deposition holes 31 are arranged in an array on the cover plate 30, so that the plurality of vapor deposition holes 31 are evenly distributed on the cover plate 30, thereby further improving the escape of the vapor deposition gas. Evenness.
- the crucible body 10 includes four second pot bodies 12. Since the heating efficiency of the vapor deposition material inside the second pot body 12 is increased when the volume of the second pot body 12 is small, the amount of the vapor deposition material per second pot body 12 is also reduced, and thus, in some examples, The second pot body 12 can be set to other numbers according to the quantity of the evaporating material and the heating rate requirement.
- the crucible body 10 can include 1, 2, 3, 5, and 6 second pot bodies 12 .
- the crucible body 10 includes one second pot body, since the volume of the second pot body is small, the problem of uneven heating of the vapor deposition material can be prevented. In addition, the material evaporated in the second pot body can be sufficiently diffused in the bulky first pot body, so that the vapor deposition area of the crucible can be increased.
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
一种坩埚,包括坩埚本体(10),坩埚本体(10)包括第一锅体(11)和第二锅体(12),第二锅体(12)的体积小于第一锅体(11);第一锅体(11)具有开口(111)和与开口(111)相对的底面(112),第二锅体(12)的一端与第一锅体(11)的底面连接,且第二锅体(12)的内部与第一锅体(11)内部连通。该坩埚可以防止坩埚体积较大时蒸镀材料受热不均匀的问题。
Description
本公开涉及一种坩埚。
OLED显示器件具有自发光、结构简单、轻薄、响应速度快、视角较宽、可实现柔性显示等优点,目前已在手机等终端产品中得到广泛的应用。OLED显示器件现在主要采用真空蒸镀法制备,其原理为加热蒸镀材料至一定温度,使其升华后透过掩膜板上的开孔沉积在基板上,从而形成OLED显示器件的膜层。
目前通常采用坩埚对蒸镀材料进行加热,在蒸镀过程中,蒸镀材料置于坩埚内部,通过设置在坩埚外部的加热装置对坩埚进行加热,从而使坩埚内的蒸镀材料受热。在蒸镀材料的加热过程中,位于最外层的蒸镀材料首先受热,然后再将热量传导至内部的蒸镀材料,在坩埚较大或蒸镀材料较多时,热量的传导过程较慢,易导致蒸镀材料受热不均,会使部分过热的蒸镀材料产生变性的风险,同时还易造成坩埚开孔堵塞和降低蒸镀材料使用率的问题。
发明内容
本公开的至少一个实施例提供一种坩埚,包括坩埚本体,其中:所述坩埚本体包括第一锅体和至少一个第二锅体,所述第二锅体的体积小于所述第一锅体;所述第一锅体具有第一开口和与所述第一开口相对的底面,所述第二锅体的一端与所述第一锅体的底面连接,且所述第二锅体的内部与所述第一锅体内部连通。
在一些示例中,所述坩埚本体包括多个所述第二锅体。
在一些示例中,每个所述第二锅体包括第二开口,所述第一锅体的底面包括多个贯穿孔,每个所述第二锅体的第二开口与所述多个贯穿孔之一相连,以使每个所述第二锅体的内部与所述第一锅体的内部连通。
在一些示例中,坩埚还包括设置于每个第二锅体的外部的加热装置。
在一些示例中,所述加热装置包括设置于每个第二锅体外侧的电热套。
在一些示例中,所述加热装置包括设置于每个第二锅体外侧的电热丝。
在一些示例中,坩埚还包括设置于每个第二锅体外部的制冷装置。
在一些示例中,所述制冷装置包括设置于每个第二锅体外部的冷媒管路。
在一些示例中,所述多个第二锅体在所述底面上间隔分布,所述加热装置被配置为围绕每个第二锅体。
在一些示例中,沿所述第一锅体的底面到第一开口的方向,所述第一锅体的与所述底面平行的截面的面积逐渐增大。
在一些示例中,所述第一锅体为圆台状结构,且所述第一锅体的第一开口所在一端的直径大于所述第一锅体的底面所在一端的直径。
在一些示例中,所述坩埚本体还具有盖合所述第一锅体的第一开口的盖板,所述盖板上设有多个蒸镀孔。
在一些示例中,所述多个蒸镀孔在所述盖板上阵列分布。
根据本公开实施例的坩埚可以防止坩埚体积较大时蒸镀材料受热不均匀的问题。
为了更清楚地说明本发明实施例的技术方案,下面将对实施例的附图作简单地介绍,显而易见地,下面描述中的附图仅仅涉及本发明的一些实施例,而非对本发明的限制。
图1是本公开实施例提供的一种坩埚的坩埚本体的结构示意图;
图2是本公开实施例提供的一种坩埚分解结构示意图;
图3是本公开实施例提供的一种坩埚装配结构示意图。
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例的附图,对本发明实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。
参见图1所示,本实施例提供了一种坩埚,包括坩埚本体10。坩埚本体10包括第一锅体11和多个第二锅体12。例如,图1所示的第一锅体11为圆台状结构,每个第二锅体12为圆柱状结构。在一些示例中,第一锅体11和第二锅体12均可采用圆台或圆柱状结构,每个第二锅体12的体积小于第一锅体11。在第二锅体12的体积较小时,由于其内部的蒸镀材料较少,导热速度较快,会提高第二锅体12内的蒸镀材料的加热速率。在一些示例中,第二锅体12的体积应根据所需加热的蒸镀材料的数量和加速速率要求进行设置。第一锅体11和第二锅体12不限于圆台或圆柱的形状,例如,第一锅体11和第二锅体12的横截面可为三角形、四边形或多边形。
由于第一锅体和第二锅体的坩埚壁的厚度相差不是很大,本公开实施例中对于第一锅体和第二锅体的体积的大小关系也反应了第一锅体和第二锅体的容积的大小关系。例如,第一锅体的体积大于第二锅体的体积,第一锅体的容积也大于第二锅体。
第一锅体11具有开口111和与开口111相对的底面112,每个第二锅体12的一端与第一锅体11的底面112连接,且每个第二锅体12的内部与第一锅体11内部连通。在一些示例中,第一锅体11和每个第二锅体12之间可采用焊接或铸造等方式进行连接。
例如,如图1所示,每个第二锅体12包括第二开口121,第一锅体11的底面112包括多个贯穿孔1121,每个第二锅体12的第二开口121与多个贯穿孔1121之一相连,以使每个第二锅体12的内部与第一锅体11的内部连通。
本公开提供的坩埚包括坩埚本体10,坩埚本体10包括第一锅体11和多个体积小于第一锅体11的第二锅体12,每个第二锅体12的一端设置于第一锅体11的底面112且内部均与第一锅体11连通;在进行蒸镀材料的加热时,将蒸镀材料分别放置于多个第二锅体12内,同时对每个第二锅体12内的各部分蒸镀材料进行加热,由于蒸镀材料被分成了多份且分别进行加热,热量在每部分蒸镀材料内传导的速度大于在整份蒸镀材料内传导的速度,利于每部分蒸镀材料内外均匀受热,改善了蒸镀材料受热不均的问题,进而改善了部分过热的蒸镀材料产生变性、以及易造成坩埚开孔堵塞和降低蒸镀材料使用率的问题。
为对第二锅体12内的蒸镀材料进行加热,一种具体实施方式中,本实施例提供的坩埚还包括设置于每个第二锅体12的外部的加热装置。
为利于对第二锅体12的受热温度进行控制,且提高第二锅体12的受热均匀性,在一些示例中,参见图2和图3所示,加热装置包括设置于每个第二锅体12外侧的电热套20。例如,电热套20上设有4个容置孔21,每个容置孔21与一个第二锅体12对应设置,并分别套接在对应的第二锅体12外侧;电热套20的温度控制精度较高,且加热面积较大,有利于提高对第二锅体12的加热温度的控制精度,且可提高第二锅体12的受热均匀度。
例如,如图2和图3所示,所述多个第二锅体在所述底面上间隔分布,所述电热套被配置为围绕每个第二锅体。
除上述采用电热套20对第二锅体12进行加热的方式之外,也可采用电热丝对每个第二锅体12进行加热,则在另一些示例中,加热装置包括设置于每个第二锅体12外侧的电热丝。例如,电热丝在第二锅体外侧设置的方式与电热套相似,因此,其设置方式也可以参照图2和图3的所示的结构。
在对坩埚本体10内的蒸镀材料进行加热后,为提高蒸镀材料的降温速度,本实施例提供的坩埚还包括设置于每个第二锅体12外部的制冷装置,制冷装置可加速第二锅体12内的蒸镀材料的冷却速率,以便于提高蒸镀材料更换和设备维护的效率。
例如,制冷装置可采用冷媒管路实现,则在一些示例中,制冷装置包括缠绕于每个第二锅体12外部的冷媒管路,冷媒管路例如可采用注有制冷剂的铜管实现。
为增加坩埚的蒸发角度,且便于使蒸镀材料受热形成的蒸镀气体混合均匀,沿第一锅体11的底面112到开口111的方向,第一锅体11的与底面112平行的方向的截面的面积逐渐增大。在一些示例中,参见图1所示,第一锅体11为圆台状结构,且第一锅体11的开口111所在一端的直径大于第一锅体11的底面112所在一端的直径,圆台状结构的第一锅体11有利于蒸镀气体混合均匀,提高蒸镀气体由坩埚逸出的均匀度,并可提高坩埚的蒸镀角度,改善坩埚因蒸镀角度过小而造成的阴影效应。
为进一步提高蒸镀气体由坩埚逸出的均匀度,参见图2和图3所示,坩埚本体10还具有盖合第一锅体11的开口111的盖板30,盖板30上设有多
个蒸镀孔31,蒸镀气体由蒸镀孔31中逸出坩埚,可进一步提高其均匀度,从而提高了蒸镀气体在基板上形成的膜层的均匀度。例如,参见图2和图3所示,多个蒸镀孔31在盖板30上阵列分布,可使多个蒸镀孔31在盖板30上分布均匀,进一步提高蒸镀气体逸出时的均匀度。
本实施例提供的坩埚中,坩埚本体10包括四个第二锅体12。由于在第二锅体12的体积较小时,会提高其内部的蒸镀材料的加热效率,但也会减少每个第二锅体12对蒸镀材料的容置量,因此,在一些示例中,可根据蒸镀材料的数量和加热速率需求,将第二锅体12设置为其他数量,例如,坩埚本体10可包括1个、2个、3个、5个、6个第二锅体12。
在坩埚本体10包括1个第二锅体时,由于第二锅体的体积较小,从而也能防止蒸镀材料加热不均的问题。另外,在第二锅体中蒸发的材料可以在体积较大的第一锅体中充分扩散,从而能够增大坩埚的蒸镀面积。
以上所述仅是本发明的示范性实施方式,而非用于限制本发明的保护范围,本发明的保护范围由所附的权利要求确定。
本申请要求于2017年1月24日递交的中国专利申请第201720105076.X号的优先权,在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
Claims (13)
- 一种坩埚,包括坩埚本体,其中:所述坩埚本体包括第一锅体和至少一个第二锅体,所述第二锅体的体积小于所述第一锅体;所述第一锅体具有第一开口和与所述第一开口相对的底面,所述第二锅体的一端与所述第一锅体的底面连接,且所述第二锅体的内部与所述第一锅体内部连通。
- 根据权利要求1所述的坩埚,其中,所述坩埚本体包括多个所述第二锅体。
- 根据权利要求2所述的坩埚,其中,每个所述第二锅体包括第二开口,所述第一锅体的底面包括多个贯穿孔,每个所述第二锅体的第二开口与所述多个贯穿孔之一相连,以使每个所述第二锅体的内部与所述第一锅体的内部连通。
- 根据权利要求2或3所述的坩埚,还包括设置于每个第二锅体的外部的加热装置。
- 根据权利要求4所述的坩埚,其中,所述加热装置包括设置于每个第二锅体外侧的电热套。
- 根据权利要求4所述的坩埚,其中,所述加热装置包括设置于每个第二锅体外侧的电热丝。
- 根据权利要求2-6任一项所述的坩埚,还包括设置于每个第二锅体外部的制冷装置。
- 根据权利要求7所述的坩埚,其中,所述制冷装置包括设置于每个第二锅体外部的冷媒管路。
- 根据权利要求4所述的坩埚,其中,所述多个第二锅体在所述底面上间隔分布,所述加热装置被配置为围绕每个第二锅体。
- 根据权利要求1-9任一项所述的坩埚,其中,沿所述第一锅体的底面到第一开口的方向,所述第一锅体的与所述底面平行的截面的面积逐渐增大。
- 根据权利要求10所述的坩埚,其中,所述第一锅体为圆台状结构,且所述第一锅体的第一开口所在一端的直径大于所述第一锅体的底面所在一 端的直径。
- 根据权利要求1-11所述的坩埚,其中,所述坩埚本体还具有盖合所述第一锅体的第一开口的盖板,所述盖板上设有多个蒸镀孔。
- 根据权利要求12所述的坩埚,其中,所述多个蒸镀孔在所述盖板上阵列分布。
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CN107829070A (zh) * | 2017-12-14 | 2018-03-23 | 深圳先进技术研究院 | 导热结构及加热蒸发组件 |
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JP2006225717A (ja) * | 2005-02-17 | 2006-08-31 | Stanley Electric Co Ltd | 蒸着用るつぼ |
CN101445907A (zh) * | 2007-11-27 | 2009-06-03 | 鸿富锦精密工业(深圳)有限公司 | 蒸镀装置 |
CN102373421A (zh) * | 2010-08-19 | 2012-03-14 | 三菱伸铜株式会社 | 真空蒸镀装置 |
CN203768445U (zh) * | 2013-01-15 | 2014-08-13 | 日立造船株式会社 | 真空蒸镀装置 |
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JP2006225757A (ja) * | 2005-01-21 | 2006-08-31 | Mitsubishi Heavy Ind Ltd | 真空蒸着装置 |
US8882921B2 (en) * | 2009-06-08 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
CN103328681B (zh) * | 2011-01-20 | 2015-09-23 | 夏普株式会社 | 坩埚和蒸镀装置 |
TW201243083A (en) * | 2011-03-16 | 2012-11-01 | Panasonic Corp | Vacuum evaporator |
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JP2006225717A (ja) * | 2005-02-17 | 2006-08-31 | Stanley Electric Co Ltd | 蒸着用るつぼ |
CN101445907A (zh) * | 2007-11-27 | 2009-06-03 | 鸿富锦精密工业(深圳)有限公司 | 蒸镀装置 |
CN102373421A (zh) * | 2010-08-19 | 2012-03-14 | 三菱伸铜株式会社 | 真空蒸镀装置 |
CN203768445U (zh) * | 2013-01-15 | 2014-08-13 | 日立造船株式会社 | 真空蒸镀装置 |
CN106399947A (zh) * | 2016-12-09 | 2017-02-15 | 京东方科技集团股份有限公司 | 蒸发源 |
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