WO2019090859A1 - 控制独立孔孔径和独立线厚度制作方法 - Google Patents

控制独立孔孔径和独立线厚度制作方法 Download PDF

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WO2019090859A1
WO2019090859A1 PCT/CN2017/112925 CN2017112925W WO2019090859A1 WO 2019090859 A1 WO2019090859 A1 WO 2019090859A1 CN 2017112925 W CN2017112925 W CN 2017112925W WO 2019090859 A1 WO2019090859 A1 WO 2019090859A1
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substrate
line
film
laser
independent
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PCT/CN2017/112925
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English (en)
French (fr)
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石继龙
毛敏
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建业科技电子（惠州）有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Definitions

  • the invention relates to the technical field of circuit board production, in particular to a method for controlling independent aperture aperture and independent line thickness.
  • a method for controlling independent aperture aperture and independent line thickness including the following steps:
  • Substrate trimming the substrate is cut into the required size of the circuit board by the substrate cutting machine, and is polished by a sanding machine, and is used after the processing is completed;
  • Substrate surface treatment a non-metal photoinduction catalyst aldehyde is added to the surface of the substrate as a thermoplastic carrier material, and is injection molded into a member by an injection molding machine, wherein the non-metal photoinduced catalyst alcohol content is 5-15%, and the injection molding is performed.
  • the molding temperature is 80-150 ° C;
  • Design line film use line scanning equipment to scan along the surface of the substrate with circuit lines to obtain a graph, according to the distribution state of the curve in the graph, determine the cutting standard of layer cutting; then use 3D scanning The device scans the substrate with the circuit line, constructs a three-dimensional model of the template according to the obtained three-dimensional data, and then cuts the three-dimensional model obtained in step 2 according to the cutting standard determined in step 1, and obtains corresponding different layers. a film pattern; the position of the positioning hole is marked on the obtained film pattern; finally, the film pattern is outputted to obtain a corresponding film;
  • Substrate drilling pre-set the etching compensation value of the independent PAD of the thick copper plate; when designing the line film, the position of the required drilling hole of the independent PAD is treated without copper according to the corresponding etching compensation value, wherein the line film needs to be ⁇ The size of the empty is equal to the hole diameter of the hole to etch the compensation value; then the modified line film is designed and the circuit pattern is transferred.
  • the distance between the hole to be drilled and the hole diameter of the independent PAD after etching is between ⁇ 2mil. , that is, the hollow aperture and the borehole size are within ⁇ 2 mil; finally, the laser drilling machine is used for drilling;
  • Substrate and line film alignment press the screw into the corresponding positioning hole of the film, then attach the film to the surface of the printed circuit board, and one end of the screw penetrates into the corresponding positioning hole of the printed circuit board to complete the printed circuit board and Film fits the position;
  • press curing preparing a protective plate for use; then pre-compressing the prepreg by laying a prepreg on the bottom and the top of the protective plate and the substrate, the pre-compression temperature is lower than the glass transition temperature of the prepreg, and The prepreg can be melted into a liquid state to achieve bonding between the layers; finally, press-bonding is performed using a press machine.
  • Drilling and etching the fixing bolts used for the alignment of the substrate and the line film are removed, and then the through holes are etched by chemical agents to form uniform through holes;
  • the rotational speed of the sander in the step 1) is 400-550 r/min.
  • the laser modulation frequency in the step 3) is 1200-5000 Hz
  • the pulse width is 60-150 ns
  • the average power of the laser is 10-200 W.
  • the step 2) the non-metal light-inducing catalyst aldehyde is a solid or liquid or gaseous triol
  • the thermoplastic carrier material is polyvinyl chloride, polycarbonate and polybutylene terephthalate. ester.
  • the alignment beam is used to make the drilling beam Match the circuit board, use the pattern on the through hole or circuit board as the mark; then open the laser drill to determine the size of the mask; set the laser parameters, calibrate the position of the collector; finally the laser launcher, laser drill hole.
  • the press-bonding temperature of the step 8) is 30-40 ° C, and is maintained for 10-20 minutes, and the hot pressing pressure of the press machine is 200-600 MPa.
  • the step 9) applies a corrosion-resistant adhesive on a predetermined portion of the surface of the workpiece, and performs mask processing on the surface of the workpiece coated with the corrosion-resistant adhesive;
  • the etching solution is spray-etched to form an initial concave-convex structure on the working surface; the etched workpiece is subjected to a stripping process to remove the mask on the surface of the workpiece; and the removed workpiece is placed in the second etching solution Immersion to remove the edges of the continuous initial convex-concave structure and to reduce the etching depth of the microstructure to be formed; the soaked workpiece is rinsed with water, dried and then polished to form a fixed-sized through hole on the surface of the workpiece.
  • the immersion time is 10-30 min, so that the corresponding metal core is formed on the surface of the component; finally, the metal core is subjected to electroplating copper treatment to form a conductive line, which can effectively and accurately control the thickness of the circuit line and effectively improve the convenience of use;
  • the positioning holes of different sizes can be effectively formed, which is convenient for precisely controlling the diameter of the positioning hole, thereby effectively improving the convenience of use.
  • Figure 1 is a flow chart of the overall production of the present invention
  • the present invention provides a technical solution for controlling independent aperture aperture and independent line thickness, including the following steps:
  • Substrate trimming the substrate is cut into the required size of the circuit board by the substrate cutting machine, and is polished by a sanding machine, and is used after the processing is completed;
  • Substrate surface treatment a non-metal photoinduction catalyst aldehyde is added to the surface of the substrate as a thermoplastic carrier material, and is injection molded into a member by an injection molding machine, wherein the non-metal photoinduced catalyst alcohol content is 5-15%, and the injection molding is performed.
  • the molding temperature is 80-150 ° C;
  • Design line film use line scanning equipment to scan along the surface of the substrate with circuit lines to obtain a graph, according to the distribution state of the curve in the graph, determine the cutting standard of layer cutting; then use 3D scanning The device scans the substrate with the circuit line, constructs the three-dimensional model of the template according to the obtained three-dimensional data; and then cuts the three-dimensional model obtained in step 2 according to the cutting standard determined in step 1, and obtains corresponding film patterns of different layers. The position of the positioning hole is marked on the obtained film pattern; finally, the film pattern is outputted to obtain the corresponding film;
  • Substrate drilling pre-set the etching compensation value of the independent PAD of the thick copper plate; when designing the line film, the position of the required drilling hole of the independent PAD is treated without copper according to the corresponding etching compensation value, wherein the line film needs to be ⁇ The size of the empty is equal to the hole diameter of the hole to etch the compensation value; then the modified line film is designed and the circuit pattern is transferred.
  • the distance between the hole to be drilled and the hole diameter of the independent PAD after etching is between ⁇ 2mil. , that is, the hollow aperture and the borehole size are within ⁇ 2 mil; finally, the laser drilling machine is used for drilling;
  • Substrate and line film alignment press the screw into the corresponding positioning hole of the film, then attach the film to the surface of the printed circuit board, and one end of the screw penetrates into the corresponding positioning hole of the printed circuit board to complete the printed circuit board and Film fits the position;
  • Pressurization curing prepare a protective plate for use; then lay a prepreg on the bottom and top of the protective plate and the substrate, pre-compression, the pre-compression temperature is lower than the glass transition temperature of the prepreg, and the prepreg can be melted. It is liquid to achieve bonding between layers; finally, it is pressed by a press machine.
  • Drilling and etching the fixing bolts used for the alignment of the substrate and the line film are removed, and then the chemical agent is used. The through holes are etched to form uniform through holes;
  • the rotational speed of the sander in step 1) is 400-550 r/min.
  • the laser modulation frequency in the step 3) is 1200-5000 Hz
  • the pulse width is 60-150 ns
  • the average power of the laser is 10-200 W.
  • the step 2) the non-metal light-inducing catalyst aldehyde is a solid or liquid or gaseous triol
  • the thermoplastic carrier materials are polyvinyl chloride, polycarbonate and polybutylene terephthalate.
  • the alignment mark is used to match the drilling beam with the circuit board, and the pattern on the through hole or the circuit board can be used as a mark; then the laser drilling machine is turned on. , determine the size of the mask; set the laser parameters, calibrate the position of the collector; finally the laser emitting device, laser drilling.
  • the press-bonding temperature of the step 8) is 30-40 ° C, and is maintained for 10-20 minutes, and the hot pressing pressure of the press machine is 200-600 MPa.
  • step 9) coating a predetermined portion of the surface of the workpiece with a corrosion-resistant adhesive, masking the surface of the workpiece coated with the corrosion-resistant adhesive; and using the first etching solution for the workpiece after the mask processing Spray etching is performed to form an initial concave-convex structure on the working surface; the etched workpiece is subjected to a release treatment to remove the mask on the surface of the workpiece; and the removed workpiece is placed in the second etching solution to be immersed.
  • the soaked workpiece is rinsed with water, dried and then polished to form a fixed-sized through hole on the surface of the workpiece.
  • the invention immerses the substrate engraved with the line layout pattern in a temperature environment of 20-30 ° C into a mixed solution of nickel chloride and silver nitrate having a pH of 4-6, and the soaking time is 5-15 min;
  • the corresponding metal core is generated; finally, the metal core is subjected to electroplating copper treatment to form a conductive line, which can effectively and accurately control the thickness of the circuit line, thereby effectively improving the convenience of use; by using the film to make the positioning hole, the molding can be effectively formed.
  • Different sized positioning holes facilitate precise control of the diameter of the positioning holes, which effectively improves the convenience of use.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

一种控制独立孔孔径和独立线厚度制作方法，包括如下步骤：基板修整、基板表面处理、激光布线图案成型、线路成型、设计线路菲林、基板钻孔、基板和线路菲林对位、加压固化、钻孔蚀刻和入库存储，所述基板修整中打磨机的转速为400-550r/min，所述激光布线图案成型中的激光调制频率为1200-5000Hz，脉冲宽度为60-150ns，激光的平均功率为10-200W，所述基板表面处理中非金属光诱导催化剂醛类为固态或液态或者气态的三元醇，所述基板表面处理中热塑性承载材料为聚氯乙烯、聚碳酸酯和聚对苯二甲酸丁二醇酯，所述基板钻孔中将基板装到真空吸盘上后，要用对位标记使钻孔光束与线路板相配。该方法所获得的结构简单，使用方便，便于精确控制孔径的大小和电路线的厚度，有效提升使用的方便性。

Description

控制独立孔孔径和独立线厚度制作方法 技术领域
本发明涉及电路板生产技术领域，具体为控制独立孔孔径和独立线厚度制作方法。
背景技术
随着电子通信技术的不断发展，通讯产品的功能越来越多。为了更好发挥电子产品的功能，目前高端移动电子设备大部分都配有触控显示屏，显示屏的尺寸也逐渐加大，显示屏的加大造成了耗电量的成倍增加。为了增加电子产品的待机时间，厂商在设计时都最大限度减小线路板的尺寸，以加大了电池的容量；目前高端电子产品的电路板尺寸，已从之前与产品等大减小到产品尺寸的50％以下。电路板的功能增加而体积减小，导致电路板器件布局更加密集且层数持续上升。而随着电路板层数的递增，生产时压合次数也随之增加，电路板生产流程也越来越复杂。现有的电路板在生产时无法控制控制独立孔孔径和独立线厚度，因此，设计一种控制独立孔孔径和独立线厚度制作方法是很有必要的。
发明内容
本发明的目的在于提供控制独立孔孔径和独立线厚度制作方法，以解决上述背景技术中提出的问题。
为了解决上述技术问题，本发明提供如下技术方案：控制独立孔孔径和独立线厚度制作方法，包括如下步骤：
1)基板修整：将基板通过基板切割机裁切成电路板的所需尺寸，通过打磨机进行打磨处理，处理完成后待用；
2)基板表面处理：在基板的表面以热塑性承载材料中加入非金属光诱导催化剂醛类，用注塑机注塑成型为构件，其中，非金属光诱导催化剂醇类的含量为5-15％，注塑成型温度为80-150℃；
3)激光布线图案成型：用波长为1000-1500nm的激光射线在构件的表面照射出的线路排布图案，在构件表面照射的时间为5-15s，使其形成线路排布图案；
4)线路成型：将刻有线路排布图案的基板在20-30℃温度环境下浸入PH值为4-6的 氯化镍和硝酸银的混合溶液，浸泡时间为5-15min；接着将构件从氯化镍和硝酸银的混合溶液取出，并且用蒸馏水清洗；再将清洗过后的构件放入PH＝5-6的含有还原剂的溶液中浸泡，浸泡时间为10-30min，使得构件表面生成相应的金属核；最后再金属核进行电镀铜处理，使其形成导电线路；
5)设计线路菲林：采用线扫描设备沿着具有电路线的基板的表面进行扫描，得到曲线图，根据曲线图中曲线的分布状态，确定分层裁切的裁切标准；接着再采用三维扫描设备对所述具有电路线的基板进行扫描，根据所得三维数据构建样板的三维模型；再根据步骤1中确定的裁切标准对步骤2中得到的三维模型进行裁切，得到相应的不同层的菲林图案；接在再所得的菲林图案上标注出定位孔的位置；最后将所述的菲林图案输出后得到相应的菲林；
6)基板钻孔：预先设定厚铜板独立PAD的蚀刻补偿值；再设计线路菲林时将独立PAD的需钻孔的位置根据其对应的蚀刻补偿值做无铜处理，其中，线路菲林需掏空的大小等于钻孔孔径先去蚀刻补偿值；接着设计出修改后的线路菲林，并进行线路图形转移，蚀刻后独立PAD的需钻孔的位置与钻孔孔径的大小差距在±2mil之间，即掏空的圆孔径跟钻孔孔径大小在±2mil内；最后使用激光钻孔机进行钻孔；
7)基板和线路菲林对位：在菲林对应定位孔中压入螺钉，然后把菲林贴合在印制电路板表面，螺钉一端穿入印制电路板对应定位孔中，完成印制电路板与菲林对位贴合；
8)加压固化：准备一块保护板备用；接着将保护板和基板的底部和顶部分别铺设半固化片，进行预压合，所述预压合的温度低于所述半固化片的玻璃化转变温度，且能够使所述半固化片熔化为液态，以实现层间的粘结；最后采用压合机进行压合。
9)钻孔蚀刻：将基板和线路菲林对位采用的固定螺栓拆卸下来，接着采用化学药剂对通孔进行蚀刻，使其形成均匀的通孔；
10)入库存储：对成品进行入科存储，并进行记录。
根据上述技术方案，所述步骤1)中打磨机的转速为400-550r/min。
根据上述技术方案，所述步骤3)中的激光调制频率为1200-5000Hz，脉冲宽度为60-150ns，所述激光的平均功率为10-200W。
根据上述技术方案，所述步骤2)非金属光诱导催化剂醛类为固态或液态或者气态的三元醇，所述热塑性承载材料为聚氯乙烯、聚碳酸酯和聚对苯二甲酸丁二醇酯。
根据上述技术方案，所述步骤6)将基板装到真空吸盘上后，要用对位标记使钻孔光束 与线路板相配，可利用通孔或线路板上的图形作为标记；接着打开激光钻孔机，确定光罩大小；再设定激光参数，校准集光镜位置；最后激光发射装置，进行激光钻孔。
根据上述技术方案，所述步骤8)压合机的压合温度为30-40℃，且维持10-20分钟，所述压合机的热压压力为200-600MPa。
根据上述技术方案，所述步骤9)在工件的表面的预定部分上涂覆耐腐蚀胶，对工件的涂覆耐腐蚀胶后的表面进行掩膜处理；对掩膜处理后的工件用第一蚀刻液进行喷淋蚀刻，以在工作的表面上形成初始凹凸结构；对蚀刻后的工件进行脱膜处理，以去除工件表面的掩膜；将脱膜处理后的工件放到第二蚀刻液中浸泡，以去除连续的初始凸凹结构的棱边和减小将要形成的微结构的蚀刻深度；将浸泡后的工件用水冲洗、干燥然后抛光，从而在工件的表面上形成固定大小的通孔。
与现有技术相比，本发明所达到的有益效果是：本发明通过将刻有线路排布图案的基板在20-30℃温度环境下浸入PH值为4-6的氯化镍和硝酸银的混合溶液，浸泡时间为5-15min；接着将构件从氯化镍和硝酸银的混合溶液取出，并且用蒸馏水清洗；再将清洗过后的构件放入PH＝5-6的含有还原剂的溶液中浸泡，浸泡时间为10-30min，使得构件表面生成相应的金属核；最后再金属核进行电镀铜处理，使其形成导电线路，可以有效精确控制电路线的厚度，有效提升使用的方便性；通过采用菲林来进行定位孔的制作，可以有效成型不同大小的定位孔，便于精确控制定位孔的直径大小，有效提升使用的方便性。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例一起用于解释本发明，并不构成对本发明的限制。在附图中：
图1是本发明的整体制作流程图；
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，本发明提供技术方案：控制独立孔孔径和独立线厚度制作方法，包括如下步骤：
1)基板修整：将基板通过基板切割机裁切成电路板的所需尺寸，通过打磨机进行打磨处理，处理完成后待用；
2)基板表面处理：在基板的表面以热塑性承载材料中加入非金属光诱导催化剂醛类，用注塑机注塑成型为构件，其中，非金属光诱导催化剂醇类的含量为5-15％，注塑成型温度为80-150℃；
3)激光布线图案成型：用波长为1000-1500nm的激光射线在构件的表面照射出的线路排布图案，在构件表面照射的时间为5-15s，使其形成线路排布图案；
4)线路成型：将刻有线路排布图案的基板在20-30℃温度环境下浸入PH值为4-6的氯化镍和硝酸银的混合溶液，浸泡时间为5-15min；接着将构件从氯化镍和硝酸银的混合溶液取出，并且用蒸馏水清洗；再将清洗过后的构件放入PH＝5-6的含有还原剂的溶液中浸泡，浸泡时间为10-30min，使得构件表面生成相应的金属核；最后再金属核进行电镀铜处理，使其形成导电线路；
5)设计线路菲林：采用线扫描设备沿着具有电路线的基板的表面进行扫描，得到曲线图，根据曲线图中曲线的分布状态，确定分层裁切的裁切标准；接着再采用三维扫描设备对具有电路线的基板进行扫描，根据所得三维数据构建样板的三维模型；再根据步骤1中确定的裁切标准对步骤2中得到的三维模型进行裁切，得到相应的不同层的菲林图案；接在再所得的菲林图案上标注出定位孔的位置；最后将的菲林图案输出后得到相应的菲林；
6)基板钻孔：预先设定厚铜板独立PAD的蚀刻补偿值；再设计线路菲林时将独立PAD的需钻孔的位置根据其对应的蚀刻补偿值做无铜处理，其中，线路菲林需掏空的大小等于钻孔孔径先去蚀刻补偿值；接着设计出修改后的线路菲林，并进行线路图形转移，蚀刻后独立PAD的需钻孔的位置与钻孔孔径的大小差距在±2mil之间，即掏空的圆孔径跟钻孔孔径大小在±2mil内；最后使用激光钻孔机进行钻孔；
7)基板和线路菲林对位：在菲林对应定位孔中压入螺钉，然后把菲林贴合在印制电路板表面，螺钉一端穿入印制电路板对应定位孔中，完成印制电路板与菲林对位贴合；
8)加压固化：准备一块保护板备用；接着将保护板和基板的底部和顶部分别铺设半固化片，进行预压合，预压合的温度低于半固化片的玻璃化转变温度，且能够使半固化片熔化为液态，以实现层间的粘结；最后采用压合机进行压合。
9)钻孔蚀刻：将基板和线路菲林对位采用的固定螺栓拆卸下来，接着采用化学药剂对 通孔进行蚀刻，使其形成均匀的通孔；
10)入库存储：对成品进行入科存储，并进行记录。
根据上述技术方案，步骤1)中打磨机的转速为400-550r/min。
根据上述技术方案，步骤3)中的激光调制频率为1200-5000Hz，脉冲宽度为60-150ns，激光的平均功率为10-200W。
根据上述技术方案，步骤2)非金属光诱导催化剂醛类为固态或液态或者气态的三元醇，热塑性承载材料为聚氯乙烯、聚碳酸酯和聚对苯二甲酸丁二醇酯。
根据上述技术方案，步骤6)将基板装到真空吸盘上后，要用对位标记使钻孔光束与线路板相配，可利用通孔或线路板上的图形作为标记；接着打开激光钻孔机，确定光罩大小；再设定激光参数，校准集光镜位置；最后激光发射装置，进行激光钻孔。
根据上述技术方案，步骤8)压合机的压合温度为30-40℃，且维持10-20分钟，压合机的热压压力为200-600MPa。
根据上述技术方案，步骤9)在工件的表面的预定部分上涂覆耐腐蚀胶，对工件的涂覆耐腐蚀胶后的表面进行掩膜处理；对掩膜处理后的工件用第一蚀刻液进行喷淋蚀刻，以在工作的表面上形成初始凹凸结构；对蚀刻后的工件进行脱膜处理，以去除工件表面的掩膜；将脱膜处理后的工件放到第二蚀刻液中浸泡，以去除连续的初始凸凹结构的棱边和减小将要形成的微结构的蚀刻深度；将浸泡后的工件用水冲洗、干燥然后抛光，从而在工件的表面上形成固定大小的通孔。
工作原理：本发明通过将刻有线路排布图案的基板在20-30℃温度环境下浸入PH值为4-6的氯化镍和硝酸银的混合溶液，浸泡时间为5-15min；接着将构件从氯化镍和硝酸银的混合溶液取出，并且用蒸馏水清洗；再将清洗过后的构件放入PH＝5-6的含有还原剂的溶液中浸泡，浸泡时间为10-30min，使得构件表面生成相应的金属核；最后再金属核进行电镀铜处理，使其形成导电线路，可以有效精确控制电路线的厚度，有效提升使用的方便性；通过采用菲林来进行定位孔的制作，可以有效成型不同大小的定位孔，便于精确控制定位孔的直径大小，有效提升使用的方便性。
最后应说明的是：以上所述仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本发 明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 控制独立孔孔径和独立线厚度制作方法，其特征在于：包括如下步骤：
    1)基板修整：将基板通过基板切割机裁切成电路板的所需尺寸，通过打磨机进行打磨处理，处理完成后待用；
    2)基板表面处理：在基板的表面以热塑性承载材料中加入非金属光诱导催化剂醛类，用注塑机注塑成型为构件，其中，非金属光诱导催化剂醇类的含量为5-15％，注塑成型温度为80-150℃；
    3)激光布线图案成型：用波长为1000-1500nm的激光射线在构件的表面照射出的线路排布图案，在构件表面照射的时间为5-15s，使其形成线路排布图案；
    4)线路成型：将刻有线路排布图案的基板在20-30℃温度环境下浸入PH值为4-6的氯化镍和硝酸银的混合溶液，浸泡时间为5-15min；接着将构件从氯化镍和硝酸银的混合溶液取出，并且用蒸馏水清洗；再将清洗过后的构件放入PH＝5-6的含有还原剂的溶液中浸泡，浸泡时间为10-30min，使得构件表面生成相应的金属核；最后再金属核进行电镀铜处理，使其形成导电线路；
    5)设计线路菲林：采用线扫描设备沿着具有电路线的基板的表面进行扫描，得到曲线图，根据曲线图中曲线的分布状态，确定分层裁切的裁切标准；接着再采用三维扫描设备对所述具有电路线的基板进行扫描，根据所得三维数据构建样板的三维模型；再根据步骤1中确定的裁切标准对步骤2中得到的三维模型进行裁切，得到相应的不同层的菲林图案；接在再所得的菲林图案上标注出定位孔的位置；最后将所述的菲林图案输出后得到相应的菲林；
    6)基板钻孔：预先设定厚铜板独立PAD的蚀刻补偿值；再设计线路菲林时将独立PAD的需钻孔的位置根据其对应的蚀刻补偿值做无铜处理，其中，线路菲林需掏空的大小等于钻孔孔径先去蚀刻补偿值；接着设计出修改后的线路菲林，并进行线路图形转移，蚀刻后独立PAD的需钻孔的位置与钻孔孔径的大小差距在±2mil之间，即掏空的圆孔径跟钻孔孔径大小在±2mil内；最后使用激光钻孔机进行钻孔；
    7)基板和线路菲林对位：在菲林对应定位孔中压入螺钉，然后把菲林贴合在印制电路板表面，螺钉一端穿入印制电路板对应定位孔中，完成印制电路板与菲林对位贴合；
    8)加压固化：准备一块保护板备用；接着将保护板和基板的底部和顶部分别铺设半 固化片，进行预压合，所述预压合的温度低于所述半固化片的玻璃化转变温度，且能够使所述半固化片熔化为液态，以实现层间的粘结；最后采用压合机进行压合。
    9)钻孔蚀刻：将基板和线路菲林对位采用的固定螺栓拆卸下来，接着采用化学药剂对通孔进行蚀刻，使其形成均匀的通孔；
    10)入库存储：对成品进行入科存储，并进行记录。
  2. 根据权利要求1所述的控制独立孔孔径和独立线厚度制作方法，其特征在于：所述步骤1)中打磨机的转速为400-550r/min。
  3. 根据权利要求1所述的控制独立孔孔径和独立线厚度制作方法，其特征在于：所述步骤3)中的激光调制频率为1200-5000Hz，脉冲宽度为60-150ns，所述激光的平均功率为10-200W。
  4. 根据权利要求1所述的控制独立孔孔径和独立线厚度制作方法，其特征在于：所述步骤2)非金属光诱导催化剂醛类为固态或液态或者气态的三元醇，所述热塑性承载材料为聚氯乙烯、聚碳酸酯和聚对苯二甲酸丁二醇酯。
  5. 根据权利要求1所述的控制独立孔孔径和独立线厚度制作方法，其特征在于：所述步骤6)将基板装到真空吸盘上后，要用对位标记使钻孔光束与线路板相配，可利用通孔或线路板上的图形作为标记；接着打开激光钻孔机，确定光罩大小；再设定激光参数，校准集光镜位置；最后激光发射装置，进行激光钻孔。
  6. 根据权利要求1所述的控制独立孔孔径和独立线厚度制作方法，其特征在于：所述步骤8)压合机的压合温度为30-40℃，且维持10-20分钟，所述压合机的热压压力为200-600MPa。
  7. 根据权利要求1所述的控制独立孔孔径和独立线厚度制作方法，其特征在于：所述步骤9)在工件的表面的预定部分上涂覆耐腐蚀胶，对工件的涂覆耐腐蚀胶后的表面进行掩膜处理；对掩膜处理后的工件用第一蚀刻液进行喷淋蚀刻，以在工作的表面上形成初始凹凸结构；对蚀刻后的工件进行脱膜处理，以去除工件表面的掩膜；将脱膜处理后的工件放到第二蚀刻液中浸泡，以去除连续的初始凸凹结构的棱边和减小将要形成的微结构的蚀刻深度；将浸泡后的工件用水冲洗、干燥然后抛光，从而在工件的表面上形成固定大小的通孔。
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CN110901063A (zh) * 2019-12-18 2020-03-24 杭州德迪智能科技有限公司 一种靶向诱导与定向能复合三维成形装置及方法
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100147575A1 (en) * 2008-12-17 2010-06-17 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and manufacturing method thereof
CN103068167A (zh) * 2012-12-20 2013-04-24 景旺电子科技(龙川)有限公司 一种解决金属基厚铜板独立pad钻孔铜皮起翘的方法
CN103220889A (zh) * 2013-04-15 2013-07-24 深圳崇达多层线路板有限公司 一种超大尺寸pcb背板内层制作方法
CN104419929A (zh) * 2013-08-26 2015-03-18 广州三星通信技术研究有限公司 蚀刻方法
CN107148155A (zh) * 2017-06-21 2017-09-08 合肥同佑电子科技有限公司 一种三维集成电路板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102455592B (zh) * 2010-10-22 2013-12-04 比亚迪股份有限公司 一种菲林的制作方法
CN103324040A (zh) * 2013-05-28 2013-09-25 吴子坚 一种用于提高印制电路板与菲林对位精度的方法
CN107148171B (zh) * 2017-06-27 2019-06-18 北大方正集团有限公司 多层电路板的压合方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100147575A1 (en) * 2008-12-17 2010-06-17 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and manufacturing method thereof
CN103068167A (zh) * 2012-12-20 2013-04-24 景旺电子科技(龙川)有限公司 一种解决金属基厚铜板独立pad钻孔铜皮起翘的方法
CN103220889A (zh) * 2013-04-15 2013-07-24 深圳崇达多层线路板有限公司 一种超大尺寸pcb背板内层制作方法
CN104419929A (zh) * 2013-08-26 2015-03-18 广州三星通信技术研究有限公司 蚀刻方法
CN107148155A (zh) * 2017-06-21 2017-09-08 合肥同佑电子科技有限公司 一种三维集成电路板的制作方法

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