WO2018133732A1 - 壳体制作方法及移动终端 - Google Patents

壳体制作方法及移动终端 Download PDF

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Publication number
WO2018133732A1
WO2018133732A1 PCT/CN2018/072428 CN2018072428W WO2018133732A1 WO 2018133732 A1 WO2018133732 A1 WO 2018133732A1 CN 2018072428 W CN2018072428 W CN 2018072428W WO 2018133732 A1 WO2018133732 A1 WO 2018133732A1
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WO
WIPO (PCT)
Prior art keywords
housing
casing
manufacturing
wall surface
antenna
Prior art date
Application number
PCT/CN2018/072428
Other languages
English (en)
French (fr)
Inventor
李静
杨光明
龚清国
Original Assignee
广东欧珀移动通信有限公司
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Filing date
Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2018133732A1 publication Critical patent/WO2018133732A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present invention relates to the technical field of processing technology of a mobile terminal housing, and in particular to a method for manufacturing a housing and a mobile terminal.
  • the glue filled in the micro slit of the antenna has low adhesion to the metal parts on both sides of the micro slit of the antenna, the shell yield is low, and the production cost is high.
  • the present invention provides a method for manufacturing a casing and a mobile terminal, which solves the problems of low yield of the casing and high production cost in the prior art.
  • the present application provides a method for manufacturing a housing, including:
  • a filling filler is applied to the antenna microslit, the glue closely bonding the inner wall surface.
  • the present application also provides a mobile terminal comprising the housing made by the housing manufacturing method according to any of the above, a display assembly disposed on the housing, and a circuit structure disposed in the housing.
  • the beneficial effects of the present application are as follows: after roughening the inner wall surface, a plurality of nano-scale pits are formed on the inner wall surface of the antenna micro-slit, which increases the roughness of the inner wall surface, effectively improves the bonding force between the glue and the inner wall surface, and the glue passes through
  • the inner wall surface is bonded to the metal parts on both sides of the micro slit of the antenna, thereby improving the adhesion of the lifting glue to the metal parts on both sides of the micro slit of the antenna, the strength of the shell is high, the yield of the shell is improved, and the production cost is reduced.
  • FIG. 1 is a schematic flow chart of a method for manufacturing a housing according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a housing corresponding to step S101 of the method for manufacturing a housing according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of a rough strip corresponding to step S102 of the method for manufacturing a housing according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a housing corresponding to step S103 of the method for manufacturing a housing according to an embodiment of the present disclosure.
  • Embodiments of the present application provide a method of manufacturing a housing for manufacturing a housing.
  • the housing can be used for a mobile terminal as a housing for a mobile terminal.
  • the mobile terminal also includes a display assembly disposed on the housing and a circuit structure disposed within the housing.
  • the mobile terminal can be a mobile phone, a tablet, a laptop, or the like.
  • the housing is mounted on the back of the mobile terminal to protect the main board, the battery and the like inside the mobile terminal, and on the other hand, the structure of the mobile terminal is attractive to attract the eyes of the consumer.
  • the housing of this embodiment is a metal housing, and the metal housing has a metallic texture and is extremely attractive.
  • the metal shell is made of an aluminum alloy material, and the aluminum alloy material is light in weight, difficult to oxidize, and easy to process.
  • the metal casing easily shields the antenna signal inside the mobile terminal, and the casing needs to be milled to form an antenna micro slit on the casing to allow communication signals to pass.
  • FIG. 1 is a schematic flow chart of a manufacturing method of a housing 10 according to an embodiment of the present application. As shown in the figure, the steps of the manufacturing method of the housing 10 are as follows:
  • the milling housing 10 forms an antenna micro slit.
  • the housing 10 is directly placed on a four-axis CNC numerical control machine (CNC) machine with a rotary function, and the housing 10 is milled on the housing 10 by using a CNC milling cutter 30 to form an antenna. Micro slits.
  • CNC numerical control machine
  • the method is simple and easy to operate.
  • the specific housing 10 structure is as shown in FIG. 2, and the housing 10 includes a plurality of antenna micro slits.
  • the number of antenna micro slits is three. In other embodiments, the number of antennas may be other numbers.
  • the antenna micro slit includes a first micro slit 101, a second micro slit 102, and a third micro slit 103.
  • the first micro slit 101, the second micro slit 102, and the third micro slit 103 are parallel and sequentially arranged, and the first micro The slit 101, the second micro slit 102, and the third micro slit 103 have a narrow width, and the width of the metal portion between the adjacent two antenna micro slits is also narrow.
  • the width of the antenna micro slit is 0.3 mm.
  • 0.5 mm the width of the metal portion is generally from 0.5 mm to 1 mm.
  • the metal portion is elongated.
  • the metal portion between the first micro slit 101 and the second micro slit 102 is a first metal strip 121, a second micro slit 102 and a third micro slit.
  • the metal portion between 103 is the second metal strip 122. Since the width of the first metal strip 121 and the second metal strip 122 is less than 1 mm, the length covers the entire housing 10, resulting in low strength.
  • the first metal strip 121 And the second metal strip 122 is susceptible to bending, deformation, and even breaking. Therefore, the step of forming the antenna micro slit by the milling housing 10 may further include:
  • Step 1 Roughening the first surface 11 of the casing.
  • the housing 10 includes a first surface 11 and a second surface 12 disposed opposite to each other, wherein the first surface 11 is a surface (ie, an inner surface), a second surface, which is subsequently processed into a cavity of the mobile terminal after the finished product is finished.
  • 12 is a surface (ie, an outer surface) that is processed away from the inner cavity of the mobile terminal after being processed into a finished product.
  • the purpose of the T process is to form nano-scale pits on the first surface 11 of the housing 10 to roughen the first surface 11 to increase the roughness of the first surface 11 for subsequent injection molding on the first surface 11.
  • the first surface 11 is roughened by T treatment.
  • T treatment is a processing technique that uses T liquid to corrode metal surface to form nano-scale pits, and can be applied to metal surface pretreatment work, and belongs to nano molding technology.
  • the process of T processing includes:
  • the casing 10 is immersed in an alkali solution to clean the first surface 11 and remove the grease of the first surface 11.
  • the alkali solution is a weak base having a pH of 9 to 10, soaked.
  • the first surface 11 cleanliness requirement can be achieved in one minute.
  • the casing 10 is immersed in an acid solution to neutralize the pH of the first surface 11.
  • the casing 10 is immersed in the T liquid to form nano-scale pits on the first surface 11.
  • the T liquid contains a plurality of chemical agents, and the fatty acid is the main component of the T liquid.
  • the pit formed by the first surface 11 has a diameter of 20 to 30 nm, and the pit shape is a coral reef structure.
  • the fatty acid remains in the nano-scale pits in preparation for subsequent formation of the plastic layer 20 on the first surface 11.
  • the casing 10 is placed in water for rinsing to remove the chemical solution remaining on the casing 10.
  • the T treatment may be repeated a plurality of times to form nano-scale pits.
  • the housing 10 in which the first surface 11 is covered with a plurality of nano-scale pits has been obtained.
  • Step 2 The housing 10 is placed in a mold for injection molding.
  • the water-washed and dried casing 10 is clamped in a mold using a jig for injection molding.
  • the injection molded plastic material is a resin.
  • the plastic enters the nano-scale pits on the first surface 11 to form a plastic layer 20 closely bonded to the casing 10 on the first surface 11.
  • the ester and the amine are formed by the fatty acid and the plastic.
  • the chemical exothermic reaction delays the curing of the plastic and promotes the exchange of the position of the fatty acid and the plastic, thereby ensuring the successful entry of the plastic into the nano-scale pit.
  • Step 3 Milling the housing 10 to form an antenna micro slit.
  • the casing 10 in the process of forming the micro slit of the antenna, only the casing 10 is milled without cutting the plastic layer 20, and the casing 10 is supported by the plastic layer 20 to maintain the first metal between the adjacent antenna micro slits.
  • the strip 121 and the second metal strip 122 do not bend or deform during the milling process.
  • the housing 10 is placed on a four-axis CNC machine tool table having a rotary function, wherein the first surface 11 is placed on the machine table, and the side surface of the housing 10 facing away from the plastic layer 20 is The second surface 12 is inserted into the milling cutter 30 to start milling the housing 10, and the milling cutter 30 finally passes out from the first surface 11 and is milled out of the milling groove 302 in the plastic layer 20 to ensure that the antenna micro slit completely cuts off the housing 10.
  • the over-milling groove 302 has a depth of 0.1 mm to 0.3 mm.
  • the design of the over-milling slot 302 ensures that the housing 10 is completely milled to form an antenna gap without cutting the plastic layer 20 on the first surface 11, and the plastic layer 20 still supports the structure of the housing 10, maintaining the adjacent
  • the strength of the metal portion between the micro slits of the antenna makes it not to bend, deform or even break during the milling process, thereby improving the yield of the casing 10 and reducing the production cost.
  • the housing 10 is milled out of the micro slit of the antenna, in order to maintain the integrity of the housing 10 and the protection function of the housing 10 on the main board, the battery and the like inside the mobile terminal, it is necessary to fill the antenna micro slit with the glue 40 to fill the antenna micro. Seam.
  • the casing 10 needs to be roughened to be on the inner wall surface of the formed antenna micro slit. 1010 forms a nano-scale pit, roughens the inner wall surface 1010, and improves the adhesion of the inner wall surface 1010 to the glue 40.
  • the principle of the roughening treatment is to form nano-scale pits on the inner wall surface 1010.
  • the nano-scale pits are honeycomb-shaped, which is advantageous for enhancing the bonding force of the glue to the inner wall surface 1010.
  • the nano-scale pits formed by the roughening treatment are distributed over the entire area of the inner wall surface 1010, that is, the positions where the inner wall surface 1010 is in contact with the glue are all roughened, and all the inner wall surfaces 1010 are rough.
  • the maximum adhesion of the glue to the inner wall surface 1010 is improved, thereby improving the adhesion of the glue to the metal portions on both sides of the antenna micro slit.
  • the nano-scale pits formed by the roughening treatment are distributed in a partial region of the inner wall surface 1010, that is, a portion of the inner wall surface 1010 has a rough surface shape, and a plurality of nano-scale pits are rough.
  • the rough belt 1012 has a large bonding force with the glue, thereby increasing the bonding force of the glue to the inner wall surface 1010.
  • the number of the rough bands 1012 may be plural, and the array is distributed on the inner wall surface 1010. The more the number of the rough bands 1012 and the denser the distribution, the stronger the bonding force of the inner wall surface 1010 with the glue.
  • the antenna microslit includes two opposing inner wall surfaces 1010, each inner wall surface 1010 including at least one rough strip 1012.
  • each inner wall surface 1010 including at least one rough strip 1012.
  • the T treatment is used to treat the roughened inner wall surface 1010 as an example.
  • the T treatment is a processing technique for etching a metal surface using T liquid to form nano-scale pits, and can be applied to metal surface pre-treatment work, and belongs to nano-forming technology.
  • the process of T processing includes:
  • the casing 10 is immersed in an alkali solution to clean the inner wall surface 1010 and remove the grease of the inner wall surface 1010.
  • the alkali solution is a weak base having a pH of 9 to 10
  • the soaking time is The cleanliness of the inner wall surface 1010 can be achieved in 1 minute.
  • the casing 10 is immersed in an acid solution to neutralize the pH of the inner wall surface 1010.
  • the casing 10 is immersed in the T liquid to form nano-scale pits on the inner wall surface 1010.
  • the T liquid contains a plurality of chemical agents, and the fatty acid is the main component of the T liquid.
  • the pit formed by the inner wall surface 1010 has a diameter of 20 to 30 nm, and the pit shape is a coral reef structure.
  • the fatty acid remains in the nano-scale pits in preparation for subsequent formation of the plastic layer 20 on the inner wall surface 1010.
  • the casing 10 is placed in water for rinsing to remove the chemical solution remaining on the casing 10.
  • the T treatment may be repeated a plurality of times to form nano-scale pits.
  • the housing 10 having the inner wall surface 1010 covered with a plurality of nano-scale pits has been obtained.
  • filling glue 40 is in the micro slit of the antenna.
  • the glue 40 is filled into the antenna micro slit by a four-axis dispenser, and the glue 40 fills the antenna micro slit in a self-leveling manner.
  • the filled glue 40 material is a resin.
  • the nano-scale pits of the glue 40 entering the inner wall surface 1010 are tightly combined with the inner wall surface 1010. Further, the fatty acid and the glue 40 undergo a chemical exothermic reaction of the ester with the amine, delaying the curing of the glue 40, promoting the fatty acid and the The exchange of the glue 40 position ensures that the glue 40 successfully enters the nano-scale pit.
  • the glue 40 is closely bonded to the inner wall surface 1010 of the antenna micro slit, that is, the glue 40 tightly bonds the metal portions on both sides of the antenna micro slit, for example, the second micro slit 102 closely bonds the first metal strip 121 and the second metal strip 122.
  • the strength of the casing 10 is high, which improves the yield of the casing 10 and reduces the production cost.
  • the casing 10 is baked to cure the glue 40.
  • the baking temperature is 120 ° C and the baking time is 30 minutes.
  • the inner wall surface 1010 of the antenna micro slit forms a plurality of nano-scale pits, which increases the roughness of the inner wall surface 1010, effectively improves the bonding force of the glue 40 and the inner wall surface 1010, and the glue 40 passes through the inner wall.
  • the surface 1010 bonds the metal portions on both sides of the micro slit of the antenna, thereby improving the adhesion of the lifting glue 40 to the metal portions on both sides of the antenna micro slit.
  • the strength of the housing 10 is high, the yield of the housing 10 is improved, and the production cost is reduced.
  • the housing 10 is initially formed of an aluminum alloy profile. Specifically, before the milling housing 10 forms an antenna microslit, the method for manufacturing the housing 10 provided by the embodiment of the present application further includes:
  • the aluminum alloy profile is cut into a single casing 10 size shell material.
  • This process is implemented using a numerically controlled machine tool, and the size of the specific housing 10 is determined according to the size of the mobile terminal.
  • the shell material is subjected to multiple die stamping to form a uniform thickness and equal shell sheet.
  • the process is performed using a stamping machine to form a uniform thickness of the shell sheet for subsequent processing.
  • the casing material is processed by a numerically controlled machine tool, and the thickness of the casing sheet is changed to form a casing 10 having various thicknesses.
  • the first surface 11 of the housing 10 is placed on the fixture, and the second surface 12 is subjected to metal processing, including steps of turning, milling, grinding, cutting, etc., to change various parts of the housing sheet.
  • the thickness forms a prototype of the structure of the casing 10.
  • the prototype of the structure of the casing 10 is formed, and the processing process is simple and easy to operate, which facilitates subsequent processing of the antenna micro-seam.
  • the filling glue 40 is required to be finished after the micro-seam of the antenna to be finished to form a finished product.
  • the filling of the glue 40 after the micro-seam of the antenna, the manufacturing method of the housing 10 provided by the embodiment of the present application also includes:
  • the housing 10 is machined using a numerically controlled machine tool to form the inner cavity, periphery and detail features of the housing 10.
  • the inner cavity, peripheral and detail features of the housing 10 are determined by the function of the mobile terminal, and the detailed features include a camera receiving hole, a headphone jack, a power line hole, and the like.
  • the micro slit of the antenna is filled with the glue 40 which is closely bonded to the metal portion of the casing 10, the glue 40 solidified during the processing ensures the tolerance of the width of the micro slit of the antenna.
  • the casing 10 is sanded, sandblasted, and anodized to change the color and gloss of the casing 10 to form a finished casing.
  • the plastic layer 20 on the first surface 11 is removed during the polishing process, and the appearance of the casing 10 is blasted and anodized to achieve the decorative effect.
  • the inner wall surface 1010 of the antenna micro slit forms a plurality of nano-scale pits, which increases the roughness of the inner wall surface 1010, effectively improves the bonding force of the glue 40 and the inner wall surface 1010, and the glue 40 passes through the inner wall.
  • the surface 1010 bonds the metal portions on both sides of the micro slit of the antenna, thereby improving the adhesion of the lifting glue 40 to the metal portions on both sides of the antenna micro slit.
  • the strength of the housing 10 is high, the yield of the housing 10 is improved, and the production cost is reduced.
  • Embodiments of the present application also provide a mobile terminal including the above-described housing 10, a display assembly disposed on the housing 10, and a circuit structure disposed within the housing 10.
  • a mobile terminal refers to a computer device that can be used on the move, including but not limited to a mobile phone, a notebook, a tablet, a POS, an onboard computer, a camera, and the like.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请公布了一种壳体制作方法，包括：铣断所述壳体形成天线微缝；对所述天线微缝的内壁表面进行粗糙化处理；填充胶水于所述天线微缝，所述胶水紧密粘结所述内壁表面。本申请还公布了一种移动终端。内壁表面进行粗糙化处理后，天线微缝的内壁表面形成多个纳米级的凹坑，增加了内壁表面的粗糙度，有效提升胶水与内壁表面的结合力，胶水通过内壁表面粘结天线微缝两侧的金属部分，从而提高了提升胶水对天线微缝两侧的金属部分的粘结力，壳体强度高，提高壳体成品率，降低生产成本。

Description

壳体制作方法及移动终端 技术领域
本申请涉及移动终端壳体加工工艺技术领域，尤其是涉及一种壳体制作方法及移动终端。
背景技术
随着手机的广泛应用，人们对手机外壳的外观要求越来越高，金属手机外壳外观新颖，越来越受到消费者的青睐。为防止金属外壳屏蔽天线信号，常在金属外壳上加工多个天线微缝以天线射频要求，并在天线微缝中填充胶水连接天线微缝两侧的金属部分以形成完整的手机外壳。
现有技术中，填充于天线微缝的胶水与天线微缝两侧的金属部分粘结力低，壳体成品率低，生产成本高。
发明内容
本申请提供一种壳体制作方法及移动终端，解决现有技术中壳体成品率低，生产成本高的问题。
为解决上述技术问题，本申请提供一种壳体制作方法，包括：
铣断所述壳体形成天线微缝；
对所述天线微缝的内壁表面进行粗糙化处理；
填图填充胶水于所述天线微缝，所述胶水紧密粘结所述内壁表面。
本申请还提供一种移动终端，包括通过以上任意一项所述的壳体制作方法所制成的壳体、设置在所述壳体上的显示器组件以及设置在所述壳体内的电路结构。
本申请的有益效果如下：内壁表面进行粗糙化处理后，天线微缝的内壁表面形成多个纳米级的凹坑，增加了内壁表面的粗糙度，有效提升胶水与内壁表面的结合力，胶水通过内壁表面粘结天线微缝两侧的金属部分，从而提高了提升胶水对天线微缝两侧的金属部分的粘结力，壳体强度高，提高壳体成品率，降低生产成本。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的明显变形方式。
图1为本申请实施例提供的壳体制作方法的流程示意图。
图2为本申请实施例提供的壳体的结构示意图。
图3为本申请实施例提供的壳体制作方法的步骤S101所对应的壳体结构示意图。
图4为本申请实施例提供的壳体制作方法的步骤S102所对应的粗糙带示意图。
图5为本申请实施例提供的壳体制作方法的步骤S103所对应的壳体结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种壳体制作方法，用于制作壳体。壳体可用于移动终端，作为移动终端的外壳。移动终端还包括设置在壳体上的显示器组件以及设置在壳体内的电路结构。移动终端可以是手机、平板电脑、笔记本电脑等。
壳体安装于移动终端的背面，一方面保护移动终端内部的主板、电池等部件，另一方面美观移动终端的结构，吸引消费者眼球。
本实施例的壳体为金属壳体，金属壳体具有金属质感，极具吸引力。一种较佳的实施方式中，金属壳体为铝合金材料，铝合金材料质量轻、不易氧化、易加工。
金属材质的壳体易屏蔽移动终端内部的天线信号，需要铣断壳体，在壳体上形成天线微缝，以允许通信信号通过。
图1为本申请实施例提供的壳体10制作方法的流程示意图，如图所示，壳体10制作方法的步骤如下：
S101、铣断壳体10形成天线微缝。
一种实施方式中，直接将壳体10放在有旋转功能的四轴数控机床(Computer numerical control，CNC)机台上，利用CNC的铣刀30在壳体10上铣断壳体10形成天线微缝。该方法过程简单易操作。
基于移动终端对通信能力的要求及壳体10的美观考虑，常常需要在壳体10上设计多个天线微缝，具体壳体10结构如图2所示，壳体10包括多个天线微缝，本实施方式中天线微缝的数量为三个，其他实施方式中天线数量也可以其他个数。其中，天线微缝包括第一微缝101、第二微缝102及第三微缝103，第一微缝101、第二微缝102、第三微缝103相互平行且依次排列，第一微缝101、第二微缝102、第三微缝103的宽度较窄，且相邻两个天线微缝之间的金属部分宽度亦较窄，具体的，天线微缝的宽度尺寸为0.3mm～0.5mm，金属部分的宽度尺寸一般为0.5mm～1mm。一种实施方式中，该金属部分为长条状，具体的，第一微缝101和第二微缝102之间的金属部分为第一金属条121，第二微缝102和第三微缝103之间的金属部分为第二金属条122。由于第一金属条121和第二金属条122的宽度不足1mm，长度却覆盖整个壳体10，导致其强度较低，在铣加工壳体10形成天线微缝的过程中，第一金属条121和第二金属条122易受力弯曲、变形，甚至断裂。因此，进一步的，铣断壳体10形成天线微缝的步骤还可以包括：
步骤1、对壳体的第一表面11进行粗糙化处理。
具体的，壳体10包括相对设置的第一表面11和第二表面12，其中第一表面11为后续加工成壳体成品后面对移动终端内腔的表面(即内表面)，第二表面12为后续加工成壳体成品后背离移动终端内腔的表面(即外表面)。T处理的目的是在壳体10的第一表面11形成纳米级的凹坑，起到粗化第一表面11的作用，以增加第一表面11的粗糙度，利于后续在第一表面11注塑以形成粘结牢固的塑胶层20。
本实施例中，采用T处理粗糙化第一表面11。T处理是使用T液腐蚀金属表面以形成纳米级凹坑的加工技术，可以应用于金属表面前处理工作，属于纳米成型技术。
具体的，T处理的过程包括：
1、将壳体10放入碱液中浸泡，以清洗第一表面11及去除第一表面11的油脂，一种较佳的实施方式中，碱液为PH值9至10的弱碱，浸泡时间为1分钟即可达到第一表面11清洁度的要求。
2、将壳体10放入酸液中浸泡，以中和第一表面11的酸碱度。
3、将壳体10放入T液中浸泡，以在第一表面11形成纳米级的凹坑。具体的，T液包含多种化学药剂，脂氨酸为T液的主要成分。T液浸泡之后，第一表面11形成的凹坑的直径为20～30nm，凹坑形状为珊瑚礁结构。T处理之后，脂氨酸残留在纳米级凹坑内，为后续在第一表面11形成塑胶层20做准备。
4、将壳体10放入水中进行冲洗，去除壳体10上残留的化学溶液。
5、干燥壳体10，以备下一步使用。
进一步的，根据壳体10材料的不同、耐腐蚀能力不同，可重复进行多次T处理，以形成纳米级凹坑。
至此，已得到了第一表面11布有多个纳米级凹坑的壳体10。
步骤2、将壳体10放入模具中进行注塑。
具体的，将水洗干燥后的壳体10使用夹具夹持在模具内进行注塑，一种实施方式中，注塑的塑胶材料为树脂。塑胶进入第一表面11上的纳米级凹坑以在第一表面11形成与壳体10结合紧密的塑胶层20，具体的，当塑料与金属一体注射时，脂氨酸和塑胶发生酯与胺的化学放热反应，延缓了塑胶的固化，促进脂氨酸和塑胶位置的交换，从而保证了塑胶成功进入纳米级凹坑。
步骤3、铣断壳体10形成天线微缝。
本实施例中，形成天线微缝的过程中，仅铣断壳体10，而不铣断塑胶层20，利用塑胶层20支撑壳体10，保持相邻的天线微缝之间的第一金属条121和第二金属条122在铣断过程中不发生弯曲、形变。
具体的，结合图3，将壳体10放在有旋转功能的四轴数控机床机台上，其中第一表面11放置于机台上，从壳体10背离塑胶层20的一侧表面，即第 二表面12，插入铣刀30开始铣加工壳体10，并且铣刀30最终从第一表面11穿出，在塑胶层20铣出过铣槽302，以保证天线微缝完全切断壳体10。优选的，过铣槽302的深度为0.1mm～0.3mm。
过铣槽302的设计既保证了将壳体10完全铣断形成天线缝隙，又不会将第一表面11上塑胶层20铣断，塑胶层20依然支撑着壳体10结构，保持了相邻的天线微缝之间的金属部分的强度，使其在铣断过程中不发生弯曲、形变甚至断裂，提高壳体10成品率，降低生产成本。
S102、对壳体10的内壁表面1010进行粗糙化处理。
壳体10铣断出天线微缝之后，为保持壳体10的整体性及壳体10对移动终端内部的主板、电池等元件的保护作用，需要在天线微缝填充胶水40以填满天线微缝。
进一步的，胶水40与金属材质的壳体10的粘结度较低，不能满足壳体10的结构稳定性要求，需对壳体10进行粗糙化处理以在已形成的天线微缝的内壁表面1010形成纳米级凹坑，粗化内壁表面1010，提高内壁表面1010与胶水40的粘结力。
具体的，粗糙化处理的方式有多种，如喷砂粗化方式、激光扫描粗化方式、T液浸泡粗化方式等。粗糙化处理的原理是在内壁表面1010形成纳米级的凹坑，优选的，纳米级的凹坑为蜂窝状，有利于增强胶水与内壁表面1010的结合力。
一种实施方式中，粗糙化处理形成的纳米级凹坑分布于内壁表面1010的全部区域，即内壁表面1010与胶水接触的位置全部进行了粗糙化处理，内壁表面1010的全部均呈粗糙面状，最大化的提升了胶水与内壁表面1010的结合力，从而提高了提升胶水对天线微缝两侧的金属部分的粘结力。另一种实施方式中，结合图4，粗糙化处理形成的纳米级凹坑分布于内壁表面1010的部分区域，即内壁表面1010之部分面积为粗糙面状，多个纳米级的凹坑形成粗糙带1012，粗糙带1012与胶水的结合力较大，从而增大了胶水与内壁表面1010的结合力。具体的，粗糙带1012的数量可以为多个，并阵列分布于内壁表面1010上，粗糙带1012的数量越多、分布越密集，内壁表面1010与胶水的结合力越强。
进一步的，天线微缝包括两个相对的内壁表面1010，每个内壁表面1010包括至少一个粗糙带1012。利用粗糙带1012与胶水较强的结合力，增强内壁表面1010整体与浇水的结合力，从而提高了提升胶水对天线微缝两侧的金属部分的粘结力，壳体10强度高，提高壳体10成品率，降低生产成本。
本实施例中，以采用T处理粗糙化内壁表面1010为例，T处理是使用T液腐蚀金属表面以形成纳米级凹坑的加工技术，可以应用于金属表面前处理工作，属于纳米成型技术。
具体的，T处理的过程包括：
1、将壳体10放入碱液中浸泡，以清洗内壁表面1010及去除内壁表面1010的油脂，一种较佳的实施方式中，碱液为PH值9至10的弱碱，浸泡时间为1分钟即可达到内壁表面1010清洁度的要求。
2、将壳体10放入酸液中浸泡，以中和内壁表面1010的酸碱度。
3、将壳体10放入T液中浸泡，以在内壁表面1010形成纳米级的凹坑。具体的，T液包含多种化学药剂，脂氨酸为T液的主要成分。T液浸泡之后，内壁表面1010形成的凹坑的直径为20～30nm，凹坑形状为珊瑚礁结构。T处理之后，脂氨酸残留在纳米级凹坑内，为后续在内壁表面1010形成塑胶层20做准备。
4、将壳体10放入水中进行冲洗，去除壳体10上残留的化学溶液。
5、干燥壳体10，以备下一步使用。
进一步的，根据壳体10材料的不同、耐腐蚀能力不同，可重复进行多次T处理，以形成纳米级凹坑。
至此，已得到了内壁表面1010布有多个纳米级凹坑的壳体10。
S103、填充胶水40于天线微缝。
结合图5，具体的，采用四轴点胶机填充胶水40于天线微缝，胶水40以自流平的方式填满天线微缝。一种实施方式中，填充的胶水40材料为树脂。胶水40进入内壁表面1010上的纳米级凹坑与内壁表面1010紧密结合，进一步的，脂氨酸和胶水40发生酯与胺的化学放热反应，延缓了胶水40的固化，促进脂氨酸和胶水40位置的交换，从而保证了胶水40成功进入纳米级凹坑。胶水40与天线微缝的内壁表面1010粘结紧密，即胶水40紧密的粘结天线微 缝两侧的金属部分，例如第二微缝102紧密的粘结第一金属条121与第二金属条122，壳体10强度高，提高壳体10成品率，降低生产成本。
胶水40填满天线微缝之后，将壳体10进行烘烤以固化胶水40。优选的，烘烤温度为120℃，烘烤时间为30分钟。
内壁表面1010进行粗糙化处理后，天线微缝的内壁表面1010形成多个纳米级的凹坑，增加了内壁表面1010的粗糙度，有效提升胶水40与内壁表面1010的结合力，胶水40通过内壁表面1010粘结天线微缝两侧的金属部分，从而提高了提升胶水40对天线微缝两侧的金属部分的粘结力，壳体10强度高，提高壳体10成品率，降低生产成本。
本实施例中，壳体10最初为铝合金型材制作加工而成，具体的，在铣断壳体10形成天线微缝之前，本申请实施例提供的壳体10制作方法还包括：
1、将铝合金型材切割成单个壳体10尺寸的壳体原材。
一种实施方式中。该过程使用数控机床实现，具体壳体10尺寸根据移动终端的尺寸决定。
2、将壳体原材进行多次模具冲压，形成厚度均匀、相等的壳体板料。
一种实施方式中，该过程使用冲压机床完成，形成厚度均匀的壳体板料以备后续加工。
3、使用数控机床加工壳体板料，改变壳体板料的厚度，形成各部分厚度不等的壳体10。
一种实施方式中，将壳体10的第一表面11放置于治具上，对第二表面12进行金属加工，包括车、铣、磨、削等多个步骤，改变壳体板料各部分的厚度，形成壳体10结构的雏形。
通过以上加工过程形成壳体10结构的雏形，加工过程简单易操作，便于后续加工天线微缝。
本实施例中，填充胶水40于天线微缝之后，还需要尽心精加工以形成壳体成品才能使用，具体的，填充胶水40于天线微缝之后，本申请实施例提供的壳体10制作方法还包括：
1、使用数控机床加工壳体10，形成壳体10的内腔、外围及细节特征。
具体的，壳体10的内腔、外围及细节特征由移动终端的功能决定，细节 特征包括摄像头容纳孔，耳机插孔、电源线孔等。
进一步的，由于天线微缝中已填满与壳体10金属部分粘结紧密的胶水40，本加工过程中固化的胶水40保证了天线微缝的宽度公差。
2、对壳体10进行打磨抛光、喷砂及阳极氧化以改变壳体10的颜色和光泽，形成壳体成品。
具体的，打磨抛光过程中将第一表面11上的塑胶层20去除，喷砂及阳极氧化美化壳体10外观，达到装饰的效果。
内壁表面1010进行粗糙化处理后，天线微缝的内壁表面1010形成多个纳米级的凹坑，增加了内壁表面1010的粗糙度，有效提升胶水40与内壁表面1010的结合力，胶水40通过内壁表面1010粘结天线微缝两侧的金属部分，从而提高了提升胶水40对天线微缝两侧的金属部分的粘结力，壳体10强度高，提高壳体10成品率，降低生产成本。
本申请的实施例还提供一种移动终端，包括上述壳体10、设置在壳体10上的显示器组件以及设置在壳体10内的电路结构。移动终端指可以是在移动中使用的计算机设备，包括但不限于手机、笔记本、平板电脑、POS机、车载电脑、相机等。
以上所揭露的仅为本申请几种较佳实施例而已，当然不能以此来限定本申请之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本申请权利要求所作的等同变化，仍属于申请所涵盖的范围。

Claims (20)

  1. 一种壳体制作方法，其特征在于，包括：
    铣断壳体形成天线微缝；
    对所述天线微缝的内壁表面进行粗糙化处理；
    填图填充胶水于所述天线微缝，所述胶水紧密粘结所述内壁表面。
  2. 根据权利要求1所述的壳体制作方法，其特征在于，对所述天线微缝的内壁表面进行粗糙化处理后，所述内壁表面形成纳米级的凹坑结构。
  3. 根据权利要求2所述的壳体制作方法，其特征在于，所述纳米级的凹坑结构呈蜂窝状。
  4. 根据权利要求1所述的壳体制作方法，其特征在于，所述内壁表面的全部均呈粗糙面状。
  5. 根据权利要求1所述的壳体制作方法，其特征在于，所述内壁表面之部分面积为粗糙面状。
  6. 根据权利要求1所述的壳体制作方法，其特征在于，对所述天线微缝的内壁表面进行粗糙化处理的过程采用T处理方法。
  7. 根据权利要求6所述的壳体制作方法，其特征在于，所述T处理方法包括：
    将所述壳体放入碱液中浸泡，以清洗所述内壁表面及去除所述内壁表面的油脂；
    将所述壳体放入酸液中浸泡，以中和所述内壁表面的酸碱度；
    使用喷砂粗化方式或激光扫描粗化方式或T液浸泡粗化方式在所述内壁表面形成纳米级的凹坑；
    将所述壳体放入水中进行冲洗；
    干燥所述壳体。
  8. 根据权利要求1所述的壳体制作方法，其特征在于，所述填充胶水于所述天线微缝之后，所述方法还包括：将所述壳体进行烘烤，以固化所述胶水。
  9. 根据权利要求8所述的壳体制作方法，其特征在于，烘烤温度为120℃，烘烤时间为30分钟。
  10. 根据权利要求7所述的壳体制作方法，其特征在于,通过计算机数字控制机床的铣刀在壳体上铣断壳体形成天线微缝。
  11. 根据权利要求8所述的壳体制作方法，其特征在于,将水洗干燥后的所述壳体使用夹具夹持在模具内进行注塑。
  12. 根据权利要求11所述的壳体制作方法，其特征在于,注塑的塑胶材料为树脂，其中，所述壳体的第一表面布有所述纳米级凹坑，所述塑胶材料进入所述壳体的纳米级凹坑以在所述第一表面形成与所述壳体结合紧密的塑胶层。
  13. 根据权利要求12所述的壳体制作方法，其特征在于,所述铣刀从所述壳体的第一表面穿出，在所述塑胶层铣出过铣槽，以保证所述天线微缝完全切断所述壳体。
  14. 根据权利要求13所述的壳体制作方法，其特征在于,所述过铣槽的深度为0.1mm～0.3mm。
  15. 根据权利要求1所述的壳体制作方法，其特征在于,所述填充胶水于所述天线微缝，所述胶水紧密粘结所述内壁表面的步骤后，还包括：
    对所述壳体进行打磨抛光、喷砂及阳极氧化以改变所述壳体的颜色和光泽。
  16. 根据权利要求1所述的壳体制作方法，其特征在于,所述粗糙化处理的方式包括喷砂粗化方式、激光扫描粗化方式、T液浸泡粗化方式中的至少一种。
  17. 根据权利要求1所述的壳体制作方法，其特征在于,所述填充的胶水材料为树脂。
  18. 根据权利要求1所述的壳体制作方法，其特征在于,所述壳体为铝合金材料。
  19. 一种移动终端，其特征在于，包括通过权利要求1至18任意一项所述的壳体制作方法所制成的壳体、设置在所述壳体上的显示器组件以及设置在所述壳体内的电路结构。
  20. 根据权利要求19所述的移动终端，其特征在于,所述天线微缝包括第一微缝、第二微缝及第三微缝，所述第一微缝、所述第二微缝、所述第三微缝相互平行且依次排列。
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